High-precision high-speed chip mounter

Abstract

The invention discloses a high-precision high-speed chip mounter, and belongs to the field of electronic equipment manufacturing. The machine is composed of a machine frame, an automatic feeding module, an automatic discharging module, a substrate conveying module, a dispensing and dipping integrated module and the like, and is provided with a visual module. The linear module is driven by a linear motor, and is high in response speed and accurate in positioning. High-speed production is realized through alternation of double objective tables and parallel connection of a plurality of suction nozzles; and by virtue of closed-loop detection of the visual module, the mounting precision is ensured. Dispensing and dipping are integrated, and diversified gluing requirements are met. And meanwhile, at least six kinds of wafer feeding are supported, and parameters are automatically recognized and adjusted. According to the chip mounter, full-process automation of substrate feeding, glue dispensing and dipping, chip taking correction and mounting can be realized, the production efficiency and the mounting precision are greatly improved, and the problems of low efficiency, poor precision and insufficient compatibility of a traditional chip mounter are effectively solved.

Description

Technical Field

[0001] The present invention relates to the field of electronic device manufacturing, and particularly to a high-precision and high-speed chip mounter. Background Art

[0002] In the process of electronic device manufacturing, the chip mounter plays a key role in accurately mounting electronic components onto the substrate. With the improvement of chip integration and diverse production requirements, the deficiencies of traditional chip mounters in terms of efficiency, precision, and compatibility have become increasingly prominent.

[0003] Taking a semiconductor chip die bonding and chip mounting device disclosed in Chinese Patent Publication No. CN117133683A as an example, in the chip mounting process, this device can only complete the pick-and-place operation of a single chip each time. When facing the task of multi-chip mounting, it is necessary to frequently go back and forth to pick up materials, resulting in a significant increase in operation time. When replacing different types of chips, it is necessary to rely on manual calibration of the suction nozzle and parameters, which not only prolongs the downtime of the device but also easily introduces errors due to human factors. In addition, the device lacks a real-time detection mechanism and a closed-loop correction function. As the multi-chip mounting process progresses, the cumulative error is extremely likely to exceed the allowable range. At the same time, the dispensing and dipping functions are separated, and it is necessary to replace modules or programs, which is time-consuming and laborious. In the actual production process, it cannot flexibly meet diverse process requirements, seriously restricting the improvement of production efficiency and product quality.

[0004] Therefore, developing a new type of chip mounter with high-precision and high-speed mounting capabilities and capable of accommodating various process requirements is not only the key to solving the pain points in the current electronic manufacturing industry but also of great practical significance for promoting the upgrading and development of the entire industry. Summary of the Invention

[0005] The present invention overcomes the above-mentioned deficiencies and adopts the following technical solutions:

[0006] A high-precision and high-speed chip mounter, comprising:

[0007] A frame 1, serving as the support structure of the entire chip mounter and providing an installation basis for other modules;

[0008] An automatic loading module 2 and an automatic unloading module 3 arranged on both sides of the frame 1. The automatic loading module 2 is used to push out the unprocessed substrate, and the automatic unloading module 3 is used to receive the substrate after chip mounting is completed;

[0009] A substrate conveying module 4, bridging between the automatic loading module 2 and the automatic unloading module 3, including a first carrier 41 and a second carrier 42 arranged side by side. The first carrier 41 is used to receive the substrate pushed out by the automatic loading module 2; the second carrier 42 is used to receive the substrate sent out by the first carrier 41 and transfer it;

[0010] The dispensing and dipping integrated module 5 includes a first longitudinal driving mechanism 51, a dispensing mechanism 52, a dipping mechanism 53, a glue supply mechanism 54, and a second longitudinal driving mechanism 55 installed on the frame 1; the dispensing mechanism 52 and the dipping mechanism 53 are connected to the first longitudinal driving mechanism 51 and driven by it; the glue supply mechanism 54 is connected to the second longitudinal driving mechanism 55 and driven by it for supplying glue to the dispensing mechanism 52 and the dipping mechanism 53;

[0011] The wafer loading module 6 is arranged on the frame 1 and includes a wafer fixture 61 for carrying the wafer;

[0012] The chip picking module 7 is used to pick chips from the wafer fixture 61;

[0013] The calibration station module 8 receives the chips taken out by the chip picking module 7 and calibrates the chip posture;

[0014] The bonding head and chip mounting module 9 is arranged adjacent to the automatic unloading module 3 and is used to mount the calibrated chips on the substrate of the second carrier 42;

[0015] The vision module 10 includes:

[0016] The first camera group 101 is arranged along the substrate and chip conveying path and is used for substrate positioning, chip posture detection, and verification of the mounting result;

[0017] The second camera group 102 is arranged beside the tool heads of the dispensing and dipping integrated module 5, the chip picking module 7, and the bonding head and chip mounting module 9, and is used for dynamically detecting the operation accuracy of the tool heads and providing feedback for deviation correction.

[0018] Preferably, the first longitudinal driving mechanism 51 includes a first Y-axis linear module 511 installed on the frame 1, a first movable seat 512 and a second movable seat 513 driven by the first Y-axis linear module 511; the dispensing mechanism 52 is installed on the first movable seat 512 and is provided with a dispensing head 521 capable of fine adjustment; the dipping mechanism 53 is installed on the second movable seat 513 and is provided with a dipping head 531 capable of fine adjustment; the second longitudinal driving mechanism 55 includes a second Y-axis linear module 551 arranged in parallel with the first Y-axis linear module 511 and a third movable seat 552 driven by the second Y-axis linear module 551; the glue supply mechanism 54 is fixed on the third movable seat 552;

[0019] The dispensing head 521 and the dipping head 531 move synchronously through the first Y-axis linear module 511, and can simultaneously perform dispensing and dipping on different regions of a single substrate, such as dispensing on the left side of the substrate and dipping on the right side, or switching the process sequentially without waiting.

[0020] Preferably, the substrate conveying module 4 further includes a first X-axis linear module 43 installed on the frame 1 and driving the first carrier 41 and the second carrier 42 to move in the X-axis direction, a fourth movable seat 44 and a fifth movable seat 45 driven by the first X-axis linear module 43; the first carrier 41 is arranged on the fourth movable seat 44 and is provided with a first transfer device 411 for transferring the substrate that has completed the glue application process by the dispensing mechanism 52 or the dipping mechanism 53 to the second carrier 42; the second carrier 42 is arranged on the fifth movable seat 45 and is provided with a second transfer device 421 for transferring the substrate that has completed the chip mounting to the automatic blanking module 3.

[0021] The first carrier 41 receives the substrate from the loading module. After completing the dispensing / dipping, it is transferred to the second carrier 42 through the first transfer device 411; the second carrier 42 synchronously performs chip mounting, forming a "glue application - mounting" parallel process. For example, when the first carrier processes the dispensing of substrate A, the second carrier processes the mounting of substrate B. However, a single carrier only processes one substrate at a time, and the overall efficiency is improved by alternating the use of the two carriers.

[0022] Preferably, the wafer loading module 6 includes a lifting mechanism 60 installed on the frame 1 and used for lifting the wafer, a second X-axis linear module 62 installed on the frame 1, and a sixth movable seat 63 driven by the second X-axis linear module 62; the sixth movable seat 63 is drivingly connected to a seventh movable seat 65 through a third Y-axis linear module 64; the wafer fixture 61 is arranged on the seventh movable seat 65.

[0023] The wafer fixture 61 can carry at least 6 different types of wafers, and the target wafer is switched through the second X-axis and the third Y-axis linear modules; the vision system automatically identifies the wafer type and matches the corresponding nozzle parameters such as suction force and picking height to achieve multi-chip mixed-line production, such as mounting chips from 3 types of wafers on the same substrate.

[0024] Preferably, the chip picking module 7 includes a fourth Y-axis linear module 71 arranged above the first X-axis linear module 43 and an eighth movable seat 72 driven by the fourth Y-axis linear module 71; an adsorption mechanism 73 for adsorbing chips is arranged on the eighth movable seat 72; the adsorption mechanism 73 is equipped with at least two fine-tunable first nozzles 731.

[0025] The adsorption mechanism 73 is equipped with at least 2 independently fine-tunable first nozzles 731, such as double nozzles or four nozzles, which can simultaneously pick up multiple chips of the same type or different types from the wafer fixture 61. The nozzle spacing can be dynamically adjusted to adapt to any layout of the chips on the substrate, such as an array layout or a dispersed layout.

[0026] Preferably, the calibration station module 8 includes a third X-axis linear module 81, a first fine-tuning platform 82, and a second fine-tuning platform 83 installed below the fourth Y-axis linear module 71; the third X-axis linear module 81 is drivingly connected to a ninth movable seat 812 and a tenth movable seat 813; the first fine-tuning platform 82 is installed on the ninth movable seat 812 and is internally provided with a θ-axis rotation mechanism 82a and an X / Y-axis adjustment mechanism 82b for adjusting the angle and position of the chip; the second fine-tuning platform 83 is installed on the tenth movable seat 813 and is internally provided with a θ-axis rotation mechanism 83a and an X / Y-axis adjustment mechanism 83b, and alternately receives the chips of the chip picking module 7 with the first fine-tuning platform 82;

[0027] The first fine-tuning platform 82 and the second fine-tuning platform 83 alternately receive multiple chips of the chip picking module 7 through the third X-axis linear module 81; each platform is internally provided with a θ-axis rotation mechanism and an X / Y-axis adjustment mechanism, and can independently calibrate the chip angle by ±0.01° and the position by ±1μm, realizing the "picking-calibration-mounting" pipeline operation. When platform 1 is calibrating, platform 2 synchronously receives new chips.

[0028] Preferably, the bonding head mounting module 9 includes an eleventh movable seat 91 driven by the fourth Y-axis linear module 71 and a bonding head mechanism 92 installed on the eleventh movable seat 91; the bonding head mechanism 92 is provided with at least two groups of independently controlled second suction nozzles 921 for mounting the calibrated chips on the glued substrate; the bonding head mechanism 92 is provided with at least 2 groups of independently controlled second suction nozzles 921, supporting the synchronous mounting of multiple calibrated chips to different target positions on a single substrate; at the same time, sharing the fourth Y-axis linear module 71, the picking and mounting paths are highly coincident, reducing the idle movement time.

[0029] Preferably, a fifth Y-axis linear module 11 for driving the camera of the vision module 10 and a twelfth movable seat 111 driven by the fifth Y-axis linear module 11 are further provided beside the bonding head mounting module 9.

[0030] Preferably, the first camera group 101 includes:

[0031] A first vision camera 101a, arranged above the first carrier 41, for detecting the initial position of the unglued substrate;

[0032] A second vision camera 101b, arranged above the calibration station module 8, simultaneously detecting the offsets in the X / Y / θ three directions of multiple uncalibrated chips and generating independent calibration parameters;

[0033] A third vision camera 101c, arranged beside the bonding head mechanism 92, for verifying the posture of the calibrated chips;

[0034] The fourth vision camera 101d is set on the twelfth movable seat 111 and is used to detect the substrate after the mounting is completed.

[0035] Preferably, the second camera group 102 includes:

[0036] The fifth vision camera 102a is arranged beside the dispensing mechanism 52 and is used to monitor the dispensing position deviation in real time and trigger dynamic path correction;

[0037] The sixth vision camera 102b is arranged beside the dipping glue mechanism 53 and is used to detect the dipping glue contact angle and the glue layer uniformity in real time and correct them in time;

[0038] The seventh vision camera 102c is arranged beside the adsorption mechanism 73 and is used to monitor the multi-nozzle posture of the adsorption mechanism 73 in real time to ensure that the level error is less than 0.1° when each chip is adsorbed;

[0039] The eighth vision camera 102d is arranged beside the bonding head mechanism 92 and is used to dynamically detect the multi-nozzle position of the bonding head mechanism 92. Before mounting, automatically compensate for the position deviation of each nozzle, such as nozzle 1 offset +2μm, nozzle 2 offset -1μm, and the system corrects independently.

[0040] Each linear module of the present invention, such as the X-axis and Y-axis linear modules, is driven by a linear motor, and has the characteristics of high-speed response, maximum moving speed ≥1000mm / s, high-precision positioning ±1μm, and no mechanical wear, providing power support for multi-station collaborative operation.

[0041] Compared with the prior art, the beneficial effects of the present invention are:

[0042] 1. High-precision mounting: Through the collaborative work of each module and the real-time detection and feedback correction function of the vision module, such as the fine-tuning design of the dispensing head and the dipping glue head, chip posture correction and mounting result verification, etc., in each link from chip adsorption, correction to mounting, the vision camera detects the plane deviation X / Y displacement and θ rotation, and feeds back to the corresponding module in real time, such as the correction platform adjusts the angle, and the bonding head corrects the nozzle position, forming a "detection - adjustment - verification" closed loop, eliminating the cumulative error during multi-chip mounting. It can ensure the high precision of chip mounting.

[0043] 2. High-speed production: Through multi-nozzle (≥2) simultaneous material taking, double correction platforms alternating operation, and multi-nozzle synchronous mounting, realize the "taking - correcting - mounting" pipeline processing of multiple chips on a single substrate. For example: two nozzles simultaneously pick up 2 chips, the correction station calibrates synchronously on two platforms, and the bonding head double nozzles mount synchronously. Compared with the single-nozzle serial processing, the production efficiency is significantly improved. The double carriers alternate for gluing and mounting. When substrate A is being glued, substrate B is being mounted synchronously, further reducing the equipment idle time.

[0044] 3. Integrated Function: This mounter integrates the dispensing head and the dipping head into the same drive mechanism, and realizes seamless switching and synchronous operation of the two processes through an intelligent control system. For example, during the production of a certain packaging device, the packaging device needs to dip glue for a certain type of chip to enhance heat dissipation and fixation, and also needs to dispense glue for another type of chip to achieve precise connection. This mounter can complete the two processes simultaneously without pausing or manual intervention, significantly improving the processing efficiency of complex substrates and meeting the diverse gluing requirements of high-density packaging. At the same time, relying on the second longitudinal drive mechanism to accurately drive the glue supply mechanism, dynamic optimization of the glue supply path and precise control of the glue quality are achieved. The glue supply mechanism, the dispensing head, and the dipping head achieve motion synchronization through a linear module. When the tool head moves rapidly along the Y-axis, the glue supply mechanism follows synchronously, shortening the glue delivery distance to the shortest, avoiding problems such as glue stagnation and pressure fluctuations caused by long paths in traditional fixed pipelines, and ensuring the position accuracy of the glue dots and the uniformity of the glue layer.

[0045] 4. Multi-Wafer Compatibility and Automatic Calibration: The frame of this mounter integrates 6 groups of wafer fixtures. Through the high-precision motion control of the second X-axis linear module and the third Y-axis linear module, rapid switching and precise positioning of different types of wafers are achieved. With the lifting mechanism accurately controlling the wafer height, the chip picking module can quickly align with the target chip, avoiding the time-consuming mechanical calibration of traditional equipment. The vision module scans the wafer in real time, automatically identifies parameters such as chip size and pin layout, dynamically adjusts the suction parameters of the adsorption mechanism, and synchronously matches the angle adjustment parameters of the calibration station and the mounting pressure of the bonding head. The entire process does not require manual intervention, and the equipment can quickly complete wafer switching and enter the production state. At the same time, it supports simultaneous feeding of different wafers in the same column or the same row, significantly improving the flexibility of small-batch production of multiple varieties and providing an efficient and compatible production solution for complex scenarios such as semiconductor packaging.

[0046] 5. Fully Automatic Loading and Unloading and Double-Carrier Table Flow Operation: The automatic loading module continuously pushes the substrate to the first carrier table. After the first carrier table completes gluing, it is automatically transferred to the second carrier table for mounting. The mounted substrate is collected by the automatic unloading module. The entire process has no manual intervention, realizing continuous operation of "loading - processing - unloading". Description of the Drawings

[0047] Figure 1 is the overall structural schematic diagram of the present invention;

[0048] Figure 2 is the top plan view of the present invention;

[0049] Figure 3 is the structural schematic diagram of the substrate conveying module of the present invention

[0050] Figure 4 is the structural schematic diagram of the dispensing and dipping integrated module of the present invention;

[0051] Figure 5 It is a schematic structural diagram of the wafer loading module of the present invention;

[0052] Figure 6 It is a schematic structural diagram of the substrate conveying module and the bonding head chip mounter module of the present invention;

[0053] Figure 7 It is a schematic structural diagram of the calibration station module of the present invention; Detailed implementation manners

[0054] (1) Substrate loading

[0055] The automatic loading module 2 pushes the unprocessed substrate to the first carrier 41, and the first X-axis linear module 43 drives the first carrier 41 to move to the vision inspection station; the first vision camera 101a detects the initial position of the unglued substrate, providing a positioning reference for subsequent dispensing and chip mounting processes.

[0056] (2) Dispensing and dipping

[0057] The first longitudinal driving mechanism 51 drives the dispensing mechanism 52 and the dipping mechanism 53 to move. According to the position of the substrate and the processing requirements, a suitable dispensing or dipping method is selected to apply glue to the substrate. For example, the dispensing head 521 dispenses glue on the substrate area A, and the dipping head 531 dips glue on the area B. The dispensing head 521 and the dipping head 531 move synchronously along the Y-axis through the first Y-axis linear module 511. The dispensing head sprays glue dots with a diameter of ±5μm at an interval of 0.1mm, and the dipping head contacts the substrate at an inclination angle of 30° to dip glue. The fifth vision camera 102a and the sixth vision camera 102b monitor the dispensing and dipping positions in real time. If there is a deviation, the control system drives the first Y-axis linear module 511 to adjust the position. The glue supply mechanism 55 supplies glue stably through the second Y-axis linear module 551 to ensure the glue application quality.

[0058] (3) Chip picking

[0059] The fourth Y-axis linear module 71 of the chip picking module 7 drives the eighth movable seat 72 to move, so that the first suction nozzle 731 of the adsorption mechanism 73 adsorbs the chip from the wafer fixture 61, and the seventh vision camera 102c detects the adsorption posture of the chip in real time.

[0060] (4) Chip calibration

[0061] The chip picking module 7 sends the picked chip to the calibration station module 8, and the first fine-tuning platform 82 and the second fine-tuning platform 83 alternately receive the chip. The built-in θ-axis rotation mechanism and X / Y-axis adjustment mechanism adjust the angle and position of the chip, and the second vision camera 101b detects the offset of the uncalibrated chip, providing data support for calibration.

[0062] (5) Chip mounting

[0063] The bonding head mechanism 92 of the bonding head patch module 9 adsorbs the corrected chip through the second suction nozzle 921, and under the drive of the fourth Y-axis linear module 71, mounts the chip onto the glued substrate on the second carrier 42. The third vision camera 101c verifies the posture of the corrected chip, and the eighth vision camera 102d detects in real time the chip that has been corrected and adsorbed by the bonding head mechanism 92.

[0064] (VI) Substrate blanking

[0065] The second transfer device 421 of the second carrier 42 transfers the substrate with the chip mounting completed to the automatic blanking module 3. The first X-axis linear module 43 drives the second carrier 42 to quickly reset to prepare for processing the next substrate; the fourth vision camera 101d detects the substrate with the mounting completed and verifies the mounting result.

[0066] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-precision and high-speed chip mounter, characterized in that, Comprising: Frame (1); An automatic loading module (2) and an automatic unloading module (3) arranged on both sides of the frame (1), the automatic loading module (2) being used to push out unprocessed substrates, and the automatic unloading module (3) being used to receive the substrates after chip mounting is completed; A substrate conveying module (4) bridging between the automatic loading module (2) and the automatic unloading module (3), including a first carrier table (41) and a second carrier table (42) arranged side by side, the first carrier table (41) being used to receive the substrates pushed out by the automatic loading module (2); the second carrier table (42) being used to receive the substrates sent out by the first carrier table (41) and transfer them; A dispensing and dipping integrated module (5), including a first longitudinal driving mechanism (51), a dispensing mechanism (52), a dipping mechanism (53), a glue supply mechanism (54) and a second longitudinal driving mechanism (55) installed on the frame (1); the dispensing mechanism (52) and the dipping mechanism (53) are connected to the first longitudinal driving mechanism (51) and driven by it; The glue supply mechanism (54) is connected to the second longitudinal driving mechanism (55) and driven by it, and is used to supply glue to the dispensing mechanism (52) and the dipping mechanism (53); A wafer loading module (6) arranged on the frame (1), including a wafer fixture (61) for carrying wafers; A chip picking module (7) for picking chips from the wafer fixture (61); A calibration station module (8) for receiving the chips picked out by the chip picking module (7) and calibrating the chip postures; A bonding head chip mounting module (9) arranged adjacent to the automatic unloading module (3) for mounting the calibrated chips onto the substrates on the second carrier table (42); A vision module (10), including: A first camera group (101) arranged along the substrate and chip conveying paths for substrate positioning, chip posture detection and verification of mounting results; A second camera group (102) arranged beside the tool heads of the dispensing and dipping integrated module (5), the chip picking module (7) and the bonding head chip mounting module (9) for dynamically detecting the operation accuracy of the tool heads and feedback for deviation correction.

2. The high-precision and high-speed chip mounter according to claim 1, wherein The first longitudinal driving mechanism (51) includes a first Y-axis linear module (511) installed on the frame (1), a first movable seat (512) and a second movable seat (513) driven by the first Y-axis linear module (511); the dispensing mechanism (52) is installed on the first movable seat (512) and is provided with a dispensing head (521) capable of fine adjustment; the dipping mechanism (53) is installed on the second movable seat (513) and is provided with a dipping head (531) capable of fine adjustment; the second longitudinal driving mechanism (55) includes a second Y-axis linear module (551) arranged parallel to the first Y-axis linear module (511), and a third movable seat (552) driven by the second Y-axis linear module (551); the glue supply mechanism (54) is fixed on the third movable seat (552).

3. The high-precision and high-speed chip mounter according to claim 2, wherein, The substrate conveying module (4) further includes a first X-axis linear module (43) installed on the frame (1) and driving the first carrier table (41) and the second carrier table (42) to move in the X-axis direction, a fourth movable seat (44) and a fifth movable seat (45) driven by the first X-axis linear module (43); the first carrier table (41) is arranged on the fourth movable seat (44) and is provided with a first conveying device (411) for conveying the substrate that has completed the gluing process by the dispensing mechanism (52) or the dipping glue mechanism (53) to the second carrier table (42); the second carrier table (42) is arranged on the fifth movable seat (45) and is provided with a second conveying device (421) for conveying the substrate that has completed the chip mounting to the automatic blanking module (3).

4. A high-precision and high-speed chip mounter according to claim 1, characterized in that, The wafer loading module (6) includes a lifting mechanism (60) installed on the frame (1) and used for lifting the wafer, a second X-axis linear module (62) installed on the frame (1), and a sixth movable seat (63) driven by the second X-axis linear module (62); the sixth movable seat (63) is drivingly connected with a seventh movable seat (65) through a third Y-axis linear module (64); the wafer fixture (61) is arranged on the seventh movable seat (65).

5. The high-precision and high-speed chip mounter according to claim 3, wherein, The chip picking module (7) includes a fourth Y-axis linear module (71) arranged above the first X-axis linear module (43), and an eighth movable seat (72) driven by the fourth Y-axis linear module (71); an adsorption mechanism (73) for adsorbing the chip is arranged on the eighth movable seat (72); the adsorption mechanism (73) is equipped with at least two first suction nozzles (731) that can be finely adjusted.

6. The high-precision and high-speed chip mounter according to claim 5, wherein, The calibration station module (8) includes a third X-axis linear module (81) installed below the fourth Y-axis linear module (71), a first fine adjustment platform (82), and a second fine adjustment platform (83); the third X-axis linear module (81) is drivingly connected with a ninth movable seat (812) and a tenth movable seat (813); the first fine adjustment platform (82) is installed on the ninth movable seat (812) and internally provided with a θ-axis rotation mechanism (82a) and an X / Y-axis adjustment mechanism (82b) for adjusting the chip angle and position; the second fine adjustment platform (83) is installed on the tenth movable seat (813) and internally provided with a θ-axis rotation mechanism (83a) and an X / Y-axis adjustment mechanism (83b), and alternately receives the chips from the chip picking module (7) with the first fine adjustment platform (82).

7. A high-precision and high-speed chip mounter according to claim 5, characterized in that, The bonding head chip mounting module (9) includes an eleventh movable seat (91) driven by the fourth Y-axis linear module (71) and a bonding head mechanism (92) installed on the eleventh movable seat (91); the bonding head mechanism (92) is provided with at least two groups of independently controlled second suction nozzles (921) for mounting the calibrated chips on the glued substrate.

8. The high-precision and high-speed chip mounter according to claim 7, wherein, A fifth Y-axis linear module (11) for driving the camera of the vision module (10) and a twelfth movable seat (111) driven by the fifth Y-axis linear module (11) are also arranged beside the bonding head chip mounting module (9).

9. The high-precision and high-speed chip mounter according to claim 8, wherein The first camera group (101) includes: The first vision camera (101a) is disposed above the first stage (41) and is used to detect the initial position of the unglued substrate; The second vision camera (101b) is disposed above the calibration station module (8) to detect the offset of the uncalibrated chip; The third vision camera (101c) is disposed beside the bonding head mechanism (92) and is used to verify the posture of the chip after calibration; The fourth vision camera (101d) is disposed on the twelfth movable seat (111) and is used to detect the substrate after the mounting is completed.

10. A high-precision and high-speed chip mounter according to any one of claims 7, characterized in that, The second camera group (102) includes: The fifth vision camera (102a) is disposed beside the dispensing mechanism (52) and is used to monitor the dispensing position deviation in real time and trigger dynamic path correction; The sixth vision camera (102b) is disposed beside the dipping mechanism (53) and is used to detect the dipping contact angle and the glue layer uniformity in real time and make timely corrections; The seventh vision camera (102c) is disposed beside the adsorption mechanism (73) and is used to detect the chip adsorption posture in real time; The eighth vision camera (102d) is disposed beside the bonding head mechanism (92) and is used to detect the calibrated chip adsorbed by the bonding head mechanism (92) in real time.

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