Connection method applied between signal relay and 1 / 2 crystal cover relay

Abstract

The invention discloses a connection method applied between a signal relay and a 1 / 2 crystal cover relay, and the method comprises the following steps: 1, defining a first pin and an eighth pin as control coil end pins, a second pin and a seventh pin as static closing end pins, a third pin and a sixth pin as common terminals, and a fourth pin and a fifth pin as dynamic closing end pins for a double-row patch type small signal relay; 2, aiming at a 1 / 2 crystal cover sealing electromagnetic relay, defining X1 and X2 pins as control coil end pins, A3 and B3 pins as static closing end pins, A2 and B2 pins as common terminals, and A1 and B1 pins as dynamic closing end pins; and step 3, the small signal relay lead-out pin and the 1 / 2 crystal cover sealing electromagnetic relay lead-out pin are converted through the upper and lower block layer ceramic connection circuit boards. According to the method, connection between a small signal relay product and a 1 / 2 crystal cover sealing relay is completed on the basis that pin definition is not directly changed.

Description

Technical Field

[0001] The present invention belongs to the field of hermetically sealed electromagnetic relay design, and relates to a connection method between a signal relay and a metal shell of a small hermetically sealed electromagnetic relay, specifically to a connection method applied between a signal relay and a 1 / 2 crystal cover relay. Background Art

[0002] Hermetically Sealed Electromagnetic Relay is a key command device in aerospace systems and a component with a relatively high proportion in the payloads of spacecraft and aircraft components.

[0003] In recent years, with the continuous development of industries such as deep space exploration and civil large aircraft, the usage of hermetically sealed electromagnetic relays has also increased significantly. Civil hermetically sealed electromagnetic relays have the characteristics of high reliability, low cost, and high consistency. Applying them to the aerospace field can greatly reduce engineering costs and improve the service life of equipment.

[0004] Applying a civil small signal relay to the aerospace field requires hermetically sealing it. Since the pin definitions and positions of the small signal relay and the 1 / 2 crystal cover hermetically sealed electromagnetic relay are different, a connection method needs to be designed to convert its pin definition into the pin definition of the 1 / 2 crystal cover hermetically sealed electromagnetic relay, facilitating rapid metal shell sealing. Improve the performance of connection and sealing, ensure the heat dissipation performance, and achieve ceramic circuit board connection under the condition of meeting the insulation and withstand voltage requirements. Summary of the Invention

[0005] In order to apply a civil small signal relay to the aerospace field and meet the requirements for its pin definition, sealing performance, heat dissipation, and withstand voltage, etc., the present invention provides a connection method applied between a signal relay and a 1 / 2 crystal cover relay. On the basis of ensuring the bidirectional and firm connection of the lead-out pins of the small signal relay, this method realizes the conversion of the pin definition of the small signal relay sealed with a 1 / 2 crystal cover sealed relay, and completes the connection between the small signal relay product and the 1 / 2 crystal cover sealed relay without directly changing the pin definition.

[0006] The object of the present invention is achieved through the following technical solutions:

[0007] A connection method applied between a signal relay and a 1 / 2 crystal cover relay includes the following steps:

[0008] Step 1: For a dual in-line surface-mounted small signal relay, define pin 1 and pin 8 as the control coil end pins, pin 2 and pin 7 as the normally closed end pins, pin 3 and pin 6 as the common terminals, and pin 4 and pin 5 as the normally open end pins;

[0009] Step 2: For the 1 / 2 crystal cover sealed electromagnetic relay, define the X1 and X2 pins as the control coil terminal pins, the A3 and B3 pins as the normally closed terminal pins, the A2 and B2 pins as the common terminals, and the A1 and B1 pins as the normally open terminal pins;

[0010] Step 3: Convert the lead-out pins of the small signal relay and the lead-out pins of the 1 / 2 crystal cover sealed electromagnetic relay through the upper and lower ceramic connection circuit boards. The specific steps are as follows:

[0011] Step 31: Design the corresponding installation positions of the upper ceramic connection circuit board according to the pin dimensions of the small signal relay, and design the corresponding installation positions of the lower ceramic connection circuit board according to the pin dimensions of the 1 / 2 crystal cover sealed electromagnetic relay;

[0012] Step 32: Use the welding method to weld the upper surface of the upper ceramic connection circuit board to the pins of the small signal relay, weld the lower surface of the upper ceramic connection circuit board to the upper surface of the lower ceramic connection circuit board, and weld the lower surface of the lower ceramic connection circuit board to the bottom pins of the metal shell of the 1 / 2 crystal cover sealed electromagnetic relay, so as to realize the conversion of the pin definitions of the small signal relay and the 1 / 2 crystal cover sealed electromagnetic relay: X1-1, X2-8, A1-4, A2-3, A3-2, B1-5, B2-6, B3-7.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] The present invention provides a connection design based on a double-layer ceramic circuit board with good heat dissipation and insulation performance, which is suitable for converting the pin definitions of surface-mounted small signal relays into the pin definitions of through-hole 1 / 2 crystal cover sealed electromagnetic relays. This method can conveniently and quickly realize the conversion of relays by the user without changing the pin definitions, and lay a foundation for the rapid metal shell sealing of small signal relays. Brief Description of the Drawings

[0015] Figure 1 It is a connection flow chart applied to signal relays and 1 / 2 crystal cover relays;

[0016] Figure 2 It is a comparison diagram of the pin definitions of small signal relays and 1 / 2 crystal cover sealed electromagnetic relays, a) pin definitions of small signal relays, b) pin definitions of 1 / 2 crystal cover sealed electromagnetic relays;

[0017] Figure 3 It is a schematic diagram of the dimensions of small signal relays;

[0018] Figure 4 It is a circuit diagram of the upper ceramic connection circuit board;

[0019] Figure 53D schematic diagram of the upper ceramic connection circuit board;

[0020] Figure 6 Circuit diagram of the lower ceramic connection circuit board;

[0021] Figure 7 3D schematic diagram of the lower ceramic connection circuit board;

[0022] Figure 8 Dimension schematic diagram of the 1 / 2 crystal cover sealed electromagnetic relay. Specific implementation manner

[0023] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings, but are not limited thereto. Any modification or equivalent replacement of the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention shall be covered within the protection scope of the present invention.

[0024] The present invention provides a connection method applied between a signal relay and a 1 / 2 crystal cover relay. Under the size limitation of the metal shell of the 1 / 2 crystal cover sealed electromagnetic relay, for a selected small signal relay, according to its surface-mounted pin definition and size, upper and lower ceramic connection circuit boards with good heat dissipation and insulation performance are used for connection design. Due to different pin definition positions, it is necessary to convert the lead-out pins of the injection-molded relay and the lead-out pins of the bottom plate through two ceramic connection circuit boards and ensure their strength. The upper surface of the upper ceramic connection circuit board is connected to the pins of the small signal relay by welding, the lower surface of the upper ceramic connection circuit board is welded to the upper surface of the lower ceramic connection circuit board, and the lower surface of the lower ceramic connection circuit board is welded to the bottom plate pins of the 1 / 2 crystal cover sealed electromagnetic relay metal shell. On the basis of ensuring the bidirectional and firm connection of the lead-out pins of the small signal relay, the pin definition conversion of the small signal relay sealed with a 1 / 2 crystal cover relay is realized. As Figure 1 shown, the specific steps are as follows:

[0025] Step 1: For the dual in-line surface-mounted small signal relay, define pins 1 and 8 as the control coil terminal pins, pins 2 and 7 as the normally closed terminal pins, pins 3 and 6 as the common terminals, and pins 4 and 5 as the normally open terminal pins.

[0026] Step 2: The pin definitions of the 1 / 2 crystal cover sealed electromagnetic relay are different from those of the small signal relay. Define pins X1 and X2 as the control coil terminal pins, pins A3 and B3 as the normally closed terminal pins, pins A2 and B2 as the common terminals, and pins A1 and B1 as the normally open terminal pins.

[0027] Step 3: Due to the different pin definition positions, the lead-out pins of the small signal relay and the lead-out pins of the 1 / 2 crystal cover sealed electromagnetic relay need to be converted through the upper and lower ceramic connection circuit boards, and their strength should be ensured. The upper and lower ceramic connection circuit boards are designed with corresponding installation positions according to the pin sizes of the small signal relay and the 1 / 2 crystal cover sealed electromagnetic relay. The upper and lower ceramic connection circuit boards are connected to the pins of the small signal relay and the bottom pins of the 1 / 2 crystal cover sealed electromagnetic relay by welding. While ensuring the bidirectional and firm connection of the lead-out pins of the small signal relay, the pin definition conversion between the small signal relay and the common 1 / 2 crystal cover sealed electromagnetic relay is realized (X1-1, X2-8, A1-4, A2-3, A3-2, B1-5, B2-6, B3-7).

[0028] In the present invention, according to the technical specifications of the small signal relay, its insulation resistance should be ≥1000 MΩ, and the dielectric withstand voltage should reach 500 Vr.m.s., 50 Hz. In order to meet the withstand voltage and creepage distance requirements of the standard, the minimum width of the copper wires on the upper and lower ceramic connection circuit boards is 30 mils each.

[0029] In the present invention, due to the size limitation of the ceramic connection board, the upper and lower ceramic connection circuit boards are adopted for the connection design. Each ceramic connection circuit board is a double-layer design, and the upper and lower surfaces are connected through through-holes. The upper ceramic connection circuit board converts the pins of the signal relay to both sides of the lower surface of the upper ceramic connection circuit board, preparing for welding with the lower ceramic connection circuit board. The upper and lower ceramic connection circuit boards are connected by reflow soldering. There are a total of eight welding points at the same positions on the left and right sides of the upper and lower ceramic connection circuit boards, corresponding to the pins with the same definitions of the small signal relay and the 1 / 2 crystal cover sealed relay. During welding, solder paste is placed in the holes of the upper ceramic connection circuit board, and it can be welded to the pads on the upper surface of the lower ceramic connection circuit board to realize the conversion of pin definitions. The lower ceramic connection circuit board converts the pin definitions of the small signal relay to the pin definitions of the 1 / 2 crystal cover sealed relay, and its lower surface is welded to the bottom pins of the metal shell of the 1 / 2 crystal cover sealed relay. On the basis of ensuring the bidirectional and firm connection of the lead-out pins of the small signal relay, the pin definition conversion of the small signal relay sealed with the 1 / 2 crystal cover sealed relay is realized, laying a foundation for the rapid metal shell sealing of the small signal relay.

[0030] Embodiment:

[0031] As Figures 2 - 8 shown, the connection steps of the HFD4 type signal relay and the 1 / 2 crystal cover sealed electromagnetic relay are as follows:

[0032] Step 1. The pin definitions of the HFD4 type signal relay are as follows: Pins 1 and 8 are the control coil terminal pins, pins 2 and 7 are the normally closed terminal pins, pins 3 and 6 are the common terminals, and pins 4 and 5 are the normally open terminal pins.

[0033] Step 2. The pin definitions of the 1 / 2 crystal cover sealed electromagnetic relay are different from those of the small signal relay. Pins X1 and X2 are defined as the control coil terminal pins, pins A3 and B3 are the normally closed terminal pins, pins A2 and B2 are the common terminals, and pins A1 and B1 are the normally open terminal pins.

[0034] Step 3. Design two double-layer ceramic connection circuit boards. The upper ceramic connection circuit board converts the pins of the HFD4 type signal relay to both sides of the lower surface of the upper ceramic connection circuit board, preparing for soldering with the lower ceramic connection circuit board. The upper and lower ceramic connection circuit boards are connected by reflow soldering. There are a total of eight welding points at the same positions on the left and right sides of the upper and lower ceramic connection circuit boards, corresponding to the pins with the same definitions of the HFD4 type signal relay and the 1 / 2 crystal cover sealed relay. During soldering, solder paste is placed in the holes of the upper ceramic connection circuit board, and it can be soldered to the pads on the upper surface of the lower ceramic connection circuit board to achieve the conversion of pin definitions. The lower ceramic connection circuit board converts the pin definitions of the HFD4 type signal relay to the pin definitions of the 1 / 2 crystal cover sealed relay, and its lower surface is soldered to the bottom pins of the metal shell of the 1 / 2 crystal cover sealed relay. On the basis of ensuring the bidirectional and firm connection of the lead-out pins of the HFD4 type signal relay, the conversion of the pin definitions of the HFD4 type signal relay sealed with a 1 / 2 crystal cover sealed relay is achieved, laying a foundation for the rapid metal shell sealing of the small signal relay.

Claims

1. A connection method applied between a signal relay and a 1 / 2 crystal cover relay, characterized in that The method includes the following steps: Step 1: For a double-row surface-mount small signal relay, define pin 1 and pin 8 as the control coil terminal pins, pin 2 and pin 7 as the normally-closed terminal pins, pin 3 and pin 6 as the common terminals, and pin 4 and pin 5 as the normally-open terminal pins; Step 2: For a 1 / 2 crystal cover-sealed electromagnetic relay, define pin X1 and pin X2 as the control coil terminal pins, pin A3 and pin B3 as the normally-closed terminal pins, pin A2 and pin B2 as the common terminals, and pin A1 and pin B1 as the normally-open terminal pins; Step 3: Convert the lead-out pins of the small signal relay and the lead-out pins of the 1 / 2 crystal cover-sealed electromagnetic relay through upper and lower ceramic connection circuit boards. The specific steps are as follows: Step 31: Design the corresponding installation positions of the upper ceramic connection circuit board according to the pin dimensions of the small signal relay, and design the corresponding installation positions of the lower ceramic connection circuit board according to the pin dimensions of the 1 / 2 crystal cover-sealed electromagnetic relay; Step 32: Use the soldering method to solder the upper surface of the upper ceramic connection circuit board to the pins of the small signal relay, solder the lower surface of the upper ceramic connection circuit board to the upper surface of the lower ceramic connection circuit board, and solder the lower surface of the lower ceramic connection circuit board to the bottom pins of the metal shell of the 1 / 2 crystal cover-sealed electromagnetic relay, so as to realize the conversion of the pin definitions of the small signal relay and the 1 / 2 crystal cover-sealed electromagnetic relay: X1-1, X2-8, A1-4, A2-3, A3-2, B1-5, B2-6, B3-7.

2. The connection method applied between a signal relay and a 1 / 2 crystal cover relay according to claim 1, characterized in that The minimum copper wire width of the upper and lower ceramic connection circuit boards is 30 mil.

3. The connection method applied between a signal relay and a 1 / 2 crystal cover relay according to claim 1, characterized in that Both the upper and lower ceramic connection circuit boards are of double-layer design.

4. The connection method applied between a signal relay and a 1 / 2 crystal cover relay according to claim 1 or 2, characterized in that The upper and lower ceramic connection circuit boards are connected by reflow soldering.

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