Adsorption adjusting method, device and equipment of PCB labeling feeding machine and medium

Abstract

The invention relates to an adsorption adjustment method, device and equipment of a PCB labeling feeding machine and a medium, and the adsorption adjustment method of the PCB labeling feeding machine comprises the steps that if a corresponding adsorption mode is not matched, corresponding adsorption coordinates are determined according to current batch information; projection coordinates of the vacuum mechanical arm are determined, and the projection coordinates and the adsorption coordinates are located on the same plane; determining a target mechanical arm corresponding to each adsorption coordinate according to a projection distance between the projection coordinate and the adsorption coordinate; and according to the projection distance, adsorption adjustment parameters used for driving the target mechanical arm to move are generated in a self-adaptive mode, so that the target mechanical arm is adjusted till the projection coordinates of the target mechanical arm coincide with the corresponding adsorption coordinates. By re-matching the adsorption mode or regenerating the adsorption coordinate when the identification is inconsistent, the rapid adaptation to different PCB batches can be realized, the wrong setting of the adsorption point caused by the batch change is avoided, and the accuracy and adaptability of the adsorption operation in the labeling process are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of adsorption control of a PCB board labeling and loading machine, and particularly relates to an adsorption adjustment method, device, equipment and medium for a PCB board labeling and loading machine. Background Art

[0002] Currently, during the PCB board labeling and loading process, in order to achieve automatic labeling of multiple types and specifications of PCB boards, it is usually necessary to rely on multiple robotic arms to coordinate adsorption and position adjustment. However, due to differences in the structural dimensions, labeling positions, and adsorption requirements of different batches of PCB boards, traditional labeling and loading methods often lack the ability to adaptively identify batch changes, and it is difficult for the adsorption strategies and movement paths of the robotic arms to quickly switch and accurately match according to the actual board type, resulting in problems such as inaccurate adsorption point setting, lag in adsorption position adjustment, or insufficient labeling accuracy. In addition, during actual operation, problems such as adsorption offset or misalignment between the adsorption point and the target labeling area often occur, which not only affects the consistency of labeling quality, but also easily causes abnormal alarms or operation interruptions of the labeling equipment, thereby reducing the overall production line efficiency and stability. Summary of the Invention

[0003] In order to solve the problem that traditional labeling and loading methods lack the ability of adaptive identification and precise adsorption coordination when dealing with the structural differences of different batches of PCB boards, resulting in inaccurate adsorption point setting, lag in position adjustment, and insufficient labeling accuracy, the present application provides an adsorption adjustment method, device, equipment and medium for a PCB board labeling and loading machine.

[0004] An adsorption adjustment method for a PCB board labeling and loading machine is applied to a labeling and loading machine that automatically adjusts the vacuum adsorption position. The labeling and loading machine that automatically adjusts the vacuum adsorption position includes a plurality of vacuum robotic arms arranged in sequence. The adsorption adjustment method for the PCB board labeling and loading machine includes: Detect whether the current batch information of the current PCB board is consistent with the previous batch information. If it is consistent, continue to use the adsorption mode corresponding to the previous batch information for PCB board adsorption. If it is inconsistent, match the corresponding adsorption mode according to the current batch information; If the corresponding adsorption mode cannot be matched, determine the corresponding adsorption coordinates according to the current batch information; Determine the projection coordinates of the vacuum robotic arm, and the projection coordinates and the adsorption coordinates are on the same plane; Determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; Generate adsorption adjustment parameters for driving the target robotic arm to move adaptively according to the projection distance, and adjust the target robotic arm until the projection coordinates of the target robotic arm coincide with the corresponding adsorption coordinates.

[0005] By adopting the above technical solution, by comparing the current batch information with the previous batch information and rematching the adsorption mode or regenerating the adsorption coordinates when the identification is inconsistent, it is possible to achieve rapid adaptation to different PCB batches, avoid incorrect setting of adsorption points due to batch changes, and improve the accuracy and adaptability of the adsorption operation during the labeling process.

[0006] In a preferred example of the present application, it can be further configured that in the step of determining the corresponding adsorption coordinates according to the current batch information, it includes: Determine the corresponding type information, size information, and labeling area according to the current batch information; Construct a corresponding projection plane according to the type information and size information; Generate a corresponding adsorption area according to the labeling area; Generate corresponding adsorption coordinates within the projection plane according to the adsorption area.

[0007] By adopting the above technical solution, by extracting the type information, size information, and labeling area of the PCB board, and constructing a projection plane, generating an adsorption area, and adsorption coordinates based on the information, it is possible to ensure that the layout of the adsorption points in physical space corresponds precisely to the PCB board structure, thereby improving the rationality and spatial accuracy of the adsorption path generation.

[0008] In a preferred example of the present application, it can be further configured that in the step of generating a corresponding adsorption area according to the labeling area, it includes: Obtain the position coordinates and area information of the labeling area on the projection plane; Extract the adsorption offset parameters matching the labeling area from a preset adsorption offset model based on the position coordinates and the area information; Perform adsorption area conversion calculation according to the position coordinates and the adsorption offset parameters to generate a corresponding coordinate range; Determine the corresponding adsorption area according to the coordinate range.

[0009] By adopting the above technical solution, by obtaining the position and area information of the labeling area, calculating the adsorption area in combination with a preset adsorption offset model, and deriving the adsorption coordinates therefrom, it is possible to avoid the core labeling area during the adsorption action, improve the adsorption stability, reduce the risk of pollution or damage to the labeling area, and thus improve the overall yield of the attachment.

[0010] In a preferred example, the present application can be further configured as follows: in the step of determining the projection coordinates of the vacuum robot arm, it includes: Based on the projection plane, construct a three-dimensional space coordinate system consistent with the adsorption coordinate reference; Obtain the historical coordinate system, and based on the comparison result between the historical coordinate system and the current coordinate system, calibrate the three-dimensional space position data of the end effectors of each of the vacuum robot arms; Based on the three-dimensional space position data, perform coordinate projection operations to convert it into two-dimensional projection coordinates on the projection plane.

[0011] By adopting the above technical solution, by constructing a unified three-dimensional space coordinate system, comparing and calibrating it in combination with the historical coordinate system, and projecting the end position of the vacuum robot arm onto the adsorption reference plane, it is possible to effectively eliminate coordinate offset and repeated positioning errors during equipment operation, and ensure the spatial consistency and comparability of projection matching.

[0012] In a preferred example, the present application can be further configured as follows: the step of determining the target robot arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinate and the adsorption coordinate includes: Calculate the projection distance between each adsorption coordinate and each projection coordinate, and generate a distance matrix corresponding to each adsorption coordinate according to the projection distance; Determine the minimum value of the distance matrix, and determine the adsorption coordinate corresponding to the minimum value as the reference coordinate, and determine the projection coordinate corresponding to the minimum value as the candidate coordinate; If the minimum value is one, use the vacuum robot arm corresponding to the candidate coordinate as the target robot arm of the reference coordinate; If the minimum value is multiple, determine the adsorption coordinates adjacent to the reference coordinate as adjacent coordinates, and call the distance matrix of the adjacent coordinates as the adjacent matrix; Select multiple adjacent candidate values corresponding to the candidate coordinates in the adjacent matrix, and use the vacuum robot arm corresponding to the largest adjacent candidate value as the target robot arm of the reference coordinate.

[0013] By adopting the above technical solution, by calculating the projection distance between the adsorption coordinates and each vacuum robot arm, establishing a mapping relationship between the adsorption points and the robot arms, and selecting the optimal target robot arm through the comparison of adjacent coordinates in case of distance conflicts, it is possible to effectively avoid resource duplicate matching and robot arm conflicts, and improve the intelligence of task allocation and the stability of labeling operations.

[0014] In a preferred example, the present application can be further configured as follows: In the step of adaptively generating adsorption adjustment parameters for driving the target robotic arm to move according to the projection distance, it includes: Determine the corresponding swing arc path according to the projection distance; Judge whether there is an interference point in the swing arc path. If not, generate corresponding swing adjustment parameters according to the swing arc path; If so, generate a compensation factor according to the interference point, and adaptively generate corresponding front-back translation parameters and left-right translation parameters according to the compensation factor.

[0015] By adopting the above technical solution, by generating the swing arc path of the robotic arm based on the projection distance and adaptively introducing translation compensation parameters according to the interference situation in the path, the flexible adjustment of the robotic arm in the limited space of the labeling area can be realized, and the path obstacle avoidance ability of the adsorption action and the safety and stability of the equipment operation can be improved.

[0016] The second invention object of the present application is achieved through the following technical solution: An adsorption control device for a PCB board labeling and loading machine, the adsorption control device for a PCB board labeling and loading machine includes: A detection module, used to detect whether the current batch information of the current PCB board is consistent with the previous batch information. If it is consistent, continue to apply the adsorption mode corresponding to the previous batch information for PCB board adsorption. If it is inconsistent, match the corresponding adsorption mode according to the current batch information; A first determination module, used to determine the corresponding adsorption coordinates according to the current batch information if no corresponding adsorption mode is matched; A second determination module, used to determine the projection coordinates of the vacuum robotic arm, and the projection coordinates and the adsorption coordinates are on the same plane; A third determination module, used to determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; A generation module, used to adaptively generate adsorption adjustment parameters for driving the target robotic arm to move according to the projection distance, so as to adjust the target robotic arm until the projection coordinates of the target robotic arm coincide with the corresponding adsorption coordinates.

[0017] The third object of the present application is achieved through the following technical solution: A computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the steps of the above-mentioned adsorption adjustment method for a PCB board labeling and loading machine.

[0018] The above-mentioned fourth object of the present application is achieved by the following technical solutions: A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above-mentioned adsorption adjustment method of a PCB board labeling and feeding machine are implemented.

[0019] In summary, the present application includes at least one of the following beneficial technical effects: In the present application, a dynamic adsorption mode matching mechanism based on batch information is introduced in the PCB board labeling and feeding process, realizing the automatic adaptation and precise update of the operating parameters of the labeling equipment. Specifically, the system first compares the batch information of the current PCB board with that of the previous batch. When the batches are the same, the configured adsorption mode is directly reused, thus avoiding repeated calculations and coordinate configurations, reducing initialization delays, and improving the continuity of the labeling rhythm. When the batches are different, the system automatically generates corresponding adsorption coordinates based on the type information, size information, and labeling area of the new batch, ensuring structural adaptability when operating on multiple specifications of PCB boards. Subsequently, by obtaining the real-time projection coordinates of multiple vacuum robotic arms and calculating the projection distances between each robotic arm and the adsorption points on the basis of being in the same reference plane as the target adsorption coordinates, and establishing an optimal mapping relationship based on this distance, the allocation of adsorption tasks and resource scheduling are completed. Finally, for the displacement differences between each adsorption point and the robotic arm, the system dynamically generates adsorption adjustment parameters according to the distance information and drives the target robotic arm to perform precise displacement along the calculated path until the end of the robotic arm aligns with the adsorption coordinate position, realizing high-precision adsorption operations. Through the above series of related technical means, the present application effectively solves the problems of adsorption point configuration delay, position deviation, and labeling inaccuracy existing in traditional labeling equipment under multi-batch changes, and significantly improves the adsorption stability, positioning accuracy, and operation flexibility of the equipment in complex production scenarios. Description of the Drawings

[0020] Figure 1 is a flowchart of an adsorption adjustment method of a PCB board labeling and feeding machine in an embodiment of the present application.

[0021] Figure 2 is an implementation flowchart of step S20 in an adsorption adjustment method of a PCB board labeling and feeding machine in an embodiment of the present application; Figure 3 is an implementation flowchart of step S203 in an adsorption adjustment method of a PCB board labeling and feeding machine in an embodiment of the present application; Figure 4 is an implementation flowchart of step S30 in an adsorption adjustment method of a PCB board labeling and feeding machine in an embodiment of the present application; Figure 5It is a flowchart of the implementation of step S40 in an adsorption adjustment method of a PCB labeling and loading machine in an embodiment of the present application; Figure 6 It is a flowchart of the implementation of step S50 in an adsorption adjustment method of a PCB labeling and loading machine in an embodiment of the present application; Figure 7 It is a schematic structural diagram of a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application; Figure 8 It is a [description continues] in a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application Figure 7 Enlarged view of A; Figure 9 It is a right view of a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application; Figure 10 It is a sectional schematic view of a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application along the Figure 9 A - A direction; Figure 11 It is a [description continues] in a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application Figure 10 Partial enlarged view; Figure 12 It is a [description continues] in a labeling and loading machine for automatically adjusting the vacuum adsorption position in an embodiment of the present application Figure 11 Enlarged view of B; Figure 13 It is a principle block diagram of an adsorption control device of a PCB labeling and loading machine in an embodiment of the present application; Figure 14 It is a schematic diagram of the equipment in an embodiment of the present application.

[0022] Explanation of reference numerals: 1. Adaptive adsorption mechanism; 11. Support frame; 111. Sliding groove; 112. Through hole; 12. Sliding and translating component; 121. Sliding block; 122. Sliding drive motor; 13. Oscillating and translating component; 131. Drive rod; 132. Rotary drive motor; 133. Rotating block; 134. Gear; 135. Coil; 136. Electromagnetic connecting piece; 14. Adsorption component; 141. Transmission rod; 142. Adsorption rod; 143. Straight rack; 2. PCB handling mechanism; 21. Lifting and handling component; 22. Translating and handling component. Detailed implementation manners

[0023] The following further elaborates on the present application with reference to the accompanying drawings.

[0024] In one embodiment, the present application discloses an adsorption adjustment method for a PCB labeling and loading machine, which is applied to a labeling and loading machine that automatically adjusts the vacuum adsorption position, as Figures 7 - 10 shown, a labeling and loading machine that automatically adjusts the vacuum adsorption position includes an adaptive adsorption mechanism 1 and a PCB handling mechanism 2 connected to the adaptive adsorption mechanism 1 and used to control the translation and / or lifting of the adsorption mechanism. The adaptive adsorption mechanism includes a support frame 11, a sliding translation component 12, a swinging translation component 13, and an adsorption component 14. The sliding translation component 12 is a vacuum robotic arm. The adsorption component 14 is used to adsorb the PCB board. The swinging translation component 13 is connected to the adsorption component 14 to enable the adsorption component 14 to translate left and right relative to the swinging translation component 13. The swinging translation component 13 is rotationally matched with the sliding translation component 12 to enable the adsorption component 14 to rotate with the rotation of the swinging translation component 13 relative to the sliding translation component 12. A plurality of the sliding translation components 12 are provided in total, and the plurality of sliding translation components 12 are spaced apart on the support frame 11. Each sliding translation component 12 is slidably matched with the support frame 11 to enable the adsorption component 14 to translate back and forth with the back-and-forth translation of the sliding translation component 12 relative to the support frame 11.

[0025] Further, as Figure 11 shown, the adsorption component 14 includes a transmission rod 141 and an adsorption rod 142. One end of the transmission rod 141 is in transmission connection with the swinging translation component 13, and the other end is in plug-in connection with the adsorption rod 142. The suction head of the adsorption rod 142 is aligned with the loading area for placing the PCB board.

[0026] Further, as Figures 11 - 12 shown, the swinging translation component 13 includes a driving rod 131, a rotary driving motor 132, and a rotating block 133. The rotating block 133 is rotationally matched with the sliding translation component 12 and is sleeved with the bottom of the driving rod 131. The middle of the driving rod 131 is in transmission connection with the transmission rod 141. The top of the driving rod 131 is connected to the rotary driving motor 132. The rotary driving motor 132 is used to drive the driving rod 131 to rotate, thereby driving the transmission rod 141 to transmit, and / or driving the rotating block 133 to rotate.

[0027] Further, as Figure 11 shown, a straight rack 143 is provided inside the transmission rod 141. A gear 134 is sleeved in the middle of the driving rod 131. The gear 134 is meshed with the straight rack 143. The gear 134 rotates with the rotation of the driving rod 131, and then drives the transmission rod 141 to translate left and right through the straight rack 143.

[0028] Further, as Figures 11 - 12 shown, a bearing is sleeved on the bottom of the transmission rod 141 for supporting the transmission rod 141 to rotate idly in the rotating block 133. An electromagnetic connecting member 136 is key-connected to the inner side of the rotating block 133. A coil 135 is arranged in the transmission rod 141. The coil 135 is electrically connected to the rotation driving assembly. When the coil 135 is powered on, the electromagnetic connecting member 136 is adsorbed on the transmission rod 141, and the rotating block 133 is driven to rotate by the transmission rod 141 that is rotating idly through the electromagnetic connecting member 136.

[0029] Further, as Figure 8 shown, the sliding and translating member 12 includes a sliding block 121 and a sliding driving motor 122. The sliding block 121 is slidably matched with the support frame 11 and is rotatably matched with the swinging and translating member 13. The sliding driving motor 122 is used for driving the sliding block 121 to translate back and forth relative to the support frame 11.

[0030] Further, as Figure 8 shown, a sliding groove 111 with an upward opening is arranged on the support frame 11. The sliding groove 111 is slidably matched with the sliding block 121. A through hole 112 is arranged on one side of the support frame 11 to enable the sliding groove 111 to communicate with the outside of the support frame 11. The driving end of the sliding driving motor 122 passes through the through hole 112 and is connected to the sliding block 121.

[0031] Further, as Figure 7 shown, the PCB handling mechanism 2 includes: a lifting and handling member 21, connected to the adaptive adsorption mechanism 1, for controlling the lifting of the adaptive adsorption mechanism 1; a translating and handling member 22, connected to the lifting and handling member 21, for controlling the translation of the lifting and handling member 21.

[0032] As Figure 1 shown, an adsorption adjustment method for a PCB labeling and loading machine includes: S10. Detect whether the current batch information of the current PCB is the same as the previous batch information. If it is the same, continue to adsorb the PCB using the adsorption mode corresponding to the previous batch information. If it is not the same, match the corresponding adsorption mode according to the current batch information; S20. If the corresponding adsorption mode cannot be matched, determine the corresponding adsorption coordinates according to the current batch information; S30. Determine the projection coordinates of the vacuum robotic arm. The projection coordinates and the adsorption coordinates are in the same plane; S40. Determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinate and the adsorption coordinate; S50. Adaptively generate adsorption adjustment parameters for driving the movement of the target robotic arm according to the projection distance, so as to adjust the target robotic arm until the projection coordinate of the target robotic arm coincides with the corresponding adsorption coordinate.

[0033] In this embodiment, the PCB board labeling and loading machine is an automated device for attaching labeling objects (usually labels or identification units) to designated positions on printed circuit boards (PCBs). Its adsorption adjustment device is the core execution module in this equipment, used to achieve the adsorption and grasping of the PCB board and position calibration. Its main function is to accurately identify and complete the adsorption action on PCBs of different specifications or batches. The vacuum robotic arm refers to an automated robotic arm assembly equipped with a vacuum adsorption device, with the ability to generate negative pressure at its end, used to adsorb workpieces such as PCB boards or labels. In this device, multiple vacuum robotic arms are arranged in sequence along the loading path of the labeling machine, cooperating with the control system to execute adsorption and transfer tasks. Batch information refers to a parameter set used to identify PCBs of different production batches, usually including the type number, geometric dimensions, labeling area characteristics, etc. of the PCB board, used to distinguish different types of circuit boards with different structures or configurations. The adsorption mode refers to a set of adsorption execution strategies corresponding to specific batch information, including the adsorption point position, adsorption sequence, adsorption method (such as adsorption force, time), etc., used to guide the vacuum robotic arm to execute adsorption operations under specific conditions. The adsorption coordinate refers to a set of two-dimensional spatial coordinate points of the target adsorption positions generated for the current batch of PCB boards in the projection plane, reflecting the position targets where each vacuum robotic arm should complete the adsorption operation, and is the direct positioning input for the adsorption action. The projection coordinate refers to the two-dimensional coordinate points obtained by converting the actual three-dimensional spatial position of the end effector of each vacuum robotic arm to the same reference plane as the adsorption coordinate through a specific projection rule (such as orthogonal projection), used to unify the coordinate system to achieve position comparison and matching. The projection distance is the geometric distance between the adsorption coordinate and the projection coordinate on the same reference plane, usually calculated by the Euclidean formula, used to judge the spatial difference between the current robotic arm and the target adsorption position. The target robotic arm refers to the specific robotic arm finally assigned to complete the adsorption task corresponding to a certain adsorption coordinate among multiple vacuum robotic arms, and its selection basis is usually the shortest projection distance or other optimization rules. The adsorption adjustment parameters are a set of action control parameters automatically generated based on the offset between the current projection coordinate and the adsorption coordinate of the target robotic arm, combined with preset path planning rules and control strategies, and may include movement direction, displacement, movement speed, interference compensation, etc., used to drive the target robotic arm to perform precise alignment operations.

[0034] For example, on a certain PCB board labeling production line, the currently loaded PCB board is of model A100, and its batch information is different from that of the previous board of model B200. Therefore, the system fails to match the existing adsorption mode. The system recalculates 4 adsorption coordinate points based on the type information and labeling area of A100, and obtains the projection coordinates of 6 vacuum manipulators arranged currently. By calculating the projection distance, the system assigns the closest target manipulator to each adsorption coordinate, and at the same time generates adsorption adjustment parameters based on the differences between these coordinates, driving the corresponding manipulator to move to the target adsorption point to complete the adsorption, thus realizing the adaptive labeling operation under this batch.

[0035] In this embodiment, after all target manipulators complete the alignment operation with the corresponding adsorption coordinates and successfully execute the adsorption task according to the adsorption adjustment parameters, the system records the current batch information, the adsorption coordinates, the target manipulator numbers and their corresponding adjustment parameters in the actual execution process, and integrates them to form a new adsorption mode. This adsorption mode is stored in the system database as an adsorption configuration template corresponding to the current batch information for direct call in the subsequent labeling and loading operations of PCB boards of the same batch, so as to realize the self-learning and automatic optimization of the adsorption strategy, thereby improving the response speed of the system to multi-batch changes and the continuous stability of the labeling operation.

[0036] In one embodiment, as Figure 2 shown, in step S20, that is, in the step of determining the corresponding adsorption coordinates according to the current batch information, it includes: S201. Determine the corresponding type information, size information and labeling area according to the current batch information; S202. Construct the corresponding projection plane according to the type information and size information; S203. Generate the corresponding adsorption area according to the labeling area; S204. Generate the corresponding adsorption coordinates in the projection plane according to the adsorption area.

[0037] In this embodiment, the type information refers to the classification data used to identify the classification to which the current PCB board belongs in terms of structural category, functional use, or process attributes. For example, it is classified into single-sided boards, double-sided boards, multi-layer boards, or special board types with specific plug-in positions. This information is usually provided by the production management system and is used to guide the selection of subsequent adsorption strategies. The size information refers to the geometric features of the current PCB board in the physical space, including parameters such as the length, width, edge contour, or hole position of the board body, and is the basic basis for determining the adsorption coordinate layout range and calculating boundary conditions. The labeling area refers to the effective area on the current PCB board for adhering labels or identification units, usually represented by a set of rectangular or polygonal coordinate ranges. This area needs to avoid sensitive structures such as pads, chips, or hole positions and have a sufficient attachable surface, which is an important limiting condition for adsorption point planning. The projection plane refers to a standard two-dimensional plane constructed in the virtual space according to the size information of the PCB board to express the adsorption coordinates, labeling area, and the projection position of the robotic arm. This plane is aligned with the actual PCB board installation plane to unify the reference system between the adsorption coordinates and the robotic arm coordinates. The adsorption area is a range of areas derived based on the position of the labeling area for the vacuum robotic arm to perform adsorption operations. The adsorption area usually has a certain offset or position adjustment relative to the labeling area to ensure that the adsorption process does not interfere with the label pasting process, and at the same time has sufficient robotic arm movement space and adsorption stability. Generating adsorption coordinates within the projection plane means calibrating one or more target coordinate points for adsorption positioning in the two-dimensional plane based on the boundary information and shape distribution of the above-mentioned adsorption area. Usually, it is optimized and arranged considering the end movement coverage range of the robotic arm and the adsorption load balance to form a set of coordinate outputs consistent with the actual adsorption actions.

[0038] For example, when processing a double-sided PCB board with a size of 120mm × 80mm, the system first analyzes that its labeling area is symmetrically arranged at both ends in the length direction of the board body and has a width of 20mm. On the constructed projection plane, the system offsets the set adsorption spacing outward according to the boundary of the labeling area. For example, it offsets 10mm horizontally and does not offset vertically, thus generating two adsorption areas located on the left and right sides of the labeling area. Subsequently, in each adsorption area, based on the center position of the area, combined with the installation attitude of the board body and the movement coverage range of the vacuum robotic arm, the geometric center of the area is selected as the initial point of the adsorption coordinate. If the adsorption area is large or there are multiple sub-areas in the labeling area, multiple adsorption coordinate points can also be arranged at fixed intervals or adaptive intervals within the adsorption area. For example, by generating equidistant grids within the adsorption area and then selecting the grid intersection points that meet the avoidance conditions as the adsorption coordinates, a set of optimized distributed adsorption coordinate sets can be formed to provide an accurate, stable, and non-interfering adsorption path for the robotic arm.

[0039] In one embodiment, as Figure 3As shown, in step S203, that is, in the step of generating a corresponding adsorption area according to the labeling area, it includes: S2031. Obtain the position coordinates and area information of the labeling area on the projection plane; S2032. Based on the position coordinates and area information, extract the adsorption offset parameters matching the labeling area from a preset adsorption offset model; S2033. According to the position coordinates and adsorption offset parameters, perform adsorption area conversion calculation to generate a corresponding coordinate range; S2034. Determine the corresponding adsorption area according to the coordinate range.

[0040] In this embodiment, the position coordinates refer to the coordinate values of the starting point or reference point of the labeling area on the projection plane, usually expressed in a two-dimensional Cartesian coordinate system, describing the specific spatial position of the labeling area on the entire PCB board plane, and are used as a reference basis for subsequent adsorption area conversion. The area information refers to the two-dimensional space range covered by the labeling area, usually expressed in the form of length and width dimensions or pixel rectangle boundaries, reflecting the external boundary scale of the labeling area. This information is the geometric basis for calculating the expansion range and offset path of the adsorption area. The adsorption offset model is a set of preset area mapping rules or parameter sets used to define how to generate an adsorption area based on the spatial distribution of the labeling area. This model usually includes parameters such as the offset direction (such as left, right, above), offset distance (such as millimeter-level offset values), and symmetry method (whether to mirror the offset), aiming to plan the adsorption operation range of the robotic arm without interfering with the labeling operation. The adsorption offset parameters are the specific values retrieved from the adsorption offset model, used to guide how to perform position extrapolation, boundary expansion, or angle adjustment during the geometric transformation of the labeling area. These parameters are usually related to the morphological type or center point position of the labeling area. The adsorption area conversion calculation refers to the calculation process of performing displacement processing and coordinate correction on the labeling area using geometric transformation algorithms based on the position coordinates of the labeling area and the extracted adsorption offset parameters. It usually includes calculation methods such as translation transformation, boundary expansion, and symmetric projection, and is used to generate an adsorption operation range that does not overlap with the labeling area but maintains a certain adjacency relationship. The coordinate range refers to the boundary set of the adsorption area generated after the adsorption area conversion calculation on the projection plane, generally defined by a set of two-dimensional coordinate points of the upper left corner and the lower right corner, and is used to frame the spatial boundary where the adsorption operation can be performed. The adsorption area refers to the spatial area finally determined based on the above coordinate range for implementing the adsorption action. This area should ensure adsorption stability, safety, and robotic arm accessibility, and have a clear logical association with the labeling area in terms of position.

[0041] For example, when processing a PCB board with a length of 100 mm and a width of 60 mm, the system parses that the labeling area is a 20 mm × 20 mm rectangular area located in the lower left corner of the board body, with its position coordinates being (10, 10) and the area information being 400 mm². According to the shape and position of the labeling area, the system extracts the corresponding adsorption offset parameters from the adsorption offset model, including a strategy of offsetting 10 mm to the right and 5 mm upward. Subsequently, the system uses the reference point (10, 10) of the labeling area as the geometric reference, performs the adsorption area conversion calculation according to the offset parameters, extrapolates it into a new rectangular area with a starting point of (20, 15) and a size of 20 mm × 20 mm, and records the coordinate range of this area as (20, 15)-(40, 35). Finally, this range is defined as the adsorption area corresponding to the labeling area, which is used to plan the adsorption coordinate points within this area subsequently, so as to achieve the spatial logic decoupling of the adsorption area and the labeling area.

[0042] In one embodiment, as Figure 4 shown, in step S30, that is, the step of determining the projection coordinates of the vacuum robot arm, includes: S301. Based on the projection plane, construct a three-dimensional space coordinate system consistent with the adsorption coordinate reference; S302. Obtain the historical coordinate system, and calibrate the three-dimensional space position data of the end effectors of each vacuum robot arm based on the comparison result between the historical coordinate system and the current coordinate system; S303. Based on the three-dimensional space position data, perform coordinate projection operations to convert it into two-dimensional projection coordinates on the projection plane.

[0043] In this embodiment, the three-dimensional space coordinate system refers to a reference coordinate system established in the control logic of the labeling device to describe the positional relationships of the robotic arm, the adsorption points, and related structures in space. It usually includes three orthogonal axes, X, Y, and Z, and is used to accurately describe the spatial position and attitude of the end effector of the vacuum robotic arm. The construction of this coordinate system is based on the direction and reference of the projection plane, ensuring that all coordinate data are aligned with a unified reference during calculation, and it is the basis for subsequent realization of spatial projection and error calibration. The historical coordinate system refers to the coordinate system recorded and applied during the previous batch or the last calibration process of the device, which reflects the spatial layout of the robotic arm and the device state at that time, and is used to compare with the current coordinate system to identify whether structural offsets or geometric drifts have occurred in the device after long-term operation, part replacement, or maintenance. The comparison result refers to the quantified data of the differences in position, direction, or scale between the current coordinate system and the historical coordinate system, usually manifested as an offset vector or a rotation matrix, and is used to guide the correction and synchronization of coordinates. Calibration refers to the process of correcting the three-dimensional space position data of the end effector of the current vacuum robotic arm collected by using the above comparison result, ensuring that it is consistent with the reference datum where the adsorption coordinates are located in the newly established space coordinate system, so as to eliminate the position deviation caused by device offset, mechanical wear, or installation error. The three-dimensional space position data refers to the specific coordinate positions of each end of the vacuum robotic arm in space, including the X, Y, and Z axis components, usually obtained by feedback from sensors or encoders, and is the core input data for performing the adsorption path planning. The coordinate projection operation refers to mapping the above three-dimensional space position data onto the projection plane according to the specified projection rules (such as orthogonal projection, perspective projection, etc.), so as to convert it into two-dimensional coordinate points on the same reference plane as the adsorption coordinates, facilitating the realization of position comparison, distance calculation, and task allocation. The two-dimensional projection coordinates are the result of the coordinate projection operation, which is the mapping form of the target adsorption point and the position of the end of the vacuum robotic arm on the unified reference plane, ensuring that the entire adsorption logic performs spatial matching within the same coordinate system.

[0044] For example, when processing a labeling device equipped with six vacuum robotic arms, the system first constructs a three-dimensional space coordinate system with the X axis representing the length direction of the board, the Y axis representing the width direction, and the Z axis representing the vertical direction based on the direction of the PCB attachment surface, and aligns this coordinate system with the reference plane used for the adsorption coordinates. Subsequently, the system calls the historical coordinate system recorded in the previous production of the device and compares it with the attitude detected by the current robotic arm, identifying that some robotic arms have a 1.5 mm offset due to fixture replacement. The system performs spatial calibration based on the comparison result, corrects the three-dimensional positions of the ends of all current robotic arms, and obtains the accurate X, Y, and Z coordinates. Finally, each corrected three-dimensional position is mapped onto the projection plane of Z = 0 through the orthogonal projection method to obtain the two-dimensional projection coordinates of each vacuum robotic arm on this plane, providing a unified reference for the subsequent calculation of the projection distance from the adsorption coordinates.

[0045] In one embodiment, as Figure 5 shown, in step S40, that is, the step of determining the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinate and the adsorption coordinate, includes: S401. Calculate the projection distance between each adsorption coordinate and each projection coordinate, and generate a distance matrix corresponding to each adsorption coordinate according to the projection distance; S402. Determine the minimum value of the distance matrix, and determine the adsorption coordinate corresponding to the minimum value as the reference coordinate, and determine the projection coordinate corresponding to the minimum value as the candidate coordinate; S403. If the minimum value is one, use the vacuum robotic arm corresponding to the candidate coordinate as the target robotic arm of the reference coordinate; S404. If the minimum value is multiple, determine the adsorption coordinates adjacent to the reference coordinate as the adjacent coordinates, and call the distance matrix of the adjacent coordinates as the adjacent matrix; S405. Select multiple adjacent candidate values corresponding to the corresponding candidate coordinates in the adjacent matrix, and use the vacuum robotic arm corresponding to the largest adjacent candidate value as the target robotic arm of the reference coordinate.

[0046] In this embodiment, the distance matrix refers to a numerical set composed of two-dimensional projection distances calculated for each adsorption coordinate and the projection coordinates of all vacuum manipulators. It is usually stored in the form of a two-dimensional array. Each row of the matrix corresponds to an adsorption coordinate, and each column corresponds to a vacuum manipulator. The intersection value represents the distance between the corresponding adsorption point and the projection coordinate of the manipulator. This matrix is used to comprehensively express the spatial matching degree between the current adsorption task and the manipulator. The minimum value refers to the minimum distance value that can be obtained among the projection distances corresponding to a certain adsorption coordinate, indicating the closest state in space between the current adsorption point and a certain manipulator. It is the direct basis for determining the optimal manipulator allocation. The reference coordinate refers to the adsorption coordinate selected during the current comparison process for task allocation judgment. Its corresponding projection distance is the current global minimum value or the key adsorption target in the conflict judgment state, and it is the coordinate point that is given priority in this round of allocation. The candidate coordinate refers to the projection coordinate of the vacuum manipulator corresponding to the minimum distance from a certain reference adsorption coordinate in the distance matrix. The vacuum manipulator associated with this projection coordinate is the candidate manipulator and is the target object that may be assigned to perform the adsorption task. The adjacent coordinate refers to other adsorption coordinates in the adsorption coordinate set that are adjacent in position or logically related in layout to the current reference coordinate, usually based on the actual physical position. For example, the front, back, left, and right coordinate points arranged sequentially on a PCB board are used to assist in judging task conflicts or allocation priorities. The adjacent matrix refers to a subset of the distance matrix calculated around the adjacent coordinates. Its structure is the same as that of the main distance matrix, but it only contains the distance information between the adjacent adsorption coordinates and the projection coordinates of all or part of the vacuum manipulators, and is used as an auxiliary reference matrix for conflict allocation judgment. The adjacent candidate value refers to the distance value at the corresponding position of the current candidate coordinate in the adjacent matrix. These values reflect the cost of the candidate manipulator that may be assigned to the adjacent adsorption coordinates if it is not assigned to the reference adsorption coordinate. The vacuum manipulator corresponding to the maximum adjacent candidate value is the selection object with the "least sacrifice" in the global scheduling and can be used to reasonably allocate resources in case of conflicts.

[0047] For example, when performing a labeling task once, the system calculates the distances between four adsorption coordinates and the projection coordinates of five vacuum robotic arms to form a 4×5 distance matrix. The distance between the first adsorption coordinate and the second robotic arm is the smallest, which is 2.1 mm. The system sets this adsorption coordinate as the reference coordinate and sets the corresponding projection coordinate of the second robotic arm as the candidate coordinate. If this minimum value is unique, the second robotic arm is directly assigned as the target robotic arm for this adsorption point. However, in this case, the distance between another adsorption coordinate and the second robotic arm is also 2.1 mm, resulting in the non-uniqueness of the minimum value. The system further searches for the adjacent adsorption coordinates on the left and right sides of this reference coordinate and reextracts the distances between these adjacent coordinates and the second robotic arm to form an adjacent matrix. It is found in the adjacent matrix that the distances between the second robotic arm and the adjacent coordinates are 5.3 mm and 7.1 mm. Finally, the system selects the robotic arm corresponding to the maximum adjacent candidate value of 7.1 mm and assigns it to the reference coordinate to ensure the balanced scheduling and minimum loss of the overall adsorption task.

[0048] In one embodiment, as Figure 6 shown, in step S50, that is, the step of adaptively generating adsorption adjustment parameters for driving the target robotic arm to move according to the projection distance, includes: S501. Determine the corresponding swing arc path according to the projection distance; S502. Judge whether there are interference points on the swing arc path. If not, generate the corresponding swing adjustment parameters according to the swing arc path; S503. If so, generate a compensation factor according to the interference points, and adaptively generate the corresponding forward / backward translation parameters and left / right translation parameters according to the compensation factor.

[0049] In this embodiment, the swing arc path refers to the spatial motion trajectory formed based on the joint structure and end effector path planning of the target robotic arm during the process of moving from the current position to the adsorption coordinate position. This trajectory is expressed in the form of an arc and is usually calculated by the control system according to the current projection distance, robotic arm structure parameters, and motion planning model. It contains information such as the rotation angle, radius range, and movement direction during the movement of the robotic arm, and is used to ensure the smoothness and spatial accessibility of the motion. The interference point refers to the key spatial positions in the area passed by the path where physical collisions or operational interferences may occur with the equipment structure, other robotic arms, workpieces, or the edge of the plate when the robotic arm executes the motion according to the calculated swing arc path. These points are limiting factors affecting the safe operation of the robotic arm and the feasibility of the path, and obstacle avoidance analysis and risk assessment need to be carried out before path planning. The swing adjustment parameters refer to the angle control parameters and action beat control quantities directly generated based on the swing arc path when there is no interference in the path, and are used to drive the robotic arm to smoothly complete the natural arc movement to achieve adsorption position alignment. Such parameters usually include the starting angle, target angle, rotation direction, and angular velocity, etc., and are used to guide the control system to efficiently schedule the actuator. The compensation factor refers to the adjustment amount introduced to eliminate the path conflict when there are interference points in the swing path. This factor is calculated based on the spatial position of the interference point, the boundary of the interfering object, and the alternative path space, and reflects the minimum correction direction and amplitude required to deviate from the ideal path. The front-back translation parameter and the left-right translation parameter are the linear displacement control quantities calculated according to the compensation factor. The front-back direction usually corresponds to one direction of the X-axis or Y-axis on the projection plane, and the left-right direction is its orthogonal direction. These parameters are used to replace the original swing path with a combined displacement trajectory composed of multiple translation paths when interference occurs, so as to avoid obstacles and ensure that the target adsorption coordinate is finally reached.

[0050] For example, when performing a PCB board adsorption operation, the system calculates through the projection distance that a certain robotic arm needs to offset 18 mm to the upper right from the current position to adsorb the target point. Based on this, the control system plans a clockwise swing arc path with a radius of 40 mm and an angle of 45 degrees. However, during the simulation process, the system finds that a section of the trajectory in this path will cross the operating range of another group of robotic arms, and determines that there is an interference point in the middle of the path. To avoid collisions, the system automatically calculates the compensation factor at this point, determines that it is necessary to offset 5 mm in the front direction and 7 mm in the left direction, and finally generates a front-back translation parameter of +5 mm and a left-right translation parameter of -7 mm, and replaces the original path with a combined straight line path of first moving 5 mm to the right and then moving 7 mm obliquely upward to ensure that the target robotic arm safely reaches the adsorption position under the premise of obstacle avoidance.

[0051] It should be understood that the sequence numbers of the steps in the above embodiments do not indicate the order of execution. The execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0052] In one embodiment, an adsorption control device for a PCB board labeling and loading machine is provided. The adsorption control device of the PCB board labeling and loading machine corresponds one-to-one with the adsorption adjustment method of the PCB board labeling and loading machine in the above embodiment. As Figure 13 shown, the adsorption control device of the PCB board labeling and loading machine includes a detection module, a first determination module, a second determination module, a third determination module, and a generation module. The detailed description of each functional module is as follows: The detection module is used to detect whether the current batch information of the current PCB board is consistent with the previous batch information. If it is consistent, the adsorption mode corresponding to the previous batch information is continued to be used for PCB board adsorption. If it is inconsistent, the corresponding adsorption mode is matched according to the current batch information; the first determination module is used to determine the corresponding adsorption coordinates according to the current batch information if the corresponding adsorption mode cannot be matched; the second determination module is used to determine the projection coordinates of the vacuum robot arm, and the projection coordinates and the adsorption coordinates are in the same plane; the third determination module is used to determine the target robot arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; the generation module is used to adaptively generate adsorption adjustment parameters for driving the target robot arm to move according to the projection distance, so as to adjust the target robot arm until the projection coordinates of the target robot arm coincide with the corresponding adsorption coordinates.

[0053] Optionally, the first determination module includes: a first determination unit for determining the corresponding type information, size information, and labeling area according to the current batch information; a first construction unit for constructing the corresponding projection plane according to the type information and size information; a first generation unit for generating the corresponding adsorption area according to the labeling area; a second generation unit for generating the corresponding adsorption coordinates in the projection plane according to the adsorption area; Optionally, the first generation unit includes: an acquisition subunit for acquiring the position coordinates and area information of the labeling area on the projection plane; an extraction subunit for extracting the adsorption offset parameters matching the labeling area from a preset adsorption offset model based on the position coordinates and the area information; an execution subunit for performing adsorption area conversion calculation according to the position coordinates and the adsorption offset parameters to generate the corresponding coordinate range; a determination subunit for determining the corresponding adsorption area according to the coordinate range; Optionally, the second determination module includes: A second construction unit for constructing a three-dimensional space coordinate system consistent with the adsorption coordinates based on the projection plane; an acquisition unit for acquiring a historical coordinate system and calibrating the three-dimensional space position data of the end effectors of the vacuum robotic arms based on the comparison result between the historical coordinate system and the current coordinate system; an execution unit for performing a coordinate projection operation based on the three-dimensional space position data and converting it into two-dimensional projection coordinates on the projection plane; Optionally, the third determination module includes: A calculation unit for calculating the projection distance between each adsorption coordinate and each projection coordinate and generating a distance matrix corresponding to each adsorption coordinate according to the projection distance; a second determination unit for determining the minimum value of the distance matrix and determining the adsorption coordinate corresponding to the minimum value as the reference coordinate and the projection coordinate corresponding to the minimum value as the candidate coordinate; a third determination unit for, if the minimum value is one, determining the vacuum robotic arm corresponding to the candidate coordinate as the target robotic arm of the reference coordinate; a fourth determination unit for, if the minimum value is multiple, determining the adsorption coordinates adjacent to the reference coordinate as adjacent coordinates and calling the distance matrix of the adjacent coordinates as the adjacent matrix; a selection unit for selecting multiple adjacent candidate values corresponding to the candidate coordinates in the adjacent matrix and determining the vacuum robotic arm corresponding to the largest adjacent candidate value as the target robotic arm of the reference coordinate; Optionally, the generation module includes: A fifth determination unit for determining a corresponding swing arc path according to the projection distance; a judgment unit for judging whether there is an interference point in the swing arc path, and if not, generating a corresponding swing adjustment parameter according to the swing arc path; a third generation unit for, if so, generating a compensation factor according to the interference point and adaptively generating corresponding front-back translation parameters and left-right translation parameters according to the compensation factor.

[0054] For the specific limitations of an adsorption control device of a PCB board labeling and loading machine, reference can be made to the limitations of an adsorption adjustment method of a PCB board labeling and loading machine in the above text, which will not be elaborated here. Each module in the above adsorption control device of a PCB board labeling and loading machine can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in or independent of a processor in a computer device in the form of hardware, or stored in a memory in a computer device in the form of software, so as to facilitate the processor to call and execute the operations corresponding to the above modules.

[0055] In one embodiment, a computer device is provided. The computer device can be a server, and its internal structure diagram can be as Figure 14As shown in the figure. The computer device includes a processor, a memory, a network interface, and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it implements an adsorption adjustment method for a PCB board labeling and loading machine.

[0056] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, the following steps are implemented: S10. Detect whether the current batch information of the current PCB board is consistent with the previous batch information. If it is consistent, continue to adsorb the PCB board using the adsorption mode corresponding to the previous batch information. If it is inconsistent, match the corresponding adsorption mode according to the current batch information; S20. If the corresponding adsorption mode is not matched, determine the corresponding adsorption coordinates according to the current batch information; S30. Determine the projection coordinates of the vacuum robotic arm. The projection coordinates and the adsorption coordinates are on the same plane; S40. Determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; S50. Adaptively generate adsorption adjustment parameters for driving the target robotic arm to move according to the projection distance, and adjust the target robotic arm until the projection coordinates of the target robotic arm coincide with the corresponding adsorption coordinates. In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by the processor, the following steps are implemented: S10. Detect whether the current batch information of the current PCB board is consistent with the previous batch information. If it is consistent, continue to adsorb the PCB board using the adsorption mode corresponding to the previous batch information. If it is inconsistent, match the corresponding adsorption mode according to the current batch information; S20. If the corresponding adsorption mode is not matched, determine the corresponding adsorption coordinates according to the current batch information; S30. Determine the projection coordinates of the vacuum robotic arm. The projection coordinates and the adsorption coordinates are on the same plane; S40. Determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; S50. Generate adsorption adjustment parameters for driving the target robotic arm to move adaptively according to the projection distance, and adjust the target robotic arm until the projection coordinates of the target robotic arm coincide with the corresponding adsorption coordinates. Those of ordinary skill in the art can understand that all or part of the processes in implementing the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0057] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0058] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An adsorption adjustment method for a PCB board labeling and loading machine, characterized in that, Applied to a labeling feeding machine for automatically adjusting the vacuum adsorption position, the labeling feeding machine for automatically adjusting the vacuum adsorption position includes a plurality of vacuum robotic arms arranged in sequence. The adsorption adjustment method of the PCB board labeling feeding machine includes: Detect whether the current batch information of the current PCB board is the same as the previous batch information. If it is the same, continue to adsorb the PCB board using the adsorption mode corresponding to the previous batch information. If it is not the same, match the corresponding adsorption mode according to the current batch information; If the corresponding adsorption mode cannot be matched, determine the corresponding adsorption coordinates according to the current batch information; Determine the projection coordinates of the vacuum robotic arm, and the projection coordinates and the adsorption coordinates are on the same plane; Determine the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; According to the projection distance, adaptively generate adsorption adjustment parameters for driving the target robotic arm to move, so as to adjust the target robotic arm until the projection coordinates of the target robotic arm coincide with the corresponding adsorption coordinates.

2. The adsorption adjustment method of a PCB board labeling and loading machine according to claim 1, characterized in that In the step of determining the corresponding adsorption coordinates according to the current batch information, it includes: Determine the corresponding type information, size information and labeling area according to the current batch information; Construct a corresponding projection plane according to the type information and size information; Generate a corresponding adsorption area according to the labeling area; Generate corresponding adsorption coordinates in the projection plane according to the adsorption area.

3. The adsorption adjustment method of a PCB board labeling and loading machine according to claim 2, characterized in that, In the step of generating a corresponding adsorption area according to the labeling area, it includes: Obtain the position coordinates and area information of the labeling area on the projection plane; Extract the adsorption offset parameters matching the labeling area from a preset adsorption offset model based on the position coordinates and the area information; Perform adsorption area conversion calculation according to the position coordinates and the adsorption offset parameters to generate a corresponding coordinate range; Determine the corresponding adsorption area according to the coordinate range.

4. The adsorption adjustment method of a PCB board labeling and loading machine according to claim 2, characterized in that, In the step of determining the projection coordinates of the vacuum robotic arm, it includes: Based on the projection plane, construct a three-dimensional space coordinate system consistent with the adsorption coordinate reference; Obtain the historical coordinate system, and calibrate the three-dimensional space position data of the end effectors of each vacuum robotic arm based on the comparison result between the historical coordinate system and the current coordinate system; Based on the three-dimensional space position data, perform coordinate projection operation to convert it into two-dimensional projection coordinates on the projection plane.

5. The adsorption adjustment method of a PCB board labeling and loading machine according to claim 1, characterized in that The step of determining the target robotic arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates includes: Calculate the projection distance between each adsorption coordinate and each projection coordinate, and generate a distance matrix corresponding to each adsorption coordinate according to the projection distance; Determine the minimum value of the distance matrix, determine the adsorption coordinate corresponding to the minimum value as the reference coordinate, and determine the projection coordinate corresponding to the minimum value as the candidate coordinate; If the minimum value is one, use the vacuum robotic arm corresponding to the candidate coordinate as the target robotic arm of the reference coordinate; If there are multiple minimum values, determine the adsorption coordinates adjacent to the reference coordinates as adjacent coordinates, and call the distance matrix of the adjacent coordinates as the adjacent matrix; Select multiple adjacent candidate values corresponding to the candidate coordinates in the adjacent matrix, and use the vacuum robot arm corresponding to the largest adjacent candidate value as the target robot arm of the reference coordinates.

6. The adsorption adjustment method of a PCB board labeling and loading machine according to claim 1, characterized in that In the step of adaptively generating the adsorption adjustment parameters for driving the target robot arm to move according to the projection distance, it includes: Determine the corresponding swing radian path according to the projection distance; Judge whether there is an interference point in the swing radian path. If not, generate the corresponding swing adjustment parameters according to the swing radian path; If so, generate a compensation factor according to the interference point, and adaptively generate the corresponding front-back translation parameters and left-right translation parameters according to the compensation factor.

7. An adsorption control device for a PCB board labeling and loading machine, characterized in that, The adsorption control device of a PCB labeling and loading machine includes: A detection module, which is used to detect whether the current batch information of the current PCB is consistent with the previous batch information. If they are consistent, continue to use the adsorption mode corresponding to the previous batch information to adsorb the PCB. If they are inconsistent, match the corresponding adsorption mode according to the current batch information; A first determination module, which is used to determine the corresponding adsorption coordinates according to the current batch information if no corresponding adsorption mode is matched; A second determination module, which is used to determine the projection coordinates of the vacuum robot arm, and the projection coordinates and the adsorption coordinates are on the same plane; A third determination module, which is used to determine the target robot arm corresponding to each adsorption coordinate according to the projection distance between the projection coordinates and the adsorption coordinates; A generation module, which is used to adaptively generate the adsorption adjustment parameters for driving the target robot arm to move according to the projection distance, so as to adjust the target robot arm until the projection coordinates of the target robot arm coincide with the corresponding adsorption coordinates.

8. The adsorption control device of a PCB board labeling and loading machine according to claim 7, characterized in that, The first determination module includes: A first determination unit, which is used to determine the corresponding type information, size information and labeling area according to the current batch information; A first construction unit, which is used to construct the corresponding projection plane according to the type information and the size information; A first generation unit, which is used to generate the corresponding adsorption area according to the labeling area; A second generation unit, which is used to generate the corresponding adsorption coordinates in the projection plane according to the adsorption area; The first generation unit includes: An acquisition subunit, which is used to acquire the position coordinates and area information of the labeling area on the projection plane; An extraction subunit, which is used to extract the adsorption offset parameters matching the labeling area from the preset adsorption offset model based on the position coordinates and the area information; An execution subunit, which is used to perform the adsorption area conversion calculation according to the position coordinates and the adsorption offset parameters, and generate the corresponding coordinate range; A determination subunit, which is used to determine the corresponding adsorption area according to the coordinate range; The second determination module includes: A second construction unit, which is used to construct a three-dimensional space coordinate system consistent with the adsorption coordinate reference based on the projection plane; An acquisition unit, configured to acquire a historical coordinate system, and calibrate three-dimensional spatial position data of the end effectors of the vacuum robotic arms based on a comparison result between the historical coordinate system and the current coordinate system; An execution unit, configured to perform a coordinate projection operation based on the three-dimensional spatial position data and convert it into two-dimensional projection coordinates on the projection plane; The third determination module includes: A calculation unit, configured to calculate a projection distance between each of the adsorption coordinates and each of the projection coordinates, and generate a distance matrix corresponding to each of the adsorption coordinates according to the projection distance; A second determination unit, configured to determine a minimum value of the distance matrix, determine the adsorption coordinate corresponding to the minimum value as a reference coordinate, and determine the projection coordinate corresponding to the minimum value as a candidate coordinate; A third determination unit, configured to, if the minimum value is one, use the vacuum robotic arm corresponding to the candidate coordinate as the target robotic arm of the reference coordinate; A fourth determination unit, configured to, if the minimum value is multiple, determine the adsorption coordinates adjacent to the reference coordinate as adjacent coordinates, and call the distance matrix of the adjacent coordinates as an adjacent matrix; A selection unit, configured to select multiple adjacent candidate values corresponding to the candidate coordinates in the adjacent matrix, and use the vacuum robotic arm corresponding to the largest adjacent candidate value as the target robotic arm of the reference coordinate; The generation module includes: A fifth determination unit, configured to determine a corresponding swing radian path according to the projection distance; A judgment unit, configured to judge whether there is an interference point in the swing radian path, and if not, generate a corresponding swing adjustment parameter according to the swing radian path; A third generation unit, configured to, if so, generate a compensation factor according to the interference point, and adaptively generate corresponding front-back translation parameters and left-right translation parameters according to the compensation factor.

9. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, the steps of an adsorption adjustment method for a PCB board labeling and loading machine according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the steps of an adsorption adjustment method for a PCB board labeling and loading machine according to any one of claims 1 to 6 are implemented.

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