Double-sided packaging structure
By encapsulating conductive pillars and electronic components with resin film on the back of the substrate, the double-sided packaging process is simplified, costs are reduced, and product yield is improved, solving the problems of complexity and high cost of traditional double-sided packaging methods.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional double-sided packaging methods are complex, difficult to manufacture, and costly.
The back electronic components and conductive pillars on the back of the substrate are encapsulated with a flexible resin film. The resin film is applied to the back of the substrate through vacuum lamination, directly exposing the end face of the conductive pillars, which simplifies the drilling, electroplating and polishing processes.
It simplifies the packaging process, reduces the difficulty and cost of packaging technology, and improves product yield.
Smart Images
Figure CN224069098U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a double-sided packaging structure. Background Technology
[0002] With the development of System-in-Package (SIP) technology and the increasing urgency of miniaturization, packaging technology has shifted from traditional wire bonding (WB) to flip chip (FC) packaging. However, the limited space on one side of the product makes it difficult to meet the growing performance requirements. Therefore, designers have begun to shift from planar to spatial design, leading to the emergence of chip stacking and double-sided molding compounds. Double-sided molding compounds mount devices on both sides of the substrate, effectively increasing the usable area of the product to accommodate more chips and support more functions.
[0003] In common double-sided packaging methods, liquid molding compound is typically used to fill the back of the substrate to form a molding compound. Then, laser drilling, electroplating of tin or copper pillars is performed, followed by grinding to remove some of the molding compound's thickness. Finally, tin is electroplated or solder paste is printed on the ends of the tin or copper pillars to form signal output ports. However, the above-mentioned double-sided packaging methods are relatively complex, and the drilling and electroplating processes within the molding compound are difficult and costly. Utility Model Content
[0004] One of the purposes of this invention is to provide a double-sided packaging structure that simplifies the packaging process and reduces the difficulty and cost of the packaging technology.
[0005] To achieve the above objectives, this utility model provides a double-sided encapsulation structure. The double-sided encapsulation structure includes: an intermediate molding structure comprising a substrate having a front side and a back side, the back side of which has conductive pillars; a back electronic component mounted on the back side of the substrate; and a resin film adhered to the back side of the substrate, at least covering the sidewalls of the back electronic component and the sidewalls of the conductive pillars, wherein the surface of the resin film away from the substrate is flush with the end face of the conductive pillar away from the substrate.
[0006] Optionally, the back side of the substrate has a plurality of conductive pillars of equal height, and the resin layer fills the gaps between the conductive pillars and the gaps between the conductive pillars and the back electronic components.
[0007] Optionally, the back-side electronic component includes a filter chip, and a cavity exists between the filter chip and the back side of the substrate.
[0008] Optionally, the back-side electronic component includes a non-filter chip, and the gap between the non-filter chip and the back side of the substrate is filled with an underfill.
[0009] Optionally, the double-sided packaging structure further includes solder balls disposed on the end face of the conductive post away from the substrate.
[0010] Optionally, the intermediate molding structure further includes a front-side electronic component and a molding compound; the front-side electronic component is mounted on the front side of the substrate; the molding compound is formed on one side of the front side of the substrate, and the molding compound at least covers the sidewall of the front-side electronic component.
[0011] Optionally, there may be multiple back-side electronic components, and the height of the conductive post shall not be less than the height of the tallest of the back-side electronic components.
[0012] Optionally, the material of the resin film includes epoxy resin, filler, hardener, catalyst, flame retardant, coupling agent and low stress modifier.
[0013] Optionally, the resin film may be made of niobium pentoxide or lithium carbonate, wherein the purity of the niobium pentoxide or the lithium carbonate is greater than 99.995%.
[0014] In the double-sided packaging structure provided by this utility model, a soft resin film is used to encapsulate the back electronic components and conductive pillars on the back of the substrate. After the resin film is applied, the end face of the conductive pillar can be directly exposed. Compared with the traditional technical solution of filling the back of the substrate with molding compound to form a molding body to encapsulate the back electronic components, it can save the processes of drilling, electroplating and grinding the molding body, simplify the packaging process, reduce the packaging process difficulty, and reduce costs. Attached Figure Description
[0015] Figure 1 This is a flowchart illustrating a method for manufacturing a double-sided packaging structure according to an embodiment of the present invention.
[0016] Figures 2 to 6 This is a schematic diagram illustrating the manufacturing process of a double-sided packaging structure provided in one embodiment of the present invention.
[0017] Figure 7 This is a cross-sectional schematic diagram of a double-sided packaging structure provided in an embodiment of the present invention.
[0018] Figure 8 This is a cross-sectional schematic diagram of a double-sided packaging structure provided in another embodiment of the present invention.
[0019] Explanation of reference numerals in the attached drawings: 100-substrate; 101-pad; 102-conductive pillar; 200-front electronic component; 300-molding body; 400-back electronic component; 500-resin film; 601-cavity; 602-bottom filler; 700-plate. Detailed Implementation
[0020] To address the issues of complex, difficult, and costly processes associated with traditional double-sided packaging methods, the core of this invention's double-sided packaging structure and manufacturing method lies in using a flexible resin film to encapsulate the back-side electronic components and conductive pillars of the substrate. The flexible resin film is applied to the back of the substrate using a vacuum lamination method, allowing the end faces of the conductive pillars to be directly exposed after the resin film is applied. Compared to the traditional method of filling the back of the substrate with molding compound to form a molded body, followed by drilling, electroplating, and grinding within the molded body, this method eliminates the need for drilling, electroplating, and grinding within the molded body, simplifying the packaging process, reducing its difficulty, and lowering costs.
[0021] The double-sided packaging structure and its manufacturing method proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.
[0022] As used in this invention, the singular forms "a," "an," and "the" include plural objects; the term "or" is generally used to include the meaning of "and / or"; and the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral part; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two elements or an interaction between two elements. Furthermore, as used in this invention, the placement of one element on another element generally only indicates a connection, coupling, cooperation, or transmission relationship between the two elements, and this connection, coupling, cooperation, or transmission can be direct or indirect through an intermediate element. It should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located arbitrarily inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated.
[0023] Figure 1 This is a flowchart illustrating a method for manufacturing a double-sided packaging structure according to an embodiment of the present invention. Figure 1 As shown, the method for fabricating the double-sided packaging structure provided in this embodiment includes:
[0024] Step S1, providing an intermediate molding structure, the intermediate molding structure including a substrate, the substrate having opposing front and back sides, the back side of the substrate having conductive pillars;
[0025] Step S2, mounting back-side electronic components on the back side of the substrate; and
[0026] Step S3: A resin film is attached to the back side of the substrate. The resin film covers at least the sidewalls of the back electronic components and the sidewalls of the conductive pillars, and the end face of the conductive pillars away from the substrate is exposed from the resin film.
[0027] Figures 2 to 6 This is a schematic diagram illustrating the manufacturing process of a double-sided packaging structure provided in one embodiment of the present invention. Figure 7 This is a cross-sectional schematic diagram of a double-sided packaging structure provided in an embodiment of the present invention. The following is in conjunction with... Figures 2 to 7 The fabrication method of the double-sided packaging structure in this embodiment will be described.
[0028] In this embodiment, the method for providing the intermediate molding structure includes: as follows Figure 2 As shown, a substrate 100 is provided, the substrate 100 having opposing front and back sides, the back side of the substrate 100 having conductive pillars 102; front electronic components 200 are mounted on the front side of the substrate 100; as shown Figure 3 As shown, a molding compound 300 is formed on one side of the front side of the substrate 100, and the molding compound 300 at least covers the sidewall of the front electronic component 200.
[0029] Specifically, the substrate 100 can be a printed circuit board, but is not limited to this. Both the front and back sides of the substrate 100 are provided with a plurality of exposed pads 101. The pads 101 can be used for, but are not limited to, mounting chip pins, carrying conductive pillars 102, or carrying bonding wires connected to the chip. The chip, conductive pillars 102, and bonding wires can be electrically connected to the circuitry inside the substrate 100 through the pads 101.
[0030] A plurality of conductive pillars 102 may be formed on the back side of the substrate 100. The plurality of conductive pillars 102 may be respectively disposed on corresponding pads 101, and the height of the plurality of conductive pillars 102 may be equal. The material of the conductive pillars 102 includes, but is not limited to, at least one of copper, titanium and tin.
[0031] like Figure 2 and Figure 3 As shown, multiple front-side electronic components 200 can be mounted on the front side of the substrate 100. These front-side electronic components 200 can be chips or passive devices, and the passive devices can be capacitors, inductors, or resistors. For example, refer to... Figure 2As shown, some of the front-side electronic components 200 can be wire-bonded chips, with the back side of the chip attached to the front side of the substrate, and the front side of the chip electrically connected to the substrate 100 via bonding wires; some of the front-side electronic components 200 can be flip chips, with the flip chip mounted face down on the front side of the substrate 100, and the bumps on the front side of the flip chip soldered to the pads of the substrate 100.
[0032] In this embodiment, the material of the molding compound 300 formed on the front side of the substrate 100 can be epoxy molding compound (EMC). The method for forming the molding compound 300 may include: placing a mold on the front side of the substrate 100, filling the mold with liquid epoxy molding compound, and allowing the epoxy molding compound to cure and form the molding compound 300; removing the mold. If necessary, after removing the mold, a portion of the thickness of the molding compound 300 may be removed by grinding.
[0033] like Figure 4 As shown, the flipping process is performed so that the back side of the substrate 100 faces upward, and then the back electronic component 400 is installed on the back side of the substrate 100.
[0034] For example, multiple back-side electronic components 400 may be mounted on the back side of the substrate 100. The back-side electronic components 400 may be chips or passive devices, such as capacitors, inductors, or resistors. For example, the back-side electronic components 400 may be flip chips, with the front side of the flip chip facing the substrate 100, and bumps on the front side of the flip chip soldered to pads on the substrate 100. The multiple back-side electronic components 400 may include filter chips and / or non-filter chips.
[0035] It should be noted that, in this embodiment, the height of the conductive post 102 is greater than or equal to the height of the back electronic component 400. More specifically, the height of the conductive post 102 is not lower than the height of the tallest of the plurality of back electronic components 400.
[0036] It should be noted that, in this embodiment, the conductive pillars 102 are pre-formed on the back side of the substrate 100 before the front electronic component 200 is installed. For example, the conductive pillars 102 are formed when the substrate 100 is received, or in other words, the conductive pillars 102 are formed during the fabrication of the substrate 100.
[0037] In other embodiments of this application, the conductive pillars 102 can be formed on the back side of the substrate 100 after the molding compound 300 is formed and before the back-side electronic components are mounted. In one embodiment, the method for forming the conductive pillars 102 on the back side of the substrate 100 may include: forming a patterned photoresist layer on the back side of the substrate 100; and using the patterned photoresist layer as a mask, forming the conductive pillars 102 on the back side of the substrate 100 through an electroplating process. In one embodiment, the conductive pillars 102 can be soldered to pads on the back side of the substrate 100.
[0038] like Figure 5 and Figure 6 As shown, a resin film 500 is attached to the back side of the substrate 100. The resin film 500 covers at least the sidewall of the back electronic component 400 and the sidewall of the conductive post 102. The end face of the conductive post 102 away from the substrate 100 is exposed from the resin film 500.
[0039] In this embodiment, the surface of the resin film 500 away from the substrate and the end face of the conductive post 102 away from the substrate are flush. After the resin film 500 is attached to the back side of the substrate 100, the thickness of the resin film 500 can be equal to the height of the conductive post 102. The thickness direction and height direction described in this application are both perpendicular to the back side of the substrate 100. It should be noted that if the pad 101 below the conductive post 102 protrudes from the back side of the substrate 100, the thickness of the resin film 500 after it is attached to the back side of the substrate 100 can be equal to the sum of the height of the conductive post 102 and the thickness of the pad 101.
[0040] In this embodiment, the resin film 500 also covers the surface of the back electronic component 400 away from the substrate 100, such as the back side of a flip chip.
[0041] In this embodiment, a resin film 500 is laminated onto the back side of the substrate 100 using a vacuum lamination method. The method of laminating the resin film 500 onto the back side of the substrate 100 using a vacuum lamination method may include: referring to... Figure 5 and Figure 6 As shown, a soft resin film 500 is applied to a pressure plate 700; the pressure plate 700 and the intermediate encapsulation structure are placed in the film application chamber, with the side of the pressure plate 700 where the resin film 500 is placed aligned with the back of the substrate 100; the film application chamber is evacuated, and the resin film 500 is pressed onto the back of the substrate 100; the pressure plate 700 is then removed.
[0042] In the step of placing the flexible resin film 500 on the pressure plate 700, the thickness of the resin film 500 is selected according to the height of the conductive post 102 to ensure that the end face of the conductive post 102 away from the substrate 100 is just exposed after the resin film 500 is attached to the back of the substrate 100.
[0043] In this embodiment, the pressure plate 700 is a rigid plate, for example, the pressure plate 700 can be a steel plate.
[0044] When the resin film 500 is pressed onto the back side of the substrate 100, a vacuum needs to be drawn while pressing, so that the soft resin film 500 can fill the gaps between the conductive pillars 102, the gaps between the back electronic components 400, and the gaps between the conductive pillars 102 and the back electronic components 400. That is, the soft resin film 500 can encapsulate the conductive pillars 102 and the back electronic components 400 on the back side of the substrate 100.
[0045] It should be noted that for the back-side electronic component 400 of the filter chip, refer to... Figure 6 As shown, there is a cavity 601 between the filter chip and the back of the substrate 100. Compared with encapsulating the filter chip by filling the back of the substrate 100 with liquid molding compound, the pressure of the soft resin film 500 on the back of the substrate 100 on the cavity 601 is less than that of the liquid molding compound. Therefore, using the soft resin film 500 to encapsulate the filter chip can solve the problem of cavity 601 collapse, avoid filter chip performance failure, and improve product yield.
[0046] Figure 8 This is a cross-sectional schematic diagram of a double-sided packaging structure provided in one embodiment of the present invention. In another embodiment of this application, reference is made to… Figure 8 As shown, for the non-filter chip in the back-side electronic component 400; after the back-side electronic component 400 is mounted on the back side of the substrate 100 and before the resin film 500 is applied to the back side of the substrate 100, an underfiller 602 can be filled in the gap between the non-filter chip and the back side of the substrate 100. The subsequently applied resin film 500 can cover the outside of the underfiller, thereby improving the chip packaging reliability. For example, a dispensing process can be used to fill the gap between the non-filter chip and the back side of the substrate 100 with the underfiller 602.
[0047] refer to Figure 7 and Figure 8 As shown, after the resin film is attached to the back side of the substrate 100, the back side of the substrate 100 is cleaned to remove dirt from the end face of the conductive post 102; and a ball 600 is soldered onto the end face of the conductive post 102 away from the substrate 100 to form a signal output port of a double-sided package structure.
[0048] For example, the material of solder ball 600 includes tin.
[0049] This application also provides a double-sided packaging structure. The double-sided packaging structure can be formed using the above-described method for manufacturing a double-sided packaging structure.
[0050] refer to Figure 7 As shown, the double-sided encapsulation structure includes an intermediate molding structure, a rear electronic component 400, and a resin film 500. The intermediate molding structure includes a substrate 100, which has a front side and a back side. The back side of the substrate 100 has conductive pillars 102. The rear electronic component 400 is mounted on the back side of the substrate 100. The resin film 500 is attached to the back side of the substrate 100, covering at least the sidewalls of the rear electronic component 400 and the sidewalls of the conductive pillars 102. The surface of the resin film 500 away from the substrate 100 is flush with the end face of the conductive pillars 102 away from the substrate.
[0051] Specifically, the substrate 100 can be a printed circuit board, but is not limited to this. The substrate 100 has a plurality of exposed pads 101 on both the front and back sides.
[0052] A plurality of conductive pillars 102 may be formed on the back side of the substrate 100. The plurality of conductive pillars 102 may be respectively disposed on corresponding pads 101, and the height of the plurality of conductive pillars 102 may be equal. The material of the conductive pillars 102 includes, but is not limited to, at least one of copper, titanium and tin.
[0053] In this embodiment, the height of the conductive post 102 is greater than or equal to the height of the back electronic component 400. More specifically, there can be multiple back electronic components 400, and the height of the conductive post 102 is not lower than the height of the highest among the multiple back electronic components 400.
[0054] The intermediate molding structure further includes a front electronic component 200 and a molding compound 300; the front electronic component 200 is mounted on the front side of the substrate 100; the molding compound 300 is formed on one side of the front side of the substrate 100, and the molding compound 300 at least covers the sidewall of the front electronic component.
[0055] like Figure 7 As shown, a plurality of front-side electronic components 200 can be mounted on the front side of the substrate 100. These front-side electronic components 200 can be chips or passive devices, and the passive devices can be capacitors, inductors, or resistors. For example, see reference... Figure 7As shown, some of the front-side electronic components 200 can be wire-bonded chips, with the back side of the chip attached to the front side of the substrate, and the front side of the chip electrically connected to the substrate 100 via bonding wires; some of the front-side electronic components 200 can be flip chips, with the flip chip mounted face down on the front side of the substrate 100, and the bumps on the front side of the flip chip soldered to the pads of the substrate 100.
[0056] In this embodiment, the material of the molding compound 300 can be epoxy molding compound (EMC).
[0057] Multiple back-side electronic components 400 may be mounted on the back side of the substrate 100. The back-side electronic components 400 may be chips or passive devices, such as capacitors, inductors, or resistors. For example, the back-side electronic components 400 may be flip chips, with the front side of the flip chip facing the substrate 100, and bumps on the front side of the flip chip soldered to pads on the substrate 100. The multiple back-side electronic components 400 may include filter chips and / or non-filter chips.
[0058] In this embodiment, the resin layer 500 covers the surface of the back electronic component 400 away from the substrate 100. In other embodiments, the resin layer 500 may expose at least a portion of the surface of the back electronic component 400 away from the substrate 100.
[0059] In this application, the resin layer 500 fills the gaps between the conductive pillars 102, the gaps between the back electronic components 400, and the gaps between the conductive pillars 102 and the back electronic components 400. It should be emphasized that in this application, only the resin layer 500 is used to encapsulate the conductive pillars 102 and the back electronic components 400 on the back side of the substrate 100. The resin layer 500 can fill the gaps between the conductive pillars 102, the gaps between the back electronic components 400, and the gaps between the conductive pillars 102 and the back electronic components 400.
[0060] In this embodiment, the thickness of the resin film 500 can be equal to the height of the conductive post 102. Both the thickness direction and the height direction described in this application are perpendicular to the back surface of the substrate 100. It should be noted that if the pad 101 below the conductive post 102 protrudes from the back surface of the substrate 100, the thickness of the resin film 500 can be equal to the sum of the height of the conductive post 102 and the thickness of the pad 101.
[0061] In this application, a flexible resin film 500 is applied to the back of the substrate using a vacuum lamination method.
[0062] In this application, the resin film 500 is made of epoxy resin, filler, hardener, catalyst, flame retardant, coupling agent and low stress modifier, etc.
[0063] The resin membrane 500 is made of niobium pentoxide (Nb₂O₅) or lithium carbonate (Li₂CO₃); when the resin membrane 500 is made of niobium pentoxide, the purity of niobium pentoxide is greater than 99.995%; when the resin membrane 500 is made of lithium carbonate, the purity of lithium carbonate is greater than 99.995%. The resin membrane 500 also includes Fe, Ni, Cu, Zn, Mn, Ti, Mo, Al, Mg, Zr, Sn, Sb, and W, with the contents of Fe, Ni, Cu, Zn, Mn, Ti, Mo, Al, Mg, Zr, Sn, Sb, and W all less than 2 ppm. The resin membrane 500 also includes Ta, F, Si, Ca, K, and Na, with the contents of Ta, F, Si, Ca, K, and Na all less than 10 ppm.
[0064] It should be noted that for the back-side electronic component 400 of the filter chip, refer to... Figure 7 As shown, there is a cavity 601 between the filter chip and the back of the substrate 100. Compared with encapsulating the filter chip by filling the back of the substrate 100 with liquid molding compound, the pressure of the soft resin film 500 on the back of the substrate 100 on the cavity 601 is less than that of the liquid molding compound. Therefore, using the soft resin film 500 to encapsulate the filter chip can solve the problem of cavity 601 collapse, avoid filter chip performance failure, and improve product yield.
[0065] In another embodiment of this application, reference is made to... Figure 8 As shown, for the non-filter chip in the back-side electronic component 400, a bottom filler 602 can be filled in the gap between the non-filter chip and the back side of the substrate 100, and a resin film 500 can wrap the outside of the bottom filler 602, which can improve the packaging reliability of the chip.
[0066] like Figure 7 and Figure 8 As shown, the double-sided packaging structure also includes solder balls 600, which are disposed on the end face of the conductive post 102 away from the substrate.
[0067] In the double-sided packaging structure provided by this utility model, a soft resin film 500 is used to encapsulate the back electronic components 400 and conductive pillars 102 on the back side of the substrate 100. The soft resin film 500 can be applied to the back side of the substrate 100 by vacuum lamination. After the resin film 500 is applied, the end face of the conductive pillars 102 can be directly exposed. Compared with the traditional technical solution of filling the back side of the substrate with molding compound to form a molding body to encapsulate the back electronic components, this method can save the processes of drilling, electroplating and grinding the molding body, simplify the packaging process, reduce the packaging process difficulty, and reduce costs.
[0068] It should be noted that this instruction manual uses a progressive approach. The later descriptions of the double-sided packaging structure focus on the differences in manufacturing methods compared to the earlier descriptions. For similarities and similarities between the different parts, please refer to each other.
[0069] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Any person skilled in the art can make possible changes and modifications to the technical solution of the present utility model by using the methods and techniques disclosed above without departing from the spirit and scope of the present utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall fall within the protection scope of the technical solution of the present utility model.
Claims
1. A flip chip package structure, comprising: The double-sided package structure comprises: an intermediate plastic package structure, the intermediate plastic package structure comprising a substrate, the substrate having opposite front and back surfaces, the back surface of the substrate having conductive pillars; back surface electronic elements mounted on the back surface of the substrate; a resin film attached to the back surface of the substrate, the resin film at least covering sidewalls of the back surface electronic elements and sidewalls of the conductive pillars, a surface of the resin film distal from the substrate being flush with end surfaces of the conductive pillars distal from the substrate.
2. The flip chip package structure of claim 1, wherein, The back surface of the substrate has a plurality of conductive pillars of equal height, and the resin film fills gaps between the conductive pillars and gaps between the conductive pillars and the back surface electronic elements.
3. The flip chip package structure of claim 1, wherein, The back surface electronic elements comprise filter chips, and the filter chips and the back surface of the substrate have cavities therebetween.
4. The flip chip package structure of claim 1, wherein, The back surface electronic elements comprise non-filter chips, and a gap between the non-filter chips and the back surface of the substrate is filled with an underfill agent.
5. The flip chip package structure of claim 1, wherein, The double-sided package structure further comprises solder balls disposed on the end surfaces of the conductive pillars distal from the substrate.
6. The flip chip package structure of claim 1, wherein, The intermediate plastic package structure further comprises front surface electronic elements and a plastic package body; the front surface electronic elements are mounted on the front surface of the substrate; and the plastic package body is formed on a side of the front surface of the substrate, the plastic package body at least covering sidewalls of the front surface electronic elements.
7. The double-sided packaging structure as described in claim 1, characterized in that, The number of the back surface electronic elements is a plurality, and the height of the conductive pillars is not less than the height of the highest one of the plurality of back surface electronic elements.
8. The flip chip package structure of claim 1, wherein, The material of the resin film comprises epoxy resin, filler, hardener, catalyst, flame retardant, coupling agent, and low stress modifier.
9. The flip chip package structure of claim 1, wherein, The material of the resin film comprises niobium pentoxide or lithium carbonate, and the purity of the niobium pentoxide or the lithium carbonate is greater than 99.995%.