MOS transistor carrier plate and packaging tool thereof

Abstract

The application relates to the technical field of MOS tube equipment, in particular to a MOS tube carrier plate and packaging tools, a copper substrate, a mounting groove, a mounting chamfer, plastic packaging material, a chip, an isolation layer, a MOS bottom plate and a packaging assembly. The copper substrate is connected to the MOS bottom plate through the packaging assembly. The mounting groove is arranged on the copper substrate. The mounting chamfer is arranged on the mounting groove. The bottom of the chip is adhered in the mounting groove through tin paste. A gap is arranged between the side of the chip and the mounting chamfer. The plastic packaging material is filled in the gap between the chip and the mounting chamfer. The chip is provided with a gate and a source. The isolation layer is arranged between the gate and the source. The drain is arranged on the copper substrate. The copper substrate is uniformly stressed during installation. The mounting chamfer can improve the overall heat dissipation, improve the internal resistance of the product, reduce the overall energy consumption, and the plastic packaging material is arranged to resist external solvents, moisture and impact on the chip part, and ensure the electrical insulation between the chip and the external environment.

Description

Technical Field

[0001] This invention relates to the field of MOSFET device technology, specifically to a MOSFET carrier board and its packaging tool. Background Technology

[0002] MOSFETs are transistors that operate based on the field-effect principle and are widely used in electronic circuits, especially in switching circuits, amplifiers, power management, and radio frequency circuits. A MOSFET is a semiconductor device that primarily controls the conduction path through an electric field. Currently, in the electronics manufacturing industry, heat dissipation for electronic components such as MOSFETs and IGBTs is typically achieved by directly soldering the MOSFET to a MOSFET board and connecting a copper substrate to the MOSFET board, with the MOSFET's drain connected to the copper substrate. This utilizes the properties of the copper substrate to achieve heat dissipation, enhance structural strength, and improve electrical connection. However, in existing technologies, when connecting MOSFETs to the board, the MOSFET's solder material may not be heated or has not yet begun to solidify. This can cause the MOSFET to shift when moved to the soldering table during soldering, requiring the operator to readjust its connection position. Furthermore, when installing the copper substrate to connect the MOSFET's drain for heat dissipation, the bolts on the copper substrate must be tightened uniformly using a diagonal principle to prevent damage to the MOSFET board or loosening during installation. This further complicates the installation of the MOSFET.

[0003] In the prior art, for example, the MOS transistor pressure plate with patent number CN212136423U, the positioning protrusions and limiting components are set to achieve the positioning and limiting of the MOS transistor, preventing it from shifting or tilting and affecting heat dissipation. The design of the positioning protrusions and limiting components increases the contact area between the pressure plate and the MOS transistor, making the force uniform, thereby further preventing the MOS transistor from shifting due to uneven force.

[0004] While existing technologies provide limiting devices to position and limit the MOSFET during installation, thus facilitating the installation of the MOSFET board, the operator still needs to tighten the bolts on the copper substrate one by one when connecting the MOSFET board. After tightening, a torque wrench is still needed to adjust the installation force of the bolts, which is very inconvenient. During the bolt tightening process, it is impossible to guarantee that the bolts are tightened to the appropriate force in one go. If the force is too strong, it will cause excessive friction and damage to the copper substrate and the MOSFET board. If the force is too loose, the copper substrate will easily shift, causing the drain plated on the copper substrate to shift, affecting the heat dissipation effect.

[0005] To address this, a MOS transistor carrier board and its packaging tool are proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a MOS transistor carrier board and its packaging tool. In existing technologies, the tightening force of the copper substrate bolts during MOS board installation cannot be controlled, requiring the use of a torque wrench to adjust the installation force individually, leading to inconvenience. Furthermore, installation can easily result in the copper substrate connection being too tight or too loose, thereby damaging the MOS board and affecting its heat dissipation efficiency.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A MOS transistor carrier board includes a copper substrate, a mounting groove, a mounting chamfer, a molding compound, a chip, an isolation layer, a MOS base plate, and a packaging assembly. The copper substrate is connected to the MOS base plate via the packaging assembly. The mounting groove is formed on the copper substrate. The mounting chamfer is disposed on the mounting groove. The bottom of the chip is adhered to the mounting groove with solder paste. A gap is left between the side of the chip and the mounting chamfer. The molding compound fills the gap between the chip and the mounting chamfer. The chip has a gate and a source. The isolation layer is disposed between the gate and the source. The copper substrate has a drain.

[0009] Preferably, the copper substrate has 32 horizontally arranged mounting slots and 9 vertically arranged mounting slots, with two sets of chips arranged in each mounting slot.

[0010] Preferably, the molding compound is an EMC molding compound material, which is used to resist external solvents, moisture, and impacts on the chip, and to ensure electrical insulation between the chip and the external environment.

[0011] Preferably, the gate and source are connected to the chip by electroplating, and the drain is connected to the copper substrate by electroplating.

[0012] A MOSFET carrier board packaging tool is used to package a MOSFET carrier board, including any of the MOSFET carrier boards described above, and a mounting tool for mounting a MOSFET and a copper substrate, including an upper pressure plate, a connecting plate, a MOSFET base plate, a supporting base plate, a copper substrate, mounting components, bonding components, connecting components, transmission components, and unlocking components. The MOSFET is mounted in a mounting slot on the MOSFET base plate, and the mounting slot has a mounting chamfer. The supporting base plate is disposed at the lower end of the MOSFET base plate, and the connecting plate is disposed at the upper end of the MOSFET base plate. The connecting plate is connected to the supporting base plate, the upper pressure plate is slidably connected to the connecting plate, and the copper substrate is connected to the supporting base plate. The connecting components are disposed on... The lower end of the connecting plate is used to connect and fix the connecting plate to the support base plate. The transmission component and the mounting component are located inside the connecting plate. When the upper pressure plate is pressed repeatedly, the transmission component cooperates with the mounting component to slowly fasten the copper substrate to the MOS base plate and spring back the upper pressure plate until the copper substrate is completely attached to the MOS base plate. The attachment component is located at the lower end of the connecting plate. When the upper pressure plate is pressed after the copper substrate is completely attached to the MOS base plate, the attachment component cooperates with the mounting component to attach the upper pressure plate to the connecting plate, the connecting plate is released from the support base plate, and the drain of the MOS tube is attached to and aligned with the copper substrate. The unlocking component is located on the upper pressure plate and is used to cooperate with the mounting component to spring back the upper pressure plate.

[0013] Preferably, the connecting component includes a connecting baffle, a connecting spring, a connecting post, a connecting groove, a lower connecting block, and a connecting guide angle. A limiting post is provided on the supporting base plate, and a limiting groove is provided on the limiting post. The connecting post is located at the lower end of the connecting plate, and the connecting groove is formed within the connecting post. The connecting post is connected to the limiting post through the connecting groove. The connecting baffle is slidably connected within the connecting groove. Both ends of the connecting spring are connected to the end of the connecting baffle away from the limiting post and the inner wall of the connecting post, respectively. The lower connecting block is located at the end of the connecting baffle near the limiting post, and the connecting guide angle is formed on the lower connecting block, cooperating with the limiting groove.

[0014] Preferably, the transmission component includes an upper pressure column, an upper pressure groove, an upper pressure spring, an upper pressure block, an upper pressure guide angle, an upper pressure threaded groove, an upper pressure gear, a transmission gear, a fastening sleeve, and a spring-loaded unit. The upper pressure column is fixed to the lower end of the upper pressure plate, and the upper pressure column is slidably connected to the center of the upper pressure gear. The upper pressure gear and the transmission gear are rotatably connected to the upper pressure plate and mesh with each other. The upper pressure groove is disposed inside the upper pressure column, and the upper pressure block is disposed inside the upper pressure groove. The two ends of the upper pressure spring are respectively connected to the end of the upper pressure block away from the upper pressure gear and the inner wall of the upper pressure column. The upper pressure guide angle is disposed at the upper end of the upper pressure block. The upper pressure threaded groove is disposed inside the upper pressure gear. The lower end of the upper pressure block, near the upper pressure gear, engages with the upper pressure threaded groove. The upper pressure guide angle engages with the upper pressure threaded groove. The fastening sleeve is connected to the lower end of the transmission gear, and the spring-loaded unit is disposed on the fastening sleeve.

[0015] Preferably, the springback unit includes a springback guide groove, a springback block, a locking groove, a locking guide angle, a locking block, a locking baffle, and a locking spring. The springback guide groove is disposed on the fastening sleeve. The springback block is located at the lower end of the transmission gear and cooperates with the springback guide groove. The locking groove is located inside the connecting plate. The locking block is slidably connected to the locking groove. The locking guide angle is located at one end of the locking block. The locking baffle is disposed on the locking block. The two ends of the locking spring abut against the end of the locking baffle away from the locking guide angle and the inner wall of the connecting plate, respectively. The locking guide angle cooperates with the side of the transmission gear. The upper end of the locking block cooperates with the lower end of the transmission gear.

[0016] Preferably, the mounting component includes a nut groove, a fastening nut, a fastening bolt, a bolt groove, and a release unit. The nut groove is located at the lower end of the fastening sleeve, and the fastening nut is disposed within the nut groove. The bolt groove is located on the support base plate, and the lower end of the fastening bolt is connected to the bolt groove. The MOS base plate and the copper base plate are connected by the fastening bolt and the fastening nut. The release unit is disposed within the connecting plate.

[0017] Preferably, a magnet is provided at the upper end of the nut groove inside the fastening sleeve, and the magnet is used to generate an attractive force on the fastening nut.

[0018] Preferably, the release unit includes a reset groove, a reset spring, and a reset block. The reset groove is formed on the upper end of the connecting plate, the reset block is slidably connected in the reset groove, the two ends of the reset spring are respectively connected to the lower end of the reset block and the bottom of the reset groove, the lower end of the reset block cooperates with the end of the locking block away from the locking guide angle, and the upper end of the reset block is attached to the lower end of the upper pressure plate.

[0019] Preferably, the bonding component includes a bonding groove, an adjusting block, and a blocking unit. The bonding groove is located at the lower end of the reset groove, the adjusting block is located at the lower end of the reset block, and the lower end of the adjusting block engages with the drain of the MOS transistor through the bonding groove. The blocking unit is located inside the connecting plate.

[0020] Preferably, the blocking unit includes an upper connecting block, a blocking groove, a blocking spring, a blocking block, a blocking guide angle, and a blocking slot. The upper connecting block is disposed on the upper part of the connecting baffle near the lower connecting block. The blocking groove is formed inside the upper connecting block, and the blocking block is slidably connected to the blocking groove. The two ends of the blocking spring are respectively connected to the end of the blocking block near the blocking groove and the inner wall of the upper connecting block. The blocking guide angle is formed at the end of the blocking block away from the upper connecting block and cooperates with the lower end of the reset block. A limit connecting rod is provided at the lower end of the upper pressure plate. The blocking slot is formed on the limit connecting rod, and the blocking guide angle cooperates with the lower end of the limit connecting rod. The blocking guide angle cooperates with the blocking slot, and the spring force of the blocking spring is greater than the spring force of the connecting spring.

[0021] Preferably, the unlocking component includes a blocking baffle, an unlocking block, and an unlocking groove. The blocking baffle is disposed on the upper end of the blocking block, and the unlocking groove is formed between the blocking baffle and the locking baffle. The unlocking block is slidably connected in the unlocking groove. One end of the unlocking block cooperates with the blocking baffle, and the other end cooperates with the locking baffle.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] This application facilitates the installation of MOSFETs by providing a bevel on the MOSFET base plate. By setting an upper pressure plate, during copper substrate installation, the upper pressure plate, in conjunction with the installation components, simultaneously tightens the fastening nuts on the MOSFET's copper substrate, ensuring even force distribution during installation. After tightening to the preset force, a spring-loaded mechanism prevents the installation components from further tightening the fastening nuts. After all bolts are tightened, pressing the upper pressure plate again will prevent it from springing back, indicating to the operator that installation is complete. Simultaneously, the bonding component aligns the MOSFET drain with the installed copper substrate, facilitating soldering between the MOSFET carrier's copper substrate and drain, and ensuring effective heat dissipation for the MOSFET. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the copper substrate of the present invention;

[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of the copper substrate of the present invention;

[0026] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0027] Figure 4 This is a partial structural diagram of the mounting groove of the present invention;

[0028] Figure 5 This is a schematic diagram of a partial state structure during chip installation according to the present invention;

[0029] Figure 6 This is a schematic diagram of the overall cross-sectional structure of the side portion of the copper substrate of the present invention.

[0030] Figure 7 This is a schematic diagram of the copper substrate cutting position structure of the present invention.

[0031] Figure 8 This is a schematic diagram of the overall structure of the MOS base plate of the present invention;

[0032] Figure 9 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0033] Figure 10 This is a cross-sectional structural diagram of the connecting component of the present invention;

[0034] Figure 11 This is a cross-sectional structural diagram of the transmission component of the present invention;

[0035] Figure 12 This is a schematic cross-sectional view of the transmission gear of the present invention;

[0036] Figure 13 For the present invention Figure 12 Enlarged structural diagram at point C;

[0037] Figure 14 This is a schematic cross-sectional view of the bonding component of the present invention;

[0038] Figure 15 This is a schematic diagram of the unlocking groove structure of the present invention.

[0039] In the diagram: 101, copper substrate; 102, mounting groove; 103, mounting chamfer; 104, chip; 105, isolation layer; 106, MOS base plate; 107, molding compound; 108, gate; 109, source; 110, drain; 1, upper pressure plate; 2, connecting plate; 4, support base plate; 6, mounting component; 7, bonding component; 8, connecting component; 9, transmission component; 10, unlocking component; 81, connecting baffle; 82, connecting spring; 83, connecting post; 84, connecting groove; 85, lower connecting block; 86, connecting chamfer; 41, limiting post; 42, limiting groove; 91, upper pressure post; 92, upper pressure groove; 93, upper pressure spring; 94, upper pressure block; 95, upper pressure chamfer; 96, upper pressure threaded groove; 97, upper pressure gear; 98, transmission gear; 99. Fastening sleeve; 901. Springback unit; 9011. Springback guide groove; 9012. Springback block; 9013. Locking groove; 9014. Locking guide angle; 9015. Locking block; 9016. Locking baffle; 9017. Locking spring; 61. Nut groove; 62. Fastening nut; 63. Fastening bolt; 64. Bolt groove; 65. Disengagement unit; 651. Reset groove; 652. Reset spring; 653. Reset block; 71. Fitting groove; 72. Adjusting pressure block; 73. Blocking unit; 731. Upper connecting block; 732. Blocking groove; 733. Blocking spring; 734. Blocking block; 735. Blocking guide angle; 736. Blocking slot; 11. Limiting connecting rod; 1011. Blocking baffle; 1021. Unlocking block; 1031. Unlocking groove. Detailed Implementation

[0040] To ensure a clear and complete description of the technical solutions in the embodiments of the present invention, and to make the features and advantages more apparent and understandable, the specific implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0041] Example 1

[0042] Please see Figures 1 to 7 This invention provides a MOS transistor carrier board, including a copper substrate 101, a mounting groove 102, a mounting chamfer 103, a molding compound 107, a chip 104, an isolation layer 105, and a MOS base plate 106. The copper substrate 101 is connected to the MOS base plate 106. The mounting groove 102 is formed on the copper substrate 101. The mounting chamfer 103 is disposed on the mounting groove 102. The bottom of the chip 104 is bonded to the mounting groove 102 with solder paste. A gap is left between the side of the chip 104 and the mounting chamfer 103. The inclination angle of the mounting chamfer 103 is 90° to 100° to facilitate the placement of the chip 104 into the mounting groove 106. Within 2, there is more operating space, which facilitates installation. The molding compound 107 fills the gap between the chip 104 and the mounting chamfer 103. The chip 104 is provided with a gate 108 and a source 109. The isolation layer 105 is provided between the gate 108 and the source 109. The drain 110 is provided on the copper substrate 101. The mounting slots 102 on the copper substrate 101 are arranged in 32 columns horizontally and 9 rows vertically. Each mounting slot 102 is provided with two sets of chips 104. By setting the mounting slots 102 in this way, the space of the copper substrate 101 is fully utilized, the compactness of the copper substrate 101 is improved, and the material cost is saved.

[0043] The molding compound 107 is an EMC molding compound 107 material. The molding compound 107 is used to resist external solvents, moisture and impacts on the chip 104, and to ensure that the chip 104 is electrically insulated from the external environment.

[0044] The gate 108 and source 109 are connected to the chip 104 by electroplating, and the drain 110 is connected to the copper substrate 101 by electroplating. The copper substrate 101 is used as a conductive carrier, so that the copper substrate 101 does not need to be drilled and can be directly mounted.

[0045] Beneficial effects: This application improves the compactness of the copper substrate 101 when packaging the chip 104 by providing multiple mounting slots 102 on the copper substrate 101. By providing mounting chamfers 103 on the mounting slots 102, more operating space is provided when mounting and fixing the chip 104. At the same time, when mounting the chip 104, a certain gap is left between the chip 104 and the mounting chamfers 103 on the copper substrate 101, and the gap is filled with molding compound 107, so that the gate 108, source 109 and drain 110 of the chip 104 are exposed outside the copper substrate 101, which improves the overall heat dissipation, improves the internal resistance of the product, and reduces the overall power consumption. The molding compound 107 is used to resist external solvents, moisture and impacts on the chip 104, and ensures the electrical insulation of the chip 104 from the external environment.

[0046] Example 2

[0047] Please see Figures 8 to 12 This invention provides a MOS transistor carrier board for mounting a chip 104 and a copper substrate 101, including an upper pressure plate 1, a connecting plate 2, a MOS base plate 106, mounting bevels, a supporting base plate 4, a connecting component 8, a transmission component 9, a mounting component 6, a bonding component 7, and an unlocking component 10. The MOS base plate 106 has a mounting groove 102, and the chip 104 is mounted in the mounting groove 102 of the MOS base plate 106. The mounting bevels are formed on the mounting groove 102 to facilitate the mounting of the chip 104 and the application of solder material, so that the chip 104 can be better fixed in the mounting groove 102 by soldering during the heating and soldering of the MOS base plate 106. The supporting base plate 4 is located at the lower end of the copper substrate 101, and the connecting plate 2 is located at the upper end of the copper substrate 101. The connecting plate 2 is connected to the supporting base plate 4. The upper pressure plate 1 is slidably connected to the connecting plate 2. 1. Connected to the support base plate 4, the connecting component 8 is located at the lower end of the connecting plate 2 to connect and fix the connecting plate 2 to the support base plate 4. The transmission component 9 and the mounting component 6 are located inside the connecting plate 2. When the upper pressure plate 1 is pressed repeatedly, the transmission component 9 cooperates with the mounting component 6 to slowly tighten the copper substrate 101 onto the MOS base plate 106 and spring back the upper pressure plate 1 until the copper substrate 101 is completely attached to the MOS base plate 106. The bonding component 7 is located at the lower end of the connecting plate 2. When the copper substrate 101 is completely attached to the MOS base plate 106, and the upper pressure plate 1 is pressed, the bonding component 7 cooperates with the mounting component 6 to make the upper pressure plate 1 attach to the connecting plate 2, and the connecting plate 2 is released from the support base plate 4. This allows the drain 110 of the chip 104 to be attached to and aligned with the copper substrate 101 for subsequent electroplating. The unlocking component 10 is located on the upper pressure plate 1 to cooperate with the mounting component 6 to make the upper pressure plate 1 spring back.

[0048] Please see Figure 8Specifically, in the figure, there are three sets of chip 104, four sets of connecting parts 8, six sets of transmission parts 9 and mounting parts 6 (one set of disengagement unit 65), three sets of bonding grooves 71 and adjusting pressure blocks 72 corresponding to the drain 110 of chip 104, four sets of blocking units 73 corresponding to connecting parts 8, and two sets of unlocking parts 10. In actual production, the number can be reasonably allocated as needed.

[0049] Please see Figures 8 to 9 Specifically, the connecting component 8 includes a connecting post 83, a connecting groove 84, a connecting spring 82, a connecting baffle 81, a lower connecting block 85, and a connecting guide angle 86. A limit post 41 is provided on the supporting base plate 4, and a limit groove 42 is provided on the limit post 41. The connecting post 83 is located at the lower end of the connecting plate 2, and the connecting groove 84 is formed within the connecting post 83. The connecting post 83 is connected to the limit post 41 through the connecting groove 84. The connecting baffle 81 is slidably connected within the connecting groove 84. Both ends of the connecting spring 82 are connected to the end of the connecting baffle 81 away from the limit post 41 and the inner wall of the connecting post 83, respectively. The lower connecting block 85 is located at the end of the connecting baffle 81 near the limit post 41, and the connecting guide angle 86 is formed on the lower connecting block 85. The connecting guide angle 86 cooperates with the limit groove 42. This cooperation refers to the fact that when the connecting baffle 81 is to be connected to the limit post 41, the connecting baffle 82 is to be connected to the limit post 42. When connecting plate 2 and supporting base plate 4 are connected, first align connecting groove 84 with limiting post 41, then push connecting plate 2 downward, causing connecting plate 2 to drive the lower connecting block 85 inside it to move downward. When the lower connecting block 85 moves downward, the connecting guide angle 86 on the lower connecting block 85 first contacts the upper side of the limiting post 41. Then, as the lower connecting block 85 moves downward, the upper end of the limiting post 41 pushes the lower connecting block 85 into the connecting groove 84 along the connecting guide angle 86, causing the lower connecting block 85 to drive the connecting baffle 81 to squeeze the connecting spring 82 until the lower connecting block 85 is directly opposite the limiting groove 42. At this time, the lower connecting block 85 is inserted into the limiting groove 42 under the action of the connecting spring 82, and the upper end of the lower connecting block 85 is in contact with the upper end of the limiting groove 42, so that connecting plate 2 and supporting base plate 4 are connected.

[0050] Please see Figures 10 to 12Specifically, the transmission component 9 includes an upper pressure column 91, an upper pressure groove 92, an upper pressure spring 93, an upper pressure block 94, an upper pressure guide angle 95, an upper pressure gear 97, an upper pressure threaded groove 96, a transmission gear 98, a fastening sleeve 99, and a springback unit 901. The upper pressure column 91 is fixed to the lower end of the upper pressure plate 1. The upper pressure column 91 is slidably connected to the center of the upper pressure gear 97. The upper pressure gear 97 and the transmission gear 98 are rotatably connected to the upper pressure plate 1. The upper pressure gear 97 and the transmission gear 98 mesh. The thickness of the upper pressure gear 97 is greater than the thickness of the transmission gear 98. The upper pressure groove 92 is provided with... The upper pressure block 94 is placed inside the upper pressure column 91 and is located inside the upper pressure groove 92. The two ends of the upper pressure spring 93 are connected to the end of the upper pressure block 94 furthest from the upper pressure gear 97 and the inner wall of the upper pressure column 91, respectively. The elastic force of the upper pressure spring 93 is less than the elastic force of the return spring 652. The upper pressure guide angle 95 is located at the upper end of the upper pressure block 94. The upper pressure thread groove 96 is located inside the upper pressure gear 97. The lower end of the upper pressure block 94, near the upper pressure gear 97, engages with the upper pressure thread groove 96. This engagement means that when the upper pressure plate 1 is pressed, causing the upper pressure plate 1 to move the upper pressure block 94 downwards, the upper pressure block 94... Under the action of the upper pressure spring 93, the pressure block 94 extends and inserts into the upper pressure threaded groove 96. At this time, the upper pressure block 94 moves downward and drives the upper pressure gear 97 to rotate along the upper pressure threaded groove 96. The radius of the upper pressure gear 97 is smaller than the radius of the transmission gear 98. In order to provide better torque to drive the transmission gear 98 to rotate when the upper pressure gear 97 rotates, the upper pressure guide angle 95 cooperates with the upper pressure threaded groove 96. The cooperation here means that when the upper pressure plate 1 returns to its original position and moves upward, the upper pressure plate 1 will drive the upper pressure column 91 and the upper pressure block 94 to move upward. During movement, the upper pressure guide angle 95 at the upper end of the upper pressure block 94 will fit against the inner wall of the upper end of the upper pressure thread groove 96. As the upper pressure block 94 continues to move upward, the inner wall of the upper pressure thread groove 96 will push the upper pressure block 94 towards the side of the upper pressure groove 92 along the upper pressure guide angle 95, squeezing the upper pressure spring 93. This allows the upper pressure block 94 to be repeatedly pushed into the upper pressure groove 92 during the upward movement, without affecting the reset and upward movement of the upper pressure plate 1, facilitating the next press. The fastening sleeve 99 is connected to the lower end of the transmission gear 98, and the springback unit 901 is set on the fastening sleeve 99.

[0051] Please see Figures 10 to 12Specifically, the springback unit 901 includes a springback guide groove 9011, a springback block 9012, a locking groove 9013, a locking guide angle 9014, a locking block 9015, a locking baffle 9016, and a locking spring 9017. The springback guide groove 9011 is located on the fastening sleeve 99. The springback block 9012 is located at the lower end of the transmission gear 98. The locking groove 9013 is located within the connecting plate 2. The locking block 9015 is slidably connected within the locking groove 9013. The locking guide angle 9014 is located at one end of the locking block 9015. The locking baffle 9016 is located on the locking block 9015. Both ends of the locking spring 9017 abut against the end of the locking baffle 9016 away from the locking guide angle 9014 and the inner wall of the connecting plate 2, respectively, to lock the spring. The guide angle 9014 engages with the side of the transmission gear 98. This engagement means that, under normal conditions, the spring block 9012 at the lower end of the transmission gear 98 inserts into the spring guide groove 9011. The locking guide angle 9014, under the action of the locking spring 9017, fits against the outer edge of the upper end of the transmission gear 98. This causes the transmission gear 98 to be subjected to gravity and the squeezing force of the locking guide angle 9014, resulting in a tighter fit between the spring block 9012 and the spring guide groove 9011. The engagement of the spring block 9012 and the spring guide groove 9011 means that when the spring block 9012 at the lower end of the transmission gear 98 is inserted into the spring guide groove 9011, the rotation of the upper pressure gear 97 will drive the transmission gear 98 to rotate. 8. During rotation, the spring block 9012 and the spring guide groove 9011 work together to drive the fastening sleeve 99 to rotate. The rotation of the fastening sleeve 99 in turn drives the fastening nut 62 inside it to rotate, thereby realizing the installation and fixation of the copper substrate 101 and the MOS base plate 106. When the fastening nut 62 tightens the copper substrate 101 and the MOS base plate 106 to the set force, the fastening sleeve 99 can no longer rotate. When the upper pressure gear 97 drives the transmission gear 98 to continue rotating, the spring block 9012 at the lower end of the transmission gear 98 will move upward along the spring guide groove 9011. Since the thickness of the upper pressure gear 97 is greater than the thickness of the transmission gear 98, the side of the transmission gear 98 is always meshed with the upper pressure gear 97. The transmission gear 9... 8. While rotating, the gear moves upward. The upper end of the locking block 9015 engages with the lower end of the transmission gear 98. This engagement means that when the transmission gear 98 moves upward, the upper end of the transmission gear 98 pushes the locking block 9015 along the locking guide angle 9014, causing the locking block 9015 to move away from the transmission gear 98 and compress the locking spring 9017 until the spring block 9012 at the lower end of the transmission gear 98 completely rotates out of the spring guide groove 9011. At this time, the transmission gear 98 moves above the locking block 9015, and the locking block 9015 resets under the action of the locking spring 9017, so that the upper end of the locking block 9015 is in contact with the lower end of the transmission gear 98, thereby keeping the transmission gear 98 rotating in this position.

[0052] Please see Figure 12Specifically, the mounting component 6 includes a nut groove 61, a fastening nut 62, a bolt groove 64, and a fastening bolt 63. The nut groove 61 is located at the lower end of the fastening sleeve 99, the fastening nut 62 is located in the nut groove 61, the bolt groove 64 is located on the support base plate 4, and the lower end of the fastening bolt 63 is connected to the bolt groove 64. The MOS base plate 106 and the copper base plate 101 are connected by the fastening bolt 63 and the fastening nut 62.

[0053] Specifically, a magnet (not shown in the figure) is provided at the upper end of the nut groove 61 inside the fastening sleeve 99. The magnet is used to generate an attractive force on the fastening nut 62. The purpose of the magnet is that when connecting the connecting plate 2 and the supporting base plate 4, the operator can first place the fastening nut 62 inside the fastening sleeve 99, and the magnet will hold the fastening nut 62 in place. Then, when the operator connects the connecting plate 2 downwards to the supporting base plate 4, the fastening nut 62 will not fall out of the fastening sleeve 99.

[0054] Working principle: When chip 104 needs to be installed, the operator first applies solder to the mounting slot 102 of the MOS base plate 106. Then, the operator places chip 104 into the mounting slot 102. The mounting chamfer on the mounting slot 102 facilitates the placement of chip 104, and the mounting slot 102 effectively prevents the placed chip 104 from sliding or shifting. After placing chip 104, the operator places the MOS base plate 106 and chip 104 together on a heating table for heating, so that the solder between chip 104 and MOS base plate 106 is heated. After melting and cooling (since the gate 108 and source 109 are connected to the chip 104 at this point, the drain 110 needs to be soldered to the copper substrate 101 later), the MOS base plate 106 is connected. Then, the operator places the fastening bolt 63 in the bolt slot 64 and the fastening nut 62 in the nut slot 61, and places the MOS base plate 106 and the copper substrate 101 on the support base plate 4 in sequence, so that the through holes of the MOS base plate 106 and the copper substrate 101 are inserted into the fastening bolt 63, and the drain 101 is placed... At the corresponding positions of each chip 104 on the copper substrate 101, the operator connects the connecting plate 2 to the support base plate 4. When connecting the connecting plate 2 to the support base plate 4, first align the connecting groove 84 with the limiting post 41, and then push the connecting plate 2 downward, causing the lower connecting block 85 inside the connecting plate 2 to move downward. When the lower connecting block 85 moves downward, the connecting guide angle 86 on the lower connecting block 85 first contacts the upper side of the limiting post 41, and then, as the lower connecting block 85 moves downward, the upper end of the limiting post 41 moves along the connecting guide angle. 86 pushes the lower connecting block 85 into the connecting groove 84, causing the lower connecting block 85 to drive the connecting baffle 81 to squeeze the connecting spring 82 until the lower connecting block 85 is directly opposite the limiting groove 42. At this time, the lower connecting block 85 is inserted into the limiting groove 42 under the action of the connecting spring 82, and the upper end of the lower connecting block 85 is in contact with the upper end of the limiting groove 42, so that the connecting plate 2 and the supporting base plate 4 are connected, preventing relative movement between the connecting plate 2, the supporting base plate 4, the MOS base plate 106 and the copper substrate 101 when the upper pressure plate 1 is repeatedly pressed.

[0055] After connecting the support base plate 4 and the connecting plate 2, the operator repeatedly presses the upper pressure plate 1 to rotate the fastening sleeve 99 and the fastening nut 62, simultaneously tightening the fastening nuts 62 on the copper substrate 101 and the MOS base plate 106. This ensures that the copper substrate 101 is subjected to uniform force during connection, preventing misalignment due to uneven force, which would affect heat conduction efficiency. Once the fastening nut 62 is tightened to the preset force, rotation is immediately stopped to prevent damage, misalignment, or loose connection between the copper substrate 101 and the MOS base plate 106 caused by overtightening, loosening, or inconsistent force, which would affect the thermal conductivity of the copper substrate 101. This is specifically achieved as follows: After connecting the support base plate 4 and the connecting plate 2, the operator presses the upper pressure plate 1... When the upper pressure plate 1 moves the upper pressure block 94 downward, the upper pressure block 94 extends and inserts into the upper pressure thread groove 96 under the action of the upper pressure spring 93. At this time, the upper pressure block 94 moves downward and drives the upper pressure gear 97 to rotate along the upper pressure thread groove 96. When the upper pressure gear 97 rotates, it drives the transmission gear 98 to rotate. When the transmission gear 98 rotates, it drives the fastening sleeve 99 to rotate under the cooperation of the spring block 9012 and the spring guide groove 9011. The rotation of the fastening sleeve 99 drives the fastening nut 62 inside it to rotate, thereby realizing the installation and fixation of the copper substrate 101 and the MOS base plate 106. When the upper pressure plate 1 presses down, the lower end of the upper pressure plate 1 is in contact with the upper end of the reset block 653, and the upper pressure plate 1 drives the reset block 653 to move downward. The operator presses the reset spring 652 until the lower end of the reset block 653 is in contact with the upper end of the locking block 9015. Then, the operator stops pressing the upper pressure plate 1. At this time, the reset block 653 moves upward and resets under the action of the reset spring 652, thereby driving the upper pressure plate 1 to reset upward, making it convenient for the next press. After repeated pressing, when the fastening nut 62 tightens the copper substrate 101 and the MOS base plate 106 to the set force, the fastening sleeve 99 cannot rotate. When the upper pressure gear 97 drives the transmission gear 98 to continue rotating, the spring block 9012 at the lower end of the transmission gear 98 will move upward along the spring guide groove 9011. Since the thickness of the upper pressure gear 97 is greater than the thickness of the transmission gear 98, the side of the transmission gear 98 is always meshed with the upper pressure gear 97. When the transmission gear 98 rotates, it moves upward. As the transmission gear 98 moves upward, its upper end pushes the locking block 9015 along the locking guide angle 9014, causing the locking block 9015 to move away from the transmission gear 98 and compress the locking spring 9017 until the spring block 9012 at the lower end of the transmission gear 98 completely rotates out of the spring guide groove 9011. At this time, the transmission gear 98 moves above the locking block 9015, and the locking block 9015 resets under the action of the locking spring 9017, so that the upper end of the locking block 9015 fits with the lower end of the transmission gear 98, thereby keeping the transmission gear 98 rotating in this position. This achieves the effect of stopping the rotation immediately after the fastening nut 62 is tightened to the preset force.

[0056] Example 3

[0057] Please see Figures 12 to 14 A MOS transistor carrier board is provided, including a mounting component 6. The mounting component 6 includes a disengagement unit 65, which includes a reset groove 651, a reset block 653, and a reset spring 652. The reset groove 651 is formed on the upper end of the connecting plate 2. The reset block 653 is slidably connected in the reset groove 651. The two ends of the reset spring 652 are respectively connected to the lower end of the reset block 653 and the bottom of the reset groove 651. The lower end of the reset block 653 engages with the end of the locking block 9015 away from the locking guide angle 9014. This engagement means that when the locking block 9015 has not moved to the lower end of the transmission gear 98, the locking guide angle of the end of the locking block 9015 away from the reset block 653 is engaged. Angle 9014 contacts the side of the transmission gear 98. At this time, the upper side of the locking block 9015 near the reset block 653 is in contact with the lower end of the reset block 653. The upper end of the reset block 653 is in contact with the lower end of the upper pressure plate 1. When the upper pressure plate 1 is pressed down, the lower end of the upper pressure plate 1 is in contact with the upper end of the reset block 653. The upper pressure plate 1 drives the reset block 653 to move downward and squeeze the reset spring 652 until the lower end of the reset block 653 is in contact with the upper end of the locking block 9015. Then the operator stops pressing the upper pressure plate 1. At this time, the reset block 653 moves upward and resets under the action of the reset spring 652, thereby driving the upper pressure plate 1 to reset upward, which is convenient for the next press.

[0058] Please see Figures 12 to 14 Specifically, the bonding component 7 includes a bonding groove 71, an adjusting block 72, and a blocking unit 73. The bonding groove 71 is located at the lower end of the reset groove 651. The adjusting block 72 is located at the lower end of the reset block 653. The contact surface between the adjusting block 72 and the drain electrode 110 is an inverted quadrilateral funnel shape (not shown in the figure). The inverted funnel shape design facilitates the adjustment of the drain electrode 110 along the inclined surface of the funnel when the adjusting block 72 descends. The lower end of the adjusting block 72 engages with the drain electrode 110. The blocking unit 73 is located inside the connecting plate 2. Here, the engagement means that when the transmission gear 98 moves to the upper end of the locking block 9015, the locking block 9015 approaches the reset block. When one end of 653 is not in contact with the reset block 653, the operator presses the upper pressure block 94. The upper pressure block 94 drives the reset block 653 to move downwards. The reset block 653 drives the adjusting pressure block 72 to move downwards together, so that the lower end of the reset block 653 is lower than the lower end of the locking block 9015. As the upper pressure block 94 is pressed, the lower end of the adjusting pressure block 72 will be in contact with the drain 110, and the drain 110 will be aligned to the designated position on the copper substrate 101. Subsequently, the drain 110 will be electroplated and soldered. At the same time, the drain 110 of the chip 104 can be better attached to the copper substrate 101, so that the drain 110 can use the copper substrate 101 for heat dissipation.

[0059] Please see Figures 13 to 14Specifically, the blocking unit 73 includes an upper connecting block 731, a blocking groove 732, a blocking spring 733, a blocking block 734, a blocking guide angle 735, and a blocking slot 736. The upper connecting block 731 is located on the upper part of the connecting baffle 81 near the lower connecting block 85. The blocking groove 732 is formed inside the upper connecting block 731. The blocking block 734 is slidably connected inside the blocking groove 732. The two ends of the blocking spring 733 are respectively connected to the end of the blocking block 734 near the blocking groove 732 and the inner wall of the upper connecting block 731. The blocking guide angle 735 is formed at the end of the blocking block 734 away from the upper connecting block 731. The blocking guide angle 735 cooperates with the lower side of the reset block 653. This cooperation means that when the transmission gear 98 moves to the upper end of the locking block 9015, the locking block 901... 5. When the end near the reset block 653 is not in contact with the reset block 653, the operator presses the upper pressure block 94. The upper pressure block 94 drives the reset block 653 to move downwards until the lower end of the reset block 653 is lower than the lower end of the locking block 9015, until the lower side of the reset block 653 is in contact with the upper end of the blocking guide angle 735. As the reset block 653 continues to move downwards, it will push the blocking block 734 towards the side near the upper connecting block 731 along the blocking guide angle 735. At this time, since the elastic force of the blocking spring 733 is greater than the elastic force of the connecting spring 82, when the blocking block 734 moves towards the side near the upper connecting block 731, it will drive the blocking spring 733, the upper connecting block 731, the connecting baffle 81, and the lower connecting block 85 to move, and squeeze the connecting spring. 82. Pull the lower connecting block 85 out of the blocking slot 736 to unlock the upper pressure plate 1 and the support base plate 4. The lower end of the upper pressure plate 1 is provided with a limit connecting rod 11. The blocking slot 736 is opened on the limit connecting rod 11. The blocking guide angle 735 cooperates with the lower end of the limit connecting rod 11. The blocking guide angle 735 cooperates with the blocking slot 736. The cooperation here means that the upper pressure plate 1 drives the reset block 653 to move downward, so that the lower end of the reset block 653 is lower than the upper end of the locking block 9015. Then, the upper pressure plate 1 drives the reset block 653 to continue to move downward. The limit connecting rod 11 at the lower end of the upper pressure plate 1 moves downward with the upper pressure plate 1. The reset block 653 first pushes the blocking block 734 to the side of the reset block 653 along the blocking guide angle 735. Then, the limit connecting rod 11 continues to move downward. When the limit connecting rod 11 moves downward, its lower end engages with the blocking guide angle 735. As the limit connecting rod 11 continues to move downward, it pushes the blocking block 734 further towards the upper connecting block 731 along the blocking guide angle 735, compressing the blocking spring 733. This ultimately causes the blocking slot 736 on the side of the limit connecting rod 11 to engage with the blocking guide angle 735. Under the action of the blocking spring 733, the blocking guide angle 735 inserts into the blocking slot 736. At this point, the lower end of the blocking block 734 abuts against the bottom of the blocking slot 736. This ensures that after the copper substrate 101 and the MOS base plate 106 are fully connected, and the drain 110 of the chip 104 is aligned with the copper substrate 101, the upper pressure plate 1 will not spring back, indicating to the operator that the installation is complete.The force of the blocking spring 733 is greater than the force of the connecting spring 82.

[0060] The rest of the structure is the same as in Example 2.

[0061] Working principle: After all the fastening nuts 62 are tightened to the preset tightness, all the locking blocks 9015 at the lower end of the reset block 653 are inserted into the lower end of the transmission gear 98. The upper side of the locking block 9015 near the reset block 653 does not contact the reset block 653. At this time, the operator presses the upper pressure block 94, which drives the reset block 653 to move downward. The reset block 653 drives the adjusting pressure block 72 to move downward together, so that the lower end of the reset block 653 is lower than the lower end of the locking block 9015. As the upper pressure block 94 is pressed, the lower end of the adjusting pressure block 72 will fit with the drain 110, placing the drain 110 in a suitable position on the copper substrate 101. This ensures that the welding position of the drain 110 and the copper substrate 101 is accurate when the drain 110 is soldered later, and facilitates the drain 110 to dissipate heat using the copper substrate 101.

[0062] Simultaneously, as the operator presses the upper pressure block 94, causing the upper pressure block 94 to move the reset block 653 downwards, the lower end of the reset block 653 is lower than the lower end of the locking block 9015, until the lower side of the reset block 653 is in contact with the upper end of the blocking guide angle 735. As the reset block 653 continues to move downwards, it will push the blocking block 734 towards the upper connecting block 731 along the blocking guide angle 735. At this time, because the elastic force of the blocking spring 733 is greater than the elastic force of the connecting spring 82, the blocking... When block 734 moves closer to the upper connecting block 731, it will move the blocking spring 733, the upper connecting block 731, the connecting baffle 81 and the lower connecting block 85, and squeeze the connecting spring 82, causing the lower connecting block 85 to pull out of the blocking slot 736, unlocking the upper pressure plate 1 and the support base plate 4. After the copper substrate 101 and the drain 110 are connected and placed with the MOS base plate 106, the upper pressure plate 1 can automatically unlock from the support base plate 4, making it easy to remove the upper pressure plate 1 from the support base plate 4 for the next use.

[0063] Simultaneously, the upper pressure plate 1 drives the reset block 653 to move downwards, so that the lower end of the reset block 653 is lower than the upper end of the locking block 9015. Then, the upper pressure plate 1 drives the reset block 653 to continue moving downwards. The limiting connecting rod 11 at the lower end of the upper pressure plate 1 moves downwards with the upper pressure plate 1. The reset block 653 first pushes the blocking block 734 to the side of the reset block 653 along the blocking guide angle 735. Then, the limiting connecting rod 11 continues to move downwards. At this time, the lower end of the limiting connecting rod 11 is in contact with the blocking guide angle 735. As the limiting connecting rod 11 continues to move downwards, the limiting connecting rod 11 can push the blocking block 734 further towards the side of the upper connecting block 731 along the blocking guide angle 735 to compress the blocking spring 733. Finally, the limiting connecting rod 11 pushes the blocking block 734 to the side of the upper connecting block 731, compressing the blocking spring 733. The blocking slot 736 of the part is fitted with the blocking guide angle 735. The blocking guide angle 735 is inserted into the blocking slot 736 under the action of the blocking spring 733. At this time, the lower end of the blocking block 734 abuts against the bottom of the blocking slot 736. After the copper substrate 101 and the MOS base plate 106 are fully connected, and the drain 110 of the chip 104 is fully aligned with the copper substrate 101, the upper pressure plate 1 will not spring back, reminding the operator that the installation is complete. This prevents the operator from continuing to press after the copper substrate 101 and the drain 110 are properly positioned with the MOS base plate 106, which would reduce the service life of the device and avoid damage to the drain 110 and the copper substrate 101 caused by excessive pressing. Then the operator can remove the connecting plate 2 from the support base plate 4.

[0064] Example 4

[0065] Please see Figures 14 to 15A MOS transistor carrier board is provided, including an unlocking component 10. The unlocking component 10 includes a blocking baffle 1011, an unlocking groove 1031, and an unlocking block 1021. The blocking baffle 1011 is disposed on the upper end of the blocking block 734. The unlocking groove 1031 is formed between the blocking baffle 1011 and the locking baffle 9016. The unlocking block 1021 is slidably connected in the unlocking groove 1031. One end of the unlocking block 1021 cooperates with the blocking baffle 1011, and the other end cooperates with the locking baffle 9016. Here, cooperation means that when When the unlocking block 1021 is moved closer to the blocking plate 1011, the unlocking block 1021 comes into contact with the blocking plate 1011 and moves the blocking plate 1011. This causes the blocking plate 1011 to move the blocking block 734 away from the connecting limit post 41, allowing the blocking block 734 to be pulled out of the blocking slot 736. This allows the upper pressure plate 1 and the reset block 653 to reset upwards under the action of the reset spring 652. Then, the operator moves the unlocking block 1021 closer to the locking plate. When 9016 moves to one side, the locking baffle 9016 can drive the locking block 9015 to compress the locking spring 9017, and the locking block 9015 moves to the side of the transmission gear 98. Under the action of gravity, the transmission gear 98 falls downward, and the spring block 9012 at the lower end of the transmission gear 98 re-inserts into the spring guide groove 9011. (If the spring block 9012 is not aligned with the spring guide groove 9011 when the transmission gear 98 falls, the operator can manually rotate the fastening sleeve 99 to make the spring...) Block 9012 is aligned with the spring guide groove 9011, so that the transmission gear 98 drives the spring block 9012 to insert into the spring guide groove 9011 under the action of gravity. Then the operator releases the unlocking block 1021. At this time, the locking block 9015 moves back to the side closer to the transmission gear 98 under the action of the locking spring 9017, so that the locking guide angle 9014 is once again in contact with the outer side of the upper end of the transmission gear 98. The upper side of the end of the locking block 9015 away from the locking guide angle 9014 is once again engaged with the lower end of the reset block 653.

[0066] The rest of the structure is the same as in Example 3.

[0067] Working principle: After the operator installs the MOS base plate 106, the operator removes the connecting plate 2 from the support base plate 4. Then, the operator first opens the unlocking block 1021, so that when the unlocking block 1021 is pushed towards the side of the blocking plate 1011, the unlocking block 1021 fits against the blocking plate 1011 and drives the blocking plate 1011 to move. This causes the blocking plate 1011 to drive the blocking block 734 to move away from the connecting limit post 41, so that the blocking block 734 is pulled out of the blocking slot 736. This allows the upper pressure plate 1 and the reset block 653 to be reset upward under the action of the reset spring 652, making it convenient for the connecting plate 2 to connect with the support base plate 4 next time, and also making it convenient for the upper pressure plate 1 to be pressed next time.

[0068] The operator then pinches the unlocking block 1021, causing it to move closer to the locking baffle 9016. This allows the locking baffle 9016 to drive the locking block 9015 to compress the locking spring 9017, and moves the locking block 9015 closer to the transmission gear 98 to the side of the transmission gear 98. The transmission gear 98 falls downwards under gravity, causing the return block 9012 at the lower end of the transmission gear 98 to re-insert into the return guide groove 9011. (If the return block 9012 is not aligned with the return guide groove 9011 when the transmission gear 98 falls, the operator can manually rotate the fastening sleeve 99 to re-insert the return block 9012.) 2. Align the spring guide groove 9011 with the transmission gear 98, and let the spring block 9012 be inserted into the spring guide groove 9011 under the action of gravity. Then, the operator releases the unlocking block 1021. At this time, the locking block 9015 moves back to the side closer to the transmission gear 98 under the action of the locking spring 9017, so that the locking guide angle 9014 is once again in contact with the outer side of the upper end of the transmission gear 98. The upper side of the end of the locking block 9015 away from the locking guide angle 9014 is once again engaged with the lower end of the reset block 653, which facilitates the installation of the fastening nut 62 by the fastening sleeve 99 next time, so as to realize the reusability of the MOS tube carrier board.

[0069] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A MOS transistor carrier board, characterized in that: The device includes a copper substrate (101), a mounting groove (102), a mounting chamfer (103), a molding compound (107), a chip (104), an isolation layer (105), and a MOS base plate (106). The copper substrate (101) is connected to the MOS base plate (106). The mounting groove (102) is formed on the copper substrate (101). The mounting chamfer (103) is provided on the mounting groove (102). The bottom of the chip (104) is bonded with solder paste. In the mounting slot (102), there is a gap between the side of the chip (104) and the mounting chamfer (103). The molding compound (107) fills the gap between the chip (104) and the mounting chamfer (103). The chip (104) is provided with a gate (108) and a source (109). The isolation layer (105) is provided between the gate (108) and the source (109). The copper substrate (101) is provided with a drain (110).

2. The MOS transistor carrier board according to claim 1, characterized in that: The copper substrate (101) has 32 horizontally arranged mounting slots (102) and 9 vertically arranged mounting slots (102), and each mounting slot (102) contains two sets of chips (104).

3. The MOS transistor carrier board according to claim 2, characterized in that: The molding compound (107) is an EMC molding compound (107) material. The molding compound (107) is used to resist external solvents, moisture and impacts on the chip (104) and ensure that the chip (104) is electrically insulated from the external environment.

4. The MOS transistor carrier board according to claim 3, characterized in that: The gate (108) and source (109) are connected to the chip (104) by electroplating, and the drain (110) is connected to the copper substrate (101) by electroplating.

5. A MOS transistor carrier board packaging tool for packaging MOS transistor carrier boards, characterized in that: The MOS transistor carrier board includes any one of claims 1 to 4, and an upper pressure plate (1), a connecting plate (2), a supporting base plate (4), a mounting component (6), a bonding component (7), a connecting component (8), a transmission component (9), and an unlocking component (10). The supporting base plate (4) is disposed at the lower end of the copper substrate (101), the connecting plate (2) is disposed at the upper end of the copper substrate (101), the connecting plate (2) is connected to the supporting base plate (4), the upper pressure plate (1) is slidably connected to the connecting plate (2), the connecting component (8) is disposed at the lower end of the connecting plate (2) to connect and fix the connecting plate (2) to the supporting base plate (4), and the transmission component (9) and the mounting component (6) are disposed inside the connecting plate (2). When the upper pressure plate (1) is repeatedly pressed, the transmission component (9) and the mounting component (6) are engaged. The component (9) works with the mounting component (6) to slowly fasten the copper substrate (101) onto the MOS base plate (106) and spring back the upper pressure plate (1) until the copper substrate (101) is completely attached to the MOS base plate (106). The attachment component (7) is located at the lower end of the connecting plate (2). When the copper substrate (101) is completely attached to the MOS base plate (106) and the upper pressure plate (1) is pressed, the attachment component (7) works with the mounting component (6) to make the upper pressure plate (1) attach to the connecting plate (2), the connecting plate (2) is released from the support base plate (4), and the drain (110) of the chip (104) is attached to and aligned with the copper substrate (101). The unlocking component (10) is located on the upper pressure plate (1) to work with the mounting component (6) to make the upper pressure plate (1) spring back.

6. The MOS transistor carrier board packaging tool according to claim 5, characterized in that: The connecting component (8) includes a connecting baffle (81), a connecting spring (82), a connecting post (83), a connecting groove (84), a lower connecting block (85), and a connecting chamfer (86). A limiting post (41) is provided on the supporting base plate (4), and a limiting groove (42) is provided on the limiting post (41). The connecting post (83) is located at the lower end of the connecting plate (2), and the connecting groove (84) is formed within the connecting post (83). The connecting post (83) is connected to the connecting groove (86). 84) Connected to the limiting post (41), the connecting baffle (81) is slidably connected in the connecting groove (84), the two ends of the connecting spring (82) are respectively connected to the end of the connecting baffle (81) away from the limiting post (41) and the inner wall of the connecting post (83), the lower connecting block (85) is set at the end of the connecting baffle (81) near the limiting post (41), the connecting guide angle (86) is opened on the lower connecting block (85), and the connecting guide angle (86) cooperates with the limiting groove (42).

7. The MOS transistor carrier board packaging tool according to claim 6, characterized in that: The transmission component (9) includes an upper pressure column (91), an upper pressure groove (92), an upper pressure spring (93), an upper pressure block (94), an upper pressure guide angle (95), an upper pressure threaded groove (96), an upper pressure gear (97), a transmission gear (98), a fastening sleeve (99), and a springback unit (901). The upper pressure column (91) is fixed to the lower end of the upper pressure plate (1). The upper pressure column (91) is slidably connected to the center of the upper pressure gear (97). The upper pressure gear (97) and the transmission gear (98) are rotatably connected to the upper pressure plate (1). The upper pressure gear (97) and the transmission gear (98) mesh. The upper pressure groove (92) is provided inside the upper pressure column (91). The upper pressure block (94) is disposed in the upper pressure groove (92). The two ends of the upper pressure spring (93) are respectively connected to the end of the upper pressure block (94) away from the upper pressure gear (97) and the inner wall of the upper pressure column (91). The upper pressure guide angle (95) is disposed at the upper end of the upper pressure block (94). The upper pressure thread groove (96) is disposed in the upper pressure gear (97). The lower end of the upper pressure block (94) near the upper pressure gear (97) is engaged with the upper pressure thread groove (96). The upper pressure guide angle (95) is engaged with the upper pressure thread groove (96). The fastening sleeve (99) is connected to the lower end of the transmission gear (98). The springback unit (901) is disposed on the fastening sleeve (99). The springback unit (901) includes a springback guide groove (9011), a springback block (9012), a locking groove (9013), a locking guide angle (9014), a locking block (9015), a locking baffle (9016), and a locking spring (9017). The springback guide groove (9011) is opened on the fastening sleeve (99). The springback block (9012) is opened at the lower end of the transmission gear (98). The springback block (9012) cooperates with the springback guide groove (9011). The locking groove (9013) is opened in the connecting plate (2). The locking block (9015) is slidably connected in the locking groove (9013). The locking guide angle (9014) is set at one end of the locking block (9015). The locking baffle (9016) is set on the locking block (9015). The two ends of the locking spring (9017) abut against the end of the locking baffle (9016) away from the locking guide angle (9014) and the inner wall of the connecting plate (2), respectively. The locking guide angle (9014) cooperates with the side of the transmission gear (98). The upper end of the locking block (9015) cooperates with the lower end of the transmission gear (98).

8. The MOS transistor carrier board packaging tool according to claim 7, characterized in that: The mounting component (6) includes a nut groove (61), a fastening nut (62), a fastening bolt (63), a bolt groove (64), and a release unit (65). The nut groove (61) is located at the lower end of the fastening sleeve (99). The fastening nut (62) is located in the nut groove (61). The bolt groove (64) is located on the support base plate (4). The lower end of the fastening bolt (63) is connected in the bolt groove (64). The MOS base plate (106) and the copper base plate (101) are connected by the fastening bolt (63) and the fastening nut (62). The release unit (65) is located in the connecting plate (2). The disengagement unit (65) includes a reset groove (651), a reset spring (652), and a reset block (653). The reset groove (651) is located on the upper end of the connecting plate (2). The reset block (653) is slidably connected in the reset groove (651). The two ends of the reset spring (652) are respectively connected to the lower end of the reset block (653) and the bottom of the reset groove (651). The lower end of the reset block (653) is engaged with the end of the locking block (9015) away from the locking guide angle (9014). The upper end of the reset block (653) is attached to the lower end of the upper pressure plate (1).

9. The MOS transistor carrier board packaging tool according to claim 8, characterized in that: The bonding component (7) includes a bonding groove (71), an adjusting block (72), and a blocking unit (73). The bonding groove (71) is located at the lower end of the reset groove (651). The adjusting block (72) is located at the lower end of the reset block (653). The lower end of the adjusting block (72) cooperates with the drain (110) of the chip (104) through the bonding groove (71). The blocking unit (73) is located inside the connecting plate (2). The blocking unit (73) includes an upper connecting block (731), a blocking groove (732), a blocking spring (733), a blocking block (734), a blocking chamfer (735), and a blocking slot (736). The upper connecting block (731) is disposed on the upper part of the connecting baffle (81) near the lower connecting block (85). The blocking groove (732) is formed in the upper connecting block (731). The blocking block (734) is slidably connected in the blocking groove (732). The two ends of the blocking spring (733) are respectively connected to the end of the blocking block (734) near the blocking groove (732) and the upper connecting block (85). The inner wall of the block (731) is connected, the blocking guide angle (735) is opened at the end of the blocking block (734) away from the upper connecting block (731), the blocking guide angle (735) cooperates with the lower end of the reset block (653), the lower end of the upper pressure plate (1) is provided with a limit connecting rod (11), the blocking slot (736) is opened on the limit connecting rod (11), the blocking guide angle (735) cooperates with the lower end of the limit connecting rod (11), the blocking guide angle (735) cooperates with the blocking slot (736), the spring force of the blocking spring (733) is greater than the spring force of the connecting spring (82).

10. The MOS transistor carrier board packaging tool according to claim 9, characterized in that: The unlocking component (10) includes a blocking baffle (1011), an unlocking block (1021), and an unlocking groove (1031). The blocking baffle (1011) is disposed on the upper end of the blocking block (734). The unlocking groove (1031) is opened between the blocking baffle (1011) and the locking baffle (9016). The unlocking block (1021) is slidably connected in the unlocking groove (1031). One end of the unlocking block (1021) cooperates with the blocking baffle (1011), and the other end cooperates with the locking baffle (9016).

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