An integrated circuit chip packaging processing device
By introducing a positioning and fixing assembly and a centering component into the packaging device, using a mechanical clamp for centering and combining it with negative pressure adsorption, the problem of insufficient positioning accuracy of traditional packaging devices is solved, an efficient and precise chip packaging process is achieved, the packaging failure rate is reduced and production efficiency is improved.
Patent Information
- Application Number
- CN202510599021.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-10
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2045-05-10
AI Technical Summary
Traditional packaging devices have limited positioning accuracy for the packaging base, mechanical clamping blocks affect subsequent processes, and pneumatic adsorption clamping and centering accuracy are low, resulting in a high packaging failure rate and low production efficiency.
The positioning and fixing assembly, centering component and driving structure are adopted, and the mechanical clamp is used for centering and negative pressure adsorption is generated when it is released. The advantages of mechanical centering and air pressure adsorption are combined to ensure the accurate positioning and fixation of the package base.
The positioning accuracy of the package base is improved, the package failure rate is reduced, and the production efficiency and chip package quality are improved.
Smart Images

Figure CN120261354B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to an integrated circuit chip packaging and processing device. Background Art
[0002] In the field of integrated circuit chip packaging, efficient and precise packaging processing is a key link in ensuring chip quality and performance. Traditional packaging devices have limited positioning accuracy for the package base. During the dispensing and chip installation process, it is difficult to ensure that the package base is accurately connected to the chip leads. This will not only affect the electrical performance of the chip, but may also cause packaging failure and increase production costs. In addition, the package base is usually fixed by mechanical clamping. Although it can be accurately centered, the fixture can easily affect the subsequent dispensing and chip packaging processes. It will hinder operations due to position interference, reduce production efficiency, and increase the scrap rate. The centering accuracy of the start-up clamping method is low, and the accurate connection of the leads between the package base and the chip cannot be guaranteed.
[0003] Therefore, in order to utilize the advantages of mechanical clamping and centering accurately while taking advantage of air pressure adsorption to avoid position interference caused by mechanical clamping, ensure the smooth progress of subsequent dispensing and chip packaging processes, improve production efficiency and reduce scrap rate, an integrated circuit chip packaging processing device is proposed. Summary of the Invention
[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides an integrated circuit chip packaging and processing device, which, by setting a positioning and fixing assembly, a centering component and a driving structure, can use a mechanical clamping block to push the packaging base for centering during clamping, and when the clamping block is released, the positioning and fixing assembly can generate negative pressure adsorption on the packaging base, thereby effectively achieving the centering accuracy of mechanical clamping and the convenient operation of air pressure adsorption, effectively solving the problem that the current traditional packaging device has limited positioning accuracy of the packaging base and cannot take into account both the accuracy of mechanical clamping and the convenience of air pressure adsorption.
[0005] The technical solution adopted by the present invention is as follows: The present invention proposes an integrated circuit chip packaging and processing device, including a fixing table, a positioning and fixing assembly, a centering component and a driving structure. The positioning and fixing assembly and the centering component are both arranged on the fixing table. The centering component is used to position the packaging base, and the positioning and fixing assembly is used to fix the packaging base. The driving structure is respectively connected to the positioning and fixing assembly and the centering component;
[0006] Positioning and fixing assembly, including:
[0007] A workbench, which is fixedly connected to the fixed platform and is used to carry the packaging base;
[0008] A negative pressure chamber, a first one-way ventilation pipe is provided between the negative pressure chamber and the workbench, and a second one-way ventilation pipe is connected to the negative pressure chamber;
[0009] An elastic reset structure and a lifting plate, wherein the elastic reset structure is used to drive the lifting plate to reset and generate negative pressure at the workbench through the first one-way ventilation pipe.
[0010] Furthermore, the first one-way ventilation pipe includes a tube body and a valve ball, a vent is opened at one end of the tube body, the valve ball is arranged inside the tube body and close to one end of the vent, a bracket is fixedly connected to the inside of the tube body, a sliding block is fixedly connected to the valve ball, and a sealing spring is provided between the sliding block and the bracket.
[0011] Furthermore, the elastic reset structure includes a fixed seat, a guide rod and a reset spring. The fixed seat is fixedly connected to the workbench, the guide rod is fixedly connected to the workbench, and the guide rod is penetrated and slidably connected to the lifting plate. The reset spring is sleeved on the guide rod, and the two ends of the reset spring act on the fixed seat and the lifting plate respectively.
[0012] Furthermore, the workbench includes a negative pressure platform, an expansion platform and a fixed ring, the negative pressure platform is fixedly connected to the middle of the expansion platform, and the expansion platform is fixedly connected to the middle of the fixed ring.
[0013] Furthermore, a through hole is provided on the negative pressure platform, the interior of the negative pressure chamber is connected to the through hole of the negative pressure platform through a tube body, a piston block is slidably connected to the interior of the negative pressure chamber, the bottom of the piston block is fixedly connected to a connecting block, the end of the connecting block away from the piston block is fixedly connected to a connecting frame, and the connecting frame is fixedly connected to the lifting plate.
[0014] Furthermore, the centering assembly includes a rotating ring and a clamping block, the rotating ring is rotatably connected to the fixed ring, and an arc-shaped sliding groove is provided on the rotating ring;
[0015] The clamping block includes a moving block, the moving block is fixedly connected to an arc-shaped slider, the arc-shaped slider slides in the arc-shaped slide groove, and the moving block is also fixedly connected to a guide slider;
[0016] The fixing ring is provided with a guide slot, and the guide slider is slidably connected in the guide slot;
[0017] The outer circumference of the rotating ring is fixedly connected with driven teeth.
[0018] Furthermore, the driving structure includes a lifting frame, a threaded rod and a reducer, the lifting frame is fixedly connected to the connecting frame, and a threaded block is fixedly connected to the lifting frame;
[0019] The threaded rod is rotatably connected to the fixed platform, and the threaded block is engaged with the threaded rod, and when the threaded block moves, the threaded rod is driven to rotate;
[0020] The reducer is fixedly mounted on a fixed platform, and the output end of the reducer is fixedly connected to a driving gear;
[0021] The threaded rod is fixedly connected with a bevel gear 1, the input end of the reducer is fixedly connected with a bevel gear 2, and the bevel gear 1 is meshed with the bevel gear 2.
[0022] Furthermore, an idler wheel for transmission is rotatably provided on the fixed platform, and the driving gear drives the driven gear to rotate by engaging with the idler wheel.
[0023] Furthermore, a cylinder is fixedly installed on the bottom of the fixed platform, and the lifting frame is fixedly connected to the telescopic end of the cylinder.
[0024] The beneficial effects achieved by the present invention using the above structure are as follows:
[0025] (1) In order to solve the problems of limited positioning accuracy of the packaging base by traditional packaging devices, the mechanical clamping blocks easily affecting subsequent processes, and the low precision of air pressure adsorption clamping and centering, the present invention provides a positioning and fixing assembly, a centering component and a driving structure, and can use the clamping block in the centering component to push the packaging base for precise centering during the clamping process. When the clamping block is released, the positioning and fixing assembly can generate negative pressure adsorption on the packaging base, thereby effectively taking into account the accuracy of mechanical clamping and centering and the convenience of air pressure adsorption operation, ensuring the smooth progress of subsequent dispensing and chip packaging processes, improving production efficiency and reducing the scrap rate;
[0026] (2) Two sets of one-way vents with opposite flow directions are provided in the positioning and fixing assembly. The driving structure drives the centering assembly to center the package base while driving the air in the negative pressure chamber to be discharged. When the centering assembly is released, different one-way vents are used for ventilation, so that the workbench can generate negative pressure to adsorb and fix the package base, so that the release of the clamp block and the generation of negative pressure can be synchronized, thereby effectively ensuring the accuracy of the fixed position of the package base and also making the clamp block away from the package base, which is convenient for subsequent processing.
[0027] (3) In addition, during the resetting process of the lifting plate, the elastic reset structure compresses and stores energy as 3 is clamped, and provides reset power when 3 is released, making the negative pressure at the workbench more stable and reliable, further ensuring the fixing effect of the package base, and reducing the situation where the package base is not firmly fixed due to unstable negative pressure, forming an efficient and precise packaging process, which can improve production efficiency, reduce scrap rate, and ensure the quality of chip packaging. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided Figure 1 ;
[0029] Figure 2 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided Figure 2 ;
[0030] Figure 3 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0031] Figure 4 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0032] Figure 5 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0033] Figure 6 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0034] Figure 7 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0035] Figure 8 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0036] Figure 9 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0037] Figure 10 A three-dimensional structural schematic of an integrated circuit chip packaging processing device is provided
[0038] Wherein, 1, fixed table; 2, positioning and fixing assembly; 3, centering assembly; 4, driving structure; 5, air cylinder; 21, workbench; 211, negative pressure table; 212, expansion table; 213, fixed ring; 22, elastic reset structure; 221, fixed seat; 222, guide rod; 223, reset spring; 23, first one-way air pipe; 24, second one-way air pipe; 231, pipe body; 232, air port; 233, valve ball; 234, sliding block; 235, plugging spring; 236, bracket; 25, connecting pipe; 26, negative pressure cavity; 27, connecting block; 28, piston block; 29, lifting plate; 291, connecting frame; 31, rotating ring; 32, arc-shaped sliding groove; 33, clamping block; 331, moving block; 332, arc-shaped sliding block; 333, guide sliding block; 34, guide sliding groove; 35, driven tooth; 41, lifting frame; 42, threaded block; 43, threaded rod; 44, speed reducer; 45, drive gear; 46, bevel gear one; 47, bevel gear two.
[0039] The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the application, and together with the description serve to explain the application, and do not limit the application. DETAILED DESCRIPTION
[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0041] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0042] As shown in Figures 1-10 The present application provides an integrated circuit chip packaging processing device, which comprises a fixing table 1, a positioning and fixing assembly 2, a centering assembly 3 and a driving structure 4, the positioning and fixing assembly 2 and the centering assembly 3 are arranged on the fixing table 1, the centering assembly 3 is used for positioning a packaging base, the positioning and fixing assembly 2 is used for fixing the packaging base, and the driving structure 4 is connected with the positioning and fixing assembly 2 and the centering assembly 3 respectively.
[0043] The positioning and fixing assembly 2 comprises:
[0044] A workbench 21 is fixedly connected to the fixing table 1 and used for bearing the packaging base.
[0045] A negative pressure cavity 26 is provided with a first one-way air pipe 23 between the workbench 21 and the negative pressure cavity 26, and a second one-way air pipe 24 is connected to the negative pressure cavity 26, and the second one-way air pipe 24 is connected to the inside of the negative pressure cavity 26 through a connecting pipe 25.
[0046] An elastic reset structure 22 and a lifting plate 29 are provided, the elastic reset structure 22 is used for driving the lifting plate 29 to reset, and the workbench 21 generates negative pressure through the first one-way air pipe 23.
[0047] The first one-way air pipe 23 comprises a pipe body 231, a valve ball 233, an air vent 232 formed at one end of the pipe body 231, the valve ball 233 arranged inside the pipe body 231 and close to the one end of the air vent 232, a support 236 fixedly connected inside the pipe body 231, a sliding block 234 fixedly connected to the valve ball 233, and a blocking spring 235 arranged between the sliding block 234 and the support 236. When the airflow enters from the direction of the support 236, the valve ball 233 blocks the air vent 232 under the elastic force of the blocking spring 235, so that the airflow cannot pass through. When the airflow enters from the direction of the air vent 232, the airflow extrudes the blocking spring 235, so that a flow channel is formed at the air vent 232, and the airflow can pass through.
[0048] The second one-way air pipe 24 has the same structure as the first one-way air pipe 23, and the gas flow directions of the first one-way air pipe 23 and the second one-way air pipe 24 are opposite. When the piston block 28 moves towards the inside of the negative pressure cavity 26, the airflow can only be discharged from the second one-way air pipe 24 and cannot be discharged from the through hole of the workbench 21 through the first one-way air pipe 23. When the piston block 28 moves towards the outside of the negative pressure cavity 26, the airflow cannot enter the negative pressure cavity 26 from the second one-way air pipe 24, and at this time, the airflow tends to enter the inside of the negative pressure cavity 26 from the through hole of the workbench 21 through the first one-way air pipe 23, so that a negative pressure is generated at the through hole of the workbench 21 to adsorb and fix the packaging base, thereby avoiding the influence of the subsequent clamping of the clamping block 33 on the packaging base on the subsequent dispensing and packaging processes.
[0049] The elastic return structure 22 comprises a fixed seat 221, a guide rod 222 and a return spring 223. The fixed seat 221 is fixedly connected to the workbench 21. The guide rod 222 is fixedly connected to the workbench 21 and slidably connected to the lifting plate 29. The return spring 223 is sleeved on the guide rod 222, and the two ends of the return spring 223 act on the fixed seat 221 and the lifting plate 29, respectively. When the lifting plate 29 moves away from the workbench 21, the movement of the lifting plate 29 can be assisted by the elastic force of the return spring 223.
[0050] The workbench 21 comprises a negative pressure table 211, an expansion table 212 and a fixed ring 213. The negative pressure table 211 is fixedly connected to the middle part of the expansion table 212. The expansion table 212 can increase the area of the negative pressure table 211, thereby increasing the placement space of the packaging base. The expansion table 212 is fixedly connected to the middle part of the fixed ring 213, and the fixed ring 213 is used to bear the rotation of the rotating ring 31.
[0051] A through hole is provided on the negative pressure platform 211, and the interior of the negative pressure chamber 26 is connected to the through hole of the negative pressure platform 211 through the tube body 231. The piston block 28 is slidably connected to the interior of the negative pressure chamber 26, and the bottom of the piston block 28 is fixedly connected to the connecting block 27. The end of the connecting block 27 away from the piston block 28 is fixedly connected to the connecting frame 291, and the connecting frame 291 is fixedly connected to the lifting plate 29.
[0052] The centering assembly 3 includes a rotating ring 31 and a clamping block 33. The rotating ring 31 is rotatably connected to the fixed ring 213. An arc-shaped sliding groove 32 is formed on the rotating ring 31.
[0053] The clamping block 33 includes a moving block 331 , to which an arc-shaped slider 332 is fixedly connected. The arc-shaped slider 332 slides in the arc-shaped chute 32 , and a guide slider 333 is also fixedly connected to the moving block 331 ;
[0054] A guide slot 34 is formed on the fixing ring 213, and the guide slider 333 is slidably connected in the guide slot 34;
[0055] The outer circumference of the rotating ring 31 is fixedly connected with driven teeth 35 .
[0056] The driving structure 4 includes a lifting frame 41, a threaded rod 43 and a reducer 44. The lifting frame 41 is fixedly connected to the connecting frame 291, and a threaded block 42 is fixedly connected to the lifting frame 41;
[0057] The threaded rod 43 is rotatably connected to the fixed platform 1, and the threaded block 42 is engaged with the threaded rod 43. When the threaded block 42 moves, the threaded rod 43 is driven to rotate;
[0058] The reducer 44 is fixedly mounted on the fixed platform 1. The output end of the reducer 44 is fixedly connected to the driving gear 45. The output end of the reducer 44 increases the speed of the input end.
[0059] A bevel gear 1 46 is fixedly connected to the threaded rod 43 , and a bevel gear 2 47 is fixedly connected to the input end of the reducer 44 . The bevel gear 1 46 is meshed with the bevel gear 2 47 .
[0060] An idler wheel for transmission is also rotatably provided on the fixed platform 1 , and the driving gear 45 drives the driven gear 35 to rotate by engaging with the idler wheel; a cylinder 5 is fixedly installed at the bottom of the fixed platform 1 , and the lifting frame 41 is fixedly connected to the telescopic end of the cylinder 5 .
[0061] Specific use and working principle: when packaging the chip, first place the packaging base on the workbench 21, then start the cylinder 5, which drives the centering component 3 to center the packaging base through the transmission of the driving structure 4;
[0062] The telescopic end of the air cylinder 5 pushes the lifting frame 41 to move, the lifting frame 41 drives the threaded block 42 to move, the threaded block 42 drives the threaded rod 43 to rotate through the meshing action, the threaded rod 43 drives the driving gear 45 to rotate through the transmission of the bevel gear one 46 and the bevel gear two 47 and the speed increasing effect of the speed reducer 44, the driving gear 45 drives the driven tooth 35 to rotate through gear transmission, and further drives the rotating ring 31 to rotate; when the rotating ring 31 rotates, the arc-shaped sliding block 332 moves in the arc-shaped sliding groove 32, and the guide sliding block 333 moves in the guide sliding groove 34, so that the four groups of clamping blocks 33 can move towards each other, and then the packaging base is pushed to the working position, the centering of the packaging base is completed, and the accuracy of the subsequent glue dispensing and chip installation connected with the chip lead is facilitated.
[0063] When the lifting frame 41 moves, the connecting frame 291 can be pushed to move, and then the connecting block 27 and the piston block 28 move towards the inside of the negative pressure cavity 26, so that the air in the negative pressure cavity 26 is discharged from the second one-way air pipe 24; at the same time, the lifting plate 29 also moves synchronously.
[0064] When the packaging base is centered, the telescopic end of the air cylinder 5 is retracted, at this time, the clamping blocks 33 move away from each other, the packaging base is loosened, the connecting block 27 and the piston block 28 move towards the outside of the negative pressure cavity 26, because the air in the second one-way air pipe 24 can only move in one direction, the air in the second one-way air pipe 24 cannot enter the negative pressure cavity 26 at this time, and the first one-way air pipe 23 can allow air to pass at this time, so that negative pressure is generated on the through hole of the negative pressure table 211, and the packaging base is adsorbed on the workbench 21, so that the packaging base is fixed by the negative pressure while the clamping blocks 33 are loosened, and the influence of the clamping blocks 33 on the subsequent glue dispensing and packaging process is avoided.
[0065] The above is the overall working process of the present application.
[0066] It should be noted that in this text, relationship terms such as first and second are only used to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0067] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to the details of the embodiments described, since various modifications can be made by those skilled in the art, without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.
[0068] The above description of the application and its embodiments is not restrictive, and the embodiments shown in the drawings are only one of the embodiments of the application, and the actual structure is not limited thereto. In general, if a person skilled in the art is inspired by it, without departing from the purpose of the application, without creative design, similar structure and embodiments of the technical solution should belong to the protection scope of the application.
Claims
1. An integrated circuit chip packaging and processing device, characterized in that: The invention comprises a fixing platform (1), a positioning and fixing assembly (2), a centering component (3) and a driving structure (4); the positioning and fixing assembly (2) and the centering component (3) are both arranged on the fixing platform (1); the centering component (3) is used to position the packaging base; the positioning and fixing assembly (2) is used to fix the packaging base; and the driving structure (4) is connected to the positioning and fixing assembly (2) and the centering component (3) respectively; Positioning and fixing assembly (2), comprising: A workbench (21), the workbench (21) is fixedly connected to the fixed platform (1) and is used to carry the packaging base; A negative pressure chamber (26), a first one-way vent pipe (23) is provided between the negative pressure chamber (26) and the workbench (21), and a second one-way vent pipe (24) is connected to the negative pressure chamber (26); An elastic reset structure (22) and a lifting plate (29), wherein the elastic reset structure (22) is used to drive the lifting plate (29) to reset and generate negative pressure at the workbench (21) through a first one-way ventilation pipe (23).
2. The integrated circuit chip packaging and processing device according to claim 1, characterized in that: The first one-way vent pipe (23) comprises a tube body (231) and a valve ball (233). A vent (232) is provided at one end of the tube body (231). The valve ball (233) is arranged inside the tube body (231) and close to one end of the vent (232). A bracket (236) is fixedly connected inside the tube body (231). A sliding block (234) is fixedly connected to the valve ball (233). A blocking spring (235) is provided between the sliding block (234) and the bracket (236).
3. The integrated circuit chip packaging and processing device according to claim 2, characterized in that: The elastic reset structure (22) comprises a fixed seat (221), a guide rod (222) and a reset spring (223); the fixed seat (221) is fixedly connected to the workbench (21); the guide rod (222) is fixedly connected to the workbench (21); the guide rod (222) is penetrated by and slidably connected to the lifting plate (29); the reset spring (223) is sleeved on the guide rod (222); and the two ends of the reset spring (223) act on the fixed seat (221) and the lifting plate (29) respectively.
4. The integrated circuit chip packaging and processing device according to claim 3, characterized in that: The workbench (21) comprises a negative pressure platform (211), an expansion platform (212) and a fixed ring (213); the negative pressure platform (211) is fixedly connected to the middle of the expansion platform (212); and the expansion platform (212) is fixedly connected to the middle of the fixed ring (213).
5. The integrated circuit chip packaging and processing device according to claim 4, characterized in that: A through hole is provided on the negative pressure platform (211), and the interior of the negative pressure chamber (26) is connected to the through hole of the negative pressure platform (211) through a tube body (231). A piston block (28) is slidably connected to the interior of the negative pressure chamber (26), and a connecting block (27) is fixedly connected to the bottom of the piston block (28). An end of the connecting block (27) away from the piston block (28) is fixedly connected to a connecting frame (291), and the connecting frame (291) is fixedly connected to the lifting plate (29).
6. The integrated circuit chip packaging and processing device according to claim 5, characterized in that: The centering assembly (3) comprises a rotating ring (31) and a clamping block (33); the rotating ring (31) is rotatably connected to the fixed ring (213); and an arc-shaped sliding groove (32) is provided on the rotating ring (31); The clamping block (33) includes a moving block (331), the moving block (331) is fixedly connected to an arc-shaped slider (332), the arc-shaped slider (332) slides in the arc-shaped slide groove (32), and the moving block (331) is also fixedly connected to a guide slider (333); The fixing ring (213) is provided with a guide slot (34), and the guide slider (333) is slidably connected in the guide slot (34); A driven tooth (35) is fixedly connected to the outer circumference of the rotating ring (31).
7. The integrated circuit chip packaging and processing device according to claim 6, characterized in that: The driving structure (4) comprises a lifting frame (41), a threaded rod (43) and a reducer (44); the lifting frame (41) is fixedly connected to the connecting frame (291); and a threaded block (42) is fixedly connected to the lifting frame (41); The threaded rod (43) is rotatably connected to the fixed platform (1), and the threaded block (42) is meshedly connected with the threaded rod (43). When the threaded block (42) moves, it drives the threaded rod (43) to rotate; The reducer (44) is fixedly mounted on the fixed platform (1), and the output end of the reducer (44) is fixedly connected to a driving gear (45); The threaded rod (43) is fixedly connected to a bevel gear 1 (46), and the input end of the reducer (44) is fixedly connected to a bevel gear 2 (47), and the bevel gear 1 (46) is meshed with the bevel gear 2 (47).
8. The integrated circuit chip packaging and processing device according to claim 7, characterized in that: An idler wheel for transmission is also rotatably provided on the fixed platform (1), and the driving gear (45) drives the driven gear (35) to rotate by meshing with the idler wheel.
9. The integrated circuit chip packaging and processing device according to claim 8, characterized in that: A cylinder (5) is fixedly mounted on the bottom of the fixed platform (1), and the lifting frame (41) is fixedly connected to the telescopic end of the cylinder (5).
Citation Information
Patent Citations
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CN118448979A
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CN119650495A
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