Accurate wiring control method for integrated circuit board and circuit board thereof

Abstract

The invention provides an integrated circuit board accurate wiring control method and a circuit board thereof, and relates to the technical field of circuit board design, the method comprises the following steps: obtaining circuit board information, the circuit board information comprising signal frequency, current intensity and circuit board temperature; circuit board impedance information is obtained, and the circuit board impedance information comprises load end impedance, source end impedance and transmission line characteristic impedance; determining a first control parameter according to the current intensity; determining a second control parameter according to the circuit board temperature; determining a third control parameter according to the signal frequency and the impedance information; and determining a control scheme according to the first control parameter, the second control parameter and the third control parameter. According to the invention, the wiring can be controlled according to the signal frequency, the current intensity and the circuit board temperature, and the wiring accuracy of the integrated circuit board and the signal transmission quality are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board design, and particularly to a method for precisely routing control of an integrated circuit board and the circuit board thereof. Background Art

[0002] In the related art, CN111225493B discloses a routing structure of a circuit board and a circuit board, which relates to the technical field of circuit board design and is invented to solve the problem of large impedance of the single-sided board PDN in the prior art. The solution is a routing structure of a circuit board, where a processor and a capacitor are provided on one surface of the circuit board. The routing structure includes a first connection structure and a second connection structure, both of which are located inside the circuit board. The first connection structure is used to connect the power supply terminal of the processor to the power supply terminal of the capacitor, and the second connection structure is used to connect the ground terminal of the processor to the ground terminal of the capacitor. The projections of the first connection structure and the second connection structure on a first plane perpendicular to the circuit board can form at least two annular regions, and the magnetic field directions of two of the annular regions are the same. This solution is a routing structure of a circuit board for connecting a processor and a capacitor.

[0003] CN107734849B discloses a routing method and a circuit board. The method includes: S1: Using the differential routing principle, calculating the routing length of the I2C routing on the outer layer of the circuit board and designing the routing mode of the I2C routing on the outer layer of the circuit board; S2: Using the differential routing principle, calculating the routing length of the I2C routing on the inner layer of the circuit board; S3: Based on the routing length calculated in step S2, using the non-differential routing principle to design the routing mode of the I2C routing on the inner layer of the circuit board. The circuit board includes a circuit board body and an I2C routing. The I2C routing includes an I2C outer layer routing and an I2C inner layer routing. The I2C outer layer routing adopts a differential routing mode, and the I2C inner layer routing adopts a non-differential routing mode. By retaining the routing length and routing mode of the outer layer of the circuit board under the differential principle and using the non-differential principle routing mode to replace the routing mode of the inner layer of the circuit board, the routing space is greatly saved without affecting the signal transmission quality.

[0004] Based on the above related technologies, the routing space can be saved. However, the related technologies do not consider the influence of the temperature, current and signal frequency of the circuit board on the routing, that is, it is impossible to precisely route the integrated circuit board according to the three aspects of the circuit board temperature, current and signal frequency. Summary of the Invention

[0005] The present invention provides a method for precisely controlling the wiring of an integrated circuit printed circuit board and the printed circuit board, which can solve the technical problem that in the related art, the integrated circuit printed circuit board cannot be precisely wired according to three aspects of the temperature, current, and signal frequency of the printed circuit board.

[0006] According to a first aspect of the present invention, there is provided a method for precisely controlling the wiring of an integrated circuit printed circuit board, including:

[0007] Obtaining printed circuit board information, wherein the printed circuit board information includes: signal frequency, current intensity, and printed circuit board temperature;

[0008] Obtaining printed circuit board impedance information, wherein the printed circuit board impedance information includes: load end impedance, source end impedance, and transmission line characteristic impedance;

[0009] Determining a first control parameter according to the current intensity;

[0010] Determining a second control parameter according to the printed circuit board temperature;

[0011] Determining a third control parameter according to the signal frequency and the impedance information;

[0012] Determining a control scheme according to the first control parameter, the second control parameter, and the third control parameter.

[0013] According to the present invention, determining a first control parameter according to the current intensity includes:

[0014] Determining the allowable current density and the actual cross-sectional area of the wire;

[0015] Determining the minimum cross-sectional area according to the allowable current density and the current intensity;

[0016] Determining a first control parameter according to the minimum cross-sectional area and the actual cross-sectional area.

[0017] According to the present invention, determining a second control parameter according to the printed circuit board temperature includes:

[0018] Obtaining the normal temperature resistivity of the wire in the first historical experimental period;

[0019] Obtaining the temperature coefficient of the wire material;

[0020] Determining the real-time resistivity of the wire according to the normal temperature resistivity of the wire, the temperature coefficient, and the printed circuit board temperature;

[0021] Determining a second control parameter according to the printed circuit board temperature and the real-time resistivity of the wire.

[0022] According to the present invention, determining a second control parameter according to the printed circuit board temperature and the real-time resistivity of the wire includes:

[0023] Determine the real-time resistance of the wire according to the real-time resistivity of the wire;

[0024] Obtain the initial spacing, coefficient of thermal expansion, and initial line width of the wire material;

[0025] Determine a second control parameter according to the initial spacing, the initial line width, the coefficient of thermal expansion, and the temperature of the circuit board.

[0026] According to the present invention, determining a second control parameter according to the initial spacing, the initial line width, the coefficient of thermal expansion, and the temperature of the circuit board includes:

[0027] According to the formula

[0028]

[0029] Determine the second control parameter Wea, where max is the maximum value function, μ j is a preset weight, Ls j,j+1 is the initial spacing between the j-th wire and the (j + 1)-th wire, S j,o is the initial width of the j-th wire, Ce j is the coefficient of thermal expansion of the j-th wire, S j+1,o the initial width of the (j + 1)-th wire, Ce j+1 is the coefficient of thermal expansion of the (j + 1)-th wire, Cbt is the temperature of the circuit board, t T is a preset temperature, m is the number of wires, j ≤ m, and both j and m are positive integers.

[0030] According to the present invention, determining a third control parameter according to the signal frequency and the impedance information includes:

[0031] Determine whether the signal is a high-frequency signal according to the signal frequency;

[0032] In the case where the signal is a high-frequency signal, determine a third control parameter according to the impedance information;

[0033] In the case where the signal is not a high-frequency signal, determine that the third control parameter is -1.

[0034] According to the present invention, in the case where the signal is a high-frequency signal, determining a third control parameter according to the impedance information includes:

[0035] Obtain the historical load-end impedance, historical source-end impedance, and historical transmission-line characteristic impedance in the historical experimental period;

[0036] Obtain the experimental information in the historical experimental period, where the experimental information includes: experimental temperature, experimental signal frequency, and hygroscopicity of the experimental material;

[0037] Determine a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load terminal impedance, the historical source terminal impedance, and the historical transmission line characteristic impedance;

[0038] Determine an offset load terminal impedance, an offset source terminal impedance, and an offset transmission line characteristic impedance according to the first relationship function, the second relationship function, and the third relationship function;

[0039] Determine a third control parameter according to the offset load terminal impedance, the offset source terminal impedance, and the offset transmission line characteristic impedance.

[0040] According to the present invention, determining a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load terminal impedance, the historical source terminal impedance, and the historical transmission line characteristic impedance includes:

[0041] According to the formula

[0042]

[0043] Determine a first undetermined coefficient equation A of the first relationship function, a second undetermined coefficient equation B of the second relationship function, and a third undetermined coefficient equation C of the third relationship function, where Lei k,1 is the historical load terminal impedance at the start time of the k-th historical experimental period, Lei k,e is the historical load terminal impedance at the end time of the k-th historical experimental period, ESf k is the experimental signal frequency of the k-th historical experimental period, ET k is the experimental temperature of the k-th historical experimental period, EMa k is the hygroscopicity of the experimental material of the k-th historical experimental period, Si k,1 is the historical source terminal impedance at the start time of the k-th historical experimental period, Si k,e is the historical source terminal impedance at the end time of the k-th historical experimental period, Ci k,1 is the historical transmission line characteristic impedance at the start time of the k-th historical experimental period, Ci k,e is the historical transmission line characteristic impedance at the end time of the k-th historical experimental period, ESf T is a preset signal frequency threshold, ET T is a preset experimental temperature threshold, EMa Tis the preset moisture absorption threshold of the material, α1, α2, α3, α4, α5, and α6 are the first undetermined coefficients of the first undetermined coefficient equation A, β1, β2, β3, β4, β5, and β6 are the second undetermined coefficients of the second undetermined coefficient equation B, and θ1, θ2, θ3, θ4, θ5, and θ6 are the third undetermined coefficients of the third undetermined coefficient equation C;

[0044] Solve for the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the experimental material moisture absorption, the historical load - end impedance, the historical source - end impedance, and the historical transmission line characteristic impedance, to obtain the solution values of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient;

[0045] Determine the first relationship function, the second relationship function, and the third relationship function according to the solution values of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient, and the first undetermined coefficient equation A, the second undetermined coefficient equation B, and the third undetermined coefficient equation C.

[0046] According to the present invention, determine the third control parameter according to the offset load - end impedance, the offset source - end impedance, and the offset transmission line characteristic impedance, including:

[0047] Determine the load - end reflection coefficient according to the offset load - end impedance and the offset transmission line characteristic impedance;

[0048] Determine the source - end reflection coefficient according to the offset source - end impedance and the offset transmission line characteristic impedance;

[0049] Determine the third control parameter according to the load - end reflection coefficient and the source - end reflection coefficient.

[0050] According to the second aspect of the present invention, provide an integrated circuit printed circuit board, including: a signal layer, a power supply layer, a ground layer, and a protection layer, and perform wiring control using the integrated circuit board precise wiring control method.

[0051] Technical effects: According to the present invention, the integrated circuit circuit board can be simulated and operated, and the signal frequency, current intensity, and circuit board temperature during the simulated operation of the circuit board can be obtained. And according to the three aspects of signal frequency, current intensity, and circuit board temperature, the wiring is controlled, which improves the accuracy of the integrated circuit circuit board wiring and the quality of signal transmission. When determining the second control parameter, the second control parameter can be determined according to the initial spacing, initial line width, coefficient of thermal expansion, and circuit board temperature. During the calculation process, according to the reduction of the spacing between individual adjacent wire combinations, the situation with the most serious decline in the overall operating function of the integrated circuit circuit board can be determined, taking into account the cumulative effect in high-density wiring, and improving the accuracy and objectivity of the second control parameter. When determining the first relationship function, the second relationship function, and the third relationship function, the first relationship function, the second relationship function, and the third relationship function can be determined according to the experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, historical load-end impedance, historical source-end impedance, and historical transmission line characteristic impedance, accurately describing the influence relationship of the experimental temperature, experimental signal frequency, and hygroscopicity of the experimental material on the offset degree of the load-end impedance, the offset degree of the source-end impedance, and the offset degree of the transmission line characteristic impedance, and improving the comprehensiveness and accuracy of the first relationship function, the second relationship function, and the third relationship function. Description of the Drawings

[0052] Figure 1 Exemplarily shown is a schematic flowchart of a method for precise wiring control of an integrated circuit circuit board according to an embodiment of the present invention;

[0053] Figure 2 Exemplarily shown is a flowchart of calculating the second control parameter according to an embodiment of the present invention;

[0054] Figure 3 Exemplarily shown is a flowchart of calculating the third control parameter according to an embodiment of the present invention. Detailed Embodiments

[0055] Hereinafter, the technical solutions of the present invention will be described in detail with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0056] Figure 1 Exemplarily shown is a schematic flowchart of a method for precise wiring control of an integrated circuit circuit board according to an embodiment of the present invention, and the method includes:

[0057] Step S1, obtaining circuit board information, where the circuit board information includes: signal frequency, current intensity, and circuit board temperature;

[0058] Step S2, obtain the impedance information of the circuit board, where the impedance information of the circuit board includes: load-end impedance, source-end impedance, and transmission line characteristic impedance;

[0059] Step S3, determine the first control parameter according to the current intensity;

[0060] Step S4, determine the second control parameter according to the circuit board temperature;

[0061] Step S5, determine the third control parameter according to the signal frequency and the impedance information;

[0062] Step S6, determine the control scheme according to the first control parameter, the second control parameter, and the third control parameter.

[0063] According to the integrated circuit board precise routing control method of the embodiment of the present invention, the integrated circuit board can be simulated and run, the signal frequency, current intensity, and circuit board temperature during the simulation operation of the circuit board are obtained, and the routing is controlled from three aspects of signal frequency, current intensity, and circuit board temperature, improving the precision of the integrated circuit board routing and the quality of signal transmission.

[0064] According to an embodiment of the present invention, in step S1, obtain the circuit board information, where the circuit board information includes: signal frequency, current intensity, and circuit board temperature.

[0065] For example, use a time-domain reflectometer (TDR) simulation waveform, convert it to the frequency domain through Fourier transform, identify key frequency components (such as signal frequency), use a power consumption simulation tool (such as Cadence Voltus) to estimate the current intensity according to the circuit design (gate-level netlist or RTL code), use a thermal analysis software (such as Cadence Celsius) to import the PCB layout and material thermal conductivity, simulate the temperature distribution under different working conditions, and obtain the circuit board temperature.

[0066] According to an embodiment of the present invention, in step S2, obtain the impedance information of the circuit board, where the impedance information of the circuit board includes: load-end impedance, source-end impedance, and transmission line characteristic impedance.

[0067] For example, directly measure the load-end impedance using a VNA, calculate the source-end impedance through the AC injection method, and simulate and calculate the transmission line characteristic impedance through an EDA tool.

[0068] According to an embodiment of the present invention, in step S3, determine the first control parameter according to the current intensity.

[0069] According to an embodiment of the present invention, step S3 includes:

[0070] Step S31: Determine the allowable current density and the actual cross-sectional area of the wire.

[0071] Step S32: Determine the minimum cross-sectional area according to the allowable current density and the current intensity.

[0072] Step S33: Determine the first control parameter according to the minimum cross-sectional area and the actual cross-sectional area.

[0073] For example, use an IPC-2152 calculator (such as Saturn PCB Toolkit) to quickly calculate the allowable current density of the wire. Determine the actual cross-sectional area of the wire according to the designed width of the wire on the PCB and the thickness of the PCB copper foil (for example, 1 oz copper ≈ 0.035 mm, 2 oz copper ≈ 0.07 mm). According to the current density formula, determine the minimum cross-sectional area based on the ratio of the current intensity to the allowable current density. Since excessive current density increases the heat generation per unit area and raises the wire temperature, which may cause insulation damage or material melting, it is necessary to increase the wire cross-sectional area and reduce the current density. The minimum cross-sectional area is the cross-sectional area at which the wire can operate safely. For example, if the allowable current density of a copper wire is 5 A / mm² and the current passing through is 10 A, then at least a cross-sectional area of 2 mm² is required. Determine the first control parameter by subtracting the minimum cross-sectional area from the actual cross-sectional area. The first control parameter represents the size relationship between the actual cross-sectional area and the minimum cross-sectional area. When the first control parameter is less than 0, it means the actual cross-sectional area is less than the minimum cross-sectional area, and the wire may not be able to operate safely, so the actual cross-sectional area needs to be adjusted. When the first control parameter is greater than 0, it means the wire can operate safely.

[0074] According to an embodiment of the present invention, in step S4, determine the second control parameter according to the temperature of the circuit board.

[0075] According to an embodiment of the present invention, step S4 includes:

[0076] Step S41: Obtain the normal temperature resistivity of the wire in the first historical experiment period.

[0077] Step S42: Obtain the temperature coefficient of the wire material.

[0078] Step S43: Determine the real-time resistivity of the wire according to the normal temperature resistivity of the wire, the temperature coefficient, and the temperature of the circuit board.

[0079] Step S44: Determine the second control parameter according to the temperature of the circuit board and the real-time resistivity of the wire.

[0080] For example, in the first historical experiment cycle, measure the normal temperature resistivity of the wire at normal temperature (e.g., 20 degrees Celsius); refer to the temperature characteristic specifications of metal wires in international standards (such as IEEE, IEC) to obtain the temperature coefficient of the wire material; substitute the normal temperature resistivity of the wire, the temperature coefficient, and the circuit board temperature into the resistivity temperature coefficient formula to determine the real-time resistivity of the wire, that is, the resistivity of the wire at the current circuit board temperature; calculate the second control parameter according to the circuit board temperature and the real-time resistivity of the wire. The second control parameter represents the degree of decline in the overall operating function of the circuit board caused by the increase in the circuit board temperature. The larger the second control parameter, the more serious the decline in the overall operating function of the circuit board.

[0081] Figure 2 Exemplarily, a flowchart of calculating the second control parameter according to an embodiment of the present invention is shown.

[0082] According to an embodiment of the present invention, step S44 includes:

[0083] Step S441, determine the real-time resistance of the wire according to the real-time resistivity of the wire;

[0084] Step S442, obtain the initial spacing, thermal expansion coefficient, and initial line width of the wire material;

[0085] Step S443, determine the second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature.

[0086] For example, substitute the real-time resistivity of the wire into the resistance formula of the conductor to determine the real-time resistance of the wire; obtain the thermal expansion coefficient of the wire material according to the material handbook and the process design kit, and obtain the initial line width and initial spacing of the wire material according to the layout design file; calculate the second control parameter according to the initial line width, initial spacing, thermal expansion coefficient, and circuit board temperature.

[0087] According to an embodiment of the present invention, step S443 includes; determine the second control parameter Wea according to formula (1),

[0088]

[0089] where max is the maximum value function, μ j is the preset weight, Ls j,j+1 is the initial spacing between the jth wire and the (j + 1)th wire, S j,o is the initial width of the jth wire, Ce j is the thermal expansion coefficient of the jth wire, S j+1,o the initial width of the (j + 1)th wire, Ce j+1 is the thermal expansion coefficient of the (j + 1)th wire, Cbt is the circuit board temperature, t Tis the preset temperature, m is the number of wires, j ≤ m, and both j and m are positive integers.

[0090] According to an embodiment of the present invention, S j,o ×Ce j ×(Cbt - t T ) is the expansion amount of the line width of the j-th wire, where the preset temperature t T can be set to 20 degrees Celsius, S j+1,o ×Ce j+1 ×(Cbt - t T ) is the expansion amount of the line width of the (j + 1)-th wire. is the reduction amount of the spacing between the j-th and the (j + 1)-th wires. is the relative difference between the initial spacing between the j-th and the (j + 1)-th wires and the reduction amount of the spacing between the j-th and the (j + 1)-th wires. The smaller this ratio is, the greater the reduction amount of the spacing between the j-th and the (j + 1)-th wires is, and the greater the possibility of causing short circuits or signal crosstalk is.

[0091] represents taking the maximum value of the sum of the products of the reduction degrees of the spacings between m - 1 adjacent wires and the corresponding weights. For example, when the value between the first and the second adjacent wires is 0.5, the corresponding value between the second and the third adjacent wires is 0.6, and the corresponding value between the third and the fourth adjacent wires is 0.4, and the preset weights are μ1, μ2, and μ3 respectively, and μ1 < μ2 < μ3, then

[0092] value is 0.6μ3 + 0.5μ2 + 0.4μ1, indicating that the more adjacent wire combinations with a larger reduction degree of the spacing in the integrated circuit board, the more serious the impact on the operating function of the integrated circuit board as the number of adjacent wire combinations with a larger reduction degree of the spacing increases. Among them, the change of μ j takes the form of a combination of an exponential function and a linear function. The part of the change of μ j in the form of a linear function indicates that as the reduction degree of the spacing of a single adjacent wire combination increases, the degree of decline of the overall operating function of the integrated circuit board increases uniformly. The part of the change of μ j in the form of an exponential function indicates that as the number of adjacent wire combinations with a larger reduction degree of the spacing increases, the impact on the degree of decline of the overall operating function of the integrated circuit board increases rapidly and non-uniformly. The above situation of finding the maximum value by distributing weights can be used to determine the situation where the degree of decline of the overall operating function of the integrated circuit board is the most serious.

[0093] In this way, the second control parameter can be determined according to the initial spacing, initial line width, coefficient of thermal expansion, and the temperature of the circuit board. During the calculation process, the situation with the most serious decline in the overall operating function of the integrated circuit board can be determined based on the reduction in the spacing between individual adjacent wire combinations, taking into account the cumulative effect in high-density wiring, thereby improving the accuracy and objectivity of the second control parameter.

[0094] According to an embodiment of the present invention, in step S5, a third control parameter is determined based on the signal frequency and the impedance information.

[0095] According to an embodiment of the present invention, step S5 includes:

[0096] Step S51, determining whether the signal belongs to a high-frequency signal according to the signal frequency;

[0097] Step S52, in the case where the signal belongs to a high-frequency signal, determining the third control parameter according to the impedance information;

[0098] Step S53, in the case where the signal does not belong to a high-frequency signal, determining the third control parameter as -1.

[0099] For example, a signal with a frequency greater than 100 kHz is determined as a high-frequency signal (such as radio frequency, high-speed digital signal); for a high-frequency signal, impedance matching needs to be controlled to reduce the skin effect and parasitic capacitance, and the third control parameter is determined according to the impedance information; for a low-frequency signal, the line width and spacing can be appropriately relaxed, but crosstalk needs to be avoided, and the third control parameter is determined as -1. The third control parameter represents the processing method determined according to high-frequency and low-frequency signals. When the third control parameter is -1, it indicates that the signal is a low-frequency signal and crosstalk needs to be avoided. When the third control parameter is greater than or equal to 0, it indicates that the signal is a high-frequency signal, and it is necessary to determine whether the impedance is matched and determine the control method according to the judgment result.

[0100] Figure 3 Exemplarily, a flowchart of calculating the third control parameter according to an embodiment of the present invention is shown.

[0101] According to an embodiment of the present invention, step S52 includes:

[0102] Step S521, obtaining the historical load-end impedance, historical source-end impedance, and historical transmission-line characteristic impedance in the historical experimental period;

[0103] Step S522, obtaining the experimental information in the historical experimental period, where the experimental information includes: experimental temperature, experimental signal frequency, and moisture absorbency of the experimental material;

[0104] Step S523: Determine a first relationship function, a second relationship function, and a third relationship function based on the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load - end impedance, the historical source - end impedance, and the historical transmission - line characteristic impedance;

[0105] Step S524: Determine an offset load - end impedance, an offset source - end impedance, and an offset transmission - line characteristic impedance based on the first relationship function, the second relationship function, and the third relationship function;

[0106] Step S525: Determine a third control parameter based on the offset load - end impedance, the offset source - end impedance, and the offset transmission - line characteristic impedance.

[0107] For example, in a historical experimental period, adjust the environmental factors, and obtain the historical load - end impedance, the historical source - end impedance, and the historical transmission - line characteristic impedance under different environmental conditions through detection instruments (such as multimeters and impedance analyzers); obtain the experimental temperature, the experimental signal frequency, and the hygroscopicity of the experimental material in the historical experimental period. Among them, the hygroscopicity of the experimental material can be determined by the difference between the mass of the material after moisture absorption and the absolute dry mass of the material and the absolute dry mass of the material; the historical load - end impedance, the historical source - end impedance, and the historical transmission - line characteristic impedance are all related to temperature, signal frequency, and material hygroscopicity to a certain extent. For example, when the temperature rises, the dielectric constant increases, the capacitance increases, and the impedance decreases. Based on the above correlations, determine the first relationship function, the second relationship function, and the third relationship function; substitute the load - end impedance, the environmental temperature, the signal frequency, and the material hygroscopicity of the current integrated - circuit circuit board into the first relationship function to obtain the ratio of the difference between the load - end impedance and the offset load - end impedance to the load - end impedance. Based on this ratio and the load - end impedance, determine the offset load - end impedance, that is, the offset load - end impedance. Similarly, substitute the source - end impedance, the transmission - line characteristic impedance, the environmental temperature, the signal frequency, and the material hygroscopicity of the current integrated - circuit circuit board into the second relationship function and the third relationship function respectively to determine the offset source - end impedance and the offset transmission - line characteristic impedance; determine the third control parameter based on the offset load - end impedance, the offset source - end impedance, and the offset transmission - line characteristic impedance.

[0108] According to an embodiment of the present invention, step S523 includes: determining a first undetermined - coefficient equation A of the first relationship function, a second undetermined - coefficient equation B of the second relationship function, and a third undetermined - coefficient equation C of the third relationship function according to formula (2),

[0109]

[0110] where Lei k,1 is the historical load - end impedance at the start time of the k - th historical experimental period, Lei k,eis the historical load - side impedance at the end of the k - th historical experimental period, ESf k is the experimental signal frequency of the k - th historical experimental period, ET k is the experimental temperature of the k - th historical experimental period, EMa k is the hygroscopicity of the experimental material in the k - th historical experimental period, Si k,1 is the historical source - side impedance at the start of the k - th historical experimental period, Si k,e is the historical source - side impedance at the end of the k - th historical experimental period, Ci k,1 is the historical transmission - line characteristic impedance at the start of the k - th historical experimental period, Ci k,e is the historical transmission - line characteristic impedance at the end of the k - th historical experimental period, ESf T is the preset signal - frequency threshold, ET T is the preset experimental - temperature threshold, EMa T is the preset hygroscopicity threshold of the material, α1, α2, α3, α4, α5 and α6 are the first undetermined coefficients of the first undetermined - coefficient equation A, β1, β2, β3, β4, β5 and β6 are the second undetermined coefficients of the second undetermined - coefficient equation B, and θ1, θ2, θ3, θ4, θ5 and θ6 are the third undetermined coefficients of the third undetermined - coefficient equation C;

[0111] Solve for the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load - side impedance, the historical source - side impedance and the historical transmission - line characteristic impedance, and obtain the solution values of the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient;

[0112] Determine the first relationship function, the second relationship function and the third relationship function according to the solution values of the first undetermined coefficient, the second undetermined coefficient and the third undetermined coefficient, and the first undetermined - coefficient equation A, the second undetermined - coefficient equation B and the third undetermined - coefficient equation C.

[0113] According to an embodiment of the present invention, is the ratio of the experimental signal frequency of the k - th historical experimental period to the preset signal - frequency threshold, representing the experimental signal - frequency condition of the k - th historical experimental period, where the preset signal - frequency threshold can be set to 100 kHz, is the ratio of the experimental temperature of the k - th historical experimental period to the preset experimental - temperature threshold, representing the experimental temperature condition of the k - th historical experimental period, where the preset temperature threshold can be set to 20 degrees Celsius, It is the ratio of the hygroscopicity of the experimental material in the k-th historical experimental period to the preset material hygroscopicity threshold, indicating the hygroscopicity condition of the material in the k-th historical experimental period. Among them, the preset material hygroscopicity threshold can be set to 10%.

[0114] According to an embodiment of the present invention, It represents the degree of historical load-end impedance offset in the k-th historical experimental period. It represents that the degree of historical load-end impedance offset in the k-th historical experimental period has a positive correlation with the experimental signal frequency condition in the k-th historical experimental period. For example, as the frequency increases, the conductor loss resistance (Rac) increases significantly, the real part (resistance component) of the equivalent impedance increases, and the impedance rises slightly. It represents that the degree of historical load-end impedance offset in the k-th historical experimental period has a negative correlation with the experimental temperature condition in the k-th historical experimental period. For example, as the temperature increases, the dielectric constant of the dielectric material increases, the capacitance increases, and the impedance decreases. It represents that the degree of historical load-end impedance offset in the k-th historical experimental period has a negative correlation with the hygroscopicity condition of the material in the k-th historical experimental period. For example, the greater the hygroscopicity of the experimental material, the more moisture in the air it absorbs, the dielectric constant increases, and the impedance decreases. Based on the above correlation, the first undetermined coefficient equation A of the first relationship function can be obtained. Similarly, It represents the degree of historical source-end impedance offset in the k-th historical experimental period. It represents that the degree of historical source-end impedance offset in the k-th historical experimental period has a positive correlation with the experimental signal frequency condition in the k-th historical experimental period. It represents that the degree of historical source-end impedance offset in the k-th historical experimental period has a negative correlation with the experimental temperature condition in the k-th historical experimental period. It represents that the degree of historical source-end impedance offset in the k-th historical experimental period has a negative correlation with the hygroscopicity condition of the material in the k-th historical experimental period. Based on the above correlation, the second undetermined coefficient equation B of the second relationship function can be obtained. It represents the degree of historical transmission line characteristic impedance offset in the k-th historical experimental period. It represents that the degree of historical transmission line characteristic impedance offset in the k-th historical experimental period has a positive correlation with the experimental signal frequency condition in the k-th historical experimental period. It represents that the degree of historical transmission line characteristic impedance offset in the k-th historical experimental period has a negative correlation with the experimental temperature condition in the k-th historical experimental period. It is indicated that the degree of historical transmission line characteristic impedance offset in the k-th historical experimental period has a negative correlation with the hygroscopicity of the material in the k-th historical experimental period. Based on the above correlation, the third undetermined coefficient equation C of the third relationship function can be obtained.

[0115] According to an embodiment of the present invention, fitting can be performed based on multiple parameters involved in the above first undetermined coefficient equation, that is, fitting based on experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical load-end impedance, and solving the above multiple first undetermined coefficients. There are 6 first undetermined coefficients, namely, α1, α2, α3, α4, α5, and α6. Based on the experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical load-end impedance of at least 6 historical experimental periods, the above 6 first undetermined coefficients are solved to obtain the solution values of the above 6 first undetermined coefficients, and the solution values of the above 6 first undetermined coefficients are substituted into the first undetermined coefficient equation A to determine the first relationship function.

[0116] According to an embodiment of the present invention, fitting can be performed based on multiple parameters involved in the above second undetermined coefficient equation, that is, fitting based on experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical source-end impedance, and solving the above multiple second undetermined coefficients. There are 6 second undetermined coefficients, namely, β1, β2, β3, β4, β5, and β6. Based on the experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical source-end impedance of at least 6 historical experimental periods, the above 6 second undetermined coefficients are solved to obtain the solution values of the above 6 second undetermined coefficients, and the solution values of the above 6 second undetermined coefficients are substituted into the second undetermined coefficient equation B to determine the second relationship function.

[0117] According to an embodiment of the present invention, fitting can be performed based on multiple parameters involved in the above third undetermined coefficient equation, that is, fitting based on experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical transmission line characteristic impedance, and solving the above multiple third undetermined coefficients. There are 6 third undetermined coefficients, namely, θ1, θ2, θ3, θ4, θ5, and θ6. Based on the experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, and historical transmission line characteristic impedance of at least 6 historical experimental periods, the above 6 third undetermined coefficients are solved to obtain the solution values of the above 6 third undetermined coefficients, and the solution values of the above 6 third undetermined coefficients are substituted into the third undetermined coefficient equation C to determine the third relationship function.

[0118] In this way, the first relationship function, the second relationship function, and the third relationship function can be determined based on the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load-end impedance, the historical source-end impedance, and the historical transmission line characteristic impedance, accurately describing the influence relationships of the experimental temperature, the experimental signal frequency, and the hygroscopicity of the experimental material on the offset degree of the load-end impedance, the offset degree of the source-end impedance, and the offset degree of the transmission line characteristic impedance, and improving the comprehensiveness and accuracy of the first relationship function, the second relationship function, and the third relationship function.

[0119] According to an embodiment of the present invention, step S525 includes:

[0120] Step S5251, determining a load-end reflection coefficient according to the offset load-end impedance and the offset transmission line characteristic impedance;

[0121] Step S5252, determining a source-end reflection coefficient according to the offset source-end impedance and the offset transmission line characteristic impedance;

[0122] Step S5253, determining a third control parameter according to the load-end reflection coefficient and the source-end reflection coefficient.

[0123] For example, substituting the offset load-end impedance and the offset transmission line characteristic impedance into the reflection coefficient formula to determine the load-end reflection coefficient; substituting the offset source-end impedance and the offset transmission line characteristic impedance into the reflection coefficient formula to determine the source-end reflection coefficient; determining a preset reflection coefficient threshold (for example, the preset reflection coefficient threshold can be set to 0.3, indicating acceptable matching and little influence on the signal), determining the load-end reflection result according to the preset reflection coefficient threshold and the load-end reflection coefficient. When the preset reflection coefficient threshold is greater than or equal to the load-end reflection coefficient, it indicates load-end matching and the load-end reflection result is 0. When the preset reflection coefficient threshold is less than the load-end reflection coefficient, it indicates load-end mismatch and the load-end reflection result is 1. Determining the source-end reflection result according to the preset reflection coefficient threshold and the source-end reflection coefficient. When the preset reflection coefficient threshold is greater than or equal to the source-end reflection coefficient, it indicates source-end matching and the source-end reflection result is 0. When the preset reflection coefficient threshold is less than the source-end reflection coefficient, it indicates source-end mismatch and the source-end reflection result is 1. Determining the third control parameter according to the sum of the source-end reflection result and the load-end reflection result.

[0124] According to an embodiment of the present invention, in step S6, a control scheme is determined according to the first control parameter, the second control parameter, and the third control parameter.

[0125] For example, if the first control parameter is greater than 0, no control is required. If the first control parameter is less than or equal to 0, increase the wire width to increase the cross-sectional area of the wire. If the second control parameter is greater than the preset second control parameter threshold (e.g., e), it indicates that the overall operating function of the integrated circuit board has decreased significantly, and the distance between wires needs to be increased. If the second control parameter is less than the preset second control parameter threshold, it indicates that the overall operating function of the integrated circuit board has decreased slightly, and no control is required. If the third control parameter is -1, it indicates that the signal is a low-frequency signal, and an RC filter is added at the low-frequency signal input or output terminal to suppress high-frequency noise crosstalk. If the third control parameter is greater than 0, it indicates that source-end mismatch or load-end mismatch occurs, and source-end series termination or load-end parallel termination is performed.

[0126] According to the integrated circuit board precise routing control method of the embodiment of the present invention, the integrated circuit board can be simulated and run to obtain the signal frequency, current intensity, and board temperature during the simulation operation of the board, and the routing is controlled based on the signal frequency, current intensity, and board temperature, improving the accuracy of the integrated circuit board routing and the quality of signal transmission. When determining the second control parameter, the second control parameter can be determined based on the initial distance, initial wire width, coefficient of thermal expansion, and board temperature. During the calculation process, the situation with the most severe decrease in the overall operating function of the integrated circuit board can be determined according to the reduction of the distance between individual adjacent wire combinations, considering the cumulative effect in high-density routing, improving the accuracy and objectivity of the second control parameter. When determining the first relationship function, the second relationship function, and the third relationship function, the first relationship function, the second relationship function, and the third relationship function can be determined based on the experimental temperature, experimental signal frequency, hygroscopicity of the experimental material, historical load-end impedance, historical source-end impedance, and historical transmission line characteristic impedance, accurately describing the influence relationships of the experimental temperature, experimental signal frequency, and hygroscopicity of the experimental material on the offset degree of the load-end impedance, the offset degree of the source-end impedance, and the offset degree of the transmission line characteristic impedance, improving the comprehensiveness and accuracy of the first relationship function, the second relationship function, and the third relationship function.

[0127] According to an embodiment of the present invention, an integrated circuit board is provided, including: a signal layer, a power supply layer, a ground layer, and a protection layer, and the integrated circuit board precise routing control method is used for routing control.

[0128] The present invention can be a method, a device, a system, and / or a computer program product. The computer program product can include a computer-readable storage medium having computer-readable program instructions for performing various aspects of the present invention loaded thereon.

[0129] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and without departing from the said principles, any variations or modifications can be made to the embodiments of the present invention.

Claims

1. An accurate wiring control method for an integrated circuit circuit board, characterized in that, Including: Obtain circuit board information, where the circuit board information includes: signal frequency, current intensity, and circuit board temperature; Obtain circuit board impedance information, where the circuit board impedance information includes: load - end impedance, source - end impedance, and transmission line characteristic impedance; Determine a first control parameter according to the current intensity; Determine a second control parameter according to the circuit board temperature; Determine a third control parameter according to the signal frequency and the impedance information; Determine a control scheme according to the first control parameter, the second control parameter, and the third control parameter.

2. The precise wiring control method for an integrated circuit circuit board according to claim 1, characterized in that, Determine a first control parameter according to the current intensity, including: Determine the allowable current density and the actual cross - sectional area of the wire; Determine the minimum cross - sectional area according to the allowable current density and the current intensity; Determine the first control parameter according to the minimum cross - sectional area and the actual cross - sectional area.

3. The precise wiring control method for an integrated circuit circuit board according to claim 1, wherein Determine a second control parameter according to the circuit board temperature, including: Obtain the normal - temperature resistivity of the wire in the first historical experimental period; Obtain the temperature coefficient of the wire material; Determine the real - time resistivity of the wire according to the normal - temperature resistivity of the wire, the temperature coefficient, and the circuit board temperature; Determine the second control parameter according to the circuit board temperature and the real - time resistivity of the wire.

4. The precise wiring control method for an integrated circuit circuit board according to claim 3, wherein, Determine a second control parameter according to the circuit board temperature and the real - time resistivity of the wire, including: Determine the real - time resistance of the wire according to the real - time resistivity of the wire; Obtain the initial spacing, thermal expansion coefficient, and initial line width of the wire material; Determine the second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature.

5. The precise wiring control method for an integrated circuit circuit board according to claim 4, characterized in that, Determine a second control parameter according to the initial spacing, the initial line width, the thermal expansion coefficient, and the circuit board temperature, including: According to the formula Determine the second control parameter Wea, where max is the maximum value function, μ j is the preset weight, Ls j,j+1 is the initial spacing between the j-th wire and the (j + 1)-th wire, S j,o is the initial width of the j-th wire, Ce j is the coefficient of thermal expansion of the j-th wire, S j+1,o the initial width of the (j + 1)-th wire, Ce j+1 is the coefficient of thermal expansion of the (j + 1)-th wire, Cbt is the temperature of the circuit board, t T is the preset temperature, m is the number of wires, j ≤ m, and both j and m are positive integers.

6. The method for precisely routing and controlling an integrated circuit printed circuit board according to claim 1, wherein Determine a third control parameter according to the signal frequency and the impedance information, including: Determine whether the signal belongs to a high - frequency signal according to the signal frequency; In the case where the signal belongs to a high - frequency signal, determine the third control parameter according to the impedance information; In the case where the signal does not belong to a high - frequency signal, determine the third control parameter as - 1.

7. The method for precisely routing control of an integrated circuit printed circuit board according to claim 6, characterized in that, In the case where the signal belongs to a high - frequency signal, determine the third control parameter according to the impedance information, including: Obtain the historical load - end impedance, historical source - end impedance, and historical transmission line characteristic impedance in the historical experimental period; Obtain the experimental information in the historical experimental period, where the experimental information includes: experimental temperature, experimental signal frequency, and hygroscopicity of the experimental material; Determine a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load - end impedance, the historical source - end impedance, and the historical transmission line characteristic impedance; Determine the offset load - end impedance, offset source - end impedance, and offset transmission line characteristic impedance according to the first relationship function, the second relationship function, and the third relationship function; Determine the third control parameter according to the offset load - end impedance, the offset source - end impedance, and the offset transmission line characteristic impedance.

8. The method for precisely routing control of an integrated circuit circuit board according to claim 7, characterized in that, Determine a first relationship function, a second relationship function, and a third relationship function according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load-end impedance, the historical source-end impedance, and the historical transmission line characteristic impedance, including: According to the formula Determine the first undetermined coefficient equation A of the first relationship function, the second undetermined coefficient equation B of the second relationship function, and the third undetermined coefficient equation C of the third relationship function, where Lei k,1 is the historical load terminal impedance at the start time of the k-th historical experimental period, Lei k,e is the historical load terminal impedance at the end time of the k-th historical experimental period, ESf k is the experimental signal frequency of the k-th historical experimental period, ET k is the experimental temperature of the k-th historical experimental period, EMa k is the hygroscopicity of the experimental material in the k-th historical experimental period, Si k,1 is the historical source terminal impedance at the start time of the k-th historical experimental period, Si k,e is the historical source terminal impedance at the end time of the k-th historical experimental period, Ci k,1 is the historical transmission line characteristic impedance at the start time of the k-th historical experimental period, Ci k,e is the historical transmission line characteristic impedance at the end time of the k-th historical experimental period, ESf T is the preset signal frequency threshold, ET T is the preset experimental temperature threshold, EMa T is the preset material hygroscopicity threshold, α1, α2, α3, α4, α5, and α6 are the first undetermined coefficients of the first undetermined coefficient equation A, β1, β2, β3, β4, β5, and β6 are the second undetermined coefficients of the second undetermined coefficient equation B, and θ1, θ2, γ3, γ4, θ5, and θ6 are the third undetermined coefficients of the third undetermined coefficient equation C; Solve for the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient according to the experimental temperature, the experimental signal frequency, the hygroscopicity of the experimental material, the historical load-end impedance, the historical source-end impedance, and the historical transmission line characteristic impedance, and obtain the solution values of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient; Determine the first relationship function, the second relationship function, and the third relationship function according to the solution values of the first undetermined coefficient, the second undetermined coefficient, and the third undetermined coefficient, and the first undetermined coefficient equation A, the second undetermined coefficient equation B, and the third undetermined coefficient equation C.

9. The method for precisely routing and controlling an integrated circuit wiring board according to claim 7, wherein Determine a third control parameter according to the offset load-end impedance, the offset source-end impedance, and the offset transmission line characteristic impedance, including: Determine the load-end reflection coefficient according to the offset load-end impedance and the offset transmission line characteristic impedance; Determine the source-end reflection coefficient according to the offset source-end impedance and the offset transmission line characteristic impedance; Determine the third control parameter according to the load-end reflection coefficient and the source-end reflection coefficient.

10. An integrated circuit circuit board, characterized in that, Including: A signal layer, a power supply layer, a ground layer, and a protection layer, and perform wiring control using the method according to claims 1-9.

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