Heat dissipation structure for building electromechanical equipment

Abstract

The invention relates to a heat dissipation structure for building electromechanical equipment, and the structure comprises an operation box which is internally provided with a heat dissipation cavity; the first cavity is formed in the operation box and located on the side portion of the heat dissipation cavity, and a plurality of first air holes are communicated between the first cavity and the heat dissipation cavity; the second chamber is formed in the operation box and is opposite to the first chamber, the second chamber is arranged at the side part of the heat dissipation chamber, and the second chamber is communicated with the heat dissipation chamber; the air inlet cylinder is arranged at the end part of the operation box, an air inlet fan is mounted in the air inlet cylinder, a filter screen is arranged at the opening part of the air inlet cylinder, and the air inlet cylinder is communicated with the first chamber; and the plurality of second air holes are formed in the side part of the operation box and are communicated with the second cavity, so that the device is simple in structure and convenient to use.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electromechanical equipment, and particularly refers to a heat dissipation structure for building electromechanical equipment. Background Art

[0002] On a construction site, electromechanical equipment refers to those equipment involving mechanical and electrical technologies, which play a crucial role in the construction and operation processes. For example, tower cranes are used for hoisting large components and equipment and are indispensable in high-rise building construction; concrete mixers are used for preparing concrete; and power tools such as electric drills and saws are used for various processing and installation operations.

[0003] Among them, a concrete mixer is a machine that mixes cement, sand and gravel aggregates and water to prepare concrete mixture. However, on a construction site, it is usually an open and dusty environment. When the mixer works in such an environment, its heat dissipation system is prone to accumulate dust and debris. Especially for the heat dissipation fan and heat sink, if blocked by dust, it will seriously affect the heat dissipation effect. Summary of the Invention

[0004] The purpose of the present invention is to overcome the defects of the prior art and provide a heat dissipation structure for building electromechanical equipment, which reduces the influence of dust by setting a filter screen at the position of the air inlet pipe.

[0005] The technical solution to achieve the above purpose is: 1. A heat dissipation structure for building electromechanical equipment, comprising:

[0006] An operation box, in which a heat dissipation chamber is formed;

[0007] A first chamber formed in the operation box and located at the side of the heat dissipation chamber, and a plurality of first air holes are communicated between the first chamber and the heat dissipation chamber;

[0008] A second chamber formed in the operation box and opposite to the first chamber, the second chamber is arranged at the side of the heat dissipation chamber, and the second chamber is communicated with the heat dissipation chamber;

[0009] An air inlet cylinder arranged at the end of the operation box, an air inlet fan is installed in the air inlet cylinder, a filter screen is arranged at the mouth of the air inlet cylinder, and the air inlet cylinder is communicated with the first chamber; and

[0010] A plurality of second air holes formed on the side of the operation box and communicated with the second chamber.

[0011] Furthermore, a semiconductor refrigeration sheet is installed in the first chamber, and the cold end of the semiconductor refrigeration sheet faces the first chamber.

[0012] Further, a spoiler is installed in the first chamber, and the semiconductor refrigerating sheet is arranged between the spoiler and the air inlet cylinder.

[0013] Further, a baffle is slidably arranged on one side of the operation box where the second air hole is formed. The baffle is provided with a third air hole corresponding to the second air hole. By sliding the baffle, the second air hole and the third air hole are overlapped.

[0014] Further, a connecting chamber is communicated between the first chamber and the second chamber. The baffle is provided with a bent plate corresponding to the connecting chamber. The bent plate is clamped in the connecting chamber. By sliding the baffle, the bent plate is disengaged from the connecting chamber to communicate the first chamber and the second chamber.

[0015] Further, an electric push rod is arranged in the operation box. The end of the electric push rod is fixedly connected to the baffle. By starting the electric push rod, the baffle is pushed to slide.

[0016] Further, a sponge pad is arranged in the second chamber, and a humidity sensor is arranged on the sponge pad.

[0017] Further, a valve plate is rotatably arranged in the air inlet cylinder. The size of the valve plate is adapted to the inner diameter of the air inlet cylinder. By rotating the valve plate, the air inlet cylinder is opened or closed.

[0018] Further, a control handle is formed at the top of the valve plate, and a part of the control handle extends out of the top of the air inlet cylinder to form an operation section.

[0019] Further, a magnetic ball is installed on one side of the filter net close to the valve plate. Magnetic grooves are formed on opposite sides of the valve plate corresponding to the magnetic ball. When the valve plate rotates to be perpendicular to the filter net, the magnetic grooves are adsorbed on the magnetic ball.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The air flow is conveyed to the first chamber by the intake fan. At this time, the semiconductor refrigerating sheet can cool the inside of the first chamber, and at the same time, the air flow entering the first chamber can also be cooled. Then, it enters the heat dissipation chamber through the first air hole to cool the electronic components, improving the heat dissipation effect. The air flow in the heat dissipation chamber can enter the inside of the second chamber through the communication groove and finally be discharged from the second air hole. Through the above operations, the replacement of the air flow inside the operation box can be completed, further improving the heat dissipation effect. Description of the Drawings

[0022] Figure 1 It is a usage effect diagram of a heat dissipation structure for building mechanical and electrical equipment;

[0023] Figure 2 It is a sectional view effect diagram of a heat dissipation structure for building mechanical and electrical equipment;

[0024] Figure 3 It is Figure 2 the enlarged effect diagram at position A in

[0025] Figure 4 It is an internal structure diagram of a heat dissipation structure for building mechanical and electrical equipment;

[0026] Figure 5 It is a communication effect diagram of the first chamber and the second chamber of a heat dissipation structure for building mechanical and electrical equipment;

[0027] Figure 6 It is a sectional view effect diagram of a heat dissipation structure for building mechanical and electrical equipment;

[0028] Figure 7 It is Figure 6 the enlarged effect diagram at position B in

[0029] Legend description: 1. Mixer; 2. Operation box; 3. Air inlet duct; 4. Filter screen; 5. Baffle; 6. Second air hole; 7. Third air hole; 8. First air hole; 9. First chamber; 10. Turbulence plate; 11. Semiconductor refrigeration sheet; 12. Intake fan; 13. Valve plate; 14. Control board; 15. Electric push rod; 16. Second chamber; 17. Sponge pad; 18. Humidity sensor; 19. Connection chamber; 20. Tooth plate; 21. Control handle; 22. Rotating gear; 23. Magnetic ball; 24. Connecting rod. Specific implementation mode

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0031] Refer to Figure 1 , a heat dissipation structure for building mechanical and electrical equipment, including: an operation box 2, a heat dissipation chamber is formed inside the operation box 2; a first chamber 9 formed inside the operation box 2 and located at the side of the heat dissipation chamber, several first air holes 8 are communicated between the first chamber 9 and the heat dissipation chamber; a second chamber 16 formed inside the operation box 2 and opposite to the first chamber 9, the second chamber 16 is arranged at the side of the heat dissipation chamber, and the second chamber 16 is communicated with the heat dissipation chamber; an air inlet duct 3 arranged at the end of the operation box 2, an intake fan is installed inside the air inlet duct 3, a filter screen 4 is arranged at the mouth of the air inlet duct 3, and the air inlet duct 3 is communicated with the first chamber 9; and several second air holes 6 formed at the side of the operation box 2 and communicated with the second chamber 16.

[0032] In the present invention, a preferred embodiment is as follows: The operation box 2 houses electrical components for controlling the startup of the mixer 1. The first chamber 9 is provided at the bottom of the heat dissipation chamber, the second chamber 16 is provided at the top of the heat dissipation chamber, and the air inlet tube 3 is provided at the end of the operation box 2. By starting the intake fan 12, external air can be conveyed into the interior of the operation box 2. The intake fan 12 is built-in with a motor. A heat dissipation chamber for storing electronic components is formed inside the operation box 2. The gas conveyed by the intake fan 12 can directly enter the first chamber 9. The first chamber 9 is communicated with the heat dissipation chamber through the first air hole 8. Through the provided first air hole 8, the gas entering the first chamber 9 can be transmitted into the heat dissipation chamber. By allowing external cold air to enter the heat dissipation chamber, the electronic components inside the heat dissipation chamber can be cooled. As the airflow in the heat dissipation chamber increases, the airflow in the heat dissipation chamber enters the interior of the second chamber 16. At the same time, the upward thermal flow also enters the interior of the second chamber 16 through the communication groove and finally discharges through the second air hole 6. Through the above operations, the replacement of the airflow inside the operation box 2 can be completed, thereby achieving internal heat dissipation.

[0033] Furthermore, a communication groove is formed inside the operation box 2. The communication groove is located at the end of the operation box 2 away from the air inlet tube 3. The second chamber 16 is communicated with the heat dissipation chamber through the communication groove. A second air hole 6 is formed at the top end of the operation box 2.

[0034] Further, a semiconductor refrigeration sheet 11 is installed inside the first chamber 9, and the cold end of the semiconductor refrigeration sheet 11 faces the first chamber 9. Preferably, the cold end of the semiconductor refrigeration sheet 11 faces the first chamber 9, and the hot end of the semiconductor refrigeration sheet 11 faces the housing of the operation box 2 to transfer heat outside the operation box 2.

[0035] Further, a spoiler 10 is installed inside the first chamber 9, and the semiconductor refrigeration sheet 11 is arranged between the spoiler 10 and the air inlet tube 3.

[0036] Furthermore, when external airflow enters the first chamber 9 through the intake fan 12, at this time, the semiconductor refrigeration sheet 11 provided can cool down the interior of the first chamber 9, and at the same time, the airflow entering the first chamber 9 can also be cooled, thereby improving the heat dissipation effect of the airflow on the electronic components inside the heat dissipation chamber. The spoiler 10 provided can also block the airflow, increasing the residence time of the airflow inside the first chamber 9, thereby improving the airflow cooling effect and further enhancing the heat dissipation effect inside the operation box 2.

[0037] Further, a baffle 5 is slidably provided on the side of the operation box 2 where the second air hole 6 is formed. The baffle 5 is provided with a third air hole 7 corresponding to the second air hole 6. By sliding the baffle 5, the second air hole 6 and the third air hole 7 are overlapped.

[0038] In the present invention, a preferred embodiment is as follows: The first chamber 9 and the second chamber 16 are connected and communicate to form a connecting chamber 19. A baffle 5 is slidably mounted on the top end of the operation box 2. A third air hole 7 is formed in the baffle 5. The diameter of the third air hole 7 is the same as that of the second air hole 6. A bent plate is fixedly connected to the bottom end of the baffle 5. The bent plate extends into the operation box 2 and is disposed in the connecting chamber 19. When the baffle 5 slides to make the second air hole 6 and the third air hole 7 correspond and overlap with each other, the bent plate is clamped in the connecting chamber 19 and seals the first chamber 9 and the second chamber 16. When the baffle 5 slides to make the third air hole 7 and the second air hole 6 misaligned with each other, the bent plate disengages from the connecting chamber 19, so that the first chamber 9 and the second chamber 16 communicate with each other.

[0039] Preferably, after the baffle 5 slides, at this time the second air hole 6 and the third air hole 7 correspond to each other, and the bottom end of the baffle 5 will separate the second chamber 16 from the first chamber 9. When the baffle 5 slides inside, the connecting chamber 19 between the first chamber 9 and the second chamber 16 is closed. At this time, the intake fan 12 can only deliver the air flow into the first chamber 9 and flow into the second chamber 16 through the heat dissipation chamber, and at this time the heat exchange inside the operation box 2 will not be affected. When the baffle 5 does not slide, the second air hole 6 and the third air hole 7 are misaligned. At this time, the baffle 5 will block the second air hole 6, and the bent plate disengages from the connecting chamber 19. At this time, the first chamber 9 and the second chamber 16 communicate with each other. In rainy days, the second air hole 6 can be blocked, and at this time the rainwater will not enter the second chamber 16 through the second air hole 6, so that the inside of the operation box 2 is always kept dry, improving the use effect.

[0040] Furthermore, the connecting chamber 19 and the bent plate are disposed on one side of the operation box 2 close to the air inlet cylinder 3.

[0041] Further, an electric push rod 15 is disposed in the operation box 2. The end of the electric push rod 15 is fixedly connected to the baffle 5. By starting the electric push rod 15, the baffle 5 is pushed to slide.

[0042] Further, a sponge pad 17 is disposed in the second chamber 16, and a humidity sensor 18 is disposed on the sponge pad 17. Preferably, the humidity sensor 18 disposed in the second chamber 16 can monitor the humidity inside the sponge pad 17. After it rains, the rainwater will fall on the sponge pad 17 through the second air hole 6 and the third air hole 7. By monitoring the threshold value of the humidity sensor 18 and controlling the electric push rod 15 to start, the baffle 5 is pushed to block the second air hole 6, so that the first chamber 9 and the second chamber 16 communicate with each other. At this time, the operation box 2 can be used in rainy days. Even if it is not used, the possibility of the mixer 1 being damaged by rain can be avoided.

[0043] Further, a valve plate 13 is rotatably arranged in the air inlet tube 3. The size of the valve plate 13 is adapted to the inner diameter of the air inlet tube 3. By rotating the valve plate 13, the air inlet tube 3 can be opened or closed. When the external humidity is too high, the raft plate can be rotated to close the air inlet tube 3 with the raft plate.

[0044] Further, a control handle 21 is formed at the top of the valve plate 13, and a part of the control handle 21 extends out of the top of the air inlet tube 3 to form an operation section.

[0045] Still further, a rotating gear 22 is formed on the operation section. A control plate 14 is fixed to the part of the bent plate exposed outside the operation box 2. A toothed plate 20 is formed on the control plate 14 corresponding to the rotating gear 22, and the rotating gear 22 meshes with the toothed plate 20. When the baffle 5 slides and blocks the second air hole 6, it will simultaneously drive the control plate 14 to slide in the direction of getting out of the inside of the operation box 2. At this time, the toothed plate 20 arranged on the control plate 14 cooperates with the rotating gear 22 arranged on the control handle 21, so as to drive the valve plate 13 to rotate and block the inside of the air inlet tube 3; when the baffle 5 slides and makes the second air hole 6 overlap with the third air hole 7, it will simultaneously drive the control plate 14 to slide in the direction of entering the inside of the operation box 2. At this time, the toothed plate 20 arranged on the control plate 14 cooperates with the rotating gear 22 arranged on the control handle 21, so as to drive the valve plate 13 to rotate and open the inside of the air inlet tube 3.

[0046] Further, a magnetic ball 23 is installed on one side of the filter net 4 close to the valve plate 13. Magnetic grooves are formed on the opposite sides of the valve plate 13 corresponding to the magnetic ball 23. When the valve plate 13 rotates to be perpendicular to the filter net 4, the magnetic grooves adsorb on the magnetic ball 23. Preferably, a connecting rod 24 is fixedly installed at one end of the filter net 4 close to the valve plate 13, and a magnetic ball 23 is fixedly connected to one end of the connecting rod 24 close to the valve plate 13.

[0047] Further, the filter net 4 is of an elastic structure.

[0048] Still further, when the valve plate 13 rotates and opens the air inlet tube 3, the magnetic grooves formed on the valve plate 13 will adsorb on the magnetic ball 23 at this time. When the valve plate 13 rotates to block the air inlet tube 3, the rotation of the valve plate 13 will pull the magnetic ball 23 and drive the filter net 4 to deform until the valve plate 13 is separated from the magnetic ball 23. At this time, the filter net 4 will rebound and vibrate, shaking off the dust on the surface and improving the filtering effect.

[0049] The specific use of this application includes the following steps:

[0050] S1: Start the intake fan 12 to deliver air flow to the first chamber 9, then enter the heat dissipation chamber through the first air holes 8, and finally enter the interior of the second chamber 16 through the communication groove and be discharged through the second air holes 6 to complete air flow replacement.

[0051] S2: Control the electric push rod 15 to start through the humidity sensor 18 and push the baffle 5. At this time, the baffle 5 can block the second air holes 6, and at the same time drive the control board 14 and the toothed plate 20 to move, and the control rod drives the valve plate 13 to block the air inlet cylinder 3, so that the first chamber 9 is communicated with the second chamber 16 to enable internal air circulation.

[0052] The usage process of a heat dissipation structure for building electromechanical equipment according to the present invention will be described below.

[0053] When external air flow enters the first chamber 9 through the intake fan 12, the semiconductor refrigeration sheet 11 provided can cool down the interior of the first chamber 9 at this time, and at the same time can also cool down the air flow entering the first chamber 9. Then it enters the heat dissipation chamber through the first air holes 8 to cool down the electronic components, improving the heat dissipation effect. The air flow in the heat dissipation chamber can enter the interior of the second chamber 16 through the communication groove and finally be discharged from the second air holes 6. Through the above operations, the air flow replacement inside the operation box 2 can be completed, thereby realizing internal heat dissipation.

[0054] On rainy days, the humidity sensor 18 provided in the second chamber 16 can monitor the humidity inside the sponge pad 17. Rainwater will fall on the sponge pad 17 through the second air holes 6 and the third air holes 7. Through the monitoring of the humidity sensor 18, the electric push rod 15 is controlled to start and the baffle 5 is pushed to block the second air holes 6, so that the first chamber 9 is communicated with the second chamber 16. Finally, the valve plate 13 is controlled to rotate to block the air inlet cylinder 3. At this time, the operation box 2 can be used on rainy days. Even if it is not used, the possibility of the mixer 1 being damaged by rain on rainy days can be avoided.

[0055] The present invention has been described in detail with reference to the accompanying drawings and embodiments. Those of ordinary skill in the art can make various variations to the present invention according to the above description. Therefore, some details in the embodiments should not constitute a limitation to the present invention, and the protection scope of the present invention will be defined by the scope of the appended claims.

Claims

1. A heat dissipation structure for building mechanical and electrical equipment, characterized in that, Including: An operation box, in which a heat dissipation chamber is formed; A first chamber formed in the operation box and located at the side of the heat dissipation chamber, and a plurality of first air holes are communicated between the first chamber and the heat dissipation chamber; A second chamber formed in the operation box and disposed opposite to the first chamber, the second chamber is disposed at the side of the heat dissipation chamber, and the second chamber is communicated with the heat dissipation chamber; An air inlet cylinder disposed at the end of the operation box, an air inlet fan is installed in the air inlet cylinder, a filter screen is disposed at the mouth of the air inlet cylinder, and the air inlet cylinder is communicated with the first chamber; and A plurality of second air holes formed at the side of the operation box and communicated with the second chamber.

2. The heat dissipation structure for building electromechanical equipment according to claim 1, characterized in that: A semiconductor refrigeration sheet is installed in the first chamber, and the cold end of the semiconductor refrigeration sheet faces the first chamber.

3. The heat dissipation structure for building electromechanical equipment according to claim 2 is characterized in that: A spoiler is installed in the first chamber, and the semiconductor refrigeration sheet is disposed between the spoiler and the air inlet cylinder.

4. A heat dissipation structure for building mechanical and electrical equipment according to claim 1, characterized in that: A baffle is slidably disposed on one side of the operation box where the second air hole is formed, and a third air hole is formed in the baffle corresponding to the second air hole. By sliding the baffle, the second air hole and the third air hole overlap.

5. The heat dissipation structure for building mechanical and electrical equipment according to claim 4, characterized in that: A connecting chamber is communicated between the first chamber and the second chamber, and a bent plate is formed in the baffle corresponding to the connecting chamber. The bent plate is clamped in the connecting chamber. By sliding the baffle, the bent plate is disengaged from the connecting chamber to communicate the first chamber and the second chamber.

6. A heat dissipation structure for building mechanical and electrical equipment according to claim 4, characterized in that: An electric push rod is disposed in the operation box, and the end of the electric push rod is fixedly connected to the baffle. By starting the electric push rod, the baffle is pushed to slide.

7. A heat dissipation structure for building mechanical and electrical equipment according to claim 1, characterized in that: A sponge pad is disposed in the second chamber, and a humidity sensor is disposed on the sponge pad.

8. A heat dissipation structure for building mechanical and electrical equipment according to claim 1, characterized in that: A valve plate is rotatably disposed in the air inlet cylinder, and the size of the valve plate is adapted to the inner diameter of the air inlet cylinder. By rotating the valve plate, the air inlet cylinder is opened or closed.

9. The heat dissipation structure for building mechanical and electrical equipment according to claim 8, characterized in that: A control handle is formed at the top of the valve plate, and a part of the control handle extends out of the top of the air inlet cylinder to form an operation section.

10. A heat dissipation structure for building mechanical and electrical equipment according to claim 8, characterized in that: A magnetic ball is installed on one side of the filter screen close to the valve plate, and magnetic grooves are formed on the opposite sides of the valve plate corresponding to the magnetic ball. When the valve plate rotates to be perpendicular to the filter screen, the magnetic grooves are adsorbed on the magnetic ball.

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