Electronic device and method for manufacturing electronic device

Abstract

An electronic device (1) is provided with a substrate (2), a semiconductor element (3) mounted on the substrate (2), and a case (12) that accommodates the substrate (2) and the semiconductor element (3) therein, the case (12) having a positioning section (50) on an opposing surface that faces a mounting surface of the substrate (2) on which the semiconductor element (3) is mounted, the positioning section (50) being capable of positioning the semiconductor element (3) in a state before the semiconductor element (3) is mounted on the substrate (2).

Description

Technical Field

[0001] The present invention relates to an electronic device and a method for manufacturing the electronic device. Background Art

[0002] In an electronic device mounted on a vehicle, from the viewpoints of ensuring firmness and EMC countermeasures, etc., a substrate and electronic components mounted on the substrate are housed in a housing (for example, Japanese Patent No. 5528641). Summary of the Invention

[0003] Problems to be Solved by the Invention

[0004] However, in the above-described electronic device, there is an electronic device manufactured in the following manner, that is, electronic components are arranged in a housing, and then a substrate is overlapped and arranged from above the electronic components. In such an electronic device, when mounting electronic components of various sizes on the substrate, it is not easy to position the substrate with respect to the electronic components. Therefore, the electronic components are fixed in the housing in advance by screwing, and positioning with respect to the substrate to be housed later is performed. However, there is a problem of an increase in manufacturing cost due to the processing of positioning screw holes and an increase in the number of screws.

[0005] The present invention has been made to solve the above problems, and an object thereof is to provide an electronic device and a method for manufacturing an electronic device that can easily perform positioning between a substrate housed in a housing and electronic components and can reduce manufacturing costs.

[0006] Means for Solving the Problems

[0007] The electronic device according to the first aspect of the present invention includes: a substrate, electronic components mounted on the substrate, and a housing that houses the substrate and the electronic components therein, wherein the housing has a positioning portion on a facing surface facing the mounting surface of the substrate on which the electronic components are mounted, and the positioning portion can position and arrange the electronic components in a state before the electronic components are mounted on the substrate.

[0008] Regarding the method for manufacturing an electronic device according to the second aspect of the present invention, the electronic device includes a substrate, electronic components mounted on the substrate, and a housing that houses the substrate and the electronic components therein, wherein the housing has a positioning portion on a facing surface facing the mounting surface of the substrate on which the electronic components are mounted, and the positioning portion can position and arrange the electronic components in a state before the electronic components are mounted on the substrate. The method for manufacturing an electronic device includes: a step of arranging the electronic components in the housing in a state positioned by the positioning portion; and a step of overlapping and arranging the substrate from above the electronic components arranged in a state positioned in the housing.

[0009] Advantages of the Invention

[0010] In the electronic device according to the first aspect of the present invention, the housing has a positioning portion on the opposing surface that opposes the mounting surface of the substrate on which the electronic component is mounted. This positioning portion can position and arrange the electronic component in a state before the electronic component is mounted on the substrate. Therefore, since it is possible to perform positioning with the substrate to be accommodated later without fixing the electronic component to the inside of the housing by screwing, it is possible to easily perform positioning between the substrate and the electronic component, and to reduce the manufacturing cost.

[0011] In the manufacturing method of the electronic device according to the second aspect of the present invention, after arranging the electronic component in the housing in a state positioned by the positioning portion, the substrate is overlapped and arranged from above the electronic component. Therefore, since it is possible to perform positioning with the substrate to be accommodated later without fixing the electronic component to the inside of the housing by screwing, it is possible to easily perform positioning between the substrate and the electronic component, and to reduce the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a perspective view showing the electronic device according to the present embodiment disassembled.

[0013] Figure 2 is a top view obtained by observing the housing according to the present embodiment from above.

[0014] Figure 3 is an enlarged top view showing a state in which the electronic component according to the present embodiment is arranged in the positioning portion.

[0015] Figure 4 is a schematic diagram for explaining the manufacturing process of the electronic device. In (A), it shows the process of arranging the electronic component in the positioning portion. In (B), it shows the process of overlapping and arranging the substrate from above the electronic component. In (C), it shows the process of turning the housing upside down and mounting the electronic component on the substrate by reflow soldering. In (D), it shows Figure 4 after the process of (C), turning the housing upside down again and restoring it to the original posture.

[0016] Figure 5 is a cross-sectional view of the electronic device according to the present embodiment, which is a side cross-sectional view showing a state in which the electronic component is mounted on the substrate.

[0017] Figure 6Shows a first modified example of the positioning portion according to the present embodiment. (A) is a plan view showing a state where an electronic component is disposed on the positioning portion before being mounted on a substrate, and (B) is a side sectional view showing a state where the electronic component is mounted on the substrate.

[0018] Figure 7 Shows a second modified example of the positioning portion according to the present embodiment. (A) is a plan view showing a state where an electronic component is disposed on the positioning portion before being mounted on a substrate, and (B) is a side sectional view showing a state where the electronic component is mounted on the substrate. Detailed implementation mode

[0019] Hereinafter, with reference to Figures 1 to 5 one embodiment of the present invention will be described. In the present embodiment, for the sake of convenience of explanation, the directions indicated by the arrows of up and down, left and right, and front and back appropriately shown in each figure are defined as the up and down direction, left and right direction, and front and back direction of the electronic device 1, respectively, for explanation. In addition, in each figure, in order to clearly observe the drawings, some reference numerals are sometimes omitted.

[0020] The electronic device 1 constitutes, for example, an ECU (Electronic Control Unit) mounted on a vehicle (not shown). The electronic device 1 controls the operation of in-vehicle devices based on information from various sensor devices mounted on the vehicle.

[0021] As Figure 1 shown, the electronic device 1 includes a substrate 2, a plurality of electronic components mounted on the substrate 2, and a housing 12 that houses the substrate 2 and the plurality of electronic components. It should be noted that, in Figure 1 , as an example of the above-mentioned plurality of electronic components, a semiconductor element 3 and two connectors 15 and 17 are illustrated. In addition, the semiconductor element 3 corresponds to an example of the "electronic component" described in the claims.

[0022] The substrate 2 has mounting surfaces on the upper surface and the lower surface, respectively, and wiring patterns (not shown) made of, for example, copper foil are formed on each mounting surface. The wiring patterns electrically connect the plurality of electronic components mounted on the substrate 2 to each other to form the circuit of the electronic device 1. In the present embodiment, the substrate 2 is formed in a rectangular plate shape and is housed in the housing 12 in a posture with the up and down direction as the plate thickness direction. A plurality of through holes 21 are formed through the substrate 2, and terminals of the plurality of electronic components mounted on the substrate 2 are inserted through the through holes 21. By soldering the terminals inserted through the through holes 21, the plurality of electronic components are electrically connected to the wiring patterns of the substrate 2.

[0023] As an example of a plurality of electronic components, a control unit (not shown) including a plurality of circuit elements such as a CPU (Central Processing Unit), a semiconductor element 3, and a capacitor (not shown) are mounted on a substrate 2. The semiconductor element 3 is mounted on a mounting surface on the lower surface of the substrate 2, and has a resin-molded main body portion 31 and a plurality of lead terminals 32 extending from the main body portion 31 toward the substrate 2. The plurality of lead terminals 32 are inserted and penetrated from the lower side of the substrate 2 into the through holes 21, and are electrically connected to the wiring pattern of the substrate 2 by soldering. In addition, on the opposing surface ( Figure 1 which is the lower surface in this case) opposing the bottom wall portion 12E of the housing 12, an electrode 33 is provided in an exposed manner (refer to Figure 5 ). Therefore, the heat generated when the semiconductor element 3 operates dissipates from the electrode 33 exposed to the outside and is transferred to the bottom wall portion 12E of the housing 12. The semiconductor element 3 can be, for example, a field effect transistor (FET) constituting a regulator circuit, or a switching element constituting an inverter circuit, etc.

[0024] The housing 12 is a box-shaped member having an opening 13 opening upward, and is formed of a metal such as aluminum or iron as an example. The housing 12 includes a front wall portion 12A, a rear wall portion 12B, a left wall portion 12C, a right wall portion 12D, and a bottom wall portion 12E.

[0025] A first connector mounting portion 14 is formed in the left wall portion 12C of the housing 12. The first connector mounting portion 14 is formed through the left wall portion 12C and is an opening opening upward. A first connector 15 is mounted in the first connector mounting portion 14. The first connector 15 has a housing 15A and a plurality of connection terminals 15B provided on the housing 15A. One end of the plurality of connection terminals 15B is inserted and penetrated from the lower side of the substrate 2 into the through holes 21, and is electrically connected to the wiring pattern of the substrate 2 by soldering. A cable connector electrically connected to a power source or in-vehicle equipment of a vehicle (not shown) is connected to the first connector 15.

[0026] A second connector mounting portion 16 is formed in the right wall portion 12D of the housing 12. The second connector mounting portion 16 is formed through the right wall portion 12D and is an opening opening upward. A second connector 17 is mounted in the second connector mounting portion 16. The second connector 17 has a housing 17A and sensor terminals 17B provided on the housing 17A. One end of the sensor terminals 17B is inserted and penetrated from the lower side of the substrate 2 into the through holes 21, and is electrically connected to the wiring pattern of the substrate 2 by soldering. A cable connector electrically connected to various sensor devices mounted on the vehicle is connected to the second connector 17.

[0027] AsFigure 2 As shown, a plurality of receiving recesses 41, 42, 43 are formed in the bottom wall portion 12E of the housing 12. A plurality of electronic components arranged on the lower side of the substrate 2 are received in the plurality of receiving recesses 41, 42, 43. On the left end side of the bottom wall portion 12E, a first receiving recess 41 recessed in a substantially rectangular shape is formed. One end portion of the first connector 15 arranged in the housing 12 is received in the first receiving recess 41. On the right end side of the bottom wall portion 12E, a second receiving recess 42 is formed. One end portion of the second connector 17 arranged in the housing 12 is received in the second receiving recess 42. On the central portion side of the bottom wall portion 12E, a third receiving recess 43 adjacent to the first receiving recess 41 and recessed in a substantially elliptical shape is formed. For example, a capacitor (not shown) mounted on the substrate 2 is received in the third receiving recess 43.

[0028] On the front end side of the bottom wall portion 12E, a positioning portion 50 composed of a pair of left and right protrusions 52, 52 is provided. The positioning portion 50 is disposed opposite to the mounting surface of the lower surface of the substrate 2, and in the manufacturing process, the semiconductor element 3 before being mounted on the substrate 2 is placed on the positioning portion 50. By placing the semiconductor element 3 on the positioning portion 50, the semiconductor element 3 is positioned relative to the substrate 2 that is later received in the housing 12.

[0029] The pair of protrusions 52, 52 are formed in a protruding shape protruding from the bottom wall portion 12E and are arranged at intervals in the left - right direction. Each protrusion 52 has a first protrusion 521 and a second protrusion 522. The first protrusion 521 protrudes from the bottom wall portion 12E in a rectangular pedestal shape, and the second protrusion 522 is provided in a region higher than the height region of the first protrusion 521 by protruding from the upper surface of the first protrusion 521. The second protrusion 522 becomes a protrusion having a substantially T - shaped view from above. The two second protrusions 52, 52 are symmetrically arranged in the left - right direction and are configured to be convex toward the inside of the pair of protrusions 52, 52.

[0030] At the four corners of the bottom wall portion 12E, four substrate support portions 18 standing upward from the bottom wall portion 12E are provided. Inside the housing 12, each substrate support portion 18 forms a pedestal surface for supporting the substrate in a region higher than the height region of the positioning portion 50. By placing the four corners of the substrate 2 on the four substrate support portions 18 and receiving it in the housing 12, the substrate 2 is arranged in a state separated from the bottom wall portion 12E of the housing 12.

[0031] At Figure 3Shown in a top view is the state in which the semiconductor element 3 is placed on the positioning portion 50 before being mounted on the substrate 2. As shown in this figure, the semiconductor element 3 has a resin-molded main body portion 31. A plurality of lead terminals 32 extend upward from the front end portion 31A and the rear end portion 31B of the main body portion 31. In addition, a pair of positioning portions 34, 34 having a concave shape are formed at the left end portion 31C and the right end portion 31D of the main body portion 31. The two positioning portions 34, 34 are formed by cutting the left end portion 31C and the right end portion 31D of the main body portion 31 into a substantially U-shaped shape in a top view. The two positioning portions 34, 34 penetrate in the vertical direction. The two positioning portions 34, 34 are formed along the surface shape of the positioning portion 50 provided on the bottom wall portion 12E of the housing 12, and in the present embodiment, correspond to the convex shapes of the two second protrusion portions 522, 522.

[0032] The left and right end portions of the lower surface of the main body portion 31 of the semiconductor element 3 are respectively placed on the upper surfaces of the first protrusion portions 521, 521 of the positioning portion 50. In this state, the left and right end portions 31C, 31D of the main body portion 31 are respectively close to the inner side surfaces of the second protrusion portions 522, 522 and face the inner side surfaces of the second protrusion portions 522, 522. In addition, the convex-shaped portions of the second protrusion portions 52, 52 are inserted inside the two concave-shaped positioning portions 34, 34 of the main body portion 31. Thereby, the movement of the semiconductor element 3 in the front-back, left-right directions is restricted.

[0033] Return Figure 1 , the opening portion 13 of the housing 12 is blocked by a rectangular plate-shaped housing cover 19. As an example, the housing cover 19 is formed of a metal such as aluminum or iron. The housing cover 19 is fixed to the upper end portions of the front, rear, left, and right wall portions 12A to 12D of the housing 12 using an adhesive or screws. The housing cover 19 is fixed to the housing 12, thereby forming an accommodation space inside the housing 12. After the substrate 2 and a plurality of electronic components mounted on the substrate 2 are accommodated in the housing 12, the accommodation space is sealed by filling a potting resin (not shown).

[0034] Next, with reference to Figure 4 (A) to Figure 4 (D) of, the manufacturing process of the electronic device 1 will be described. In this manufacturing process, in a state where the substrate 2 and a plurality of electronic components mounted on the substrate 2 are accommodated in the housing 12, the substrate 2 is welded and connected to the lead terminals of the plurality of electronic components.

[0035] In Figure 4In the process shown in (A), a plurality of electronic components such as the semiconductor element 3 disposed on the lower side of the substrate 2 are accommodated in the housing 12. In the present embodiment, electronic components such as the first connector 15, the second connector 17, a capacitor (not shown), and the semiconductor element 3 are disposed on the lower side of the substrate 2. The first connector 15, the second connector 17, and the capacitor are accommodated in the first accommodation recess 41 to the third accommodation recess 43 formed in the bottom wall portion 12E of the housing 12 and are positioned relative to the substrate 2 to be accommodated later.

[0036] The semiconductor element 3 is disposed in a positioned state relative to the substrate 2 to be accommodated later by the positioning portion 50 provided in the bottom wall portion 12E of the housing 12. Specifically, the left and right end portions of the main body portion 31 of the semiconductor element 3 are placed on the first protrusion portions 521, 521 of the positioning portion 50, and the convex portions of the second protrusion portions 522, 522 of the positioning portion 50 are inserted into the inner sides of the positioned portions 34, 34 of the main body portion 31. In this state, the semiconductor element 3 is supported in a state separated from the bottom wall portion 12E of the housing 12 by the first protrusion portion 521 of the positioning portion 50. In addition, the movement of the semiconductor element 3 in the front-rear, left-right, and up-down directions is restricted by the second protrusion portions 522, 522.

[0037] In Figure 4 In the process shown in (B), the substrate 2 is overlapped and disposed from above the plurality of electronic components in the housing 12. The substrate 2 is supported at a prescribed height position by four substrate support portions 18 in the housing 12. In this state, terminals (32, 15B, 17B) extending from the plurality of electronic components on the lower side of the substrate 2 are inserted and passed through the through holes 21 of the substrate 2. At this time, a gap allowing the semiconductor element 3 to move in the height direction is provided between the main body portion 31 of the semiconductor element 3 and the substrate 2. Therefore, the semiconductor element 3 is positioned relative to the substrate 2 when viewed from the overlapping direction (up-down direction) with respect to the substrate 2 by the positioning portion 50, but movement in the height direction along the overlapping direction is allowed. In addition, the front ends of the lead terminals 32 of the semiconductor element 3 are disposed in a height region that does not protrude from the upper surface of the substrate 2.

[0038] In Figure 4 In the process shown in (C), the plurality of electronic components accommodated in the housing 12 are mounted on the substrate 2 by performing a reflow soldering process. Specifically, the substrate 2 in the housing 12 is pressed from above by the jig 62, and the orientation of the housing 12 is reversed in the up-down direction. The semiconductor element 3 moves in the height direction by its own weight and abuts against the lower surface of the substrate 2. The movement at this time is guided to an appropriate position on the substrate 2 by being guided by the second protrusion portions 522, 522 of the positioning portion 50 and the through holes 21 of the substrate 2. In addition, at the moved position, the lead terminals 32 of the semiconductor element 3 are disposed in a height region that protrudes from the upper surface of the substrate 2.

[0039] In Figure 4 process (C) shown, further, solder 60 melted in the solder furnace is jetted from the lower side of the housing 12 reversed in the vertical direction onto the upper surface of the substrate 2 ( Figure 4 the lower surface in (C)). Through this process, terminals (32, 15B, 17B) inserted through through-holes 21 of the substrate 2 are connected to wiring patterns formed on the substrate 2. That is, through a single reflow soldering process, soldering of a plurality of electronic components arranged on the lower side of the substrate 2 can be completed.

[0040] After that, the orientation of the housing 12 is reversed again in the vertical direction, and the jig 62 for the substrate 2 is released ( Figure 4 (D)). After that, potting resin is filled into the housing 12, and the housing cover 19 is fixed to the housing 12.

[0041] Figure 5 Shows a cross-section of the electronic device 1 manufactured through the processes (A) to (D) of Figure 4 cut in the left-right, up-down directions. As shown in this figure, inside the housing 12, the semiconductor element 3 after being mounted on the substrate 2 is arranged in a state separated from the bottom wall portion 12E constituting the opposing surface of the substrate 2. In Figure 5 , the first gap formed between the semiconductor element 3 and the bottom wall portion 12E is denoted by the reference numeral "T1". The distance of this first gap T1 is preferably the distance required to ensure the insulation distance between the semiconductor element 3 and the housing 12. Thus, in order to ensure insulation between the housing 12 and the semiconductor element 3, labor and time for inserting a sheet-like insulating member can be saved.

[0042] In addition, the semiconductor element 3 is also arranged in a state separated from the positioning portion 50 protruding from the bottom wall portion 12E of the housing 12. Specifically, the lower surface of the main body portion 31 of the semiconductor element 3 is also arranged in a state separated from the upper surfaces of the first protrusion portions 521, 521 of the positioning portion 50. In Figure 5 , the second gap formed between the semiconductor element 3 and the first protrusion portions 521, 521 is denoted by the reference numeral "T2". Through this second gap T2, since the first gap T1 formed between the semiconductor element 3 and the bottom wall portion 12E becomes larger, the potting resin can easily spread to the lower side of the semiconductor element 3 surrounded by the positioning portion 50. As a result, air stagnation is difficult to occur between the semiconductor element 3 and the bottom wall portion 12E, and the heat dissipation efficiency of the semiconductor element 3 can be improved.

[0043] (Function and effect)

[0044] As described above, in the electronic device 1 according to the above-described embodiment, the bottom wall portion 12E of the housing 12 constitutes a facing surface facing the mounting surface of the lower surface of the substrate 2. The semiconductor element 3 as an electronic component is mounted on the mounting surface of the lower surface of the substrate 2. The housing 12 has a positioning portion 50 in the bottom wall portion 12E, and the positioning portion 50 can position and arrange the semiconductor element 3 in a state before the semiconductor element 3 is mounted on the substrate 2. Therefore, in the electronic device 1, it is possible to perform positioning with the substrate 2 to be accommodated later without fixing the semiconductor element 3 to the inside of the housing 12 by screwing.

[0045] Specifically, as shown in (A) to Figure 4 (B) of Figure 4 , the semiconductor element 3 is arranged in the housing 12 in a state positioned by the positioning portion 50. After that, the substrate 2 is stacked and arranged from above the semiconductor element 3, and thus the lead terminals 32 of the semiconductor element 3 are inserted through the through holes 21 of the substrate 2. In this way, it is possible to facilitate the positioning between the substrate 2 and the semiconductor element 3 and reduce the manufacturing cost.

[0046] The positioning portion 50 has a protruding shape protruding from the bottom wall portion 12E of the housing 12, and in a state before the semiconductor element 3 is mounted on the substrate 2, the semiconductor element 3 can be positioned and arranged in a state separated from the bottom wall portion 12E of the housing 12. Therefore, while the semiconductor element 3 is being positioned relative to the substrate 2, the first gap T1 provided between the semiconductor element 3 and the housing 12 can ensure an insulating distance from the housing 12. As a result, the labor and time for inserting a sheet-like insulating member between the semiconductor element 3 and the housing 12 can be saved, making the manufacturing easier.

[0047] As shown in Figure 5 , in a state after the semiconductor element 3 is mounted on the substrate 2, the semiconductor element 3 is also arranged in a state separated from the positioning portion 50. As a result, since the gap formed between the semiconductor element 3 and the bottom wall portion 12E of the housing 2 becomes larger, it is possible to easily spread the potting resin between the semiconductor element 3 and the housing 12. Thereby, it is difficult for air to stay between the semiconductor element 3 and the housing 12, and the heat dissipation efficiency of the semiconductor element can be improved.

[0048] (First modification example of the positioning portion)

[0049] The present invention is not limited to the above-described embodiment, and Figure 6Replace the positioning portion 50 with the positioning portion 70 shown in (A). The positioning portion 70 is composed of a pair of protruding portions 72 protruding from the bottom wall portion 12E of the housing 12. Each protruding portion 72 has a first protruding portion 721 and a second protruding portion 722. The first protruding portion 721 protrudes from the bottom wall portion 12E in a rectangular pedestal shape, and the second protruding portion 722 is provided in a region higher than the height region of the first protruding portion 721 by protruding from the upper surface of the first protruding portion 721. The second protruding portion 722 is composed of a pin protruding upward and corresponds to the positioned portion 78 formed in the main body portion 76 of the semiconductor element 74. The positioned portion 78 is composed of a through hole penetrating the main body portion 76 in the vertical direction. When the semiconductor element 74 is accommodated in the housing 12, the second protruding portion 722 of the positioning portion 70 can be inserted into the positioned portion 78 to penetrate, so as to be positioned relative to the substrate 2 to be accommodated later. In addition, by arranging the second protruding portion 722 to reach the height region of the substrate 2 and inserting the front end of the second protruding portion 722 into the through hole 22 formed in the substrate 2 to penetrate, the positioning between the substrate 2 and the housing 12 can also be performed.

[0050] As Figure 6 As shown in (B), the same as the above embodiment, a first gap T1 is provided between the semiconductor element 74 after substrate mounting and the bottom wall portion 12E of the housing 12. In addition, a second gap T2 is provided between the semiconductor element 74 and the positioning portion 70. Therefore, the same effect as the above embodiment can also be obtained.

[0051] (Second modification example of the positioning portion)

[0052] The present invention is not limited to the above embodiment, and the positioning portion 80 shown in (A) can also be used Figure 7 to replace the positioning portion 50. The positioning portion 80 is composed of a concave portion formed in the bottom wall portion 12E of the housing 12. The positioning portion 80 has a concave portion 82 and a pair of first protruding portions 821. The concave portion 82 is recessed in a substantially rectangular shape in a plan view, and the pair of first protruding portions 821 protrude upward from the bottom surface of the concave portion 82 inside the concave portion 82. The resin-molded main body portion 86 of the semiconductor element 84 and the lead terminals 32 are accommodated in the concave portion 82 together. In this state, the movement of the semiconductor element 84 in the front-back, left-right directions is restricted, and it can be positioned relative to the substrate 2 to be accommodated in the housing 12 later. By placing the end portions on the left and right sides of the main body portion 86 on the pair of first protruding portions 821, the semiconductor element 84 is arranged in a state separated from the bottom surface of the concave portion 82.

[0053] As Figure 7As shown in (B) of the above embodiment, the same as the above embodiment, a first gap T1 is provided between the semiconductor element 84 after substrate mounting and the bottom wall portion 12E of the housing 12. In addition, a second gap T2 is provided between the semiconductor element 84 and the positioning portion 80. Therefore, the same effects as the above embodiment can also be obtained.

[0054] [Supplementary Explanation]

[0055] The structures of the above embodiments and each modification can be combined or changed within the scope not departing from the gist of the present invention. For example, the semiconductor elements 3, 74, and 84 in the above embodiments have a structure in which the electrodes 33 are exposed on the surface of the main body portions 31, 76, and 86, but are not limited thereto. It can also be a structure in which the electrodes are not exposed on the surface of the main body portion, such as a so-called Full Mold Package. In this case, the first protrusions 521, 721, and 821 can also be omitted from the structures of the positioning portions 50, 70, and 80 in the above embodiments and each modification. That is, it can also be configured such that no gap (first gap) is provided between the semiconductor element and the bottom wall portion 12E of the housing 12. In addition, in the above embodiment, a gap (second gap T2) is configured to be provided between the semiconductor element and the positioning portion, but this gap can also be not provided.

[0056] In addition, in the above embodiment, the structure is configured to seal the inside of the housing 12 with potting resin, but the present invention is not limited thereto. It can also be configured such that the inside of the housing 12 is not sealed with potting resin. In addition, in the above embodiment, the structure is configured such that the opening portion 13 of the housing 12 is blocked by the housing cover 19, but it can also be configured such that there is no housing cover 19.

[0057] Explanation of Reference Numerals

[0058] 1 Electronic device

[0059] 2 Substrate

[0060] 3 Semiconductor element (electronic component)

[0061] 12 Housing

[0062] 12E Bottom wall portion (opposing surface)

[0063] 50 Positioning portion

[0064] 70 Positioning portion

[0065] 80 Positioning portion

Claims

1. An electronic device, wherein, The electronic device includes: a substrate, electronic components mounted on the substrate, and a housing that internally houses the substrate and the electronic components, wherein the housing has a positioning portion on a counter surface facing the mounting surface of the substrate on which the electronic components are mounted, and the positioning portion can position and arrange the electronic components in a state before the electronic components are mounted on the substrate.

2. The electronic device according to claim 1, wherein, The positioning portion has a protruding shape protruding from the counter surface of the housing, and in a state before the electronic components are mounted on the substrate, the positioning portion can position and arrange the electronic components in a state separated from the counter surface.

3. The electronic device according to claim 2, wherein, The electronic components are arranged in a state separated from the positioning portion even after being mounted on the substrate.

4. A manufacturing method of an electronic device, wherein, The electronic device includes a substrate, electronic components mounted on the substrate, and a housing that internally houses the substrate and the electronic components, wherein the housing has a positioning portion on a counter surface facing the mounting surface of the substrate on which the electronic components are mounted, and the positioning portion can position and arrange the electronic components in a state before the electronic components are mounted on the substrate, The manufacturing method of the electronic device includes: a step of arranging the electronic components in the housing in a state positioned by the positioning portion; and a step of overlapping and arranging the substrate from above the electronic components arranged in a state positioned in the housing.

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