Electronic equipment

Abstract

The invention provides electronic equipment, the electronic equipment can comprise a mainboard, a target piece and a first structure and / or a second structure, and the mainboard is at least used for setting an electronic device; the target piece is opposite to the surface, provided with the electronic device, of the mainboard and can radiate heat in at least two dimensions; the first structure is at least used for conducting heat generated by the electronic device to the target piece, and the second structure is used for preventing short circuit between the target piece and the mainboard.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to an electronic device. Background Art

[0002] Inside an electronic device, heat is generated during the operation of electronic components. For this reason, heat pipes are provided inside the electronic device, and both ends of the heat pipes respectively correspond to the electronic components and the heat dissipation holes on the housing, so that the heat generated by the electronic components can be conducted to the heat dissipation holes through the heat pipes and discharged.

[0003] However, there is still a problem of heat accumulation inside the electronic device. Summary of the Invention

[0004] The present disclosure provides an electronic device, and the technical solution is as follows:

[0005] To solve the above technical problems, the present disclosure provides an electronic device, which may include: a main board, a target component, and a first structure and / or a second structure. The main board is at least used for arranging electronic components; the target component faces the surface of the main board where the electronic components are arranged, and can radiate heat at least in two dimensions; the first structure is at least used for conducting the heat generated by the electronic components to the target component, and the second structure is used to prevent a short circuit between the target component and the main board.

[0006] In some embodiments, the first structure includes: a first heat conducting member and a second heat conducting member. The first heat conducting member and the second heat conducting member are different heat conducting media. At least part of the first heat conducting member is arranged adjacent to the electronic component. The second heat conducting member is clamped between the first heat conducting member and the target component, and can conduct the heat of the first heat conducting member to the target component, and the target component can radiate heat at least in three dimensions.

[0007] In some embodiments, the target component is arranged inside the housing of the electronic device and is located between the main board and an inner wall of the housing; or, the target component belongs to the housing of the electronic device.

[0008] In some embodiments, one side surface of the main board has at least one first area and at least one second area. The distance between the first area and the first heat conducting member is less than the distance between the second area and the first heat conducting member. Both the first area and the second area are used for arranging electronic components, and the unit heat generation of the electronic components in the first area is greater than the unit heat generation of the electronic components in the second area; the orthographic projection of the target component onto the main board at least coincides with the main board.

[0009] In some embodiments, the electronic device may further include: an air outlet component disposed in the thickness direction of the main board and opposite to the target component, the air outlet component having a first air outlet and / or a second air outlet; the first air outlet is opposite to the heat dissipation area of the housing of the electronic device, and the thickness of the housing corresponding to the heat dissipation area is less than the thickness of the housing corresponding to the area outside the heat dissipation area; wherein at least a part of the first heat conducting member is adjacent to the first air outlet and the heat dissipation area; the second air outlet is opposite to the electronic components in the first area.

[0010] In some embodiments, the first heat conducting member includes: at least one heat conducting tube, a section in the extending direction of the heat conducting tube is located between the main board and the target component and is opposite to a plurality of first areas of the main board, and one end in the extending direction of the heat conducting tube extends out of the main board and the target component and corresponds to be between the first air outlet and the heat dissipation area; the first structure further includes: fins, a part of the fins is located between the main board and the at least one heat conducting tube, and at least one convex part is provided on the part located outside the heat conducting tube and the main board, and the surface of the convex part is used for radiating heat.

[0011] In some embodiments, the target component is disposed in the housing of the electronic device and is a metal component; the second structure includes at least one of the following settings: being electrically connected to the grounding area of the main board and the target component respectively; forming an insulating distance between the main board and the target component; an insulating material sandwiched between the main board and the target component.

[0012] In some embodiments, the main board is provided with a grounding line, the grounding line having at least one first grounding position and at least one second grounding position; the target component has at least one first grounding point and at least one second grounding point; the second structure includes: a first grounding structure and a second grounding structure, the first grounding point is electrically connected to the first grounding position through the first grounding structure, and the second grounding point is electrically connected to the second grounding position through the second grounding structure.

[0013] In some embodiments, a plurality of the first grounding points and a plurality of the second grounding points are equidistantly distributed on the target component, and the distance between the first grounding point and the corresponding first grounding position and the distance between the second grounding point and the corresponding second grounding position satisfy a consistency condition.

[0014] In some embodiments, at least part of the edge of the target component is bent towards the main board, and the bent part includes a first part and a second part. There is an insulating distance between the first part and the main board or an insulating material is clamped therebetween, and the second part is electrically connected to the first grounding position of the main board; the bent part includes at least one of the following functions: increasing the area of heat radiation of the target component; blocking the airflow between the main board and the target component; blocking the noise between the main board and the target component.

[0015] In some embodiments, the first grounding structure includes a metal-insulating clip, and the metal-insulating clip includes: a connecting part, a first clamping arm and a second clamping arm. The connecting part is arranged at the first grounding position and is electrically connected to the first grounding position. The first clamping arm and the second clamping arm are respectively connected to both ends of the connecting part, and a clamping space for clamping the second part is formed between the first clamping arm and the second clamping arm. When the second part is clamped in the clamping space, there is a gap between the second part and the connecting part; and / or, the second grounding structure includes: a metal connecting piece, and the metal connecting piece detachably passes through the target component and is fixed and electrically connected to the second grounding position of the main board.

[0016] The above description is only an overview of the technical solutions of the present disclosure. In order to be able to understand the technical means of the present disclosure more clearly and implement them according to the content of the description, the following takes the preferred embodiments of the present disclosure and combines the accompanying drawings to describe in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0018] Figure 1 It is a partial exploded structural schematic diagram of the electronic device provided by the present disclosure;

[0019] Figure 2 It is a partial structural schematic of the electronic device provided by the present disclosure Figure 1 ;

[0020] Figure 3 It is a partial perspective schematic diagram of the electronic device provided by the present disclosure;

[0021] Figure 4 It is a partial structural schematic of the electronic device provided by the present disclosure Figure 2 ;

[0022] Figure 5 Partial structural schematic of the electronic device provided by the present disclosure Figure 3 ;

[0023] Figure 6 Partial structural schematic of the electronic device provided by the present disclosure Figure 4 ;

[0024] Figure 7 Partial structural schematic of the electronic device provided by the present disclosure Figure 5 ;

[0025] Figure 8 Partial cross-sectional structural schematic of the electronic device provided by the present disclosure Figure 1 ;

[0026] Figure 9 Partial cross-sectional structural schematic of the electronic device provided by the present disclosure Figure 2 .

[0027] Description of reference numerals:

[0028] 100, electronic device; 10, main board; 101, first region; 102, second region; 103, first grounding position; 104, second grounding position; 20, target component; 2011, first grounding point; 2012, second grounding point; 202, bent portion; 2021, first part; 2022, second part; 30, first structure; 310, first heat conducting component; 3101, heat conducting tube; 320, second heat conducting component; 330, fin; 3301, convex portion; 340, target part; 40, second structure; 401, first grounding structure; 4011, connecting portion; 4012, first clamping arm; 4013, second clamping arm; 402, second grounding structure; 50, electronic device; 60, air outlet assembly; 601, first air outlet; 602, second air outlet; 603, air inlet. Detailed implementation manners

[0029] The following further describes in detail the implementation manners of the present disclosure with reference to the accompanying drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms, is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0030] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, the components of materials, numerical expressions and values described in these embodiments should be construed as merely exemplary, rather than as limitations.

[0031] It should be noted that in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality" is greater than or equal to two; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc. is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0032] In addition, the "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. Words such as "including" or "comprising" mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0033] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances. When it is described that a specific device is located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0034] All terms used in the present disclosure have the same meaning as understood by those of ordinary skill in the art to which the present disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as those, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless specifically defined as such here.

[0035] Technologies, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods and devices should be regarded as part of the specification.

[0036] Inside an electronic device, heat is generated during the operation of electronic components. For this reason, a heat pipe is provided inside the electronic device, and the two ends of the heat pipe respectively correspond to the electronic component and the heat dissipation holes on the housing, so that the heat generated by the electronic component can be conducted to the heat dissipation holes through the heat pipe and discharged.

[0037] However, there is still a problem of heat accumulation inside the electronic device.

[0038] The inventors of the present application have found that an electronic device can be designed, which can be provided with a main board and a target component. At least electronic components can be provided on the main board, and the target component can be opposite to the surface of the main board where the electronic components are provided, so that the heat generated during the operation of the electronic components can be transmitted to the target component, and then the heat can be radiated at least in at least two dimensions on the surface of the target component facing away from the main board. In this way, the temperature of the main board and the electronic components thereon can be reduced, and thus the probability of heat accumulation in the electronic device can be reduced. At least one of a first structure and a second structure can also be provided in the electronic device. When the first structure is provided, the first structure can guide the heat generated by the electronic components on the main board to the target component through itself, so as to further reduce the temperature of the main board and the electronic components thereon, and thus further reduce the probability of heat accumulation in the electronic device; when the second structure is provided, the second structure can prevent short circuit between the target component and the main board, so as to improve the safety performance of the electronic device.

[0039] The present disclosure provides an electronic device 100. Refer to Figures 1 to 9 As shown, the electronic device 100 may include: a main board 10, a target component 20, and at least one of a first structure 30 and a second structure 40. The main board 10 can be at least used to provide electronic components 50; the target component 20 can be opposite to the surface of the main board 10 where the electronic components 50 are provided and can radiate heat in at least two dimensions; the first structure 30 can at least be used to conduct the heat generated by the electronic components 50 to the target component 20, and the second structure 40 can be used to prevent short circuit between the target component 20 and the main board 10.

[0040] The main board 10 can be the core circuit board in the electronic device 100, responsible for connecting and controlling various electronic components 50. The electronic components 50 can include but are not limited to: a central processing unit (CPU), a graphics processing unit (GPU), a power management chip, an audio decoding chip, etc.; non-electronic components can also be provided on the main board 10. The non-electronic components can include but are not limited to: solder materials for fixing the electronic components 50, screws for fixing the electronic components 50, etc. The main board 10 can be a plate-shaped member with a regular shape such as a rectangle, a circle, a pentagon, or an irregular shape. The plate-shaped member can have a first surface and a second surface facing away from each other, and the first surface can be provided with the electronic components 50 and non-electronic components.

[0041] The target component 20 can conduct the heat generated by structures such as the electronic device 50 to itself and radiate the heat in a direction away from structures such as the electronic device 50, so as to reduce the heat of structures such as the electronic device 50. The target component 20 can be a plate-shaped component with regular shapes such as rectangular, circular, pentagonal, or irregular shapes; its shape can be the same as or different from the shape of the main board 10; its orthographic projection onto the main board 10 can coincide with or partially coincide with the main board 10; it can be parallel or non-parallel to the main board 10; it can be made of materials such as copper, aluminum, graphene, etc. For example: The target component 20 can be a thin metal plate, which can be parallel to the main board 10 and its orthographic projection onto the main board 10 coincides with the main board 10, so that the peripheral surfaces of the target component 20 and the main board 10 are flush, which can facilitate the structural arrangement on the peripheries of the main board 10 and the target component 20, and the space on the side of the target component 20 facing away from the main board 10 can radiate heat in at least two dimensions of the first direction and the second direction; here, when the target component 20 is horizontally arranged, the first direction and the second direction can be the first horizontal direction (such as the X direction in Figure 1 etc.) and the second horizontal direction (such as the Y direction in Figure 1 etc.) that are perpendicular to each other, or can be the first horizontal direction and the second horizontal direction that form an obtuse or acute angle with each other.

[0042] The first structure 30 can include a heat-conducting material, and the heat-conducting material can direct the heat generated by the electronic device 50 on the main board 10 to the target component 20, and further reduce the phenomenon of heat accumulation in the electronic device 100 by radiating the heat in a direction away from the electronic device 50 through the target component 20.

[0043] The second structure 40 can insulate between the target component 20 and the main board 10, or can connect the target component 20 to the grounding line of the main board 10, or be arranged in other ways to prevent the risk of short circuit between the target component 20 and the main board 10.

[0044] In this article, the term "and / or" only describes the association relationship of associated objects, indicating three possible relationships that can exist. For example, A and / or B is specifically understood as: it can simultaneously include both A and B, A can exist alone, or B can exist alone, and it can have any one of the above three situations.

[0045] In one example, the electronic device 100 may include: a main board 10, a target component 20, and a first structure 30. The main board 10 may be used to arrange electronic components 50. The target component 20 may be opposite to the surface of the main board 10 where the electronic components 50 are arranged. The thickness surface of one circle of the target component 20 may be flush with the thickness surface of one circle of the main board 10. The surface of the target component 20 facing away from the main board 10 may radiate heat in two dimensions. The first structure 30 is at least used to conduct the heat generated by the electronic components 50 to the target component 20. Here, the heat generated during the operation of the electronic components 50 may be transmitted to the target component 20, which can be regarded as the first path. At the same time, the first structure 30 can guide the heat generated by the electronic components 50 to the target component 20 through itself, which can be regarded as the second path. Under the synchronous action of the first path and the second path, the probability of heat accumulation in the electronic device 100 can be reduced.

[0046] In one example, the electronic device 100 may include: a main board 10, a target component 20, and a second structure 40. The main board 10 may be used to arrange electronic components 50. The target component 20 may be opposite to the surface of the main board 10 where the electronic components 50 are arranged. The thickness surface of one circle of the target component 20 may be flush with the thickness surface of one circle of the main board 10. The surface of the target component 20 facing away from the main board 10 may radiate heat in at least two dimensions. The second structure 40 can be used to prevent short circuit between the target component 20 and the main board 10. Here, the heat generated during the operation of the electronic components 50 may be transmitted to the target component 20, reducing the probability of heat accumulation in the electronic device 100, and the second structure 40 can be used to prevent short circuit between the target component 20 and the main board 10, so as to improve the safety performance of the electronic device 100.

[0047] In one example, refer to Figures 1 to 7 As shown, the electronic device 100 may include: a main board 10, a target component 20, a first structure 30, and a second structure 40. The main board 10 may be used to arrange electronic components 50. The target component 20 may be opposite to the surface of the main board 10 where the electronic components 50 are arranged. The thickness surface of one circle of the target component 20 may be flush with the thickness surface of one circle of the main board 10. The surface of the target component 20 facing away from the main board 10 may radiate heat in two dimensions. The first structure 30 is at least used to conduct the heat generated by the electronic components 50 to the target component 20. The second structure 40 can be used to prevent short circuit between the target component 20 and the main board 10. Here, the heat generated during the operation of the electronic components 50 may be transmitted to the target component 20, which can be regarded as the first path. At the same time, the first structure 30 can guide the heat generated by the electronic components 50 to the target component 20 through itself, which can be regarded as the second path. Under the synchronous action of the first path and the second path, the probability of heat accumulation in the electronic device 100 can be reduced. The second structure 40 can be used to prevent short circuit between the target component 20 and the main board 10, so as to improve the safety performance of the electronic device 100.

[0048] In this embodiment, the electronic device 100 may be provided with at least one of a main board 10, a target component 20, a first structure 30, and a second structure 40. The target component 20 may be opposite to the surface of the main board 10 where electronic components 50 are provided, so that the heat generated by the electronic components 50 can be transmitted to the target component 20, and the heat can be radiated in two dimensions, namely, a first direction and a second direction, on the side of the target component 20 facing away from the main board 10. In this way, the temperature of the main board 10 and the electronic components 50 thereon can be reduced, and thus the probability of heat accumulation in the electronic device 100 can be decreased. When the first structure 30 is provided, the first structure 30 can conduct the heat generated by the electronic components 50 to the target component 20 through itself, so as to accelerate the speed and total amount of heat transmission from the electronic components 50 to the target component 20, and accelerate the total amount of heat radiated by the target component 20 per unit time, further reducing the temperature of the main board 10 and the electronic components 50 thereon, and further decreasing the probability of heat accumulation in the electronic device 100. When the second structure 40 is provided, the second structure 40 can prevent the risk of short circuit between the target component 20 and the main board 10, thereby improving the safety performance of the electronic device 100.

[0049] First aspect

[0050] In some embodiments, as shown in Figure 1 、 Figure 3 and Figure 4 the first structure 30 may include: a first heat conducting member 310 and a second heat conducting member 320. The first heat conducting member 310 and the second heat conducting member 320 may be different heat conducting media. At least a part of the first heat conducting member 310 may be disposed adjacent to the electronic components 50, and the second heat conducting member 320 may be sandwiched between the first heat conducting member 310 and the target component 20 and can conduct the heat of the first heat conducting member 310 to the target component 20, and the target component 20 can radiate heat in at least three dimensions.

[0051] Among them, a part of the first heat conducting member 310 may be close to the electronic components 50, so that the heat generated by the electronic components 50 can be quickly conducted to itself, and the second heat conducting member 320 sandwiched between the first heat conducting member 310 and the target component 20 can conduct the heat of the first heat conducting member 310 to the target component 20, and then more heat can be radiated through the target component 20. The first heat conducting member 310 and the second heat conducting member 320 may be different heat conducting media, which can combine the advantages of different heat conducting media.

[0052] When the target part 20 is a plate with thickness (for example, the thickness of the thin plate mentioned above is 0.1 mm, and the thickness of the plate with thickness here is greater than 0.1 mm, etc.), the target part 20 can radiate heat in two dimensions, namely, the first direction and the second direction on the side facing away from the main board 10, and can also radiate heat in a third direction through the thickness surface of the target part 20, so that the target part 20 can radiate heat in three dimensions, namely, the first direction, the second direction and the third direction, so as to further improve the heat dissipation efficiency of the target part 20.

[0053] The first heat conducting member 310 may include one or more heat conducting pipes 3101 (such as copper pipes, aluminum pipes, etc.) with heat conducting properties. Each heat conducting pipe 3101 may include a straight extending portion and / or a curved extending portion. The radial dimensions of different heat conducting pipes 3101 may be consistent or inconsistent. The wall thickness of different heat conducting pipes 3101 may be consistent or inconsistent. The directions of different heat conducting pipes 3101 may be consistent or inconsistent. For example, see Figure 1 , Figure 3 and Figure 4 As shown, the first heat-conducting member 310 may include three heat-conducting pipes 3101 arranged in parallel and attached to each other, and any heat-conducting pipe 3101 includes a straight section, a curved section and a bent section; the three heat-conducting pipes 3101 may be located at different positions so as to be able to conduct the heat at the corresponding positions to themselves respectively, thereby improving the heat conduction efficiency of the first heat-conducting member 310 per unit time; any heat-conducting pipe 3101 may have a straight section, a curved section and a bent section so as to be able to adapt to complex setting spaces.

[0054] The second heat-conducting member 320 may be a first heat-conducting part made of a metal material, or a second heat-conducting part made of a silicone base mixed with heat-conducting fillers such as aluminum oxide and boron nitride, or a third heat-conducting part made of other materials, or a fourth heat-conducting part formed by stacking, crossing, etc. the first heat-conducting part, the second heat-conducting part, and the third heat-conducting part. When the second heat-conducting member 320 is formed by stacking, crossing, etc. different materials, the heat-conducting advantages of multiple materials can be combined to form a more efficient heat-conducting structure, and the stacking, crossing, etc. can increase the mechanical strength of the second heat-conducting member 320.

[0055] The first heat conducting member 310 and the second heat conducting member 320 can be different heat conducting media, and the heat conducting advantages of different heat conducting media can be combined. For example, the first heat conducting member 310 is a high heat conducting material (such as copper, aluminum, etc.), and the second heat conducting member 320 is a low heat conducting material (such as a silica gel-based material mixed with heat conducting fillers such as alumina and boron nitride). The first heat conducting member 310 made of the high heat conducting material can quickly conduct the heat generated by the electronic device 50 to itself. The heat conduction speed of the second heat conducting member 320 made of the low heat conducting material is relatively slower than that of the first heat conducting member 310, and it can gradually disperse the heat conducted by the first heat conducting member 310, thereby reducing the probability of temperature accumulation in the second heat conducting member 320 itself and even the probability of temperature accumulation in the target member 20.

[0056] In one example, referring to Figure 1 、 Figure 3 and Figure 4 As shown, the first heat conducting member 310 can include three heat conducting tubes 3101 made of copper and having the same extending trajectory. The middle sections of the three heat conducting tubes 3101 can be correspondingly located between the main board 10 and the target member 20. The second heat conducting member 320 in the form of a sheet made of a silica gel material mixed with alumina is clamped between the three heat conducting tubes 3101 and the target member 20. In this way, the high heat conductivity material of the first heat conducting member 310 can quickly direct the heat of the electronic device 50 to the second heat conducting member 320, and the second heat conducting member 320 can diffuse the heat transmitted by the first heat conducting member 310 in itself to evenly conduct it to the target member 20 with a thickness, so that the target member 20 can perform uniform heat radiation, further reducing the problem of heat concentration in the second heat conducting member 320 and the target member 20; moreover, the silica gel material of the second heat conducting member 320 has elasticity to provide buffering during the relative shaking between the target member 20 and the main board 10.

[0057] In this embodiment, the first heat conducting member 310 and the second heat conducting member 320 can cooperate to direct the heat generated by the electronic device 50 on the main board 10 to the target member 20, enabling the target member 20 to radiate heat in three-dimensional directions, reducing the probability of heat accumulation in the electronic device 100, and since the first heat conducting member 310 and the second heat conducting member 320 can be different heat conducting media, the heat conducting advantages of different materials of the first heat conducting member 310 and the second heat conducting member 320 can be combined to improve the heat conducting quality.

[0058] In some embodiments, referring to Figures 1 to 3 As shown, the target member 20 can be disposed within the housing of the electronic device 100 and located between the main board 10 and an inner wall of the housing; or, the target member 20 can belong to the housing of the electronic device 100.

[0059] That is to say, the target component 20 can be a structure independent of the housing of the electronic device 100, or a part of the housing. For example: Figures 1 to 3 As shown in Figures 1 to 3 , it can be a structure where the electronic device 100 does not have a housing. The target component 20 can be independent of the housing of the electronic device 100 and be located inside the housing. Another example: The housing of the electronic device 100 can be formed by enclosing multiple plate structures, and a part or all of one plate structure is the target component 20.

[0060] In this embodiment, when the target component 20 is independent of the housing of the electronic device 100, the target component 20 can be a structure that radiates heat, and at the same time, it can also be a setting carrier for other structures inside the electronic device 100. For example: The side of the target component 20 facing away from the main board 10 can be a setting carrier for the keyboard structure of the electronic device 100. Another example: The side of the target component 20 facing away from the main board 10 can be a setting carrier for the touchpad of the electronic device 100. When the target component 20 belongs to the housing of the electronic device 100, the target component 20 can be a structure that radiates heat and can reduce the space occupation inside the housing. The above two setting methods of the target component 20 can be flexibly selected.

[0061] In some embodiments, the side of the target component 20 facing away from the main board 10 can be a setting carrier for the keyboard structure of the electronic device 100 (such as a laptop, a tablet computer, etc.), and the thickness of the target component 20 corresponding to the positions of the keys of the keyboard structure can be less than the thickness of the target component 20 corresponding to the positions between two adjacent keys. In this way, the heat conducted to the target component 20 by the second heat conducting component 320 distributed in the part of the target component 20 corresponding to the keys can be less than the part distributed between the adjacent keys of the target component 20. When heat is generated during the operation of the keys, the probability of heat accumulation between the part of the target component 20 corresponding to the keys and the keys can be reduced.

[0062] In some embodiments, referring to Figures 5 to 7 As shown in Figures 5 to 7 , one side surface of the main board 10 can have at least one first area 101 and at least one second area 102. The distance between the first area 101 and the first heat conducting component 310 can be less than the distance between the second area 102 and the first heat conducting component 310. Both the first area 101 and the second area 102 can be used to set the electronic components 50, and the unit heat generation of the electronic components 50 in the first area 101 is greater than the unit heat generation of the electronic components 50 in the second area 102. The orthographic projection of the target component 20 onto the main board 10 can at least coincide with the main board 10.

[0063] The surface of the main board 10 facing the target component 20 may have one or more first regions 101, and may also have one or more second regions 102. The distance between the first region 101 and the first heat conducting component 310 is smaller than that between the second region 102 and the first heat conducting component 310, and the heat generation amount of the electronic device 50 arranged in the first region 101 is larger than that of the electronic device 50 arranged in the second region 102. In this way, the core heat generated by the electronic device 50 on the main board 10 (which may mainly be the electronic device 50 in the first region 101, etc.) can be conducted to the second heat conducting component 320 through the first heat conducting component 310, and then the heat can be quickly radiated through the target component 20 in contact with the second heat conducting component 320. In this way, the probability of heat accumulation on the main board 10 can be reduced. For example, referring to Figures 5 to 7 As shown, the number of the first regions 101 is two, and a central processing unit and a graphics processing unit can be respectively arranged; the number of the second regions 102 can be multiple, and the electronic devices 50 on different second regions 102 can be the same or different.

[0064] In some embodiments, referring to Figures 1 to 7 As shown, the electronic device 100 may further include: an air outlet assembly 60 arranged in the thickness direction of the main board 10 and facing the target component 20. The air outlet assembly 60 may have a first air outlet 601 and / or a second air outlet 602; the first air outlet 601 may be opposite to the heat dissipation area of the housing of the electronic device 100, and the thickness of the housing corresponding to the heat dissipation area may be smaller than the thickness outside the heat dissipation area of the housing; wherein, at least a part of the first heat conducting component 310 may be adjacent to the first air outlet 601 and the heat dissipation area; the second air outlet 602 may be opposite to the electronic device 50 in the first region 101.

[0065] The air outlet component 60 can output an air flow, which can accelerate the gas flow. When the air outlet component 60 has a first air outlet 601 and the first air outlet 601 is opposite to the heat dissipation area of the housing of the electronic device 100, the air outlet component 60 can send the air flow through the first air outlet 601, and then can discharge the heat between the first air outlet 601 and the heat dissipation area outside the electronic device 100 through the heat dissipation area. In this way, the temperature between the first air outlet 601 and the heat dissipation area is relatively low, and a part of the first heat conducting member 310 is adjacent to the first area 101 and is partially located between the first air outlet 601 and the heat dissipation area, which can enable the first heat conducting member 310 to quickly guide the heat of the first area 101 and its vicinity to the area between the first air outlet 601 and the heat dissipation area through itself, and a third path can be generated on the basis of the first path and the second path above, so as to further reduce the probability of heat accumulation in the electronic device 100. When the air outlet component 60 has a second air outlet 602 and the second air outlet 602 is opposite to the electronic component 50 in the first area 101, the air outlet component 60 can send the air flow through the second air outlet 602 to the space between the main board 10 and the target component 20, so as to quickly blow the heat of the electronic component 50 in the first area 101 and its surroundings to the nearby heat conducting first structure 30 and / or the target component 20 that can radiate heat. The air outlet component 60 can include a rotating shaft and fan blades connected to the rotating shaft. The rotating shaft can rotate under the drive of a drive structure (such as a motor, etc.), and the fan blades can move along with the rotation of the rotating shaft and generate an air flow.

[0066] The heat dissipation area of the housing can include one or more of the following: heat dissipation holes, thin plates, filters; when the heat dissipation area includes a filter, the heat inside the electronic device 100 can be discharged through the heat dissipation area, and foreign objects outside the electronic device 100 entering the electronic device 100 via the filter can be reduced.

[0067] In one example, see Figures 1 to 7As shown, a main board 10, a target component 20, a first structure 30, and two air outlet components 60 may be disposed inside the housing of the electronic device 100. Two first regions 101 and at least one second region 102 may be arranged in parallel on the main board 10. The two air outlet components 60 may be respectively located on both sides of the main board 10. The air outlet component 60 has an air inlet 603, a first air outlet 601, and a second air outlet 602. The two air inlets 603 of the two air outlet components 60 may both face the first inner wall of the housing. The two first air outlets 601 of the two air outlet components 60 may both face the second inner wall of the housing. The two second air outlets 602 of the two air outlet components 60 may respectively face the two opposite sides of the two electronic components 50 on the two first regions 101 of the main board 10. The target component 20 may be located between the main board 10 and the first inner wall and face the surface of the main board 10 where the electronic component 50 is disposed. The first structure 30 may include a first heat conducting member 310 and a second heat conducting member 320. Three heat conducting tubes 3101 of the first heat conducting member 310 may be arranged in parallel. The middle sections of the three heat conducting tubes 3101 may be located between the main board 10 and the target component 20 and face the two first regions 101, while the two ends of the three heat conducting tubes 3101 may respectively correspond to the two first air outlets 601. The second heat conducting member 320 may be clamped between the three heat conducting tubes 3101 and the target component 20. When the air outlet component 60 is operating, there is at least the following heat dissipation path. The first heat dissipation path: The first heat conducting member 310 may direct the heat of the electronic component 50 in the first region 101 to both ends of the first heat conducting member 310, and under the action of the airflow sent out from the two first air outlets 601 of the two air outlet components 60, it is discharged outside the electronic device 100 through the two heat dissipation regions of the second inner wall. The second heat dissipation path: The two second air outlets 602 of the two air outlet components 60 may blow the heat between the main board 10 and the target component 20 to the middle section of the first heat conducting member 310, and then it can be directed to the target component 20 through the second heat conducting member 320, so that the heat can be radiated through the target component 20.

[0068] In this embodiment, an air outlet component 60 may also be disposed inside the electronic device 100. The air outlet component 60 may accelerate the airflow inside the housing of the electronic device 100, so as to improve the heat dissipation efficiency and reduce the probability of heat accumulation inside the electronic device 100.

[0069] In some embodiments, refer to Figures 1 to 7As shown, the target component 20 can also cover the side of the air inlet 603 of the air outlet component 60 and expose the air inlet 603, so that the target component 20 can form a cover for the side of the air inlet 603 corresponding to the air outlet component 60 without interfering with the air intake of the air outlet component 60. This can not only make the air flow generated by the air outlet component 60 pass through the first air outlet 601 and / or the second air outlet 602 under the blocking effect of the cover, but also physically protect the side of the air inlet 603 of the air outlet component 60. At the same time, it can direct the heat generated during the operation of the air outlet component 60 to itself and further reduce the probability of heat accumulation in the air outlet component 60 by radiating heat itself.

[0070] In some embodiments, the surface of the second heat conducting member 320 near the second air outlet 602 can be provided with a honeycomb structure formed by periodically arranging a plurality of adjacent polygons (such as regular hexagons, equilateral triangles, squares, etc.). The noise generated during the process of the air flow sent out from the second air outlet 602 can enter the honeycomb cells, and the inner walls of the honeycomb cells can reflect the noise to weaken it, achieving the purpose of noise reduction.

[0071] In some embodiments, referring to Figure 1 , Figure 4 , Figure 6 and Figure 7 As shown, the first heat conducting member 310 can include: at least one heat conducting tube 3101. A section in the extending direction of the heat conducting tube 3101 can be located between the main board 10 and the target component 20 and can be opposite to a plurality of first regions 101 of the main board 10. One end in the extending direction of the heat conducting tube 3101 can extend out of the main board 10 and the target component 20 and correspond to be between the first air outlet 601 and the heat dissipation area. The first structure 30 can also include: fins 330. A part of the fins 330 can be located between the main board 10 and at least one heat conducting tube 3101, and the part located outside the heat conducting tube 3101 and the main board 10 can have at least one convex portion 3301, and the surface of the convex portion 3301 can be used for radiating heat.

[0072] The middle section of the heat pipe 3101 in the extension direction can be located between the main board 10 and the target part 20, so that the middle section of the heat pipe 3101 can be closer to the first area 101 of the main board 10 and the target part 20, so as to shorten the heat conduction path from the first area 101 to the first heat conducting member 310, and the conduction path between the second heat conducting member 320 and the target part 20, thereby accelerating the heat dissipation efficiency of the heat dissipation path through the first heat conducting member 310, the second heat conducting member 320 and the target part 20. One end and / or both ends of the heat pipe 3101 in the extension direction can extend out of the main board 10 and the target part 20, and extend to the space between the first air outlet 601 and the heat dissipation zone, and the airflow sent out from the first air outlet 601 blows toward the heat dissipation zone, so that the temperature between the first air outlet 601 and the heat dissipation zone is low, so that the heat absorbed by the heat pipe 3101 itself can be quickly conducted to the space between the first air outlet 601 and the heat dissipation zone with low temperature along the extension direction of the heat pipe 3101, and then can be dissipated through the heat dissipation zone.

[0073] The fin 330 may be partially located between the mainboard 10 and the heat pipe 3101, and partially located outside the heat pipe 3101 and the mainboard 10 and having a protrusion 3301. In this way, the fin 330 located between the mainboard 10 and the heat pipe 3101 can direct the heat of the mainboard 10 and the heat of the heat pipe 3101 to itself, and after being conducted to the protrusion 3301 by itself, the heat can be radiated through the peripheral surface of the protrusion 3301 and the surface connected to the peripheral surface and facing away from the fin 330. The protrusion 3301 may be one or more protrusions on at least one side surface of the fin 330. In the case of multiple protrusions, the multiple protrusions may be arranged regularly, for example: see Figure 1 , Figure 4 , Figure 6 and Figure 7 As shown, the plurality of protrusions may all be in the shape of long strips, of uniform size, and arranged in sequence along the same direction, so that the protrusion 3301 may have a beautiful visual effect while radiating heat evenly.

[0074] In some embodiments, see Figures 1 to 8 As shown, the target part 20 can be set in the shell of the electronic device 100 and can be a metal part; the second structure 40 can include at least one of the following settings: electrically connected to the grounding area of ​​the mainboard 10 and the target part 20 respectively; forming an insulation distance d between the mainboard 10 and the target part 20; insulating material A sandwiched between the mainboard 10 and the target part 20.

[0075] The target component 20 can be made of a metal material (such as copper, aluminum, etc.). The metal material has good thermal conductivity and mechanical strength, so as to accelerate the heat radiation efficiency of the target component 20 and extend its service life. When the target component 20 is a metal component, a short - circuit problem is likely to occur between the target component 20 and the main board 10. Therefore, one or more of the following methods can be set to reduce the probability of short - circuit between the target component 20 and the main board 10: being electrically connected to the grounding area of the main board 10 and the target component 20 respectively, forming an insulating distance d between the main board 10 and the target component 20, and an insulating material A sandwiched between the main board 10 and the target component 20.

[0076] When the second structure 40 is electrically connected to the grounding area of the main board 10 and the target component 20 respectively, the target component 20, the second structure 40 and the grounding area of the main board 10 form an electrical path. When static electricity appears on the target component 20, the electronic device 100 leaks electricity to make the target component 20 charged, and in other cases where the target component 20 is charged, the current on the target component 20 can be grounded through the second structure 40 and the grounding area on the main board 10, thus protecting the safety of personnel and the electronic device 100. At the same time, the grounding connection can reduce the high - frequency signals generated by short - circuit between the target component 20 and the main board 10. The existence of high - frequency signals will cause electromagnetic interference (EMI, Electromagnetic Interference) and radio - frequency interference (RFI, Radio Frequency Interference). Therefore, the grounding connection can reduce electromagnetic interference (such as reducing the probability of sensitive components on the main board 10 being affected by electromagnetic interference, etc.) and radio - frequency interference. The second structure 40 can be a solder joint, conductive adhesive, metal contact, metal insulation clip, etc.

[0077] When the second structure 40 forms an insulating distance d between the main board 10 and the target component 20, the main board 10 can at least have a first position, and the target component 20 can at least have a second position. There is a target distance between the first position and the second position, and this target distance can insulate the first position and the second position. The second structure 40 can be a target space formed by the target distance, and the target space can isolate the first position and the second position from each other, which can reduce the probability of electrical short - circuit between the main board 10 and the target component 20, thus improving personal and equipment safety.

[0078] In the case where the second structure 40 can be an insulating material A sandwiched between the main board 10 and the target component 20, the main board 10 can at least have a third position, and the target component 20 can at least have a fourth position. The second structure 40 can be sandwiched between the third position and the fourth position. The second structure 40 can be an insulating material A (such as plastic, rubber, etc.). In this way, the probability of electrical short circuit between the main board 10 and the target component 20 can be reduced through the second structure 40, thereby improving personal and equipment safety. In addition, the second structure 40 sandwiched between the main board 10 and the target component 20 can support between the main board 10 and the target component 20, reducing the probability of relative shaking between the main board 10 and the target component 20.

[0079] In one example, referring to Figures 1 to 8 As shown, the target component 20 can be disposed in the housing of the electronic device 100 and can be a metal component; the second structure 40 can include the following settings: electrically connected to the grounding area of the main board 10 and the target component 20 respectively; forming an insulating distance d between the main board 10 and the target component 20; an insulating material A sandwiched between the main board 10 and the target component 20.

[0080] In this embodiment, at least six setting methods of the second structure 40 are provided, which can include: Method 1, electrically connected to the grounding area of the main board 10 and the target component 20 respectively; Method 2, forming an insulating distance d between the main board 10 and the target component 20; Method 3, an insulating material A sandwiched between the main board 10 and the target component 20; Method 4, electrically connected to the grounding area of the main board 10 and the target component 20 respectively, and forming an insulating distance d between the main board 10 and the target component 20; Method 5, forming an insulating distance d between the main board 10 and the target component 20, and an insulating material A sandwiched between the main board 10 and the target component 20; Method 6, electrically connected to the grounding area of the main board 10 and the target component 20 respectively, forming an insulating distance d between the main board 10 and the target component 20, and an insulating material A sandwiched between the main board 10 and the target component 20. Flexible selection of settings can be made.

[0081] In some embodiments, the main board 10 can be provided with a grounding line, and the grounding line can have at least one first grounding position 103 and at least one second grounding position 104; the target component 20 can have at least one first grounding point 2011 and at least one second grounding point 2012; the second structure 40 can include: a first grounding structure 401 and a second grounding structure 402. The first grounding point 2011 can be electrically connected to the first grounding position 103 through the first grounding structure 401, and the second grounding point 2012 can be electrically connected to the second grounding position 104 through the second grounding structure 402.

[0082] One or more grounding lines can be set on the main board 10, and these grounding lines can have at least two types of grounding positions, namely: the first grounding position 103 and the second grounding position 104; there can also be at least two types of grounding points on the target part 20, namely: the first grounding point 2011 and the second grounding point 2012; the first grounding point 2011 can be electrically connected to the first grounding position 103 through the first grounding structure 401, and the second grounding point 2012 can be electrically connected to the second grounding position 104 through the second grounding structure 402; in this way, multiple first grounding points 2011 can be electrically connected to multiple first grounding positions 103 respectively through multiple first grounding structures 401, and multiple second grounding points 2012 can be connected to multiple second grounding positions 104 respectively through multiple second grounding structures 402.

[0083] In this embodiment, multiple grounding positions on the main board 10 and multiple grounding points on the target part 20 can be correspondingly connected, which can minimize the path length from different positions on the target part 20 to the grounding area of the main board 10, disperse the current path, and reduce signal interference and noise caused by single-point grounding; moreover, if one grounding position on the main board 10 fails, other grounding positions can still maintain electrical connection, which can improve the fault tolerance of the system.

[0084] In some embodiments, multiple first grounding points 2011 and multiple second grounding points 2012 can be equidistantly distributed on the target part 20, and the distance between the first grounding point 2011 and the corresponding first grounding position 103 and the distance between the second grounding point 2012 and the corresponding second grounding position 104 can meet the consistency condition.

[0085] Multiple first grounding points 2011 and multiple second grounding points 2012 can be equidistantly distributed on the target part 20. In other words, the distance between two adjacent grounding points (such as: two adjacent first grounding points 2011, an adjacent first grounding point 2011 and a second grounding point 2012, or two adjacent second grounding points 2012, etc.) and the distance between another two adjacent grounding points (such as: two adjacent first grounding points 2011, an adjacent first grounding point 2011 and a second grounding point 2012, or two adjacent second grounding points 2012, etc.) can be the same or substantially the same. For example: multiple first grounding points 2011 and multiple second grounding points 2012 are arranged in a grid pattern on the target part 20.

[0086] The distance meeting the consistency condition can be equal distances; or the difference is not significant, and those skilled in the art can consider the difference as being equal.

[0087] In this embodiment, multiple first grounding points 2011 and multiple second grounding points 2012 can be equidistantly distributed on the target component 20, which can enable the grounding points to cover the entire target component 20, reduce the phenomenon of insufficient grounding in local areas, avoid local overheating or signal interference, and optimize the usage space at the same time. The distance between the first grounding point 2011 and the corresponding first grounding position 103 and the distance between the second grounding point 2012 and the corresponding second grounding position 104 can meet the consistency condition, which can improve the symmetry and consistency of the current path and reduce the electrical performance fluctuations caused by distance differences.

[0088] In some embodiments, as shown in Figure 1 , Figure 2 and Figure 9 , at least part of the edge of the target component 20 can be bent towards the main board 10, and the bent part 202 can include a first part 2021 and a second part 2022. There can be an insulating distance d between the first part 2021 and the main board 10 or an insulating material A can be clamped therebetween, and the second part 2022 can be electrically connected to the first grounding position 103 of the main board 10. The bent part 202 includes at least one of the following functions: increasing the heat radiation area of the target component 20; blocking the air flow between the main board 10 and the target component 20; blocking the noise between the main board 10 and the target component 20.

[0089] That is to say, among different positions between the bent part 202 and the main board 10, one of the insulating distance d and the insulating material A can be set at some positions, and some positions can be electrically connected to the first grounding position 103 of the main board 10. Here, through different settings at different positions, the probability of short circuit between the main board 10 and the target component 20 can be comprehensively prevented.

[0090] Among them, when the air outlet component 60 is provided in the electronic device 100, the air outlet component 60 can be located within the bent part 202, so as to block the air flow sent out from the second air outlet 602 of the air outlet component 60 between the main board 10 and the target component 20 through the bent part 202, and can reflect and block the noise generated during the air outlet process of the air outlet component 60 through the bent part 202, thereby achieving the purpose of noise reduction.

[0091] In some embodiments, as shown in Figures 1 to 8As shown, the first grounding structure 401 may include a metal insulating clip, and the metal insulating clip may include: a connecting portion 4011, a first clamping arm 4012, and a second clamping arm 4013. The connecting portion 4011 may be disposed at the first grounding position 103 and electrically connected to the first grounding position 103. The first clamping arm 4012 and the second clamping arm 4013 may be respectively connected to two ends of the connecting portion 4011, and a clamping space for clamping the second portion 2022 may be formed between the first clamping arm 4012 and the second clamping arm 4013. When the second portion 2022 is clamped in the clamping space, there is a gap between the second portion 2022 and the connecting portion 4011. The second portion 2022 may be electrically connected to the first grounding position 103 through the first clamping arm 4012, the second clamping arm 4013, and the connecting portion 4011, so that the second portion 2022 can be grounded. Since there is a gap between the second portion 2022 and the connecting portion 4011 when the second portion 2022 is clamped in the clamping space, when there is relative shaking between the target component 20 and the main board 10, the gap can provide a buffer space for the second portion 2022, which can better protect the main board 10 and the target component 20.

[0092] In one example, referring to Figure 8 As shown, the first clamping arm 4012 and the second clamping arm 4013 may protrude towards each other, and the position where the two clamping arms protrude towards each other may clamp the second portion 2022, and there is a gap between the second portion 2022 and the connecting portion 4011.

[0093] In some embodiments, referring to Figure 1 、 Figure 4 、 Figure 6 and Figure 7 As shown, the target portion 340 of the first structure 30 may be a metal component; the second grounding structure 402 may include: a metal fastener, and the metal fastener may detachably pass through the target portion 340 and be fixed and electrically connected to the second grounding position 104 of the main board 10.

[0094] That is to say, part or all of the first structure 30 is a metal part. The metal part has good heat conduction performance and mechanical properties, which can quickly direct the heat on the main board 10 to the target part 20, and can provide good support for the target part 20 through the second heat conduction part 320. Since the metal fastener can pass through the metal part of the first structure 30 and be fixedly connected to the second grounding position 104 of the main board 10, the first structure 30 can be fixed relative to the main board 10, and the metal fastener is electrically connected to the second grounding position 104, so that the first structure 30 and the main board 10 can be grounded. Since the second heat conduction part 320 of the first structure 30 is in contact with the target part 20, the target part 20 can be electrically connected to the second grounding position 104 through the metal part of the first structure 30, thereby improving the safety performance of the electronic device 100.

[0095] In some other embodiments, referring to Figure 1 and Figure 2 as shown, the second grounding structure 402 may include a metal connecting piece. The metal connecting piece can pass through the target part 20 and be fixedly and electrically connected to the second grounding position 104 of the main board 10. In this way, the metal connecting piece can realize the grounding setting of the target part 20 and the main board 10, and can also fix the position of the target part 20 relative to the main board 10.

[0096] In a second aspect

[0097] In some embodiments, referring to Figures 1 to 9 as shown, the target part 20 may be disposed in the housing of the electronic device 100 and may be a metal part. The second structure 40 may at least include one of the following settings: being electrically connected to the grounding area of the main board 10 and the target part 20 respectively; forming an insulating distance d between the main board 10 and the target part 20; and an insulating material A clamped between the main board 10 and the target part 20.

[0098] The target part 20 can be made of a metal material (such as copper, aluminum, etc.). The metal material has good heat conductivity and mechanical strength, so as to be able to accelerate the heat radiation efficiency of the target part 20 and extend its service life. When the target part 20 is a metal part, a short - circuit problem is likely to occur between the target part 20 and the main board 10. For this reason, the probability of a short - circuit between the target part 20 and the main board 10 can be reduced by setting one or more of the following methods: being electrically connected to the grounding area of the main board 10 and the target part 20 respectively, forming an insulating distance d between the main board 10 and the target part 20, and an insulating material A clamped between the main board 10 and the target part 20.

[0099] When the second structure 40 is electrically connected to the grounding area of the main board 10 and the target component 20 respectively, an electrical path is formed among the target component 20, the second structure 40, and the grounding area of the main board 10. When static electricity appears on the target component 20, the electronic device 100 leaks electricity to make the target component 20 charged, or in other cases where the target component 20 is charged, the current on the target component 20 can be grounded through the second structure 40 and the grounding area on the main board 10, thereby protecting the safety of personnel and the electronic device 100. At the same time, the grounding connection can reduce the high-frequency signals generated by a short circuit between the target component 20 and the main board 10. The existence of high-frequency signals will cause electromagnetic interference (EMI, Electromagnetic Interference) and radio frequency interference (RFI, Radio Frequency Interference). Therefore, the grounding connection can reduce electromagnetic interference (such as reducing the probability of sensitive components on the main board 10 being affected by electromagnetic interference, etc.) and radio frequency interference. The second structure 40 can be a solder joint, conductive adhesive, metal contact, metal-insulating clip, etc.

[0100] When the second structure 40 forms an insulation distance d between the main board 10 and the target component 20, the main board 10 can at least have a first position, and the target component 20 can at least have a second position. There is a target distance between the first position and the second position, and this target distance can insulate the first position and the second position. The second structure 40 can be a target space formed by the target distance, and the target space can isolate the first position and the second position from each other, reducing the probability of an electrical short circuit occurring between the main board 10 and the target component 20, thereby improving personal and equipment safety.

[0101] When the second structure 40 can be an insulating material A sandwiched between the main board 10 and the target component 20, the main board 10 can at least have a third position, and the target component 20 can at least have a fourth position. The second structure 40 can be sandwiched between the third position and the fourth position. The second structure 40 can be an insulating material A (such as plastic, rubber, etc.). In this way, the second structure 40 can reduce the probability of an electrical short circuit occurring between the main board 10 and the target component 20, thereby improving personal and equipment safety. In addition, the second structure 40 sandwiched between the main board 10 and the target component 20 can support between the main board 10 and the target component 20, reducing the probability of relative shaking between the main board 10 and the target component 20.

[0102] In one example, as shown in Figures 1 to 8 the target component 20 can be arranged inside the housing of the electronic device 100 and can be a metal component; the second structure 40 can include the following settings: being electrically connected to the grounding area of the main board 10 and the target component 20 respectively; forming an insulation distance d between the main board 10 and the target component 20; and an insulating material A sandwiched between the main board 10 and the target component 20.

[0103] In this embodiment, at least six setting methods of the second structure 40 are provided, which may include: Method 1, electrically connecting to the grounding area of the main board 10 and the target component 20 respectively; Method 2, forming an insulation distance d between the main board 10 and the target component 20; Method 3, sandwiching an insulating material A between the main board 10 and the target component 20; Method 4, electrically connecting to the grounding area of the main board 10 and the target component 20 respectively, and forming an insulation distance d between the main board 10 and the target component 20; Method 5, forming an insulation distance d between the main board 10 and the target component 20, and sandwiching an insulating material A between the main board 10 and the target component 20; Method 6, electrically connecting to the grounding area of the main board 10 and the target component 20 respectively, forming an insulation distance d between the main board 10 and the target component 20, and sandwiching an insulating material A between the main board 10 and the target component 20. It can be flexibly selected and set.

[0104] In some embodiments, the main board 10 is provided with a grounding line, and the grounding line has at least one first grounding position 103 and at least one second grounding position 104; the target component 20 has at least one first grounding point 2011 and at least one second grounding point 2012; the second structure 40 includes: a first grounding structure 401 and a second grounding structure 402, the first grounding point 2011 is electrically connected to the first grounding position 103 through the first grounding structure 401, and the second grounding point 2012 is electrically connected to the second grounding position 104 through the second grounding structure 402.

[0105] One or more grounding lines may be provided on the main board 10, and these grounding lines may have at least two types of grounding positions, namely: a first grounding position 103 and a second grounding position 104; there may also be at least two types of grounding points on the target component 20, namely: a first grounding point 2011 and a second grounding point 2012; the first grounding point 2011 may be electrically connected to the first grounding position 103 through the first grounding structure 401, and the second grounding point 2012 may be electrically connected to the second grounding position 104 through the second grounding structure 402; thus, multiple first grounding points 2011 may be electrically connected to multiple first grounding positions 103 respectively through multiple first grounding structures 401, and multiple second grounding points 2012 may be connected to multiple second grounding positions 104 respectively through multiple second grounding structures 402.

[0106] In this embodiment, multiple grounding positions on the main board 10 and multiple grounding points on the target component 20 can be correspondingly connected, which can minimize the path length from different positions on the target component 20 to the grounding area of the main board 10, can disperse the current path, and can also reduce signal interference and noise caused by single-point grounding; and, if one grounding position on the main board 10 fails, other grounding positions can still maintain electrical connection, which can improve the fault tolerance of the system.

[0107] In some embodiments, multiple first grounding points 2011 and multiple second grounding points 2012 on the target component 20 may be equidistantly distributed, and the distances between the first grounding points 2011 and their corresponding first grounding positions 103 and the distances between the second grounding points 2012 and their corresponding second grounding positions 104 may satisfy a consistency condition.

[0108] Multiple first grounding points 2011 and multiple second grounding points 2012 on the target component 20 may be equidistantly distributed. That is to say, the distances between two adjacent grounding points (such as two adjacent first grounding points 2011, an adjacent first grounding point 2011 and a second grounding point 2012, or two adjacent second grounding points 2012, etc.) and the distances between another two adjacent grounding points (such as two adjacent first grounding points 2011, an adjacent first grounding point 2011 and a second grounding point 2012, or two adjacent second grounding points 2012, etc.) may be the same or substantially the same. For example, multiple first grounding points 2011 and multiple second grounding points 2012 are arranged in a grid pattern on the target component 20.

[0109] The distances satisfying the consistency condition may be equal distances; or the differences may be small, and those skilled in the art may consider the differences to be equal.

[0110] In this embodiment, multiple first grounding points 2011 and multiple second grounding points 2012 being equidistantly distributed on the target component 20 can enable the grounding points to cover the entire target component 20, reduce the phenomenon of insufficient grounding in local areas, avoid local overheating or signal interference, and optimize the usage space at the same time; the distances between the first grounding points 2011 and their corresponding first grounding positions 103 and the distances between the second grounding points 2012 and their corresponding second grounding positions 104 satisfying the consistency condition can improve the symmetry and consistency of the current path and reduce the electrical performance fluctuations caused by distance differences.

[0111] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 9 , at least a part of the edge of the target component 20 can be bent towards the main board 10, and the bent part 202 can include a first part 2021 and a second part 2022. There may be an insulating distance d or an insulating material A is clamped between the first part 2021 and the main board 10, and the second part 2022 can be electrically connected to the first grounding position 103 of the main board 10; the bent part 202 includes at least one of the following functions: increasing the heat radiation area of the target component 20; blocking the airflow between the main board 10 and the target component 20; blocking the noise between the main board 10 and the target component 20.

[0112] That is to say, among different positions between the bent portion 202 and the main board 10, one of the insulating distance d and the insulating material A can be provided at some positions, and some positions can be electrically connected to the first grounding position 103 of the main board 10. Here, through different settings at different positions, the probability of a short circuit between the main board 10 and the target component 20 can be comprehensively prevented.

[0113] In some embodiments, referring to Figures 1 to 8 as shown, the first grounding structure 401 can include a metal insulating clip, and the metal insulating clip can include: a connecting portion 4011, a first clamping arm 4012, and a second clamping arm 4013. The connecting portion 4011 can be disposed at the first grounding position 103 and be electrically connected to the first grounding position 103. The first clamping arm 4012 and the second clamping arm 4013 can be respectively connected to both ends of the connecting portion 4011, and a clamping space for clamping the second portion 2022 can be formed between the first clamping arm 4012 and the second clamping arm 4013. And when the second portion 2022 is clamped in the clamping space, there is a gap between the second portion 2022 and the connecting portion 4011. The second portion 2022 can be electrically connected to the first grounding position 103 through the first clamping arm 4012, the second clamping arm 4013, and the connecting portion 4011, so that the second portion 2022 can be grounded. And since there is a gap between the second portion 2022 and the connecting portion 4011 when the second portion 2022 is clamped in the clamping space, when there is relative shaking between the target component 20 and the main board 10, the gap can provide a buffer space for the second portion 2022, and can better protect the main board 10 and the target component 20.

[0114] In one example, referring to Figure 8 as shown, the first clamping arm 4012 and the second clamping arm 4013 can protrude towards each other, and the position where the two clamping arms protrude towards each other can clamp the second portion 2022, and there is a gap between the second portion 2022 and the connecting portion 4011.

[0115] In other embodiments, referring to Figure 1 and Figure 2 as shown, the second grounding structure 402 can include a metal connecting piece, and the metal connecting piece can detachably pass through the target component 20 and be fixed and electrically connected to the second grounding position 104 of the main board 10. In this way, the metal connecting piece can achieve the grounding setting of the target component 20 and the main board 10, and can also fix the position of the target component 20 relative to the main board 10.

[0116] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details well known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed here based on the above description.

[0117] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or equivalent substitutions can be made for some technical features without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way.

Claims

1. An electronic device, characterized in that, Comprising: A main board, on which at least electronic devices are to be arranged; A target component, which is opposite to the surface of the main board where the electronic devices are arranged and can radiate heat in at least two dimensions; A first structure and / or a second structure, the first structure is at least used to conduct the heat generated by the electronic devices to the target component, and the second structure is used to prevent a short circuit between the target component and the main board.

2. The electronic device according to claim 1, wherein The first structure includes: a first heat conducting member and a second heat conducting member, the first heat conducting member and the second heat conducting member are different heat conducting media, at least part of the first heat conducting member is arranged adjacent to the electronic devices, the second heat conducting member is clamped between the first heat conducting member and the target component and can conduct the heat of the first heat conducting member to the target component, and the target component can radiate heat in at least three dimensions.

3. The electronic device according to claim 2, wherein One side surface of the main board has at least one first area and at least one second area, the distance between the first area and the first heat conducting member is less than the distance between the second area and the first heat conducting member, both the first area and the second area are used to arrange electronic devices, and the unit heat generation of the electronic devices in the first area is greater than the unit heat generation of the electronic devices in the second area; The orthographic projection of the target component onto the main board at least coincides with the main board.

4. The electronic device according to claim 3, wherein Further comprising: An air outlet assembly arranged in the thickness direction of the main board and opposite to the target component, the air outlet assembly has a first air outlet and / or a second air outlet; The first air outlet is opposite to the heat dissipation area of the housing of the electronic device, and the thickness of the housing corresponding to the heat dissipation area is less than the thickness of the housing corresponding to the area outside the heat dissipation area; wherein, at least part of the first heat conducting member is adjacent to the first air outlet and the heat dissipation area; The second air outlet is opposite to the electronic devices in the first area.

5. The electronic device according to claim 4, wherein The first heat conducting member includes: at least one heat conducting pipe, a section in the extending direction of the heat conducting pipe is located between the main board and the target component and is opposite to a plurality of first areas of the main board, and one end in the extending direction of the heat conducting pipe extends out of the main board and the target component and corresponds to be between the first air outlet and the heat dissipation area; The first structure further includes: fins, a part of the fins is located between the main board and the at least one heat conducting pipe, and the part located outside the heat conducting pipe and the main board has at least one convex part, and the surface of the convex part is used for radiating heat.

6. The electronic device according to any one of claims 1 to 5, wherein The target component is arranged in the housing of the electronic device and is a metal component; The second structure at least includes one of the following settings: Electrically connected to the grounding area of the main board and the target component respectively; Forming an insulating distance between the main board and the target component; An insulating material clamped between the main board and the target component.

7. The electronic device according to claim 6, wherein The main board is provided with a grounding line, and the grounding line has at least one first grounding position and at least one second grounding position; The target component has at least one first grounding point and at least one second grounding point; The second structure includes: a first grounding structure and a second grounding structure. The first grounding point is electrically connected to the first grounding position through the first grounding structure, and the second grounding point is electrically connected to the second grounding position through the second grounding structure.

8. The electronic device according to claim 7, wherein A plurality of the first grounding points and a plurality of the second grounding points are equidistantly distributed on the target component, and the distance between the first grounding point and the corresponding first grounding position and the distance between the second grounding point and the corresponding second grounding position satisfy a consistency condition.

9. The electronic device according to claim 8, wherein At least a part of the edge of the target component is bent towards the main board, and the bent part includes a first part and a second part. There is an insulating distance between the first part and the main board or an insulating material is clamped therebetween, and the second part is electrically connected to the first grounding position of the main board; The bent part includes at least one of the following functions: Increasing the area of the target component for radiating heat; Blocking the air flow between the main board and the target component; Blocking the noise between the main board and the target component.

10. The electronic device according to claim 9, wherein The first grounding structure includes a metal insulating clip, and the metal insulating clip includes: a connecting portion, a first clamping arm and a second clamping arm. The connecting portion is arranged at the first grounding position and is electrically connected to the first grounding position. The first clamping arm and the second clamping arm are respectively connected to two ends of the connecting portion, and a clamping space for clamping the second part is formed between the first clamping arm and the second clamping arm. When the second part is clamped in the clamping space, there is a gap between the second part and the connecting portion; and / or, The second grounding structure includes: a metal connecting piece, and the metal connecting piece detachably passes through the target component and is fixed and electrically connected to the second grounding position of the main board.

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