Rapid assembling and adjusting device and method for nanoscale capacitive sensor

Abstract

The invention relates to the field of capacitive sensor installation, in particular to a rapid assembling and adjusting device and method for a nanoscale capacitive sensor, and the rapid assembling and adjusting device for the nanoscale capacitive sensor comprises a base and three assembling and adjusting tools. The base comprises a containing space used for containing a measuring block of a to-be-measured assembly, and the three capacitive sensor probes are fixed to three inner walls of the containing space respectively and used for measuring displacement of the measuring block in three mutually perpendicular directions. The three installation and adjustment tools are correspondingly arranged on the three inner walls of the containing space respectively, each installation and adjustment tool comprises an installation part, each installation part comprises two parallel installation faces which are oppositely arranged in the first direction, one of the two installation faces abuts against the inner wall of the containing space, and the other one of the two installation faces abuts against the surface of the measuring block. And the mounting part is detachably mounted between the inner wall of the accommodating space and the surface of the measuring block. In this way, the installation precision requirement of the capacitive sensor is guaranteed, and meanwhile the capacitive sensor can be rapidly installed and adjusted.

Description

Technical Field

[0001] The present invention belongs to the field of installation of capacitive sensors, and particularly relates to a rapid installation and adjustment device and method for a nanoscale capacitive sensor. Background Art

[0002] In the field of large space optical telescopes, mirror displacement monitoring is mainly used to ensure the position stability and accuracy of the mirror body in the optical system. Mirror displacement monitoring plays an important role in high-precision optical systems. Through mirror displacement monitoring, precise positioning and real-time monitoring of the mirror body can be achieved, thereby improving the overall performance and reliability of the optical system.

[0003] A capacitive sensor is a sensor that measures the relative displacement by using the change of capacitance. It usually adopts a parallel plate capacitor structure composed of a probe and the surface of the object to be measured. Its measurement principle is mainly to change the capacitance by changing the distance between two conductor plates, so as to detect the displacement of the object. It has the advantages of simple structure, small volume, high resolution, high precision, good dynamic characteristics, low power, fast response speed, good linearity, etc., and is widely used in the field of large space optical telescopes.

[0004] The initial installation distance, parallelism and stability between the capacitive probe and the measured surface of the mirror body will all affect the displacement measurement accuracy of the sensor. And mirror displacement monitoring requires nanoscale measurement accuracy in three spatial directions at the same time, which puts strict requirements on the initial installation accuracy between the probe and the measured surface of the mirror body. In view of the requirements for the initial installation accuracy of nanoscale capacitive sensors, the existing technology uses a large number of complex movable adjustment mechanisms to meet the requirements for the initial installation accuracy of the sensors, which has a great impact on the stability between the probe and the measured surface, and cannot meet the needs of rapid installation and adjustment of capacitive sensors in actual engineering. Therefore, there is an urgent need to develop a rapid installation and adjustment device and method for a nanoscale capacitive sensor for the mirror body. Summary of the Invention

[0005] In view of this, the present invention aims to provide a rapid installation and adjustment device and method for a nanoscale capacitive sensor, which can achieve the rapid installation and adjustment of the capacitive sensor while ensuring the installation accuracy requirements of the capacitive sensor.

[0006] To achieve the above object, the technical solution of the present invention is realized as follows: A rapid installation and adjustment device for a nanoscale capacitive sensor, which includes: A base, including an accommodation space for placing a measurement block of a component to be measured, and three capacitive sensor probes are respectively fixed on three inner walls of the accommodation space for measuring the displacement of the measurement block in three mutually perpendicular directions; and Three assembly and adjustment toolings are respectively disposed on three inner walls of the accommodation space. The assembly and adjustment tooling includes an installation part, and the installation part includes two installation surfaces that are oppositely arranged and parallel in the first direction. One of the two installation surfaces abuts against the inner wall of the accommodation space, and the other abuts against the surface of the measuring block; the installation part is detachably installed between the inner wall of the accommodation space and the surface of the measuring block.

[0007] Further, the base includes a main body part, a first extension part, a second extension part, and a third extension part that enclose to form the accommodation space; the first extension part and the second extension part extend outward from the surface of the main body part, and the third extension part extends outward from one end of the second extension part away from the main body part; wherein, the inner side surfaces of the first extension part, the second extension part, and the third extension part are the three inner walls of the accommodation space.

[0008] Further, the component to be measured further includes an adapter seat and a mirror body; the adapter seat is installed between the measuring block and the mirror body.

[0009] Further, a boss is protrudingly provided on the surface of the measuring block, and a conductive gasket is provided at the top end of the boss; the adapter seat is provided with a through hole, the boss passes through the through hole, and the conductive gasket at the top end of the boss abuts against the surface of the mirror body.

[0010] Further, the shape of the measuring block is a regular hexahedron.

[0011] Further, the assembly and adjustment tooling further includes a handle, and the installation part extends from the handle in the second direction, and the first direction is perpendicular to the second direction; When the installation part is installed between the inner wall of the accommodation space and the surface of the measuring block, the handle extends out of the accommodation space.

[0012] Further, the installation part includes a first part and a second part, the first part and the second part are arranged in the third direction, and there is an installation space between the first part and the second part; a capacitance sensor probe is disposed in the installation space; wherein, the first direction is perpendicular to the third direction.

[0013] Further, in the first direction, the thickness of the installation part is greater than the thickness of the capacitance sensor probe; the difference between the thickness of the installation part and the thickness of the capacitance sensor is greater than half of the range of the capacitance sensor probe.

[0014] Further, the parallelism between the two installation surfaces is better than 1μm.

[0015] A rapid assembly and adjustment method for a nanoscale capacitance sensor is realized by the above-mentioned rapid assembly and adjustment device. The rapid assembly and adjustment method for a nanoscale capacitance sensor includes: Fix three capacitance sensor probes on three inner walls of the accommodation space respectively; Install three assembly and adjustment toolings between the inner wall of the accommodation space and the surface of the measuring block; Fix the base fixedly to the measurement reference, and connect the mirror body of the component to be measured to the measurement block; Remove the three alignment tooling, so that the capacitance sensor probe is fixed to the measurement reference through the base, the measurement block is fixed to the mirror body, and the surface of the capacitance sensor probe is parallel to the surface of the measurement block.

[0016] Compared with the prior art, the present invention can achieve the following beneficial effects: In the rapid alignment device of a nanoscale capacitance sensor according to an embodiment of the present invention, the installation part of the alignment tooling is detachably installed between the inner wall of the accommodation space and the surface of the measurement block, and the alignment tooling can be used to ensure the installation distance and parallelism between the capacitance sensor probe and the measurement block. In this way, while ensuring the installation accuracy requirements of the capacitance sensor, the rapid alignment of the capacitance sensor can be realized, and the requirements of displacement monitoring of the mirror body of a large space optical telescope can be met. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings: Figure 1 is a three-dimensional exploded view of the rapid alignment device according to an embodiment of the present invention; Figure 2 is a structural schematic diagram of the base of the rapid alignment device according to an embodiment of the present invention; Figure 3 is a structural schematic diagram of the alignment tooling of the rapid alignment device according to an embodiment of the present invention; Figure 4 is a structural schematic diagram of the measurement block of the rapid alignment device according to an embodiment of the present invention; Figure 5 is a flowchart of the rapid alignment method according to an embodiment of the present invention.

[0018] DESCRIPTION OF THE REFERENCE NUMERALS: 10. Rapid alignment device; 11. Base; 12. Alignment tooling; 13. Component to be measured; 14. Measurement block; 15. Accommodation space; 16. Capacitance sensor probe; 17. Probe fixing screw; 18. Installation part; 19, 20. Installation surface; 21. Alignment screw; 22. Main body part; 23. First extension part; 24. Second extension part; 25. Third extension part; 26. Adapter seat; 27. Boss; 28. Conductive gasket; 29. Through hole; 30. Upper surface; 31. Front surface; 32. Side surface; 33. Handle; 34. First part; 35. Second part; 36. Installation space. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation to the present invention. Similar elements in different embodiments are labeled with related similar element numbers. In the following embodiments, many detailed descriptions are provided to enable a better understanding of the present invention. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present invention are not shown or described in the specification to avoid the core part of the present invention being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and general technical knowledge in the art.

[0020] It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other to form various implementation manners. At the same time, the steps or actions in the method description can also be adjusted in the order that is obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is stated that a certain sequence must be followed.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0022] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0023] The present invention will be described in detail below with reference to the drawings and in conjunction with embodiments.

[0024] See Figure 1 、 Figure 2 and Figure 3 As shown in

[0025] Embodiments of the present invention provide a rapid alignment device 10 for a nanoscale capacitance sensor. The rapid alignment device 10 includes a base 11 and three alignment toolings 12. The base 11 includes an accommodation space 15 for placing a measurement block 14 of a component to be measured. Three capacitance sensor probes 16 are respectively fixed to three inner walls of the accommodation space 15 for measuring displacements of the measurement block 14 in three mutually perpendicular directions. Among them, the surfaces between any two of the three inner walls are perpendicular to each other. In this embodiment, the perpendicularity between the surfaces of any two of the three inner walls is better than 3 μm. The three capacitance sensor probes 16 are respectively fixed to the three inner walls of the accommodation space 15 through probe fixing screws 17, and the capacitance sensor probes 16 have nanoscale measurement accuracy.

[0026] The three alignment toolings 12 are respectively arranged corresponding to the three inner walls of the accommodation space 15. The alignment tooling 12 includes an installation part 18. The installation part 18 includes two installation surfaces 19, 20 that are oppositely arranged and parallel along the first direction X. In this embodiment, the parallelism between the two installation surfaces 19, 20 is better than 1 μm, so as to ensure the installation parallelism between the capacitance sensor detection and the measurement block 14. One of the two installation surfaces 19, 20 abuts against the inner wall of the accommodation space 15, and the other abuts against the surface of the measurement block 14. The installation part 18 is detachably installed between the inner wall of the accommodation space 15 and the surface of the measurement block 14. The installation part 18 can be detachably installed between the inner wall of the accommodation space 15 and the surface of the measurement block 14 through an alignment screw 21. In this way, the installation distance and parallelism between the capacitance sensor probe 16 and the measurement block 14 can be ensured by using the alignment tooling 12.

[0027] In one embodiment, the base 11 includes a main body portion 22 that encloses to form a receiving space 15, a first extension portion 23, a second extension portion 24, and a third extension portion 25. The first extension portion 23 and the second extension portion 24 extend outward from the surface of the main body portion 22, and the third extension portion 25 extends outward from one end of the second extension portion 24 away from the main body portion 22. Among them, the inner surfaces of the first extension portion 23, the second extension portion 24, and the third extension portion 25 are the three inner walls of the receiving space 15.

[0028] In one embodiment, the component under test 13 further includes an adapter base 26 and a lens body (not shown in the figure). The adapter base 26 is installed between the measuring block 14 and the lens body. In this embodiment, the measuring block 14 is bonded to the adapter base 26, and the adapter base 26 is bonded to the lens body. The measuring block 14 can be bonded to the adapter base 26 through an optical epoxy adhesive. The adapter base 26 is provided with a glue injection hole. By injecting a photosensitive adhesive into the glue injection hole, the adapter base 26 is bonded to the lens body.

[0029] See Figure 1 and Figure 4 As shown, in one embodiment, a boss 27 is protrudingly provided on the surface of the measuring block 14. The shape of the boss 27 can be cylindrical. A conductive gasket 28 is provided at the top end of the boss 27. The adapter base 26 is provided with a through hole 29. The boss 27 passes through the through hole 29, and the conductive gasket 28 at the top end of the boss 27 abuts against the surface of the lens body. Among them, the boss 27 passes through the through hole 29 so that the conductive gasket 28 at the top end of the boss 27 protrudes from the surface of the side of the adapter base 26 away from the measuring block 14. In this embodiment, the distance between the top end of the conductive gasket 28 and the surface of the side of the adapter base 26 away from the measuring block 14 is 0.2 mm. The conductive gasket 28 abuts against the surface of the lens body, so that the potentials of the measuring block 14 and the lens body can be ensured to be the same.

[0030] In one embodiment, the materials of the base 11, the alignment tooling 12, and the measuring block 14 are invar, and the material of the adapter base 26 is glass-ceramics. In this way, the low expansion characteristics of invar and glass-ceramics can be utilized to reduce the influence of temperature change on the measurement result.

[0031] In one embodiment, the shape of the measuring block 14 is a regular hexahedron, that is, the six surfaces of the measuring block 14 are perpendicular to each other in pairs. In this embodiment, the perpendicularity between two adjacent surfaces among the six surfaces is better than 2 μm. In this embodiment, threaded holes are provided on the upper surface 30, the front surface 31, and the side surface 32 of the measuring block 14. The alignment screw 21 can pass through the inner wall of the receiving space 15 and the mounting portion 18 of the alignment tooling 12 and be in threaded connection with the threaded hole to detachably mount the mounting portion 18 of the alignment tooling 12 between the inner wall of the receiving space 15 and the surface of the measuring block 14.

[0032] In one embodiment, the alignment tooling 12 further includes a handle 33. The shape of the handle 33 can be square. The mounting portion 18 extends from the handle 33 along the second direction Y, and the first direction X is perpendicular to the second direction Y. When the mounting portion 18 is installed between the inner wall of the accommodation space 15 and the surface of the measuring block 14, the handle 33 extends out of the accommodation space 15. This facilitates the user's grip and is conducive to removing the alignment tooling 12 after the alignment of the capacitive sensor probe 16 is completed.

[0033] In one embodiment, the mounting portion 18 includes a first part 34 and a second part 35. The first part 34 and the second part 35 are arranged along the third direction Z, and there is a mounting space 36 between the first part 34 and the second part 35. The capacitive sensor probe 16 is disposed in the mounting space 36. Among them, the first direction X is perpendicular to the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other in pairs. The capacitive sensor probe 16 can be located between the first part 34 and the second part 35 of the mounting portion 18, so that the overall structural design is more compact.

[0034] In one embodiment, in the first direction X, the thickness of the mounting portion 18 is greater than the thickness of the capacitive sensor probe 16. The difference between the thickness of the mounting portion 18 and the thickness of the capacitive sensor is greater than half of the measuring range of the capacitive sensor probe 16. In this way, the installation distance between the capacitive sensor probe 16 and the measuring block 14 can be ensured to be more appropriate by adjusting the thickness of the alignment tooling 12, so that the initial installation distance between the capacitive sensor probe 16 and the measuring block 14 is located at the center position of the measuring range of the capacitive sensor probe 16. In this embodiment, the difference between the thickness of the mounting portion 18 and the thickness of the capacitive sensor is 0.1 mm.

[0035] For a rapid alignment device 10 of a nanoscale capacitive sensor according to an embodiment of the present invention, the mounting portion 18 of the alignment tooling 12 is detachably installed between the inner wall of the accommodation space 15 and the surface of the measuring block 14, and the alignment tooling 12 can be used to ensure the installation distance and parallelism between the capacitive sensor probe 16 and the measuring block 14. In this way, while ensuring the installation accuracy requirements of the capacitive sensor, the rapid alignment of the capacitive sensor can be realized, which can meet the requirements of the displacement monitoring of the large-space optical telescope mirror body. It has been proved by experiments that the measurement accuracy of the system aligned by the rapid alignment device 10 is better than 3 nm, and the measurement range is greater than 0.2 mm. Moreover, all the structures of the rapid alignment device 10 are fixedly connected, without moving parts, making the overall structure simple, the connection reliable, and the stability high. At the same time, the connection between the adapter seat 26 and the mirror body uses photosensitive glue, without assembly stress, which improves the structural stability of the rapid alignment device 10.

[0036] See Figure 5As shown, the embodiment of the present invention also provides a rapid assembly and alignment method for a nanoscale capacitance sensor, which is realized by the above rapid assembly and alignment device 10. The rapid assembly and alignment method for the nanoscale capacitance sensor includes: Step S101: Fix three capacitance sensor probes 16 to the three inner walls of the accommodation space 15 respectively. Fix the three capacitance sensor probes 16 to the three inner walls of the accommodation space 15 through the probe fixing screws 17 respectively, so as to install the three capacitance sensor probes 16 on the base 11.

[0037] In one embodiment, before step S101, the rapid assembly and alignment method further includes: bonding the measurement block 14 to the adapter base 26 through an optical epoxy adhesive, and bonding the conductive gasket 28 to the top of the boss 27 of the measurement block 14 through a conductive adhesive.

[0038] Step S102: Install three assembly and alignment tools 12 between the inner wall of the accommodation space 15 and the surface of the measurement block 14. The assembly and alignment screw 21 can pass through the inner wall of the accommodation space 15 and the installation part 18 of the assembly and alignment tool 12, and be connected with the threaded hole of the measurement block 14 in a matching manner, so as to pre-install the three assembly and alignment tools 12 between the inner wall of the accommodation space 15 and the surface of the measurement block 14. The parallelism between the two installation surfaces of the installation part 18 of the assembly and alignment tool 12 can be used to ensure the initial installation parallelism between the capacitance sensor probe 16 and the measurement block 14. The installation distance between the capacitance sensor probe 16 and the measurement block 14 can be ensured to be more appropriate by adjusting the thickness of the assembly and alignment tool 12, so that the initial installation distance between the capacitance sensor probe 16 and the measurement block 14 is located at the center position of the measuring range of the capacitance sensor probe 16.

[0039] Step S103: Fix the base 11 to the measurement reference, and connect the mirror body of the component to be measured 13 to the measurement block 14. Fix the base 11 to the measurement reference through screws. During the installation process, it is necessary to ensure that the conductive gasket 28 is in contact with the mirror body. The rapid connection and fixation of the adapter base 26 and the mirror body are realized by injecting photosensitive glue into the glue injection hole of the adapter base 26, so as to indirectly connect the mirror body to the measurement block 14.

[0040] Step S104: Remove the three alignment jigs 12 so that the capacitive sensor probe 16 is fixed to the measurement reference through the base 11, the measurement block 14 is fixed to the mirror body, and the surface of the capacitive sensor probe 16 is parallel to the surface of the measurement block 14. The three alignment jigs 12 can be removed after the photosensitive adhesive is cured and the adapter base 26 is fixedly connected to the mirror body. The alignment screws 21 can be screwed out, and the handle 33 of the alignment jig 12 can be held to remove the alignment jig 12. At this time, the connection between the capacitive sensor probe 16 and the measurement block 14 is disconnected. The capacitive sensor probe 16 is fixed to the measurement reference through the base 11, the measurement block 14 is fixed to the mirror body, and the surface of the capacitive sensor probe 16 is parallel to the surface of the measurement block 14. In this way, the monitoring of the displacement of the mirror body can be realized by measuring the real-time change of the distance between the capacitive sensor probe 16 and the measurement block 14.

[0041] It should be understood that the various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in the disclosure of the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in the present invention can be achieved, and no limitation is made herein.

[0042] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A rapid assembly and adjustment device for a nanoscale capacitance sensor, characterized in that, Including: A base, including an accommodation space for placing a measurement block of a component to be measured, and three capacitive sensor probes are respectively fixed on three inner walls of the accommodation space for measuring displacements of the measurement block in three mutually perpendicular directions; And Three alignment jigs, which are respectively arranged corresponding to three inner walls of the accommodation space. The alignment jig includes a mounting part. The mounting part includes two mounting surfaces that are oppositely arranged and parallel in a first direction. One of the two mounting surfaces abuts against the inner wall of the accommodation space, and the other abuts against the surface of the measurement block; the mounting part is detachably mounted between the inner wall of the accommodation space and the surface of the measurement block.

2. The rapid alignment device of the nanoscale capacitance sensor according to claim 1, characterized in that The base includes a main body part, a first extension part, a second extension part, and a third extension part that enclose to form the accommodation space; the first extension part and the second extension part extend outward from the surface of the main body part, and the third extension part extends outward from one end of the second extension part away from the main body part; wherein, the inner side surfaces of the first extension part, the second extension part, and the third extension part are the three inner walls of the accommodation space.

3. The rapid alignment device of the nanoscale capacitance sensor according to claim 1, characterized in that The component to be measured further includes an adapter base and a mirror body; the adapter base is mounted between the measurement block and the mirror body.

4. The rapid assembly and adjustment device of the nanoscale capacitance sensor according to claim 3, characterized in that A boss is convexly provided on the surface of the measurement block, and a conductive gasket is provided at the top of the boss; the adapter base is provided with a through hole, the boss passes through the through hole, and the conductive gasket at the top of the boss abuts against the surface of the mirror body.

5. The rapid alignment device for the nanoscale capacitance sensor according to claim 1, characterized in that, The shape of the measurement block is a regular hexahedron.

6. The rapid alignment device of the nanoscale capacitance sensor according to claim 1, characterized in that, The alignment jig further includes a handle, and the mounting part extends from the handle in a second direction, and the first direction is perpendicular to the second direction; When the mounting part is mounted between the inner wall of the accommodation space and the surface of the measurement block, the handle extends out of the accommodation space.

7. The rapid alignment device for the nanoscale capacitance sensor according to claim 1, characterized in that, The mounting part includes a first part and a second part, the first part and the second part are arranged in a third direction, and there is a mounting space between the first part and the second part; the capacitive sensor probe is arranged in the mounting space; wherein, the first direction is perpendicular to the third direction.

8. The rapid alignment device for the nanoscale capacitance sensor according to claim 1, characterized in that, In the first direction, the thickness of the mounting part is greater than the thickness of the capacitive sensor probe; the difference between the thickness of the mounting part and the thickness of the capacitive sensor is greater than half of the measuring range of the capacitive sensor probe.

9. The rapid alignment device of the nanoscale capacitance sensor according to claim 1, characterized in that, The parallelism between the two mounting surfaces is better than 1μm.

10. A rapid alignment method for a nanoscale capacitive sensor, characterized in that, Achieved by the quick alignment device according to any one of claims 1-9, a quick alignment method for a nanoscale capacitive sensor includes: Fixing the three capacitive sensor probes on three inner walls of the accommodation space respectively; Installing the three alignment jigs between the inner wall of the accommodation space and the surface of the measurement block; Fixing the base to a measurement reference, and connecting the mirror body of the component to be measured to the measurement block; Removing the three alignment jigs, so that the capacitive sensor probes are fixed to the measurement reference through the base, the measurement block is fixed to the mirror body, and the surface of the capacitive sensor probe is parallel to the surface of the measurement block.

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