Head-mounted device

Abstract

The embodiment of the invention provides a head-mounted device. The head-mounted device comprises: a metal middle frame; the main board is arranged on the first side of the metal middle frame; the first camera and the second camera are arranged on the first side of the metal middle frame, and the first camera and the second camera are not overlapped with the mainboard in the direction perpendicular to the metal middle frame; the screen is located on the second side, opposite to the first side, of the metal middle frame. By adopting the metal middle frame, the mainboard, the first camera and the second camera are arranged on the same side of the metal middle frame, and are positioned on the same level without overlapping, so that the light and thin design of the head-mounted equipment can be realized.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of electronic devices, and more particularly, to head-mounted devices. Background Art

[0002] With the development of technologies such as augmented reality (AR) and virtual reality (VR), the application scope of head-mounted devices (e.g., VR glasses, etc.) is becoming wider and wider. Being thin and light and having good heat dissipation have always been important aspects and difficulties of head-mounted devices, and further improvements in this regard are expected. Summary of the Invention

[0003] This Summary of the Invention section is provided to introduce concepts in a brief form, which will be described in detail in the following Detailed Description section. This Summary of the Invention section is not intended to identify key features or essential features of the claimed technical solutions, nor is it intended to be used to limit the scope of the claimed technical solutions.

[0004] To solve the above problems, embodiments of the present disclosure provide a head-mounted device, including: a metal middle frame; a main board disposed on a first side of the metal middle frame; a first camera and a second camera disposed on the first side of the metal middle frame, and the first camera and the second camera do not overlap with the main board in a direction perpendicular to the metal middle frame; and a screen located on a second side of the metal middle frame opposite to the first side.

[0005] By adopting a metal middle frame, the present disclosure disposes the main board, the first camera and the second camera on the same side of the metal middle frame and at the same level without overlapping. Thus, it is beneficial to achieve a thin and light design of the head-mounted device. Brief Description of the Drawings

[0006] To more clearly illustrate the solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0007] Figure 1 Shows a schematic diagram of the structured module of an existing head-mounted device.

[0008] Figure 2 Shows a three-dimensional schematic diagram of the structured module of a head-mounted device according to some embodiments.

[0009] Figure 3 Shows a three-dimensional schematic diagram of the structured module of a head-mounted device according to some embodiments.

[0010] Figure 4Shows a cross-sectional schematic diagram of a structured module of a head-mounted device according to some embodiments. Detailed implementation

[0011] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Instead, these embodiments are provided to more thoroughly and completely understand the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not used to limit the protection scope of the present disclosure.

[0012] As used herein, the term "including" and its variations are open-ended, that is, "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0013] It should be noted that the concepts such as "first" and "second" mentioned in the present disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence relationship of the functions performed by these devices, modules or units.

[0014] It should be noted that the modifications of "one" and "multiple" mentioned in the present disclosure are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0015] Because head-mounted devices (HMDs) such as VR glasses need to process a large amount of content in aspects such as images and rendering, the power consumption of the whole machine is relatively large, and a large amount of heat will be generated. Ordinary passive heat dissipation is difficult to effectively solve the heat generation problem of the whole machine, and usually fans etc. are required for active heat dissipation. In conventional designs, a stacked method is usually adopted, and the active heat dissipation system (including a fan and a metal radiator) is stacked above the main board and the processor. Figure 1 Shows a schematic diagram of a structured module of an existing head-mounted device. In this stacking and heat dissipation method, because the main components are stacked, the total thickness of the HMD is relatively large, and the space utilization rate inside the fuselage is insufficient, making it impossible to achieve an ultra-thin design. With the continuous application of mixed reality (MR) scenarios, modules such as RGB cameras and time-of-flight (TOF) depth cameras will also be added to the head-mounted device. The traditional method is to directly stack above the heat dissipation system (as Figure 1 shown), resulting in a further increase in the thickness of the HMD. Therefore, in order to reduce the overall thickness of the HMD, improve the space utilization rate and the heat dissipation performance of the whole machine, a new HMD architecture and heat dissipation method are needed.

[0016] Figure 2 A three-dimensional schematic diagram of a structured module of a head-mounted device according to some embodiments is shown. In some embodiments, as Figure 2 shown, the head-mounted device includes a metal middle frame, a main board, a screen, a camera, etc. In some embodiments, the metal middle frame can sometimes also be referred to as a middle frame bracket or a bracket, and the metal of the metal middle frame can include copper, iron, etc. In some embodiments, the main board is disposed on the first side ( Figure 2 the upper side in ). In some embodiments, the main board can be in direct contact with the metal middle frame. Figure 2 Independent screens 1 and 2 are shown in , but it should be understood that this is only exemplary, and screens 1 and 2 can be parts of an integral screen. In some embodiments, the screen is used in the head-mounted device to display images. In some embodiments, the screen is located on the second side ( Figure 2 the lower side in ) opposite to the first side of the metal middle frame.

[0017] In some embodiments, a first camera (e.g., Figure 2 the video see-through (VST) camera 1 in ) and a second camera (e.g., a depth camera) are disposed on the first side of the metal middle frame. It should be understood that although Figure 2 two VST cameras and one depth camera are shown in , this is only exemplary, and the head-mounted device can include more or fewer cameras, e.g., 1, 2, 4, etc. In some embodiments, the first camera and the second camera do not overlap with the main board in a direction perpendicular to the metal middle frame, that is, the cameras of the present disclosure are not stacked with the main board. By adopting the metal middle frame, the main board, the first camera, and the second camera are disposed on the same side of the metal middle frame and at the same level without overlapping. Thus, it is beneficial to achieve a thin and light design of the head-mounted device. Additionally, by adopting the metal middle frame, the area of uniform temperature is increased, the heat capacity is increased, and the heat dissipation ability under transient high-load conditions is improved. In the conventional design, a heat sink plus a cooling fan are used. Because the volume of the heat sink is limited and the thermal resistance between the heat sink and the CPU is large, it is less adaptable to instantaneous high-load scenarios and often requires the fan to continuously rotate at a high speed. The high-speed rotating fan is also not conducive to reducing wind noise and affects the user experience.

[0018] The metal middle frame of the present disclosure is an integrated middle frame. By reusing the middle frame as a radiator, the need for a separate radiator is eliminated, and the overall thickness of the head-mounted device is reduced.

[0019] In some embodiments, according to different height requirements, the metal middle frame can have bosses or depressions at positions corresponding to the main board, the first camera, and / or the second camera, such that the tops of the main board, the first camera, and the second camera are at the same horizontal plane, facilitating installation and structural stability.

[0020] In some embodiments, the head-mounted device may further include a heat pipe embedded in the metal middle frame. In some embodiments, the heat pipe may be completely embedded in the metal middle frame or only partially embedded in the metal middle frame, with part of the heat pipe exposed outside the metal middle frame. By using the heat pipe, it is beneficial to promote the heat dissipation of the metal middle frame. In some embodiments, the heat pipe includes a copper pipe.

[0021] Figure 3 A three-dimensional schematic diagram of the structured module of the head-mounted device according to some embodiments is shown. Figure 4 A cross-sectional schematic diagram of the structured module of the head-mounted device according to some embodiments is shown. In some embodiments, the metal middle frame includes a first fin portion and a second fin portion, and the first fin portion and the second fin portion are located on both sides of the metal middle frame in the horizontal direction. In some embodiments, as Figure 3 and Figure 4 shown, during the wearing of the head-mounted device, the line connecting the first fin portion and the second fin portion is in the same direction as the line connecting the two eyes, that is, the first fin portion and the second fin portion are located on the left and right sides of the metal middle frame. For example, the first fin portion is located on the left side and the second fin portion is located on the right side.

[0022] In some embodiments, as Figure 3 and Figure 4 shown, the head-mounted device further includes a first fan and a second fan. The first fan and the second fan are arranged on the second side of the metal middle frame. The first fan corresponds to the first fin portion, and the second fan corresponds to the second fin portion. In this way, the heat generated by the first camera, the second camera, and the main board arranged on the metal middle frame can be quickly dissipated through the fin portions of the metal middle frame. In addition, the first fan and the second fan are arranged on the second side of the metal middle frame, without occupying the space on the first side of the metal middle frame, which is also beneficial to the thin and light design of the head-mounted device.

[0023] In some embodiments, as Figure 3 and Figure 4 shown, the first fan and the second fan blow air towards the first side of the metal middle frame. The first fan blows air towards the first fin portion, and the second fan blows air towards the second fin portion. In this way, it can help quickly dissipate the heat conducted from other parts of the metal middle frame to the first fin portion and the second fin portion.

[0024] In some embodiments, as Figure 3 and Figure 4As shown, the air duct is located on the second side of the metal middle frame, and the air duct passes through the metal middle frame and the screen. In this way, when the first fan and the second fan blow air, the air in the air duct can pass through the metal middle frame and the screen, thereby helping to dissipate the heat of the metal middle frame and the screen. Therefore, in addition to being able to quickly dissipate the heat generated in the CPU, camera, and motherboard, the present disclosure can also quickly dissipate the heat generated by the screen, which is beneficial to improving the performance and lifespan of the screen.

[0025] In some embodiments, as Figure 4 shown, the head-mounted device further includes a processor CPU disposed on the motherboard, and the metal middle frame is connected to the processor through a heat-conducting material. In this way, the heat generated in the CPU can be quickly dissipated through the metal middle frame. In some embodiments, the heat-conducting material may include thermal grease, copper foil, etc.

[0026] In some other embodiments, the metal middle frame includes a fin portion, and the fin portion is located at the top of the head-mounted device (not shown), and during the wearing of the head-mounted device, the top is aligned with the orientation of the top of the head. In this embodiment, the head-mounted device further includes a fan, and the fan is disposed on the fin portion. That is, different from the above embodiments, in the above embodiments, the fin portion and the fan of the metal middle frame are disposed on the left and right sides, and in this embodiment, the fin portion and the fan are disposed at the top of the head-mounted device (for example, in the middle of the top). In this way, the fan is not stacked with the motherboard, camera, etc., which is also beneficial to reducing the thickness of the head-mounted device.

[0027] In some embodiments, the heat-conducting tube embedded in the metal middle frame extends to the fin portion. By extending the heat-conducting tube embedded in the metal middle frame to the fin portion, the heat dissipation of the metal middle frame can be promoted.

[0028] In some embodiments, the head-mounted device further includes an air inlet at the bottom of the head-mounted device, and the bottom is opposite to the top. In some embodiments, the air duct between the air inlet and the fin portion is located on the second side of the metal middle frame. In some embodiments, the air duct passes through the metal middle frame and the screen. Similarly, in this way, the heat in the metal middle frame and the screen can be quickly dissipated.

[0029] The fan of the present disclosure is not placed at the front (first side) of the metal middle frame, saving the space at the front of the metal middle frame (between the metal middle frame and the front cover plate), which is beneficial to reducing the thickness of the head-mounted device. In addition, the present disclosure realizes the overall heat dissipation of the head-mounted device, rather than only dissipating the heat of the CPU. The camera and the motherboard are directly disposed on the first side of the metal middle frame, which is beneficial to the heat dissipation of the camera and the motherboard. In addition, the air duct of the present disclosure passes through the screen, facilitating heat dissipation of the screen.

[0030] According to one or more embodiments of the present disclosure, a head-mounted device is provided, including: a metal middle frame; a main board disposed on a first side of the metal middle frame; a first camera and a second camera disposed on the first side of the metal middle frame, wherein the first camera and the second camera do not overlap with the main board in a direction perpendicular to the metal middle frame; and a screen located on a second side of the metal middle frame opposite to the first side.

[0031] According to one or more embodiments of the present disclosure, the head-mounted device further includes: a heat pipe embedded in the metal middle frame.

[0032] According to one or more embodiments of the present disclosure, the metal middle frame includes a first fin portion and a second fin portion, the first fin portion and the second fin portion are located on two sides of the metal middle frame in the horizontal direction, and during the wearing of the head-mounted device, the line connecting the first fin portion and the second fin portion is in the same direction as the line between two eyes; wherein, the head-mounted device further includes a first fan and a second fan, the first fan and the second fan are disposed on the second side of the metal middle frame, the first fan corresponds to the first fin portion, and the second fan corresponds to the second fin portion.

[0033] According to one or more embodiments of the present disclosure, the first fan and the second fan blow air towards the first side of the metal middle frame, the first fan blows air towards the first fin portion, and the second fan blows air towards the second fin portion.

[0034] According to one or more embodiments of the present disclosure, an air duct is located on the second side of the metal middle frame, and the air duct passes through the metal middle frame and the screen.

[0035] According to one or more embodiments of the present disclosure, the head-mounted device further includes a processor disposed on the main board, and the metal middle frame is connected to the processor through a heat-conducting material.

[0036] According to one or more embodiments of the present disclosure, the metal middle frame includes a fin portion, the fin portion is located at the top of the head-mounted device, and during the wearing of the head-mounted device, the top is in the same orientation as the top of the head; wherein, the head-mounted device further includes a fan, and the fan is disposed on the fin portion.

[0037] According to one or more embodiments of the present disclosure, the heat pipe embedded in the metal middle frame extends to the fin portion.

[0038] According to one or more embodiments of the present disclosure, the head-mounted device further includes an air inlet located at the bottom of the head-mounted device, the bottom being opposite to the top, wherein the air duct between the air inlet and the fin portion is located on the second side of the metal middle frame.

[0039] According to one or more embodiments of the present disclosure, the air duct passes through the metal middle frame and the screen.

[0040] The above description is only a preferred embodiment of the present disclosure and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of disclosure involved in the present disclosure is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosure concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) having similar functions disclosed in the present disclosure.

[0041] In addition, although the operations are depicted in a particular order, this should not be construed as requiring that the operations be performed in the particular order shown or in sequential order. In certain circumstances, multitasking and parallel processing may be advantageous. Similarly, although a number of specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the present disclosure. Certain features described in the context of separate embodiments may also be implemented combinatorially in a single embodiment. Conversely, the various features described in the context of a single embodiment may also be implemented separately or in any suitable sub-combination in multiple embodiments.

[0042] Although the subject matter has been described in language specific to structural features and / or methodological acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are merely example forms of implementing the claims.

Claims

1. A head-mounted device, characterized in that, Comprising: A metal middle frame; A main board, disposed on a first side of the metal middle frame; A first camera and a second camera, disposed on the first side of the metal middle frame, and the first camera and the second camera do not overlap with the main board in a direction perpendicular to the metal middle frame; A screen, located on a second side of the metal middle frame opposite to the first side.

2. The head-mounted device according to claim 1, wherein Further comprising: A heat pipe, embedded in the metal middle frame.

3. The head-mounted device according to claim 1, wherein The metal middle frame includes a first fin portion and a second fin portion, the first fin portion and the second fin portion are located on two sides of the metal middle frame in the horizontal direction, and during the wearing of the head-mounted device, the line connecting the first fin portion and the second fin portion is in the same direction as the line connecting the two eyes; Wherein, the head-mounted device further includes a first fan and a second fan, the first fan and the second fan are disposed on the second side of the metal middle frame, the first fan corresponds to the first fin portion, and the second fan corresponds to the second fin portion.

4. The head-mounted device according to claim 3, characterized in that, The first fan and the second fan blow air towards the first side of the metal middle frame, the first fan blows air towards the first fin portion, and the second fan blows air towards the second fin portion.

5. The head-mounted device according to claim 3, wherein An air duct is located on the second side of the metal middle frame, and the air duct passes through the metal middle frame and the screen.

6. The head-mounted device according to claim 1, wherein The head-mounted device further includes a processor disposed on the main board, and the metal middle frame is connected to the processor through a heat-conducting material.

7. The head-mounted device according to claim 1, characterized in that, The metal middle frame includes a fin portion, the fin portion is located at the top of the head-mounted device, and during the wearing of the head-mounted device, the top is in the same orientation as the top of the head; Wherein, the head-mounted device further includes a fan, and the fan is disposed on the fin portion.

8. The head-mounted device according to claim 7, wherein The heat pipe embedded in the metal middle frame extends to the fin portion.

9. The head-mounted device according to claim 7, wherein, Further comprising an air inlet located at the bottom of the head-mounted device, the bottom is opposite to the top, wherein the air duct between the air inlet and the fin portion is located on the second side of the metal middle frame.

10. The head-mounted device according to claim 9, characterized in that, The air duct passes through the metal middle frame and the screen.

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