3D uniform temperature plate

Abstract

The invention relates to the technical field of 3D temperature uniformizing plates, and particularly provides a 3D temperature uniformizing plate which is used for heat dissipation of electronic components and comprises a composite copper pipe, an upper cover plate, a lower cover plate and an upper cover capillary. The upper cover plate is welded with the composite copper pipe; the ends, deviating from the composite copper pipe, of the lower cover plate and the upper cover plate are welded to form a containing cavity. The upper cover capillary is arranged in the accommodating cavity; one end, facing the upper cover plate, of the lower cover plate is provided with a sunken table area and a peripheral area, and the sunken table area is provided with a core area and an edge area; wherein a plurality of edge tooth pieces and a plurality of core tooth pieces are arranged in the sunken table area; the plurality of edge tooth sheets are fixedly arranged in the edge area, and the plurality of core tooth sheets are fixedly arranged in the core area, so that the heating core area of the lower cover plate is upgraded from a two-dimensional structure to a three-dimensional structure. The diversification of heat energy transfer and working medium evaporation paths in a multi-dimensional space is realized, and the heat transfer efficiency in a high-power-consumption scene is improved, so that the problem of heat transfer efficiency bottleneck in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the technical field of 3D temperature averaging plates, and in particular to a 3D temperature averaging plate. Background Art

[0002] As server computing power increases, the heat flux density of server CPUs is also increasing, and traditional vapor chambers and heat pipes cannot meet the heat dissipation needs. Compared with traditional vapor chambers, 3D vapor chambers change the heat dissipation of the vapor chamber from two-dimensional surface to three-dimensional heat conduction, greatly improving the heat dissipation capacity of electronic components.

[0003] A 3D temperature spreader generally includes a temperature spreader body and a copper tube. The cavity formed by the temperature spreader body and the copper tube is interconnected. The end of the temperature spreader body away from the copper tube is set as the heating core area, and a heating boss is usually set downward to increase the contact area between the 3D temperature spreader and the heat source. When the heat sink flows back to the heating boss, the heat sink can only be heated by the bottom of the heating boss. The heat dissipation efficiency of the heat sink is low, which makes the heat transfer efficiency of the 3D temperature spreader in a high power consumption environment have an obvious bottleneck.

[0004] Therefore, the prior art has defects and deficiencies and needs further improvement and development. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a 3D temperature equalizing plate, aiming to solve the problem that the 3D temperature equalizing plate powder filling device in the prior art can only rely on the bottom surface of the heating boss to heat the heat dissipation medium, and the heat dissipation efficiency of the heat dissipation medium is low, resulting in an obvious bottleneck problem in the heat transfer efficiency of the 3D temperature equalizing plate in a high power consumption environment.

[0006] The technical solution adopted by the present application to solve the technical problem is as follows: a 3D temperature-averaging plate for heat dissipation of electronic components, comprising:

[0007] Composite copper tube;

[0008] An upper cover plate, wherein the upper cover plate is welded to the composite copper tube;

[0009] A lower cover plate, wherein the lower cover plate is welded to an end of the upper cover plate away from the composite copper tube to form a receiving cavity;

[0010] An upper cover capillary, wherein the upper cover capillary is arranged in the accommodating cavity;

[0011] The lower cover plate is provided with a sinking area and a peripheral area at one end thereof facing the upper cover plate, and the sinking area is provided with a core area and an edge area;

[0012] Wherein, a plurality of edge teeth and a plurality of core teeth are arranged in the sinking area;

[0013] A plurality of the edge teeth are fixedly arranged in the edge area, and a plurality of the core teeth are fixedly arranged in the core area.

[0014] Optionally, the core area is covered with a fine copper powder layer with a mesh number less than or equal to 200 meshes, and the porosity of the fine copper powder layer is 30% - 45%; the edge area is filled with coarse copper powder with a mesh number of 100 - 150 meshes, and the porosity of the coarse copper powder is 50% - 65%; the peripheral area is filled with coarse copper powder with a mesh number of 70 - 90 meshes; the upper half of the slope of the sunken area is made of coarse copper powder, and the lower half is made of fine copper powder, and the porosity of the upper half of the slope of the sunken area is greater than that of the lower half of the slope of the sunken area.

[0015] Optionally, a plurality of the core teeth are all set as solid copper teeth, V-shaped hook grooves are arranged on the left and right side surfaces of a plurality of the core teeth, and the front and rear side surfaces of a plurality of the core teeth are set as arc-shaped surfaces.

[0016] Optionally, the ratio of the height of the core teeth to the spacing between the core teeth is 1:1.1 - 1.5; the ratio of the length of the core teeth to the length of the edge teeth is 1:0.3 - 0.6.

[0017] Optionally, the lower cover plate further includes a plurality of gradient support columns, a plurality of coarse copper powder rings and a plurality of fine support columns; a plurality of the gradient support columns are all fixedly arranged in the core area, and a plurality of the coarse copper powder rings and a plurality of the fine support columns are all fixedly arranged at equal intervals in the peripheral area.

[0018] Optionally, the gradient support columns are divided into an upper section, a middle section and a lower section with lengths decreasing in arithmetic progression; the porosity of the upper section is greater than that of the middle section, and the porosity of the middle section is greater than that of the lower section.

[0019] Optionally, the upper cover capillary is a 200-mesh copper mesh, and the thickness of the upper cover capillary is 0.05 mm - 0.1 mm; a plurality of fixing holes are arranged in the upper cover capillary, and the diameters of a plurality of the fixing holes are adapted to the outer diameters of a plurality of the gradient support columns and a plurality of the fine support columns;

[0020] The edges of the upper cover plate and the lower cover plate surround to form a water injection port, the water injection port is communicated with the accommodation cavity, and the water injection port is used for injecting a heat dissipation working medium into the accommodation cavity.

[0021] Optionally, the composite copper tube includes a copper tube body and an air inlet notch, the air inlet notch is arranged at the open end of the copper tube body, the height of the air inlet notch along the axial direction of the copper tube body is set to be 3 mm - 4 mm, and the air inlet notch is arranged in the accommodation cavity.

[0022] Optionally, a groove capillary area and a copper powder capillary area are provided on the inner wall of the copper tube body, and the groove capillary area is provided above the copper powder capillary area.

[0023] Optionally, the groove capillary zone is provided with a spiral groove or a straight groove, the groove depth of the groove capillary zone is 0.05mm-0.1mm, and the groove spacing of the groove capillary zone is 0.2mm-0.5mm; the copper powder capillary zone is covered with a 100-150 mesh copper powder layer and overlaps with the lower cover capillary.

[0024] Compared with the prior art, the present application provides a 3D temperature equalizing plate, which upgrades the heating core area of ​​the lower cover plate from a two-dimensional structure to a three-dimensional structure by setting a composite copper tube, an upper cover plate, a lower cover plate, an upper cover capillary, a sinking area and a peripheral area, and setting a number of edge teeth and a number of core teeth in the sinking area. By setting a number of core teeth and edge teeth in the core area and edge area of ​​the sinking area, the contact area between the heating core area and the heat dissipation medium can be greatly increased, effectively improving the heat absorption efficiency of the medium. At the same time, the teeth form a three-dimensional heat exchange channel, so that the heat dissipation medium is heated more evenly. Compared with the prior art that only relies on the bottom surface of the heating boss to heat the heat dissipation medium, the 3D temperature equalizing plate realizes the transfer of thermal energy in multi-dimensional space and the diversification of the evaporation path of the medium, significantly improving the heat transfer efficiency in high power consumption scenarios, thereby solving the bottleneck problem of heat transfer efficiency existing in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the 3D temperature homogenizing plate provided in this application;

[0026] Figure 2 It is a schematic diagram of the three-dimensional exploded structure of the 3D temperature homogenizing plate provided in this application;

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the lower cover plate of the 3D temperature homogenizing plate provided in this application;

[0028] Figure 4 is a front view of the 3D temperature homogenizing plate provided in this application;

[0029] Figure 5 This application provides Figure 4 A cross-sectional view along the Ⅰ-Ⅰ direction;

[0030] Figure 6 This application provides Figure 5 The enlarged schematic diagram of point A in the middle;

[0031] Figure 7 is a front view of the composite copper tube of the 3D temperature homogenizing plate provided in the present application;

[0032] Figure 8It is a cross-sectional view of the composite copper tube of the 3D vapor chamber provided in this application.

[0033] Explanation of reference numerals:

[0034] 10. 3D vapor chamber; 11. Composite copper tube; 12. Upper cover plate; 13. Upper cover capillary; 14. Lower cover plate; 141. Sunken area; 142. Peripheral area; 143. Gradient support column; 144. Coarse copper powder ring; 145. Fine support column; 146. Slope; 1411. Core area; 1412. Edge area; 1413. Edge tooth piece; 1414. Core tooth piece; 111. Copper tube body; 112. Air intake notch; 131. Fixing hole; 1111. Groove capillary area; 1112. Copper powder capillary area; 15. Water injection port. Detailed implementation manners

[0035] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0036] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0037] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0038] Please refer to Figures 1 to 8, the first embodiment of the present application provides a 3D vapor chamber 10, and the 3D vapor chamber 10 includes a composite copper tube 11, an upper cover plate 12, a lower cover plate 14, an upper cover capillary 13, a plurality of core fins 1414, a plurality of edge fins 1413, a plurality of gradient support columns 143, a plurality of thin support columns 145, a plurality of thick copper powder rings 144, a groove capillary region 1111, a copper powder capillary region 1112, and a water injection port 15; the 3D vapor chamber 10 forms a receiving cavity through the welding of the upper cover plate 12 and the lower cover plate 14, the composite copper tube 11 is welded on the upper cover plate 12 and penetrates into the interior of the receiving cavity, and the outer wall of the composite copper tube 11 can be in contact with existing refrigeration equipment; one end of the lower cover plate 14 facing the upper cover plate 12 is provided with a sunken area 141 and a peripheral area 142, the sunken area 141 further includes a core area 1411 and an edge area 1412, a plurality of core fins 1414 made of solid copper structures are arranged in the core area 1411, and a plurality of edge fins 1413 are arranged in the edge area 1412; a plurality of gradient support columns 143 are further fixedly arranged in the core area 1411 of the lower cover plate 14, and a plurality of thin support columns 145 and a plurality of thick copper powder rings 144 are evenly spaced in the peripheral area 142; the upper cover capillary 13 is composed of a 200-mesh copper mesh, the upper cover capillary 13 is arranged in the receiving cavity, and a plurality of fixing holes 131 are formed in the upper cover capillary 13, and the outer diameters of the plurality of fixing holes 131 are adapted to the outer diameters of the gradient support columns 143 and the thin support columns 145; the composite copper tube 11 includes a copper tube body 111 and an air intake notch 112, and a groove capillary region 1111 and a copper powder capillary region 1112 are sequentially arranged on the inner wall of the copper tube body 111 from top to bottom.

[0039] During the operation of electronic components, their heat is first conducted from the core area 1411 of the lower cover plate 14 in direct contact with them to a plurality of core fins 1414. Since the core fins 1414 are made of solid copper material and the outer surface is covered with a fine copper powder layer; on the one hand, it can have good thermal conductivity and quickly conduct heat from the bottom upwards, and on the other hand, it can improve the capillary force and liquid storage capacity of the core area 1411 through the fine copper powder layer to prevent local dry burning under high power consumption; V-shaped grooves are arranged on both sides of the plurality of core fins 1414, and the front and rear sides are arc-shaped, further increasing the heat dissipation surface area and strengthening the liquid return path, which is beneficial to the continuous and stable evaporation process. A plurality of edge fins 1413 in the edge area 1412 and the core fins 1414 form a gradient heat conduction layout, which helps to expand the evaporation area range.

[0040] In the upper half of the slope 146 of the sunken area 141 of the lower cover plate 14, coarse copper powder is filled, and in the lower half, fine copper powder is filled. Through the multi-stage porosity structure composed of copper powders with different mesh numbers, the capillary drainage transition from the evaporation area to the condensation area can be realized, enhancing the reflux ability of the heat working medium. In the peripheral area 142 of the lower cover plate 14, coarse copper powder is filled, and a number of coarse copper powder rings 144 and fine support columns 145 are evenly arranged to construct a reflux path, while improving the structural strength and liquid storage capacity. A number of gradient support columns 143 arranged in the core area 1411 are divided into an upper section, a middle section, and a lower section with an arithmetic progression decrease in length, and respectively correspond to different porosities. The porosity of the upper section is greater than that of the middle section, and the middle section is greater than that of the lower section, which can realize the continuous and stable liquid support and evaporation support functions in the heat working medium flow path from top to bottom.

[0041] The upper cover capillary 13 covers the upper part of the accommodation cavity and is made of a large-mesh copper mesh. It has a small thickness and a high porosity, effectively reducing the condensation of steam on the upper cover. At the same time, through the cooperation with the fixing holes 131 of a number of gradient support columns 143 and fine support columns 145 below, the stable support of the capillary structure is realized. The water injection port 15 is arranged in the area surrounded by the edges of the upper cover plate 12 and the lower cover plate 14, communicating with the accommodation cavity, and is used to inject the heat dissipation working medium into the accommodation cavity to ensure that the 3D heat pipe 10 has a stable evaporation and condensation cycle.

[0042] The composite copper tube 11 is welded on the upper cover plate 12. An air intake notch 112 is arranged inside the composite copper tube 11. The air intake notch 112 is located in the accommodation cavity and has a height of 3 mm to 4 mm, ensuring that steam can quickly enter the inside of the copper tube. On the inner wall of the copper tube body 111, a groove capillary area 1111 and a copper powder capillary area 1112 are respectively arranged from top to bottom. The groove capillary area 1111 adopts the form of spiral grooves or straight grooves, with a groove depth of 0.05 mm to 0.1 mm and a groove pitch of 0.2 mm to 0.5 mm, effectively enhancing the steam condensation heat transfer area and reducing the liquid film thermal resistance; the copper powder capillary area 1112 is arranged in the lower part and covers a copper powder layer with 100 to 150 meshes, overlapping with the upper cover capillary 13 to construct a complete and closed liquid capillary reflux path, enabling the steam to be preferentially condensed inside the composite copper tube 11 and efficiently reflux to the lower cover core area 1411, realizing an efficient and stable heat working medium cycle.

[0043] The core tooth piece 1414 composed of solid copper material cooperates with the fine copper powder layer covering its surface to improve the thermal conductivity and capillary force of the evaporation zone; the gradient support column 143, the edge tooth piece 1413, the coarse copper powder area and its annular structure cooperate to construct a structural support and liquid return path; the groove capillary area 1111 and the copper powder capillary area 1112 form an inner tube priority condensation system to reduce condensation losses in non-target areas; a complete capillary drive path is realized by overlapping the upper and lower capillary structures, and combined with the integrated structure of the water injection port 15 and the accommodating cavity, rapid evaporation, efficient conduction and stable condensation reflux of the thermal working medium in the 3D space are realized, which greatly improves the heat transfer efficiency in a high power consumption environment and breaks through the efficiency bottleneck brought about by the traditional two-dimensional temperature averaging plate relying only on bottom heating.

[0044] Please refer to Figures 1 to 3 In some embodiments, the 3D temperature homogenizing plate 10 includes a composite copper tube 11, an upper cover plate 12, a lower cover plate 14 and an upper cover capillary 13; the upper cover plate 12 is welded to the composite copper tube 11; the lower cover plate 14 is welded to one end of the upper cover plate 12 away from the composite copper tube 11 to form a receiving cavity; the upper cover plate 12 capillary is arranged in the receiving cavity; the lower cover plate 14 is provided with a sinking area 141 and a peripheral area 142 at one end facing the upper cover plate 12, and the sinking area 141 is provided with a core area 1411 and an edge area 1412; wherein, the sinking area A plurality of edge teeth 1413 and a plurality of core teeth 1414 are arranged in the platform area 141; a plurality of the edge teeth 1413 are fixedly arranged in the edge area 1412, and a plurality of the core teeth 1414 are fixedly arranged in the core area 1411. Then, by arranging the composite copper tube 11, the upper cover plate 12, the lower cover plate 14, the upper cover capillary 13, the platform area 141 and the peripheral area 142, and arranging a plurality of edge teeth 1413 and a plurality of core teeth 1414 in the platform area 141, the heating core area of ​​the lower cover plate 14 is upgraded from a two-dimensional structure to a three-dimensional structure. By arranging a plurality of core teeth 1414 and edge teeth 1413 in the core area 1411 and the edge area 1412 of the platform area 141, the contact area between the heating core area and the heat dissipation medium can be greatly increased, and the heat absorption efficiency of the medium can be effectively improved. At the same time, the teeth form a three-dimensional heat exchange channel, so that the heat dissipation medium is heated more evenly. Compared with the prior art that only relies on the bottom surface of the heating boss to heat the heat dissipation medium, the 3D temperature homogenizing plate 10 realizes the transfer of thermal energy in multi-dimensional space and the diversification of the evaporation path of the medium, improves the heat transfer efficiency in high power consumption scenarios, and thus solves the bottleneck problem of heat transfer efficiency existing in the prior art.

[0045] Please refer to Figure 3, in some embodiments, the core area 1411 is covered with a fine copper powder layer with a mesh number less than or equal to 200 meshes (not shown in the figure), and the porosity of the fine copper powder layer is 30% - 45%; the edge area 1412 is filled with coarse copper powder with a mesh number of 100 - 150 meshes, and the porosity of the coarse copper powder is 50% - 65%; the peripheral area 142 is filled with coarse copper powder with a mesh number of 70 - 90 meshes (not shown in the figure); the upper half of the slope 146 of the sunken platform area 141 is made of coarse copper powder, and the lower half is made of fine copper powder. The porosity of the upper half of the slope 146 of the sunken platform area 141 is greater than that of the lower half of the slope 146 of the sunken platform area 141. Furthermore, the mesh number and porosity of the copper powder covering or filling the core area 1411, the edge area 1412, and the peripheral area 142 are set in zones to form a gradient capillary structure. The fine copper powder layer has higher capillary force and water storage capacity, which helps prevent dry burning when the heat load is high and improves the evaporation efficiency of the core area 1411; while the coarser copper powder in the edge area 1412 and the peripheral area 142 is beneficial to the smooth reflux of the liquid after steam condensation, reduces the reflux resistance, and effectively constructs an internal circulation system; different particle sizes of copper powder are used on the upper and lower parts of the slope 146 of the sunken platform area 141 to further optimize the flow state of steam and condensate at the interface. The overall design realizes the optimization of the evaporation, condensation, and reflux paths, and improves the heat exchange capacity of the 3D heat pipe 10 under complex heat loads.

[0046] Please refer to Figure 3 , in some embodiments, several of the core teeth 1414 are all set as solid copper teeth. V-shaped grooves are provided on the left and right side surfaces of several of the core teeth 1414, and the front and rear side surfaces of several of the core teeth 1414 are set as arc-shaped surfaces. Furthermore, while ensuring the heat transfer efficiency, it effectively guides the distribution and reflux path of the heat dissipation working medium in the core area 1411. The V-shaped grooves increase the attachment surface area of the heat dissipation working medium, which is beneficial to evaporation; the arc-shaped structure can avoid the formation of dead corners and local high temperatures, and improve the uniformity of the overall temperature distribution. Compared with traditional copper powder sintered teeth, the solid copper teeth have higher thermal conductivity and significantly improve the heat conduction efficiency from the heat source to the working medium.

[0047] Please refer to Figure 3, in some embodiments, the ratio of the height of the core fin 1414 to the spacing between the core fins 1414 is 1:1.1 to 1.5; the ratio of the length of the core fin 1414 to the length of the edge fin 1413 is 1:0.3 to 0.6. Thus, the structural regulation and optimization of the fin array are realized. By matching the height and the spacing, the heat capacity density per unit area is increased. At the same time, by setting the length difference, the edge fin 1413 plays an auxiliary role in the diversion and steam path adjustment, ensuring that the evaporation efficiency in the core fin 1414 area is not disturbed, promoting the orderly flow of steam towards the composite copper tube 11, and further improving the heat transfer efficiency and the reliability of the working fluid cycle.

[0048] Please refer to Figures 2 to 3 , in some embodiments, the lower cover plate 14 further includes a plurality of gradient support columns 143, a plurality of coarse copper powder rings 144 and a plurality of fine support columns 145; a plurality of the gradient support columns 143 are fixedly arranged in the core area 1411, and a plurality of the coarse copper powder rings 144 and a plurality of the fine support columns 145 are evenly and spacedly fixedly arranged in the peripheral area 142. Thus, by arranging a plurality of gradient support columns 143, a plurality of coarse copper powder rings 144 and a plurality of fine support columns 145 on the lower cover plate 14, a multi-point support system in the steam channel is constructed while ensuring the structural strength. The coarse copper powder ring 144 helps to guide the steam to flow concentratedly towards the composite copper tube 11, and the fine support column 145 stabilizes the structure and does not hinder the flow of the working fluid. The gradient support column 143 is arranged in the core area 1411, effectively enhancing the anti-deformation ability of the three-dimensional structure under the heating state, especially maintaining the structural integrity and evaporation efficiency of the core area 1411 under high-temperature gradient conditions. Further, a synergistic cooperation is formed in terms of physical support and capillary conduction, ensuring the smoothness of the working fluid cycle and the structural stability.

[0049] In some embodiments, the gradient support column 143 is divided into an upper section, a middle section and a lower section with lengths decreasing in arithmetic progression; the porosity of the upper section is greater than the porosity of the middle section, and the porosity of the middle section is greater than the porosity of the lower section. Thus, a vertical capillary force gradient structure is constructed, which is beneficial to the condensed liquid to gradually flow back to the heating core area along the porosity gradient, improving the reflux rate and reducing the reflux resistance. In addition, the structural gradient inside the support column can also realize stress release and hierarchical distribution of heat conduction when the structure expands due to heat, achieving double synergistic optimization of structural strength and thermal cycle performance.

[0050] Please refer to Figure 2, in some embodiments, the upper cover capillary 13 is a 200-mesh copper mesh, and the thickness of the upper cover capillary 13 is 0.05 mm to 0.1 mm; a plurality of fixing holes 131 are provided in the upper cover capillary 13, and the diameters of the plurality of fixing holes 131 are adapted to the outer diameters of the plurality of gradient support columns 143 and the plurality of fine support columns 145; an injection port 15 is formed by surrounding the edges of the upper cover plate 12 and the lower cover plate 14, the injection port 15 is communicated with the accommodating cavity, and the injection port 15 is used for injecting a heat dissipation working fluid into the accommodating cavity. Furthermore, by setting the upper cover capillary 13 as a 200-250 mesh copper mesh with a thickness of only 0.05 mm to 0.1 mm, the condensation probability of steam at the upper cover plate 12 is significantly reduced, more steam is guided into the composite copper tube 11, the condensation ratio of the working fluid in the copper tube is increased, and the steam loss in the non-heat exchange area is avoided. The design that the fixing holes 131 are adapted to the outer diameters of the gradient support columns 143 and the fine support columns 145 enables the upper cover capillary 13 to be stably attached and maintain good contact under the thermal deformation of the overall structure. The injection port 15 formed by surrounding the edges is communicated with the accommodating cavity, which is convenient for injecting the heat dissipation working fluid and ensuring the formation of a complete internal circulation system, effectively improving the assembly and use convenience, and enhancing the initial filling efficiency and sealing reliability.

[0051] Please refer to Figures 5 to 8 , in some embodiments, the composite copper tube 11 includes a copper tube body 111 and an air intake notch 112, the air intake notch 112 is provided at the open end of the copper tube body 111, the height of the air intake notch 112 in the axial direction of the copper tube body 111 is set to 3 mm to 4 mm, and the air intake notch 112 is provided in the accommodating cavity. Furthermore, a transition expansion area can be provided during the process of steam entering the composite copper tube 11, the steam flow resistance is reduced, the flow velocity and heat exchange rate of the steam inside the copper tube are increased, and at the same time, the steam aggregation in the ineffective area of the accommodating cavity causing heat accumulation is avoided. The air intake notch 112 forms a good cooperation with the steam flow path of the lower cover plate 14, enhancing the guiding ability of the steam to the main heat exchange area, thereby realizing the flow continuity and direction stability between the evaporation cavity and the condensation cavity.

[0052] Please refer to Figure 2 , in some embodiments, a plurality of clearance holes are further provided in the upper cover capillary 13, the plurality of clearance holes are arranged in one-to-one correspondence with the copper tube holes of the upper cover plate 12, the composite copper tube 11 passes through the copper tube holes and the clearance holes, so that the air intake notch 112 is overlapped with the lower cover capillary, and the air intake notch 112 serves as a steam flow channel.

[0053] Please refer to Figures 7 to 8, in some embodiments, a groove capillary zone 1111 and a copper powder capillary zone 1112 are provided on the inner wall of the copper tube body 111, and the groove capillary zone 1111 is arranged above the copper powder capillary zone 1112. Furthermore, by providing the groove capillary zone 1111 and the copper powder capillary zone 1112 on the inner wall of the copper tube body 111 and arranging the groove capillary zone 1111 above the copper powder capillary zone 1112, the condensate can smoothly flow back to the lower cover core area 1411 in the copper tube, realizing the functional stratification of condensation and reflux. The groove zone provides a strong liquid guiding channel, reducing the retention of condensate on the tube wall. The copper powder capillary zone 1112 enhances the liquid storage capacity of the reflux path. The groove zone can also increase the heat transfer area between the steam and the inner wall of the copper tube body 111, reducing the influence of the liquid film thermal resistance generated on the wall surface during the steam condensation process on the heat transfer efficiency. The two work together to improve the condensation efficiency of the working medium and the continuity of reflux, thereby ensuring efficient and stable heat transfer during the internal working medium circulation of the 3D heat pipe 10.

[0054] Please refer to Figures 7 to 8 , in some embodiments, the groove capillary zone 1111 is provided with spiral grooves or straight grooves, the groove depth of the groove capillary zone 1111 is 0.05 mm to 0.1 mm, and the groove pitch of the groove capillary zone 1111 is 0.2 mm to 0.5 mm; the copper powder capillary zone 1112 is covered with a copper powder layer of 100 mesh to 150 mesh and is capillary-lapped with the lower cover. The lower cover capillary is specifically composed of copper powder sintered in the sinking area 141 and the peripheral area 142. Furthermore, by providing spiral grooves or straight grooves and defining the groove depth to be 0.05 mm to 0.1 mm and the groove pitch to be 0.2 mm to 0.5 mm, an efficient liquid film condensation and drainage channel is ensured to be formed in the copper tube. The copper powder capillary zone 1112 is covered with 100 to 150 mesh copper powder and is capillary-lapped with the upper cover capillary 13, realizing a closed-loop reflux channel for the liquid from the copper tube to the copper powder capillary and then to the upper cover capillary 13 after steam condensation, thereby forming a benign capillary self-circulation system. It effectively avoids the liquid return failure caused by discontinuous capillary distribution in the traditional structure, realizes the seamless connection and functional complementarity of the working medium heat transfer path, and thus overall improves the heat transfer efficiency of the heat pipe and the working reliability under high-power applications.

[0055] In some embodiments, the 3D vapor chamber 10 can be processed by the following processing method, and the processing equipment used can be realized by existing equipment; first, the raw material of the lower cover plate 14 is integrally formed by an integral forging process to prepare the lower cover plate 14 with an accommodation cavity. The lower cover plate 14 is further formed into a core area 1411 and a peripheral area 142 for carrying the core fins 1414 and the edge fins 1413 through a stamping and cutting process. On the outer surface of the core area 1411 of the lower cover plate 14, a number of core fins 1414 are provided. During the processing, electrolytic copper powder with a mesh size of 150 to 200 meshes is used, and the electrolytic copper powder is evenly covered on the designated position of the outer surface of the core area 1411 through a graphite jig and a powder vibrating machine; then it is placed in a bell jar furnace and sintered at a constant temperature for 2 hours in a nitrogen-hydrogen mixed atmosphere (nitrogen-hydrogen volume ratio is 9:1) at 900 °C, so that the electrolytic copper powder is sintered to form a number of core fins 1414 and firmly adheres to the lower cover plate 14.

[0056] In the peripheral area 142 of the lower cover plate 14, a number of edge fins 1413 are provided. For this part, electrolytic copper powder with a mesh size of 60 to 100 meshes is used, and it is covered, sintered and demolded in the above-mentioned manner. The sintered edge fins 1413 form the capillary structure in the edge area of the 3D vapor chamber 10, improving the liquid reflux ability.

[0057] In the core area 1411 of the lower cover plate 14, a number of gradient support columns 143 are also provided, and their positions are between or near the core fins 1414; a number of thin support columns 145 are provided in the peripheral area 142 of the lower cover plate 14 to support and keep the distance between the upper cover plates 12 consistent. The above-mentioned gradient support columns 143 and thin support columns 145 are sintered and formed together with the core fins 1414 and the edge fins 1413 to ensure their structural stability and channel continuity.

[0058] An upper cover capillary 13 is provided on the inner side of the upper cover plate 12. By attaching a 200-mesh copper mesh to its inner surface and sending it into a bell jar furnace to be sintered at a constant temperature of 900 °C for 2 hours, the upper cover capillary 13 is tightly sintered and combined with the upper cover plate 12, enhancing the liquid adsorption and reflux performance. Specifically, electrolytic copper powder with different mesh sizes can be selected according to actual needs, and the present application does not make excessive restrictions.

[0059] In the peripheral area of the lower cover plate 14, a number of welding copper powder rings are preset as auxiliary fillers in the welding area between the upper cover plate 12 and the lower cover plate 14. After the above-mentioned sintered structure is completed, the upper cover plate 12 and the lower cover plate 14 are aligned and covered, so that the upper cover plate 12 and the lower cover plate 14 enclose an accommodation cavity, and a metallurgical connection is formed in the set welding area by means of the welding copper powder rings. The welding process adopts the diffusion welding method, and the process parameters are: temperature 860 °C, constant temperature 1.5 hours, pressure 70 kg, to realize the firm welding of the upper cover plate 12 and the lower cover plate 14.

[0060] A plurality of composite copper tubes 11 are inserted into the side of the upper cover plate 12 away from the lower cover plate 14, and copper solder is used to fill the gap between the composite copper tubes 11 and the upper cover plate 12, and then high-frequency welding is used to weld the composite copper tubes 11 and the upper cover plate 12 to form a reliable sealed connection.

[0061] Finally, a proper amount of ultrapure water is injected into the accommodating cavity through the liquid injection device, and a conventional temperature-averaging process is used for vacuum extraction, degassing and sealing, so that a stable gas-liquid coexistence state is formed in the accommodating cavity. At this point, the 3D temperature-averaging plate 10 including the upper cover plate 12, the lower cover plate 14, the composite copper tube 11, the upper cover capillary 13, the core tooth piece 1414, the edge tooth piece 1413, the gradient support column 143, the fine support column 145, the coarse copper powder ring 144 and the water injection port 15 is manufactured; the upper cover plate 12, the lower cover plate 14, the composite copper tube 11, the upper cover capillary 13, the core tooth piece 1414, the edge tooth piece 1413, the gradient support column 143, the fine support column 145, the coarse copper powder ring 144 and the water injection port 15 work together and are inseparable, and have the collaborative thermal control functions of evaporation, heat transfer and reflux.

[0062] In summary, the present application provides a 3D temperature equalizing plate for heat dissipation of electronic components, the 3D temperature equalizing plate comprising a composite copper tube, an upper cover plate, a lower cover plate and an upper cover capillary; the upper cover plate is welded to the composite copper tube; the lower cover plate is welded to one end of the upper cover plate away from the composite copper tube to form a accommodating cavity; the upper cover capillary is arranged in the accommodating cavity; the end of the lower cover plate facing the upper cover plate is provided with a sinking platform area and a peripheral area, and the sinking platform area is provided with a core area and an edge area; wherein, a plurality of edge teeth and a plurality of core teeth are arranged in the sinking platform area; a plurality of the edge teeth are fixedly arranged in the edge area, and a plurality of the core teeth are fixedly arranged in the core area, and then by arranging the composite copper tube, the upper cover plate, the lower cover plate, the upper cover capillary, the sinking platform area and the peripheral area, and arranging a plurality of edge teeth and a plurality of core teeth in the sinking platform area, the heating core area of ​​the lower cover plate is upgraded from a two-dimensional structure to a three-dimensional structure. By setting a number of core teeth and edge teeth in the core area and edge area of ​​the sink area, the contact area between the heating core area and the heat dissipation medium can be greatly increased, effectively improving the heat absorption efficiency of the medium. At the same time, the teeth form a three-dimensional heat exchange channel to make the heat dissipation medium heated more evenly. Compared with the prior art that only relies on the bottom surface of the heating boss to heat the heat dissipation medium, the 3D temperature plate realizes the transfer of thermal energy in multi-dimensional space and the diversification of the evaporation path of the medium, significantly improving the heat transfer efficiency in high power consumption scenarios, thereby solving the bottleneck problem of heat transfer efficiency in the prior art.

[0063] It should be understood that the application of this application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations shall fall within the protection scope of the appended claims of this application.

Claims

1. A 3D heat pipe, used for the heat dissipation of electronic components, is characterized in that, The 3D temperature homogenizing plate comprises: Composite copper tube; An upper cover plate, wherein the upper cover plate is welded to the composite copper tube; A lower cover plate, wherein the lower cover plate is welded to an end of the upper cover plate away from the composite copper tube to form a receiving cavity; An upper cover capillary, wherein the upper cover capillary is arranged in the accommodating cavity; The lower cover plate is provided with a sinking area and a peripheral area at one end thereof facing the upper cover plate, and the sinking area is provided with a core area and an edge area; Wherein, a plurality of edge teeth and a plurality of core teeth are arranged in the sinking area; A plurality of the edge teeth are fixedly arranged in the edge area, and a plurality of the core teeth are fixedly arranged in the core area.

2. The 3D vapor chamber according to claim 1, wherein The core area is covered with a fine copper powder layer with a mesh size of less than or equal to 200 meshes, and the porosity of the fine copper powder layer is 30% to 45%; the edge area is filled with coarse copper powder with a mesh size of 100 to 150 meshes, and the porosity of the coarse copper powder is 50% to 65%; the peripheral area is filled with coarse copper powder with a mesh size of 70 to 90 meshes; the upper half of the slope of the sinking area is made of coarse copper powder, and the lower half of the slope is made of fine copper powder, and the porosity of the upper half of the slope of the sinking area is greater than the porosity of the lower half of the slope of the sinking area.

3. The 3D temperature homogenizing plate according to claim 1, characterized in that: Some of the core tooth pieces are configured as solid copper tooth pieces, some of the left and right side surfaces of the core tooth pieces are provided with V-shaped hook grooves, and some of the front and rear side surfaces of the core tooth pieces are configured as arc surfaces.

4. The 3D temperature homogenizing plate according to claim 3, characterized in that: The ratio of the tooth height of the core tooth piece to the spacing between the core tooth pieces is 1:1.1-1.5; the ratio of the length of the core tooth piece to the length of the edge tooth piece is 1:0.3-0.

6.

5. The 3D temperature homogenizing plate according to claim 1, characterized in that: The lower cover plate also includes a plurality of gradient support columns, a plurality of coarse copper powder rings and a plurality of fine support columns; the plurality of gradient support columns are fixedly arranged in the core area, and the plurality of coarse copper powder rings and the plurality of fine support columns are fixedly arranged in the peripheral area at even intervals.

6. The 3D temperature homogenizing plate according to claim 5, characterized in that: The gradient support column is divided into an upper section, a middle section and a lower section with lengths decreasing arbitrarily; the porosity of the upper section is greater than that of the middle section, and the porosity of the middle section is greater than that of the lower section.

7. The 3D temperature homogenizing plate according to claim 5, characterized in that: The capillary of the upper cover is a 200-mesh copper mesh, and the thickness of the capillary of the upper cover is 0.05 mm to 0.1 mm; a plurality of fixing holes are arranged in the capillary of the upper cover, and the apertures of the plurality of fixing holes are adapted to the outer diameters of the plurality of gradient support columns and the plurality of thin support columns; The edges of the upper cover plate and the lower cover plate are surrounded to form a water injection port, the water injection port is communicated with the accommodating cavity, and the water injection port is used to inject heat dissipation medium into the accommodating cavity.

8. The 3D temperature homogenizing plate according to claim 1, characterized in that: The composite copper tube includes a copper tube body and an air intake notch. The air intake notch is arranged at the open end of the copper tube body. The height of the air intake notch in the axial direction of the copper tube body is set to be 3 mm to 4 mm, and the air intake notch is arranged in the accommodating cavity.

9. The 3D heat spreader according to claim 8, wherein A groove capillary zone and a copper powder capillary zone are arranged on the inner wall of the copper tube body, and the groove capillary zone is arranged above the copper powder capillary zone.

10. The 3D heat pipe according to claim 9, characterized in that, The groove capillary zone is provided with spiral grooves or straight grooves. The groove depth of the groove capillary zone is 0.05 mm to 0.1 mm, and the groove pitch of the groove capillary zone is 0.2 mm to 0.5 mm; the copper powder capillary zone is covered with a copper powder layer of 100 mesh to 150 mesh and is capillary-lapped with the lower cover.

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