Test interface structure and chip test apparatus

Abstract

The present application relates to the technical field of chip testing, and in particular to a test interface structure and a chip testing device. The test interface structure comprises: a substrate, which is arranged above a chip carrying platform and is mounted at the bottom of a light source provider; the substrate is provided with a plurality of spaced-apart and through-extended openings, the openings are provided with light-transmissive partition structures, the partition structures are configured to form a first partition space with a dry environment between the partition structures and the light source provider, and the partition structures are further configured to form a second partition space between the partition structures and the chip carrying platform, which allows dry gas to be filled or vacuumed; and a plurality of objective lenses, which are one-to-one correspondingly mounted in the plurality of openings and are located above the bottom surface of the partition structures. The test interface structure of the present application can make the field of view of the objective lens clear and facilitate testing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a test interface structure and a chip testing device. BACKGROUND

[0002] Based on the testing requirement, the chip testing device needs to test the chip in high temperature, normal temperature and low temperature environment.

[0003] The light source provider generates a large amount of heat during long time operation, which results in high temperature of the light source provider and the objective lens of the test probe card. Therefore, when low temperature testing is performed, the temperature of the objective lens of the test probe card is higher than the temperature of the environment where the chip to be tested is located. However, once the humidity of the environment where the chip to be tested is located is slightly high, condensation or frost may be generated on the objective lens of the test probe card, which makes the objective lens of the test probe card become blurred and difficult to test.

[0004] In addition, after the chip is tested in a high temperature environment, the next test needs to be performed in a low temperature environment, for example, from high temperature to normal temperature, from high temperature to low temperature, or from normal temperature to low temperature. The same as above, the temperature of the objective lens is higher than the temperature of the environment where the chip to be tested is located, which may cause condensation or frost on the objective lens, making the objective lens of the test probe card become blurred and difficult to test. Therefore, after the test is completed in a high temperature environment, the same chip testing device cannot perform the next test in a low temperature environment, and at this time, a test probe card specially used for low temperature testing must be replaced to perform the test. SUMMARY

[0005] The present application aims to solve the following technical problems: when low temperature testing is performed, condensation or frost may be generated on the objective lens, which makes the objective lens become blurred and difficult to test; and after the test is completed in a high temperature environment, the next test needs to be performed in a low temperature environment, and condensation or frost may be generated on the objective lens, which makes the objective lens become blurred and difficult to test.

[0006] In order to achieve the above-mentioned purpose, the present application provides a test interface structure, which comprises: a substrate, the substrate is used to be arranged above a chip carrying platform and is used to be installed at the bottom of a light source provider; the substrate is provided with a plurality of spaced-apart and through-extended openings, the openings are provided with light-transmitting partition structures, the partition structures are configured to form a first partition space with a dry environment between the partition structures and the light source provider, and the partition structures are further configured to form a second partition space between the partition structures and the chip carrying platform, which allows dry gas to be filled or vacuumized; and a plurality of objective lenses, the plurality of objective lenses are one-to-one correspondingly installed in the plurality of openings, and the objective lenses are located above the bottom surface of the partition structures.

[0007] In some embodiments, the first partitioned space is configured to allow its dry environment to be maintained in a manner of continuously filling with dry gas.

[0008] In some embodiments, the partitioning structure comprises a first light-transmissive plate, and a peripheral portion of the first light-transmissive plate is sealingly connected with the hole wall of the opening.

[0009] In some embodiments, the first light-transmissive plate is a glass plate or a filter plate.

[0010] In some embodiments, the first light-transmissive plate is located at a middle portion or a bottom end of the opening.

[0011] In some embodiments, the test interface structure further comprises a second light-transmissive plate sealingly installed in the opening, and a first partitioned space with a dry environment is formed between the second light-transmissive plate and the first light-transmissive plate, wherein the dry environment is formed in a manner of filling with dry gas or being vacuumized.

[0012] In some embodiments, the test interface structure further comprises a second light-transmissive plate sealingly installed in the opening, and a sealing space is formed between the second light-transmissive plate and the first light-transmissive plate, and the sealing space is filled with dry gas or is in a vacuum state.

[0013] In some embodiments, the second light-transmissive plate is located at a middle portion or a top end of the opening, and a distance between the second light-transmissive plate and the top end of the opening is less than a distance between the first light-transmissive plate and the top end of the opening.

[0014] In some embodiments, the objective lens is located between the second light-transmissive plate and the first light-transmissive plate.

[0015] In some embodiments, the objective lens is located between the second light-transmissive plate and the top end of the opening.

[0016] In some embodiments, the second light-transmissive plate is a glass plate or a filter plate.

[0017] In some embodiments, a diameter of the opening gradually decreases from top to bottom.

[0018] The present application also provides a chip testing device, which comprises a light source provider, a chip bearing platform, and the above-mentioned test interface structure, the substrate is installed at a bottom of the light source provider, the objective lens can focus light provided by the light source provider, the light source provider and the test interface structure are located above the chip bearing platform, and the chip bearing platform can bear and fix the chip to be tested.

[0019] The above technical solutions of the present application have the following beneficial effects:

[0020] When the low-temperature test is performed, or after the high-temperature environmental test is completed and the next test is performed at a lower temperature, the second partition space can be filled with dry gas or vacuumized to keep the second partition space in a dry environment, so as to prevent moisture in the air from adhering to the bottom surface of the partition structure to generate condensation or frost, ensure the clear field of view of the objective lens and facilitate the test; meanwhile, the first partition space has a dry environment, which can also provide isolation and protection for the objective lens, further prevent the objective lens and the partition structure from generating condensation or frost due to temperature reduction, make the field of view of the objective lens clear and facilitate the test, and the test does not need to use a special test probe card for low-temperature test. Therefore, the test interface structure of the application can make the field of view of the objective lens clear and facilitate the test. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a schematic diagram of a test interface structure in an embodiment of the application;

[0022] Figure 2 is a schematic diagram of a chip test device in an embodiment of the application;

[0023] Figure 3 is a schematic diagram of a test interface structure in another embodiment of the application;

[0024] Figure 4 is a schematic diagram of a test interface structure in another embodiment of the application;

[0025] Figure 5 is a schematic diagram of a test interface structure in another embodiment of the application;

[0026] Figure 6 is a schematic diagram of a test interface structure in another embodiment of the application;

[0027] Figure 7 is a schematic diagram of a test interface structure in another embodiment of the application.

[0028] BRIEF DESCRIPTION OF DRAWINGS

[0029] 1, substrate; 11, opening; 12, first partition space; 13, second partition space; 14, sealed space; 15, second light-transmitting plate; 16, probe;

[0030] 2, partition structure; 21, first light-transmitting plate;

[0031] 3, objective lens;

[0032] 4, light source provider;

[0033] 5, chip carrying platform;

[0034] 6, chip to be tested. DETAILED DESCRIPTION

[0035] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present invention and not to limit the present invention. For those skilled in the art, the present invention can be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the invention.

[0036] Typically, in this field, the high-temperature, room-temperature, and low-temperature environments of the chip under test (DUT) are provided by the chip carrier platform 5. The chip carrier platform 5 is internally equipped with a temperature regulation device, enabling it to heat, cool, or maintain a room temperature, thus allowing the DUT to operate in high-temperature, room-temperature, or low-temperature environments. When the DUT is in a low-temperature environment, the surrounding environment will also be at a low temperature. The light source provider 4 generates a large amount of heat during prolonged operation, which is conducted to the objective lens, raising its temperature. This results in the objective lens temperature being higher than the ambient temperature of the DUT. Therefore, if the humidity of the DUT's environment is slightly high, condensation or frost may form on the objective lens, causing it to become blurry and difficult to test. Furthermore, when the DUT is tested in a higher-temperature environment and then needs to be tested in a lower-temperature environment, such as from high temperature to room temperature, from high temperature to low temperature, or from room temperature to low temperature, the same situation occurs: the objective lens temperature will be higher than the ambient temperature of the DUT, potentially causing condensation or frost on the objective lens, blurring the objective lens of the test probe card and making testing difficult. Therefore, after completing the test in a higher temperature environment, the same chip testing equipment cannot perform the next test in a lower temperature environment. At this time, it is necessary to replace it with a test probe card specifically designed for low temperature testing.

[0037] like Figure 1 and Figure 2 As shown, the present invention provides a test interface structure, which includes a substrate 1 and a plurality of objective lenses 3. The substrate 1 is disposed above a chip carrier platform 5 and mounted on the bottom of a light source provider 4. The substrate 1 has a plurality of spaced and through-holes 11, each of which has a light-transmitting partition structure 2. The partition structure 2 is configured to form a first partition space 12 with a dry environment between itself and the light source provider 4, and is also configured to form a second partition space 13 between itself and the chip carrier platform 5, allowing the filling of dry gas or the evacuation. The plurality of objective lenses 3 are mounted one-to-one in the plurality of openings 11, and the objective lenses 3 are located above the bottom surface of the partition structure 2.

[0038] Specifically, the substrate 1 is provided with a plurality of through holes 11 which are distributed at intervals and extend through the substrate 1, and the through holes 11 are provided with a partition structure 2 which allows light to pass through. When the substrate 1 is installed at the bottom of the light source provider 4, the substrate 1 and the partition structure 2 can separate the space between the light source provider 4 and the chip carrier platform 5. Among them, a first separation space 12 can be formed between the partition structure 2 and the light source provider 4, that is, the first separation space 12 is close to the light source provider 4; a second separation space 13 can be formed between the partition structure 2 and the chip carrier platform 5, that is, the second separation space 13 is close to the chip carrier platform 5 and the chip under test 6; and the partition structure 2 separates the first separation space 12 and the second separation space 13 to prevent gas convection from occurring in the first separation space 12 and the second separation space 13. The objective lens 3 is installed in the through hole 11, and the objective lens 3 is located above the bottom surface of the partition structure 2, so the partition structure 2 also separates the objective lens 3 and the second separation space 13, and the second separation space 13 can be filled with dry gas or vacuumized to form a dry environment with low thermal conductivity, reduce water vapor condensation, and prevent heat conduction, thereby preventing the partition structure 2 from producing condensation or frost due to temperature reduction, keeping the field of view of the objective lens 3 clear. Moreover, the objective lens 3 can be located in the first separation space 12 or above the first separation space 12, and the first separation space 12 has a dry environment with low thermal conductivity, which can also reduce water vapor condensation and prevent heat conduction, so the first separation space 12 can also provide isolation protection for the objective lens 3, further preventing the objective lens 3 and the partition structure 2 from producing condensation or frost due to temperature reduction in the first separation space 12 and the second separation space 13, keeping the field of view of the objective lens 3 clear.

[0039] Therefore, in the embodiment, when low-temperature testing is performed, or after high-temperature environmental testing is completed and the next test is performed at a lower temperature, the second separation space 13 can be filled with dry gas or vacuumized to keep the second separation space 13 in a dry environment, thereby preventing moisture in the air from adhering to the bottom surface of the partition structure 2 to produce condensation or frost, ensuring that the field of view of the objective lens 3 is clear and facilitating testing. At the same time, the first separation space 12 has a dry environment, which can also provide isolation protection for the objective lens 3, further preventing the objective lens 3 and the partition structure 2 from producing condensation or frost due to temperature reduction, keeping the field of view of the objective lens 3 clear and facilitating testing, and without the need to replace a test probe card specially used for low-temperature testing to perform testing. Therefore, the test interface structure of the present application can keep the field of view of the objective lens 3 clear and facilitate testing.

[0040] In some embodiments, when the dry environment is formed by filling with dry gas, the dry gas can be inert gas or nitrogen, or a combination of the two in any suitable ratio.

[0041] In some embodiments of the present application, the first partition space 12 is configured to allow the dry environment thereof to be maintained in a manner of continuously charging dry gas.

[0042] Specifically, when the low-temperature test is performed, or after the higher-temperature environmental test is completed and the next test is performed at a lower temperature, the first partition space 12 can be continuously charged with dry gas, so as to cause the first partition space 12 to have a positive pressure environment, and the air with moisture in the first partition space 12 is continuously discharged, so as to maintain the dry environment of the first partition space 12. At the same time, if the objective lens 3 has fog on one side of the first partition space 12, the fog of the objective lens 3 can also be blown dry due to the continuous charging of dry air.

[0043] As shown in FIG. 1, in some embodiments of the present application, the partition structure 2 comprises a first light-transmitting plate 21, and the outer peripheral portion of the first light-transmitting plate 21 is sealingly connected with the hole wall of the opening 11. Figures 1 to 7

[0044] Specifically, the first partition space 12 is located between the first light-transmitting plate 21 and the light source provider 4, the second partition space 13 is located between the first light-transmitting plate 21 and the chip-bearing platform 5, and the objective lens 3 is arranged above the bottom surface of the first light-transmitting plate 21.

[0045] In some embodiments, the first light-transmitting plate 21 can be one or more. In some embodiments, when there are more than one first light-transmitting plate 21, the adjacent two first light-transmitting plates 21 can be arranged in abutment with each other or in a spaced manner.

[0046] In some embodiments of the present application, the first light-transmitting plate 21 is a glass plate or a filter plate.

[0047] Specifically, the glass plate has a good light-transmitting effect, which does not affect the light intensity and the light path, so as to ensure the signal accuracy. The filter plate can filter stray light, improve the light signal intensity, adjust the light color and spectrum, so as to ensure the signal accuracy. Of course, the first light-transmitting plate 21 can also adopt other light-transmitting plate members capable of achieving the above technical effects, and the present application does not make any limitation.

[0048] In some embodiments, in order to further improve the light-transmitting effect, the first light-transmitting plate 21 can be a light-transmitting plate member with a uniform thickness.

[0049] In some other embodiments, the first light-transmitting plate 21 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being recessed; or the first light-transmitting plate 21 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being protruded; or the first light-transmitting plate 21 can also be a light-transmitting plate member with one of the top surface and the bottom surface being recessed and the other being protruded.

[0050] ​In some embodiments of the present application, at least a portion of the partition structure 2 is located at the middle of the opening 11. For example, in some embodiments, a portion of the partition structure 2 is located at the middle of the opening 11, and another portion of the partition structure 2 is located at the bottom end of the opening 11. For another example, in some embodiments, the partition structure 2 is located entirely at the middle of the opening 11.

[0051] As shown in FIG. 1, in some embodiments of the present application, the first light-transmissive plate 21 is located at the middle of the opening 11 or at the bottom end of the opening 11. Figures 1 to 7

[0052] Specifically, as long as at least a portion of the first light-transmissive plate 21 is located at the middle of the opening 11, it is considered that the first light-transmissive plate 21 is located at the middle of the opening 11. In some embodiments, the distance between the middle of the opening 11 and the bottom end of the opening 11 is greater than the thickness of the first light-transmissive plate 21.

[0053] As shown in FIG. 1, in some embodiments of the present application, the test interface structure further comprises a second light-transmissive plate 15 sealingly installed in the opening 11, and a first partition space 12 with a dry environment is formed between the second light-transmissive plate 15 and the first light-transmissive plate 21, wherein the dry environment is formed by filling dry gas or vacuumizing. Figures 4 to 5 Specifically, the second light-transmissive plate 15 cooperates with the first light-transmissive plate 21 to form the first partition space 12, and the first partition space 12 is a relatively closed space, which can further improve the isolation and protection effect of the objective lens 3. In some embodiments, for the space between the second light-transmissive plate 15 and the light source provider 4, the dry environment can still be formed by filling dry gas or vacuumizing, further reducing water vapor condensation and preventing heat conduction.

[0054] As shown in FIG. 1, in some embodiments of the present application, the test interface structure further comprises a second light-transmissive plate 15 sealingly installed in the opening 11, and a sealing space 14 is formed between the second light-transmissive plate 15 and the first light-transmissive plate 21, the sealing space 14 is filled with dry gas or in a vacuum state, so that the first partition space 12, the sealing space 14, and the second partition space 13 are all in a dry state.

[0055] Figures 6 to 7

[0056] ​​​Specifically, the first partition space 12 is formed between the first light-transmitting plate 21 and the light source provider 4, and the sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21, so the sealed space 14 belongs to a part of the first partition space 12. And the sealed space 14 can further improve the isolation and protection effect on the objective lens 3. Wherein, the part of the first partition space 12 except the sealed space 14 is defined as an external space, and the external space and the sealed space 14 can be dried in the same or different way. For example, the external space and the sealed space 14 are both dried by filling dry gas. For another example, the external space is dried by filling dry gas, and the sealed space 14 is dried by vacuumizing.

[0057] As shown in Figures 4 to 7 some embodiments of the present application, the second light-transmitting plate 15 is located at the middle or the top of the opening 11, and the distance between the second light-transmitting plate 15 and the top of the opening 11 is less than the distance between the first light-transmitting plate 21 and the top of the opening 11.

[0058] Specifically, the second light-transmitting plate 15 is located above the first light-transmitting plate 21, and the two are spaced apart to form the first partition space 12 or the sealed space 14 between them.

[0059] As shown in Figure 4 and Figure 6 some embodiments of the present application, the objective lens 3 is located between the second light-transmitting plate 15 and the first light-transmitting plate 21.

[0060] Specifically, the second light-transmitting plate 15 can be located at the top of the opening 11, and the first light-transmitting plate 21 can be located at the middle of the opening 11, so that the first partition space 12 or the sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21, extending from the middle of the opening 11 to the top of the opening 11. And the objective lens 3 can be closer to the first light-transmitting plate 21. The first partition space 12 or the sealed space 14 can form a dry environment by filling dry gas or vacuumizing, so that the objective lens 3 is located in the dry environment, ensuring the clear vision of the objective lens 3. And the space between the second light-transmitting plate 15 and the light source provider 4 can also form a dry environment by filling dry gas or vacuumizing, reducing water vapor condensation and preventing heat conduction.

[0061] As shown in Figure 5 and Figure 7 some embodiments of the present application, the objective lens 3 is located between the second light-transmitting plate 15 and the top of the opening 11.

[0062] Specifically, the first light-transmitting plate 21 and the second light-transmitting plate 15 are both located at the middle part of the opening 11, and the second light-transmitting plate 15 is located above the first light-transmitting plate 21 and spaced apart from the first light-transmitting plate 21, and the first partition space 12 or the sealed space 14 is formed between the first light-transmitting plate 21 and the second light-transmitting plate 15. The first partition space 12 or the sealed space 14 can form a dry environment by filling dry gas or vacuumizing. The objective lens 3 is located above the second light-transmitting plate 15, and the objective lens 3 can be closer to the second light-transmitting plate 15 relative to the top end of the opening 11. The space between the second light-transmitting plate 15 and the light source provider 4 can also form a dry environment by filling dry gas or vacuumizing, so as to reduce water vapor condensation and prevent heat conduction.

[0063] In some embodiments of the present application, the second light-transmitting plate 15 is a glass plate or a filter plate.

[0064] Specifically, the glass plate has good light-transmitting effect, which does not affect the light intensity and the light path, so as to ensure the signal accuracy. The filter plate can filter stray light and improve the light brightness, so as to ensure the signal accuracy. Of course, the second light-transmitting plate 15 can also adopt other light-transmitting plate members capable of achieving the above technical effects, and the present application does not make any limitation.

[0065] In some embodiments, in order to further improve the light-transmitting effect, the second light-transmitting plate 15 can be a light-transmitting plate member with uniform thickness.

[0066] In some other embodiments, the second light-transmitting plate 15 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being recessed; or the second light-transmitting plate 15 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being protruded; or the second light-transmitting plate 15 can also be a light-transmitting plate member with one of the top surface and the bottom surface being recessed and the other being protruded.

[0067] In some embodiments of the present application, the diameter of the opening 11 gradually decreases from top to bottom. On the one hand, it is convenient to install the objective lens 3 from the top end of the opening 11; on the other hand, it reduces the capacity of the opening 11, so that the opening 11 is convenient to be quickly filled with dry gas or vacuumized.

[0068] In some other embodiments, the opening 11 can also be a cylindrical hole, a hole with a diameter gradually increasing from top to bottom, or a polygonal hole, and the present application does not make any limitation.

[0069] In some embodiments of the present application, the bottom of the substrate 1 is also provided with a plurality of probes 16.

[0070] The application further provides a chip testing device, which comprises the light source provider 4, the chip bearing platform 5 and the testing interface structure of the above embodiment, the substrate 1 is installed at the bottom of the light source provider 4, the objective lens 3 can focus the light provided by the light source provider 4, the light source provider 4 and the testing interface structure are located above the chip bearing platform 5, and the chip bearing platform 5 can bear and fix the chip 6 to be tested.

[0071] Specifically, the first separation space 12 is formed between the separation structure 2 and the light source provider 4, the second separation space 13 is formed between the separation structure 2 and the chip bearing platform 5, and the separation structure 2 separates the first separation space 12 and the second separation space 13 to prevent the gas convection in the first separation space 12 and the second separation space 13. The second separation space 13 can be filled with dry gas or vacuumized to prevent the condensation or frosting of the separation structure 2 due to the temperature reduction, so that the field of view of the objective lens 3 is clear. The objective lens 3 can be located in the first separation space 12 or above the first separation space 12, and the first separation space 12 with the dry environment can provide isolation protection for the objective lens 3, and further prevent the condensation or frosting of the objective lens 3 and the separation structure 2 due to the temperature reduction in the first separation space 12 and the second separation space 13, so that the field of view of the objective lens 3 is clear.

[0072] The principles and implementation manners of the application are described by using specific examples in the present application, and the above examples are only used to help understand the method of the application and its core idea. The above is only the preferred embodiment of the application, and it should be pointed out that, due to the limitation of the expression, there are infinite specific structures, and for ordinary skilled persons in the technical field, some improvements, decorations or changes can be made without departing from the principles of the application, and the above technical features can be combined in an appropriate manner; the improvements, decorations, changes or combinations, or the direct application of the concepts and technical solutions of the application to other occasions without improvement, should be regarded as the protection scope of the application.

Claims

1. A test interface structure, characterized in that, include: A substrate (1) is disposed above a chip carrier platform (5) and mounted on the bottom of a light source provider (4); the substrate (1) has a plurality of spaced and through openings (11), each opening (11) having a light-transmitting partition structure (2), the partition structure (2) being configured to form a first partition space (12) with a dry environment between itself and the light source provider (4), and the partition structure (2) being further configured to form a second partition space (13) between itself and the chip carrier platform (5) allowing the filling of dry gas or the evacuation; and Multiple objectives (3) are installed in multiple openings (11) in a one-to-one correspondence, and the objectives (3) are located above the bottom surface of the partition structure (2); The separation structure (2) separates the first separation space (12) and the second separation space (13) to prevent gas convection from occurring in the first separation space (12) and the second separation space (13).

2. The test interface structure according to claim 1, characterized in that, The first partition space (12) is configured to allow its dry environment to be maintained by continuously filling it with dry gas.

3. The test interface structure according to claim 1, characterized in that, The partition structure (2) includes a first light-transmitting plate (21), the outer periphery of which is sealed to the wall of the opening (11).

4. The test interface structure according to claim 3, characterized in that, The first light-transmitting plate (21) is a glass plate or a filter plate.

5. The test interface structure according to claim 3, characterized in that, The first light-transmitting plate (21) is located at the middle or bottom of the opening (11).

6. The test interface structure according to claim 5, characterized in that, The test interface structure also includes a second light-transmitting plate (15) sealed and installed in the opening (11), and a first partition space (12) with a dry environment is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), wherein the dry environment is formed by filling with dry gas or by vacuuming.

7. The test interface structure according to claim 5, characterized in that, The test interface structure also includes a second light-transmitting plate (15) sealed and installed in the opening (11), and a sealed space (14) is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), and the sealed space (14) is filled with dry gas or is in a vacuum state.

8. The test interface structure according to claim 6 or 7, characterized in that, The second light-transmitting plate (15) is located at the middle or top of the opening (11), and the distance between the second light-transmitting plate (15) and the top of the opening (11) is less than the distance between the first light-transmitting plate (21) and the top of the opening (11).

9. The test interface structure according to claim 8, characterized in that, The objective lens (3) is located between the second light-transmitting plate (15) and the first light-transmitting plate (21).

10. The test interface structure according to claim 6 or 7, characterized in that, The objective lens (3) is located between the second light-transmitting plate (15) and the top of the opening (11).

11. The test interface structure according to claim 6, characterized in that, The second light-transmitting plate (15) is a glass plate or a filter plate.

12. The test interface structure according to any one of claims 1-7, characterized in that, The diameter of the opening (11) gradually decreases from top to bottom.

13. A chip testing device, characterized in that, The device includes a light source provider (4), a chip carrier platform (5), and a test interface structure according to any one of claims 1-12. The substrate (1) is mounted on the bottom of the light source provider (4), the objective lens (3) is capable of focusing the light provided by the light source provider (4), the light source provider (4) and the test interface structure are located above the chip carrier platform (5), and the chip carrier platform (5) is capable of supporting and fixing the chip under test (6).

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