Microstructure preparation method, optical lens and multi-primary-color LED packaging module

Abstract

The invention discloses a preparation method of a microstructure. The preparation method comprises the following steps: preparing an uncured first polymer; preparing a micro-droplet generating device, and loading liquid in the micro-droplet generating device; starting a micro-droplet generation device, dispersing the liquid into micro-droplets by the micro-droplet generation device, and enabling the micro-droplets to move to the surface of the first polymer; the micro-droplets are insoluble in the first polymer; after a certain period of time, the micro-droplets form a micro-droplet array on the surface of the first polymer; and curing the first polymer, or curing the first polymer and the micro-droplets to obtain the first polymer with the microstructure on the surface. Micro-droplets are generated through a micro-droplet generation device, the micro-droplets form a micro-droplet array on the surface of a polymer under the action of power, the preparation method of the microstructure is not limited by the surface morphology of the polymer, and the microstructure can be prepared on various surfaces such as a plane and a curved surface; the problem that the microstructure cannot be prepared on the curved surface by the traditional photoetching and mold imprinting methods is solved.

Description

Technical Field

[0001] The present invention relates to the preparation technology of the surface microstructure of organic colloids, and particularly to a preparation method of a microstructure, an optical lens, and a multi-primary-color LED packaging module. Background Art

[0002] The surface microstructure refers to the orderly or randomly arranged tiny structures formed on the material surface. The sizes of these structures are usually in the micron to nanometer range, and their functions and applications are very extensive. The surface microstructure can be applied to enhance surface functions, such as superhydrophobicity, superoleophobicity, enhanced adhesion, used as photonic crystals and antireflection coatings in optical applications, affecting heat conduction and thermal radiation control in thermal applications, used for flow control and boundary layer control in fluid dynamics, and used for cell growth, tissue engineering, and drug release in biomedicine. In addition, the microstructure also has a wide range of uses in electronic and sensor technologies, catalysis and chemical reactions, mechanical properties, environmental applications, etc. For multi-primary-color LED beads, since the chips emit light directly, the chips in different positions will bring problems of poor spatial color uniformity to the light source. Preparing a microstructure on the surface of the packaging colloid can effectively scatter light, achieve the effect of improving light mixing, and improve spatial color uniformity. For an extended light source, the light extraction efficiency is greatly affected by the surface morphology of the packaging colloid, and the microstructure on the surface of the packaging colloid helps to break total reflection and improve the light extraction efficiency.

[0003] At present, the general method for preparing the microstructures on the surface of silicone rubber is the imprinting method, which can transfer the mold pattern to the polymer surface. However, the microstructures on the mold are complex to process, costly, and rely on expensive precision equipment. Moreover, it is difficult to imprint on a curved surface. The invention patent CN107188114B discloses a method for preparing surface microstructures based on active refrigeration droplet condensation. Through the active refrigeration droplet condensation technology, the temperature of the polymer surface placed in a certain vapor environment is lower than the ambient temperature, so that the vapor in the air nucleates on the polymer surface, condenses and grows, and self-assembles into uniformly distributed droplets. Ultraviolet curing is used to cure the polymer and evaporate the droplets, and uniformly distributed microstructures are obtained on the polymer surface. However, this method has some deficiencies: (1) This method has limitations on the microstructure morphology: This method can only perform imprinting to prepare concave microstructures and cannot perform additive manufacturing to form convex microstructures, and the improvement of the light extraction of the extended light source by the concave surface microstructures is weaker than that of the convex surface microstructures; (2) This method has limitations on the micro-droplet materials: Since the micro-droplets on the polymer surface need to be in the saturated vapor atmosphere of the micro-droplets, only low-boiling-point micro-droplet materials are suitable. If high-boiling-point micro-droplet materials are used, first, it is difficult to achieve a high-temperature saturated vapor atmosphere. Second, the polymer may directly cure when condensing micro-droplets in a high-temperature saturated atmosphere; (3) This method has limitations on the polymer materials and is only applicable to ultraviolet-curable polymers. Since the micro-droplet materials used are low-boiling-point micro-droplet materials, if thermally curable polymers are used, the micro-droplet array will be unstable during the heating curing process, and the micro-droplets are prone to converge or disappear; (4) The implementation conditions of this method are limited: The microstructure preparation process needs to be in a closed environment and a semiconductor refrigerator is used to generate a temperature difference, which is not conducive to large-scale and rapid preparation of microstructures in actual production. Therefore, a method for preparing microstructures that does not use a mold, has a flexible and variable method, and a simple process has important practical significance. Summary of the Invention

[0004] The purpose of the present invention is to solve the above technical problems existing in the prior art, and provide a method for preparing microstructures, an optical lens, and a multi-primary-color LED packaging module.

[0005] The technical solution of the present invention is as follows: In the first aspect, the present invention provides a method for preparing microstructures, including the following steps: A: Prepare an uncured first polymer; B: Prepare a micro-droplet generating device and load a liquid into the micro-droplet generating device; C: Turn on the micro-droplet generating device. The micro-droplet generating device disperses the liquid into micro-droplets and makes the micro-droplets move to the surface of the first polymer; the micro-droplets are immiscible with the first polymer; D: After a certain period of time, micro-droplets form a micro-droplet array on the surface of the first polymer; E: Cure the first polymer, or cure the first polymer and the micro-droplets, to obtain a first polymer with micro-structures on its surface.

[0006] Optionally, in step B, the liquid is an uncured second polymer; in step E, cure the first polymer and the micro-droplets to obtain a first polymer with convex micro-structures on its surface.

[0007] Optionally, in step B, the liquid is one or more of alcohols, esters, or silicone oils; in step E, cure the first polymer and remove the micro-droplets to obtain a first polymer with concave micro-structures on its surface.

[0008] Optionally, in step D, it further includes preparing a sacrificial layer material on the surfaces of the first polymer and the micro-droplets to form a stable three-phase interface of the first polymer - micro-droplets - sacrificial layer material; in step E, cure the first polymer and remove the sacrificial layer material and the micro-droplets, or cure the first polymer and the micro-droplets and then remove the sacrificial layer material, to obtain a first polymer with micro-structures on its surface; the sacrificial layer material is immiscible with both the first polymer and the micro-droplets.

[0009] Optionally, after step E, it further includes preparing an uncured third polymer on the surface of the first polymer with micro-structures, and then curing the third polymer to obtain an interfacial micro-structure between the first polymer and the third polymer.

[0010] Optionally, after step E, it further includes preparing an uncured third polymer on the surface of the first polymer with micro-structures; repeat steps B - D to form a micro-droplet array on the surface of the third polymer, and then cure the third polymer and remove the micro-droplets, or cure the third polymer and the micro-droplets, to obtain an interfacial micro-structure between the first polymer and the third polymer and micro-structures on the surface of the third polymer.

[0011] Optionally, the micro-droplet generating device in step A is one of an ultrasonic atomization device, a compressed atomization device, and a centrifugal atomization device.

[0012] Optionally, the surface of the first polymer is a flat surface or a curved surface, and the filling ratio of the micro-structures on the surface of the first polymer in step E is ≥ 50%; the micro-structures include several micro-structure units, and the micro-structure units are evenly distributed on the surface of the first polymer; the protruding or recessed part of the micro-structure unit relative to the surface of the first polymer is a spherical crown shape, and the ratio relationship between the height dimension H1 and the diameter dimension D1 of the spherical crown is 0.2 ≤ H1 / D1 ≤ 1, where 0.5 μm ≤ D1 ≤ 500 μm.

[0013] In a second aspect, the present invention provides an optical lens, the surface of the optical lens has a microstructure and / or the interior of the optical lens has an interface microstructure, and the microstructure is prepared by the above-mentioned preparation method of the microstructure.

[0014] Optionally, the optical lens is a plano lens, a spherical cap lens, a small-angle curved surface lens or a free-form surface lens; the light transmittance of the optical lens is greater than 95%; the refractive indices of the optical lens on both sides of the interface microstructure are different.

[0015] In a third aspect, the present invention provides a multi-primary color LED packaging module, and the primary optical lens of the multi-primary color LED packaging module adopts the above-mentioned optical lens; the multi-primary color LED packaging module includes a packaging substrate, a die bonding layer, multi-primary color LED chips, gold wires and a primary optical lens; the multi-primary color LED chips include two or more of a 445nm - 479nm blue light LED chip, a 500nm - 549nm green light LED chip, a 550nm - 590nm yellow light LED chip and a 610nm - 660nm red light LED chip; the multi-primary color LED chips are connected to the packaging base through the die bonding layer, the multi-primary color LED chips are electrically connected to the packaging substrate through gold wires, and the primary optical lens seals the LED chips, the die bonding layer and the gold wires on the packaging substrate.

[0016] Compared with the prior art, the above technical solutions proposed by the present invention have the following advantages: 1. For the preparation method of the microstructure proposed by the present invention, micro-droplets are generated by a micro-droplet generating device, and the micro-droplets form a micro-droplet array on the polymer surface under the action of power. This preparation method of the microstructure is not limited by the surface topography of the polymer, and can prepare microstructures on various surfaces such as flat surfaces and curved surfaces, solving the problem that traditional photolithography and mold imprinting methods cannot prepare microstructures on curved surfaces.

[0017] 2. For the preparation method of the microstructure proposed by the present invention, it is not necessary to use saturated steam to prepare the micro-droplet array. It not only has low requirements for the implementation environment of the preparation method, but also is more flexible in the selection of micro-droplet materials. It can not only use curable polymer materials for additive preparation of convex microstructures to solve the problem that it is difficult to perform additive preparation of convex microstructures by existing methods, but also use non-curable and easily removable liquid materials for imprinting to prepare concave microstructures.

[0018] 3. For the preparation method of the microstructure proposed by the present invention, the selection of polymer materials is not limited to specific types of polymers, but is almost applicable to all curable polymers, whether it is thermally curable polymers or ultraviolet curable polymers. This not only expands the range of material selection, but also provides more possibilities for the design and functionalization of microstructures.

[0019] 4. The optical lens proposed by the present invention has a microstructure on the surface of the optical lens and / or an interfacial microstructure inside the optical lens. When applied to a lamp bead or a lighting fixture, it can improve the light output uniformity of the LED light source, and at the same time increase the light output area and improve the light extraction efficiency of the lamp bead or the lighting fixture.

[0020] 5. The multi-primary-color LED packaging module proposed by the present invention uses a primary optical lens with a high light transmittance and a microstructure on the surface and / or an interfacial microstructure inside. It can not only increase the light output area and improve the light extraction efficiency, but also improve the mixing effect of multi-primary-color LEDs and enhance the spatial color uniformity of multi-primary-color LEDs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the forming principle of the convex surface microstructure.

[0022] Figure 2 It is a schematic diagram of the forming principle of the concave surface microstructure.

[0023] Figure 3 It is a schematic diagram of the principle of regulating the morphology of micro-droplets by the sacrificial layer material.

[0024] Figure 4 It is a schematic diagram of two interfacial microstructures.

[0025] Figure 5 It is a schematic diagram of the forming of the convex surface microstructure in Example 1.

[0026] Figure 6 It is a schematic diagram of the convex surface microstructure in Example 1.

[0027] Figure 7 It is a schematic diagram of the multi-primary-color LED packaging module in Example 1.

[0028] Figure 8 It is a schematic diagram of the forming of the convex surface microstructure in Example 2.

[0029] Figure 9 It is a schematic diagram of the morphology regulation of the convex surface microstructure in Example 2.

[0030] Figure 10 It is a schematic diagram of the convex surface microstructure in Example 2.

[0031] Figure 11 It is a schematic diagram of the multi-primary-color LED packaging module in Example 2.

[0032] Figure 12 It is a schematic diagram of the forming of the concave surface microstructure in Example 3.

[0033] Figure 13 It is a schematic diagram of the concave surface microstructure in Example 3.

[0034] Figure 14 Schematic diagram of the multi - primary - color LED packaging module in Example 3.

[0035] Figure 15 Schematic diagram of the formation of the concave - surface micro - structure in Example 4.

[0036] Figure 16 Schematic diagram of the morphology regulation of the concave - surface micro - structure in Example 4.

[0037] Figure 17 Schematic diagram of the concave - surface micro - structure in Example 4.

[0038] Figure 18 Schematic diagram of the multi - primary - color LED packaging module in Example 4.

[0039] Figure 19 Schematic diagram of the interface micro - structure in Example 5.

[0040] Figure 20 Schematic diagram of the multi - primary - color LED packaging module in Example 5.

[0041] Figure 21 Schematic diagram of the interface micro - structure in Example 6.

[0042] Figure 22 Schematic diagram of the multi - primary - color LED packaging module in Example 6.

[0043] Figure 23 Schematic diagram of the grooves between the surface electrodes, pads and the chip on the chip in Example 6.

[0044] Figure 24 Schematic diagram of the interface micro - structure in Example 7.

[0045] Figure 25 Schematic diagram of the multi - primary - color LED packaging module in Example 7.

[0046] Figure 26 Schematic diagram of the surface micro - structure and the interface micro - structure in Example 8.

[0047] Figure 27 Schematic diagram of the multi - primary - color LED packaging module in Example 8.

[0048] Figure 28 Schematic diagram of the formation of the concave - surface micro - structure in Example 9.

[0049] Figure 29 Schematic diagram of the concave - surface micro - structure in Example 9.

[0050] Figure 30 Schematic diagram of the interface micro - structure in Example 9.

[0051] Figure 31 Schematic diagram of the multi-primary color LED packaging module in Example 9.

[0052] Figure 32 Schematic diagram of the structure of the multi-primary color LED chip in Example 9. DETAILED DESCRIPTION

[0053] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described are only used to explain the present invention and are not used to limit the present invention.

[0054] To achieve the purpose of the present invention, some embodiments of the present invention provide a method for preparing a microstructure, comprising the following steps: A: Preparing an uncured first polymer; B: preparing a micro-droplet generating device and loading liquid into the micro-droplet generating device; C: Turning on the micro-droplet generating device, the micro-droplet generating device disperses the liquid into micro-droplets, and moves the micro-droplets to the surface of the first polymer; the micro-droplets are incompatible with the first polymer; D: After a certain period of time, the microdroplets form a microdroplet array on the surface of the first polymer; E: solidifying the first polymer, or solidifying the first polymer and the microdroplets, to obtain the first polymer having a microstructure on the surface.

[0055] It should be noted that the preparation method of the microstructure provided in this embodiment is not limited by the surface morphology of the first polymer, and the microstructure can be prepared on a variety of surfaces such as a plane and a curved surface, which solves the problem that the traditional photolithography and mold imprinting methods cannot prepare microstructures on a curved surface. It is not limited by the first polymer material, and a UV-curable polymer or a thermally curable polymer can be used. It is not necessary to use saturated steam to prepare the microdroplet array, and the implementation environment requirements of the preparation method are low, and the selection of microdroplet materials is more flexible.

[0056] In some embodiments of the present invention, the liquid in step B is an uncured second polymer; and the first polymer and the micro-droplets are cured in step E to obtain a first polymer having a convex microstructure on the surface, such as Figure 1 shown.

[0057] It should be noted that the use of curable polymer materials as micro-droplet materials for additive preparation of convex microstructures solves the problem that existing methods are difficult to perform additive preparation of convex microstructures.

[0058] In some embodiments of the present invention, the liquid in step B is one or more of alcohols, esters or silicone oils; in step E, the first polymer is cured and the microdroplets are removed to obtain a first polymer with a concave micro-structure on its surface, as Figure 2 shown. Specifically, the method for removing the microdroplets is heating evaporation, oscillating washing and other methods.

[0059] In some embodiments of the present invention, in step D, a sacrificial layer material is further prepared on the surfaces of the first polymer and the microdroplets to form a stable three-phase interface of the first polymer - microdroplet - sacrificial layer material; in step E, the first polymer is cured and the sacrificial layer material and the microdroplets are removed, or the first polymer and the microdroplets are cured and the sacrificial layer material is removed, to obtain a first polymer with a micro-structure on its surface, as Figure 3 shown; the sacrificial layer material is immiscible with both the first polymer and the microdroplets. Specifically, the method for removing the sacrificial layer material and the microdroplets is oscillating washing, ultrasonic washing and other methods.

[0060] It should be noted that the use of the sacrificial layer material can control the morphology of the microdroplets.

[0061] In some embodiments of the present invention, after step E, an uncured third polymer is further prepared on the surface of the first polymer with a micro-structure, and then the third polymer is cured to obtain an interfacial micro-structure between the first polymer and the third polymer, as Figure 4 shown.

[0062] In some embodiments of the present invention, after step E, an uncured third polymer is further prepared on the surface of the first polymer with a micro-structure; steps B - D are repeated to form an array of microdroplets on the surface of the third polymer, and then the third polymer is cured and the microdroplets are removed, or the third polymer and the microdroplets are cured, to obtain an interfacial micro-structure between the first polymer and the third polymer and a micro-structure on the surface of the third polymer.

[0063] In some embodiments of the present invention, the microdroplet generating device is one of an ultrasonic atomizing device, a compressed atomizing device, and a centrifugal atomizing device.

[0064] In some embodiments of the present invention, the surface of the first polymer is flat or curved. In step E, the filling ratio of the microstructures on the surface of the first polymer is ≥ 50%. If the filling ratio of the microstructures is small, the microstructures can only change the outgoing paths of a small part of the light, and the light mixing and light extraction enhancement effects achieved by the microstructures are poor. The microstructures include a number of microstructure units, and the microstructure units are evenly distributed on the surface of the first polymer. The protruding or recessed part of the microstructure unit relative to the surface of the first polymer is spherical crown-shaped, and the ratio relationship between the height dimension H1 and the diameter dimension D1 of the spherical crown is 0.2 ≤ H1 / D1 ≤ 1, where 0.5 μm ≤ D1 ≤ 500 μm. Microstructures with smaller sizes can be achieved, and good light emission uniformity and light extraction efficiency of the LED light source can be enhanced without changing the overall morphology of the polymer.

[0065] Some other embodiments of the present invention also provide an optical lens. The surface of the optical lens has microstructures and / or the interior of the optical lens has interfacial microstructures, and the microstructures are prepared by using the preparation method of the above-mentioned microstructures. When the surface of the optical lens has microstructures and / or the interior of the optical lens has interfacial microstructures and is applied to a lamp bead or a lighting fixture, the light emission uniformity of the LED light source can be enhanced, and at the same time, the light-emitting area can be increased, and the light extraction efficiency of the lamp bead or the lighting fixture can be improved.

[0066] In some embodiments of the present invention, the optical lens is a plano-convex lens, a ball-cap lens, a small-angle curved lens or a free-form lens; the light transmittance of the optical lens is greater than 95%; the refractive indices of the optical lens on both sides of the interfacial microstructures are different.

[0067] Another embodiment of the present invention provides a multi-primary-color LED packaging module. The primary optical lens of the multi-primary-color LED packaging module uses the above-mentioned optical lens; the multi-primary-color LED packaging module includes a packaging substrate, a die bonding layer, multi-primary-color LED chips, gold wires and a primary optical lens; the multi-primary-color LED chips are connected to the packaging substrate through the die bonding layer; the multi-primary-color LED chips include two or more of a 445 nm - 479 nm blue LED chip, a 500 nm - 549 nm green LED chip, a 550 nm - 590 nm yellow LED chip and a 610 nm - 660 nm red LED chip; the multi-primary-color LED chips are electrically connected to the packaging substrate through the gold wires, and the primary optical lens seals the LED chips, the die bonding layer and the gold wires on the packaging substrate.

[0068] It should be noted that the primary optical lens with high light transmittance and having microstructures on the surface and / or interfacial microstructures inside can not only increase the light-emitting area and improve the light extraction efficiency, but also improve the light mixing effect of the multi-primary-color LED and enhance the spatial color uniformity of the multi-primary-color LED.

[0069] The present invention will be further described in detail below with specific embodiments, but the present invention is not limited to the following specific embodiments. Embodiment 1

[0070] As Figures 5-6 shown, this embodiment provides a method for preparing a micro-structure, including the following steps: A: Prepare an uncured first polymer 13. The surface of the first polymer 13 is flat. The first polymer is a thermosetting silica gel with a light transmittance of 99% (OE6636, Dow Corning, USA, refractive index of 1.54).

[0071] B: Prepare a centrifugal atomization device 11 and load the uncured second polymer 12 into the centrifugal atomization device 11. Among them, the second polymer is a thermosetting silica gel with a light transmittance of 99% (OE6370, Dow Corning, USA, refractive index of 1.41).

[0072] C: Place the first polymer 13 below the centrifugal atomization device 11, turn on the centrifugal atomization device 11. Under the action of high-speed centrifugation, the centrifugal atomization device 11 disperses the second polymer 12 into micro-droplets 121 and ejects them. The micro-droplets 121 move to the surface of the first polymer 13 due to their initial velocity. The micro-droplets 121 are immiscible with the first polymer 13.

[0073] D: After 1 minute, the micro-droplets 121 remain on the surface of the first polymer 13 under the action of interfacial tension, and the micro-droplets 121 are evenly distributed on the surface of the first polymer 13 to form a micro-droplet array.

[0074] E: Cure the first polymer 13 and the micro-droplet array by heating. The cured micro-droplet array forms a convex micro-structure on the surface of the first polymer 13, and the first polymer 13 with a convex micro-structure on its surface is obtained. The filling ratio of the convex micro-structure on the surface of the first polymer 13 ≥ 50%. The convex micro-structure includes a plurality of convex micro-structure units, and the convex micro-structure units are evenly distributed on the surface of the first polymer 13. The convex part of the convex micro-structure unit relative to the surface of the first polymer 13 is a spherical crown shape, and the ratio relationship between the height dimension H1 and the diameter dimension D1 of the spherical crown is H1 / D1 = 0.4, and the diameter dimension D1 = 30 ± 5 μm.

[0075] In this embodiment, the convex micro-structure is prepared by additive manufacturing on the surface of the flat first polymer 13 using the curable second polymer 12, which solves the problem that it is difficult to prepare the convex micro-structure by additive manufacturing with the existing methods.

[0076] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a plano-convex lens, and the surface of the optical lens has a convex microstructure. The convex microstructure on the surface of the optical lens is prepared by the preparation method of the microstructure in this embodiment. Preparing a convex microstructure on the surface of a plano-optical lens with high light transmittance can reduce total internal reflection of light when applied to a lamp bead or a lighting fixture, and improve the light extraction efficiency of the lamp bead or the lighting fixture.

[0077] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 19 of the multi-primary-color LED packaging module adopts the optical lens provided in this embodiment. As Figure 7 shown, the multi-primary-color LED packaging module includes a packaging substrate 15, a die bonding layer 16, multi-primary-color LED chips 17, gold wires 18, and a primary optical lens 19. The multi-primary-color LED chips 17 are connected to the packaging substrate 15 through the die bonding layer 16. The multi-primary-color LED chips 17 are electrically connected to the packaging substrate 15 through the gold wires 18. The primary optical lens 19 seals the LED chips 17, the die bonding layer 16, and the gold wires 18 on the packaging substrate 15. Among them, the multi-primary-color LED chips 17 include a 450-nm wavelength blue LED chip, a 530-nm wavelength green LED chip, a 565-nm wavelength yellow LED chip, and a 620-nm wavelength red LED chip. Among them, the convex microstructure on the primary optical lens 19 can reduce Fresnel loss during planar packaging, reduce total internal reflection of light, improve the light extraction efficiency, and improve the multi-primary-color LED mixing effect of the planar packaged lamp bead, and enhance the spatial color uniformity of the multi-primary-color LED. Embodiment 2

[0078] As Figures 8-10 shown, this embodiment provides a preparation method of a microstructure, including the following steps: A: Prepare an uncured first polymer 23, and the surface of the first polymer 23 is a hemispherical surface. Among them, the first polymer is an ultraviolet-curable silica gel (NOA63, NORLAND, USA) with a light transmittance of 96%.

[0079] B: Prepare a compressed atomization device 21, and load a second polymer 22 diluted by a diluent in the compressed atomization device 21. Among them, the second polymer is an ultraviolet-curable silica gel (NOA63, NORLAND, USA) with a light transmittance of 96%.

[0080] C: Place the first polymer 23 below the compressed atomization device 21, turn on the compressed atomization device 21. The compressed atomization device 21 disperses the diluted second polymer 22 into micro-droplets 221 under the action of compressed gas, and the micro-droplets 221 move to the surface of the first polymer 23 along with the compressed gas. The micro-droplets 221 are immiscible with the first polymer 23.

[0081] D: After 1 minute, the micro-droplets 221 remain on the surface of the first polymer 23 under the action of interfacial tension, and the micro-droplets 221 are evenly distributed on the surface of the first polymer 23 to form a micro-droplet array. A sacrificial layer material 24 is added to the surface of the first polymer 23 with the micro-droplet array. The sacrificial layer material 24 is silicone oil, forming a stable three-phase interface of the first polymer 23 - micro-droplet 221 - sacrificial layer material 24, and regulating the imprinted morphology of the micro-droplets 221 on the surface of the first polymer 23 through the three-phase interface. Among them, the sacrificial layer material 24 is immiscible with both the micro-droplets 221 and the first polymer 23.

[0082] E: The first polymer 23 and the micro-droplet array are cured by ultraviolet light irradiation, and the sacrificial layer material 24 on the surface of the first polymer 23 and the diluent in the micro-droplets 221 are removed by oscillating washing. The cured micro-droplet array forms convex microstructures on the surface of the first polymer 23, and the first polymer 23 with convex microstructures on the surface is obtained. The filling ratio of the convex microstructures on the surface of the first polymer 23 is ≥50%. The convex microstructures include a plurality of convex microstructure units, and the convex microstructure units are evenly distributed on the surface of the first polymer 23. The raised part of the convex microstructure unit relative to the surface of the first polymer 13 is spherical cap-shaped, and the ratio of the height dimension H1 to the diameter dimension D1 of the spherical cap is H1 / D1 = 0.5, and the diameter dimension D1 = 30 ± 5 μm.

[0083] In this embodiment, the convex microstructures are additively prepared on the surface of the first polymer 23 with a hemispherical curved surface by using the curable second polymer 22, which not only solves the problem that traditional photolithography and mold imprinting methods cannot prepare microstructures on curved surfaces, but also solves the problem that it is difficult to additively prepare convex microstructures by existing methods. And the morphology of the convex microstructures is further regulated by the sacrificial layer material 24.

[0084] This embodiment also provides an optical lens. The light transmittance of the optical lens is 96%. The optical lens is a spherical cap lens with a hemispherical curved surface. The surface of the optical lens has convex microstructures, and the convex microstructures on the surface of the optical lens are prepared by using the preparation method of the microstructures in this embodiment. Preparing convex microstructures on the surface of a high-light transmittance hemispherical curved surface optical lens can increase the light-emitting area and improve the light extraction efficiency of the lamp beads or lamps when applied to lamp beads or lamps.

[0085] This embodiment also provides a multi-primary color LED packaging module. The primary optical lens 29 of the multi-primary color LED packaging module adopts the optical lens provided in this embodiment. As Figure 11As shown in the figure, the multi-primary-color LED packaging module includes a packaging substrate 25, a die bonding layer 26, multi-primary-color LED chips 27, gold wires 28, and a primary optical lens 29; the multi-primary-color LED chips 27 are connected to the packaging substrate 25 through the die bonding layer 26, and the multi-primary-color LED chips 27 are electrically connected to the packaging substrate 25 through the gold wires 28. The primary optical lens 29 seals the LED chips 27, the die bonding layer 26, and the gold wires 28 on the packaging substrate 25. Among them, the multi-primary-color LED chips 27 include a blue LED chip with a wavelength of 450 nm, a green LED chip with a wavelength of 530 nm, a yellow LED chip with a wavelength of 565 nm, and a red LED chip with a wavelength of 620 nm. Among them, the convex microstructures with adjusted topography on the primary optical lens 29 can reduce the light reflection loss caused by the extended light source, increase the light-emitting area, improve the light extraction efficiency, and improve the color mixing effect of the multi-primary-color LED, and enhance the spatial color uniformity of the multi-primary-color LED. Embodiment 3

[0086] As Figures 12-13 shown in the figure, this embodiment provides a preparation method for microstructures, including the following steps: A: Prepare an uncured first polymer 33, and the surface of the first polymer 33 is flat. Among them, the first polymer is a thermosetting silica gel (OE6636, Dow Corning, USA) with a light transmittance of 99%, and the refractive index is 1.54.

[0087] B: Prepare an ultrasonic atomization device 31, and load glycerol 32 in the ultrasonic atomization device 31.

[0088] C: Place the first polymer 33 below the ultrasonic atomization device 31, turn on the ultrasonic atomization device 31, and the ultrasonic atomization device 31 disperses the glycerol 32 into micro-droplets 321 under the action of compressed gas. The micro-droplets 321 move to the surface of the first polymer 33 due to their initial velocity. The micro-droplets 321 are immiscible with the first polymer 33.

[0089] D: After 30 s, part of the micro-droplets 321 are imprinted into the first polymer 33 under the action of interfacial tension, and the micro-droplets 321 are evenly distributed on the surface of the first polymer 33 to form a micro-droplet array.

[0090] E: The first polymer 33 is cured by heating, and after removing the micro-droplets 321 by oscillating washing, the first polymer 33 with a concave micro-structure on its surface is obtained. The filling ratio of the concave micro-structure on the surface of the first polymer 33 is ≥50%. The concave micro-structure includes a plurality of concave micro-structure units, and the concave micro-structure units are evenly distributed on the surface of the first polymer 33. The recessed part of the concave micro-structure unit relative to the surface of the first polymer 33 is an inverted spherical crown shape, and the ratio of the height dimension H1 to the diameter dimension D1 of the spherical crown is H1 / D1 = 0.6, and the diameter dimension D1 of the spherical crown is 20 ± 5 μm.

[0091] In this embodiment, glycerol 32 is used to imprint the concave micro-structure on the surface of the planar first polymer 33. It is not necessary to use saturated steam to prepare the micro-droplet array, and the requirements for the implementation environment of the preparation method are low. Moreover, the selection of the material of the first polymer 33 is almost applicable to all curable polymers, expanding the range of material selection.

[0092] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a planar lens, and the surface of the optical lens has a concave micro-structure. The concave micro-structure on the surface of the optical lens is prepared by the method for preparing the micro-structure in this embodiment. Preparing a concave micro-structure on the surface of a planar optical lens with high light transmittance can reduce the total reflection of light and improve the light extraction efficiency of the lamp bead or the lighting fixture when applied to the lamp bead or the lighting fixture.

[0093] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 39 of the multi-primary-color LED packaging module adopts the optical lens provided by this embodiment. As Figure 14 shown, the multi-primary-color LED packaging module includes a packaging substrate 35, a die bonding layer 36, a multi-primary-color LED chip 37, a gold wire 38, and a primary optical lens 39; the multi-primary-color LED chip 37 is connected to the packaging substrate 35 through the die bonding layer 36, and the multi-primary-color LED chip 37 is electrically connected to the packaging substrate 35 through the gold wire 38. The primary optical lens 39 seals the LED chip 37, the die bonding layer 36, and the gold wire 38 on the packaging substrate 35. Among them, the multi-primary-color LED chip 37 includes a 450 nm wavelength blue light LED chip, a 530 nm wavelength green light LED chip, a 565 nm wavelength yellow light LED chip, and a 620 nm wavelength red light LED chip. Among them, the concave micro-structure on the primary optical lens 39 can effectively reduce the reflection loss of light during planar packaging, improve the light extraction efficiency, and can improve the multi-primary-color LED mixing effect of the planar packaged lamp bead and enhance the spatial color uniformity of the multi-primary-color LED. Example 4

[0094] As Figures 15-17 shown, this embodiment provides a method for preparing a micro-structure, including the following steps: A: Prepare the uncured first polymer 43, the surface of the first polymer 43 being a hemispherical curved surface. Among them, the first polymer is a thermosetting silica gel with a light transmittance of 99% (OE6636, Dow Corning, USA, refractive index 1.54).

[0095] B: Prepare a compression atomization device 41 and load ethylene glycol 42 into the compression atomization device 41.

[0096] C: Place the first polymer 43 below the compression atomization device 41, turn on the compression atomization device 41, and the compression atomization device 41 disperses the ethylene glycol 42 into micro-droplets 421 under the action of compressed gas. The micro-droplets 421 move with the compressed gas to the surface of the first polymer 43. The micro-droplets 421 are immiscible with the first polymer 43.

[0097] D: After 30 s, part of the micro-droplets 421 are imprinted into the first polymer 43 under the action of interfacial tension, and the micro-droplets 421 are evenly distributed on the surface of the first polymer 43 to form a micro-droplet array. Add another layer of sacrificial layer material 44 on the first polymer 43 with a micro-droplet array on its surface. The sacrificial layer material 44 is silicone oil, forming a stable three-phase interface of the first polymer 43 - micro-droplets 42 - sacrificial layer material silicone oil 44, and regulating the imprinted morphology of the micro-droplets 421 on the surface of the first polymer 43 through the three-phase interface. Among them, the sacrificial layer material 44 is immiscible with both the micro-droplets 421 and the first polymer 43.

[0098] E: Cure the first polymer 43 by heating and curing, and remove the sacrificial layer material 44 and the micro-droplets 421 on the surface of the first polymer 23 by oscillating washing to obtain the first polymer 43 with concave microstructures on its surface. The filling ratio of the concave microstructures on the surface of the first polymer 43 ≥ 50%. The concave microstructures include a plurality of concave microstructure units, and the concave microstructure units are evenly distributed on the surface of the first polymer 43. The recessed part of the concave microstructure unit relative to the surface of the first polymer 33 is an inverted spherical crown shape, and the ratio of the height dimension H1 to the diameter dimension D1 of the spherical crown is H1 / D1 = 0.5, and the diameter dimension D1 of the spherical crown is 20 ± 5 μm.

[0099] In this embodiment, ethylene glycol 42 is used to imprint and prepare concave microstructures on the surface of the hemispherical curved surface of the first polymer 43, solving the problem that traditional photolithography and mold imprinting methods cannot prepare microstructures on curved surfaces. And the morphology of the concave microstructures is further regulated by the sacrificial layer material 44.

[0100] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a spherical cap lens with a hemispherical curved surface. The surface of the optical lens has a concave micro-structure, and the concave micro-structure on the surface of the optical lens is prepared by the preparation method of the micro-structure in this embodiment. Preparing a concave micro-structure on the surface of a high-light transmittance hemispherical curved surface optical lens can increase the light-emitting area and improve the light extraction efficiency of the lamp bead or the lamp when applied to the lamp bead or the lamp.

[0101] This embodiment also provides a multi-primary color LED packaging module. The primary optical lens 49 of the multi-primary color LED packaging module adopts the optical lens provided by this embodiment. As Figure 18 shown, the multi-primary color LED packaging module includes a packaging substrate 45, a die bonding layer 46, multi-primary color LED chips 47, gold wires 48, and a primary optical lens 49. The multi-primary color LED chips 47 are connected to the packaging substrate 45 through the die bonding layer 46. The multi-primary color LED chips 47 are electrically connected to the packaging substrate 45 through the gold wires 48. The primary optical lens 49 seals the LED chips 47, the die bonding layer 46, and the gold wires 48 on the packaging substrate 45. Among them, the multi-primary color LED chips 47 include a 450 nm wavelength blue LED chip, a 530 nm wavelength green LED chip, a 565 nm wavelength yellow LED chip, and a 620 nm wavelength red LED chip. Among them, the concave micro-structure on the primary optical lens 49 can improve the multi-primary color LED mixing effect of the spherical cap packaged lamp bead and enhance the spatial color uniformity of the multi-primary color LED. Example 5

[0102] The preparation method of the micro-structure in Example 5 is basically the same as that in Example 1. The difference is that: after obtaining the convex micro-structure by the preparation method of the micro-structure in Example 1, one more step is finally added. A layer of uncured third polymer 54 is added on the surface of the first polymer 53 with the convex micro-structure, and the thermal curing of the third polymer 54 is realized to obtain the interfacial micro-structure of the first polymer 53 and the third polymer 54 as Figure 19 shown. Among them, the third polymer 54 is a thermosetting silica gel (OE7662, Dow Corning, USA) with a light transmittance of 99%, and the surface of the third polymer 54 is a plane. This embodiment realizes the preparation of the interfacial micro-structure inside the polymer.

[0103] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a plano-convex lens. The interior of the optical lens has an interfacial microstructure. The refractive indices of the optical lens on both sides of the interfacial microstructure are different. The interfacial microstructure inside the optical lens is prepared by the preparation method of the microstructure in this embodiment. By preparing an interfacial microstructure inside a plano-optical lens with high light transmittance and with different refractive indices of the optical lens on both sides of the interfacial microstructure, when applied to a lamp bead or a lighting fixture, the light-emitting uniformity of the LED light source can be improved.

[0104] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 59 of the multi-primary-color LED packaging module uses the optical lens provided in this embodiment. As Figure 20 shown, the multi-primary-color LED packaging module includes a packaging substrate 55, a die bonding layer 56, multi-primary-color LED chips 57, gold wires 58, and a primary optical lens 59. The multi-primary-color LED chips 57 are connected to the packaging substrate 55 through the die bonding layer 56. The multi-primary-color LED chips 57 are electrically connected to the packaging substrate 55 through the gold wires 58. The primary optical lens 59 seals the LED chips 57, the die bonding layer 56, and the gold wires 58 on the packaging substrate 55. Among them, the multi-primary-color LED chips 57 include a 450-nm wavelength blue LED chip, a 530-nm wavelength green LED chip, a 565-nm wavelength yellow LED chip, and a 620-nm wavelength red LED chip. Among them, the interfacial microstructure in the primary optical lens 59 can improve the light mixing effect of the multi-primary-color LED in the planar packaged lamp bead and enhance the spatial color uniformity of the multi-primary-color LED. Embodiment 6

[0105] The preparation method of the microstructure in Embodiment 6 is basically the same as that in Embodiment 3. The difference is that: after obtaining the concave surface microstructure by the preparation method of the microstructure in Embodiment 3, one last step is added. Another uncured third polymer 64 is added on the surface of the first polymer 63 with the concave microstructure, and thermal curing of the third polymer 64 is achieved to obtain the interfacial microstructure of the first polymer 63 and the third polymer 64 as Figure 21 shown. Among them, the third polymer 64 is a thermally curable silica gel with a light transmittance of 99% (OE6370, Dow Corning, USA, refractive index of 1.41), and the surface of the third polymer 64 is a small-angle curved surface. This embodiment also realizes the preparation of an interfacial microstructure inside the polymer.

[0106] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a small-angle curved lens. The interior of the optical lens has an interfacial microstructure. The refractive indices of the optical lens on both sides of the interfacial microstructure are different. The interfacial microstructure inside the optical lens is prepared by the preparation method of the microstructure in this embodiment. By preparing an interfacial microstructure inside a planar optical lens with high light transmittance and with different refractive indices of the optical lens on both sides of the interfacial microstructure, when applied to a lamp bead or a lighting fixture, the light-emitting uniformity of the LED light source can be improved.

[0107] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 69 of the multi-primary-color LED packaging module adopts the optical lens provided in this embodiment. As Figure 22 shown, the multi-primary-color LED packaging module includes a packaging substrate 65, a die bonding layer 66, multi-primary-color LED chips 67, gold wires 68, and a primary optical lens 69; the multi-primary-color LED chips 67 are connected to the packaging substrate 65 through the die bonding layer 66, and the multi-primary-color LED chips 67 are electrically connected to the packaging substrate 65 through the gold wires 68. The primary optical lens 69 seals the LED chips 67, the die bonding layer 66, and the gold wires 68 on the packaging substrate 65. Among them, the multi-primary-color LED chips 67 include a 450-nm wavelength blue LED chip, a 530-nm wavelength green LED chip, a 565-nm wavelength yellow LED chip, and a 620-nm wavelength red LED chip. Among them, the primary optical lens 69 has a small-angle curvature, the multi-primary-color LED packaging module is a small-angle lamp bead, and the primary optical lens 69 has an interfacial microstructure inside. The interfacial microstructure scatters the light emitted by the chip, and can solve the problem of dark areas existing on the illumination surface caused by the imaging of the chip surface electrode lines and pads and the imaging of the trenches between the chips when the small-angle LED lamp bead emits light; among them, the chip surface electrode lines, pads, and trenches between the chips are as Figure 23 shown; among them, the distance L between the interfacial microstructure and the surface of the LED chip is < 0.3 mm. If the distance between the interfacial microstructure and the surface of the LED chip is large, the light-emitting area will be enlarged, and while eliminating the imaging, the beam angle of the small-angle lamp bead will also be changed. Embodiment 7

[0108] The preparation methods of the microstructures in Embodiment 7 and Embodiment 6 are basically the same. The differences are as follows: The surface topography of the material is different: the surface of the third polymer 74 is a free-form surface, as Figure 24 shown. By comparing this embodiment with Embodiment 6, it can be seen that for the preparation method of the microstructure proposed in this application, the design of the microstructure can be diversified.

[0109] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a free-form lens. The interior of the optical lens has an interface microstructure, and the refractive indices of the optical lens on both sides of the interface microstructure are different. The interface microstructure inside the optical lens is prepared by using the microstructure preparation method in this embodiment.

[0110] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 79 of the multi-primary-color LED packaging module uses the optical lens provided in this embodiment. As Figure 25 shown, the multi-primary-color LED packaging module includes a packaging substrate 75, a die bonding layer 76, multi-primary-color LED chips 77, gold wires 78, and a primary optical lens 79. The multi-primary-color LED chips 77 are connected to the packaging substrate 75 through the die bonding layer 76. The multi-primary-color LED chips 77 are electrically connected to the packaging substrate 75 through the gold wires 78. The primary optical lens 79 seals the LED chips 77, the die bonding layer 76, and the gold wires 78 on the packaging substrate 75. Among them, the multi-primary-color LED chips 77 include a 450-nm wavelength blue LED chip, a 530-nm wavelength green LED chip, a 565-nm wavelength yellow LED chip, and a 620-nm wavelength red LED chip. Among them, the interface microstructure in the primary optical lens 79 can improve the multi-primary-color LED mixing light effect of the free-form lamp beads and enhance the spatial color uniformity of the multi-primary-color LEDs. Example 8

[0111] The microstructure preparation methods of Example 8 and Example 7 are basically the same. The difference is that: after preparing the concave microstructure on the surface of the first polymer, one last step is added. Add an uncured third polymer 84 on the surface of the first polymer 83 with the concave microstructure, then prepare a micro-droplet array on the surface of the third polymer 84, and finally cure the third polymer 84 and the micro-droplets to obtain the internal interface microstructure and the convex microstructure on the surface, as Figure 26 shown. This embodiment realizes the preparation of the interface microstructure inside the polymer and the microstructure on the surface of the polymer.

[0112] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a free-form lens. The interior of the optical lens has an interface microstructure and the surface has a convex microstructure, and the refractive indices of the optical lens on both sides of the interface microstructure are different. The convex microstructure on the surface of the optical lens and the interface microstructure inside are prepared by using the microstructure preparation method in this embodiment. Preparing microstructures inside and on the surface of the high-light-transmittance curved optical lens can improve the light output uniformity of the LED light source when applied to lamp beads or lamps, and at the same time can increase the light output area and improve the light extraction efficiency of the lamp beads or lamps.

[0113] This embodiment also provides a multi-primary-color LED packaging module. The primary optical lens 89 of the multi-primary-color LED packaging module adopts the optical lens provided by this embodiment. As Figure 27 shown, the multi-primary-color LED packaging module includes a packaging substrate 85, a die bonding layer 86, multi-primary-color LED chips 87, gold wires 88, and a primary optical lens 89. The multi-primary-color LED chips 87 are connected to the packaging substrate 85 through the die bonding layer 86. The multi-primary-color LED chips 87 are electrically connected to the packaging substrate 85 through the gold wires 88. The primary optical lens 89 seals the LED chips 87, the die bonding layer 86, and the gold wires 88 on the packaging substrate 85. Among them, the multi-primary-color LED chips 87 include a 450-nm wavelength blue LED chip, a 530-nm wavelength green LED chip, a 565-nm wavelength yellow LED chip, and a 620-nm wavelength red LED chip. Among them, the interface microstructure and surface microstructure in the primary optical lens 89 can further improve the multi-primary-color LED mixing effect of the free-form surface lamp beads and enhance the spatial color uniformity of the multi-primary-color LEDs. Example 9

[0114] As Figures 28-30 shown, a preparation method for a microstructure includes the following steps: A: Prepare a first polymer 93, and the surface of the first polymer 93 is flat. Among them, the first polymer is a thermosetting silica gel (OE7662, Dow Corning, USA) with a light transmittance of 99% and a refractive index of 1.55.

[0115] B: Prepare an ultrasonic atomization device 91 and load glycerol 92 in the ultrasonic atomization device 91.

[0116] C: Place the first polymer 93 below the compression atomization device 91, turn on the ultrasonic atomization device 91, and the ultrasonic atomization device 91 disperses the glycerol 92 into micro-droplets 921 under the action of compressed gas. The micro-droplets 921 move to the surface of the first polymer 93 due to their initial velocity. The micro-droplets 921 are immiscible with the first polymer 93.

[0117] D: After 30 s, part of the micro-droplets 921 are imprinted into the first polymer 93 under the action of interfacial tension, and the micro-droplets 921 are evenly distributed on the surface of the first polymer 93 to form a micro-droplet array.

[0118] E: The curing of the first polymer 93 is achieved by heat curing. After removing the micro-droplets 921 by oscillating washing, the first polymer 93 with a concave micro-structure on its surface is obtained. The filling ratio of the concave micro-structure on the surface of the first polymer 93 is ≥ 50%. The concave micro-structure includes a plurality of concave micro-structure units, which are evenly distributed on the surface of the first polymer 93. The recessed part of the concave micro-structure unit relative to the surface of the first polymer 93 is an inverted spherical crown shape. The ratio of the micro-structure height dimension H1 to the diameter dimension D1 of the spherical crown is H1 / D1 = 0.8, and the diameter dimension D1 of the micro-structure is 20 ± 5 μm.

[0119] F: A layer of the third polymer 94 is further added to the surface of the first polymer 93 with a concave surface micro-structure, and the heat curing of the third polymer 94 is achieved to obtain the interface micro-structure of the first polymer 93 and the third polymer 94. Among them, the third polymer 94 is a heat-curing silica gel with a light transmittance of 99% (OE6370, Dow Corning, USA, refractive index is 1.41), and the surface of the third polymer 94 is a spherical surface.

[0120] Comparing this embodiment with Embodiment 3, it can be seen that the preparation method of the micro-structure proposed in the present application is not limited by the surface morphology of the polymer, and the design of the micro-structure can be diversified.

[0121] This embodiment also provides an optical lens. The light transmittance of the optical lens is 99%. The optical lens is a spherical cap lens with a hemispherical curved surface. The interior of the optical lens has an interface micro-structure, and the refractive indices of the optical lens on both sides of the interface micro-structure are different. The interface micro-structure inside the optical lens is prepared by the preparation method of the micro-structure in this embodiment. Preparing a micro-structure inside a curved optical lens with high light transmittance can improve the light output uniformity of the LED light source when applied to a lamp bead or a lighting fixture.

[0122] This embodiment also provides a multi-primary color LED packaging module. The primary optical lens 99 of the multi-primary color LED packaging module adopts the optical lens provided in this embodiment. As Figure 31As shown in the figure, the multi-primary-color LED packaging module includes a packaging substrate 95, a die bonding layer 96, multi-primary-color LED chips 97, gold wires 98, and a primary optical lens 99; the multi-primary-color LED chips 97 are connected to the packaging substrate 95 through the die bonding layer 96, and the multi-primary-color LED chips 97 are electrically connected to the packaging substrate 95 through the gold wires 98. The primary optical lens 99 seals the LED chips 97, the die bonding layer 96, and the gold wires 98 on the packaging substrate 95. Among them, the multi-primary-color LED chips 97 include a 450-nm wavelength blue LED chip 971, a 530-nm wavelength green LED chip 972, a 565-nm wavelength yellow LED chip 973, and a 620-nm wavelength red LED chip 974. Among them, the primary optical lens 99 is spherical, and the internal interface microstructure of the primary optical lens has a higher H1 / D1 ratio, forming a two-layer polymer intercalated structure, which can not only improve the mixing effect of multi-primary-color LEDs in the ball-cap packaged lamp beads, but also avoid the problem of interface delamination during thermal shock due to the inconsistent thermal expansion coefficients of the two polymers, improving the thermal shock reliability of the primary optical lens 99.

Claims

1. A method for preparing a microstructure, characterized in that: It includes the following steps: A: Prepare an uncured first polymer; B: Prepare a micro-droplet generating device and load a liquid therein; C: Turn on the micro-droplet generating device, which disperses the liquid into micro-droplets and makes the micro-droplets move to the surface of the first polymer; the micro-droplets are immiscible with the first polymer; D: After a certain period of time, micro-droplet arrays are formed on the surface of the first polymer; E: Cure the first polymer, or cure the first polymer and the micro-droplets to obtain a first polymer with a micro-structure on its surface.

2. The preparation method of the microstructure according to claim 1, wherein: In step B, the liquid is an uncured second polymer; in step E, cure the first polymer and the micro-droplets to obtain a first polymer with convex micro-structures on its surface.

3. The preparation method of the microstructure according to claim 1, characterized in that: In step B, the liquid is one or more of alcohols, esters or silicone oils; in step E, cure the first polymer and remove the micro-droplets to obtain a first polymer with concave micro-structures on its surface.

4. The manufacturing method of the microstructure according to claim 1, characterized in that: In step D, it further includes preparing a sacrificial layer material on the surfaces of the first polymer and the micro-droplets to form a stable three-phase interface of the first polymer - micro-droplets - sacrificial layer material; in step E, after curing the first polymer and removing the sacrificial layer material and the micro-droplets, or curing the first polymer and the micro-droplets and then removing the sacrificial layer material, a first polymer with a micro-structure on its surface is obtained; the sacrificial layer material is immiscible with both the first polymer and the micro-droplets.

5. The manufacturing method of the microstructure according to claim 1, characterized in that: After step E, it further includes preparing an uncured third polymer on the surface of the first polymer with a micro-structure, and then curing the third polymer to obtain an interfacial micro-structure between the first polymer and the third polymer.

6. The preparation method of the microstructure according to claim 1, wherein: After step E, it further includes preparing an uncured third polymer on the surface of the first polymer with a micro-structure; repeat steps B - D to form micro-droplet arrays on the surface of the third polymer, and then cure the third polymer and remove the micro-droplets, or cure the third polymer and the micro-droplets to obtain an interfacial micro-structure between the first polymer and the third polymer and a micro-structure on the surface of the third polymer.

7. The manufacturing method of the microstructure according to claim 1, characterized in that: The surface of the first polymer is flat or curved, and in step E, the filling ratio of the micro-structure on the surface of the first polymer ≥ 50%; the micro-structure includes several micro-structure units, and the micro-structure units are evenly distributed on the surface of the first polymer; the protruding or recessed part of the micro-structure unit relative to the surface of the first polymer is spherical cap-shaped, and the ratio of the height dimension H1 to the diameter dimension D1 of the spherical cap is 0.2 ≤ H1 / D1 ≤ 1, where 0.5 μm ≤ D1 ≤ 500 μm.

8. An optical lens, characterized in that: The surface of the optical lens has a micro-structure and / or the interior of the optical lens has an interfacial micro-structure, and the micro-structure is prepared by using the preparation method of the micro-structure according to any one of claims 1 - 7.

9. The optical lens according to claim 8, characterized in that: The optical lens is a plano lens, a ball cap lens, a small-angle curved lens or a free-form lens; the light transmittance of the optical lens is greater than 95%; the refractive indices of the optical lens on both sides of the interfacial micro-structure are different.

10. A multi-primary-color LED packaging module, characterized in that: The primary optical lens of the multi-primary-color LED packaging module adopts the optical lens in claim 9; the multi-primary-color LED packaging module includes a packaging substrate, a die bonding layer, multi-primary-color LED chips, gold wires, and a primary optical lens; the multi-primary-color LED chips include two or more of a 445nm - 479nm blue LED chip, a 500nm - 549nm green LED chip, a 550nm - 590nm yellow LED chip, and a 610nm - 660nm red LED chip; the multi-primary-color LED chips are connected to the packaging substrate through the die bonding layer, the multi-primary-color LED chips are electrically connected to the packaging substrate through gold wires, and the primary optical lens seals the LED chips, the die bonding layer, and the gold wires on the packaging substrate.

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