Pressure sensor

Abstract

The invention provides a pressure sensor. The pressure sensor comprises a first fixed seat, a top cover, a movable film, an electrode piece and a heating piece, the top cover and the movable film respectively seal openings in the top and the bottom of the first fixed seat to form a pressure reference cavity, and the electrode piece is arranged in the pressure reference cavity; the heating piece is arranged in the pressure reference cavity and located on the side, away from the movable film, of the electrode piece, and the heating piece is used for at least heating the electrode piece. According to the pressure sensor, the heating piece is fixedly arranged on the electrode piece, so that the electrode piece and the fixed electrode fixed on the electrode piece can be directly heated from the inside, the heating time required before the pressure sensor is used is shortened, and the semiconductor process efficiency and the machine capacity are improved. Meanwhile, the heating piece is located in the pressure sensor, and the energy utilization rate is increased.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor process equipment, and more particularly, to a pressure sensor. Background Art

[0002] When manufacturing chips by methods such as etching, in order to accurately control the pressure, flow rate, etc. of gases to ensure product quality, pressure sensors such as vacuum gauges are required to monitor the pressure of process gases with high precision. However, existing vacuum gauges require a long preparation time each time they are put into use, which affects the efficiency of semiconductor processes. In addition, the manufacturing cost of existing vacuum gauges is relatively high, increasing the material cost of semiconductor process equipment.

[0003] Therefore, how to provide a pressure sensor that can ensure the efficiency of semiconductor processes and has a low cost has become an urgent technical problem in this field. Summary of the Invention

[0004] The present invention aims to provide a pressure sensor that can ensure the efficiency of semiconductor processes and has a low cost.

[0005] To achieve the above object, as an aspect of the present invention, there is provided a pressure sensor, including a first fixing seat, a top cover, a movable film, an electrode member, and a heating member;

[0006] The top cover and the movable film respectively seal the openings at the top and bottom of the first fixing seat to form a pressure reference cavity, and the electrode member is disposed in the pressure reference cavity;

[0007] The heating member is disposed in the pressure reference cavity and is located on the side of the electrode member away from the movable film, and the heating member is used to heat at least the electrode member.

[0008] Optionally, the pressure sensor further includes a first heating lead pin, one end of which is electrically connected to the heating member, and the other end passes through the top cover for connection to one end of an external power supply.

[0009] Optionally, the pressure sensor further includes a second heating lead pin or an electrical connection member, wherein,

[0010] One end of the second heating lead pin is electrically connected to the other end of the heating member, and the other end of the second heating lead pin passes through the top cover for connection to the other end of the external power supply;

[0011] Or, one end of the electrical connection member is electrically connected to the other end of the heating member, and the other end of the electrical connection member is electrically connected to the top cover or the first fixing seat and grounded.

[0012] Optionally, the heating element includes a heating strip and a pressing ring, at least one end of the heating strip is electrically connected to the inner side of the pressing ring, and the first heating lead pin and the second heating lead pin are respectively electrically connected to both ends of the heating strip; alternatively, the first heating lead pin is electrically connected to the heating strip, and the pressing ring is electrically connected to the electrical connection component.

[0013] Optionally, the heating element includes a pressing ring and a pair of connecting parts connected to the inner side of the pressing ring, and the two connecting parts are respectively electrically connected to the first heating lead pin and the second heating lead pin.

[0014] Optionally, the pressure sensor further includes an annular pressing component, which is arranged between the pressing ring and the top cover and is used for elastically pressing the surface of the pressing ring on the side facing the top cover.

[0015] Optionally, the annular pressing component includes an elastic ring and a pressing cylinder, and the elastic ring is arranged between the top cover and the pressing cylinder and is used for driving the pressing cylinder to press the pressing ring through elastic force.

[0016] Optionally, the annular pressing component is the electrical connection component, and the pressing ring is electrically connected to the top cover through the pressing cylinder and the elastic ring.

[0017] Optionally, the annular pressing component further includes an insulating washer, and the insulating washer is arranged between the pressing cylinder and the pressing ring.

[0018] Optionally, the annular pressing component further includes a conductive washer, and the conductive washer is arranged between the pressing cylinder and the pressing ring. The pressing ring is electrically connected to the top cover through the conductive washer, the pressing cylinder and the elastic ring.

[0019] Optionally, a receiving groove is further formed on the surface of the electrode component on the side facing the top cover, and at least a part of the heating element is received in the receiving groove.

[0020] As a second aspect of the present invention, a semiconductor process equipment is provided, which includes a process chamber and a pressure sensor. Wherein, the pressure sensor is the pressure sensor described above, and the second fixed seat of the pressure sensor is communicated with the process chamber, and the pressure sensor is used for detecting the gas pressure inside the process chamber.

[0021] In the present invention, a moving film and a fixed electrode form a sensing capacitor, and one side of the moving film facing away from the pressure reference cavity communicates with the gas environment to be measured through a second fixing base. Thus, when the pressure of the gas environment to be measured (such as the process gas in a process chamber) changes, the position of the moving film changes under the action of the upper and lower pressure differences, so that the capacitance value C of the sensing capacitor changes accordingly. Furthermore, the gas pressure can be detected by detecting the capacitance value C of the sensing capacitor.

[0022] In the pressure sensor provided by the present invention, a heating element is fixedly arranged on the electrode element, so that the pressure sensor can be heated, and the electrode element and the fixed electrode fixed thereon are directly heated from the inside. It is not necessary to wait for a long time for external heat to be conducted to the electrode element and the fixed electrode through structures such as the first fixing base or to radiate to the electrode element through the pressure reference cavity to reach the required temperature, which shortens the heating time required before the pressure sensor is used, improves the semiconductor process efficiency and the machine tool production capacity. At the same time, the heating element is located inside the pressure sensor, and most of the heat generated by it can be used to heat the pressure sensor, with high energy utilization efficiency, which is beneficial to energy conservation and environmental protection.

[0023] In addition, the pressure sensor provided by the present invention does not need to be provided with structures such as heat insulation cotton that meet the heat insulation requirements outside, further reducing the machine tool material cost, and thus reducing the semiconductor process cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification, and are used to explain the present invention together with the following specific embodiments, but do not constitute a limitation to the present invention. In the drawings:

[0025] Figure 1 is a schematic structural diagram of a vacuum gauge in the related art;

[0026] Figure 2 is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0027] Figure 3 is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0028] Figure 4 is Figure 3 a partial enlarged schematic diagram of the pressure sensor shown in the A area;

[0029] Figure 5 is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0030] Figure 6 is Figure 5 a partial enlarged schematic diagram of the pressure sensor shown in the B area;

[0031] Figure 7It is a schematic structural diagram of an electrode component in a pressure sensor provided by an embodiment of the present invention;

[0032] Figure 8 It is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0033] Figure 9 It is Figure 8 A partial enlarged schematic diagram of the pressure sensor shown in the C area;

[0034] Figure 10 It is Figure 8 An equivalent circuit schematic diagram of a heating component in the pressure sensor shown;

[0035] Figure 11 It is a schematic structural diagram of an electrode component in a pressure sensor provided by an embodiment of the present invention;

[0036] Figure 12 It is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0037] Figure 13 It is Figure 12 An equivalent circuit schematic diagram of a heating component in the pressure sensor shown;

[0038] Figure 14 It is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0039] Figure 15 It is Figure 14 An equivalent circuit schematic diagram of a heating component in the pressure sensor shown;

[0040] Figure 16 It is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0041] Figure 17 It is a schematic structural diagram of an electrode component in a pressure sensor provided by an embodiment of the present invention;

[0042] Figure 18 It is a schematic structural diagram of a pressure sensor provided by an embodiment of the present invention;

[0043] Figure 19 It is Figure 18 An equivalent circuit schematic diagram of a heating component in the pressure sensor shown.

[0044] Explanation of reference numerals:

[0045] The first fixing seat 110

[0046] The second annular boss 111

[0047] The top cover 120

[0048] The insulator 121

[0049] Air pump 130

[0050] Second fixing seat 200

[0051] Connecting cylinder 210

[0052] Moving film 300

[0053] Electrode component 400

[0054] Positioning boss 410

[0055] Connection layer 421

[0056] Electrode lead pin 422

[0057] First annular boss 431

[0058] Conductive through hole 432

[0059] Strip-shaped limiting groove 441

[0060] Annular limiting groove 442

[0061] Heating groove 443

[0062] Heating strip 510

[0063] First heating lead pin 521

[0064] Second heating lead pin 522

[0065] Pressing ring 530

[0066] Elastic ring 610

[0067] Pressing cylinder 620

[0068] Conductive washer 630

[0069] Insulating washer 640 Detailed implementation manners

[0070] The following will describe in detail the detailed implementation manners of the present invention in conjunction with the accompanying drawings. It should be understood that the detailed implementation manners described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0071] As Figure 1The figure shows a schematic structural diagram of a vacuum gauge in the related art, which includes a first fixing base 110, a top cover 120, a moving membrane 300, and an electrode component 400. The moving membrane 300 and the top cover 120 seal the openings at both ends of the first fixing base 110 to form a pressure reference cavity. The electrode component 400 is arranged in the pressure reference cavity. The moving membrane 300 is clamped and fixed between the first fixing base 110 and the second fixing base 200, and is disposed opposite to the fixed electrode at the bottom of the electrode component 400. The second fixing base 200 is used to connect the environment of the gas to be measured with the side of the moving membrane 300 facing away from the pressure reference cavity. Thus, when the pressure of the environment of the gas to be measured (such as the process gas in the process chamber) changes, the pressure difference between the upper and lower sides of the moving membrane 300 changes accordingly, causing the distance between the moving membrane 300 and the fixed electrode to change.

[0072] The moving membrane 300 and the fixed electrode are arranged opposite to each other to form a sensing capacitor. The relationship between the capacitance value C of the sensing capacitor and the distance d between the moving membrane 300 and the electrode component 400 is: C = εS / d, where S is the area where the moving membrane 300 and the electrode component 400 face each other; ε is the dielectric constant of the substance between the moving membrane 300 and the electrode component 400. When the pressure of the environment of the gas to be measured changes, the position of the moving membrane 300 changes, and the distance d changes accordingly, causing the capacitance value C to also change. Furthermore, the gas pressure can be detected by detecting the capacitance value C of the sensing capacitor.

[0073] In order to prevent the gas to be measured from condensing inside the vacuum gauge and affecting the measurement accuracy of the vacuum gauge, it is necessary to heat the vacuum gauge and maintain it at a specified high temperature (the maximum temperature can reach 200 °C) before use. In the related art, the temperature rise of the vacuum gauge is often achieved by external heating. For example, a heating tape can be directly wrapped around the outside of the vacuum gauge for heating, or as Figure 1 shown, a metal barrel 11 is sleeved outside the vacuum gauge, and then a heating tape 12 is wrapped around the outside of the metal barrel for heating. After heating the vacuum gauge from room temperature to the specified temperature in this way, the power of the heating tape 12 is controlled by a circuit board to maintain the temperature of the vacuum gauge at the specified temperature.

[0074] However, since the pressure reference cavity is in a vacuum state, the heat transfer methods inside it are only conduction and radiation, and some components are not in direct contact with other components and can only transfer heat by radiation. Moreover, the electrode component 400 is usually made of ceramic material with a low thermal conductivity, resulting in a long time required for the internal structure of the vacuum gauge to be heated to the specified temperature (the fixed electrode is inside the vacuum gauge and must be heated to the specified temperature before the output of the product can be stable. Otherwise, the temperature of the fixed electrode will continue to change during use, affecting the output accuracy of the product. Therefore, before each use, it is necessary to heat for at least 4 hours to ensure the stability of the temperature of the internal fixed electrode), which affects the production efficiency of the machine.

[0075] Furthermore, since only the heat from the inner side of the heating belt 12 is transferred to the vacuum gauge, most of the heat on the outer side is dissipated to the outside. Therefore, the heating power required for the heating belt is high, resulting in energy waste, and further increasing the insulation requirements for related structures such as circuit boards and thermal insulation cotton, increasing the material cost of the machine.

[0076] In order to solve the above technical problems, as one aspect of the present invention, a pressure sensor (vacuum gauge) is provided, such as Figures 2 to 17 As shown, the pressure sensor includes: a first fixing seat 110, a top cover 120, a second fixing seat 200, a moving membrane 300, an electrode member 400 and a heating member (which may include a heating strip 510, a pressing ring 530 and other structures);

[0077] The top cover 120 and the moving membrane 300 respectively seal the top and bottom openings of the first fixing seat 110 to form a pressure reference cavity, and the electrode member 400 is disposed in the pressure reference cavity;

[0078] The heating element is disposed in the pressure reference cavity and is located on a side of the electrode element 400 that is away from the moving membrane. The heating element is used to heat at least the electrode element 400 .

[0079] In the present invention, the movable membrane 300 and the fixed electrode on the electrode member 400 (the fixed electrode is arranged on the surface of the electrode member 400 facing the movable membrane 300) form a sensing capacitor, so that when the pressure of the gas environment to be measured (for example, the process gas in the process chamber) changes, the position of the movable membrane 300 changes under the action of the upper and lower pressure differences, so that the capacitance value C of the sensing capacitor changes accordingly, and then the gas pressure can be detected by detecting the capacitance value C of the sensing capacitor.

[0080] In the pressure sensor provided by the present invention, the heating element is fixedly arranged on the electrode element 400, so that the electrode element 400 and the fixed electrode fixed thereon can be directly heated from the inside, without having to wait for a long time for the external heat to be conducted to the electrode element 400 and the fixed electrode through the first fixing seat 110 and other structures or radiated to the electrode element 400 through the pressure reference cavity to make its temperature reach the required level, thus shortening the heating time required before the pressure sensor is used, and improving the semiconductor process efficiency and machine production capacity. At the same time, the heating element is located inside the pressure sensor, and most of the heat generated by it can be used to heat the pressure sensor, with high energy utilization, which is beneficial to energy saving and environmental protection.

[0081] In addition, the pressure sensor provided by the present invention does not need to be provided with external structures such as thermal insulation cotton that meets the thermal insulation requirements, which further reduces the material cost of the machine and further reduces the semiconductor process cost.

[0082] As an optional embodiment of the present invention, Figures 2 to 17As shown, the pressure sensor further includes a second fixing seat 200 , and the dynamic membrane 300 is clamped and fixed between the first fixing seat 110 and the second fixing seat 200 .

[0083] As an optional embodiment of the present invention, Figure 2 , Figure 3 , Figure 5 , Figure 8 , Figure 16 As shown, the electrode member 400 has a positioning boss 410 on one side facing the second fixing seat 200 , and the fixed electrode is fixedly disposed on the positioning boss 410 .

[0084] As an optional embodiment of the present invention, the moving membrane 300 includes a metal sheet, and a sensing capacitor is formed between the metal sheet and the fixed electrode.

[0085] As an optional embodiment of the present invention, Figure 2 , Figure 3 , Figure 5 , Figure 8 , Figure 12 , Figure 14 , Figure 16 , Figure 18 As shown, a connecting groove is formed on the side surface of the second fixing seat 200 facing the first fixing seat 110, and a connecting hole is formed at the bottom of the connecting groove, which penetrates to the side surface of the second fixing seat 200 away from the first fixing seat 110, and a connecting tube 210 is arranged in the connecting hole, and the connecting tube 210 is used to connect the gas environment to be measured with the connecting groove.

[0086] As an optional embodiment of the present invention, the electrode member 400 is made of insulating material (such as ceramic), and the fixed electrode is fixedly arranged on the surface of the electrode member 400 facing the moving membrane 300 or the second fixing seat 200. Figure 7 , Figure 11 , Figure 17 As shown, a conductive through hole 432 is formed in the electrode member 400 and penetrates the electrode member 400 in the thickness direction. A connection layer 421 is provided on the surface of the electrode member 400 away from the second fixing seat 200. The connection layer 421 is electrically connected to the fixed electrode through the conductive through hole 432 (conductive material on the inner wall). Figure 2 , Figure 3 , Figure 5 , Figure 8 , Figure 12 , Figure 14 , Figure 16 , Figure 18 As shown, an electrode lead needle 422 is connected to the connection layer 421, an electrode lead needle avoidance hole is formed on the upper cover, and one end of the electrode lead needle 422 passes through the electrode lead needle avoidance hole to the outside of the pressure reference chamber.

[0087] In an embodiment of the present invention, the fixed electrode at the bottom of the electrode member 400 is electrically connected to the connection layer 421 and the electrode lead 422 disposed thereon through the conductive material on the inner wall of the conductive through-hole 432. Thus, the control circuit can be connected to the fixed electrode inside the pressure sensor through the electrode lead 422. The moving film 300 is grounded through the second fixing base 200. The control circuit can detect the capacitance value C of the sensing capacitor by detecting the electrode lead 422, and then determine the gas pressure.

[0088] As an alternative embodiment of the present invention, as Figure 2 , Figure 3 , Figure 5 , Figure 8 , Figure 12 , Figure 14 , Figure 16 , Figure 18 shown in the figure, the pressure sensor further includes a first heating lead 521. One end of the first heating lead 521 is electrically connected to the heating element, and the other end passes through the top cover 120 for connection to one end of an external power supply.

[0089] In an embodiment of the present invention, the heating element is conducted to the external power supply through the first heating lead 521 passing through the top cover 120. Thus, after forming a loop with the external power supply, the electrical energy of the external power supply is converted into heat energy to heat the inside of the pressure sensor.

[0090] As an alternative embodiment of the present invention, as Figure 2 , Figure 8 , Figure 12 , Figure 16 , Figure 18 shown in the figure, the pressure sensor further includes a second heating lead 522 or an electrical connector (the electrical connector can be the first electrical connector 540 in Figure 12 or the annular pressing component described below). Among them,

[0091] As Figure 2 , Figure 8 , Figure 16 , Figure 18 shown in the figure, one end of the second heating lead 522 is electrically connected to the other end of the heating element, and the other end of the second heating lead 522 passes through the top cover 120 for connection to the other end of the external power supply;

[0092] Or, one end of the electrical connector is electrically connected to the other end of the heating element, and the other end of the electrical connector is electrically connected to the top cover 120 or the first fixing base 110 and grounded.

[0093] Optionally, as Figure 12As shown, the electrical connector includes a first electrical connector 540. One end of the first electrical connector 540 is electrically connected to the other end of the heating element, and the other end of the first electrical connector 540 is electrically connected to the top cover 120 or the first fixing base 110 and grounded.

[0094] In an embodiment of the present invention, the pressure sensor may include a second heating lead pin 522. After connecting the two ends of the heating element to the two poles of the power supply through two independent lead pins, namely the first heating lead pin 521 and the second heating lead pin 522, the heating system in the circuit can be isolated, not affected by other electrical components, and not affecting other electrical parts either. Thus, the stability of the temperature measurement of the pressure sensor is increased and the service life of the pressure sensor is extended.

[0095] Alternatively, the pressure sensor may further include an electrical connector. The two ends of the heating element are respectively connected to the two poles of the power supply through the first heating lead pin 521 and the housing of the pressure sensor (the top cover 120 or the first fixing base 110) to form a current loop. The housing structure of the pressure sensor is reused as a grounding circuit, simplifying the structure of the pressure sensor and reducing the cost of manufacturing the pressure sensor.

[0096] As an alternative embodiment of the present invention, as Figure 2 shown, the electrode lead pin avoidance hole and the heating lead pin avoidance hole in the top cover 120 are filled with an insulator 121, which is used to fix the lead pin structure and prevent a short - circuit fault between the corresponding lead pin structure and the top cover 120.

[0097] As an alternative embodiment of the present invention, as Figure 2 shown, an air extraction cylinder 130 is also fixedly arranged on the top cover 120. The air extraction cylinder 130 can be selectively communicated with the pressure reference cavity, and is used to extract the gas in the pressure reference cavity so that the air pressure in the pressure reference cavity approaches a vacuum.

[0098] As an alternative embodiment of the present invention, as Figure 2 、 Figure 3 、 Figure 5 、 Figure 8 、 Figure 16 shown, a first annular boss 431 is provided on the side wall of the electrode member 400, and a second annular boss 111 is provided on the inner wall of the first fixing base 110. The first annular boss 431 is located between the second annular boss 111 and the top cover 120. The first annular boss 431 is lapped on the second annular boss 111, and the two are insulated from each other.

[0099] To improve the semiconductor process efficiency, as a preferred embodiment of the present invention, as Figure 8 、 Figure 9 、 Figure 12 、 Figure 14 、Figure 16 As shown, the heating element includes a heating strip 510 and a pressing ring 530. As Figure 8 , Figure 16 shown, at least one end of the heating strip 510 is electrically connected to the inner side of the pressing ring 530, and the first heating lead 521 and the second heating lead 522 are respectively electrically connected to both ends of the heating strip; or, as Figure 12 , Figure 14 shown, the first heating lead 521 is electrically connected to the heating strip 510, and the pressing ring 530 is electrically connected to an electrical connection member (as Figure 12 the electrical connection member in Figure 14 includes a first electrical connection member 540,

[0100] In the embodiment of the present invention, the heating strip 510 is electrically connected to the pressing ring 530, so that the heating element includes a heating strip 510 connected in parallel between the two heating leads and two half-rings of the pressing ring 530 corresponding to both sides of the heating strip, a total of three heating branches (the equivalent circuit is as Figure 10 , Figure 13 , Figure 16 shown).

[0101] As an alternative embodiment of the present invention, as Figure 18 shown, the heating element includes a pressing ring 530 and a pair of connecting portions 550 connected to the inner side of the pressing ring. The two connecting portions 550 are respectively electrically connected to the first heating lead 521 and the second heating lead 522, and its heating circuit includes two half-rings of the pressing ring 530 connected in parallel between the two heating leads, a total of two heating branches (the equivalent circuit is as Figure 19 shown).

[0102] As an alternative embodiment of the present invention, as Figures 2 to 18 shown, the pressure sensor further includes an annular pressing assembly (including an elastic ring 610, or including an elastic ring 610 and a pressing cylinder 620, etc.), and the annular pressing assembly is arranged between the upper surface of the electrode member 400 and the top cover 120, and is used for elastically pressing the surface of the pressing electrode member 400 facing the top cover 120, so that the electrode member 400 is away from the top cover 120 and is abutted against the second annular boss 111, thereby ensuring the stability of the fixed electrode position on the electrode member 400.

[0103] In the case where the heating element includes a heating strip 510 and a pressing ring 530, the annular pressing assembly can be arranged between the pressing ring 530 and the top cover 120, and is used for elastically pressing the surface of the pressing ring 530 facing the top cover 120.

[0104] In an embodiment of the present invention, the annular pressing component can drive the pressing ring 530 to press the electrode component 400 downward through an elastic force, which can not only make the electrode component 400 away from the top cover 120 and be abutted against the second annular boss 111, so as to ensure the stability of the fixed electrode position on the electrode component 400, but also ensure the close fit between the pressing ring 530 and the electrode component 400, thereby ensuring the heating efficiency of the electrode component 400 and improving the semiconductor process efficiency.

[0105] As an alternative embodiment of the present invention, as Figures 8 to 18 shown, the annular pressing component includes an elastic ring 610 and a pressing cylinder 620. The elastic ring 610 is arranged between the top cover 120 and the pressing cylinder 620 and is used to drive the pressing cylinder 620 to press the pressing ring 530 through an elastic force.

[0106] As a preferred embodiment of the present invention, as Figure 14 shown, the annular pressing component is an electrical connection component. The pressing ring 530 is electrically connected to the top cover 120 through the pressing cylinder 620 and the elastic ring 610, thereby saving the material cost of arranging the first electrical connection component 540 separately and simplifying the overall structure of the pressure sensor.

[0107] In the case where the annular pressing component is reused as an electrical connection component, as an alternative embodiment of the present invention, as Figures 3 to 6 shown, the annular pressing component further includes a conductive washer 630. The conductive washer 630 is arranged between the pressing cylinder 620 and the electrode component 400. The heating strip 510 is electrically connected to the top cover 120 through the conductive washer 630, the pressing cylinder 620 and the elastic ring 610.

[0108] In an embodiment of the present invention, the elastic ring 610 can drive the pressing cylinder 620, the conductive washer 630 and the pressing ring 530 to press the electrode component 400 downward through an elastic force, so that the electrode component 400 is away from the top cover 120 and is abutted against the second annular boss 111, thereby ensuring the stability of the fixed electrode position on the electrode component 400, and at the same time ensuring the close fit between the pressing ring 530 and the heating strip 510 and the electrode component 400, thereby ensuring the heating efficiency of the electrode component 400 and improving the semiconductor process efficiency.

[0109] As an alternative embodiment of the present invention, the elastic ring 610 is a wave spring.

[0110] In the case where the annular pressing component is reused as an electrical connection component, as an alternative embodiment of the present invention, as Figure 3 、 Figure 4 shown, the first end of the heating strip 510 is electrically connected to the first heating lead 521, and the second end of the heating strip 510 is clamped between the pressing cylinder 620 and the conductive washer 630 to be electrically connected to the first fixing seat 110 through the pressing cylinder 620.

[0111] As another alternative embodiment of the present invention, as Figure 5 , Figure 6 shown, the first end of the heating strip 510 is electrically connected to the first heating lead pin 521, and the second end of the heating strip 510 is clamped between the conductive washer 630 and the electrode member 400, so as to be finally electrically connected to the first fixing seat 110 or the top cover 120 through the conductive washer 630 and the pressing cylinder 620, etc.

[0112] When the pressing ring 530 is used to form a heating branch and heat under the guiding action, as an alternative embodiment of the present invention, as Figure 8 , Figure 12 , Figure 18 shown, the pressure sensor further includes an insulating washer 640, and the insulating washer 640 is disposed between the pressing cylinder 620 and the pressing ring 530 for insulating the pressing cylinder 620 from the electrode member 400 to ensure the potential difference on the pressing ring 530, and further ensure the stability of the heating of the heating element.

[0113] To ensure the stability of the pressure sensor, as a preferred embodiment of the present invention, as Figures 8 to 11 shown, a receiving groove (including a strip-shaped limiting groove 441 and an annular limiting groove 442) is further formed on the surface of the electrode member 400 facing the top cover 120, and at least a part of the heating element is received in the receiving groove.

[0114] In the embodiment of the present invention, a receiving groove is formed at the top of the electrode member 400, and the heating element is received in the receiving groove, so as to realize the horizontal limitation of the heating element, ensure the stability of the pressure sensor, and further increase the heat exchange area between the heating element and the electrode member 400, and further improve the heating efficiency, thereby ensuring the semiconductor process efficiency.

[0115] As an alternative embodiment of the present invention, as Figures 8 to 11 shown, the receiving groove includes a strip-shaped limiting groove 441 and an annular limiting groove 442, and the heating strip 510 and the pressing ring 530 are respectively received in the strip-shaped limiting groove 441 and the annular limiting groove 442.

[0116] As an alternative embodiment of the present invention, as Figure 17 shown, a heating groove 443 is further formed at the bottom of the strip-shaped limiting groove 441, and the bottom of the heating strip 510 has a heating convex portion, and the heating convex portion is received in the heating groove 443, so as to further increase the heat exchange area between the heating strip 510 and the electrode member 400, further improve the heating efficiency, and thereby ensure the semiconductor process efficiency.

[0117] As a second aspect of the present invention, there is provided a semiconductor processing apparatus, including a process chamber and a pressure sensor. Wherein, the pressure sensor is the pressure sensor provided by the embodiments of the present invention. The second fixing base 200 of the pressure sensor communicates with the process chamber, and the pressure sensor is used to detect the gas pressure inside the process chamber.

[0118] In the semiconductor processing apparatus provided by the present invention, the heating element is fixedly arranged on the electrode member 400, so that the electrode member 400 and the fixed electrode fixed thereon can be directly heated from the inside, without having to wait for a long time for external heat to be conducted to the electrode member 400 and the fixed electrode through structures such as the first fixing base 110 or to reach the required temperature by radiation through the pressure reference chamber. This shortens the heating time required before using the pressure sensor, improves the semiconductor processing efficiency and the machine platform production capacity. At the same time, the heating element is located inside the pressure sensor, and most of the heat generated by it can be used to heat the pressure sensor, with high energy utilization rate, which is beneficial to energy conservation and environmental protection.

[0119] In addition, the pressure sensor provided by the present invention does not need to be provided with structures such as heat insulation cotton that meet the heat insulation requirements externally, further reducing the machine platform material cost, and thus reducing the semiconductor processing cost.

[0120] As an alternative embodiment of the present invention, as Figure 2 、 Figure 3 、 Figure 5 、 Figure 8 、 Figure 16 shown, a communication groove is formed on the surface of the second fixing base 200 facing the first fixing base 110. A communication hole penetrating through to the surface of the second fixing base 200 facing away from the first fixing base 110 is formed at the bottom of the communication groove. A connecting cylinder 210 is arranged in the communication hole, and the connecting cylinder 210 is connected to the process chamber.

[0121] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention. However, the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A pressure sensor, characterized in that, It includes a first fixing seat, a top cover, a moving membrane, an electrode member and a heating member; The top cover and the moving membrane respectively seal the openings at the top and bottom of the first fixing seat to form a pressure reference cavity, and the electrode member is disposed in the pressure reference cavity; The heating element is arranged in the pressure reference cavity and is located on a side of the electrode element away from the moving membrane. The heating element is used to heat at least the electrode element.

2. The pressure sensor according to claim 1, wherein, The pressure sensor further comprises a first heating pin, one end of which is electrically connected to the heating element, and the other end of which passes through the top cover for connection to one end of an external power source.

3. The pressure sensor according to claim 2, wherein, The pressure sensor further comprises a second heating pin or an electrical connector, wherein: One end of the second heating pin is electrically connected to the other end of the heating element, and the other end of the second heating pin passes through the top cover to be connected to the other end of the external power supply; Alternatively, one end of the electrical connector is electrically connected to the other end of the heating element, and the other end of the electrical connector is electrically connected to the top cover or the first fixing seat and is grounded.

4. The pressure sensor according to claim 3, wherein, The heating element includes a heating strip and a pressing ring, at least one end of the heating strip is electrically connected to the inner side of the pressing ring, and the first heating pin and the second heating pin are electrically connected to the two ends of the heating strip respectively; or, the first heating pin is electrically connected to the heating strip, and the pressing ring is electrically connected to the electrical connector.

5. The pressure sensor according to claim 3, characterized in that, The heating element includes a pressing ring and a pair of connecting parts connected to the inner side of the pressing ring, and the two connecting parts are electrically connected to the first heating pin and the second heating pin respectively.

6. The pressure sensor according to claim 4 or 5, characterized in that, The pressure sensor further comprises an annular pressing component, which is disposed between the pressing ring and the top cover and is used for elastically pressing the surface of the pressing ring facing the top cover.

7. The pressure sensor according to claim 6, characterized in that, The annular pressing assembly comprises an elastic ring and a pressing cylinder. The elastic ring is arranged between the top cover and the pressing cylinder and is used to drive the pressing cylinder to press the pressing ring through elastic force.

8. The pressure sensor according to claim 7, wherein, The annular pressing assembly is the electrical connector, and the pressing ring is electrically connected to the top cover through the pressing tube and the elastic ring.

9. The pressure sensor according to claim 7, wherein The annular pressing assembly further includes an insulating washer, which is arranged between the pressing cylinder and the pressing ring.

10. The pressure sensor according to claim 8, characterized in that, The annular pressing assembly further includes a conductive gasket, which is disposed between the pressing cylinder and the pressing ring. The pressing ring is electrically connected to the top cover via the conductive gasket, the pressing cylinder and the elastic ring.

11. The pressure sensor according to any one of claims 1 to 5, characterized in that, A receiving groove is also formed on the surface of the electrode member facing the top cover, and the heating member is at least partially received in the receiving groove.

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