Wafer basket grabbing device with detection device
By introducing detection devices and optimizing the drive structure into the wafer basket grabbing device, the abnormal operation problem of equipment caused by the basket pressing phenomenon is solved, and miniaturization and efficient grasping are achieved.
Patent Information
- Application Number
- CN202510636432.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-17
- Publication Date
- 2025-07-04
AI Technical Summary
Existing cleaning machines are prone to basket pressing when grabbing wafer baskets, resulting in abnormal operation of the equipment, and the equipment is large in size, large in area and low efficiency.
A wafer basket grabbing device equipped with a detection device is designed, including a substrate, a clamping jaw, and a detection device. The vertical plate sensor and a reset spring are used to detect whether the clamping jaw accurately clamp the wafer basket, and alarm in time to avoid the basket pressing phenomenon, and the gripping process is optimized through the electric lifting device and the sliding block drive device.
It realizes timely detection of basket pressure phenomenon, ensures the normal operation of the equipment, reduces the equipment volume, and improves the grab speed and efficiency.
Smart Images
Figure CN120261386A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor wafer cleaning equipment, and particularly to a wafer cassette gripping device. Background Art
[0002] In the production of semiconductor devices, approximately 20% of the processes are related to wafer cleaning. After the wafer is processed through different processes such as slicing, chamfering, grinding, surface treatment, polishing, and epitaxy, its surface has been severely contaminated. The purpose of cleaning is to remove contaminants such as particles, metal ions, and organic substances on the wafer surface.
[0003] Existing cleaning machines usually have a row of cleaning tanks. A cleaning cassette is provided in the cleaning tank, and a guide rail is provided above the cleaning tank; a movement driving device is used to drive a cleaning cassette hook to move on the guide rail to grip the cassette. When the cleaning cassette hook descends to grip the cleaning cassette, occasionally the gripping fails because the cleaning cassette is not properly positioned, which is commonly called pressing the cassette. If the situation of pressing the cassette occurs and is not detected and processed in time, it will seriously affect the normal operation of the entire cleaning equipment and greatly reduce the production efficiency. In addition, when there are many cleaning tanks, the horizontal guide rail is relatively long, which will cause the cleaning machine to be relatively large and occupy a large area; at the same time, the movement driving device takes a long time to run on the guide rail and has low efficiency. Summary of the Invention
[0004] One object of the present invention is to provide a wafer cassette gripping device provided with a detection device, which can be detected in time when the cassette is pressed.
[0005] Another object of the present invention is to provide a wafer cassette gripping device provided with a detection device, which has the characteristics of small volume and fast gripping speed in view of the deficiencies of the prior art.
[0006] The technical solution adopted by the present invention is as follows.
[0007] A wafer cassette gripping device provided with a detection device, characterized in that it includes a horizontally arranged substrate, a substrate movement driving device, two jaws, two jaw horizontal driving mechanisms installed on the substrate, and a plurality of detection devices; the detection device includes a box body.
[0008] The two jaws are respectively connected to a jaw horizontal driving mechanism; the side of one jaw away from the other jaw is connected to the box body.
[0009] A rotating shaft is horizontally arranged on the box body. A part of the rotating shaft is located inside the cavity of the box body, and a part is located outside the cavity of the box body. A vertical plate perpendicular to the rotating shaft is installed on the part of the rotating shaft inside the cavity of the box body. An installation groove with an opening downward is arranged directly above the vertical plate inside the cavity of the box body. A vertical plate sensor is arranged on the installation groove, and the top end of the vertical plate is located outside the installation groove. The part of the rotating shaft inside the cavity of the box body is connected to a return spring, and a part of the return spring is in contact with the cavity of the box body. A vertical rod connected to the rotating shaft is arranged outside the box body. When the distance between the two clamping jaws is equal to the width of a wafer cassette and the vertical rod contacts the side surface of the wafer cassette, the top end of the vertical plate is located inside the installation groove. When the vertical rod does not contact the side surface of the wafer cassette, under the action of the return spring, the top end of the vertical plate is located outside the installation groove.
[0010] A guide groove is vertically arranged on the clamping jaw connected to the box body. The box body is slidably installed on the guide groove. A box body sensor is arranged on the substrate, and the box body sensor is connected to an alarm device.
[0011] The beneficial effects are as follows: The substrate movement driving device drives the substrate to descend from above the wafer cassette, and the two clamping jaws are respectively located on both sides of the wafer cassette. Under the action of the clamping jaw horizontal driving mechanism, the two clamping jaws approach each other. When the distance between the two clamping jaws is equal to the width of a wafer cassette, the bottom end of the vertical rod approaches the side surface of the wafer cassette and contacts the wafer cassette, causing the rotating shaft to rotate. The top end of the vertical plate moves into the installation groove. The vertical plate sensor at the top end of the vertical plate can detect that the top end of the vertical plate enters the installation groove, indicating that the two clamping jaws accurately clamp the wafer cassette at this time. When the two clamping jaws move away from each other, under the action of the return spring, the top end of the vertical plate moves outside the installation groove, and the vertical plate sensor at the top end of the vertical plate cannot detect the top end of the vertical plate. When the substrate descends and the bottom end of the vertical rod is lifted by the wafer cassette, the box body moves upward. When the box body sensor detects the top end of the box body, it indicates that the phenomenon of pressing the cassette has occurred, which is convenient to remind manual processing and is beneficial to ensuring the normal operation of the cleaning equipment.
[0012] As a preferred technical solution, the substrate movement driving device includes a horizontal rail. A sliding block is arranged on the horizontal rail. The sliding block is connected to a sliding block movement driving device that can drive the sliding block to move on the horizontal rail. An electric lifting device is vertically arranged on the sliding block, and the bottom end of the output shaft of the electric lifting device is connected to a substrate.
[0013] As a preferred technical solution, a slide rail is horizontally arranged on the substrate. The clamping jaw horizontal driving mechanism includes a slider arranged on the slide rail. Each slider is connected to the top end of a clamping jaw. Electric driving devices are arranged at both ends of each slide rail. The output shaft of the electric driving device is parallel to the slide rail and is connected to the slider on the slide rail.
[0014] As a preferred technical solution, a slide rail is horizontally arranged on the substrate. The jaw horizontal driving mechanism includes a slider arranged on the slide rail, and each slider is connected to the top end of a jaw; on each slider on the slide rail, an electric driving device is arranged on the side away from the other slider. The output shaft of the electric driving device is parallel to the slide rail and is connected to the slider on the slide rail; At the bottom end of the output shaft of the electric lifting device, a substrate rotation motor is vertically arranged. The bottom end of the output shaft of the substrate rotation motor is connected to the center of the substrate; The two sliders and the two electric driving devices are both located on the left side of the center of the substrate, or, the two sliders and the two electric driving devices are both located on the right side of the center of the substrate.
[0015] Adopting this technical solution, the substrate can rotate along a straight line passing through the center of the substrate and perpendicular to the ground. Thus, the grasping range of the wafer cassette grasping device is a longitudinal strip-shaped area directly below the substrate with a width equal to the diameter of the bottom surface of the substrate. In the case of the same number of cleaning tanks, compared with the grasping mechanism with a vertical row of cleaning tanks, the wafer cassette grasping device has a smaller volume, the running time of the slider movement driving device on the horizontal rail is shorter, and the cleaning efficiency is high.
[0016] As a preferred technical solution, the electric driving device is an electric push rod or an electric screw.
[0017] As a preferred technical solution, the electric lifting device is an electric linear actuator.
[0018] As a preferred technical solution, a first rack is arranged on the horizontal rail. The slider movement driving device includes a first driving motor vertically arranged, and a first gear meshing with the first rack is arranged on the output shaft of the first driving motor.
[0019] As a preferred technical solution, the vertical rod is connected to the rotating shaft through a clamping seat.
[0020] As a preferred technical solution, hanging grooves are respectively arranged on the left and right sides of the wafer cassette, and a cassette hook adapted to the hanging groove is arranged on the bottom end of each jaw close to the side of the other jaw.
[0021] As a preferred technical solution, the box body sensor is located on the ground of the substrate and between the two jaws. Description of the Drawings
[0022] Figure 1 Schematic three-dimensional structure diagram of the detection device.
[0023] Figure 2 is Figure 1 Left view of the shown detection device.
[0024] Figure 3 is Figure 2 Cross-sectional view of the shown detection device along A-A'.
[0025] Figure 4 is Figure 3 A partial enlarged view of part B of
[0026] Figure 5 is Figure 1 The front view of the detection device shown
[0027] Figure 6 is Figure 5 The sectional view of the detection device shown along C-C’
[0028] Figure 7 is Figure 6 A partial enlarged view of part E of
[0029] Figure 8 is Figure 5 The sectional view of the detection device shown along D-D’
[0030] Figure 9 It is a schematic structural diagram of a preferred embodiment of the wafer cassette gripping device of the present utility model.
[0031] Figure 10 is Figure 9 A partial enlarged view of part F of
[0032] Figure 11 is Figure 9 A partial enlarged view of part G of
[0033] Figure 12 is Figure 9 A partial enlarged view of part H of
[0034] Figure 13 is Figure 9 A partial enlarged view of part I of
[0035] Figure 14 is Figure 9 A state diagram of the wafer cassette gripping device shown
[0036] Figure 15 is Figure 14 A partial enlarged view of part J of
[0037] Figure 16 is Figure 9 A state diagram of the wafer cassette gripping device shown
[0038] Figure 17 is Figure 16 A partial enlarged view of part K of
[0039] Figure 18 is Figure 9 A state diagram of the wafer cassette gripping device shown
[0040] Figure 19 is Figure 18 a partial enlarged view of the L part of
[0041] Figure 20 is a schematic structural diagram of another preferred embodiment of the wafer cassette gripping device of the present utility model.
[0042] Figure 21 is Figure 20 a partial enlarged view of the M part of
[0043] Figure 22 is Figure 20 a partial enlarged view of the N part of
[0044] Figure 23 is a schematic structural diagram of another preferred embodiment of the wafer cassette gripping device of the present utility model.
[0045] Figure 24 is Figure 23 a state diagram of the wafer cassette gripping device shown in
[0046] Wherein: substrate - 1; slide rail - 10; jaw - 2; guide groove - 21; cassette hook - 22; jaw horizontal drive mechanism - 3; slider - 31; electric drive device - 32; output shaft of the electric drive device - 33; box body - 4; rotating shaft - 41; box body cavity - 42; vertical plate - 43; return spring - 44; installation groove - 45; vertical plate sensor - 46; vertical rod - 47; box body sensor - 48; jaw holder - 49; wafer cassette - 5; hanging groove - 51; horizontal rail - 6; sliding block - 61; first rack - 62; first gear - 64; electric lifting device - 7; output shaft of the electric lifting device - 71; cleaning tank - 8. Detailed implementation manners
[0047] Next, the present invention will be further described in conjunction with the drawings and embodiments.
[0048] As Figure 1-17 shown, a wafer cassette gripping device provided with a detection device is characterized in that: it includes a horizontally arranged substrate 1, a substrate movement drive device, two jaws 2, two jaw horizontal drive mechanisms 3 installed on the substrate 1, and several detection devices; the detection device includes a box body 4.
[0049] The two clamping jaws 2 are respectively connected to a clamping jaw horizontal driving mechanism 3. The two clamping jaws 2 are respectively located on both sides of the center of the substrate 1. The left side of one clamping jaw 2 on the left side of the center of the substrate 1 is connected to the box body 4. A rotating shaft 41 is horizontally arranged on the box body 4. A part of the rotating shaft 41 is located inside the box body cavity 42, and a part is located outside the box body cavity 42; A vertical plate 43 perpendicular to the rotating shaft 41 is installed on the part of the rotating shaft 41 inside the box body cavity 42. An installation groove 45 with a downward opening is arranged directly above the vertical plate 43 in the box body cavity 42. A vertical plate sensor 46 is arranged on the installation groove 45. The top end of the vertical plate 43 is located outside the installation groove 45; The part of the rotating shaft 41 inside the box body cavity 42 is connected to the return spring 44. A part of the return spring 44 is in contact with the box body cavity 42; A vertical rod 47 connected to the rotating shaft 41 is arranged outside the box body 4. When the distance between the two clamping jaws 2 is equal to the width of a wafer cassette 5 and the vertical rod 47 contacts the side surface of the wafer cassette, the top end of the vertical plate 43 is located inside the installation groove 45. When the vertical rod 47 does not contact the side surface of the wafer cassette, under the action of the return spring 44, the top end of the vertical plate 43 is located outside the installation groove 45.
[0050] As Figure 11 shown, a guiding groove 21 is vertically arranged on the clamping jaw 2 connected to the box body 4. The box body 4 is slidably installed on the guiding groove 21. A box body sensor 48 is arranged on the substrate 1. The box body sensor 48 is connected to an alarm device. The box body sensor 48 is located on the ground of the substrate 1 and between the two clamping jaws 2. The length direction of the substrate 1 adopts a length omission drawing method.
[0051] The substrate movement driving device includes a horizontal rail 6. A sliding block 61 is arranged on the horizontal rail 6. The sliding block 61 is connected to a sliding block movement driving device that can drive the sliding block 61 to move on the horizontal rail 6; An electric lifting device 7 is vertically arranged on the sliding block 61. The bottom end of the output shaft 71 of the electric lifting device is connected to the substrate 1.
[0052] A sliding rail 10 is horizontally arranged on the substrate 1. The clamping jaw horizontal driving mechanism 3 includes a slider 31 arranged on the sliding rail. Each slider 31 is connected to the top end of a clamping jaw 2; Electric driving devices 32 are arranged at both ends of each sliding rail 10. The output shaft 33 of the electric driving device is parallel to the sliding rail 10 and is connected to the slider 31 on the sliding rail 10. The electric driving device 32 is an electric push rod.
[0053] In the middle of the part of the rotating shaft 41 inside the box body cavity 42, a vertical plate 43 perpendicular to the rotating shaft 41 is installed.
[0054] The electric lifting device 7 is an electric linear actuator.
[0055] A first rack 62 is arranged on the horizontal rail 6. The sliding block movement driving device includes a first driving motor 63 arranged vertically. A first gear 64 meshing with the first rack 62 is arranged on the output shaft of the first driving motor 63.
[0056] As Figure 13 shown, hanging grooves 51 are provided on both the left and right sides of the wafer cassette 5, and a cassette hook 22 adapted to the hanging groove 51 is provided near the other jaw 2 on the bottom end of each jaw 2.
[0057] A detection device is installed on the left side of the center of the plate 1. A detection device is provided on the left side of one of the jaws 2. The substrate movement driving device drives the substrate 1 to descend from above the wafer cassette, and the two jaws 2 are respectively located on both sides of the wafer cassette. Under the action of the jaw horizontal driving mechanism 3, the two jaws 2 approach each other. When the distance between the two jaws 2 is equal to the width of a wafer cassette, the bottom end of the vertical rod 47 near the side of the wafer cassette contacts the wafer cassette and causes the rotating shaft 41 to rotate, and the top end of the vertical plate 43 moves into the installation groove 45. The vertical plate sensor 46 at the top end of the vertical plate 43 can detect that the top end of the vertical plate 43 enters the installation groove 45. At this time, it indicates that the two jaws 2 accurately hold the wafer cassette. When the two jaws 2 move away from each other, under the action of the return spring 44, the top end of the vertical plate 43 moves out of the installation groove 45, and the vertical plate sensor 46 at the top end of the vertical plate 43 cannot detect the top end of the vertical plate 43. When the substrate 1 descends and the bottom end of the vertical rod 47 is lifted by the wafer cassette, the box body 4 moves upward, and the box body sensor 48 detecting the top end of the box body 4 indicates that a cassette pressing has occurred. At this time, it is convenient to remind manual handling.
[0058] Embodiment 2. As Figure 20-22 shown, the difference between this embodiment and Embodiment 1 is that the right side of one of the jaws 2 on the right side of the center of the substrate 1 is connected to the box body 4. Thus, the detection device is installed on the right side of one of the jaws 2 on the right side of the center of the plate 1.
[0059] The electric driving device 32 is an electric screw. The vertical rod 47 is connected to the rotating shaft 41 through a clamp seat 49. The box body sensor 48, the vertical plate sensor 46, the substrate movement driving device, and the jaw horizontal driving mechanism 3 are all connected to the control device of the cleaning machine through wires.
[0060] Embodiment 3. As Figure 23-24 shown, the difference between this embodiment and Embodiment 1 is that a slide rail 10 is horizontally provided on the substrate 1. The jaw horizontal driving mechanism 3 includes a slider 31 provided on the slide rail. Each slider 31 is connected to the top end of a jaw 2; an electric driving device 32 is provided on the side of each slider 31 on the slide rail 10 away from the other slider 31. The output shaft 33 of the electric driving device is parallel to the slide rail 10 and is connected to the slider 31 on the slide rail 10; A substrate rotation motor 72 is vertically provided at the bottom end of the output shaft 71 of the electric lifting device. The bottom end of the output shaft 73 of the substrate rotation motor is connected to the center of the substrate 1; The two sliding blocks 61 and the two electric driving devices 32 are both located on the left side of the center of the substrate 1.
[0061] In another example, the two sliding blocks 61 and the two electric drive devices 32 are both located on the right side of the center of the substrate 1.
[0062] With this technical solution, the substrate 1 can rotate along a straight line passing through the center of the substrate 1 and perpendicular to the ground. Thus, the grasping range of the wafer cassette grasping device is a longitudinal strip-shaped area directly below the substrate 1 with a width equal to the diameter of the bottom surface of the substrate. In the case of the same number of cleaning tanks, compared with the grasping mechanism provided with a vertical row of cleaning tanks, the wafer cassette grasping device has a smaller volume, the sliding block motion drive device runs on the horizontal rail 6 for a shorter time, and the cleaning efficiency is high.
[0063] The embodiments listed above are only for understanding the present invention and are not intended to limit the technical solutions described in the present invention. Those of ordinary skill in the relevant art can also make various changes or deformations, and all equivalent changes or deformations should be covered within the protection scope of the present invention. Where the present invention is not described in detail, it is the well-known technology of those skilled in the art of the present technology field.
Claims
1. A wafer cassette gripping device provided with a detection device, characterized in that: It includes a horizontally arranged substrate, a substrate movement driving device, two clamping jaws, two clamping jaw horizontal driving mechanisms installed on the substrate, and several detection devices; the detection device includes a box body; the two clamping jaws are respectively connected to a clamping jaw horizontal driving mechanism; the side of one clamping jaw away from the other clamping jaw is connected to the box body; A rotating shaft is horizontally arranged on the box body, a part of the rotating shaft is located inside the box body cavity, and a part is located outside the box body cavity; a vertical plate perpendicular to the rotating shaft is installed on the part of the rotating shaft inside the box body cavity, an installation groove with a downward opening is arranged directly above the vertical plate inside the box body cavity, a vertical plate sensor is arranged on the installation groove, and the top end of the vertical plate is located outside the installation groove; the part of the rotating shaft inside the box body cavity is connected to a return spring, and a part of the return spring is in contact with the box body cavity; a vertical rod connected to the rotating shaft is arranged outside the box body; when the distance between the two clamping jaws is equal to the width of a wafer cassette and the vertical rod contacts the side surface of the wafer cassette, the top end of the vertical plate is located inside the installation groove; when the vertical rod does not contact the side surface of the wafer cassette, under the action of the return spring, the top end of the vertical plate is located outside the installation groove; a guiding groove is vertically arranged on the clamping jaw connected to the box body, the box body is slidably installed on the guiding groove, a box body sensor is arranged on the substrate, and the box body sensor is connected to an alarm device.
2. The wafer cassette gripping device provided with a detection device as described in claim 1, wherein: The substrate movement driving device includes a horizontal rail, a sliding block is arranged on the horizontal rail, and the sliding block is connected to a sliding block movement driving device that can drive the sliding block to move on the horizontal rail; an electric lifting device is vertically arranged on the sliding block, and the bottom end of the output shaft of the electric lifting device is connected to a substrate.
3. The wafer cassette gripping device provided with a detection device according to claim 2, characterized in that: A sliding rail is horizontally arranged on the substrate, the clamping jaw horizontal driving mechanism includes a slider arranged on the sliding rail, and each slider is connected to the top end of a clamping jaw; electric driving devices are arranged at both ends of each sliding rail, and the output shaft of the electric driving device is parallel to the sliding rail and is connected to the slider on the sliding rail.
4. The wafer cassette gripping device provided with a detection device according to claim 2, characterized in that: A sliding rail is horizontally arranged on the substrate, the clamping jaw horizontal driving mechanism includes a slider arranged on the sliding rail, and each slider is connected to the top end of a clamping jaw; an electric driving device is arranged on the side of each slider on the sliding rail away from the other slider, and the output shaft of the electric driving device is parallel to the sliding rail and is connected to the slider on the sliding rail; A substrate rotation motor is vertically arranged at the bottom end of the output shaft of the electric lifting device, and the bottom end of the output shaft of the substrate rotation motor is connected to the center of the substrate; The two sliding blocks and the two electric driving devices are both located on the left side of the center of the substrate, Or, the two sliding blocks and the two electric driving devices are both located on the right side of the center of the substrate.
5. The wafer cassette gripping device provided with a detection device according to claim 4, wherein: The electric driving device is an electric push rod or an electric screw.
6. The wafer cassette gripping device provided with a detection device according to claim 2, wherein: The electric lifting device is an electric linear actuator.
7. The wafer cassette gripping device provided with a detection device according to claim 2, characterized in that: A first rack is arranged on the horizontal rail, and the sliding block movement driving device includes a first driving motor arranged vertically, and a first gear meshing with the first rack is arranged on the output shaft of the first driving motor.
8. The wafer cassette gripping device provided with a detection device according to claim 1, wherein: The vertical rod is connected to the rotating shaft through a clamping seat.
9. The wafer cassette gripping device provided with a detection device according to claim 1, wherein: Hanging grooves are respectively arranged on the left and right sides of the wafer cassette, and flower basket hooks adapted to the hanging grooves are arranged on the side of the bottom end of each clamping jaw close to the other clamping jaw.
10. The wafer cassette gripping device provided with a detection device according to claim 1, characterized in that: The box body sensor is located on the ground of the substrate and between the two clamping jaws.