High-precision double-sided grinding and polishing machine

Abstract

The invention relates to the technical field of polishing machines, and particularly discloses a high-precision double-face grinding and polishing machine which comprises a polishing table and a polishing pad arranged on the polishing table. The collecting cavity is installed on the edge side of the polishing table, the interior of the collecting cavity is communicated with a groove in the edge of the table top of the polishing table, a blocking device for limiting circulation and steering of the polishing liquid is arranged in the collecting cavity, a pump body is arranged on the back face, away from the communicated connection face of the collecting cavity and the polishing table, of the blocking device, and the pump body is connected with a liquid guide pipe on the outer side of the polishing table; and meanwhile, a waste collecting assembly is further arranged at the edge of the interior of the blocking device, and an adsorption assembly is arranged on the waste collecting assembly and used for adsorbing large-particle materials in the polishing solution. According to the high-precision double-sided grinding and polishing machine, large-particle impurities generated in the grinding process can be automatically separated out in the continuous auxiliary grinding and polishing process of the polishing solution, and the particle impurities are prevented from influencing the planarization of workpiece polishing and grinding.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer polishing, and particularly to a high-precision double-sided grinding and polishing machine. Background Art

[0002] Wafer polishing is a process of grinding the surface of a wafer after wafer cutting and forming to ensure its flatness. This process uses mechanical grinding and chemical corrosion in synchronization to perform high-precision planarization on the grinding surface of the wafer. Chemical substances in the polishing liquid react with the outer surface of the wafer to generate a soft layer that is easily removed, and physical grinding of the soft layer is achieved by the polishing pad rotating and the particulate abrasives in the polishing liquid. Thus, the surface of the wafer is made flat.

[0003] Existing grinding and polishing machines achieve relative movement between the polishing pad and the wafer to be polished through continuous rotation and addition of grinding liquid, thereby achieving the polishing effect. In this process, chemical corrosion and grinding are used to achieve flatness. At the same time, the softened layer of the wafer to be ground is also removed by the grinding particles. During this process, the grinding liquid gathers at the polishing pad and the wafer to be ground, and the softened layer ground off is carried away through the fluidity of the liquid and the movement characteristics of the grinding particles. However, during continuous grinding of the wafer using particulate abrasives for grinding, large particulate impurities of the softened layer of the wafer are mixed into the polishing liquid. These particulate impurities are mixed with the particulate abrasives in the polishing liquid, resulting in the influence of the flatness of the grinding surface of the wafer and the polishing forming effect due to the large particulate impurities remaining in the polishing liquid during continuous grinding and polishing of the wafer.

[0004] In view of the above problems, there is an urgent need for innovative design based on the original grinding and polishing machine. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-precision double-sided grinding and polishing machine to solve the problem in the above background art that in the polishing operation using polishing liquid and particulate abrasives, large particulate impurities removed by the particulate abrasives are mixed into the polishing liquid, affecting the flatness of the grinding surface of the wafer and its polishing forming effect.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A high-precision double-sided grinding and polishing machine, including a polishing table and a polishing pad disposed thereon; It further includes: a collection chamber installed at the side of the polishing table. The inside of the collection chamber communicates with the groove at the edge of the polishing table surface, and a barrier for restricting the flow and turning of the polishing liquid is provided inside the collection chamber. A pump body is provided on the back of the barrier away from the through connection of the collection chamber and the polishing table. The pump body is connected to a liquid guide pipe outside the polishing table. At the same time, a waste collection assembly is provided at the inner edge of the barrier, and an adsorption assembly is provided on the waste collection assembly for adsorbing large particle materials in the polishing liquid.

[0007] Preferably, a locator, a liquid drainage assembly and a moving assembly are further provided above the polishing table, wherein the locator is used for wafer positioning and polishing processing, and the liquid drainage assembly is used for the addition setting of the polishing liquid.

[0008] Preferably, the collection chamber and the polishing table are butt-jointed through a sealed elastic pipe fitting. The elastic pipe fitting realizes the through connection between the inside of the collection chamber and the groove at the edge of the polishing table surface. At the same time, the bottom of the polishing table is fixed on the top surface of the workbench.

[0009] Preferably, a vibration assembly is further provided inside the barrier. At the same time, the bottom surface of the collection chamber is in a weakly magnetic movable connection with the edge of the top surface of the workbench through a magnetic plate.

[0010] Preferably, the barrier is located at the center inside the collection chamber. A guiding channel for the flow of the polishing liquid is reserved between the outer edge of the barrier and the inner wall of the side of the collection chamber. A channel for accumulating large particle substances in the polishing liquid is provided at the turning corner of the guiding channel.

[0011] Preferably, the liquid inlet port of the pump body is located at the tail position of the guiding channel inside the collection chamber, and the tail of the guiding channel where the liquid inlet port is located is concave.

[0012] Preferably, the waste collection assembly is distributed at the inner wall position of the collection chamber and is tubular. The distribution of the waste collection assembly penetrates through the guiding channel for the flow of the polishing liquid inside the collection chamber and the channel where the channel is located.

[0013] Preferably, a waste collection inlet is provided on the waste collection assembly, and an adsorption assembly is correspondingly provided on the outer wall of the inlet. The adsorption assembly includes highly dispersed diatomaceous earth, and the waste collection assembly is connected to an external negative pressure device.

[0014] Preferably, the liquid guide pipe is arranged at the outer edge of the polishing table. At the same time, the liquid guide pipe, the collection chamber, the barrier and the pump body form a polishing liquid impurity removal and reflux system.

[0015] Preferably, a sealing member is provided at the joint between the inner side of the polishing table and the outer edge of the polishing pad, and the sealing member is disconnected at the liquid inlet position of the collection chamber.

[0016] Compared with the prior art, the invention has the following beneficial effects: the high-precision double-sided grinding and polishing machine can automatically separate large particle impurities generated during the continuous polishing liquid-assisted grinding and polishing process, thereby preventing the particle impurities from affecting the flattening of the workpiece polishing and polishing. The specific contents are as follows: 1. A guide channel for the polishing liquid is formed through the barrier inside the collecting chamber. The built-in corners of the guide channel and the eddy current and centrifugal effect at the corners during the circulation of the polishing liquid are used to precipitate large particles of impurities in the polishing liquid, so that the continuously used polishing liquid can not only assist in polishing, but also prevent large particles of impurities caused by the shedding of the softened layer on the workpiece from affecting its polishing flatness; Furthermore, a vibration component is provided inside the barrier to improve the separation efficiency when the polishing liquid is circulated and transported to separate large particles of impurities, and the collection chamber and the polishing table are connected by a sealed elastic pipe fitting to prevent the influence of the workpiece polishing caused by vibration; Furthermore, a vibration component and a magnetic plate are provided to be installed in a matching manner. The magnetic plate initially limits the collecting chamber so that it can stably unload force during vibration and will not become disconnected from the workbench.

[0017] 2. A waste collection component and an adsorption component are installed in conjunction. The waste collection component is arranged in a pipeline-like structure, which can remove large particles of impurities accumulated in the guide channel for conveying and circulating the polishing liquid in the subsequent operating environment, while the adsorption component adopts highly dispersed diatomaceous earth, graphene and carbon nanotubes, etc., which can effectively adsorb large silica particles in the polishing liquid and separate large impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the front structure of the present invention; Figure 2 It is a schematic diagram of the side structure of the present invention; Figure 3 This is a schematic diagram of the installation position of the polishing pad of the present invention; Figure 4 A schematic diagram of the distribution of liquid guide tubes when the polishing pad of the present invention is installed; Figure 5 It is a schematic diagram of the distribution state of the liquid guide tubes on the polishing table of the present invention; Figure 6 This is a schematic diagram of the installation structure of the collection chamber of the present invention; Figure 7 This is a schematic diagram of the front structure of the interior of the collecting chamber of the present invention; Figure 8 This is a schematic diagram of the back structure of the collecting chamber of the present invention; Figure 9 This is a schematic diagram of the distribution state of the magnetic plates of the present invention; Figure 10 This is a schematic diagram of the installation of the polishing table of the present invention.

[0019] In the figure: 1. polishing table; 101. workbench; 2. polishing pad; 201. positioner; 202. drainage assembly; 203. moving assembly; 3. collecting chamber; 4. barrier; 401. vibration assembly; 402. magnetic plate; 5. pump body; 6. liquid guide tube; 7. waste collection assembly; 8. adsorption assembly. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-9 The present invention provides a technical solution: a high-precision double-sided grinding and polishing machine, comprising a polishing table 1 and a polishing pad 2 arranged thereon; a positioner 201, a drainage assembly 202 and a moving assembly 203 are also arranged above the polishing table 1, wherein the positioner 201 is used for wafer positioning and polishing processing, and the drainage assembly 202 is used for adding polishing liquid; in this technical solution, the positioning and installation method of the wafer adopts the existing setting, which can be fixed by snapping or adsorption, so that the wafer is set at the bottom of the positioner 201 through the mounting bracket component. During the grinding and polishing operation, the positioner 201 moves due to the drive of the motor, and the positioner 203 moves. 01 drives the wafer to move relative to the polishing pad 2, while the discharge component 202 is used to add polishing liquid to assist grinding. The moving component 203 is driven by a motor and can move back and forth to guide the polishing liquid collected on the polishing pad 2 to the bottom of the positioner 201, thereby promoting the processing, grinding and polishing of the wafer. The installation method of the positioner 201 itself is driven by a motor to rotate by hinges, which is convenient for changing its positioning angle and facilitating the assembly and removal of the wafer. At the same time, during the grinding and polishing process of the wafer workpiece, the softened layer formed by the chemical corrosion of the polishing liquid will be turned into large particles of impurities due to grinding and removed from the workpiece, thereby improving the flatness of the wafer.

[0022] The above technical solution further includes: a collection chamber 3 installed on the side of the polishing table 1. The inside of the collection chamber 3 communicates with the groove at the edge of the tabletop of the polishing table 1. And a barrier 4 for restricting the flow and turning of the polishing liquid is provided inside the collection chamber 3. And a pump body 5 is provided on the back of the barrier 4 away from the through connection of the collection chamber 3 and the polishing table 1. The pump body 5 is connected to a liquid guide pipe 6 outside the polishing table 1. At the same time, a waste collection component 7 is also provided at the inner edge of the barrier 4. An adsorption component 8 is provided on the waste collection component 7. The adsorption component 8 is used for adsorbing large particle materials in the polishing liquid; the barrier 4 is located at the center of the inside of the collection chamber 3. A guiding channel for the flow of the polishing liquid is reserved between the outer edge of the barrier 4 and the inner wall of the side of the collection chamber 3. A channel for accumulating large particle substances in the polishing liquid is provided at the turning corner of the guiding channel; a sealing member is provided at the joint between the inner side of the polishing table 1 and the outer edge of the polishing pad 2. The sealing member is discontinuously provided at the liquid inlet position of the collection chamber 3. The sealing member can be a sealing strip or the like; the liquid inlet port of the pump body 5 is located at the tail position of the guiding channel inside the collection chamber 3. The tail of the guiding channel where the liquid inlet port is located is concave; in the above solution, during the grinding and polishing of the workpiece, since the polishing operation of the workpiece causes the polishing liquid on the polishing pad 2 to be guided to the liquid inlet position of the collection chamber 3, the polishing liquid is thus introduced into the collection chamber 3. Under the action of external force movement and the liquid pumping of the pump body 5, the polishing liquid flows in the guiding channel inside the collection chamber 3. And during the continuous flow of the polishing liquid, the turning corner inside the guiding channel forms a convergence point of large particle impurities generated by the eddy current, so that during the continuous application of the polishing liquid, the mixing of large particle impurities and grinding particle substances contained therein is reduced, and the side effects of the grinding process are affected.

[0023] At the same time, in this technical solution, the collection chamber 3 and the polishing table 1 are connected by a sealed elastic pipe fitting. The elastic pipe fitting realizes the through connection between the inside of the collection chamber 3 and the groove at the edge of the tabletop of the polishing table 1. At the same time, the bottom of the polishing table 1 is fixed on the top surface of the workbench 101; a vibration component 401 is also provided inside the barrier 4. At the same time, the bottom surface of the collection chamber 3 is movably connected with weak magnetism to the edge of the top surface of the workbench 101 through a magnetic plate 402; during the continuous flow of the above polishing liquid, when eddy currents are formed to collect and precipitate large particle impurities for separation, the vibration component 401 is further provided. The vibration component 401 generates vibration external force to improve the collection efficiency of large particle substances during the precipitation separation process. At the same time, the elastic pipe fitting connection and the weak magnetic connection of the magnetic plate 402 are set, so that when the collection chamber 3 vibrates as a whole under the vibration of the vibration component 401, it can adapt to its own movement and avoid the collection chamber 3 transmitting the vibration external force to the polishing pad 2, affecting the grinding and polishing operation of the workpiece.

[0024] In this technical solution, the liquid guide pipe 6 is arranged at the outer edge of the polishing table 1. At the same time, the liquid guide pipe 6, the collection chamber 3, the barrier 4 and the pump body 5 form an impurity removal and reflux system for the polishing liquid, realizing the confluence function of the polishing liquid, avoiding the lack of polishing liquid on the polishing pad 2, and affecting the efficiency and working stability of the grinding and polishing operation.

[0025] Embodiment 2: On the basis of Embodiment 1, the present invention further discloses that the waste collection component 7 is distributed at the inner wall position of the collection chamber 3, and the waste collection component 7 is arranged in a tubular shape. The distribution of the waste collection component 7 penetrates through the guiding channel for the flow of the polishing liquid inside the collection chamber 3 and the channel where the channel is located; a waste collection inlet is arranged on the waste collection component 7, and an adsorption component 8 is correspondingly arranged on the outer wall of the inlet. The adsorption component 8 includes highly dispersed diatomaceous earth. The waste collection component 7 is connected to an external negative pressure device; when large particle impurities are gathered inside the guiding channel, in order to facilitate the cleaning of the impurities, by arranging the waste collection component 7 and the adsorption component 8, the discharge of large particle impurities is facilitated. At the same time, the adsorption component 8 adopts highly dispersed diatomaceous earth, graphene, carbon nanotubes, etc., which can effectively adsorb large particles of silicon dioxide in the polishing liquid, separate the large particle impurities, so that the large particle impurities are further separated during the use of the polishing liquid, avoiding their mixing with the particulate grinding material in the polishing liquid and affecting the grinding and polishing.

[0026] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-precision double-sided grinding and polishing machine, comprising a polishing table (1) and a polishing pad (2) arranged thereon; It is characterized in that It further includes: A collection chamber (3), installed on the side of the polishing table (1). The inside of the collection chamber (3) is in communication with the groove at the edge of the tabletop of the polishing table (1). And a barrier (4) for restricting the flow and turning of the polishing liquid is provided inside the collection chamber (3). And a pump body (5) is provided on the back of the barrier (4) away from the through connection of the collection chamber (3) and the polishing table (1). The pump body (5) is connected to a liquid guide pipe (6) outside the polishing table (1). At the same time, a waste collection assembly (7) is also provided at the inner edge of the barrier (4). An adsorption assembly (8) is provided on the waste collection assembly (7). The adsorption assembly (8) is used for adsorbing large-particle materials in the polishing liquid.

2. The high-precision double-sided grinding and polishing machine according to claim 1, wherein: Above the polishing table (1), a locator (201), a liquid drainage assembly (202) and a moving assembly (203) are further provided. Among them, the locator (201) is used for wafer positioning and polishing processing, and the liquid drainage assembly (202) is used for the addition setting of the polishing liquid.

3. A high-precision double-sided grinding and polishing machine according to claim 1 or 2, characterized in that: Between the collection chamber (3) and the polishing table (1), they are butt-jointed through a sealed elastic pipe fitting. The elastic pipe fitting realizes the through connection between the inside of the collection chamber (3) and the groove at the edge of the tabletop of the polishing table (1). At the same time, the bottom of the polishing table (1) is fixed on the top surface of the workbench (101).

4. A high-precision double-sided grinding and polishing machine according to claim 3, characterized in that: A vibration assembly (401) is further provided inside the barrier (4). At the same time, the bottom surface of the collection chamber (3) is movably connected to the edge of the top surface of the workbench (101) with weak magnetism through a magnetic plate (402).

5. A high-precision double-sided grinding and polishing machine according to claim 1 or 4, characterized in that: The barrier (4) is located at the center inside the collection chamber (3). A guiding channel for the flow of the polishing liquid is reserved between the outer edge of the barrier (4) and the inner wall of the side of the collection chamber (3). A channel for accumulating large-particle substances in the polishing liquid is provided at the turning corner of the guiding channel.

6. The high-precision double-sided grinding and polishing machine according to claim 5, characterized in that: The liquid inlet port of the pump body (5) is located at the tail position of the guiding channel inside the collection chamber (3), and the tail of the guiding channel where the liquid inlet port is located is concave.

7. A high-precision double-sided grinding and polishing machine according to claim 6, characterized in that: The waste collection assembly (7) is distributed at the inner wall position of the collection chamber (3), and the waste collection assembly (7) is arranged in a tubular shape. The distribution of the waste collection assembly (7) penetrates through the guiding channel for the flow of the polishing liquid inside the collection chamber (3) and the channel where the channel is located.

8. A high-precision double-sided grinding and polishing machine according to claim 1 or 7, characterized in that: A waste collection inlet is provided on the waste collection assembly (7). An adsorption assembly (8) is correspondingly arranged on the outer wall of the inlet. The adsorption assembly (8) includes highly dispersed diatomaceous earth. The waste collection assembly (7) is connected to an external negative pressure device.

9. A high-precision double-sided grinding and polishing machine according to claim 1, characterized in that: The liquid guide pipe (6) is arranged at the outer edge of the polishing table (1). At the same time, the liquid guide pipe (6), the collection chamber (3), the barrier (4) and the pump body (5) form a polishing liquid impurity removal and reflux system.

10. A high-precision double-sided grinding and polishing machine according to any one of claims 1, characterized in that: A sealing member is provided at the joint between the inner side of the polishing table (1) and the outer edge of the polishing pad (2). The sealing member is discontinuously arranged at the liquid inlet of the collection chamber (3).

Images