Circuit structure and manufacturing method thereof, battery and electric device

Abstract

The invention is suitable for the technical field of power batteries, and provides a circuit structure and a manufacturing method thereof, a battery and a power utilization device, the circuit structure comprises a circuit board, and the circuit board comprises a conductive part; the electronic device is arranged on the circuit board, pins are arranged on the electronic device, and the pins are electrically connected to the conductive part; the limiting piece is arranged on one side, deviating from the pin, of the conductive part; part of the limiting piece, part of the conductive part and part of the pin are welded to form a fusion part, and the fusion part penetrates through the circuit board from the limiting piece and extends into the pin; according to the embodiment of the invention, the pins, the circuit board and the limiting pieces are connected together through the fusion parts, so that the contact area between the fusion parts and the conductive parts and the pins is increased, and the connection strength between the conductive parts and the pins is enhanced; and the limiting piece can also play a role in supplementing the solution, so that the connection strength between the conductive part and the pin is further enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of power batteries, and in particular to a circuit structure and a manufacturing method thereof, a battery and an electrical device. Background Art

[0002] At present, from the perspective of market development, the application of power batteries is becoming more and more extensive. Power batteries are not only used in energy storage power systems such as hydropower, thermal power, wind power and solar power stations, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, electric cars, as well as military equipment and aerospace and other fields. With the continuous expansion of the application field of power batteries, the market demand is also constantly expanding.

[0003] In batteries, various parameters of the battery are usually transmitted to the control module through a connector, wherein the connector is usually connected to various sensors and other devices inside the battery through a flexible circuit cable, and is connected to the control module through a connector body connected to the flexible circuit cable, so as to achieve the function of transmitting various parameters. However, in current connectors, the connection between the connector body and the flexible circuit cable is weak and prone to deformation and breakage, which has a negative impact on parameter transmission. Summary of the invention

[0004] In view of the above problems, the present application provides a circuit structure and a manufacturing method thereof, a battery and an electrical device, which alleviate the problem of low strength at the connection between electronic devices and flexible circuit cables.

[0005] In a first aspect, an embodiment of the present application provides a circuit structure, including:

[0006] A circuit board, the circuit board comprising a conductive portion;

[0007] An electronic device is arranged on the circuit board, the electronic device is provided with pins, and the pins are electrically connected to the conductive part;

[0008] A stopper, arranged on a side of the conductive portion away from the pin;

[0009] Part of the limiting member, part of the conductive part and part of the pin are welded to form a fusion portion, and the fusion portion extends from the limiting member through the circuit board to the pin.

[0010] In the technical solution of this embodiment, a limiting member is provided on the side of the circuit board away from the pins. The limiting member is welded to the conductive portion of the circuit board to form a fusion portion, so that a part of the limiting member, a part of the conductive portion, and a part of the pins are all melted into the fusion portion, and the fusion portion can pass through the conductive portion and extend into the pins. The pins, the circuit board, and the limiting member are connected together through the fusion portion, increasing the contact area between the fusion portion and the conductive portion and the pins, and enhancing the connection strength between the conductive portion and the pins. The setting of the limiting member can also play a role in supplementing the solution during the welding process to further increase the contact area between the fusion portion and the conductive portion and the pins, and further enhance the connection strength between the conductive portion and the pins.

[0011] In some embodiments, the conductive portion is electrically connected to the pins through the fusion portion.

[0012] In the technical solution of this embodiment, the conductive portion is made to be electrically connected to the pins through the fusion portion. Since the contact area between the fusion portion and the conductive portion and the pins is relatively large, the over-current area between the conductive portion and the pins is also relatively large, thereby enhancing the over-current capacity between the conductive portion and the pins.

[0013] In some embodiments, the conductive portion includes a first surface facing the pins, and the pins include a second surface facing the conductive portion;

[0014] The conductive portion is pressed by the limiting member against the pins so that the first surface touches and is electrically connected to the second surface.

[0015] In the technical solution of this embodiment, the limiting member presses the conductive portion against the pins. Since the fusion portion passes through the circuit board from the limiting member and extends into the pins, that is, the fusion portion fixes the positions of the limiting member, the circuit board, and the pins, the conductive portion can be stably pressed against the pins, and the first surface can be stably pressed against the second surface, enabling the conductive portion to be electrically connected to the pins through the mutually contacting first surface and second surface, thereby further increasing the over-current area between the conductive portion and the pins and enhancing the over-current capacity between the conductive portion and the pins.

[0016] In some embodiments, a welding hole is formed in the fusion portion, and the welding hole passes through the limiting member, the circuit board, and extends into the pins;

[0017] Along the direction from the limiting member to the pins, the inner diameter of the welding hole gradually decreases.

[0018] In the technical solution of this embodiment, making the inner diameter of the welding hole gradually decrease along the direction from the limiting member to the pins can cause a component force in the direction from the limiting member to the pins to exist during the formation of the welding hole. This component force can better press the conductive portion against the pins, so that the first surface can better press against the second surface, thereby improving the stability of the electrical connection between the conductive portion and the pins through the first surface and the second surface.

[0019] In some embodiments, the circuit board further includes a covering portion at least provided on one side of the conductive portion, the electronic device is provided on any covering portion and the pins pass through the covering portion and are electrically connected to the conductive portion, and the limiting member passes through the other covering portion and is welded to the conductive portion.

[0020] The technical solution of this embodiment enables the circuit board to also include a covering portion to protect the conductive portion through the covering portion, thereby reducing the negative impact of the external environment on the conductive portion; at the same time, the covering portion can also provide a fixed basis for the electronic device, reducing the difficulty of laying out the electronic device.

[0021] In some embodiments, the covering portion includes an insulating layer and a reinforcing layer, the insulating layer is disposed on the conductive portion, and the reinforcing layer is disposed on a side of the insulating layer away from the conductive portion.

[0022] The technical solution of this embodiment makes the covering part include a reinforcement layer and an insulating layer, wherein the insulating layer can be used to reduce the negative impact of the external environment on the electrical signal transmitted by the conductive part, and can also reduce the negative impact of the electrical signal transmitted by the conductive part on the outside world; the reinforcement layer is used to provide support and protection for the conductive part, and can also better provide a fixed foundation for the electronic device.

[0023] In some embodiments, a through hole is formed on the covering portion to expose the conductive portion, and the through hole is used to accommodate a stopper or a pin.

[0024] The technical solution of this embodiment is to set a through hole on the covering part, and enable the conductive part to be exposed to the outside through the through hole, so that the pin or the limiter can pass through the through hole and connect with the conductive part; at the same time, the side wall of the through hole can also protect the connection between the pin and the conductive part, and the connection between the limiter and the conductive part.

[0025] In some embodiments, the electronic device further includes a housing, wherein the housing is disposed on the cover.

[0026] The technical solution of this embodiment provides a specific structure for connecting some electronic devices to the circuit board, so that the shell is connected to the covering part, so that the electronic devices can be connected to the circuit board, while reducing the negative impact on the conductivity and signal transmission capabilities of the circuit board.

[0027] In some embodiments, a slot is formed on the cover portion, and at least a portion of the housing is interference-fitted into the slot.

[0028] The technical solution of this embodiment provides a specific structure for connecting some electronic devices to the cover part, so that the shell is interference-fitted in the slot of the cover part, so as to facilitate the installation, disassembly, replacement and maintenance of the shell.

[0029] In some embodiments, the thickness of the conductive portion is less than or equal to 0.8 mm, and the thickness of the conductive portion is greater than or equal to 0.2 mm.

[0030] The technical solution of this embodiment makes the thickness of the conductive part less than or equal to 0.8 mm and greater than or equal to 0.2 mm. That is, at this time, the conductive part is a relatively thin metal foil or metal sheet, so that the conductive part has a certain deformability, so that the conductive part can be bent in a narrow environment, facilitating the layout of electronic devices and circuit boards.

[0031] In some embodiments, the circuit board is a flexible circuit board.

[0032] In the technical solution of this embodiment, making the circuit board a flexible circuit board enables the circuit board to have a deformation ability, so that the circuit structure can adapt to a relatively narrow space and can also reduce the space occupied by the circuit structure.

[0033] In a second aspect, some embodiments of the present application further provide a method for manufacturing a circuit structure, including:

[0034] The pin and the limiting member are respectively arranged on opposite sides of the conductive part of the circuit board, wherein the pin is electrically connected to the conductive part;

[0035] The limiting member is welded to the conductive part to form a fusion part, wherein the fusion part extends through the conductive part into the pin, and part of the conductive part and part of the pin are melted in the fusion part.

[0036] In the technical solution of this embodiment, the pin, the circuit board and the limiting member are connected together through the fusion part, reducing the negative impact of the contact area between the pin and the conductive part on the connection strength, increasing the contact area between the fusion part and the conductive part and the pin, and enhancing the connection strength between the conductive part and the pin; the setting of the limiting member can also play a role in supplementing the solution during the welding process to further increase the contact area between the fusion part and the conductive part and the pin, thereby further enhancing the connection strength between the conductive part and the pin.

[0037] In some embodiments, in the step of welding the limiting member to the conductive part to form a fusion part, the limiting member can press the conductive part against the pin so that the conductive part can be electrically connected to the pin.

[0038] In the technical solution of this embodiment, the conductive part is pressed against the pin, so that the contact surface between the conductive part and the pin can also conduct current, thereby further increasing the over-current area between the conductive part and the pin and enhancing the over-current ability between the conductive part and the pin.

[0039] In some embodiments, in the step of welding the limiting member to the conductive part to form a fusion part, the limiting member is welded to the conductive part by a stirring welding process to form a fusion part.

[0040] In the technical solution of this embodiment, the fusion portion is formed by a stirring welding process, so that the process of forming the fusion portion has a lower negative impact on electronic devices, circuit boards and other mechanisms, thereby better reducing the deformation of adjacent structures; at the same time, the strength of the fusion portion formed by the stirring welding process is closer to the strength of the limiter, the conductive portion or the pin, and is stronger and less likely to break, thereby further enhancing the connection strength between the conductive portion and the pin.

[0041] In some embodiments, the stopper is formed by a stirring welding process to form a welding hole that passes through the conductive portion and extends into the pin;

[0042] Along the direction from the stopper to the pin, the inner diameter of the welding hole gradually decreases.

[0043] In the technical solution of this embodiment, during the formation process of the fusion portion, there is a component force from the limiting piece pointing in the direction of the pin, which can better press the conductive part to the pin, so that the conductive part can be better pressed to the pin, thereby improving the stability of the conductive part being electrically connected to the pin.

[0044] In some embodiments, before the step of respectively arranging the pins and the stopper on opposite sides of the conductive portion of the circuit board, the circuit structure manufacturing method further includes:

[0045] Covering portions are provided on both sides of the conductive portion.

[0046] In the technical solution of this embodiment, covering parts are arranged on both sides of the conductive part to protect the conductive part through the covering parts, thereby reducing the negative impact of the external environment on the conductive part; at the same time, the covering parts can also provide a fixed foundation for the electronic device, reducing the difficulty of laying out the electronic device.

[0047] In some embodiments, in the step of providing the covering portions on both sides of the conductive portion, the insulating layer is provided on the conductive portion, and the reinforcing layer is provided on a side of the insulating layer away from the conductive portion.

[0048] The technical solution of this embodiment makes the covering part include a reinforcement layer and an insulating layer, wherein the insulating layer can be used to reduce the negative impact of the external environment on the electrical signal transmitted by the conductive part, and can also reduce the negative impact of the electrical signal transmitted by the conductive part on the outside world; the reinforcement layer is used to provide support and protection for the conductive part, and can also better provide a fixed foundation for the electronic device.

[0049] In a third aspect, some embodiments of the present application further provide a battery, comprising the circuit structure provided by some embodiments of the first aspect, or a circuit structure manufactured by the circuit structure manufacturing method provided by some embodiments of the second aspect.

[0050] In a fourth aspect, some embodiments of the present application further provide an electrical device, comprising the battery provided by some embodiments of the third aspect.

[0051] The above description is only an overview of the technical solution of the present application. In order to better understand the technical means of the present application, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specific embodiments of the present application are given. Description of the Drawings

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0053] Figure 1 Structural schematic diagram of an electrical device provided by some embodiments of the present application.

[0054] Figure 2 Explosion structural schematic diagram of a battery provided by some embodiments of the present application.

[0055] Figure 3 Explosion structural schematic diagram of a battery cell provided by some embodiments of the present application.

[0056] Figure 4 Three-dimensional schematic diagram of a circuit structure provided by some embodiments of the present application.

[0057] Figure 5 Front view schematic diagram of a circuit structure provided by some embodiments of the present application.

[0058] Figure 6 Top view schematic diagram of a circuit structure provided by some embodiments of the present application.

[0059] Figure 7 Bottom view schematic diagram of a circuit structure provided by some embodiments of the present application.

[0060] Figure 8 Side view schematic diagram of a circuit structure provided by some embodiments of the present application.

[0061] Figure 9 For Figure 8 Cross-sectional schematic diagram at A-A in

[0062] Figure 10 For Figure 9 Local enlarged schematic diagram at B in

[0063] Figure 11 Flow schematic diagram of a method for manufacturing a circuit structure provided by some embodiments of the present application.

[0064] The meanings of the markings in the figure are as follows:

[0065] 100, electrical device;

[0066] 10, motor;

[0067] 20, controller;

[0068] 200, battery;

[0069] 30, housing; 31, first part; 32, second part;

[0070] 300, battery cell;

[0071] 31, end cap; 32, housing; 33, electrode assembly;

[0072] 400, circuit structure;

[0073] 40, electronic device; 41, pin; 411, second surface; 42, housing;

[0074] 50, circuit board; 51, conductive part; 511, first surface; 52, covering part; 521, insulating layer; 522, reinforcing layer; 523, through hole; 524, card slot;

[0075] 60, limiting part;

[0076] 70, fusion part; 71, welding hole. Detailed implementation manners

[0077] Hereinafter, embodiments of the technical solutions of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solutions of the present application more clearly, and thus are only examples and should not be used to limit the protection scope of the present application.

[0078] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0079] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, "a plurality of" means more than two unless otherwise specifically defined.

[0080] References to "embodiments" in this specification mean that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0081] In the description of the embodiments of the present application, the term "and / or" is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the associated objects before and after.

[0082] In the description of the embodiments of the present application, the term "plural" refers to two or more (including two). Similarly, "multiple groups" refers to two or more groups (including two groups), and "multiple pieces" refers to two or more pieces (including two pieces).

[0083] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the embodiments of the present application.

[0084] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0085] Currently, from the perspective of the development of the market situation, the application of power batteries is becoming more and more extensive. Power batteries are not only used in energy storage power systems such as hydraulic, thermal, wind, and solar power stations, but also widely used in electric transportation such as electric bicycles, electric motorcycles, and electric vehicles, as well as in multiple fields such as military equipment and aerospace. With the continuous expansion of the application fields of power batteries, the market demand for them is also constantly increasing.

[0086] In the battery, various parameters of the battery, such as the internal temperature and voltage of the battery, are transmitted to the control module of the battery through the circuit structure, so that the control module can perform corresponding actions according to the various parameters and preset programs.

[0087] The circuit structure includes an electronic device and a flexible circuit cable connected to the electronic device, wherein the electronic device is mainly used to connect with the control module, and the flexible circuit cable is mainly used to connect with various electrical components in the battery.

[0088] At present, electronic devices and flexible circuit cables are usually connected by soldering or other welding methods, for example, soldering the pins of the electronic devices to the conductive metal of the flexible circuit cable. The pins of the electronic devices usually include Z-shaped pins or L-shaped pins, wherein the end of the Z-shaped pin can fit on the conductive metal, and a weld mark is formed between the end of the Z-shaped pin and the conductive metal to achieve fixation; while the end of the L-shaped pin needs to be inserted into the conductive metal, that is, a socket is provided on the conductive metal, and the end of the L-shaped pin can be inserted into the socket, and the weld mark is formed between the end of the L-shaped pin and the side wall of the socket.

[0089] For Z-shaped pins, although the bonding area between the Z-shaped pins and the conductive metal is larger than that of L-shaped pins, and the coverage area of ​​the weld marks can also be relatively large, the weld marks are formed on the surface of the conductive metal and are easily affected by the external environment; while for L-shaped pins, the contact area between the L-shaped pins and the conductive metal is only the side wall of the jack, and because the thickness of the conductive metal is usually small, the coverage area of ​​the weld marks is small. According to the above connection methods, whether it is a Z-shaped pin or an L-shaped pin, the connection strength between it and the flexible circuit cable is low.

[0090] In order to alleviate the problem of low strength at the connection between the electronic device and the flexible circuit cable, the embodiment of the present application provides a limit piece on the side of the circuit board away from the pin, and the limit piece is welded to the conductive part of the circuit board to form a fusion part, so that part of the limit piece, part of the conductive part and part of the pin are melted in the fusion part, and the fusion part can extend through the conductive part into the pin, so that the pin, the circuit board and the limit piece are connected together through the fusion part.

[0091] In such a circuit structure, part of the limiting member, part of the conductive portion, and part of the pin are all melted and fused into the fusion portion, which can form a fusion portion with higher strength and can also increase the contact area between the fusion portion and the conductive portion and the pin, thereby enhancing the connection strength between the conductive portion and the pin. At the same time, the setting of the limiting member can also play a role in supplementing the solution during the welding process to further increase the contact area between the fusion portion and the conductive portion and the pin, thereby further enhancing the connection strength between the conductive portion and the pin, reducing the occurrence of connection failure between the electronic device and the flexible circuit cable, and improving the stability of the circuit structure.

[0092] The circuit structure provided in this embodiment can be used in a battery or applied to other devices such as other computers and electric toys. The battery can be an electrical device using the battery as a power source or various energy storage systems using the battery as an energy storage element. The electrical device can be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, an electric toy, an electric tool, a battery car, an electric vehicle, a ship, a spacecraft, etc. Among them, the electric toy can include fixed or mobile electric toys, such as game consoles, electric vehicle toys, electric ship toys, and electric aircraft toys, etc., and the spacecraft can include airplanes, rockets, space shuttles, and spaceships, etc.

[0093] For the convenience of description in the following embodiments, an electrical device 100 in an embodiment of the present application is taken as a vehicle, and the circuit structure 400 is applied to the battery 200 as an example for description.

[0094] Reference Figure 1 , Figure 1 is a schematic structural diagram of a vehicle provided in some embodiments of the present application. The vehicle can be a fuel vehicle, a gas vehicle, or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid vehicle, or an extended-range vehicle, etc. A battery 200 is provided inside the vehicle, and the battery 200 can be arranged at the bottom, head, or tail of the vehicle. The battery 200 can be used for power supply of the vehicle. For example, the battery 200 can be used as the operating power source of the vehicle. The vehicle can also include a controller 20 and a motor 10. The controller 20 is used to control the battery 200 to supply power to the motor 10. For example, it is used for the working power requirements during the start, navigation, and driving of the vehicle.

[0095] In some embodiments of the present application, the battery 200 can not only be used as the operating power source of the vehicle but also as the driving power source of the vehicle, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle.

[0096] Reference Figure 2 , Figure 2Explosion diagram of the battery 200 provided by some embodiments of the present application. The battery 200 includes a box body 30 and battery cells 300, and the battery cells 300 are accommodated in the box body 30. Among them, the box body 30 is used to provide an accommodation space for the battery cells 300, and the box body 30 can adopt various structures. In some embodiments, the box body 30 may include a first part 31 and a second part 32, the first part 31 and the second part 32 cover each other, and the first part 31 and the second part 32 jointly define an accommodation space for accommodating the battery cells 300. The second part 32 may be a hollow structure with one end open, and the first part 31 may be a plate-like structure. The first part 31 covers the open side of the second part 32 so that the first part 31 and the second part 32 jointly define an accommodation space; the first part 31 and the second part 32 may also both be hollow structures with one side open, and the open side of the first part 31 covers the open side of the second part 32. Of course, the box body 30 formed by the first part 31 and the second part 32 may be in various shapes, such as a cylinder, a cuboid, etc.

[0097] In the battery 200, there may be multiple battery cells 300, and the multiple battery cells 300 may be connected in series, parallel or in a hybrid connection. A hybrid connection means that there are both series and parallel connections among the multiple battery cells 300. The multiple battery cells 300 may be directly connected in series, parallel or in a hybrid connection together, and then the whole formed by the multiple battery cells 300 is accommodated in the box body 30; of course, the battery 200 may also be in the form of multiple battery cells 300 first connected in series, parallel or in a hybrid connection to form a battery 200 module, and then multiple battery 200 modules are connected in series, parallel or in a hybrid connection to form a whole and are accommodated in the box body 30. The battery 200 may further include other structures. For example, the battery 200 may further include a busbar component for realizing electrical connection among the multiple battery cells 300.

[0098] Among them, each battery cell 300 may be a secondary battery or a primary battery; it may also be a lithium-sulfur battery, a sodium-ion battery or a magnesium-ion battery, but is not limited thereto. The battery cell 300 may be in the shape of a cylinder, a flat body, a cuboid or other shapes.

[0099] Reference Figure 3 , Figure 3 Schematic exploded view of the battery cell 300 provided by some embodiments of the present application. The battery cell 300 refers to the smallest unit that makes up the battery 200. As shown in the figure, the battery cell 300 includes an end cap 31, a housing 32, an electrode assembly 33 and other functional components.

[0100] The end cap 31 refers to a component that covers the opening of the housing 32 to isolate the internal environment of the battery cell 300 from the external environment. Without limitation, the shape of the end cap 31 can be adapted to the shape of the housing 32 to fit the housing 32. Optionally, the end cap 31 can be made of a material with a certain hardness and strength (such as aluminum alloy). In this way, the end cap 31 is not easily deformed when subjected to extrusion and collision, enabling the battery cell 300 to have higher structural strength and improved safety performance. Functional components such as electrode terminals can be provided on the end cap 31. The electrode terminals can be used for electrical connection with the electrode assembly 33 to output or input the electrical energy of the battery cell 300. In some embodiments, a pressure relief mechanism for releasing the internal pressure when the internal pressure or temperature of the battery cell 300 reaches a threshold can also be provided on the end cap 31. The material of the end cap 31 can also be various, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and the embodiments of the present application do not make special restrictions on this. In some embodiments, an insulating member can also be provided on the inner side of the end cap 31. The insulating member can be used to isolate the electrical connection components in the housing 32 from the end cap 31 to reduce the risk of short circuit. Exemplarily, the insulating member can be plastic, rubber, etc.

[0101] The housing 32 is a component used to cooperate with the end cap 31 to form the internal environment of the battery cell 300, wherein the formed internal environment can be used to accommodate the electrode assembly 33, the electrolyte, and other components. The housing 32 and the end cap 31 can be independent components. An opening can be provided on the housing 32, and the end cap 31 is covered at the opening to form the internal environment of the battery cell 300. Without limitation, the end cap 31 and the housing 32 can also be integrated. Specifically, the end cap 31 and the housing 32 can first form a common connection surface before other components are put into the housing, and when it is necessary to encapsulate the inside of the housing 32, the end cap 31 is then covered on the housing 32. The housing 32 can be of various shapes and sizes, such as cuboid, cylindrical, hexagonal prism, etc. Specifically, the shape of the housing 32 can be determined according to the specific shape and size of the electrode assembly 33. The material of the housing 32 can be various, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and the embodiments of the present application do not make special restrictions on this.

[0102] The electrode assembly 33 is a component in the battery cell 300 where electrochemical reactions occur. One or more electrode assemblies 33 may be included in the housing 32. The electrode assembly 33 is mainly formed by winding or stacking positive and negative electrode sheets, and a separator is usually provided between the positive and negative electrode sheets. The parts of the positive and negative electrode sheets with active materials constitute the main body of the electrode assembly 33, and the parts of the positive and negative electrode sheets without active materials each constitute a tab. The positive tab and the negative tab may be located together at one end of the main body or at both ends of the main body, respectively. During the charge and discharge process of the battery 200, the positive active material and the negative active material react with the electrolyte, and the tabs connect the electrode terminals to form a current loop.

[0103] In a first aspect, some embodiments of the present application provide a circuit structure 400, referring to Figures 4 to 7 ,in, Figure 4 is a three-dimensional schematic diagram of a circuit structure 400 provided in some embodiments of the present application, Figure 5 A schematic diagram of a circuit structure 400 provided in some embodiments of the present application is shown in FIG. Figure 6 A schematic top view of a circuit structure 400 provided in some embodiments of the present application is shown in FIG. Figure 7 A bottom view of a circuit structure 400 provided in some embodiments of the present application.

[0104] In some embodiments of the present application, the circuit structure 400 includes an electronic device 40, a circuit board 50 and a limit member 60, wherein the circuit board 50 includes a conductive portion 51; the electronic device 40 is disposed on the circuit board 50, a pin 41 is disposed on the electronic device 40, and the pin 41 is electrically connected to the conductive portion 51; the limit member 60 is welded to an end of the conductive portion 51 away from the pin 41 and forms a fusion portion 70, and the fusion portion 70 extends from the limit member 60 through the circuit board 50 to the pin 41; the fusion portion 70 includes a portion of the limit member 60, a portion of the conductive portion 51 and a portion of the pin 41.

[0105] The circuit board 50 refers to a structure in the circuit structure 400 for transmitting electrical signals. The electronic device 40 exchanges electrical signals with the circuit board 50 through the pins 41. The circuit board 50 can be a printed circuit board 50 (Printed Circuit Board, PCB), a flexible printed circuit (Flexible Printed Circuit, FPC) or other circuit boards 50, among which the FPC has the characteristics of good bending performance and is suitable for use in the narrow environment inside the battery cell 300.

[0106] The conductive part 51 refers to the structure in the circuit board 50 that mainly transmits electrical signals. The shape of the conductive part 51 can be sheet-shaped, column-shaped or other shapes; the material of the conductive part 51 should include conductive materials, such as metal, conductive polymer or other materials.

[0107] The electronic device 40 is a structure in the circuit structure 400 for connecting to the control module of the battery 200. The electronic device 40 is the main structure of the circuit structure 400, and various electrical structures are accommodated inside it. The electronic device 40 can be a connector, an integrated chip, or other devices; the shape of the electronic device 40 can be a cuboid, a cylinder, or other regular shapes, and the electronic device 40 can also be various irregular shapes; the material of the electronic device 40 can include plastic, metal, or other materials.

[0108] The pin 41 refers to the conductive structure provided on the electronic device 40. The pin 41 is used to enable the electronic device 40 and its internal structures to be electrically connected to the circuit board 50 or other structures. One end of the pin 41 can extend outside the electronic device 40 to facilitate connection to the circuit board 50 or other structures; the material of the pin 41 should include conductive materials, such as metal, conductive polymer, or other materials; the shape of the pin 41 can be cylindrical, prismatic, or other shapes; it can be understood that the pin 41 can be a Z-shaped pin, an L-shaped pin, or other shaped pins.

[0109] The limiting member 60 refers to a structure in the circuit structure 400 for enhancing the connection strength between the pin 41 and the conductive portion 51. The shape of the limiting member 60 can be block-shaped, column-shaped, or other shapes.

[0110] The pin 41 is connected to the conductive portion 51 of the circuit board 50, and the limiting member 60 is provided on the side of the conductive portion 51 facing away from the pin 41. The limiting member 60 is welded to the conductive portion 51 and can form a fusion portion 70. The fusion portion 70 extends from the limiting member 60 through the conductive portion 51 into the pin 41, that is, the limiting member 60, the conductive portion 51, and the pin 41 are connected and fixed through the fusion portion 70; the fusion portion 70 can be formed by a hot melt welding process, a friction stir welding process, or other welding processes.

[0111] The pin 41 can be electrically connected to the conductive portion 51 in various ways; for example, the pin 41 can be electrically connected to the conductive portion 51 through the fusion portion 70; for another example, the pin 41 can also directly touch the conductive portion 51 to achieve electrical connection conduction; for still another example, a cable or other conductive structure can be provided between the pin 41 and the conductive portion 51.

[0112] During the welding process of the limiting member 60, part of the limiting member 60, part of the conductive portion 51, and part of the pin 41 will melt into the fusion portion 70, so that after the fusion portion 70 is formed, it can include part of the limiting member 60, part of the conductive portion 51, and part of the pin 41, that is, the fusion portion 70 mixes part of the limiting member 60, part of the conductive portion 51, and part of the pin 41. The strength of the fusion portion 70 can approach the material strength of the limiting member 60, the conductive portion 51, and the pin 41, thereby being able to play a role in enhancing the connection strength.

[0113] Since the fusion part 70 can extend into the pin 41, during the formation of the welded joint of the fusion part 70, the length of the fusion part 70 in the pin 41 can be extended by controlling the welding depth, so as to increase the contact area between the fusion part 70 and the pin 41, thereby further enhancing the connection strength.

[0114] Moreover, since the fusion part 70 is formed inside the limiting member 60, the conductive part 51 and the pin 41, the influence of the outside world on the fusion part 70 will be reduced, thereby further enhancing the connection strength and enhancing the stability of the connection.

[0115] Since the pin 41 is usually connected to the conductive part 51 by soldering, that is, the material of the solder joint between the pin 41 and the conductive part 51 is tin, and the melting point of tin is relatively low (the melting point of tin is about 215°C - 260°C), and when the ambient temperature reaches one-third of the melting point of the solder joint material, the solder joint will creep and transform into a liquid state, and the strength of the solder joint will be reduced at this time. In this embodiment, the fusion part 70 mixes part of the limiting member 60, part of the conductive part 51 and part of the pin 41, and the melting point of the fusion part 70 can also approach the melting points of the limiting member 60, the conductive part 51 and the pin 41. The fusion part 70 is less likely to creep and other situations during the use of the circuit structure 400, thereby further enhancing the connection strength.

[0116] In the technical solution of this embodiment, a limiting member 60 is provided on the side of the circuit board 50 facing away from the pin 41, the limiting member 60 is welded to the conductive part 51 of the circuit board 50 to form a fusion part 70, so that part of the fusion part 70, part of the conductive part 51 and part of the pin 41 are melted and fused into the fusion part 70, and the fusion part 70 can pass through the conductive part 51 and extend into the pin 41. The pin 41, the circuit board 50 and the limiting member 60 are connected together through the fusion part 70, reducing the negative impact of the contact area between the pin 41 and the conductive part 51 on the connection strength, increasing the contact area between the fusion part 70 and the conductive part 51 and the pin 41, and enhancing the connection strength between the conductive part 51 and the pin 41; the setting of the limiting member 60 can also play a role in supplementing the solution during the welding process to further increase the contact area between the fusion part 70 and the conductive part 51 and the pin 41, thereby further enhancing the connection strength between the conductive part 51 and the pin 41.

[0117] According to some embodiments of the present application, refer to Figure 7 , Figure 9 , Figure 10 , wherein, Figure 8 is a side view schematic diagram of the circuit structure 400 provided by some embodiments of the present application, Figure 9 is Figure 8 the cross-sectional view at A-A in Figure 10 is Figure 9Partial enlarged schematic diagram at B in the [original language].

[0118] In some embodiments of the present application, the conductive part 51 is electrically connected to the pin 41 through the fusion part 70.

[0119] The fusion part 70 can conduct the conductive part 51 and the pin 41, that is, the fusion part 70 has the ability to conduct electricity.

[0120] Since the fusion part 70 includes a part of the limiting part 60, a part of the conductive part 51, and a part of the pin 41, and the conductive part 51 and the pin 41 are made of conductive materials, the material of the limiting part 60 can include conductive materials or not; in some embodiments, to reduce the negative impact of the conductive part 51 on current transmission, the limiting part 60 is made of conductive materials, such as copper, etc.

[0121] Since the fusion part 70 can pass through the conductive part 51 and extend into the pin 41, and there is a large contact area between the fusion part 70 and the pin 41, that is, there is a large over-current area between the fusion part 70 and the pin 41. Conducting the conductive part 51 and the pin 41 through the fusion part 70 can enhance the over-current capacity between the conductive part 51 and the pin 41, thereby reducing the loss of current transmission between the conductive part 51 and the pin 41.

[0122] Also, since the fusion part 70 is within the limiting part 60, the conductive part 51, and the pin 41, transmitting current through the fusion part 70 can also reduce the influence of the external environment on current transmission.

[0123] In this embodiment, the conductive part 51 is conducted with the pin 41 through the fusion part 70, and the contact area between the fusion part 70 and the conductive part 51 and the pin 41 is large, so that the over-current area between the conductive part 51 and the pin 41 is also large, thereby enhancing the over-current capacity between the conductive part 51 and the pin 41.

[0124] Reference Figure 10 , in some embodiments, the conductive part 51 includes a first surface 511 facing the pin 41, and the pin 41 includes a second surface 411 facing the conductive part 51; the conductive part 51 is pressed by the limiting part 60 against the pin 41 so that the first surface 511 touches and is electrically connected to the second surface 411.

[0125] The first surface 511 refers to the surface of the conductive part 51 facing the pin 41. The first surface 511 can be an arc surface, a plane surface, or a surface of other shapes.

[0126] The second surface 411 refers to the surface of the pin 41 facing the conductive part 51; similar to the first surface 511, the second surface 411 can be an arc surface, a plane surface, or a surface of other shapes.

[0127] The limiting member 60 presses against the conductive portion 51 and presses the conductive portion 51 against the pin 41, that is, the limiting member 60 can press the conductive portion 51 onto the pin 41 to sandwich the conductive portion 51 between the pin 41 and the limiting member 60, so that the first surface 511 can be in contact with the second surface 411; since the fusing portion 70 can fix the limiting member 60, the conductive portion 51 and the pin 41, after the limiting member 60 presses the conductive portion 51 against the pin 41, the fusing portion 70 can also improve the stability of the contact between the first surface 511 and the second surface 411, so that the first surface 511 is not easily separated from the second surface 411.

[0128] Moreover, since both the conductive portion 51 and the pin 41 have electrical conductivity, when the first surface 511 is in contact with the second surface 411, the current in the conductive portion 51 can be transmitted to the pin 41 through the first surface 511 and the second surface 411; since the fusing portion 70 can prevent the first surface 511 from separating from the second surface 411, a relatively stable current transmission structure can be formed at the first surface 511 and the second surface 411.

[0129] Since the functions of the first surface 511 and the second surface 411 are to transmit current, the first surface 511 and the second surface 411 are preferably set as planes to increase the contact area between the first surface 511 and the second surface 411, thereby increasing the current-carrying area between the conductive portion 51 and the pin 41.

[0130] On this basis, if the conductive portion 51 is also electrically connected to the pin 41 through the fusing portion 70, the conduction structures of the fusing portion 70, the first surface 511 and the second surface 411 can form two parallel circuits, thereby further reducing the loss of current transmission between the conductive portion 51 and the pin 41.

[0131] In this embodiment, the limiting member 60 presses the conductive portion 51 onto the pin 41. Since the fusing portion 70 passes through the circuit board 50 from the limiting member 60 and extends into the pin 41, that is, the fusing portion 70 fixes the positions of the limiting member 60, the circuit board 50 and the pin 41, the conductive portion 51 can be stably pressed onto the pin 41, and the first surface 511 can be stably pressed against the second surface 411, enabling the conductive portion 51 to be electrically connected to the pin 41 through the mutually contacting first surface 511 and second surface 411, thereby further increasing the current-carrying area between the conductive portion 51 and the pin 41 and enhancing the current-carrying capacity between the conductive portion 51 and the pin 41.

[0132] According to some embodiments of the present application, refer to Figure 7 、 Figure 9 、 Figure 10 ,wherein, Figure 8 is a side view schematic diagram of the circuit structure 400 provided by some embodiments of the present application, Figure 9 is Figure 8Cross-sectional schematic view at A-A in [the figure], Figure 10 is Figure 9 partial enlarged schematic view at B in [the figure].

[0133] Figure 10 The direction where the Z-axis is located in [the figure] is the thickness direction of the circuit board 50, and is also the arrangement direction of the limiting member 60, the circuit board 50 and the pin 41.

[0134] In some embodiments of the present application, a welding hole 71 is formed in the fusion part 70. The welding hole 71 passes through the limiting member 60, the circuit board 50 and extends into the pin 41; along the direction from the limiting member 60 to the pin 41, the inner diameter of the welding hole 71 gradually decreases.

[0135] The welding hole 71 refers to a hole structure formed in the fusion part 70. The welding hole 71 is surrounded by the fusion part 70, that is, the side wall of the welding hole 71 is the fusion part 70; the welding hole 71 can be a through hole, that is, the welding hole 71 passes through the limiting member 60, the conductive part 51 and the pin 41. For example, when the pin 41 is a Z-shaped pin, the thickness of the part of the pin 41 opposite to the welding hole 71 in the thickness direction (Z) of the circuit board 50 is smaller. At this time, the welding hole 71 can pass through the pin 41; the welding hole 71 can also be a blind hole, that is, the welding hole 71 passes through the limiting member 60 and the conductive part 51 and extends into the pin 41. For example, referring to Figure 10 , when the pin 41 is an L-shaped pin, the thickness of the part of the pin 41 opposite to the welding hole 71 in the thickness direction (Z) of the circuit board 50 is larger. At this time, the welding hole 71 can extend into the pin 41.

[0136] Since the inner diameter of the welding hole 71 gradually decreases along the direction from the limiting member 60 to the pin 41, the welding hole 71 can be a frustum-shaped hole, a conical hole, a stepped hole or a hole of other shapes.

[0137] The welding hole 71 can be formed on the fusion part 70 by a drill bit or other tools, or the welding hole 71 can be formed by laser or other means; since the inner diameter of the welding hole 71 gradually decreases along the direction from the limiting member 60 to the pin 41, this setting enables a component force pointing from the limiting member 60 to the pin 41 to exist during the formation of the welding hole 71. This component force can better press the conductive part 51 against the pin 41, so that the first surface 511 can better press against the second surface 411, thereby improving the stability of the electrical connection between the conductive part 51 and the pin 41 through the first surface 511 and the second surface 411.

[0138] In this embodiment, the inner diameter of the welding hole 71 gradually decreases from the limiting member 60 towards the pin 41. This can result in a component force in the direction from the limiting member 60 towards the pin 41 during the formation of the welding hole 71. This component force can better press the conductive part 51 against the pin 41, enabling the first surface 511 to better press against the second surface 411, thereby improving the stability of the electrical connection between the conductive part 51 and the pin 41 via the first surface 511 and the second surface 411.

[0139] In some embodiments, the fusion part 70 is formed by a friction stir welding process, and the welding hole 71 is formed by rotating and stirring a welding tool; since the inner diameter of the welding hole 71 gradually decreases along the direction from the limiting member 60 towards the pin 41, the welding hole 71 can be a frustum-shaped hole, a conical hole, a stepped hole, or a hole of other shapes.

[0140] Corresponding to the welding hole 71, the shape of the welding head of the welding tool required for the friction stir welding process can be frustum-shaped, prism-shaped, stepped, or of other shapes; at this time, during the formation of the fusion part 70, the welding head of the welding tool will form a component force pointing towards the conductive part 51 during the friction stir welding process. This component force can press the conductive part 51 against the pin 41 and increase the force between the first surface 511 and the second surface 411, enabling the first surface 511 to more stably contact the second surface 411 and not easily separate.

[0141] In this embodiment, since the fusion part 70 is formed by a friction stir welding process and the inner diameter of the welding hole 71 surrounded by the fusion part 70 gradually decreases from the limiting member 60 towards the pin 41, a component force in the direction from the limiting member 60 towards the pin 41 can exist during the formation of the fusion part 70. This component force can better press the conductive part 51 against the pin 41, enabling the first surface 511 to better press against the second surface 411, thereby improving the stability of the electrical connection between the conductive part 51 and the pin 41 via the first surface 511 and the second surface 411.

[0142] According to some embodiments of the present application, refer to Figure 5 、 Figures 8 to 10 ,wherein, Figure 5 is the front view schematic diagram of the circuit structure 400 provided by some embodiments of the present application, Figure 8 is the side view schematic diagram of the circuit structure 400 provided by some embodiments of the present application, Figure 9 is Figure 8 the cross-sectional view at A - A in Figure 10 is Figure 9 the partial enlarged view at B in

[0143] In some embodiments of the present application, the circuit board 50 also includes a covering portion 52 disposed on at least one side of the conductive portion 51, the electronic device 40 is disposed on any covering portion 52 and the pin 41 passes through the covering portion 52 and is electrically connected to the conductive portion 51, and the limit member 60 passes through the other covering portion 52 and is welded to the conductive portion 51.

[0144] The covering part 52 refers to a structure in the circuit board 50 that protects the conductive part 51. The covering part 52 may include a variety of different structures, or may include only one structure. For example, the covering part 52 may include other structures such as an insulating structure and a supporting structure; the material of the covering part 52 may include plastic, metal or other materials; the shape of the covering part 52 may be sheet-shaped, block-shaped or other shapes.

[0145] The covering portion 52 may be disposed only on one side of the conductive portion 51, in which case the covering portion 52 is mainly used to protect one side of the conductive portion 51; the covering portion 52 may also be disposed on two opposite sides or other sides of the conductive portion 51, for example, the covering portion 52 may completely wrap the conductive portion 51 to better protect the conductive portion 51; the covering portion 52 may be connected to the conductive portion 51 by gluing, or may cover the conductive portion 51 by other means. In some embodiments, the covering portion 52 is disposed on two opposite sides of the conductive portion 51.

[0146] In this embodiment, the circuit board 50 also includes a covering portion 52 to protect the conductive portion 51 through the covering portion 52, thereby reducing the negative impact of the external environment on the conductive portion 51; at the same time, the covering portion 52 can also provide a fixed base for the electronic device 40, reducing the difficulty of arranging the electronic device 40.

[0147] refer to Figure 9 , Figure 10 In some embodiments, the covering portion 52 includes an insulating layer 521 and a reinforcing layer 522 , wherein the insulating layer 521 is disposed on the conductive portion 51 , and the reinforcing layer 522 is disposed on a side of the insulating layer 521 away from the conductive portion 51 .

[0148] The insulating layer 521 refers to a structure that is arranged outside the conductive part 51 and mainly plays an insulating role. The insulating layer 521 is arranged on the conductive part 51. The insulating layer 521 can be arranged on one side of the insulating layer 521 by gluing, or can be arranged on the conductive part 51 by surrounding and wrapping. The insulating layer 521 can also be arranged on the conductive part 51 by other methods. The material of the insulating layer 521 can include rubber, plastic, ceramic or other insulating materials.

[0149] The reinforcing layer 522 refers to a structure provided outside the conductive part 51 mainly for protection. The reinforcing layer 522 is disposed on the side of the insulating layer 521 facing away from the conductive part 51. The reinforcing layer 522 can also play a role in protecting the insulating layer 521. At the same time, the reinforcing layer 522 can also provide a fixed foundation for the electronic device 40. The reinforcing layer 522 can be disposed on one side of the insulating layer 521 by means of adhesion, or can be disposed on the conductive part 51 by means of circumferential wrapping. The reinforcing layer 522 can also be disposed on the insulating layer 521 by other means. The material of the reinforcing layer 522 can be plastic, metal or other materials. The material of the reinforcing layer 522 can also include insulating materials, heat-resistant materials, corrosion-resistant materials, etc.

[0150] In this embodiment, the covering part 52 includes a reinforcing layer 522 and an insulating layer 521. The insulating layer 521 can be used to reduce the negative impact of the external environment on the transmission of electrical signals by the conductive part 51, and can also reduce the negative impact of the electrical signals transmitted by the conductive part 51 on the outside world. The reinforcing layer 522 is used to provide support and protection for the conductive part 51, and can also better provide a fixed foundation for the electronic device 40.

[0151] Reference Figure 9 、 Figure 10 , in some embodiments, a through hole 523 is provided on the covering part 52, and the conductive part 51 can be exposed to the outside through the through hole 523. The through hole 523 is used to accommodate the limiting member 60 or the pin 41.

[0152] The through hole 523 refers to a hole-shaped structure formed on the covering part 52. The through hole 523 can penetrate the covering part 52 and expose the conductive part 51 to the outside, and the through hole 523 is used to accommodate the limiting member 60 or the pin 41, that is, at least part of the limiting member 60 or at least part of the pin 41 can pass through the through hole 523 and be connected to the conductive part 51. The shape of the through hole 523 can be circular, square or other shapes. The shape of the through hole 523 can also be set according to the shapes of the pin 41 and the limiting member 60.

[0153] In this embodiment, a through hole 523 is provided on the covering part 52, and the conductive part 51 can be exposed to the outside through the through hole 523 so that the pin 41 or the limiting member 60 can pass through the through hole 523 and be connected to the conductive part 51. At the same time, the side wall of the through hole 523 can also play a role in protecting the connection between the pin 41 and the conductive part 51 and the connection between the limiting member 60 and the conductive part 51.

[0154] Reference Figure 9 , in some embodiments, the electronic device 40 further includes a housing 42, and the housing 42 is disposed on the covering part 52.

[0155] The housing 42 refers to a structure that provides a fixed base for the pins 41 and other structures. The pins 41 and other structures in the electronic device 40 can be connected to the housing 42 or accommodated within the housing 42. The shape of the housing 42 can be a cuboid, a cylinder, or other regular shapes, and the housing 42 can also be of various irregular shapes. The material of the housing 42 can be plastic, metal, or other materials.

[0156] The housing 42 is disposed on the covering portion 52. Specifically, the housing 42 can be disposed on the covering portion 52 by means of bolt connection, adhesive connection, snap connection, or other connection means. In some embodiments, when the covering portion 52 includes an insulating layer 521 and a reinforcing layer 522, the housing 42 is connected to the side of the reinforcing layer 522 facing the outside.

[0157] This embodiment provides specific structures for connecting some electronic devices to the circuit board, enabling the housing to be connected to the covering portion so that the electronic device can be connected to the circuit board while reducing the negative impact on the conductive ability and signal transmission ability of the circuit board.

[0158] Reference Figure 9 , in some embodiments, a card slot 524 is formed on the covering portion 52, and at least a part of the housing 42 is in interference fit within the card slot 524.

[0159] The card slot 524 refers to a groove-like structure formed on the covering portion 52 for accommodating at least a part of the housing 42. The card slot 524 can be a groove recessed in the covering portion 52, or can be formed by a structure protruding from the covering portion 52. The shape of the card slot 524 can be square, circular, or other shapes. In some embodiments, when the covering portion 52 includes an insulating layer 521 and a reinforcing layer 522, the card slot 524 is formed on the side of the reinforcing layer 522 facing the outside.

[0160] At least a part of the housing 42 is in interference fit within the card slot 524. The housing 42 can be only partially inserted into the card slot 524, or the entire housing 42 can be accommodated within the card slot 524. The housing 42 is in interference fit within the card slot 524, that is, the housing 42 inserted into the card slot 524 can abut against the side wall of the card slot 524 and be fixed within the card slot 524 by friction. In some embodiments, the shape of the card slot 524 should be the same as the shape of the side of the housing 42 facing the card slot 524.

[0161] This embodiment provides specific structures for connecting some electronic devices 40 to the covering portion 52, enabling the housing 42 to be in interference fit within the card slot 524 of the covering portion 52, facilitating the installation, disassembly, replacement, and repair of the housing 42.

[0162] Reference Figure 10, according to some embodiments of the present application, the thickness of the conductive part 51 is less than or equal to 0.8 millimeters (mm), and the thickness of the conductive part 51 is greater than or equal to 0.2 mm; specifically, the thickness of the conductive part 51 can be 0.25 mm, 0.30 mm, 0.35 mm, 0.40 mm, 0.45 mm, 0.50 mm, 0.55 mm, 0.60 mm, 0.65 mm, 0.70 mm, 0.75 mm, 0.80 mm or other values; for example, the thickness range of the conductive part 51 can be 0.37 mm ± 0.02 mm, for example, it can be 0.35 mm, 0.36 mm, 0.37 mm, 0.38 mm, 0.39 mm; for example, the thickness range of the conductive part 51 can also be 0.70 mm ± 0.02 mm, for example, it can be 0.68 mm, 0.69 mm, 0.70 mm, 0.71 mm, 0.72 mm.

[0163] The thickness of the conductive part 51 is Figure 10 the dimension of the conductive part 51 in the Z-axis direction in

[0164] The conductive part 51 is a thin metal foil or metal sheet. At this time, the circuit board 50 can be a flexible printed circuit (FPC). Because the thickness of the conductive part 51 is small, when soldering the conductive part 51 and the pin 41 by methods such as soldering, the solder mark formed by soldering is smaller and its strength is weaker; while using the fusion part 70 provided by the embodiments of the present application can strengthen the connection strength between the pin 41 and the conductive part 51.

[0165] Making the thickness of the conductive part 51 less than or equal to 0.8 mm and greater than or equal to 0.2 mm can not only make the conductive part 51 easy to bend and not easy to break in the flexible circuit board, but also easy for signal transmission, and at the same time can reduce costs.

[0166] In this embodiment, the thickness of the conductive part 51 is less than or equal to 0.8 mm and greater than or equal to 0.2 mm, that is, at this time the conductive part 51 is a thin metal foil or metal sheet, so that the conductive part 51 has a certain deformability, so that the conductive part 51 can bend in a narrow environment, facilitating the layout of the electronic device 40 and the circuit board 50.

[0167] According to some embodiments of the present application, the circuit board 50 is a flexible circuit board.

[0168] Compared with a printed circuit board or other rigid circuit boards, making the circuit board 50 a flexible circuit board enables the circuit board to be bent according to requirements to meet different needs; at the same time, it can make the space occupied by the circuit structure 400 smaller and be more suitable for narrow spaces.

[0169] In this embodiment, the circuit board 50 is a flexible circuit board, enabling the circuit board 50 to have the ability to deform, so that the circuit structure 400 can adapt to a relatively narrow space and also reduce the space occupied by the circuit structure 400.

[0170] Second, some embodiments of the present application also provide a manufacturing method for a circuit structure 400. Refer to Figure 11 , Figure 11 which is a schematic flow chart of the manufacturing method for the circuit structure 400 provided by some embodiments of the present application.

[0171] In some embodiments of the present application, the manufacturing method for the circuit structure 400 includes:

[0172] S820: Dispose the pin 41 and the limiting member 60 on opposite sides of the conductive portion 51 of the circuit board 50 respectively.

[0173] Among them, the pin 41 is electrically connected to the conductive portion 51.

[0174] Similar to the circuit structure 400 provided by some embodiments of the first aspect, in this step, the pin 41 refers to a conductive structure provided on the circuit structure 400. The pin 41 is used to enable the electronic device 40 and its internal structure to be electrically connected to the circuit board 50 or other structures. One end of the pin 41 can extend outside the electronic device 40 to facilitate connection to the circuit board 50 or other structures.

[0175] The conductive portion 51 refers to the structure in the circuit board 50 that mainly functions to transmit electrical signals. The shape of the conductive portion 51 can be sheet-shaped, columnar or other shapes; the material of the conductive portion 51 should include conductive materials, such as metals, conductive polymers or other materials.

[0176] The limiting member 60 refers to the structure in the circuit structure 400 that is used to enhance the connection strength between the pin 41 and the conductive portion 51. The shape of the limiting member 60 can be block-shaped, columnar or other shapes.

[0177] S830: Weld the limiting member 60 to the conductive portion 51 to form a fusion portion 70.

[0178] Among them, the fusion portion 70 extends through the conductive portion 51 into the pin 41, and part of the conductive portion 51 and part of the pin 41 are melted in the fusion portion 70.

[0179] Similar to the circuit structure 400 provided in some embodiments of the first aspect, in this step, the pin 41 is connected to the conductive part 51 of the circuit board 50, and the limit member 60 is arranged on the side of the conductive part 51 away from the pin 41, the limit member 60 is welded to the conductive part 51 and can form a fusion portion 70, the fusion portion 70 extends from the limit member 60 through the conductive part 51 to the pin 41, that is, the limit member 60, the conductive part 51 and the pin 41 are connected and fixed by the fusion portion 70; the fusion portion 70 can be formed by a hot melt welding process, or by a stirring welding process or other welding processes.

[0180] The pin 41 can be electrically connected to the conductive part 51 in a variety of ways; for example, the pin 41 can be electrically connected to the conductive part 51 through the fusion part 70; for another example, the pin 41 can also directly contact the conductive part 51 to achieve electrical connection; for another example, a cable or other conductive structure can be arranged between the pin 41 and the conductive part 51.

[0181] During the welding process of the limit member 60, part of the limit member 60, part of the conductive part 51 and part of the pin 41 will all melt in the fusion portion 70, so that after the fusion portion 70 is formed, it can include part of the limit member 60, part of the conductive part 51 and part of the pin 41, that is, part of the limit member 60, part of the conductive part 51 and part of the pin 41 are mixed in the fusion portion 70, and the strength of the fusion portion 70 can approach the material strength of the limit member 60, the conductive part 51 and the pin 41, thereby being able to enhance the connection strength.

[0182] Since the fusion portion 70 can extend into the pin 41, during the process of welding the fusion portion 70, the length of the fusion portion 70 in the pin 41 can be extended by controlling the welding depth to increase the contact area between the fusion portion 70 and the pin 41, thereby further enhancing the connection strength.

[0183] Furthermore, because the fusion portion 70 is formed inside the stopper 60 , the conductive portion 51 and the pin 41 , the fusion portion 70 is less susceptible to external influences, thereby further enhancing the connection strength and the stability of the connection.

[0184] In this embodiment, the pin 41, the circuit board 50 and the limit piece 60 are connected together by the fusion portion 70, which reduces the negative impact of the contact area between the pin 41 and the conductive portion 51 on the connection strength, increases the contact area between the fusion portion 70 and the conductive portion 51 and the pin 41, and enhances the connection strength between the conductive portion 51 and the pin 41; the setting of the limit piece 60 can also play a role in replenishing the solution during the welding process, so as to further increase the contact area between the fusion portion 70 and the conductive portion 51 and the pin 41, thereby further enhancing the connection strength between the conductive portion 51 and the pin 41.

[0185] refer to Figure 10, in some embodiments, the fusion part 70 can conduct the electrical connection between the conductive part 51 and the pin 41. Since the fusion part 70 can penetrate through the conductive part 51 and extend into the interior of the pin 41, and there is a large contact area between the fusion part 70 and the pin 41, that is, there is a large over-current area between the fusion part 70 and the pin 41. Conducting the electrical connection between the conductive part 51 and the pin 41 through the fusion part 70 can enhance the over-current capacity between the conductive part 51 and the pin 41, thereby reducing the loss of current transmission between the conductive part 51 and the pin 41.

[0186] Moreover, since the fusion part 70 is located within the limiting part 60, the conductive part 51, and the pin 41, transmitting current through the fusion part 70 can also reduce the influence of the external environment on current transmission.

[0187] According to some embodiments of the present application, in the step of welding the limiting part 60 to the conductive part 51 to form the fusion part 70, the limiting part 60 can press the conductive part 51 against the pin 41 so that the conductive part 51 can be electrically connected to the pin 41.

[0188] Similar to the circuit structure 400 provided in some embodiments of the first aspect, the limiting part 60 presses against the conductive part 51 and presses the conductive part 51 against the pin 41, which can make the surface of the conductive part 51 facing the pin 41 contact the surface of the pin 41 facing the conductive part 51; since the fusion part 70 can fix the limiting part 60, the conductive part 51, and the pin 41, after the limiting part 60 presses the conductive part 51 against the pin 41, the fusion part 70 can further improve the stability of the contact between the conductive part 51 and the pin 41, so that the conductive part 51 is not easily separated from the pin 41.

[0189] Since both the conductive part 51 and the pin 41 have electrical conductivity, when the conductive part 51 contacts the pin 41, the current in the conductive part 51 can be directly transmitted to the pin 41; and since the fusion part 70 can prevent the conductive part 51 from separating from the pin 41, a relatively stable current transmission structure can be formed at the contact part between the conductive part 51 and the pin 41.

[0190] It can be understood that the over-current capacity of the contact part between the conductive part 51 and the pin 41 is positively correlated with the contact area. Therefore, the surface of the conductive part 51 facing the pin 41 and the surface of the pin 41 facing the conductive part 51 can both be flat surfaces to increase the contact area of the contact part between the conductive part 51 and the pin 41, thereby increasing the over-current capacity of this contact part.

[0191] In this embodiment, the conductive part 51 is pressed against the pin 41, so that the contact surface between the conductive part 51 and the pin 41 can also transmit current, further increasing the over-current area between the conductive part 51 and the pin 41 and enhancing the over-current capacity between the conductive part 51 and the pin 41.

[0192] ReferenceFigure 10 , in some embodiments, in the step of welding the limiting member 60 to the conductive portion 51 to form the fusion portion 70, that is, in the step of S830, the limiting member 60 is welded to the conductive portion 51 by a friction stir welding process to form the fusion portion 70.

[0193] The friction stir welding process is a welding process that uses the heat generated by the friction between a high-speed rotating welding tool and the workpiece to locally plasticize the welded material. After the welded material is locally plasticized, it can also mix and extrude the plasticized welded material to form a dense solid-phase weld seam to connect the welded workpieces through this solid-phase weld seam. In this process, since the weld seam can be formed by locally plasticizing the welded material, the heat generated is relatively low, and sputtering of the welded material is not likely to occur.

[0194] In the circuit structure 400, since the circuit board 50 usually includes other non-metallic structures in addition to the conductive portion 51, and the electronic device 40 usually includes other non-metallic structures in addition to the pins 41, these non-metallic structures are prone to deformation in a high-temperature environment; forming the fusion portion 70 by the friction stir welding process can reduce the temperature during welding, thereby reducing the negative impact of the welding process on other structures in the circuit board 50 and the electronic device 40.

[0195] During the process of forming the fusion portion 70 by the friction stir welding process, part of the limiting member 60, part of the conductive portion 51, and part of the pins 41 are extruded and fused into the fusion portion 70 by the high-speed rotating welding tool, so that the strength of the fusion portion 70 can be closer to the strength of the limiting member 60, the conductive portion 51, and the pins 41, thereby increasing the strength of the fusion portion 70; at the same time, the melting point of the fusion portion 70 can also be closer to the melting points of the limiting member 60, the conductive portion 51, and the pins 41, increasing the melting point of the fusion portion 70, so that the fusion portion 70 is less likely to deform such as creep during use, increasing the stability of the fusion portion 70.

[0196] Since hot melt welding will cause a rapid increase in the surrounding temperature and form a high-temperature environment, and other structures of the circuit board 50 and other structures of the electronic device 40 are prone to deformation in the high-temperature environment formed by hot melt welding, resulting in poor stability of the circuit structure 400. Accordingly, in this embodiment, the fusion portion 70 is formed by the friction stir welding process, so that the negative impact of the formation process of the fusion portion 70 on mechanisms such as the electronic device 40 and the circuit board 50 is lower, thereby better reducing the deformation of adjacent structures; at the same time, the strength of the fusion portion 70 formed by the friction stir welding process is closer to the strength of the limiting member 60, the conductive portion 51, or the pins 41, with stronger strength and less prone to breakage, thereby further enhancing the connection strength between the conductive portion 51 and the pins 41.

[0197] Reference Figure 10, in some embodiments, the limiting member 60 is formed with a welding hole 71 passing through the conductive portion 51 and extending into the pin 41 by a friction stir welding process; along the direction of the limiting member 60 towards the pin 41, the inner diameter of the welding hole 71 gradually decreases.

[0198] Similar to the circuit structure 400 provided in some embodiments of the first aspect, since the inner diameter of the welding hole 71 gradually decreases along the direction of the limiting member 60 towards the pin 41, the distance between the outer wall of the welding head of the welding tool required for the friction stir welding process and its axis should also gradually decrease. At this time, during the formation of the fusion portion 70, during the friction stir welding process of the welding head of the welding tool, a component force pointing towards the conductive portion 51 will be formed, and this component force can press the conductive portion 51 against the pin 41 and can increase the force pressing the conductive portion 51 against the pin 41, so that the conductive portion 51 can be more stably in contact with the pin 41 and is not easily detached.

[0199] In this embodiment, during the formation of the fusion portion 70, there is a component force pointing from the limiting member 60 towards the pin 41 direction, and this component force can better press the conductive portion 51 against the pin 41, so that the conductive portion 51 can be better pressed against the pin 41, thereby improving the stability of the electrical connection between the conductive portion 51 and the pin 41.

[0200] According to some embodiments of the present application, with reference to Figure 10 , Figure 11 , wherein, Figure 10 is a partial cross-sectional view schematic diagram of the circuit structure 400, Figure 11 is a flowchart schematic diagram of the manufacturing method of the circuit structure 400 provided in some embodiments of the present application.

[0201] In some embodiments of the present application, before the step of respectively disposing the pin 41 and the limiting member 60 on opposite sides of the conductive portion 51 of the circuit board 50, that is, before the step of S820, the manufacturing method of the circuit structure 400 further includes:

[0202] S810: Dispose covering portions 52 on both sides of the conductive portion 51.

[0203] Similar to the circuit structure 400 provided in some embodiments of the first aspect, the covering portion 52 is used to protect the conductive portion 51, and the covering portion 52 is also used to provide a fixing basis for the circuit structure 400; the covering portion 52 can be disposed on opposite sides of the conductive portion 51, and on this basis, the covering portion 52 can also be disposed on other sides of the conductive portion 51. For example, the covering portion 52 can completely wrap the conductive portion 51 to play a role in protecting the conductive portion 51; the covering portion 52 and the conductive portion 51 can be connected by an adhesive method or by other methods.

[0204] In this embodiment, covering portions 52 are provided on both sides of the conductive portion 51 to protect the conductive portion 51 through the covering portions 52, thereby reducing the negative impact of the external environment on the conductive portion 51; at the same time, the covering portions 52 can also provide a fixing basis for the electronic device 40, reducing the laying difficulty of the electronic device 40.

[0205] Reference Figure 10 , in some embodiments, in the step of providing the covering portions 52 on both sides of the conductive portion 51, that is, in S810, an insulating layer 521 is provided on the conductive portion 51, and a reinforcing layer 522 is provided on the side of the insulating layer 521 facing away from the conductive portion 51.

[0206] Similar to the circuit structure 400 provided by some embodiments of the first aspect, the insulating layer 521 refers to a structure provided outside the conductive portion 51 mainly for insulation; the insulating layer 521 is provided on the conductive portion 51, and the insulating layer 521 can be provided on a certain side of the insulating layer 521 by an adhesive method, or can be provided on the conductive portion 51 by a surrounding and covering method, and the insulating layer 521 can also be provided on the conductive portion 51 by other methods; the material of the insulating layer 521 can include rubber, plastic, ceramic or other insulating materials.

[0207] The reinforcing layer 522 refers to a structure provided outside the conductive portion 51 mainly for protection. The reinforcing layer 522 is provided on the side of the insulating layer 521 facing away from the conductive portion 51. The reinforcing layer 522 can also play a role in protecting the insulating layer 521. At the same time, the reinforcing layer 522 can also provide a fixing basis for the electronic device 40; the reinforcing layer 522 can be provided on a certain side of the insulating layer 521 by an adhesive method, or can be provided on the conductive portion 51 by a surrounding and covering method, and the reinforcing layer 522 can also be provided on the insulating layer 521 by other methods; the material of the reinforcing layer 522 can be plastic, metal or other materials, and the material of the reinforcing layer 522 can also include insulating materials, heat-resistant materials, corrosion-resistant materials, etc.

[0208] This embodiment makes the covering portion 52 include the reinforcing layer 522 and the insulating layer 521. Among them, the insulating layer 521 can be used to reduce the negative impact of the external environment on the electrical signal transmission of the conductive portion 51, and can also reduce the negative impact of the electrical signal transmitted by the conductive portion 51 on the outside; the reinforcing layer 522 is used to provide support and protection for the conductive portion 51, and can also better provide a fixing basis for the electronic device 40.

[0209] In a third aspect, some embodiments of the present application further provide a battery 200, including the circuit structure 400 provided by some embodiments of the first aspect, or including the circuit structure 400 formed by the manufacturing method of the circuit structure 400 provided by some embodiments of the second aspect.

[0210] Reference Figure 2, the battery 200 includes a box body 30 and battery cells 300, and the battery cells 300 are accommodated in the box body 30. Among them, the box body 30 is used to provide an accommodation space for the battery cells 300, and the box body 30 can adopt various structures. For example, the box body 30 can be cylindrical, cuboid or other shapes.

[0211] In the battery 200, the battery cells 300 can be square shell battery cells 300 or cylindrical battery cells 300; there can be multiple battery cells 300, and the multiple battery cells 300 can be connected in series, parallel or in a mixed connection.

[0212] The circuit structure 400 is arranged in the box body 30. The circuit structure 400 can be arranged above each battery cell 300 or at other positions in the box body 30; the circuit structure 400 can be electrically connected to each battery cell 300, can also be electrically connected to other electrical components in the box body 30, and can also be connected to a control module outside the battery 200. For example, the electronic device 40 can be connected to the control module outside the battery 200, and the circuit board 50 can be connected to each battery cell 300 and electrical components in the box body 30.

[0213] In a fourth aspect, some embodiments of the present application further provide an electrical device 100, including the battery 200 provided by some embodiments of the third aspect.

[0214] The electrical device 100 can be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, an electric toy, an electric tool, a battery car, an electric vehicle, a ship, a spacecraft, etc. Among them, the electric toy can include a fixed or mobile electric toy. For example, a game console, an electric vehicle toy, an electric ship toy, an electric aircraft toy, etc. The spacecraft can include an airplane, a rocket, a space shuttle, a spaceship, etc.

[0215] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered by the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A circuit structure, characterized in that, include: A circuit board, the circuit board comprising a conductive portion; An electronic device is disposed on the circuit board, the electronic device is provided with pins, and the pins are electrically connected to the conductive part; A stopper, arranged on a side of the conductive portion away from the pin; A portion of the position-limiting member, a portion of the conductive portion and a portion of the pin are welded to form a fusion portion, and the fusion portion extends from the position-limiting member through the circuit board to the pin.

2. The circuit structure according to claim 1, wherein The conductive portion is electrically connected to the lead through the fusion portion.

3. The circuit structure according to claim 1 or 2, characterized in that, The conductive portion includes a first surface facing the pin, and the pin includes a second surface facing the conductive portion; The conductive portion is pressed against the pin by the stopper, so that the first surface contacts and is electrically connected to the second surface.

4. The circuit structure according to any one of claims 1-3, characterized in that, A welding hole is formed in the fusion portion, and the welding hole passes through the stopper, the circuit board and extends into the pin; Along the direction from the limiting member to the pin, the inner diameter of the welding hole gradually decreases.

5. The circuit structure according to any one of claims 1-4, characterized in that, The circuit board also includes a covering portion at least arranged on one side of the conductive portion, the electronic device is arranged on any of the covering portions and the pin passes through the covering portion and is electrically connected to the conductive portion, and the limiter passes through the other covering portion and is welded to the conductive portion.

6. The circuit structure according to claim 5, characterized in that, The covering portion comprises an insulating layer and a reinforcing layer, wherein the insulating layer is arranged on the conductive portion, and the reinforcing layer is arranged on a side of the insulating layer away from the conductive portion.

7. The circuit structure according to claim 5 or 6, characterized in that, The covering portion is provided with a through hole capable of exposing the conductive portion, and the through hole is used to accommodate the limiting member or the pin.

8. The circuit structure according to any one of claims 5-7, characterized in that, The electronic device further includes a housing, and the housing is disposed on the cover.

9. The circuit structure according to claim 8, wherein The covering portion is provided with a slot, and at least a portion of the housing is interference-fitted in the slot.

10. The circuit structure according to any one of claims 1-9, characterized in that, The thickness of the conductive portion is less than or equal to 0.8 mm, and the thickness of the conductive portion is greater than or equal to 0.2 mm.

11. The circuit structure according to any one of claims 1-10, characterized in that, The circuit board is a flexible circuit board.

12. A method for manufacturing a circuit structure, characterized in that, include: The pins and the stopper are respectively arranged on opposite sides of the conductive part of the circuit board, wherein the pins are electrically connected to the conductive part; The stopper is welded to the conductive part to form a fusion part, wherein the fusion part extends through the conductive part into the pin, and a part of the conductive part and a part of the pin are melted in the fusion part.

13. The method for manufacturing a circuit structure according to claim 12, wherein In the step of welding the stopper to the conductive part and forming the fusion part, the stopper can press the conductive part to the pin so that the conductive part can be electrically connected to the pin.

14. The method for manufacturing a circuit structure according to claim 12 or 13, characterized in that, In the step of welding the stopper to the conductive portion to form a fusion portion, the stopper is welded to the conductive portion through a stirring welding process to form the fusion portion.

15. The method for manufacturing a circuit structure according to claim 14, wherein The stopper is formed by a stirring welding process to form a welding hole that passes through the conductive part and extends into the pin; Along the direction from the limiting member to the pin, the inner diameter of the welding hole gradually decreases.

16. The method for manufacturing a circuit structure according to any one of claims 12-15, characterized in that, Before the step of respectively arranging the pins and the stopper on opposite sides of the conductive portion of the circuit board, the circuit structure manufacturing method further includes: Covering parts are provided on both sides of the conductive part.

17. The method for manufacturing the circuit structure according to claim 16, wherein, In the step of disposing the covering portions on both sides of the conductive portion, an insulating layer is disposed on the conductive portion, and a reinforcing layer is disposed on a side of the insulating layer facing away from the conductive portion.

18. A battery, characterized in that, Comprising the circuit structure according to any one of claims 1-11, or the circuit structure manufactured by the method of manufacturing a circuit structure according to any one of claims 12-17.

19. An electrical device, characterized in that, Comprising the battery according to claim 18.

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