Defect simulation device for nondestructive testing and processing method

Abstract

The invention relates to the technical field of nondestructive testing, and discloses a defect simulation device for nondestructive testing and a processing method, a test block matrix is embedded in an embedding groove of a test block base, and a defect processing surface abuts against the groove bottom wall of the embedding groove, so that a simulation defect is formed in the defect simulation device; the test block base body and the test block base are processed by adopting an additive printing technology, and finish machining is performed on the inner wall of the embedded groove and the outer embedded surface, so that the processing precision of the outer embedded surface and the inner wall of the embedded groove is less than 10 microns, the actual fit clearance between the outer embedded surface and the inner wall of the embedded groove is less than 50 microns, and the fit precision invisible to naked eyes is realized; a gap between the contact surfaces of the embedded outer surface and the inner wall of the embedded groove is invisible during ray type perspective detection, so that the influence of processing of a defect simulation device on simulated defects is reduced, the simulation is not deformed in the embedding process of the test block base body and the test block base, the simulated defects are clear and distinguishable during ray type perspective detection, and the detection efficiency is improved. And the authenticity of simulated defects is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of nondestructive testing, and particularly to a defect simulation device for nondestructive testing and a processing method thereof. Background Art

[0002] The reference block is an important component for verifying the detection ability of industrial nondestructive testing technology, and artificial processing is used to simulate defects on the reference block.

[0003] In the prior art, the surface to be connected of one test block is set to be in contact with the surface to be connected of another test block, and the two test blocks are hot-pressed. At least one of the surface to be connected of one test block and the surface to be connected of the other test block is formed with a simulated defect.

[0004] The deformation during hot pressing will cause deformation inside the test block, resulting in a reduction in the quality of the test block. Although the deformation can be reduced and the quality of the test block can be improved by controlling parameters such as the hot pressing temperature, hot pressing pressure, and hot pressing time. However, it is found in actual applications that when CT detection is performed using the processed reference block, the deformation between the contact surfaces of the two test blocks can be clearly observed from the detection image, which will further cause a change in the defect size on the test block, and this deformation will inevitably affect the simulated defect.

[0005] Therefore, there is an urgent need for a defect simulation device for nondestructive testing to solve the above technical problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a defect simulation device for nondestructive testing and a processing method thereof, which can simulate defects inside the defect simulation device as realistically as possible, and greatly reduce the influence of the processing of the defect simulation device on the simulated defect.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A defect simulation device for nondestructive testing, comprising:

[0009] A test block base, the test block base having an installation side surface, and an embedding groove being recessed in the installation side surface;

[0010] A test block matrix, the test block matrix having a defect processing surface, a simulated defect being processed on the defect processing surface, the test block matrix being embedded in the embedding groove, and the defect processing surface abutting against the bottom wall of the embedding groove;

[0011] The test block matrix has an embedding outer surface in contact with the inner wall of the embedding groove, the machining accuracy of the embedding outer surface is less than 10 microns, the machining accuracy of the inner wall of the embedding groove is less than 10 microns, and the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove is less than 50 microns.

[0012] As a preferred technical solution of the above-mentioned defect simulation device for non-destructive testing, the cross-section of the test block base is circular, rectangular or polygonal, and the cross-section of the test block base is parallel to the installation side surface;

[0013] And / or, the cross-section of the test block matrix is circular, rectangular or polygonal, the cross-section shape of the embedding groove is the same as the cross-section shape of the test block matrix, and the cross-sections of the test block matrix and the embedding groove are both parallel to the defect processing surface.

[0014] As a preferred technical solution of the above-mentioned defect simulation device for non-destructive testing, the thickness of the test block matrix is 0.5 mm - 10 mm; the maximum width of the test block matrix ≥ 5 mm.

[0015] As a preferred technical solution of the above-mentioned defect simulation device for non-destructive testing, a plurality of the simulation defects are provided on the test block matrix.

[0016] As a preferred technical solution of the above-mentioned defect simulation device for non-destructive testing, the simulation defects include at least one of cavity-type defects, inclusion-type defects, crack-type defects, and pore and porosity-type defects.

[0017] As a preferred technical solution of the above-mentioned defect simulation device for non-destructive testing, the cavity-type defects include special-shaped grooves formed by machining, the inclusion-type defects include the special-shaped grooves and inclusions sandwiched in the special-shaped grooves, the crack-type defects include cracks formed by etching, and the pore and porosity-type defects include the special-shaped grooves and metal powders and pore-forming agents filled in the special-shaped grooves.

[0018] In order to achieve the above object, the present invention also provides a processing method for a defect simulation device for non-destructive testing, which is used to process the above-mentioned defect simulation device for non-destructive testing. The processing method for the defect simulation device for non-destructive testing includes the following steps:

[0019] S10. Process the test block matrix and the test block base by using additive manufacturing technology;

[0020] S20. Process simulation defects on the defect processing surface of the test block matrix;

[0021] S30. Finish-machine the inner wall of the embedding groove of the test block base and the outer embedding surface of the test block matrix, and make the machining accuracy of the outer embedding surface and the machining accuracy of the inner wall of the embedding groove both less than 10 microns, and make the actual fit clearance between the outer embedding surface and the inner wall of the embedding groove less than 50 microns;

[0022] S40. Embed the test block matrix into the embedding groove.

[0023] As a preferred technical solution of the above processing method of the defect simulation device for nondestructive testing, in step S20, a laser processing technique or a mechanical processing method is used to process simulated defects on the defect processing surface of the test block substrate.

[0024] As a preferred technical solution of the above processing method of the defect simulation device for nondestructive testing, in step S20, a variety of simulated defects are processed on the defect processing surface of the test block substrate.

[0025] As a preferred technical solution of the above processing method of the defect simulation device for nondestructive testing, in step S10, materials with the same ray absorption characteristics as the workpiece to be inspected are selected for additive manufacturing of the test block substrate and the test block base.

[0026] Beneficial effects of the present invention: For the defect simulation device for nondestructive testing provided by the present invention, the test block substrate is embedded in the embedding groove of the test block base, and the defect processing surface abuts against the bottom wall of the embedding groove, so that the simulated defects on the defect processing surface are formed inside the defect simulation device; by defining that the machining precision of the embedding outer surface and the inner wall of the embedding groove is less than 10 microns, and the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove is less than 50 microns, it is realized that the gap between the contact surfaces of the embedding outer surface and the inner wall of the embedding groove is invisible during ray-based perspective detection, greatly reducing the influence of the processing of the defect simulation device on the simulated defects. For example, the embedding process of the test block substrate and the test block base will not cause deformation of the simulation, making the simulated defects clearly distinguishable during ray-based perspective detection and improving the authenticity of the simulated defects.

[0027] The processing method of the defect simulation device for nondestructive testing provided by the present invention uses additive printing technology to process the test block substrate and the test block base, and performs fine machining on the inner wall of the embedding groove and the embedding outer surface, so that the machining precision of the embedding outer surface and the inner wall of the embedding groove is less than 10 microns, and the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove is less than 50 microns, thus realizing a fitting precision invisible to the naked eye and being able to avoid the influence of the processing of the defect simulation device on the simulated defects. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present invention and these drawings.

[0029] Figure 1 is a perspective view of the first defect simulation device for nondestructive testing provided by the embodiments of the present invention;

[0030] Figure 2 is a perspective view of the first test block base provided by an embodiment of the present invention;

[0031] Figure 3 is a perspective view of the second test block base provided by an embodiment of the present invention;

[0032] Figure 4 is a schematic structural view of the first test block matrix provided by an embodiment of the present invention;

[0033] Figure 5 is a schematic structural view of the second test block matrix provided by an embodiment of the present invention;

[0034] Figure 6 is a perspective view of the third test block matrix provided by an embodiment of the present invention;

[0035] Figure 7 is a perspective view of the fourth test block matrix provided by an embodiment of the present invention;

[0036] Figure 8 is a perspective view of the second defect simulation device for non-destructive testing provided by an embodiment of the present invention;

[0037] Figure 9 is a flowchart of a processing method for a defect simulation device for non-destructive testing provided by an embodiment of the present invention.

[0038] In the figure:

[0039] 100, test block matrix; 110, simulated defect;

[0040] 200, test block base; 210, embedding groove. Detailed implementation manners

[0041] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only parts related to the present invention are shown in the drawings, rather than all the structures.

[0042] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0043] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0044] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0045] As Figure 1 shown, this embodiment provides a defect simulation device for non-destructive testing, including a test block base 200 and a test block matrix 100. Among them, the test block base 200 has an installation side surface, and an embedding groove 210 is recessed in the installation side surface; the test block matrix 100 has a defect processing surface, and a simulated defect 110 is processed on the defect processing surface. The test block matrix 100 is embedded in the embedding groove 210, and the defect processing surface abuts against the bottom wall of the embedding groove 210; the test block matrix 100 has an embedding outer surface in contact with the inner wall of the embedding groove 210, the machining accuracy of the embedding outer surface is less than 10 microns, the machining accuracy of the inner wall of the embedding groove 210 is less than 10 microns, and the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove 210 is less than 50 microns.

[0046] The defect simulation device for non-destructive testing provided by the embodiment of the present invention embeds the test block matrix 100 into the embedding groove 210 of the test block base 200, so that the defect processing surface abuts against the bottom wall of the embedding groove 210, thereby forming the simulated defect 110 on the defect processing surface inside the defect simulation device; by defining that the machining accuracies of both the embedding outer surface and the inner wall of the embedding groove 210 are less than 10 microns, and the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove 210 is less than 50 microns, it is realized that the gap between the contact surfaces of the embedding outer surface and the inner wall of the embedding groove 210 is invisible during ray-based fluoroscopic inspection, greatly reducing the influence of the machining of the defect simulation device on the simulated defect 110. For example, the embedding process of the test block matrix 100 and the test block base 200 will not cause deformation of the simulation, making the simulated defect 110 clearly distinguishable during ray-based fluoroscopic inspection and improving the authenticity of the simulated defect 110.

[0047] In some embodiments, the cross-section of the test block base 200 can be circular, see Figure 1 . The cross-section of the test block base 200 is parallel to the mounting side. In some embodiments, the cross-section of the test block base 200 can also be rectangular, see Figure 2 . In some embodiments, the cross-section of the test block base 200 can also be polygonal, such as pentagonal, hexagonal, etc.

[0048] Optionally, the cross-sectional shape of the embedding groove 210 is the same as that of the test block body 100, and the cross-sections of the test block body 100 and the embedding groove 210 are both parallel to the defect processing surface. In some embodiments, the cross-section of the embedding groove 210 can be circular, see Figure 2 . In some embodiments, the cross-section of the embedding groove 210 can be rectangular, see Figure 3 .

[0049] In some embodiments, the cross-section of the test block body 100 can be circular, see Figure 4 . In some embodiments, the cross-section of the test block body 100 can be rectangular, see Figure 5 . In some embodiments, the cross-section of the test block body 100 can be polygonal, such as pentagonal, hexagonal, etc.

[0050] It should be noted that the machining accuracy of the embedding outer surface and the inner wall of the embedding groove 210 can be any value among 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns and 9 microns, and the fitting gap between the embedding outer surface and the inner wall of the embedding groove 210 can be any value among 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns.

[0051] It should be noted that the shapes of the test block body 100 and the test block base 200 are both determined according to the detection requirements. The width of the test block body 100 depends on the opening size of the embedding groove 210. The thickness of the test block body 100 is determined by the size of the simulated defect 110. The size of the test block base 200 is determined by the size of the workpiece to be inspected and is equal to the maximum penetration thickness of the workpiece to be inspected. The external dimensions of the test block base 200 are consistent with the maximum dimensions of the cross-section of the detection position of the workpiece to be inspected, and they have the same ray absorption characteristics. The shape, size, and height of the embedding groove on the test block base 200 are the same as those of the test block body 100.

[0052] Optionally, the thickness of the test block substrate 100 is 0.5 mm - 10 mm, specifically determined based on the height of the defect to be detected; the maximum width of the test block substrate 100 ≥ 5 mm, specifically determined based on the position where the defect to be detected is located. It should be noted that the thickness of the test block substrate 100 can be any value between 0.5 mm and 10 mm. For example, the thickness of the test block substrate 100 can be any value among 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc., and the maximum width of the test block substrate 100 can be any value among 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc.

[0053] Optionally, a plurality of the simulated defects 110 are provided on the test block substrate 100. It should be noted that the plurality of simulated defects 110 can be of the same type but different sizes, or different simulated defects 110.

[0054] Optionally, the simulated defect 110 includes at least one of cavity - type defects, inclusion - type defects, crack - type defects, and porosity and porosity - like defects. Among them, the cavity - type defect includes a special - shaped groove formed by machining, the inclusion - type defect includes a special - shaped groove and inclusions contained in the special - shaped groove, the crack - type defect includes a crack formed by etching, and the porosity and porosity - like defect includes a special - shaped groove and metal powder and pore - forming agent filled in the special - shaped groove.

[0055] In some embodiments, as Figure 1 and Figure 6 shown, a series of a plurality of simulated defects 110 distributed at circumferential intervals can be machined on the test block substrate 100. In some embodiments, as Figure 7 and Figure 8 shown, a series of a plurality of simulated defects 110 distributed at longitudinal intervals can be machined on the test block substrate 100.

[0056] It should be noted that the morphology of the simulated defect 110 is determined by the detection requirements, such as cylindrical, hemispherical, cuboid, conical, etc., and the size of the simulated defect 110 is determined by the acceptance criteria, which will not be specifically limited here.

[0057] As Figure 9 shown, an embodiment of the present invention also provides a processing method for a defect simulation device for non - destructive testing, which is used to process the above - mentioned defect simulation device for non - destructive testing. The processing method for the defect simulation device for non - destructive testing includes the following steps:

[0058] S10. Process the test block substrate 100 and the test block base 200 using additive manufacturing technology;

[0059] S20. Machine the simulated defect 110 on the defect - machining surface of the test block substrate 100;

[0060] S30. Finish machining the inner wall of the embedding groove 210 of the test block base 200 and the embedding outer surface of the test block matrix 100, and make the machining precision of the embedding outer surface and the inner wall of the embedding groove 210 both less than 10 microns, and make the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove 210 less than 50 microns;

[0061] S40. Embed the test block matrix 100 into the embedding groove 210.

[0062] The processing method of the defect simulation device for nondestructive testing provided by the embodiment of the present invention uses additive manufacturing technology to process the test block matrix 100 and the test block base 200, and finish machines the inner wall of the embedding groove 210 and the embedding outer surface, so that the machining precision of the embedding outer surface and the inner wall of the embedding groove 210 are both less than 10 microns, and make the actual fit clearance between the embedding outer surface and the inner wall of the embedding groove 210 less than 50 microns, thus achieving a fit precision invisible to the naked eye and being able to avoid the influence of the processing of the defect simulation device on the simulated defect 110.

[0063] Further, in step S20, a laser processing technology or a mechanical processing method is used to machine the simulated defect 110 on the defect processing surface of the test block matrix 100. In this way, the machining precision of the simulated defect 110 can be improved, and the authenticity of the simulated defect 110 can be improved.

[0064] Further, in step S20, a variety of simulated defects 110 are machined on the defect processing surface of the test block matrix 100. In this way, multiple defects can be detected at one time, the detection efficiency can be improved, and the processing cost can be reduced.

[0065] Further, in step S10, materials with the same ray absorption characteristics as the workpiece to be inspected are selected for additive manufacturing of the test block matrix 100 and the test block base 200. In this way, the authenticity of the defect simulation device can be avoided from being reduced due to the ray absorption characteristics of the defect simulation device and the workpiece to be inspected.

[0066] In addition, the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A defect simulation device for non-destructive testing, characterized in that, include: A test block base (200), the test block base (200) having a mounting side surface, the mounting side surface being concavely provided with an embedding groove (210); A test block base (100), the test block base (100) having a defect processing surface, the defect processing surface being processed with a simulated defect (110), the test block base (100) being embedded in the embedding groove (210), and the defect processing surface being in contact with a groove bottom wall of the embedding groove (210); The test block base (100) has an embedded outer surface in contact with the inner wall of the embedded groove (210), the machining accuracy of the embedded outer surface is less than 10 microns, the machining accuracy of the inner wall of the embedded groove (210) is less than 10 microns, and the actual matching clearance between the embedded outer surface and the inner wall of the embedded groove (210) is less than 50 microns.

2. The defect simulation device for non-destructive testing according to claim 1, characterized in that The cross section of the test block base (200) is circular, rectangular, or polygonal, and the cross section of the test block base (200) is parallel to the installation side surface; And / or, the cross-section of the test block base (100) is circular, rectangular, or polygonal, the cross-section shape of the embedding groove (210) is the same as the cross-section shape of the test block base (100), and the cross-section of the test block base (100) and the cross-section of the embedding groove (210) are both parallel to the defective processing surface.

3. The defect simulation device for non-destructive testing according to claim 1, characterized in that, The thickness of the test block base (100) is 0.5 mm-10 mm, and the maximum width of the test block base (100) is greater than or equal to 5 mm.

4. The defect simulation device for nondestructive testing according to claim 1, wherein, A plurality of simulated defects (110) are provided on the test block substrate (100).

5. The defect simulation device for non-destructive testing according to claim 1, characterized in that, The simulated defects (110) include at least one of cavity defects, inclusion defects, crack defects, and pore and porosity defects.

6. The defect simulation device for non-destructive testing according to claim 5, characterized in that, The cavity-type defects include special-shaped grooves formed by machining, the inclusion-type defects include the special-shaped grooves and inclusions contained in the special-shaped grooves, the crack-type defects include cracks formed by etching, and the pore and looseness-type defects include the special-shaped grooves and metal powder and pore-forming agents filled in the special-shaped grooves.

7. A processing method for a defect simulation device for non-destructive testing, characterized in that, A method for processing a defect simulation device for nondestructive testing as claimed in any one of claims 1 to 6, wherein the method comprises the following steps: S10, using additive printing technology to process the test block base (100) and the test block base (200); S20, machining a simulated defect (110) on the defect machining surface of the test block substrate (100); S30, fine-machining the inner wall of the embedding groove (210) of the test block base (200) and the embedding outer surface of the test block base (100), and making the machining accuracy of the embedding outer surface and the machining accuracy of the inner wall of the embedding groove (210) both less than 10 microns, and making the actual matching clearance between the embedding outer surface and the inner wall of the embedding groove (210) less than 50 microns; S40, embedding the test block base (100) in the embedding groove (210).

8. The processing method of the defect simulation device for non-destructive testing according to claim 7, characterized in that In step S20, a simulated defect (110) is machined on the defect machining surface of the test block substrate (100) by using laser processing technology or machining.

9. The method for machining a defect simulation device for non-destructive testing according to claim 7, wherein In step S20, a variety of simulated defects (110) are machined on the defect machining surface of the test block substrate (100).

10. The method for machining a defect simulation device for non-destructive testing according to claim 7, wherein, In step S10, the test block substrate (100) and the test block base (200) are additively manufactured with a material having the same ray absorption characteristics as the workpiece to be inspected.

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