Laser processing equipment capable of preventing slice TGV from cracking

Abstract

The invention relates to the technical field of laser processing, in particular to laser processing equipment capable of preventing slice TGV breakage, which comprises a rack, a case is fixedly mounted on the rack, a mounting plate is fixedly connected to the upper part of the inner wall of the front side of the case, and a laser transmitter is mounted at the bottom of the mounting plate through driving of an XY-axis control system; the laser emitter is used for laser through hole glass substrates; the feeding frame and the discharging frame are symmetrically and fixedly arranged on the inner wall of the rear side of the machine box, the feeding frame and the discharging frame are used for feeding and discharging of glass substrates to be machined respectively, and a water cooling unit is arranged at the top of the machine frame. The water cooling unit is adopted for cooling the machining table, the flow of cooling water flowing through the containing table is dynamically regulated and controlled through cooperation with the regulation and control mechanism according to heat generated at different positions during glass substrate through hole machining, the thermal stress of a glass substrate in the machining process is effectively controlled, and therefore the risk of breakage during glass substrate through hole machining is reduced.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and more particularly, to a laser processing device capable of preventing thin-film TGV from cracking. Background Art

[0002] With the rapid development of semiconductor packaging technology, 3D integration, and microelectromechanical systems (MEMS), the technology of glass through-vias (TGV) has occupied an important position in the field of advanced packaging due to its excellent insulation performance, high-frequency response characteristics, and excellent thermal stability. However, when it comes to laser processing of thin films with a thickness usually between 50 and 300 μm, due to the brittle nature and low thermal conductivity of the glass material itself, local thermal stress accumulation and mechanical vibration are likely to occur during the processing, resulting in the generation of microcracks in the glass material or even the problem of overall cracking, thereby limiting the production yield and processing efficiency.

[0003] Although current laser processing devices have been optimized to a certain extent for the special requirements of TGV thin films, there are still several core problems to be solved. First, the rigid design of the cooling system. The traditional single-cycle water cooling or air cooling cannot adapt to the dynamically changing processing thermal field, resulting in uneven cooling and making it difficult to effectively control the thermal stress in local areas. Second, the traditional vacuum adsorption or mechanical clamping methods are likely to cause additional stress and have limited ability to suppress high-frequency vibrations generated during the processing, which may further exacerbate the risk of microcrack propagation in the material. Therefore, we propose a laser processing device capable of preventing thin-film TGV from cracking to improve the above problems. Summary of the Invention

[0004] In order to overcome the above-mentioned disadvantages of the prior art, the present invention provides a laser processing device capable of preventing thin-film TGV from cracking.

[0005] The technical implementation solution of the present invention is as follows: A laser processing device capable of preventing thin-film TGV from cracking, including a machine frame, which is the load-bearing carrier of this device. A chassis is fixedly installed on the machine frame. The upper part of the inner wall of the front side of the chassis is fixedly connected with a mounting plate. A laser emitter is driven and installed at the bottom of the mounting plate through an XY-axis control system. The XY-axis control system is an existing driving technology device. The laser emitter is used for laser through-hole glass substrates. It also includes a feeding frame and a discharging frame symmetrically and fixedly arranged on the inner wall of the rear side of the chassis. The feeding frame and the discharging frame are respectively used for feeding and discharging the glass substrates to be processed. A water cooling unit is arranged on the top of the machine frame. The water cooling unit is an existing device for circulating cooling water. A processing table for placing the glass substrates to be processed is arranged on the top of the outer shell of the water cooling unit. A transfer mechanism is arranged in the chassis between the feeding frame and the discharging frame. The transfer mechanism is used to sequentially transfer the glass substrates between the feeding frame, the processing table, and the discharging frame. The glass substrate fed at the feeding frame is transferred to the processing table for processing, and then the processed glass on the processing table is transferred to the discharging frame for discharging. The processing table includes a mounting frame fixedly installed on the top of the water cooling unit. The mounting frame is a hollow frame body, and a placing table is fixedly assembled on the top. The placing table is a hollow table body and is used to carry the glass substrates to be processed. Adsorption through-tubes are densely arrayed between the upper and lower table surfaces of the placing table and penetrate through to the mounting frame at the bottom of the placing table. The bottom plate of the mounting frame is an open-hole plate, and a plurality of adsorption fans are fixedly installed inside the mounting frame. The adsorption fans blow air downward, making the air flow in the adsorption through-tubes flow downward. The glass substrate to be processed placed on the placing table will be stably adsorbed by the negative pressure generated in the adsorption through-tubes. An inlet water channel and an outlet water channel are respectively communicated on both sides of the placing table. A plurality of communication cavities communicating with the inside of the placing table are symmetrically arranged on both the inlet water channel and the outlet water channel. The inlet water channel is communicated with the water supply pipe of the water cooling unit through an inlet pipe, and the outlet water channel is communicated with the water return pipe of the water cooling unit through an outlet pipe. A regulating mechanism for regulating the water inflow and outflow of the inlet water channel and the outlet water channel is arranged inside the table body of the placing table.

[0006] Optionally, the laser emitter includes a lifting cylinder assembled in the XY-axis control system. The piston rod of the lifting cylinder faces downward and is fixedly connected with a support plate. A laser head for emitting through-hole laser is assembled on the support plate. A layer of outer tube is fixedly arranged outside the laser head and covers the periphery of the laser head. An air inlet plate with through-holes is arranged between the bottom of the outer tube and the laser head. An exhaust pipe is externally communicated with the tube body of the outer tube, and the exhaust pipe is used for connecting to an exhaust gas treatment device.

[0007] Optionally, the transfer mechanism includes a first motor fixedly installed at the bottom of the chassis. A connecting plate is fixedly connected to the output shaft of the first motor. A short-stroke cylinder is fixedly installed on the connecting plate. A transfer plate is fixedly connected to the piston rod of the short-stroke cylinder. An adsorption disc is assembled at the bottom of the plate end of the transfer plate. Adsorption holes are densely formed on the adsorption surface of the adsorption disc. A negative pressure fan is also assembled on the transfer plate. The negative pressure fan is connected to the adsorption disc on the transfer plate through a pipeline. The adsorption disc cooperates with the negative pressure fan to adsorb the glass substrate to be transferred.

[0008] Optionally, the regulation mechanism includes a first stopper rotatably arranged in the communication cavity between the placement table and the water inlet channel. The first stopper is symmetrically hinged in the corresponding communication cavity. A first spring is arranged between the first stopper and the placement table. The first stopper blocks in the communication cavity under the action of the first spring. A second stopper is symmetrically hinged in the communication cavity between the placement table and the water outlet channel. A second spring is arranged between the second stopper and the water outlet channel. The second stopper blocks in the communication cavity under the action of the second spring. A driving rod slidably connected to the inside of the placement table and having the same number as the communication cavities is provided. One end of the driving rod contacts the first stopper, and the other end of the driving rod contacts the second stopper. A second motor is fixedly installed at the bottom of the placement table corresponding to each driving rod. The output shaft of the second motor penetrates the bottom surface of the placement table and is fixedly connected to a driving frame. A convex rod slidably matched with the driving frame is arranged on the driving rod.

[0009] Optionally, temperature sensors are arranged on the four sides of the tabletop of the processing table. The temperature sensors are used to sense the temperature change of the glass substrate. The temperature sensors include rotating rods respectively hinged to the four sides of the placement table. Motors are fixedly installed at the four corners of the outer edge of the bottom surface of the placement table. The rotating rods are driven by the motors installed at the bottom of the placement table. One side of the rod end of the rotating rod is hinged to a heat conduction plate. The heat conduction plate is arc-shaped and internally provided with a thermocouple sensor. The thermocouple sensor is used to sense the change in the heat conducted by the corresponding heat conduction plate. The thermocouple sensor electrically controls the second motor through a built-in controller.

[0010] Optionally, a rack is assembled at the material inlet of the feeding frame and the discharging frame close to the chassis. The rack is used for stacking and placing multiple layers of glass substrates. Slots suitable for the up-and-down sliding of the rack are formed on the bottom plates of the feeding frame and the discharging frame. Electric sliding rails are fixedly arranged on the inner walls of the chassis close to the feeding frame and the discharging frame. The sliders of the electric sliding rails are snap-connected to the rack.

[0011] Optionally, chutes are provided at the bottoms of the frames of the feeding frame and the discharging frame. An electric drive conveyor belt I is arranged in the chute of the feeding frame and is used to convey the glass substrates on the rack in the feeding frame to the loading area of the loading mechanism. An electric drive conveyor belt II is arranged in the chute of the discharging frame and is used to convey the glass substrates discharged by the loading mechanism in the discharging frame to the rack.

[0012] Optionally, a positioning plate is slidably arranged on the bottom plates of the feeding frame and the discharging frame close to the processing table. The positioning plate is positioned on the bottom plates of the feeding frame and the discharging frame through fastening buckles, and the positioning plate is used to limit glass substrates of different sizes in the loading areas of the feeding frame and the discharging frame.

[0013] Advantages of the present invention: 1. The present invention uses a water cooling unit to cool the processing table, and cooperates with a regulation mechanism to dynamically regulate the flow rate of the cooling water flowing through the placement table according to the heat generated at different positions during the through-hole processing of the glass substrate, effectively controlling the thermal stress of the glass substrate during the processing, thereby reducing the risk of cracking of the glass substrate during through-hole processing.

[0014] 2. The present invention utilizes temperature sensing elements arranged on the four sides of the processing table to monitor the temperature changes at different positions on the glass substrate in real time. The thermocouple sensor can automatically adjust the cooling water volume in the corresponding area according to the detected heat changes, realizing dynamic temperature reduction of the glass substrate during the laser through-hole processing process.

[0015] 3. The present invention can also realize the integrated process of stacking, lifting and conveying of glass substrates through the electric drive conveyor belt I and the electric drive conveyor belt II, in cooperation with the rack, the electric slide rail and the loading mechanism, improving the automation level of material conveying during the laser through-hole processing of glass substrates. Description of the drawings

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0017] Figure 2 It is a schematic diagram of components such as the chassis, laser emitter, processing table and loading mechanism of the present invention.

[0018] Figure 3 It is a connection relationship diagram of components such as the XY-axis control system and the laser emitter of the present invention.

[0019] Figure 4 It is a connection relationship diagram of the water cooling unit, the installation frame and the placement table of the present invention.

[0020] Figure 5 It is a schematic diagram of the specific components inside the processing table of the present invention.

[0021] Figure 6Schematic diagram of components such as the installation frame, placement table, adsorption fan, and regulation mechanism of the present invention.

[0022] Figure 7 Schematic diagram of the placement table, water inlet channel, first stopper, and drive rod of the present invention.

[0023] Figure 8 Schematic diagram of the placement table, water outlet channel, second stopper, and drive rod of the present invention.

[0024] Figure 9 Schematic diagram of the specific components of the laser emitter of the present invention.

[0025] Figure 10 Connection relationship diagram of the rotating rod, motor, heat conduction plate, and thermocouple sensor of the present invention.

[0026] Figure 11 Schematic diagram of the chassis, feeding frame, discharging frame, and material rack of the present invention.

[0027] Figure 12 Schematic three-dimensional structure diagram of the specific components of the transfer mechanism of the present invention.

[0028] Figure 13 Schematic diagram of the feeding frame, material rack, electric slide rail, and positioning plate of the present invention.

[0029] Meanings of the reference numerals in the figure: 100 - glass substrate, 1 - frame, 2 - chassis, 3 - mounting plate, 31 - XY-axis control system, 4 - laser emitter, 41 - lifting cylinder, 42 - support plate, 43 - laser head, 44 - outer tube, 45 - air inlet plate, 46 - air extraction pipe, 5 - feeding frame, 51 - first electric drive conveyor belt, 6 - discharging frame, 61 - second electric drive conveyor belt, 7 - transfer mechanism, 71 - first motor, 72 - connecting plate, 73 - short-stroke cylinder, 74 - transfer plate, 75 - adsorption disc, 76 - negative pressure fan, 8 - water cooling unit, 81 - water inlet pipe, 82 - water outlet pipe, 9 - processing table, 91 - installation frame, 92 - placement table, 921 - adsorption through pipe, 93 - water inlet channel, 94 - water outlet channel, 10 - adsorption fan, 11 - regulation mechanism, 111 - first stopper, 112 - first spring, 113 - second stopper, 114 - second spring, 115 - drive rod, 116 - second motor, 117 - drive frame, 12 - temperature sensing element, 121 - rotating rod, 122 - motor, 123 - heat conduction plate, 124 - thermocouple sensor, 13 - material rack, 14 - electric slide rail, 141 - slider, 15 - positioning plate, 151 - fastening lock. Detailed implementation manners

[0030] It should first be noted that in the embodiments described differently, the same components are provided with the same reference signs or the same component names, wherein the disclosure contained throughout the specification can be meaningfully transferred to the same components with the same reference signs or the same component names. The positional descriptions selected in the specification, such as up, down, lateral, etc., also refer to the directly described and illustrated drawings and are meaningfully transferred to the new positions when the positions change.

[0031] Embodiment 1: A laser processing device capable of preventing a thin film TGV from cracking, such as Figures 1-6As shown in the figure, it includes a machine frame 1. The machine frame 1 is the load-bearing carrier of this equipment. A chassis 2 is fixedly installed on the machine frame 1. On the upper part of the inner wall of the front side of the chassis 2, a mounting plate 3 is fixedly connected. At the bottom of the mounting plate 3, a laser emitter 4 is driven and installed through an XY-axis control system 31. The XY-axis control system 31 is an existing driving technology device, and the laser emitter 4 is used for laser through-holing a glass substrate 100; it also includes a feeding frame 5 and a discharging frame 6 symmetrically and fixedly arranged on the inner wall of the rear side of the chassis 2. The feeding frame 5 and the discharging frame 6 are respectively used for feeding and discharging the glass substrate 100 to be processed. A water cooling unit 8 is arranged on the top of the machine frame 1. The water cooling unit 8 is an existing device for circulating cooling water. On the top of the shell of the water cooling unit 8, there is a processing table 9 for placing the glass substrate 100 to be processed. Inside the chassis 2, between the feeding frame 5 and the discharging frame 6, there is a transfer mechanism 7. The transfer mechanism 7 is used to sequentially transfer the glass substrate 100 between the feeding frame 5, the processing table 9 and the discharging frame 6. The glass substrate 100 fed at the feeding frame 5 is transferred to the processing table 9 for processing, and then the glass processed on the processing table 9 is transferred to the discharging frame 6 for discharging; the processing table 9 includes a mounting frame 91 fixedly installed on the top of the water cooling unit 8. The mounting frame 91 is a hollow frame body, and a placing table 92 is fixedly assembled on the top. The placing table 92 is a hollow table body and is used to carry the glass substrate 100 to be processed. Between the upper and lower table surfaces of the placing table 92, adsorption through-tubes 921 are densely arranged in an array. The adsorption through-tubes 921 penetrate through to the mounting frame 91 inside the bottom of the placing table 92. The bottom plate of the mounting frame 91 is an open-hole plate. Inside the mounting frame 91, a plurality of adsorption fans 10 are fixedly installed. The adsorption fans 10 blow air downward, so that the air flow in the adsorption through-tubes 921 flows downward. The glass substrate 100 to be processed placed on the placing table 92 will be stably adsorbed by the negative pressure generated in the adsorption through-tubes 921. On both sides of the placing table 92, a water inlet channel 93 and a water outlet channel 94 are respectively communicated. Both the water inlet channel 93 and the water outlet channel 94 are symmetrically provided with a plurality of communication cavities communicating with the inside of the placing table 92. The water inlet channel 93 is communicated with the water supply pipe of the water cooling unit 8 through a water inlet pipe 81, and the water outlet channel 94 is communicated with the water return pipe of the water cooling unit 8 through a water outlet pipe 82; inside the table body of the placing table 92, there is a regulating mechanism 11 for regulating the water inflow and outflow of the water inlet channel 93 and the water outlet channel 94. Through the cooperation of the adsorption fans 10 and the adsorption through-tubes 921, the glass substrate 100 to be processed transferred to the processing table 9 can be stably adsorbed on the placing table 92. When the laser emitter 4 is driven by the XY-axis control system 31 to perform through-hole processing on the glass substrate 100 on the placing table 92, by using the regulating mechanism 11, according to the heat generated when the glass substrate 100 is through-holed at different positions, by regulating the flow rate of the cooling water flowing through the placing table 92 in the water inlet channel 93 and the water outlet channel 94, the heat of the glass substrate 100 during through-hole processing can be effectively cooled, so that the thermal stress in the local area of the glass substrate 100 is difficult to be effectively controlled, and the risk of the glass substrate 100 cracking during through-hole processing is reduced.

[0032] AsFigure 3 and Figure 9 As shown in Figure 9 , the laser emitter 4 includes a lifting cylinder 41 assembled in the XY-axis control system 31. The piston rod of the lifting cylinder 41 faces downward and is fixedly connected to a support plate 42. A laser head 43 for emitting through-hole laser is assembled on the support plate 42. A layer of outer tube 44 is fixedly arranged outside the laser head 43. The outer tube 44 covers the periphery of the laser head 43. An air inlet plate 45 with a through-hole is arranged between the bottom of the outer tube 44 and the laser head 43. An exhaust pipe 46 is communicated outward from the tube body of the outer tube 44. The exhaust pipe 46 is used to connect to an exhaust gas treatment device externally. The XY-axis control system 31 cooperates with the lifting cylinder 41 to drive the three-dimensional displacement of the laser head 43, so that the laser head 43 can emit laser to perform through-hole processing on the glass substrate 100 on the placement table 92. During the through-hole processing, the exhaust pipe 46 connected to the exhaust gas treatment device externally can synchronously suck away waste gases such as particulate matter, smoke and gaseous pollutants generated.

[0033] As Figure 2 、 Figure 11 and Figure 12 As shown in Figure 12 , the transfer mechanism 7 includes a motor 71 fixedly installed at the bottom of the chassis 2. A connecting plate 72 is fixedly connected to the output shaft of the motor 71. A short-stroke cylinder 73 is fixedly installed on the connecting plate 72. A transfer plate 74 is fixedly connected to the piston rod of the short-stroke cylinder 73. An adsorption disc 75 is assembled at the bottom of the plate end of the transfer plate 74. Adsorption holes are densely arranged on the adsorption surface of the adsorption disc 75. A negative pressure fan 76 is also assembled on the transfer plate 74. The negative pressure fan 76 is communicated with the adsorption disc 75 on the transfer plate 74 through a pipeline. The adsorption disc 75 cooperates with the negative pressure fan 76 to adsorb the glass substrate 100 to be transferred. After the short-stroke cylinder 73 drives the adsorption disc 75 on the transfer plate 74 downward to contact the surface of the glass substrate 100, the negative pressure fan 76 blows air to generate suction force on the adsorption disc 75 to adsorb the glass substrate 100. After the short-stroke cylinder 73 drives the adsorption disc 75 upward to adsorb the glass substrate 100, the glass substrate 100 adsorbed by the adsorption disc 75 on the transfer plate 74 is driven by the motor 71 to rotate to complete the transfer.

[0034] As Figure 11 and Figure 13As shown in the figure, material racks 13 are assembled and docked at the material inlets of the feed frame 5 and the discharge frame 6 close to the chassis 2. The material racks 13 are used to stack multiple layers of glass substrates 100. Slots are provided on the bottom plates of the feed frame 5 and the discharge frame 6 for the material racks 13 to slide up and down. Electric slide rails 14 are fixedly installed on the inner walls of the chassis 2 near the feed frame 5 and the discharge frame 6. The sliders 141 of the electric slide rails 14 are snap-connected to the material racks 13. After the material racks 13 are assembled into the feed frame 5 and the discharge frame 6 and docked with the sliders 141 of the corresponding electric slide rails 14, the electric slide rails 14 intermittently drive the material racks 13 to lift at equal intervals at the corresponding first electric conveyor belt 51 and the second electric conveyor belt 61, so that the multiple layers of glass substrates 100 stacked on the material racks 13 are aligned with the first electric conveyor belt 51 and the second electric conveyor belt 61. Then, the glass substrates 100 on the material rack 13 in the feed frame 5 can be fed by the drive of the first electric conveyor belt 51, and the glass substrates 100 discharged from the first electric conveyor belt 51 in the discharge frame 6 can also be loaded onto the material rack 13, improving the feeding and discharging efficiency of the processed glass substrates 100.

[0035] As Figure 2 shown, Figure 11 slots are provided at the bottom of the frames of the feed frame 5 and the discharge frame 6. A first electric conveyor belt 51 is arranged in the slot of the feed frame 5. The first electric conveyor belt 51 is used to convey the glass substrates 100 on the material rack 13 in the feed frame 5 to the transfer area of the transfer mechanism 7. A second electric conveyor belt 61 is arranged in the slot of the discharge frame 6. The second electric conveyor belt 61 is used to convey the glass substrates 100 transferred out by the transfer mechanism 7 in the discharge frame 6 onto the material rack 13, realizing the automatic transfer of the glass substrates 100 during through-hole processing.

[0036] As Figure 11 shown, Figure 13 positioning plates 15 are slidably arranged on the bottom plates on one side of the feed frame 5 and the discharge frame 6 close to the processing table 9. The positioning plates 15 are positioned on the bottom plates of the feed frame 5 and the discharge frame 6 through fastening locks 151. The positioning plates 15 are used to limit glass substrates 100 of different sizes in the transfer areas of the feed frame 5 and the discharge frame 6, so that the suction cups 75 on the transfer mechanism 7 can accurately adsorb and transfer glass substrates 100 of different sizes.

[0037] According to the size of the thin-film TGV glass substrate 100 to be processed, first slide and adjust the positioning plates 15 on the bottom plates of the feeding frame 5 and the discharging frame 6. Position the positioning plates 15 through the fastening latches 151 and adjust them to a position matching the size of the glass substrate 100 to ensure that the glass substrate 100 is accurately aligned in the transfer areas of the feeding frame 5 and the discharging frame 6. Subsequently, slide the rack 13 loaded with the glass substrate 100 into the feeding frame 5, and at the same time, slide the empty rack 13 into the discharging frame 6 so that the rack 13 can be snapped onto the slider 141 of the corresponding electric slide rail 14. Then, activate the electric slide rail 14 at the outlet of the feeding frame 5. The electric slide rail 14 drives the rack 13 to descend through the slider 141, aligning a substrate to be processed loaded in the rack 13 with the first electric conveyor belt 51 in the feeding frame 5. Then, the first electric conveyor belt 51 in the feeding frame 5 conveys the glass substrate 100 to the designated transfer area of the transfer mechanism 7. Subsequently, activate the first motor 71. The first motor 71 drives the connecting plate 72 to rotate around the output shaft, moving the short-stroke cylinder 73 and the transfer plate 74 directly above the glass substrate 100 in the transfer area of the feeding frame 5. The piston rod of the short-stroke cylinder 73 drives the suction cup 75 at the bottom of the transfer plate 74 to contact the surface of the glass substrate 100 downward. At this time, the negative pressure fan 76 is activated, generating negative pressure through the dense suction holes on the surface of the suction cup 75, enabling the suction cup 75 to firmly adsorb the glass substrate 100. Then, the short-stroke cylinder 73 lifts the adsorbed glass substrate 100. At the same time, the first motor 71 drives the connecting plate 72 to rotate again, horizontally transporting the adsorbed glass substrate 100 to the placement table 92 of the processing table 9. The negative pressure fan 76 stops working, and the suction cup 75 releases negative pressure, enabling the glass substrate 100 to be smoothly placed on the surface of the placement table 92. Meanwhile, the suction fan 10 inside the mounting frame 91 is activated, forming a downward air flow through the dense array of suction pipes 921, generating uniform negative pressure on the surface of the placement table 92, and tightly adsorbing and fixing the glass substrate 100 on the placement table 92 to prevent displacement or vibration during the laser processing. Then, laser through-hole processing is performed on the glass substrate 100 on the placement table 92.

[0038] Example 2: On the basis of Example 1, as Figures 5-8As shown in the figure, the regulating mechanism 11 includes a first stopper 111 rotatably arranged in the communication cavity between the placing table 92 and the water inlet channel 93. The first stoppers 111 are symmetrically hinged in the corresponding communication cavities. A first spring 112 is arranged between each first stopper 111 and the placing table 92. Under the action of the first spring 112, the first stopper 111 blocks in the communication cavity. Second stoppers 113 are symmetrically hinged in the communication cavity between the placing table 92 and the water outlet channel 94. A second spring 114 is arranged between each second stopper 113 and the water outlet channel 94. Under the action of the second spring 114, the second stopper 113 blocks in the communication cavity. A driving rod 115 with the same number as the communication cavities is slidably connected inside the placing table 92. One end of the driving rod 115 contacts the first stopper 111, and the other end of the driving rod 115 contacts the second stopper 113. A second motor 116 is fixedly installed at the bottom of the placing table 92 corresponding to each driving rod 115. The output shaft of the second motor 116 penetrates the bottom surface of the placing table 92 and is fixedly connected to a driving frame 117. A convex rod that slidably cooperates with the driving frame 117 is arranged on the driving rod 115. By controlling the second motors 116 in different regions, the second motors 116 rotate the driving frame 117 to press the convex rod on the driving rod 115. The driving rod 115 can drive the first stopper 111 and the second stopper 113 in the communication cavities of different regions to open, so that the cooling water flow in different regions of the water inlet channel 93 changes, and the glass substrate 100 on the placing table 92 is cooled in a divided area, so as to better adapt to the dynamically changing processing thermal field during the through-hole processing of the glass substrate 100.

[0039] As Figure 3 , Figure 4 and Figure 10 shown in the figure, temperature sensors 12 are arranged on all four sides of the tabletop of the processing table 9. The temperature sensors 12 are used to sense the temperature change on the glass substrate 100. The temperature sensors 12 include rotating rods 121 respectively hinged to the four sides of the placing table 92. Motors 122 are fixedly installed at the four corners of the outer edge of the bottom surface of the placing table 92. The rotating rods 121 are driven by the motors 122 installed at the bottom of the placing table 92. One side of the rod end of the rotating rod 121 is hinged with a heat conduction plate 123. The heat conduction plate 123 is arc-shaped and internally provided with a thermocouple sensor 124. The thermocouple sensor 124 is used to sense the change in the heat conducted by the corresponding heat conduction plate 123. The thermocouple sensor 124 electrically controls the second motor 116 through a built-in controller. The four rotating rods 121 are driven by the motors 122 to fit the outside of the glass substrate 100 on the placing table 92 through the heat conduction plates 123. The thermocouple sensor 124 is used to monitor the heat change of the corresponding heat conduction plate 123 in real time, so as to sense the heat at different positions on the glass substrate 100 during the through-hole processing. The thermocouple sensor 124 controls the rotation of the second motor 116 near the heat source position through the controller, so that the opening angles of the first stopper 111 and the second stopper 113 in the communication cavity at the corresponding heat source change, so that the cooling water can flow more into the heat source concentration area, realizing the dynamic cooling of the glass substrate 100 during the laser through-hole processing.

[0040] During processing, first, the lifting cylinder 41 drives the support plate 42 to descend vertically, bringing the laser head 43 and the outer tube 44 covering its periphery closer to the surface of the glass substrate 100. At the same time, in cooperation with the XY-axis control system 31, the laser head 43 is precisely controlled to move along the X-Y plane according to a preset path. Meanwhile, the laser head 43 emits a high-energy laser beam to perform through-hole processing on the glass substrate 100. During the through-hole processing, the air inlet plate 45 at the bottom of the outer tube 44 allows external air flow to enter, and at the same time, the waste gas treatment equipment connected to the exhaust pipe 46 continuously sucks, so as to suck away the particulate matter, smoke and harmful gases generated by laser ablation. At the same time, the cooling water in the water-cooling unit 8 flows into the water inlet channel 93 through the water inlet pipe 81, enters the inside of the placement table 92 through multiple groups of communication cavities in the water inlet channel 93, and after flowing through the inside of the placement table 92, flows into the water outlet pipe 82 through multiple groups of communication cavities in the water outlet channel 94, and finally flows back to the water-cooling unit 8 through the water outlet pipe 82 for cooling circulation. In this process, the cooling water will absorb the heat generated by laser processing the glass substrate 100. During the cooling process, the motor 122 in the temperature sensing part 12 is activated, the motor 122 drives the rotating rod 121 to rotate, the rotating rod 121 drives the arc-shaped heat conducting plate 123 to fit the edge of the glass substrate 100, and the built-in thermocouple sensor 124 monitors the surface temperature distribution of the substrate in real time. When the thermocouple sensor 124 detects that the temperature in a certain area rises abnormally, the controller immediately sends an instruction to the motor two 116 in the corresponding area. The motor two 116 synchronously drives the driving frame 117 to rotate and presses the convex rod on the driving rod 115. The driving rod 115 will simultaneously overcome the spring one 112 and the spring two 114 to push and pull the stopper one 111 and the stopper two 113, forcing the stopper one 111 and the stopper two 113 to generate an angular deflection in the corresponding communication cavity, thereby increasing the flow rate of the cooling water in this area, thereby specifically strengthening the heat dissipation efficiency of the placement table 92, thereby dynamically regulating and effectively balancing the thermal field distribution on the glass substrate 100 during processing, and avoiding microcracks or fractures caused by local thermal stress concentration.

[0041] After the laser through-hole processing is completed, the adsorption fan 10 in the installation frame 91 stops running, and the glass substrate 100 is released from the negative pressure adsorption state. Subsequently, the short-range cylinder 73 of the transfer mechanism 7 drives the adsorption disc 75 to descend again and adsorb the finished substrate on the placement table 92. At the same time, the motor one 71 drives the connecting plate 72 to rotate above the discharge frame 6, and the negative pressure fan 76 releases the adsorption force, and the finished substrate is smoothly placed on the electric drive conveyor belt two 61 in the discharge frame 6. The electric drive conveyor belt two 61 starts, and conveys the substrate to the rack 13 inside the discharge frame 6. In cooperation with the discharge frame 6, the electric slide rail 14 descends intermittently according to the stacking height, realizing the automatic stacking and storage of multiple layers of finished substrates on the rack 13. At the same time, the electric slide rail 14 of the feed frame 5 synchronously controls the rack 13 to rise again, aligning the next substrate to be processed with the feed port of the electric drive conveyor belt one 51, and preparing to enter a new round of processing cycle.

[0042] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form. Any technical solutions obtained by means of equivalent replacement or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A laser processing device capable of preventing the rupture of a thin-film TGV, comprising a frame (1) with a chassis (2) fixedly installed at the top. Inside the chassis (2), an upper mounting plate (3) is fixedly connected. At the bottom of the mounting plate (3), a laser emitter (4) is installed through an XY-axis control system (31). It is characterized in that It further includes a feeding frame (5) and a discharging frame (6) fixedly arranged at the rear side of the chassis (2). At the top of the frame (1), a water-cooling unit (8) is provided. At the top of the water-cooling unit (8), a processing table (9) is provided. Inside the chassis (2), a transfer mechanism (7) is provided. The processing table (9) includes a mounting frame (91) fixedly installed at the top of the water-cooling unit (8). At the top of the mounting frame (91), a placement table (92) is fixedly assembled. Between the upper and lower surfaces of the placement table (92), adsorption through-tubes (921) are densely arranged in an array. The adsorption through-tubes (921) penetrate through to the inside of the mounting frame (91) at the bottom of the placement table (92). Inside the mounting frame (91), an adsorption fan (10) is fixedly installed. On both sides of the placement table (92), a water inlet channel (93) and a water outlet channel (94) are respectively communicated. The water inlet channel (93) and the water outlet channel (94) are both symmetrically provided with a plurality of communication cavities communicating with the placement table (92). The water inlet channel (93) is communicated with the water supply pipe of the water-cooling unit (8) through a water inlet pipe (81). The water outlet channel (94) is communicated with the water return pipe of the water-cooling unit (8) through a water outlet pipe (82). A regulating mechanism (11) for regulating the flow rates of the water inlet channel (93) and the water outlet channel (94) is arranged inside the table body of the placement table (92).

2. A laser processing device capable of preventing the rupture of a thin TGV according to claim 1, characterized in that, The laser emitter (4) includes a lifting cylinder (41) assembled in the XY-axis control system (31). The piston rod of the lifting cylinder (41) faces downward and is fixedly connected with a support plate (42). On the support plate (42), a laser head (43) is assembled. A layer of outer tube (44) is fixedly arranged outside the laser head (43). The outer tube (44) covers the periphery of the laser head (43). Between the bottom of the outer tube (44) and the laser head (43), an air inlet plate (45) with through-holes is provided. The tube body of the outer tube (44) is externally communicated with an air extraction pipe (46).

3. A laser processing device capable of preventing the breakage of a thin-film TGV according to claim 2, characterized in that, The transfer mechanism (7) includes a motor one (71) fixedly installed at the bottom of the chassis (2). On the output shaft of the motor one (71), a connecting plate (72) is fixedly connected. On the connecting plate (72), a short-stroke cylinder (73) is fixedly installed. On the piston rod of the short-stroke cylinder (73), a transfer plate (74) is fixedly connected. At the bottom of the plate end of the transfer plate (74), an adsorption disc (75) is assembled. On the adsorption surface of the adsorption disc (75), adsorption holes are densely arranged. A negative pressure fan (76) is also assembled on the transfer plate (74). The negative pressure fan (76) is communicated with the adsorption disc (75) on the transfer plate (74) through a pipeline.

4. A laser processing device capable of preventing the thin-film TGV from cracking according to claim 3, characterized in that, The regulating mechanism (11) includes a first stopper (111) rotatably arranged in the communication cavity between the placing table (92) and the water inlet channel (93). The first stoppers (111) are symmetrically hinged in the corresponding communication cavities. A first spring (112) is arranged between each first stopper (111) and the placing table (92). Second stoppers (113) are symmetrically hinged in the communication cavity between the placing table (92) and the water outlet channel (94). A second spring (114) is arranged between each second stopper (113) and the water outlet channel (94). A driving rod (115) with the same number as the communication cavities is slidably connected inside the placing table (92). One end of the driving rod (115) contacts the first stopper (111), and the other end of the driving rod (115) contacts the second stopper (113). A second motor (116) is fixedly installed at the bottom of the placing table (92) corresponding to each driving rod (115). The output shaft of the second motor (116) penetrates the bottom surface of the placing table (92) and is fixedly connected to a driving frame (117). The driving rod (115) is provided with a convex rod that slidably cooperates with the driving frame (117).

5. A laser processing device capable of preventing the rupture of a thin-film TGV according to claim 4, characterized in that, Temperature sensors (12) are arranged on the four sides of the tabletop of the processing table (9). The temperature sensors (12) are used to sense the temperature change on the glass substrate (100). The temperature sensors (12) include rotating rods (121) respectively hinged to the four sides of the placing table (92). Electric motors (122) are fixedly installed at the four corners of the outer edge of the bottom surface of the placing table (92). The rotating rods (121) are driven by the electric motors (122) installed at the bottom of the placing table (92). One side of the rod end of the rotating rod (121) is hinged to a heat conducting plate (123). A thermocouple sensor (124) is arranged inside the heat conducting plate (123). The thermocouple sensor (124) is used to sense the change in the heat conducted by the corresponding heat conducting plate (123). The thermocouple sensor (124) electrically controls the second motor (116) through a built-in controller.

6. A laser processing device capable of preventing the rupture of a thin-film TGV according to claim 5, characterized in that, Material racks (13) are assembled and docked at the material inlets of the feeding frame (5) and the discharging frame (6) close to the machine case (2). The material racks (13) are used to stack and place multiple glass substrates (100). Slots for the up-and-down sliding of the material racks (13) are opened on the bottom plates of the feeding frame (5) and the discharging frame (6). Electric sliding rails (14) are fixedly arranged on the inner walls of the machine case (2) close to the feeding frame (5) and the discharging frame (6). The sliders (141) of the electric sliding rails (14) are snap-connected to the material racks (13).

7. A laser processing device capable of preventing a thin-film TGV from cracking according to claim 6, characterized in that, Chutes are opened at the bottom of the frames of the feeding frame (5) and the discharging frame (6). An electrically driven conveyor belt one (51) is arranged in the chute of the feeding frame (5), and an electrically driven conveyor belt two (61) is arranged in the chute of the discharging frame (6).

8. A laser processing device capable of preventing the rupture of a thin-film TGV according to claim 7, characterized in that, Positioning plates (15) are slidably arranged on the bottom plates of the feeding frame (5) and the discharging frame (6) close to the processing table (9). The positioning plates (15) are provided with fastening locks (151) for positioning on the bottom plates of the feeding frame (5) and the discharging frame (6).

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