Component ultrasonic detection device and detection system

Abstract

The present application provides an apparatus comprising: an ultrasonic detector comprising an ultrasonic detection head; the pulse laser is arranged on one side of the ultrasonic detector, the pulse laser emits pulse laser, and the ultrasonic detection head is provided with a through hole for the pulse laser to pass through, so that when the ultrasonic detection head is opposite to the position of the component, the ultrasonic detection head emits ultrasonic waves and the pulse laser to the component; receiving the ultrasonic wave returned by the component; according to the ultrasonic detection device, a laser ultrasonic and conventional ultrasonic combined mode is adopted, the high-precision defect morphology of the surface of the component and the defect morphology of different depths in the component are obtained at the same time through one-time scanning, the accuracy and comprehensiveness of component detection are improved, and the detection efficiency of the component is improved.

Description

Technical Field

[0001] This application relates to the technical field of component detection, and particularly to an ultrasonic detection device and a detection system for components. Background Art

[0002] In the field of reliability screening of electronic components, ultrasonic detectors are currently widely used. An ultrasonic detection head emits ultrasonic waves to the components, and the signal is transmitted through a coupling medium (water). The internal structure of the components will cause differences in ultrasonic echo signals. The ultrasonic detection head then receives and collects the ultrasonic waves transmitted back from the inside of the components to judge the internal defects of the components. However, the current scanning mode can only obtain the structural features of the plastic package of the components and the upper surface of the internal chip by adjusting the focal position of the ultrasonic probe and performing a single scan, and judge whether there are delamination defects on the plastic package of the components and the upper surface of the internal chip. It is impossible to obtain high-precision imaging photos of multiple depths of the components in one scan. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose an ultrasonic detection device for components to solve the problem that the existing ultrasonic detector can only obtain the structural features of the upper surface of the components in a single scan and cannot obtain the structural features of the internal deep layer.

[0004] Based on the above purpose, this application provides an ultrasonic detection device for components, including:

[0005] An ultrasonic detector, the ultrasonic detector includes an ultrasonic detection head;

[0006] A pulsed laser, the pulsed laser is arranged on one side of the ultrasonic detector, the pulsed laser emits pulsed laser, and a through hole for the pulsed laser to pass through is provided on the ultrasonic detection head, so that when the ultrasonic detection head is opposite to the component, the ultrasonic detection head emits ultrasonic waves and pulsed laser to the component and receives the ultrasonic waves returned from the component.

[0007] Optionally, it further includes a thin film container filled with water. The thin film container is arranged below the ultrasonic detection head, the probe end of the ultrasonic detection head is immersed in water, a water film is provided on the top surface of the component, and the top surface of the component abuts against the thin film container.

[0008] Optionally, the bottom of the thin film container is a high-transparency film, and the top surface of the component abuts against the high-transparency film to make the ultrasonic detection head opposite to the component.

[0009] Optionally, the ultrasonic detector further includes a base which is hollow and internally provided with a reflecting lens. The output end of the pulsed laser is connected to a collimator through an optical fiber. The collimator is arranged on one side of the base, and the output end of the collimator emits pulsed laser that penetrates the base and passes through the through hole through the reflecting lens.

[0010] Optionally, a refrigerating sheet is provided on one side of the inner wall of the thin film container to reduce the water temperature.

[0011] Optionally, the ultrasonic detection head includes an ultrasonic transducer and a detection head body. The detection head body is hollow, the ultrasonic transducer is installed in the detection head body, the through hole is arranged through the ultrasonic transducer, and the ultrasonic transducer is used to emit ultrasonic waves and receive the ultrasonic waves returned from the component, and convert them into ultrasonic signals.

[0012] Optionally, a lens is further included, which is installed in the detection head body and is arranged below the ultrasonic transducer to adjust the spot size of the pulsed laser emitted by the pulsed laser.

[0013] Optionally, the lens and the ultrasonic transducer are immersed in the water in the thin film container.

[0014] Optionally, a waterproof adhesive layer is provided between the high-transparency film and the side wall of the thin film container.

[0015] Optionally, the high-transparency film is a polyethylene film.

[0016] Optionally, a bracket is connected between the thin film container and the base.

[0017] Optionally, a mesh groove is connected to one side of the inner wall of the thin film container, and the refrigerating end of the refrigerating sheet is arranged in the mesh groove.

[0018] Based on the same inventive concept, the present disclosure also provides a component ultrasonic detection system, including the component ultrasonic detection device according to any one of the above, and,

[0019] A signal conditioning module, connected to the ultrasonic transducer, for preprocessing and amplifying the ultrasonic signal;

[0020] A data acquisition module, connected to the signal conditioning module, for acquiring the ultrasonic signal that has been preprocessed and amplified;

[0021] A control module, connected to the ultrasonic detector, for controlling the ultrasonic detection head to emit ultrasonic waves to the component and controlling the pulsed laser to emit pulsed laser, and connected to the data acquisition module, for receiving the ultrasonic signal that has been preprocessed and amplified and converting it into ultrasonic data.

[0022] Optionally, it further includes a host computer module, which is connected to the control module to issue control instructions to the control module and perform human-machine interface display.

[0023] As can be seen from the above, an ultrasonic detection device for components provided in this application includes an ultrasonic detector and a pulsed laser. The ultrasonic detection head on the ultrasonic detector is used to emit ultrasonic waves to the components, and the pulsed laser is used to emit pulsed laser. By setting a through hole on the ultrasonic detection head for the pulsed laser to pass through, the ultrasonic detection head has the function of simultaneously emitting ultrasonic waves and pulsed laser. When the ultrasonic detection head detects the components, the ultrasonic waves emitted by the ultrasonic detection head reach the surface of the components and then return, and are received by the ultrasonic detection head again, so as to obtain the high-precision defect morphology on the surface of the components. The pulsed laser emitted by the ultrasonic detection head excites ultrasonic waves on the surface of the components, and the ultrasonic waves propagate inside the components, reflect when encountering an interface, and are received by the ultrasonic detection head again, so as to obtain the high-precision defect morphology inside the components. Therefore, the ultrasonic detection device in this application adopts the method of combining laser ultrasound and conventional ultrasound, and simultaneously obtains the high-precision defect morphology on the surface of the components and the defect morphology at different depths inside the components through one scan, improving the accuracy and comprehensiveness of component detection, and improving the detection efficiency of components. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in this application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only the embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram showing the ultrasonic detector in an embodiment of this application;

[0026] Figure 2 It is a schematic structural diagram showing the ultrasonic transducer in an embodiment of this application.

[0027] Reference numerals: 1, ultrasonic detector; 11, ultrasonic detection head; 111, through hole; 12, base; 13, collimator; 14, cooling sheet; 15, ultrasonic transducer; 16, lens; 17, detection head body; 2, pulsed laser; 3, thin film container; 31, high-transmission film; 4, signal conditioning module; 5, data acquisition module; 6, control module. Detailed Embodiments

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe this application in detail with reference to specific embodiments and the accompanying drawings.

[0029] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the ordinary meanings understood by those of ordinary skill in the field to which this application belongs. The "first", "second" and similar terms used in the embodiments of this application do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0030] Based on the background described above, in the precision field of electronic component reliability screening, ultrasonic detection technology, with its unique non-destructive testing ability, has become an indispensable tool for evaluating the internal structure and integrity of components. In currently widely used ultrasonic detection systems, ultrasonic waves are emitted towards the components to be tested, and water is used as a coupling medium to efficiently transmit these acoustic signals. The complex structural features inside the components will generate different echo responses to the ultrasonic waves, and these differences are accurately captured and collected by the ultrasonic detection head, and then potential defects inside the components, such as delamination, cracks or voids, are analyzed through complex signal processing algorithms. However, the current scanning mode mainly relies on adjusting the focal position of the ultrasonic probe. A single scan can only reveal the structural features of the plastic encapsulation material of the component and the upper surface of the internal chip, and there are limitations in obtaining multi-level information in the depth direction, and it is impossible to generate multiple high-precision imaging photos of the component from the surface layer to the deep layer at one time.

[0031] The following will Figure 1-2 describe the embodiments of this application in detail with reference to the accompanying

[0032] As Figure 1 and Figure 2 shown, an ultrasonic detection device for components includes:

[0033] An ultrasonic detector 1, where the ultrasonic detector 1 includes an ultrasonic detection head 11;

[0034] A pulsed laser 2, the pulsed laser 2 is arranged on one side of the ultrasonic detector 1, the pulsed laser 2 emits pulsed laser, and a through hole 111 for the pulsed laser to pass through is provided on the ultrasonic detection head 11, so that when the ultrasonic detection head 11 is opposite to the position of the component, the ultrasonic detection head 11 emits ultrasonic waves and pulsed laser to the component and receives the ultrasonic waves returned from the component.

[0035] Specifically, the ultrasonic detector 1 is a water immersion ultrasonic detector 1 commonly used in the non-destructive inspection of components. When the water immersion ultrasonic detector 1 inspects components, the components and the ultrasonic detection head 11 are immersed in water to ensure that ultrasonic waves can be smoothly transmitted to the components, thereby completing the inspection of the components. The ultrasonic detector 1 and the pulsed laser 2 are both installed on the installation platform. A through hole 111 is provided at the center position of the ultrasonic detection head 11, and this through hole 111 does not affect the ultrasonic waves emitted by the ultrasonic detection head 11. The pulsed laser emitted by the pulsed laser 2 passes through this through hole 111, enabling the ultrasonic detection head to have the function of simultaneously emitting ultrasonic waves and pulsed laser light.

[0036] In this embodiment, the ultrasonic detection head 11 on the ultrasonic detector 1 is used to emit ultrasonic waves to the components, and the pulsed laser 2 is used to emit pulsed laser light. By providing a through hole 111 on the ultrasonic detection head 11 for the pulsed laser to pass through, the ultrasonic detection head has the function of simultaneously emitting ultrasonic waves and pulsed laser light. When the ultrasonic detection head 11 inspects the components, the ultrasonic waves emitted by the ultrasonic detection head 11 reach the surface of the components and then return, and are received by the ultrasonic detection head 11 again, thereby obtaining a high-precision defect morphology on the surface of the components. The pulsed laser light emitted by the ultrasonic detection head 11 excites ultrasonic waves on the surface of the components, and the ultrasonic waves propagate inside the components, reflect when encountering an interface, and are then received by the ultrasonic detection head 11, thereby obtaining a high-precision defect morphology at different depths inside the components. Therefore, the ultrasonic detection device in this application adopts a method of combining laser ultrasound and conventional ultrasound into one, and simultaneously obtains a high-precision defect morphology on the surface of the components and a defect morphology at different depths inside the components through a single scan, improving the comprehensiveness of component inspection and thus improving the inspection efficiency of the components.

[0037] In some embodiments, as Figure 1 and Figure 2 shown, a component ultrasonic detection device further includes a thin film container 3 filled with water. The thin film container 3 is arranged below the ultrasonic detection head 11. The probe end of the ultrasonic detection head 11 is immersed in water, and a water film is provided on the top surface of the component. The top surface of the component abuts against the thin film container 3.

[0038] In addition, the bottom of the thin film container 3 is a high-transparency film 31, and the top surface of the component abuts against the high-transparency film 31 to make the positions of the ultrasonic detection head 11 and the component opposite to each other.

[0039] Specifically, a small amount of water adheres to the top surface of the component to form a water film when it abuts against the high-transparency film 31. The bottom of the thin-film container 3 is the high-transparency film 31, and a waterproof adhesive layer is provided between the high-transparency film 31 and the side wall of the thin-film container 3 to prevent water from seeping out through the gap between the high-transparency film 31 and the side wall of the thin-film container 3. The high-transparency film 31 is a polyethylene film, which has high transparency and a certain bearing capacity. While not affecting the transmission of ultrasonic waves and pulsed lasers, it can also bear the water in the thin-film container 3, thus ensuring the normal progress of the detection.

[0040] In this embodiment, a small amount of water adheres to the surface of the component, and an ultra-thin water film is formed on the surface of the component when it abuts against the high-transparency film 31. The ultrasonic detection head 11 is immersed in water. The high-transparency film 31 separates the component from the ultrasonic detection head, avoiding the component being immersed in water while not affecting the transmission of ultrasonic waves to the component, thus preventing the internal defects of the component from being filled with water and affecting its detection effect.

[0041] In some embodiments, a refrigerating sheet 14 is provided on one side of the inner wall of the thin-film container 3 to reduce the water temperature.

[0042] Specifically, a mesh groove is connected to one side of the inner wall of the thin-film container 3, and the refrigerating end of the refrigerating sheet 14 is arranged in the mesh groove, improving the stability of the refrigerating sheet 14 and preventing the refrigerating sheet 14 from affecting the detection of the component 01 by the ultrasonic detection head 11. The refrigerating sheet 14 is connected to an external temperature control device to achieve precise temperature control of the water in the thin-film container 3.

[0043] In this embodiment, since the pulsed laser can increase the water temperature, thereby affecting the transmission of ultrasonic waves, the refrigerating sheet 14 can reduce the water temperature, preventing the water temperature from rising and affecting the transmission of ultrasonic waves, thus improving the accuracy of the detection of internal defects of the component.

[0044] In some embodiments, as Figure 1 and Figure 2 shown, the ultrasonic detector 1 further includes a base 12, the base 12 is hollow and internally provided with a reflecting mirror. The output end of the pulsed laser 2 is connected to a collimator 13 through an optical fiber. The collimator 13 is arranged on one side of the base 12, and the output end of the collimator 13 emits pulsed laser light that penetrates the base 12 and passes through the through hole 111 through the reflecting mirror.

[0045] Specifically, the base 12 is installed on the installation platform. A bracket is connected between the thin film container 3 and the base 12 to accurately place the thin film container 3 below the ultrasonic detection head 11. The collimator 13 is also installed on the installation platform and is arranged on one side of the base 12. The base 12 is hollow, and a light inlet hole is provided on the side wall of the base 12. The pulsed laser 2 is a laser with a single wavelength or a tunable wavelength laser. The pulsed laser emitted by the pulsed laser 2 is introduced into the collimator 13. The pulsed laser emitted from the output end of the collimator 13 passes through the light inlet hole, and then the transmission direction is changed by the reflection mirror inside the base 12, so that the pulsed laser accurately passes through the through hole 111 on the ultrasonic detection head 11, so that the ultrasonic detection head 11 simultaneously has the functions of emitting ultrasonic waves and pulsed lasers.

[0046] In this embodiment, the laser pulse generator is connected to the collimator 13. The collimator 13 converts the light beam emitted by the pulsed laser 2 into a parallel light beam and focuses the parallel light beam into a pulsed laser beam with a smaller diameter, thereby improving the energy and effect of the pulsed laser. The base 12 is used to install the ultrasonic detection head 11. The base 12 is hollow and is provided with a reflection mirror inside, which is convenient for adjusting the transmission angle of the pulsed laser so that it accurately passes through the through hole 111 on the ultrasonic detection head 11, so that the ultrasonic detection head 11 simultaneously has the functions of emitting ultrasonic waves and pulsed lasers.

[0047] In some embodiments, as Figure 1 and Figure 2 shown, the ultrasonic detection head 11 includes an ultrasonic transducer 15 and a detection head body 17. The detection head body 17 is hollow. The ultrasonic transducer 15 is installed in the detection head body 17. The through hole 111 penetrates through the ultrasonic transducer 15. The ultrasonic transducer 15 is used to emit ultrasonic waves and receive the ultrasonic waves returned from the component, and convert them into ultrasonic signals.

[0048] Specifically, the detection head body 17 is connected to the base 12 and the two are communicated so that the pulsed laser can pass through. The ultrasonic transducer 15 is installed in the detection head body, and its emitting end is opposite to the top surface of the component, so as to emit ultrasonic waves and pulsed lasers to the top surface of the component.

[0049] In this embodiment, the detection head body 17 is hollow and is used to install the ultrasonic transducer 15. The through hole 111 penetrates through the ultrasonic transducer 15 and is communicated with the inside of the detection head body 17 so that the pulsed laser can pass through. The ultrasonic transducer 15 is the core component of the ultrasonic detection head 11. It can emit ultrasonic waves and pulsed lasers while also receiving ultrasonic waves from the component and converting them into ultrasonic signals for analyzing the surface and internal defects of the component.

[0050] In some embodiments, a component ultrasonic detection device further includes a lens 16, which is installed inside the detection head body and is disposed below the ultrasonic transducer 15 for adjusting the spot size of the pulsed laser emitted by the pulsed laser 2.

[0051] In addition, the lens 16 and the ultrasonic transducer 15 are immersed in the water in the thin film container 3.

[0052] In this embodiment, the lens 16 is used to adjust the spot size of the pulsed laser emitted by the pulsed laser 2, facilitating the adjustment of the energy density of the pulsed laser according to the test requirements, thereby improving the flexibility of component detection.

[0053] Based on the same inventive concept, as Figure 1 shown, the present application further provides a component detection ultrasonic system, including the component detection ultrasonic device described in any of the above embodiments, and

[0054] a signal conditioning module 4, connected to the ultrasonic transducer 15, for preprocessing and amplifying the ultrasonic signal;

[0055] a data acquisition module 5, connected to the signal conditioning module 4, for acquiring the preprocessed and amplified ultrasonic signal;

[0056] a control module 6, connected to the ultrasonic detector 1, for controlling the ultrasonic detection head 11 to emit ultrasonic waves to the component and controlling the pulsed laser 2 to emit pulsed laser, and connected to the data acquisition module 5, for receiving the preprocessed and amplified ultrasonic signal and converting it into ultrasonic data.

[0057] In addition, it further includes a host computer module, connected to the control module 6, for sending control instructions to the control module 6 and for human-machine interface display.

[0058] Specifically, the signal conditioning module 4 includes a signal amplifier and a filter. The signal conditioning module 4 is connected to the ultrasonic transducer 15 to preprocess and amplify the received weak ultrasonic signal. The preprocessing includes operations such as filtering and denoising to improve the signal-to-noise ratio of the signal. The data acquisition module 5 includes a data acquisition card. The data acquisition module 5 is connected to the signal conditioning module 4 and is responsible for acquiring the ultrasonic signal that has been preprocessed and amplified. This module usually has high precision and a high sampling rate to ensure that the acquired signal can truly reflect the characteristics of the components. The control module 6 is an FPGA chip. The control module 6 controls the ultrasonic transducer 15 to emit ultrasonic waves and at the same time controls the pulsed laser 2 to emit pulsed laser. It can also receive the ultrasonic signal that has been preprocessed and amplified and convert it into ultrasonic data for subsequent analysis. The host computer module is connected to the control module 6 and serves as the user-system interaction interface. The user can send control commands through the host computer module, such as setting detection parameters, starting / stopping detection, etc. The host computer module can also display the detection results, such as the image inside the component, the defect location, etc.

[0059] In this embodiment, the component ultrasonic detection device, the signal conditioning module 4, the data acquisition module 5, the control module 6, and the host computer module form a complete component detection system. Among them, the ultrasonic transducer 15 in the component ultrasonic detection device receives the ultrasonic waves returned by the component and converts them into ultrasonic signals. The signal conditioning module 4 amplifies and preprocesses the ultrasonic signals. The data acquisition module 5 acquires the amplified and preprocessed ultrasonic signals with high precision. The control module 6 receives the ultrasonic signals and converts them into ultrasonic data. The host computer module displays the ultrasonic data. The detection personnel judge whether there are defects inside the component according to the ultrasonic data. The above detection system has characteristics such as high precision and efficient data acquisition, and can realize comprehensive and accurate detection of internal defects of components.

[0060] Those of ordinary skill in the art should understand that: The discussion of any above embodiment is only exemplary and is not intended to imply that the scope of the present application is limited to these examples; Under the idea of the present application, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other variations in different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of brevity.

[0061] In addition, for simplicity of explanation and discussion, and so as not to make the embodiments of the present application difficult to understand, well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Further, the devices may be shown in block diagram form in order to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that details regarding the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present application are to be implemented (i.e., these details should be fully within the understanding of those skilled in the art). In cases where specific details (such as circuits) are set forth to describe exemplary embodiments of the present application, it will be apparent to those skilled in the art that the embodiments of the present application may be practiced without these specific details or with variations of these specific details. Accordingly, these descriptions are to be regarded as illustrative rather than restrictive.

[0062] Although the present application has been described in connection with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (such as dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0063] Embodiments of the present application are intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the claims of the present application. Accordingly, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. An ultrasonic detection device for components, characterized in that, Comprising: An ultrasonic detector (1), the ultrasonic detector (1) comprising an ultrasonic detection head (11); A pulsed laser (2), the pulsed laser (2) being provided on one side of the ultrasonic detector (1), the pulsed laser (2) emitting pulsed laser light, and a through hole (111) for the pulsed laser light to pass through being provided on the ultrasonic detection head (11), so that when the ultrasonic detection head (11) is opposite to the component (01) in position, the ultrasonic detection head (11) emits ultrasonic waves and pulsed laser light to the component (01) and receives the ultrasonic waves returned from the component (01).

2. The ultrasonic detection device for a component according to claim 1, wherein It further comprises a thin film container (3) filled with water, the thin film container (3) being provided below the ultrasonic detection head (11), the probe end of the ultrasonic detection head (11) being immersed in water, a water film being provided on the top surface of the component (01), and the top surface of the component (01) abutting against the thin film container (3).

3. The ultrasonic detection device for a component according to claim 2, characterized in that, The bottom of the thin film container (3) is a high-transparency film (31), and the top surface of the component (01) abuts against the high-transparency film (31) so that the ultrasonic detection head (11) is opposite to the component (01) in position.

4. The ultrasonic detection device for a component according to claim 3, characterized in that, The ultrasonic detector (1) further comprises a base (12), the base (12) being hollow and having a reflecting lens inside, the output end of the pulsed laser (2) being connected to a collimator (13) through an optical fiber, the collimator (13) being provided on one side of the base (12), and the output end of the collimator (13) emitting pulsed laser light to penetrate through the base (12) and pass through the through hole (111) through the reflecting lens.

5. An ultrasonic detection device for components according to claim 4, characterized in that, One side of the inner wall of the thin film container (3) is provided with a Peltier cooler (14) to reduce the water temperature.

6. The ultrasonic detection device for components according to claim 5, wherein, The ultrasonic detection head (11) comprises an ultrasonic transducer (15) and a detection head body (17), the detection head body (17) being hollow, the ultrasonic transducer (15) being installed inside the detection head body (17), the through hole (111) being provided through the ultrasonic transducer (15), and the ultrasonic transducer (15) being used for emitting ultrasonic waves and receiving the ultrasonic waves returned from the component (01) and converting them into ultrasonic signals.

7. An ultrasonic detection device for components according to claim 6, characterized in that, It further comprises a lens (16), installed inside the detection head body (17) and provided below the ultrasonic transducer (15), for adjusting the spot size of the pulsed laser light emitted by the pulsed laser (2).

8. An ultrasonic detection device for components according to claim 7, characterized in that, The lens (16) and the ultrasonic transducer (15) are immersed in the water in the thin film container (3).

9. An ultrasonic detection device for components according to claim 3, characterized in that, A waterproof adhesive layer is provided between the high-transparency film (31) and the side wall of the thin film container (3).

10. The ultrasonic detection device for components according to claim 9, characterized in that, The high-transparency film (31) is a polyethylene film.

11. An ultrasonic detection device for components according to claim 4, characterized in that, A bracket is connected between the thin film container (3) and the base (12).

12. The ultrasonic detection device for components according to claim 5, characterized in that, One side of the inner wall of the thin film container (3) is connected with a mesh groove, and the cooling end of the Peltier cooler (14) is provided in the mesh groove.

13. An ultrasonic detection system for components, characterized in that, Comprising the component ultrasonic detection device according to any one of claims 6-12, and, A signal conditioning module (4), connected to the ultrasonic transducer (15), for preprocessing and amplifying the ultrasonic signal; The data acquisition module (5), which is connected to the signal conditioning module (4), is used to acquire the preprocessed and amplified ultrasonic signals; The control module (6), which is connected to the ultrasonic detector (1), is used to control the ultrasonic probe (11) to emit ultrasonic waves to the component (01) and control the pulsed laser (2) to emit pulsed laser, and is connected to the data acquisition module (5) to receive the preprocessed and amplified ultrasonic signals and convert them into ultrasonic data.

14. An ultrasonic detection system for components according to claim 13, further comprising a host computer module, which is connected to the control module (6) to send control instructions to the control module (6) and perform human-machine interface display.

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