A method for ultrafast impregnation packaging of superconducting structures

Abstract

The present invention relates to a method for ultrafast impregnation encapsulation superconducting structure, and relates to the technical field of superconducting structure impregnation encapsulation, the method for the ultrafast impregnation encapsulation superconducting structure comprising the following steps: obtaining a front-end polymerization solution based on dicyclopentadiene monomer; placing a superconducting structure in the front-end polymerization solution based on dicyclopentadiene monomer for impregnation encapsulation, and obtaining a superconducting structure finished product after encapsulation is completed; the front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight: dicyclopentadiene monomer 84.33 91.45%, 5 ethylidene 2 norbornene 5.63 10.39%, catalyst 0.045 0.059%, solvent 2.82 5.19%, and the balance being an inhibitor. The present invention provides a method for ultrafast impregnation encapsulation superconducting structure, which has the characteristics of low energy consumption, short time consumption, and effectively solves the problems such as high energy consumption and long time faced in the impregnation encapsulation process of existing superconducting structure.

Description

Technical Field

[0001] The present invention relates to the technical field of superconducting structure impregnation packaging, and in particular to a method for ultrafast impregnation packaging of a superconducting structure. Background Art

[0002] Superconducting materials, with their unique zero-resistance properties, have demonstrated enormous potential for application in power transmission, magnet manufacturing, and high-end scientific research equipment such as nuclear magnetic resonance imaging (MRI), high-energy particle accelerators, and thermonuclear fusion reactors, significantly advancing scientific research and the development of human society. However, superconducting structures operate under extremely demanding conditions, often requiring operation at extremely low temperatures. This makes them susceptible to thermal stress and deformation during cooling. In particular, in strong magnetic fields, superconducting structures must withstand strong electromagnetic forces, further increasing the risk of irreversible deformation or even damage.

[0003] To enhance the mechanical stability of superconducting structures and prevent quenching caused by deformation during operation, epoxy resin impregnation technology has emerged. By filling the gaps between superconducting materials, epoxy resin can make the entire superconducting structure more compact, effectively improving its deformation resistance. Currently, the main impregnation methods for superconducting structures include vacuum pressure impregnation, brush impregnation, and injection molding. Epoxy resin is the most common impregnation material, and in rare cases, low-temperature alloys or ice are also used for impregnation.

[0004] Although epoxy resin impregnation technology has solved the problem of mechanical stability of superconducting structures to a certain extent, its curing process has become a bottleneck restricting production efficiency. Traditionally, in order to fully cure the epoxy resin, the impregnated superconducting structure needs to be placed in an environment of 70 to 110°C and must be kept for more than 5 hours to achieve ideal mechanical properties and insulation effects. Even if some epoxy resins that can be cured at room temperature are used, it usually takes more than 24 hours to fully cure. Taking CTD-101K, an epoxy resin commonly used in superconducting structure impregnation, as an example, its curing method requires placing it in an environment of 110°C for 5 hours or in an environment of 80°C for 24 hours. Such curing conditions undoubtedly greatly extend the production cycle of the superconducting structure and increase the complexity of process control and production costs.

[0005] Therefore, in order to address the problems of long curing time and low production efficiency in the existing epoxy resin impregnation technology, it is urgent to develop a method for ultrafast impregnation packaging of superconducting structures. Summary of the Invention

[0006] In order to solve the above problems, the present invention provides a method for ultrafast impregnation packaging of a superconducting structure.

[0007] The technical solutions provided by the present invention are as follows:

[0008] The present invention provides a method for ultrafast impregnation packaging of a superconducting structure, the method comprising the following steps:

[0009] Obtaining a front-end polymerization solution based on dicyclopentadiene monomer;

[0010] placing the superconducting structure in the front-end polymerization solution based on dicyclopentadiene monomer for dipping and packaging to obtain a finished superconducting structure after packaging;

[0011] The front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight:

[0012] Dicyclopentadiene monomer 84.33-91.45%, 5-ethylidene-2-norbornene 5.63-10.39%, catalyst 0.045-0.059%, solvent 2.82-5.19%, and the balance is inhibitor;

[0013] The working condition parameters of the dip encapsulation include: heating at 150-300° C. for 0.0001 s to 10 s in a circular area with a diameter of less than 5 mm.

[0014] Furthermore, the working condition parameters of the dip encapsulation include: heating at 150-300° C. for 1 second to 10 seconds within a circular area with a diameter of less than 5 mm.

[0015] Furthermore, the working condition parameters of the dip encapsulation include: heating at 150-300° C. for 1 second to 5 seconds within a circular area with a diameter of less than 5 mm.

[0016] Furthermore, the front-end polymerization solution based on dicyclopentadiene monomer comprises the following raw materials in percentage by weight:

[0017] The composition includes 91.45% dicyclopentadiene monomer, 5.63% 5-ethylidene-2-norbornene, 0.059% catalyst, 2.82% solvent, and the balance being inhibitor.

[0018] Furthermore, the solvent is phenylcyclohexane.

[0019] Furthermore, the catalyst is a Grubbs 2 generation catalyst.

[0020] Furthermore, the inhibitor is tributyl phosphite.

[0021] Furthermore, the superconducting structure includes at least one of a superconducting cable and a superconducting magnet.

[0022] Furthermore, the superconducting cable includes but is not limited to at least one of a Roebel cable, a CORC cable and a CICC cable.

[0023] Furthermore, the superconducting magnet includes but is not limited to at least one of a solenoid superconducting magnet, a racetrack superconducting magnet, a pancake-type superconducting magnet and a D-type superconducting magnet.

[0024] Furthermore, the winding material of the impregnated package superconducting structure includes but is not limited to YBa2Cu3O 7-δ , at least one of NbTi, Nb3Sn, Bi-2223, Bi-2212 and MgB2; wherein δ is 0-0.5.

[0025] The above technical solution provided by the embodiment of the present invention has at least the following advantages compared with the prior art:

[0026] The present invention provides a method for ultrafast impregnation packaging of superconducting structures, which has the characteristics of low energy consumption and short time consumption, and effectively solves the problems of high energy consumption and long time faced in the existing impregnation packaging process of superconducting structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 It is a schematic diagram of the method for ultrafast impregnation packaging of superconducting structures provided in the present invention.

[0030] Figure 2 This is a diagram of the ultrafast impregnation and packaging process of the magnet in Example 1 of the present invention.

[0031] Figure 3 This is a photo of the magnet after ultrafast packaging in Example 1 of the present invention.

[0032] Figure 4 This is a diagram of the ultrafast impregnation and packaging process of the magnet in Example 2 of the present invention.

[0033] Figure 5 This is a photo of the magnet after ultrafast packaging in Example 2 of the present invention. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0035] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0036] The present invention provides a method for ultrafast impregnation packaging of a superconducting structure, the method comprising the following steps:

[0037] Obtaining a front-end polymerization solution based on dicyclopentadiene monomer;

[0038] placing the superconducting structure in the front-end polymerization solution based on dicyclopentadiene monomer for dipping and packaging to obtain a finished superconducting structure after packaging;

[0039] The front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight:

[0040] Dicyclopentadiene monomer 84.33-91.45%, 5-ethylidene-2-norbornene 5.63-10.39%, catalyst 0.045-0.059%, solvent 2.82-5.19%, and the balance is inhibitor;

[0041] The working condition parameters of the dip encapsulation include: heating in a circular area with a diameter of less than 5 mm at 150-300° C. for 0.0001 s to 10 s. Further, the heating time is 1 s to 10 s, and further, the heating time is 1 s to 5 s.

[0042] The present invention provides a method for ultrafast impregnation packaging of superconducting structures, which has the characteristics of low energy consumption and short time consumption, and effectively solves the problems of high energy consumption and long time faced in the existing impregnation packaging process of superconducting structures.

[0043] The present invention uses front-end polymerization technology to achieve ultrafast impregnation and packaging of superconducting structures. Front-end polymerization technology completes the polymerization reaction by moving the local reaction area. Only a short period of energy input (ultrasound, local point direct heating, ultraviolet irradiation, microwave, etc.) is required in the initial stage of the reaction to heat the local point. Subsequently, the reaction itself releases heat to complete rapid polymerization without continuous heating, significantly reducing energy consumption and greatly shortening the curing time. Specifically, Figure 1As shown, the method for ultrafast impregnation packaging of a superconducting structure provided by the present invention specifically comprises the following steps: first, preparing a dicyclopentadiene solution capable of inducing a front-end polymerization reaction; then, placing the wound superconducting magnet into a prepared mold and sealing it, leaving a port for injecting the solution; finally, injecting the solution and inducing a front-end polymerization reaction using an electric soldering iron.

[0044] In some specific embodiments, the front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight:

[0045] The composition includes 91.45% dicyclopentadiene monomer, 5.63% 5-ethylidene-2-norbornene, 0.059% catalyst, 2.82% solvent, and the balance being inhibitor.

[0046] The preparation process of the front-end polymerization solution based on dicyclopentadiene monomer in the present invention is as follows: the dicyclopentadiene monomer and 5-ethylidene-2-norbornene are mixed and placed in a vacuum environment to remove bubbles for 30 minutes; the Grubbs second-generation catalyst and phenylcycloethane are mixed and ultrasonicated for 20 minutes; then tributyl phosphite is added and ultrasonicated for 5 minutes; and the mixture is stirred for 5 minutes to synthesize a solution capable of initiating a polymerization reaction - the front-end polymerization solution based on dicyclopentadiene monomer.

[0047] In some specific embodiments, the solvent is phenylcyclohexane.

[0048] In some embodiments, the catalyst is a Grubbs 2 generation catalyst.

[0049] In some embodiments, the inhibitor is tributyl phosphite.

[0050] In some specific embodiments, the working condition parameters of the dip encapsulation include: heating at 250° C. for 5 seconds in a circular area with a diameter of less than 5 mm.

[0051] In some specific embodiments, the working condition parameters of the dip encapsulation include: heating at 300° C. for 1 s in a circular area with a diameter of less than 5 mm.

[0052] In some specific embodiments, the working condition parameters of the dip encapsulation include: heating at 150° C. for 10 seconds within a circular area with a diameter of less than 5 mm.

[0053] In some specific embodiments, the working condition parameters of the dip encapsulation include: heating to 300° C. for 0.0001 s within a circular area with a diameter of less than 5 mm, and using local ignition, such as laser ignition, to achieve instantaneous heating to 300° C.

[0054] In some specific embodiments, the superconducting structure includes at least one of a superconducting cable and a superconducting magnet.

[0055] In some specific embodiments, the superconducting cable includes but is not limited to at least one of a Roebel cable, a CORC cable, and a CICC cable.

[0056] In some specific embodiments, the superconducting magnet includes but is not limited to at least one of a solenoid superconducting magnet, a racetrack superconducting magnet, a pancake superconducting magnet, and a D-type superconducting magnet.

[0057] In some specific embodiments, the winding material of the impregnated package superconducting structure includes but is not limited to YBa2Cu3O 7-δ , at least one of NbTi, Nb3Sn, Bi-2223, Bi-2212 and MgB2; wherein δ is 0-0.5.

[0058] The present invention will be further described below in conjunction with specific examples. It should be understood that these examples are intended to illustrate the present invention only and are not intended to limit the scope of the invention. The experimental methods in the following examples where specific conditions are not specified are generally measured in accordance with national standards. If there are no corresponding national standards, then the methods are carried out in accordance with general international standards, conventional conditions, or the conditions recommended by the manufacturer.

[0059] Example 1

[0060] This example provides a method for ultrafast impregnation encapsulation of superconducting structures. The front-end polymerization solution based on dicyclopentadiene monomer is: dicyclopentadiene monomer (91.45%), 5-ethylidene-2-norbornene (5.63%), Grubbs second-generation catalyst (0.059%), phenylcycloethane as solvent (2.82%), and tributyl phosphite as inhibitor (balance). The mixing steps are: dicyclopentadiene monomer and 5-ethylidene-2-norbornene are mixed, then placed in a vacuum environment to remove bubbles for 30 minutes. The Grubbs second-generation catalyst and phenylcycloethane are then mixed and sonicated for 20 minutes. Tributyl phosphite is then added and sonicated for 5 minutes. After stirring for 5 minutes, a solution capable of initiating polymerization is synthesized. The specific process includes the following:

[0061] like Figure 1 As shown, due to YBa2Cu3O 7-δ The outer surface of the superconducting tape is a copper layer. Therefore, this example uses T2 copper tape as an example to wind a pancake-shaped magnet to demonstrate the effectiveness and advancement of this patent. The magnet's dimensions are: outer diameter 130mm, inner diameter 70mm, and thickness 4mm. The solution is locally heated using a soldering iron. In this example, the local heating temperature is 250°C for 5 seconds.

[0062] like Figure 2As shown in the figure, the magnet packaging process diagram is as follows. When the polymerization reaction starts, the soldering iron is removed and this time is recorded as 0s. The figure shows the curing status of the magnet at 0s, 31.5s, 63s, 94.5s, 126s and 157.5s. It can be found that its curing speed is about 1 mm / s, and as time goes by, its curing front peak gradually moves from the curing point on the right to the left, and the dipping and packaging is completed after 157.5s.

[0063] like Figure 3 As shown, Figure 3 After demolding, the magnets were found to be free of defects. The curing time of encapsulated superconducting magnets using this method is significantly shorter than the 5 or even 24 hours required by existing superconducting magnet curing methods. Furthermore, this method consumes virtually no energy, significantly reducing production costs compared to methods that require high-temperature curing.

[0064] Example 2

[0065] This example provides a method for ultrafast impregnation packaging of superconducting structures, such as Figure 4 and Figure 5 As shown, the only difference from Example 1 is that in this example, the front-end polymerization solution based on dicyclopentadiene monomer is: dicyclopentadiene monomer (84.33%), 5-ethylidene-2-norbornene (10.39%), Grubbs second-generation catalyst (0.045%), phenylcyclohexane as solvent (5.19%), and tributyl phosphite as inhibitor (balance); curing is completed in 180 seconds.

[0066] Example 3

[0067] This example provides a method for ultrafast impregnation packaging of a superconducting structure. The only difference from Example 1 is that in this example, a front-end polymerization solution based on dicyclopentadiene monomer is selected, which includes: dicyclopentadiene monomer (87.75%), 5-ethylidene-2-norbornene (8.11%), Grubbs second-generation catalyst (0.05%), phenylcyclohexane as solvent (4.05%), and tributyl phosphite as inhibitor (balance); curing is completed in 170 seconds.

[0068] Example 4

[0069] This example provides a method for ultrafast impregnation packaging of a superconducting structure. The only difference from Example 1 is that the dimensions of the magnet are: outer diameter 130 mm, inner diameter 70 mm, thickness 4 mm. The solution is locally heated by an electric soldering iron. In this example, the local heating temperature is 300°C and the heating time is 1 s.

[0070] Example 5

[0071] This example provides a method for ultrafast impregnation packaging of a superconducting structure. The only difference from Example 1 is that the dimensions of the magnet are: outer diameter 130 mm, inner diameter 70 mm, thickness 4 mm. The solution is locally heated by an electric soldering iron. In this example, the local heating temperature is 150°C and the heating time is 10 seconds.

[0072] In summary, the existing superconducting structure curing process requires the magnet to be placed in an oven for baking or the superconducting structure to be left at room temperature for more than 24 hours. The present invention provides a method for ultrafast impregnation packaging of superconducting structures, which only requires local short-term heating to complete the impregnation packaging of the entire superconducting structure in an extremely short time. It has the characteristics of low energy consumption and short time, effectively solving the problems of high energy consumption and long time faced in the existing superconducting structure impregnation packaging process, and has great engineering application prospects.

[0073] Various embodiments of the present invention may be presented in the form of a range; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention; therefore, the range description should be considered to have specifically disclosed all possible subranges and individual numerical values ​​within the range. For example, the description of a range from 1 to 6 should be considered to have specifically disclosed subranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as individual numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. In addition, whenever a numerical range is indicated herein, it is intended to include any cited numeral (fractional or integer) within the indicated range.

[0074] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for ultrafast impregnation packaging of a superconducting structure, characterized in that: The method for ultrafast impregnation packaging of a superconducting structure comprises the following steps: Obtaining a front-end polymerization solution based on dicyclopentadiene monomer; placing the superconducting structure in the front-end polymerization solution based on dicyclopentadiene monomer for immersion packaging to obtain a finished superconducting structure after packaging; The front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight: Dicyclopentadiene monomer 84.33-91.45%, 5-ethylidene-2-norbornene 5.63-10.39%, catalyst 0.045-0.059%, solvent 2.82-5.19%, and the balance is inhibitor; The working condition parameters of the dip encapsulation include: heating to 150-300°C for 1s-10s in a circular area with a diameter of <5mm; The solvent is phenylcyclohexane; The catalyst is a Grubbs 2 generation catalyst; The inhibitor is tributyl phosphite.

2. The method for ultrafast impregnation packaging of a superconducting structure according to claim 1, characterized in that: The front-end polymerization solution based on dicyclopentadiene monomer includes the following raw materials in percentage by weight: The composition includes 91.45% dicyclopentadiene monomer, 5.63% 5-ethylidene-2-norbornene, 0.059% catalyst, 2.82% solvent, and the balance being inhibitor.

3. The method for ultrafast impregnation packaging of a superconducting structure according to any one of claims 1 to 2, characterized in that: The superconducting structure includes at least one of a superconducting cable and a superconducting magnet.

4. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The winding materials of the impregnated packaged superconducting structure include YBa2Cu3O 7-δ , at least one of NbTi, Nb3Sn, Bi-2223, Bi-2212 and MgB2; wherein δ is 0-0.

5.

5. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The superconducting cable includes at least one of a Roebel cable, a CORC cable, and a CICC cable.

6. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The superconducting magnet includes a solenoid-type superconducting magnet.

7. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The superconducting magnet includes a pancake-wound superconducting magnet.

8. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The superconducting magnet includes a racetrack-type superconducting magnet.

9. The method for ultrafast impregnation packaging of a superconducting structure according to claim 3, characterized in that: The superconducting magnet includes a D-type superconducting magnet.

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