Large-size chip demolding ejector pin mechanism

Abstract

The invention relates to the technical field of semiconductor mounting equipment, and particularly discloses a large-size chip demolding ejector pin mechanism which comprises an ejector pin stripping module and a Z-direction movement module, the ejector pin stripping module comprises an ejector pin assembly and an adsorption assembly, the adsorption assembly is inserted into the ejector pin assembly in a sliding mode, and the ejector pin assembly comprises a plurality of ejector pins; the adsorption assembly comprises a plurality of adsorption heads, the ejector pins and the adsorption heads are arranged in a staggered mode, and a fixing part is arranged at the top of the ejector pin assembly around the adsorption assembly. The Z-direction movement module comprises a local movement module and an overall movement module, the local movement module is connected to the output end of the overall movement module, the ejector pin assembly is fixedly connected to the local movement module, and the adsorption assembly is connected with the output end of the local movement module. By adopting the technical scheme provided by the invention, the technical problem that the qualified rate of products is influenced by hidden dangers such as chip fragmentation easily caused when the stripping process of the large-size chip is carried out in the prior art can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor mounting equipment, and particularly relates to a large-size chip demoulding ejector pin mechanism. Background Art

[0002] In the field of manufacturing high-precision equipment dedicated to semiconductor devices, it mainly involves semiconductor mounting equipment, semiconductor packaging equipment, etc. At present, chip peeling is one of the important process steps included in most semiconductor packaging equipment, and usually, the chip peeling action is completed through an ejector pin mechanism. The existing chip peeling ejector pin mechanism mainly consists of an ejector pin base movement module and an ejector pin peeling module. The ejector pin base movement module has movements in three directions of the X-axis, Y-axis, and Z-axis, and can drive the ejector pin peeling module to move along the X-axis and Y-axis under the wafer stage, so that the ejector pin peeling module can move under each chip, and then drive the ejector pin peeling module to move along the Z-axis, so that the ejector pins of the ejector pin peeling module can jack up the chip upward, realizing the separation of the chip from the blue film on the wafer stage, thereby completing the chip peeling process and facilitating the pick-up head to suck and move the chip.

[0003] The magnitude of the contact force between the ejector pin of the ejector pin peeling module and the chip, and the stress deformation of the chip under the action of the contact force directly determine whether there are potential hazards such as chip fragmentation, hidden crack, perforation, and failure to eject during the peeling process, which is crucial for the successful peeling of the chip. In particular, with the reduction of chip thickness and the increase of packaging speed, the chip peeling process under the action of the ejector pin is one of the main causes of chip fragmentation, directly affecting the product qualification rate.

[0004] The existing ejector pin peeling module adopts a single ejector pin structure, which is suitable for demoulding operations of small-size chips with a certain thickness such as 0.5×0.5mm, 1×1mm, 2×2mm, etc. When used for demoulding large-size chips of 10×10mm to 50×50mm, due to the fact that the thickness of large-size chips is often very small (less than or equal to 70μm), and the contact area between the single ejector pin of the ejector pin peeling module and the large-size chip is too small, it will cause the stress concentration of the large-size chip, making the large-size chip prone to potential hazards such as fragmentation, hidden crack, perforation, and failure to eject during the peeling process, resulting in a reduction in the product qualification rate. In addition, the excessive consumption of chips in the peeling process will increase the cost, and at the same time, it will affect the overall working efficiency of the semiconductor packaging equipment.

[0005] Therefore, there is an urgent need for a large-size chip demoulding ejector pin mechanism to complete the peeling process of large-size chips, so as to reduce potential hazards such as chip fragmentation, hidden crack, perforation, and failure to eject during the peeling process and improve the product qualification rate. Summary of the Invention

[0006] The present invention aims to provide a demolding ejector pin mechanism for large-sized chips, so as to solve the technical problem in the prior art that when used in the peeling process of large-sized chips, it is easy to cause potential hazards such as chip fragmentation, affecting the product qualification rate.

[0007] To achieve the above object, the present invention adopts the following technical solutions: A demolding ejector pin mechanism for large-sized chips includes an ejector pin peeling module and a Z-direction movement module. The ejector pin peeling module includes an ejector pin assembly and an adsorption assembly. The adsorption assembly is slidably inserted into the ejector pin assembly. The ejector pin assembly includes a plurality of ejector pins, and the adsorption assembly includes a plurality of adsorption heads. The plurality of ejector pins and the plurality of adsorption heads are arranged alternately. A fixing part is provided around the adsorption assembly at the top of the ejector pin assembly. The Z-direction movement module includes a local movement module and an overall movement module. The local movement module is connected to the output end of the overall movement module. The ejector pin assembly is fixedly connected to the local movement module, and the adsorption assembly is connected to the output end of the local movement module. The overall movement module drives the ejector pin peeling module to move upward, so that the ejector pins contact the blue film at the corresponding position of the chip. The fixing part is used to fix the blue film around the chip, and the adsorption heads are used to adsorb the blue film at the corresponding position of the chip. The local movement module first drives the adsorption assembly to move upward a small distance and then reset to realize the pre-loosening of the chip and the blue film, and then drives the adsorption assembly to move downward a small distance to realize the peeling of the chip and the blue film.

[0008] The principle and advantages of this solution are as follows: 1. In this solution, the ejector pin assembly is set to include a plurality of ejector pins. When the ejector pin peeling module performs demolding operation on large-sized chips with a small thickness (less than or equal to 70 μm), compared with the single-ejector pin structure in the prior art, the multi-ejector pin structure in this solution can effectively increase the contact area between the ejector pins and the large-sized chips, avoid the stress concentration of the large-sized chips during the demolding process, reduce the stress deformation of the large-sized chips under the action of the contact force, thereby reducing or even avoiding potential hazards such as chip fragmentation, hidden cracks, perforation, and failure to eject during the demolding process of the large-sized chips, which is beneficial to improving the product qualification rate, reducing the consumption of chips in the peeling process to reduce costs, and improving the overall working efficiency of semiconductor packaging equipment at the same time.

[0009] 2. Before the formal demolding operation in this solution, the blue film around the chip is fixed by the fixing part provided at the top of the ejector pin assembly, and the blue film at the corresponding position of the chip is adsorbed and fixed by the adsorption assembly. Then, the local movement module drives the adsorption assembly to move upward a small distance, thereby driving the chip to move upward a small distance. At this time, the blue film at the corresponding position of the chip is stretched to form serrated wrinkles, resulting in a smaller contact area between the chip and the blue film and a lower connection tightness between the two, which is convenient for the subsequent formal demolding operation and is beneficial to improving the demolding effect and efficiency of the chip.

[0010] 3. When the formal film removal is carried out in this solution, the blue film around the chip is fixed by the fixing part, and the blue film at the corresponding position of the chip is adsorbed and fixed by the adsorption component. Then, the local motion module drives the adsorption component to move downward a small distance, thereby driving the blue film at the corresponding position of the chip to move downward a small distance. During the downward movement of the adsorption component, the ejector pins of the ejector pin assembly remain stationary in the absolute position, and the downward movement of the chip is restricted by the ejector pins, resulting in the chip being peeled off from the blue film at its corresponding position, realizing the film removal of the chip. The absolute positions of the ejector pins and the chip remain unchanged throughout the process. Compared with the prior art method of lifting the chip upward by the ejector pins for film removal, the force on the chip can be reduced, and the chip is not easily damaged.

[0011] 4. In addition to setting up a local motion module to drive the adsorption component to complete the film removal operation of the chip, this solution also sets up an overall motion module to drive the local motion module to move up and down, thereby driving the ejector pin peeling module to move up and down. When the overall motion module drives the ejector pin peeling module to move upward, it can make the ejector pin peeling module contact the blue film adhered to the chip to be demolded, preparing for the film removal operation of the chip. After a chip completes the film removal operation, the wafer stage needs to move in the X and Y directions to align the next chip with the ejector pin peeling module. The overall motion module drives the ejector pin peeling module to move downward and reset before the wafer stage moves, which can provide sufficient movement space for the movement of the wafer stage and ensure the continuous operation of the equipment.

[0012] Preferably, as an improvement, the ejector pin assembly further includes an ejector pin cap and an ejector pin body connected in sequence from top to bottom. A chip groove is formed at the top of the ejector pin cap, and several ejector pins are arranged at the bottom of the chip groove. A vacuum chamber is formed inside the ejector pin cap, and a vacuum hole is formed in the ejector pin body. One end of the vacuum hole communicates with the vacuum chamber, and the other end communicates with an external vacuum generator. The fixing part includes several fixing holes formed around the adsorption component at the top of the ejector pin cap, and the fixing holes communicate with the vacuum chamber.

[0013] Beneficial effects: A chip groove is formed at the top of the ejector pin cap in this solution. When the overall motion module drives the ejector pin peeling module to move upward to a preset position, the chip to be demolded enters the chip groove, which can not only realize the mutual positioning of the chip and the ejector pin peeling module, ensuring the accuracy of subsequent film removal actions, but also limit the chip through the chip groove, improving the position stability of the chip during subsequent film removal.

[0014] In this solution, a vacuum chamber is formed in the ejector pin cap by connecting to an external vacuum generator, and several fixing holes communicating with the vacuum chamber are formed around the adsorption component (i.e., around the chip groove) at the top of the ejector pin cap as the fixing part. The blue film around the chip is adsorbed and fixed by the negative pressure in the fixing holes. The structure is simple, which is beneficial to simplifying the structure of the ejector pin assembly.

[0015] Preferably, as an improvement, the ejector pin assembly further includes an ejector pin seat detachably connected inside the ejector pin cap. A plurality of ejector pins are fixedly connected to the top of the ejector pin seat. Ejector pin holes are formed at the bottom of the chip slot corresponding to the positions of the ejector pins, and the ejector pins protrude from the ejector pin holes.

[0016] Beneficial effects: In this solution, by adding an ejector pin seat inside the ejector pin cap for installing the ejector pins, a detachable connection between the ejector pins and the ejector pin cap can be achieved. When the ejector pins are worn or damaged during long-term use, the ejector pins can be conveniently replaced individually, thereby ensuring the chip demolding effect, being beneficial to extending the service life of the entire demolding ejector pin mechanism, and reducing costs compared to replacing the entire ejector pin demolding mechanism.

[0017] Preferably, as an improvement, the adsorption assembly further includes an adsorption seat and a lifting rod connected in sequence from top to bottom. A plurality of adsorption heads are fixedly connected to the top of the adsorption seat. Movement holes are formed at the bottom of the chip slot corresponding to the positions of the adsorption heads, and relief holes are formed in the ejector pin seat corresponding to the positions of the adsorption heads. The adsorption heads are slidably connected in the movement holes and the relief holes; adsorption holes are formed at the top of the adsorption heads, and an adsorption channel is formed inside the adsorption seat. The adsorption channel communicates between the adsorption holes and the vacuum chamber; the lifting rod is slidably inserted into the ejector pin body, and a first resetting member is connected between the lifting rod and the ejector pin body.

[0018] Beneficial effects: In this solution, a plurality of adsorption heads are connected to the top of the lifting rod through the adsorption seat. The local movement module drives the adsorption heads to move up and down through the lifting rod to achieve pre-loosening of the chip and the blue film and demolding of the chip. The structure is simple and reliable. During the up and down movement of the adsorption heads, they slide up and down in the movement holes of the chip slot and the relief holes of the ejector pin seat, which can guide the movement of the adsorption heads. The adsorption holes formed on the adsorption heads communicate with the vacuum chamber through the adsorption channels formed inside the adsorption seat, so negative pressure can be formed in the adsorption holes, thereby effectively realizing the adsorption and fixation of the blue film at the corresponding position of the chip, ensuring that the blue film at the corresponding position of the chip moves up and down with the adsorption heads, and then effectively realizing pre-loosening of the chip and the blue film and demolding of the chip.

[0019] In this solution, the lifting rod is slidably inserted into the ejector pin body. When the local movement module drives the lifting rod to move up and down to drive the adsorption heads to move up and down, the ejector pin body can guide the movement of the lifting rod to ensure that the lifting rod moves along the set direction, thereby ensuring the pre-loosening effect of the chip and the blue film and the demolding effect of the chip. A first resetting member is connected between the lifting rod and the ejector pin body. When the local movement module drives the adsorption heads to move up a short distance through the lifting rod to achieve pre-loosening of the chip and the blue film, the lifting rod can drive the adsorption heads to reset under the action of the first resetting member, thereby preparing for the subsequent formal demolding action and ensuring the smooth progress of the subsequent formal demolding action.

[0020] Preferably, as an improvement, a connecting member is provided between the thimble assembly and the local motion module, and the thimble assembly and the local motion module are detachably connected through the connecting member.

[0021] Beneficial effects: In this solution, the detachable connection between the thimble assembly and the local motion module is realized through the connecting member. When the thimble assembly is damaged during long-term use, the thimble assembly can be conveniently replaced separately, so as to ensure the effect of chip demoulding, which is beneficial to extending the service life of the entire thimble peeling module, and can also reduce costs compared with replacing the entire thimble peeling module. In addition, when the adsorption assembly slidably connected in the thimble assembly fails or is damaged during long-term use, the fixing assembly can be disassembled, so as to facilitate the maintenance or replacement of the adsorption assembly.

[0022] Preferably, as an improvement, the connecting member includes an upper connecting plate fixedly connected to the bottom of the thimble body and a lower connecting plate fixedly connected to the top of the local motion module. A plurality of magnets are oppositely arranged on the upper connecting plate and the lower connecting plate, and the surfaces of the magnets on the upper connecting plate and the lower connecting plate facing each other have opposite magnetic poles; a plurality of positioning pins are provided at the bottom of the upper connecting plate, and positioning holes are opened at the top of the lower connecting plate corresponding to the positions of the positioning pins.

[0023] Beneficial effects: In this solution, the detachable connection between the upper connecting plate and the lower connecting plate is realized by the attraction of opposite poles between the magnets on the upper connecting plate and the magnets on the lower connecting plate, so as to realize the detachable connection between the thimble assembly and the local motion module. The structure is simple, the connection is reliable, and the installation is convenient. In addition, in this solution, positioning pins are provided at the bottom of the upper connecting plate, and positioning holes are opened at the corresponding positions of the lower connecting plate. By inserting the positioning pins into the positioning holes, the rapid positioning of the upper connecting plate and the lower connecting plate can be realized, thereby further improving the connection convenience of the thimble assembly and the local motion module.

[0024] Preferably, as an improvement, the local motion module includes a motor fixing plate and a local motor fixedly connected to the motor fixing plate. A driving cam is fixedly connected to the output shaft of the local motor; a Z-direction moving plate is vertically slidably connected to the motor fixing plate, and a second reset member is connected between the motor fixing plate and the Z-direction moving plate; a cam follower is provided on the Z-direction moving plate, and the driving cam is tangent to the cam follower so that the Z-direction moving plate can move up and down, and the Z-direction moving plate is fixedly connected to the jacking rod.

[0025] Beneficial effects: In this solution, a local motor drives a drive gear to rotate, causing a cam follower tangent to the drive cam to move up and down. Thereby, an adsorption head is driven to move up and down through a Z-direction movement plate and a lifting rod, realizing pre-loosening of the chip and the blue film and demolding of the chip. The structure is simple and reliable. A second reset member is connected between the motor fixing plate and the Z-direction movement plate. After the drive cam drives the adsorption head to move upward a short distance to pre-loosen the chip from the blue film, the Z-direction movement plate gradually moves downward and resets under the action of the second reset member, thereby driving the cam follower to move downward and reset, maintaining the tangency between the cam follower and the drive cam, and preparing for the drive cam to drive the adsorption head to move downward to demold the chip later.

[0026] Preferably, as an improvement, a first photoelectric sensor is provided on the motor fixing plate, and a first sensor sheet metal corresponding to the first photoelectric sensor is provided on the Z-direction movement plate. The first photoelectric sensor cooperates with the first sensor sheet metal to realize zeroing of the Z-direction movement plate.

[0027] Beneficial effects: In this solution, a first photoelectric sensor is provided on the motor fixing plate as a fixing member, and a first sensor sheet metal is provided on the Z-direction movement plate as a moving member. After the demolding action of one chip is completed, through the cooperation of the first photoelectric sensor and the first sensor sheet metal, zeroing of the Z-direction movement plate as a moving member is realized, which can prepare for the demolding action of the next chip and ensure the reliability and accuracy of subsequent demolding actions.

[0028] Preferably, as an improvement, the overall movement module includes a motor mounting plate and an overall motor fixedly connected to the motor mounting plate. A worm is fixedly connected to the output shaft of the overall motor; a ball screw is provided on the motor mounting plate. A turbine is fixedly connected to the screw of the ball screw. The turbine meshes with the worm, and a manual adjustment nut is fixedly connected to the top of the turbine; the nut of the ball screw is fixedly connected to the motor fixing plate, and the motor fixing plate is slidably connected to the motor mounting plate.

[0029] Beneficial effects: In this solution, the overall motor drives the worm to rotate. The worm drives the screw of the ball screw to rotate through the turbine, causing the nut of the ball screw to move up and down. Thereby, the local movement module and the thimble peeling module are driven to move up and down through the motor fixing plate, realizing preparation for chip demolding when the thimble peeling module moves upward, and avoiding the X-direction and Y-direction movements of the wafer stage when the thimble peeling module moves downward. In addition, a manual adjustment nut is provided on the top of the turbine in this solution, and the screw of the ball screw can be manually driven to rotate through the manual adjustment nut, thereby realizing manual driving of the up and down movement of the thimble peeling module to adapt to different working conditions.

[0030] Preferably, as an improvement, a second photoelectric sensor is provided on the motor mounting plate, and a second sensor sheet metal is provided on the motor fixing plate corresponding to the second photoelectric sensor. The second photoelectric sensor cooperates with the second sensor sheet metal to achieve zeroing of the motor fixing plate.

[0031] Beneficial effects: In this solution, a second photoelectric sensor is provided on the motor mounting plate as a fixing part, and a second sensor sheet metal is provided on the motor fixing plate as a moving part. After the demolding action of a chip is completed, through the cooperation of the second photoelectric sensor and the second sensor sheet metal, zeroing of the motor fixing plate as a moving part can be achieved, which can prepare for the demolding action of the next chip and ensure the reliability and accuracy of the subsequent demolding action. Brief Description of the Drawings

[0032] Figure 1 It is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0033] Figure 2 It is a schematic diagram of the structure of the ejector pin peeling module in Embodiment 1 of the present invention.

[0034] Figure 3 It is Figure 2 a top view of.

[0035] Figure 4 It is Figure 2 an exploded view of.

[0036] Figure 5 It is Figure 4 a schematic diagram of the structure of the suction head and the suction seat in.

[0037] Figure 6 It is Figure 4 a bottom view of the upper connecting plate in.

[0038] Figure 7 It is a schematic diagram of the structure of the Z-direction movement module in Embodiment 1 of the present invention.

[0039] Figure 8 It is Figure 7 an exploded view of the local movement module in.

[0040] Figure 9 It is Figure 7 a schematic diagram of the structure of the overall movement module in. Detailed Description of the Invention

[0041] The following is further detailed through specific embodiments: The reference numerals in the accompanying drawings of the specification include: ejector pin peeling module 100, locking cover plate 101, ejector pin cap 102, suction head 103, coupling 104, ejector pin body 105, ball spline 106, upper connecting plate 107, ejector pin 108, chip slot 109, fixing hole 110, suction seat 111, lifting rod 112, suction hole 113, suction channel 114, upper magnet 115, positioning pin 116, local motion module 200, local motor 201, lower connecting plate 202, motor fixing plate 203, driving cam 204, Z-direction motion plate 205, cross guide rail 206, lower magnet 207, cam follower 208, connecting shaft 209, positioning hole 210, overall motion module 300, overall motor 301, guide rail mounting plate 302, motor mounting plate 303, linear guide rail 304, turbine 305, worm 306, manual adjusting nut 307, bearing seat 308, ball screw 309.

[0042] Embodiment 1 A large-size chip demoulding ejector pin mechanism, as shown in the attached Figure 1 figures, includes an ejector pin peeling module 100 and a Z-direction motion module. The ejector pin peeling module 100 includes an ejector pin assembly and a suction assembly, and the suction assembly is slidably inserted into the ejector pin assembly; the Z-direction motion module includes a local motion module 200 and an overall motion module 300. The local motion module 200 is connected to the output end of the overall motion module 300, the ejector pin assembly is fixedly connected to the local motion module 200, and the suction assembly is connected to the output end of the local motion module 200.

[0043] The overall motion module 300 drives the local motion module 200 to move upward, thereby driving the ejector pin peeling module 100 to move upward to contact the blue film; the ejector pin assembly contacts the blue film at the corresponding position of the chip and fixes the blue film around the chip, and the suction assembly adsorbs the blue film at the corresponding position of the chip; the local motion module 200 first drives the suction assembly to move upward a small distance and then reset to realize the pre-loosening of the chip and the blue film, and then drives the suction assembly to move downward a small distance to realize the peeling of the chip and the blue film.

[0044] Combined with the attached Figure 2 and Figure 3As shown in the figure, the ejector pin assembly includes an ejector pin cap 102 and an ejector pin body 105 connected in sequence from top to bottom. A locking cover plate 101 is sleeved at the connection between the ejector pin cap 102 and the ejector pin body 105, and the locking cover plate 101 can increase the connection sealing performance between the ejector pin cap 102 and the ejector pin body 105. A chip slot 109 is opened at the center position of the top of the ejector pin cap 102, and the size of the chip slot 109 matches the size of the chip to be demolded, so that the chip to be demolded can enter the chip slot 109. A plurality of ejector pins 108 are vertically and fixedly connected to the bottom of the chip slot 109, and the plurality of ejector pins 108 are distributed in a rectangular array at the bottom of the chip slot 109. A vacuum chamber is formed inside the ejector pin cap 102. A vacuum hole (not shown in the figure) is axially opened in the ejector pin body 105. The upper end of the vacuum hole penetrates the top of the ejector pin body 105 and communicates with the vacuum chamber, and the lower end of the vacuum hole penetrates the bottom of the ejector pin body 105. A plurality of fixing holes 110 are opened at the top of the ejector pin cap 102. The plurality of fixing holes 110 are arranged around the chip slot 109, and the plurality of fixing holes 110 all penetrate the ejector pin cap 102 and communicate with the vacuum chamber.

[0045] Combined with the attached Figure 4 and Figure 5 As shown in the figure, the adsorption assembly includes an adsorption seat 111 and a lifting rod 112 connected in sequence from top to bottom. Specifically, the bottom of the adsorption seat 111 and the top of the lifting rod 112 are connected by a coupling 104. A plurality of adsorption heads 103 are fixedly connected to the top of the adsorption seat 111, and the plurality of adsorption heads 103 and the plurality of ejector pins 108 are arranged staggeredly. As shown in the attached Figure 3 As shown in the figure, in this embodiment, the horizontal projection of the adsorption head 103 is rectangular, and the adsorption head 103 is located between two adjacent rows of ejector pins 108. A movement hole is opened at the position of the chip slot 109 corresponding to the adsorption head 103, and the adsorption head 103 is slidably connected in the movement hole, and the adsorption head 103 can pass through the movement hole and extend into the chip slot 109. A plurality of adsorption holes 113 are opened at the top of the adsorption head 103, and an adsorption channel 114 is opened in the adsorption seat 111. The adsorption channel 114 communicates between the plurality of adsorption holes 113 and the vacuum chamber. The lifting rod 112 is slidably inserted into the ejector pin body 105. Specifically, the lifting rod 112 and the ejector pin body 105 are coaxially slidably connected through a ball spline 106, and a first reset member (not shown in the figure) is connected between the lifting rod 112 and the ball spline 106. In this embodiment, the first reset member is a first compression spring. The first compression spring is sleeved on the lifting rod 112, and one end of the first compression spring is fixedly connected to the outer wall of the lifting rod 112 and the other end is fixedly connected to the end of the ball spline 106.

[0046] Combined with the attached Figure 4 , Figure 6 and Figure 7As shown, a connecting member is provided between the thimble assembly and the local motion module 200, and the thimble assembly and the local motion module 200 are detachably connected through the connecting member. Specifically, the connecting member includes an upper connecting plate 107 and a lower connecting plate 202. The upper connecting plate 107 is fixedly connected to the bottom of the thimble body 105, and the lower connecting plate 202 is fixedly connected to the top of the local motion module 200. A plurality of upper mounting holes are formed in the bottom of the upper connecting plate 107, and upper magnets 115 are fixedly connected in the upper mounting holes. Lower mounting holes are formed in the top of the lower connecting plate 202 at positions corresponding to the upper mounting holes, and lower magnets 207 are fixedly connected in the lower mounting holes. The opposite sides of the upper magnets 115 and the lower magnets 207 have opposite magnetic poles. In this embodiment, the bottom of the upper magnet 115 is the south pole, and the top of the lower magnet 207 is the north pole to ensure that the upper magnets 115 and the lower magnets 207 attract each other with opposite poles. A plurality of positioning pins 116 are fixedly connected to the bottom of the upper connecting plate 107, and positioning holes 210 are formed in the top of the lower connecting plate 202 at positions corresponding to the positioning pins 116. The positioning pins 116 are inserted into the positioning holes 210 to realize the positioning of the upper connecting plate 107 and the lower connecting plate 202.

[0047] Combined with Figure 7 and Figure 8 As shown, the local motion module 200 includes a motor fixing plate 203 and a local motor 201 fixedly connected to the motor fixing plate 203. A driving cam 204 is fixedly connected to the output shaft of the local motor 201. A Z-direction moving plate 205 is vertically slidably connected to the motor fixing plate 203. Specifically, an intersecting guide rail 206 is fixedly connected to the motor fixing plate 203, and the Z-direction moving plate 205 is fixedly connected to the slider of the intersecting guide rail 206. A second reset member (not shown in the figure) is connected between the motor fixing plate 203 and the Z-direction moving plate 205. In this embodiment, the second reset member is a second compression spring. The second compression spring is vertically arranged, and one end of the second compression spring is fixedly connected to the motor fixing plate 203 and the other end is fixedly connected to the Z-direction moving plate 205. A cam follower 208 is fixedly connected to the Z-direction moving plate 205, and the driving cam 204 is tangent to the cam follower 208 so that the Z-direction moving plate 205 can move up and down.

[0048] The lower connecting plate 202 is fixedly connected to the top of the motor fixing plate 203. The Z-direction moving plate 205 is fixedly connected to the jacking rod 112. Specifically, a connecting shaft 209 is vertically and fixedly connected to the top of the Z-direction moving plate 205. The top of the connecting shaft 209 passes through the motor fixing plate 203 and the lower connecting plate 202 from bottom to top in sequence. The bottom of the jacking rod 112 passes through the upper connecting plate 107 and is fixedly connected to the top of the connecting shaft 209. The lower end of the vacuum hole of the thimble body 105 is communicated with an external vacuum generator. Specifically, communication holes are vertically opened in the upper connecting plate 107 and the lower connecting plate 202 at positions corresponding to the vacuum hole, and the upper end of the communication hole is communicated with the lower end of the vacuum hole; a vacuum channel is opened in the motor fixing plate 203, one end of the vacuum channel is communicated with the lower end of the communication hole, and the other end of the vacuum channel is communicated with the external vacuum generator through a pipeline.

[0049] Combined with the attached Figure 7 and Figure 9 As shown, the overall motion module 300 includes a motor mounting plate 303 and an overall motor 301 fixedly connected to the motor mounting plate 303. A guide rail mounting plate 302 is fixedly connected to the side of the motor mounting plate 303 away from the overall motor 301. A worm 306 is coaxially and fixedly connected to the output shaft of the overall motor 301. The worm 306 passes through the motor mounting plate 303 and the guide rail mounting plate 302. A ball screw 309 is vertically arranged on the guide rail mounting plate 302. Specifically, a bearing seat 308 is fixedly connected to the guide rail mounting plate 302, a limit bearing is fixedly connected inside the bearing seat 308, and the screw rod of the ball screw 309 is fixedly inserted into the limit bearing, and the rotation connection between the screw rod of the ball screw 309 and the bearing seat 308 is realized through the limit bearing. A turbine 305 is coaxially and fixedly connected to the top of the screw rod of the ball screw 309. The turbine 305 meshes with the worm 306. A manual adjusting nut 307 is coaxially and fixedly connected to the top of the turbine 305. The nut of the ball screw 309 is fixedly connected to the motor fixing plate 203 to drive the motor fixing plate 203 to move up and down. The motor fixing plate 203 is vertically slidably connected to the guide rail mounting plate 302. Specifically, a linear guide rail 304 is fixedly connected to the guide rail mounting plate 302, and the motor fixing plate 203 is fixedly connected to the slider of the linear guide rail 304.

[0050] The specific implementation process is as follows: (1) Demoulding Preparation: The overall motor 301 of the overall motion module 300 drives the worm 306 to rotate. The worm 306 drives the screw of the ball screw 309 to rotate through the turbine 305, driving the nut of the ball screw 309 to move upward. Thus, the entire local motion module 200 and the ejector pin peeling module 100 are driven to move upward through the motor fixing plate 203, enabling the chip to be demoulded to enter the chip slot 109. At this time, several ejector pins 108 and several suction heads 103 contact the blue film at the corresponding positions of the chip, and the top of the ejector pin cap 102 contacts the blue film around the chip. The pick-up head moves above the chip to be demoulded, contacts and adsorbs the chip to be demoulded, and remains relatively stationary with the chip.

[0051] (2) Pre-loosening of Chip and Blue Film: Start the external vacuum generator. The vacuum generator is connected to the vacuum channel opened in the motor fixing plate 203 through a pipeline, thereby creating a vacuum environment in the vacuum channel of the motor fixing plate 203, the communication holes of the upper connecting plate 107 and the lower connecting plate 202, the vacuum holes of the ejector pin body 105, and the vacuum cavity inside the ejector pin cap 102. The suction holes 113 connected to the vacuum cavity through the suction channel 114 use negative pressure to adsorb and fix the blue film at the corresponding positions of the chip, and the fixing holes 110 connected to the vacuum cavity use negative pressure to adsorb and fix the blue film around the chip.

[0052] The local motor 201 of the local motion module 200 drives the drive cam 204 to rotate. At this time, the cam follower 208 is tangent to the ascending section of the drive cam 204, causing the cam follower 208 to move upward a small distance (4 mm), driving the Z-direction movement plate 205 to move upward a small distance. Thus, through the connecting shaft 209, the lifting rod 112, and the suction seat 111, the suction head 103 is driven to move upward a small distance, and the pick-up head follows the suction head 103 to move upward, lifting the chip and the blue film at its corresponding position upward a small distance. At this time, the blue film at the corresponding position of the chip is stretched and shows serrated folds, reducing the contact area between the chip and the blue film and the tightness of their connection, achieving the pre-loosening of the chip and the blue film.

[0053] The local motor 201 continues to drive the drive cam 204 to rotate. At this time, the cam follower 208 is tangent to the reset section of the drive cam 204, causing the cam follower 208 to move downward a small distance (4 mm) to reset. The first compression spring drives the lifting rod 112 to move downward a small distance to reset, driving the suction head 103 to move downward a small distance to reset, and the pick-up head follows the suction head 103 to move downward to reset, enabling the chip to return to the chip slot 109 and be supported by the ejector pins 108. The second compression spring drives the Z-direction movement plate 205 to move downward a small distance to reset, preparing for the subsequent chip demoulding operation.

[0054] (3) Chip Demolding: The local motor 201 continues to drive the drive cam 204 to rotate. At this time, the cam follower 208 is tangent to the descending section of the drive cam 204, causing the cam follower 208 to move downward a short distance (4 mm), driving the Z-direction moving plate 205 to move downward a short distance. Thus, through the connecting shaft 209, the lifting rod 112, and the adsorption seat 111, the adsorption head 103 is driven to move downward a short distance. The blue film at the corresponding position of the chip follows the adsorption head 103 to move downward a short distance. The chip is restricted from moving downward by the ejector pin 108, so as to peel the chip off the blue film and achieve chip demolding. The pick-up head takes away the demolded chip.

[0055] The local motor 201 continues to drive the drive cam 204 to rotate. At this time, the cam follower 208 is tangent to the reset section of the drive cam 204, causing the cam follower 208 to move upward a short distance (4 mm) to reset. The first compression spring drives the lifting rod 112 to move upward a short distance to reset, driving the adsorption head 103 to move upward a short distance to reset. The second compression spring drives the Z-direction moving plate 205 to move upward a short distance to reset, preparing for the demolding operation of the next chip.

[0056] (4) Position Avoidance: The overall motor 301 drives the worm 306 to rotate in the reverse direction. The worm 306 drives the screw of the ball screw 309 to rotate in the reverse direction through the turbine 305, driving the nut of the ball screw 309 to move downward. Thus, through the motor fixing plate 203, the entire local motion module 200 and the ejector pin peeling module 100 are driven to move downward, so that the ejector pin peeling module 100 moves away from the wafer stage, performing position avoidance for the horizontal movement of the wafer stage. The wafer stage performs X-direction and Y-direction movements, so that the next chip to be demolded moves to directly above the ejector pin peeling module 100 for the demolding operation of the next chip.

[0057] Embodiment 2 A large-size chip demolding ejector pin mechanism, which is different from that in Embodiment 1 in that: a plurality of ejector pins 108 are detachably connected to the ejector pin cap 102, so as to replace the worn ejector pins 108 after long-term use and ensure the chip demolding effect. Specifically, an ejector pin seat is detachably connected inside the ejector pin cap 102 through bolts, and a plurality of ejector pins 108 are fixedly connected to the top of the ejector pin seat; ejector pin holes are opened at the bottom of the chip groove 109 corresponding to the positions of the ejector pins 108, and the ejector pins 108 pass through the ejector pin holes and extend into the chip groove 109. Adaptively, a relief hole is opened at the position of the ejector pin seat corresponding to the adsorption head 103, and the adsorption head 103 is slidably connected in the relief hole, and the adsorption head 103 sequentially passes through the relief hole and the movement hole and extends into the chip groove 109.

[0058] Embodiment 3 A large-size chip demolding ejector pin mechanism, which is different from that of Embodiment 2 in that: a first photoelectric sensor is fixedly connected to the motor fixing plate 203, and a first sensor sheet metal is fixedly connected to the Z-direction moving plate 205 at a position corresponding to the first photoelectric sensor. The first photoelectric sensor cooperates with the first sensor sheet metal to realize the zero return of the Z-direction moving plate 205, so as to prepare for the next lifting and demolding of the large-size chip.

[0059] Embodiment 4 A large-size chip demolding ejector pin mechanism, which is different from that of Embodiment 3 in that: a second photoelectric sensor is fixedly connected to the guide rail mounting plate 302, and a second sensor sheet metal is fixedly connected to the motor fixing plate 203 at a position corresponding to the first photoelectric sensor. The second photoelectric sensor cooperates with the second sensor sheet metal to realize the zero return of the motor fixing plate 203, so as to prepare for the next lifting and demolding of the large-size chip.

[0060] The above are only the embodiments of the present invention. Specific technical solutions and / or common knowledge such as characteristics well known in the art are not described in detail herein. It should be pointed out that for those skilled in the art, without departing from the technical solution of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the implementation effect of the present invention and the practicality of the patent. The protection scope required by this application should be subject to the content of its claims, and the specific implementation manners and the like described in the specification can be used to interpret the content of the claims.

Claims

1. A large-size chip demoulding ejector pin mechanism, comprising an ejector pin peeling module and a Z-direction movement module, characterized in that: The ejector stripping module includes an ejector assembly and an adsorption assembly, the adsorption assembly is slidably inserted in the ejector assembly, the ejector assembly includes a plurality of ejectors, the adsorption assembly includes a plurality of adsorption heads, the ejectors and the adsorption heads are staggered, and a fixing portion is provided on the top of the ejector assembly around the adsorption assembly; the Z-direction motion module includes a local motion module and an overall motion module, the local motion module is connected to the output end of the overall motion module, the ejector assembly is fixedly connected to the local motion module, and the adsorption assembly is connected to the output end of the local motion module; The overall motion module drives the ejector pin peeling module to move upward so that the ejector pin contacts the blue film at the corresponding position of the chip. The fixing part is used to fix the blue film around the chip, and the adsorption head is used to adsorb the blue film at the corresponding position of the chip. The local motion module first drives the adsorption component to move upward a short distance and then resets it to achieve pre-loosening of the chip and the blue film, and then drives the adsorption component to move downward a short distance to achieve peeling of the chip and the blue film.

2. The large-size chip demoulding ejector pin mechanism according to claim 1, wherein: The ejector pin assembly also includes an ejector pin cap and an ejector pin body which are connected in sequence from top to bottom. A chip slot is provided on the top of the ejector pin cap, and a plurality of ejector pins are arranged at the bottom of the chip slot. A vacuum chamber is formed inside the ejector pin cap, and a vacuum hole is provided in the ejector pin body. One end of the vacuum hole is connected to the vacuum chamber, and the other end is connected to an external vacuum generator. The fixing part includes a plurality of fixing holes which are provided on the top of the ejector pin cap around the adsorption assembly, and the fixing holes are connected to the vacuum chamber.

3. A large-size chip demoulding ejector pin mechanism according to claim 2, characterized in that: The ejector assembly also includes an ejector seat detachably connected to the ejector cap, a plurality of ejectors are fixedly connected to the top of the ejector seat, an ejector hole is opened at the bottom of the chip slot corresponding to the position of the ejector, and the ejector extends from the ejector hole.

4. A large-size chip demolding ejector pin mechanism according to claim 3, characterized in that: The adsorption assembly also includes an adsorption seat and a lifting rod connected in sequence from top to bottom, a plurality of adsorption heads are fixedly connected to the top of the adsorption seat, a movement hole is provided at the bottom of the chip slot corresponding to the position of the adsorption head, and a clearance hole is provided at the position of the ejector seat corresponding to the adsorption head, and the adsorption head is slidably connected in the movement hole and the clearance hole; an adsorption hole is provided at the top of the adsorption head, an adsorption channel is provided in the adsorption seat, and the adsorption channel is connected between the adsorption hole and the vacuum chamber; the lifting rod is slidably inserted in the ejector body, and a first reset member is connected between the lifting rod and the ejector body.

5. A large-size chip demoulding ejector pin mechanism according to claim 4, characterized in that: A connecting piece is arranged between the ejector assembly and the local motion module, and the ejector assembly and the local motion module are detachably connected via the connecting piece.

6. The large-size chip demoulding ejector pin mechanism according to claim 5, wherein: The connecting member includes an upper connecting plate fixedly connected to the bottom of the ejector body and a lower connecting plate fixedly connected to the top of the local motion module. The upper connecting plate and the lower connecting plate are provided with a plurality of magnets opposite to each other, and the magnets of the upper connecting plate and the magnets of the lower connecting plate have opposite magnetic poles on one side. The bottom of the upper connecting plate is provided with a plurality of positioning pins, and the top of the lower connecting plate is provided with positioning holes corresponding to the positions of the positioning pins.

7. A large-size chip demolding ejector pin mechanism according to claim 6, characterized in that: The local motion module includes a motor fixing plate and a local motor fixedly connected to the motor fixing plate. A driving cam is fixedly connected to the output shaft of the local motor; a Z-direction moving plate is vertically slidably connected to the motor fixing plate, and a second reset member is connected between the motor fixing plate and the Z-direction moving plate; a cam follower is arranged on the Z-direction moving plate, and the driving cam is tangent to the cam follower so that the Z-direction moving plate can move up and down, and the Z-direction moving plate is fixedly connected to the jacking rod.

8. A large-size chip demoulding ejector pin mechanism according to claim 7, characterized in that: A first photoelectric sensor is arranged on the motor fixing plate, and a first sensor sheet metal corresponding to the first photoelectric sensor is sheet metal arranged on the Z-direction moving plate. The first photoelectric sensor cooperates with the first sensor sheet metal to realize the zero return of the Z-direction moving plate.

9. A large-size chip demolding ejector pin mechanism according to claim 8, characterized in that: The overall motion module includes a motor mounting plate and an overall motor fixedly connected to the motor mounting plate. A worm is fixedly connected to the output shaft of the overall motor; a ball screw is arranged on the motor mounting plate, a turbine is fixedly connected to the screw rod of the ball screw, the turbine meshes with the worm, and a manual adjusting nut is fixedly connected to the top of the turbine; the nut of the ball screw is fixedly connected to the motor fixing plate, and the motor fixing plate is slidably connected to the motor mounting plate.

10. A large-size chip demolding ejector pin mechanism according to claim 9, characterized in that: A second photoelectric sensor is arranged on the motor mounting plate, and a second sensor sheet metal corresponding to the second photoelectric sensor is arranged on the motor fixing plate. The second photoelectric sensor cooperates with the second sensor sheet metal to realize the zero return of the motor fixing plate.

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