Light-emitting diode lead frame and light-emitting diode thereof

Abstract

The invention relates to the technical field of light-emitting diodes, in particular to a light-emitting diode lead frame and a light-emitting diode thereof.The light-emitting diode lead frame comprises an LED chip, a heat dissipation base, a lead packaging base, electrode guide pins, a glue filling assembly and a glue storage bag, the heat dissipation base is arranged in the lead packaging base, the electrode guide pins are fixedly installed in the lead packaging base, and the glue storage bag is arranged in the lead packaging base; the LED chip is fixedly installed on the heat dissipation base, glue filling assemblies are symmetrically arranged in the wire packaging base and connected with the glue storage bag, organic silica gel is poured into the glue storage bag, and the glue filling assemblies apply pressure to the glue storage bag through temperature changes. According to the invention, the place where the fit clearance is generated between the heat dissipation base and the wire packaging base is filled up through the organic silica gel, so that delamination between the wire packaging base and the heat dissipation base is avoided, the LED chip is exposed in air or moisture, the dry working environment of the LED chip is ensured, and the service life of the LED is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting diodes, and particularly to a lead frame for a light-emitting diode and a light-emitting diode thereof. Background Art

[0002] A light-emitting diode, abbreviated as LED, is a commonly used light-emitting device that emits light by the recombination of electrons and holes. The light-emitting diode can efficiently convert electrical energy into light energy and has a wide range of applications in modern society, such as lighting, flat panel displays, medical devices, etc. In the early stage, this electronic component could only emit low-intensity red light. Subsequently, versions of other monochromatic lights were developed, and the emitted light has covered visible light, infrared, and ultraviolet light, and the light intensity has also been increased to a considerable level. A light-emitting diode device usually includes a surface-mounted light-emitting diode package, which has a light-emitting diode chip inside. With the development of technology, a light-emitting diode package with a pre-sealed lead frame for carrying a light-emitting diode chip has gradually replaced the traditional ceramic substrate. The pre-sealed lead frame includes an insulating encapsulation adhesive material covering the lead frame, and the encapsulation adhesive material exposes the positive electrode and the negative electrode of the lead frame. However, the bonding force between the lead frame and the encapsulation adhesive material is usually weak, and there are also great differences in the thermal expansion coefficients of the lead frame and the encapsulation adhesive material. Due to the different thermal expansion coefficients of the lead frame and the encapsulation adhesive material, when the encapsulation structure undergoes temperature cycling, stress will be induced at the interface between the lead frame and the encapsulation adhesive material, and the encapsulation structure will release stress during long-term aging, resulting in a poor adhesion force between the lead frame and the encapsulation adhesive material, and delamination between the lead frame and the encapsulation adhesive material occurs, exposing the delaminated part of the light-emitting diode package to air or moisture, thereby causing damage to the light-emitting diode package.

[0003] To avoid the deterioration of the adhesion force between the lead frame of the light-emitting diode and the encapsulation adhesive material and the occurrence of delamination between the lead frame and the encapsulation adhesive material, the invention patent with the application number CN202011382095.X provides an LED package. The invention provides an LED package by providing a packaging substrate, an LED chip, a packaging layer, and an anti-delamination component on the LED package. The upper surface of the packaging substrate is provided with a die bonding area and a non-die bonding area. The LED chip is arranged on the die bonding area of the packaging substrate. The packaging layer is arranged on the die bonding area and the non-die bonding area of the packaging substrate. The LED chip is encapsulated between the packaging substrate and the packaging layer. The surface of the packaging layer away from the packaging substrate is the upper surface of the packaging layer. The anti-delamination component is arranged on the non-die bonding area of the packaging substrate, and the anti-delamination component extends downward from the upper surface of the packaging layer to the packaging substrate and fixes the packaging layer. The packaging layer is fixed by the anti-delamination component to prevent the packaging layer from falling off the packaging substrate, improve the airtightness of the LED package, avoid water vapor from penetrating into the interior of the LED package, and thus improve the reliability of the LED package. However, if the packaging substrate is subjected to stress or vibration, a fitting gap is generated between the anti-delamination component and the packaging layer, and water vapor will still penetrate into the interior of the LED package.

[0004] Therefore, in order to avoid the adhesion between the lead frame and the encapsulation adhesive material from deteriorating due to stress release during the long-term aging process of the light-emitting diode encapsulation structure, resulting in delamination between the lead frame and the encapsulation adhesive material, and causing the delaminated part of the light-emitting diode encapsulation to be exposed to air or moisture, thereby damaging the light-emitting diode encapsulation, a light-emitting diode lead frame and a light-emitting diode are proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a light-emitting diode lead frame and a light-emitting diode. In order to avoid stress release during the long-term aging process of the light-emitting diode encapsulation structure, which causes the adhesion between the lead frame and the encapsulation adhesive material to deteriorate and results in delamination between the lead frame and the encapsulation adhesive material, exposing the delaminated part of the light-emitting diode encapsulation to air or moisture, thereby damaging the light-emitting diode encapsulation. By providing a glue-filling component inside the wire encapsulation seat, the glue-filling component extrudes the silicone rubber inside the glue storage bag through temperature changes, and the silicone rubber fills the places where there are fitting gaps between the heat dissipation base and the wire encapsulation seat, avoiding delamination between the wire encapsulation seat and the heat dissipation base, preventing the LED chip from being exposed to air or moisture, ensuring a dry working environment for the LED chip, and improving the service life of the light-emitting diode.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A light-emitting diode lead frame includes a heat dissipation base, a wire encapsulation seat, a glue-filling component, and a glue storage bag. A circular boss is provided inside the wire encapsulation seat. The heat dissipation base is arranged inside the wire encapsulation seat and is fitted and installed with the circular boss. The glue-filling components are symmetrically arranged inside the wire encapsulation seat. The glue storage bag is installed on the wire encapsulation seat. The glue-filling component is connected to the glue storage bag. The overall horizontal position of the glue-filling component is lower than the top end of the heat dissipation base. The glue storage bag is filled with silicone rubber. A glue flow ring is installed on the heat dissipation base. The glue storage bag is connected to the glue flow ring. The glue-filling component applies pressure to the glue storage bag through temperature changes, and the silicone rubber is discharged from the glue flow ring.

[0008] By setting the wire encapsulation base to be circular, a circular boss is arranged in the middle of the wire encapsulation base, the heat dissipation base is inserted into the circular boss from the bottom of the wire encapsulation base, the upper surface of the heat dissipation base fits with the circular boss, the glue filling component is located on both sides of the heat dissipation base. When the LED chip continuously emits light and the temperature inside the wire encapsulation base rises, the glue filling component applies pressure to the glue storage bag, extruding the silicone rubber inside the glue storage bag. The silicone rubber flows downward from inside the glue flow ring. The silicone rubber will undergo a curing reaction only when it contacts the air. When the adhesion between the heat dissipation base and the wire encapsulation base becomes poor, the silicone rubber flows into the fitting place between the heat dissipation base and the wire encapsulation base to fill the gap, preventing delamination between the wire encapsulation base and the heat dissipation base, exposing the LED chip to air or moisture, ensuring a dry working environment for the LED chip, and improving the service life of the light-emitting diode.

[0009] Preferably, the glue filling component includes a driving spring, a pushing plate, and a bag mounting groove. The bag mounting groove fits with the side wall of the circular boss. The glue storage bag is installed inside the bag mounting groove. The pushing plate is arranged on one side of the bag mounting groove. The bottom of the pushing plate is in the same plane as the bottom of the bag mounting groove. A pressing plate is fixedly installed on the pushing plate. The pressing plate passes through the bag mounting groove and fits with the surface of the glue storage bag. One end of the driving spring is fixedly installed on the inner wall of the wire encapsulation base, and the other end is connected to the side wall of the pushing plate. The driving spring is made of a shape memory metal material. The driving spring elongates when reaching the set temperature. The glue flow ring is set in a C shape. The glue flow ring is located above the fitting place between the heat dissipation base and the circular boss. The glue flow ring is arrayed with glue flow ports. One end of the glue flow ring passes through the bag mounting groove and communicates with the inside of the glue storage bag. The volume of the silicone rubber accounts for three-quarters of the volume of the glue storage bag. A lifting component is arranged on the bag mounting groove. The lifting component lifts the horizontal position of the glue storage bag with the movement of the pushing plate as the power.

[0010] By installing the glue storage bag in the bagging groove, the bagging groove is set in an arc crescent shape, the pushing plate and the pressing plate are set in the same arc shape, the bottom of the pushing plate fits the inner end face of the wire encapsulation seat, the pushing plate can slide smoothly in the wire encapsulation seat, the driving spring is in a contracted state at room temperature, when the electrode leads are energized, the LED chip continuously emits light, after the internal temperature of the wire encapsulation seat reaches the set temperature, the driving spring elongates, the driving spring makes the pushing plate move towards the direction of the LED chip, the pressing plate moves with the pushing plate, the pressing plate applies pressure to the glue storage bag, the glue storage bag deforms in the bagging groove, the silicone rubber is extruded from the glue storage bag, and slides into the glue flow ring from the connection between the glue flow ring and the glue storage bag. A glue flow channel with the same shape as the glue flow ring is provided in the glue flow ring, the glue flow channel is communicated with a plurality of glue flow ports, the silicone rubber flows out from the glue flow ports and flows into the joint between the heat dissipation base and the wire encapsulation seat. Since the thermal expansion coefficients of the heat dissipation base and the wire encapsulation seat are different, when the encapsulation structure undergoes a temperature cycle, stress will be generated at the joint interface between the heat dissipation base and the wire encapsulation seat, and the materials of the encapsulation structure will also release stress during long-term aging, resulting in a poor adhesion force between the heat dissipation base and the wire encapsulation seat, and gaps will be generated at the joint interface between the heat dissipation base and the wire encapsulation seat. At this time, the silicone rubber flows into the gaps, contacts the air and undergoes a curing reaction to fill the gaps, improving the adhesion force between the heat dissipation base and the wire encapsulation seat, preventing moisture from entering the inside of the light-emitting diode, and increasing the service life of the LED chip.

[0011] Preferably, the lifting component includes a sliding groove, a horizontal slider, a vertical slider and a connecting rod. The sliding groove is set in an L shape, the sliding groove is fixedly installed on both sides of the bagging groove, the horizontal slider is horizontally slidably installed in the sliding groove, the vertical slider is vertically slidably installed in the sliding groove, both ends of the connecting rod are rotatably installed on the horizontal slider and the vertical slider respectively, one end of the horizontal slider is fixedly connected to the side wall of the pushing plate, and a lifting plate is fixedly installed at the end of the vertical slider. The lifting plate is set in an L shape, the lifting plate is located inside the bagging groove and fits the bottom of the glue storage bag.

[0012] By arranging a lifting component on the bagging groove, two identical sliding grooves are fixedly installed on both sides of the bagging groove. The horizontal slider and the vertical slider are limited to slide within the L-shaped sliding groove. When the temperature inside the wire encapsulation seat reaches the set temperature, the driving spring elongates, and the driving spring causes the pushing plate to move towards the direction of the LED chip. The horizontal slider moves in the same direction as the pushing plate. At this time, the horizontal slider is limited to move within the sliding groove. Since the connecting rod is rotationally connected to the horizontal slider and the vertical slider, under the action of the power transmission of the connecting rod, the vertical slider moves upward in the vertical direction, and the lifting plate moves upward with the vertical slider. The lifting plate lifts the bottom of the glue storage bag, causing the liquid level of the silicone rubber in the glue storage bag to rise, and the silicone rubber is extruded from the glue flowing ring. The lifting component ensures that the volume of the silicone rubber extruded by each pressing plate is the same, avoids excessive extrusion of the silicone rubber from affecting the internal structure of the light-emitting diode, and improves the utilization rate of the silicone rubber.

[0013] Preferably, an overflow groove is provided on the circular convex platform, the glue flowing ring is located directly above the overflow groove, the overflow groove is arranged in a circular ring shape, and the overflow groove is located above the joint of the heat dissipation base and the wire encapsulation seat.

[0014] By arranging an overflow groove on the circular convex platform, when the silicone rubber flows into the gap between the heat dissipation base and the wire encapsulation seat, the overflow groove can hold more silicone rubber. And affected by the surface tension of the fluid, the silicone rubber will stay between the side wall of the overflow groove and the heat dissipation base, avoiding the continuous flow of the silicone rubber, shortening the time required for the silicone rubber to solidify, and improving the joint effect of the heat dissipation base and the wire encapsulation seat.

[0015] Preferably, a return groove is provided on the circular convex platform. The return groove is composed of a plurality of rectangular grooves and a circular ring groove. The radius of the circular ring groove of the return groove is larger than the radius of the overflow groove. The rectangular grooves of the return groove are located on the side wall of the bagging groove, and a plurality of glue passing grooves corresponding to the rectangular grooves are provided on the side wall of the bagging groove. The plurality of glue passing grooves are communicated with the inside of the glue storage bag.

[0016] By arranging a return groove on the circular convex platform, if there is no gap yet between the joint interface of the heat dissipation base and the wire encapsulation seat, or the generated gap is small, and there is still remaining silicone rubber after the discharged silicone rubber fills the gap, the remaining silicone rubber will flow into the glue passing groove from the return groove and finally be recycled into the glue storage bag, avoiding the remaining of excess silicone rubber on the circular convex platform and further improving the utilization rate of the silicone rubber.

[0017] Preferably, a counterweight is arranged inside the glue storage bag, and the vertical slider drives the counterweight to move within the silicone rubber when moving.

[0018] By arranging a counterweight inside the glue storage bag, when the light-emitting diode moves and rotates with the installation device or is vibrated, the counterweight will move inside the glue storage bag, accelerating the flow rate of the silicone rubber. After the flow rate of the silicone rubber is accelerated, it can carry away more heat generated by the LED chip, improving the heat dissipation effect of the heat dissipation base.

[0019] Preferably, the bottom of the glue flow ring is provided with an inclined slope, and the horizontal height of the position where the glue flow ring communicates with the glue storage bag is higher than the lowest horizontal position of both ends of the glue flow ring.

[0020] By arranging an inclined slope at the bottom of the glue flow ring, when the silicone rubber flows out from the connection between the glue flow ring and the glue storage bag, the silicone rubber flows from the middle of the glue flow ring to both sides of the glue flow ring along the inclined slope of the glue flow ring, ensuring that the silicone rubber can flow out from each glue outlet and avoiding that some gaps cannot be filled, further improving the fitting effect between the heat dissipation base and the wire encapsulation base.

[0021] A light-emitting diode equipped with the above-mentioned wire frame, characterized in that:

[0022] A lens is fixedly installed on the wire encapsulation base. The lens fits with the inner side wall of the wire encapsulation base, and the lens closes and covers the upper part of the wire encapsulation base, enabling the LED chip to work in a sealed and dry environment. An electrode lead is installed inside the wire encapsulation base. One end of the electrode lead extends to the outside of the wire encapsulation base. The electrode lead is divided into a positive electrode and a negative electrode at both ends, symmetrically arranged inside the wire encapsulation base. An LED chip is fixedly installed on the heat dissipation base. Two bonding wires are respectively led out from the LED chip, one is welded to the positive electrode lead, and the other is welded to the negative electrode lead. When the electrode lead is energized, the LED chip can emit light for illumination. Liquid blocking plates are symmetrically arranged on the circular convex platform. The liquid blocking plates are arranged in an arc shape. The side walls of the liquid blocking plates fit with the side walls of the bagging groove. The liquid blocking plates and the bagging groove are combined into a circle to wrap the circular convex platform, preventing excess silicone rubber from flowing out of the boundary of the circular convex platform during the filling work and falling onto the electrode lead, affecting the conductivity of the electrode lead and ensuring the stability of the light-emitting diode.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] 1. By arranging a glue filling component inside the light-emitting diode, when the temperature inside the wire encapsulation base rises, the glue filling component applies pressure to the glue storage bag, extruding the silicone rubber. The silicone rubber flows into the joint between the heat dissipation base and the wire encapsulation base to fill the gaps, preventing delamination between the wire encapsulation base and the heat dissipation base, exposing the LED chip to air or moisture, ensuring a dry working environment for the LED chip, and improving the service life of the light-emitting diode.

[0025] 2. The pressing plate is driven by a driving spring to extrude the silicone rubber bag, so that the silicone rubber is extruded from the silicone rubber bag. The silicone rubber flows into the gap generated between the heat dissipation base and the wire encapsulation seat, contacts the air and undergoes a curing reaction to fill the gap, improving the adhesion between the heat dissipation base and the wire encapsulation seat, preventing moisture from entering the interior of the light-emitting diode, and increasing the service life of the LED chip.

[0026] 3. By arranging a lifting assembly beside the silicone rubber bag, the lifting plate lifts the bottom of the silicone rubber bag, raising the liquid level of the silicone rubber in the silicone rubber bag. The silicone rubber is extruded from the glue flow ring. The lifting assembly ensures that the volume of the silicone rubber extruded by the pressing plate each time is the same, preventing excessive extrusion of the silicone rubber from affecting the internal structure of the light-emitting diode and improving the utilization rate of the silicone rubber. Description of the Drawings

[0027] Figure 1 is the external view schematic diagram of the present invention;

[0028] Figure 2 is the internal structure schematic diagram of the present invention;

[0029] Figure 3 is the front sectional view of the present invention;

[0030] Figure 4 is the top view of the internal structure of the present invention;

[0031] Figure 5 is the installation schematic diagram of the glue filling assembly of the present invention;

[0032] Figure 6 is the structural schematic diagram of the adding assembly of the present invention;

[0033] Figure 7 is the sectional view of the glue filling assembly of the present invention;

[0034] Figure 8 is the schematic diagram of the elongation of the driving spring of the present invention.

[0035] In the figures: 1. LED chip; 2. Heat dissipation base; 3. Wire encapsulation seat; 31. Circular boss; 32. Overflow groove; 33. Return groove; 4. Electrode lead; 5. Lens; 6. Glue filling assembly; 61. Driving spring; 62. Pushing plate; 621. Pressing plate; 63. Bagging groove; 631. Glue through groove; 64. Glue flow ring; 641. Glue flow port; 7. Silicone rubber bag; 8. Bonding wire; 9. Lifting assembly; 91. Sliding groove; 92. Horizontal slider; 93. Vertical slider; 94. Connecting rod; 95. Lifting plate; 10. Counterweight; 11. Liquid baffle. Detailed Embodiments

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "horizontal", "vertical", "upper", "middle", "both sides", "inside", "fitting", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0038] Please refer to Figures 1 to 8 , the present invention provides a light-emitting diode lead frame, and the technical solution is as follows:

[0039] The wire encapsulation base 3 is set to be circular. A circular boss 31 is provided inside the wire encapsulation base 3. The circular boss 31 is arranged in the middle of the wire encapsulation base 3. The heat dissipation base 2 is inserted into the circular boss 31 from the bottom of the wire encapsulation base 3. The upper surface of the heat dissipation base 2 is in contact with the circular boss 31. A lens 5 is fixedly installed on the wire encapsulation base 3 and is in contact with the inner side wall of the wire encapsulation base 3. The lens 5 closes and covers the upper part of the wire encapsulation base 3, enabling the LED chip 1 to work in a sealed and dry environment. An electrode lead 4 is fixedly installed inside the wire encapsulation base 3. The electrode lead 4 is divided into two ends, a positive electrode and a negative electrode, and is symmetrically arranged inside the wire encapsulation base 3. The wire encapsulation base 3 is symmetrically provided with notches for the electrode lead 4 to extend out. An LED chip 1 is fixedly installed on the heat dissipation base 2. Two bonding wires 8 are respectively led out from the LED chip 1. One is welded to the positive electrode lead 4, and the other is welded to the negative electrode lead 4. When the electrode lead 4 is energized, the LED chip 1 can emit light for illumination. A glue storage bag 7 is arranged inside the wire encapsulation base 3. Glue filling components 6 are symmetrically arranged on both sides of the electrode lead 4. The glue filling components 6 are connected to the glue storage bag 7. The overall horizontal position of the glue filling components 6 is lower than the bottom of the LED chip 1. The glue storage bag 7 is filled with silicone rubber. The glue filling components 6 apply pressure to the glue storage bag 7 through temperature changes. When the LED chip 1 continuously emits light and the temperature inside the wire encapsulation base 3 rises, the glue filling components 6 apply pressure to the glue storage bag 7, squeezing out the silicone rubber inside the glue storage bag 7. The silicone rubber will undergo a curing reaction only when it comes into contact with air. When the adhesion between the heat dissipation base 2 and the wire encapsulation base 3 becomes poor, the silicone rubber flows into the joint between the heat dissipation base 2 and the wire encapsulation base 3 to fill the gap, preventing delamination between the wire encapsulation base 3 and the heat dissipation base 2 and exposing the LED chip 1 to air or moisture, ensuring a dry working environment for the LED chip 1 and extending the service life of the light-emitting diode;The glue filling assembly 6 includes a driving spring 61, a pushing plate 62, a bagging groove 63, and a glue flowing ring 64. The bagging groove 63 is attached to the side wall of the circular boss 31, and the glue storage bag 7 is installed inside the bagging groove 63. The pushing plate 62 is arranged on one side of the bagging groove 63. The bottom of the pushing plate 62 is in the same plane as the bottom of the bagging groove 63. A pressing plate 621 is fixedly installed on the pushing plate 62. The pressing plate 621 passes through the bagging groove 63 and is attached to the surface of the glue storage bag 7. One end of the driving spring 61 is fixedly installed on the inner wall of the wire encapsulation seat 3, and the other end is connected to the side wall of the pushing plate 62. The driving spring 61 is made of a shape memory metal material. The transformation temperature of the shape memory metal material is set at 45°C. The driving spring 61 elongates when it reaches the set temperature. The glue flowing ring 64 is set in a C shape. The glue flowing ring 64 is located above the joint of the heat dissipation base 2 and the circular boss 31. A plurality of glue flowing ports 641 are arranged in an array on the glue flowing ring 64. One end of the glue flowing ring 64 passes through the bagging groove 63 and is communicated with the inside of the glue storage bag 7. A lifting assembly 9 is arranged on the bagging groove 63. The volume of the silicone rubber accounts for three-quarters of the volume of the glue storage bag 7. The lifting assembly 9 uses the movement of the pushing plate 62 as the power to lift the horizontal position of the glue storage bag 7. The lifting assembly 9 lifts the glue storage bag 7 so that the silicone rubber can be extruded from the glue storage bag 7. The bagging groove 63 is set in an arc crescent shape. The pushing plate 62 and the pressing plate 621 are set in the same arc shape. The bottom of the pushing plate 62 is attached to the inner end face of the wire encapsulation seat 3. The pushing plate 62 can slide smoothly inside the wire encapsulation seat 3. In the normal temperature state, the driving spring 61 is in a contracted state. When the electrode lead 4 is energized, the LED chip 1 continuously emits light. After the temperature inside the wire encapsulation seat 3 reaches the set temperature, the driving spring 61 elongates. The driving spring 61 makes the pushing plate 62 move towards the direction of the LED chip 1. The pressing plate 621 moves with the pushing plate 62. The pressing plate 621 applies pressure to the glue storage bag 7. The glue storage bag 7 deforms inside the bagging groove 63. The silicone rubber is extruded from the glue storage bag 7 and slides into the glue flowing ring 64 from the connection between the glue flowing ring 64 and the glue storage bag 7. A glue flowing channel with the same shape as the glue flowing ring 64 is arranged inside the glue flowing ring 64. The glue flowing channel is communicated with a plurality of glue flowing ports 641. The silicone rubber flows out from the glue flowing ports 641 and flows into the joint of the heat dissipation base 2 and the wire encapsulation seat 3. Due to the different thermal expansion coefficients of the heat dissipation base 2 and the wire encapsulation seat 3, when the encapsulation structure undergoes a temperature cycle, stress will be generated at the joint interface of the heat dissipation base 2 and the wire encapsulation seat 3. And the materials of the encapsulation structure will also release stress during the long-term aging process, resulting in a poor adhesion force between the heat dissipation base 2 and the wire encapsulation seat 3. A gap will be generated at the joint interface of the heat dissipation base 2 and the wire encapsulation seat 3. At this time, the silicone rubber flows into the gap and reacts with the air to solidify and fill the gap, improving the adhesion force between the heat dissipation base 2 and the wire encapsulation seat 3, preventing moisture from entering the inside of the light-emitting diode, and improving the service life of the LED chip 1.;

[0040] As an implementation manner of the present invention, referring to Figures 3 to 8, the lifting component 9 includes a sliding groove 91, a horizontal slider 92, a vertical slider 93, and a connecting rod 94. The sliding groove 91 is arranged in an L shape and is fixedly installed on both sides of the bagging groove 63. The horizontal slider 92 is horizontally slidably installed in the sliding groove 91, and the vertical slider 93 is vertically slidably installed in the sliding groove 91. Both ends of the connecting rod 94 are rotatably installed on the horizontal slider 92 and the vertical slider 93 respectively. One end of the horizontal slider 92 is fixedly connected to the side wall of the push plate 62. The end of the vertical slider 93 is fixedly installed with a lifting plate 95. The lifting plate 95 is arranged in an L shape and is located inside the bagging groove 63 and is in contact with the bottom of the glue storage bag 7. Two identical sliding grooves 91 are fixedly installed on both sides of the bagging groove 63. The horizontal slider 92 and the vertical slider 93 are limitedly slid in the L-shaped sliding groove 91. When the temperature inside the wire encapsulation seat 3 reaches the set temperature, the driving spring 61 elongates, and the driving spring 61 causes the push plate 62 to move towards the LED chip 1. The horizontal slider 92 moves in the same direction as the push plate 62. At this time, the horizontal slider 92 is limitedly moved in the sliding groove 91. Due to the rotational connection between the connecting rod 94 and the horizontal slider 92 and the vertical slider 93, under the action of the power transmission of the connecting rod 94, the vertical slider 93 moves upward in the vertical direction, and the lifting plate 95 moves upward with the vertical slider 93. The lifting plate 95 lifts the bottom of the glue storage bag 7, causing the liquid level of the silicone rubber in the glue storage bag 7 to rise, and the silicone rubber is extruded from the glue flow ring 64. The lifting component 9 ensures that the volume of the silicone rubber extruded by each pressing plate 621 is the same, avoiding excessive extrusion of silicone rubber from affecting the internal structure of the light-emitting diode and improving the utilization rate of silicone rubber; an overflow groove 32 is formed on the circular boss 31. The overflow groove 32 is arranged in a circular ring shape and is located above the joint between the heat dissipation base 2 and the wire encapsulation seat 3. When the silicone rubber flows into the gap between the heat dissipation base 2 and the wire encapsulation seat 3, the overflow groove 32 can hold more silicone rubber, and affected by the surface tension of the fluid, the silicone rubber will stay between the side wall of the overflow groove 32 and the heat dissipation base 2, avoiding the continuous flow of silicone rubber and shortening the time required for the silicone rubber to solidify, and improving the joint effect between the heat dissipation base 2 and the wire encapsulation seat 3; a return groove 33 is formed on the circular boss 31. The return groove 33 is composed of a plurality of rectangular grooves and a circular ring groove. The radius of the circular ring groove of the return groove 33 is greater than the radius of the overflow groove 32. The rectangular grooves of the return groove 33 are located on the side wall of the bagging groove 63. A plurality of glue passing grooves 631 corresponding to the rectangular grooves are formed on the side wall of the bagging groove 63. The plurality of glue passing grooves 631 are communicated with the inside of the glue storage bag 7. If there is no gap yet generated between the joint interface of the heat dissipation base 2 and the wire encapsulation seat 3, or the generated gap is small, and there is still remaining silicone rubber on the circular boss 31 after the discharged silicone rubber fills the gap, the remaining silicone rubber will flow into the glue passing grooves 631 from the return groove 33 and finally be recycled into the glue storage bag 7, avoiding the remaining of excessive silicone rubber on the circular boss 31 and further improving the utilization rate of silicone rubber;The bottom of the glue - flowing ring 64 is provided with an inclined slope. The horizontal height of the connection position between the glue - flowing ring 64 and the glue - storage bag 7 is higher than the lowest horizontal position of the two ends of the glue - flowing ring 64. When the silicone rubber flows out from the connection position between the glue - flowing ring 64 and the glue - storage bag 7, the silicone rubber flows from the middle of the glue - flowing ring 64 to both sides of the glue - flowing ring 64 along the inclined slope of the glue - flowing ring 64, ensuring that the silicone rubber can flow out from each glue - flowing port 641, avoiding that some gaps cannot be filled, and further improving the fitting effect between the heat - dissipation base 2 and the wire - encapsulation base 3. A counterweight 10 is arranged inside the glue - storage bag 7. When the counterweight 10 moves in the silicone rubber, it accelerates the flow rate of the silicone rubber. When the light - emitting diode moves and rotates with the installation device or the light - emitting diode is vibrated, the counterweight 10 will move inside the glue - storage bag 7, accelerating the flow rate of the silicone rubber. After the flow rate of the silicone rubber is accelerated, it can take away more heat generated by the LED chip 1, improving the heat - dissipation effect of the heat - dissipation base 2. Liquid - blocking plates 11 are symmetrically arranged on the circular boss 31. The liquid - blocking plates 11 are arranged in an arc shape. The side wall of the liquid - blocking plate 11 is attached to the side wall of the bag - loading groove 63. The liquid - blocking plates 11 and the bag - loading groove 63 are combined into a circle to wrap the circular boss 31, preventing excess silicone rubber from flowing out of the boundary of the circular boss 31 and falling onto the electrode leads 4 during the filling work of the silicone rubber, affecting the electrical conductivity of the electrode leads 4 and ensuring the stability of the light - emitting diode.

[0041] Working principle: When the electrode leads 4 are powered on, the LED chip 1 continuously emits light. After the temperature inside the wire - encapsulation base 3 reaches the set temperature, the driving spring 61 elongates. The driving spring 61 makes the push plate 62 move towards the direction of the LED chip 1. The horizontal slider 92 moves in the same direction as the push plate 62. At this time, the horizontal slider 92 is limited to move in the sliding groove 91. Since the connecting rod 94 and the horizontal slider 92 are rotationally connected to the vertical slider 93, under the action of the power transmission of the connecting rod 94, the vertical slider 93 moves upward in the vertical direction. The lifting plate 95 moves upward with the vertical slider 93. The lifting plate 95 lifts the bottom of the glue - storage bag 7, causing the liquid level of the silicone rubber in the glue - storage bag 7 to rise. The pressing plate 621 moves with the push plate 62, and the pressing plate 621 applies pressure to the glue - storage bag 7. The glue - storage bag 7 deforms in the bag - loading groove 63, and the silicone rubber is extruded from the glue - storage bag 7 and slides into the glue - flowing ring 64 from the connection position between the glue - flowing ring 64 and the glue - storage bag 7. A glue - flowing channel with the same shape as the glue - flowing ring 64 is provided in the glue - flowing ring 64. The glue - flowing channel is communicated with a plurality of glue - flowing ports 641. The silicone rubber flows out from the glue - flowing ports 641 and flows into the joint between the heat - dissipation base 2 and the wire - encapsulation base 3. If there are no gaps or the gaps are small between the fitting interfaces of the heat - dissipation base 2 and the wire - encapsulation base 3, after the discharged silicone rubber fills the gaps, there is still remaining silicone rubber on the circular boss 31. The remaining silicone rubber will flow into the through - glue groove 631 from the return groove 33 and finally be recycled into the glue - storage bag 7.

[0042] The above has described in detail a specific embodiment of the present invention in conjunction with the accompanying drawings, but the present invention is not limited to the described embodiment. For those skilled in the art, without departing from the principles and ideas of the present invention, various changes, modifications, substitutions, and variations made to these embodiments should still fall within the protection scope of the present invention.

Claims

1. A light-emitting diode lead frame, characterized in that, It includes a heat dissipation base (2), a wire encapsulation base (3), a glue filling component (6), and a glue storage bag (7). A circular boss (31) is provided inside the wire encapsulation base (3). The heat dissipation base (2) is arranged inside the wire encapsulation base (3) and is fitted and installed with the circular boss (31). Glue filling components (6) are symmetrically arranged inside the wire encapsulation base (3). The glue storage bag (7) is installed on the wire encapsulation base (3). The glue filling component (6) is connected to the glue storage bag (7). The overall horizontal position of the glue filling component (6) is lower than the top end of the heat dissipation base (2). The inside of the glue storage bag (7) is filled with silicone rubber. A glue flowing ring (64) is installed on the heat dissipation base (2). The glue storage bag (7) is connected to the glue flowing ring (64). The glue filling component (6) applies pressure to the glue storage bag (7) through temperature change, and the silicone rubber is discharged from the glue flowing ring (64).

2. The light emitting diode lead frame according to claim 1, characterized in that, The glue filling component (6) includes a driving spring (61), a pushing plate (62), and a bag - mounting groove (63). The bag - mounting groove (63) is in contact with the side wall of the circular boss (31). The glue storage bag (7) is installed inside the bag - mounting groove (63). The pushing plate (62) is arranged on one side of the bag - mounting groove (63). The bottom of the pushing plate (62) is in the same plane as the bottom of the bag - mounting groove (63). A pressing plate (621) is fixedly installed on the pushing plate (62). The pressing plate (621) passes through the bag - mounting groove (63) and is in contact with the surface of the glue storage bag (7). One end of the driving spring (61) is fixedly installed on the inner wall of the wire encapsulation base (3), and the other end is connected to the side wall of the pushing plate (62). The driving spring (61) is made of a shape - memory metal material. The driving spring (61) elongates when reaching the set temperature. The glue flowing ring (64) is set in a C - shape. The glue flowing ring (64) is located above the joint of the heat dissipation base (2) and the circular boss (31). Glue flowing ports (641) are arrayed on the glue flowing ring (64). One end of the glue flowing ring (64) passes through the bag - mounting groove (63) and is communicated with the inside of the glue storage bag (7). The volume of the silicone rubber accounts for three - quarters of the volume of the glue storage bag (7). A lifting component (9) is arranged on the bag - mounting groove (63). The lifting component (9) lifts the horizontal position of the glue storage bag (7) with the movement of the pushing plate (62) as the power.

3. The light-emitting diode lead frame according to claim 2, wherein The lifting component (9) includes a sliding groove (91), a horizontal slider (92), a vertical slider (93), and a connecting rod (94). The sliding groove (91) is arranged in an L shape and is fixedly installed on both sides of the bagging groove (63). The horizontal slider (92) is horizontally slidably installed in the sliding groove (91), the vertical slider (93) is vertically slidably installed in the sliding groove (91), and both ends of the connecting rod (94) are rotatably installed on the horizontal slider (92) and the vertical slider (93). One end of the horizontal slider (92) is fixedly connected to the side wall of the pushing plate (62), and a lifting plate (95) is fixedly installed at the end of the vertical slider (93). The lifting plate (95) is arranged in an L shape and is located inside the bagging groove (63) and fits against the bottom of the glue storage bag (7).

4. The light-emitting diode lead frame according to claim 2, wherein, An overflow groove (32) is formed on the circular boss (31). The glue flowing ring (64) is located directly above the overflow groove (32). The overflow groove (32) is arranged in a circular ring shape and is located above the fitting position of the heat dissipation base (2) and the wire encapsulation seat (3).

5. The light-emitting diode lead frame according to claim 4, characterized in that, A return groove (33) is formed on the circular boss (31). The return groove (33) is composed of a plurality of rectangular grooves and a circular ring groove. The radius of the circular ring groove of the return groove (33) is larger than the radius of the overflow groove (32). The rectangular grooves of the return groove (33) are located on the side wall of the bagging groove (63). A plurality of glue passing grooves (631) corresponding to the rectangular grooves are formed on the side wall of the bagging groove (63), and the plurality of glue passing grooves (631) communicate with the inside of the glue storage bag (7).

6. The light emitting diode lead frame according to claim 5, characterized in that, A weight block (10) is arranged inside the glue storage bag (7). When the vertical slider (93) moves, it drives the weight block (10) to move in the silicone rubber.

7. The light-emitting diode lead frame according to claim 2, characterized in that, The bottom of the glue flowing ring (64) is provided with an inclined slope, and the horizontal height of the position where the glue flowing ring (64) communicates with the glue storage bag (7) is higher than the lowest horizontal position of both ends of the glue flowing ring (64).

8. A light-emitting diode using the lead frame of the light-emitting diode according to any one of claims 1-7, characterized in that, A lens (5) is fixedly installed on the wire encapsulation seat (3). The lens (5) fits against the inner side wall of the wire encapsulation seat (3). An electrode lead (4) is installed inside the wire encapsulation seat (3), and one end of the electrode lead (4) extends outside the wire encapsulation seat (3). An LED chip (1) is fixedly installed on the heat dissipation base (2). The LED chip (1) is connected to the electrode lead (4) through a bonding wire (8). Liquid blocking plates (11) are symmetrically arranged on the circular boss (31). The liquid blocking plates (11) are arranged in an arc shape, and the side walls of the liquid blocking plates (11) fit against the side walls of the bagging groove (63). The liquid blocking plates (11) and the bagging groove (63) form a circle to wrap the circular boss (31).

Images