Control method of carrying manipulator

Abstract

The invention discloses a control method of a carrying manipulator. The control method comprises the steps that a first controller sends a carrying instruction to a second controller and a signal processor; the second controller controls the mechanical arm to move according to the carrying instruction and controls the corresponding first wafer fork to take the wafer according to the carrying instruction; the first detection part collects a first signal indicating whether the first wafer fork takes the wafer or not and sends the first signal to the signal processor; the signal processor compares the first signal with a carrying instruction to judge whether carrying abnormity exists in each first sheet fork or not; and when the first wafer fork which is abnormal in carrying exists, the signal processor transmits information of the first wafer fork which is abnormal in carrying to the first controller, and the second controller does not execute the next received carrying instruction any more. Abnormal sheet forks can be quickly positioned and carried, and troubleshooting is facilitated.

Description

Technical Field

[0001] The present invention relates to the field of wafer handling equipment stations, and particularly to a control method for a handling manipulator. Background Art

[0002] During the wafer processing, a handling manipulator is used for handling. The handling manipulator generally includes a robotic arm and an end effector connected to the robotic arm. To improve the wafer handling efficiency, the existing end effector is usually provided with a plurality of wafer forks, and each wafer fork can handle one wafer. After receiving a handling command, the handling manipulator controls the plurality of wafer forks to handle wafers simultaneously. However, there may be an abnormal situation where a certain wafer fork fails to handle a wafer. At this time, if it is impossible to promptly detect which wafer fork has an abnormal handling, it will affect the subsequent wafer handling. Summary of the Invention

[0003] To overcome the above drawbacks, the purpose of the present invention is to provide a control method for a handling manipulator, which can quickly locate the wafer fork with abnormal handling and facilitate troubleshooting.

[0004] To achieve the above object, the technical solution adopted by the present invention is: A control method for a handling manipulator, the handling manipulator includes: A robotic arm; an end effector, including a wrist connected to the robotic arm, a plurality of wafer forks connected to the wrist, and a detection unit provided on each wafer fork; a control device, including a first controller, a second controller, and a signal processor that are communicatively connected to each other in pairs. The first controller and the second controller are away from the robotic arm, and the signal processor is provided on the wrist and communicatively connected to all the detection units; The control method includes: The first controller sends a handling instruction to both the second controller and the signal processor; the second controller controls the movement of the robotic arm according to the handling instruction and controls the corresponding wafer fork to pick up a wafer according to the handling instruction; the detection unit collects a status signal indicating whether the wafer fork has picked up the wafer and sends the status signal to the signal processor; the signal processor compares the status signal with the handling instruction to determine whether there is an abnormal handling for each wafer fork; if there is no wafer fork with abnormal handling, the second controller obtains the confirmation information from the signal processor, and the second controller executes the next received handling instruction; if there is a wafer fork with abnormal handling, the signal processor or the first controller obtains the information of the wafer fork with abnormal handling.

[0005] Furthermore, the signal processor compares the status signal with the handling instruction to determine whether there is any abnormal handling for each of the sheet forks, which specifically includes: the status signals corresponding to each of the sheet forks sequentially form a signal data; comparing whether the values of the signal data and the handling instruction are equal; if so, there is no abnormal handling for each of the sheet forks; if not, there are sheet forks with abnormal handling.

[0006] Furthermore, the signal processor obtains the information of the sheet forks with abnormal handling, which specifically includes: the signal processor compares the status signals corresponding to each of the sheet forks with the instructions of the corresponding sheet forks in the handling instruction; recording the information of the sheet forks where the corresponding status signals and the instructions of the corresponding sheet forks are inconsistent.

[0007] Furthermore, the first controller obtains the information of the sheet forks with abnormal handling, which specifically includes: the signal processor sends the status signals corresponding to each of the sheet forks to the first controller; the first controller compares the status signals corresponding to each of the sheet forks with the instructions of the corresponding sheet forks in the handling instruction; recording the information of the sheet forks where the corresponding status signals and the instructions of the corresponding sheet forks are inconsistent.

[0008] Furthermore, the signal processor compares the status signal with the handling instruction to determine whether there is any abnormal handling for each of the sheet forks, which specifically includes: the signal processor separately compares the status signals corresponding to each of the sheet forks with the instructions of the corresponding sheet forks in the handling instruction, and determines whether the status signals corresponding to each of the sheet forks and the instructions of the corresponding sheet forks are consistent; if so, there are no sheet forks with abnormal handling; if not, there are sheet forks with abnormal handling; The signal processor obtains the information of the sheet forks with abnormal handling, including: when the status signal corresponding to the sheet fork and the instruction of the corresponding sheet fork are inconsistent, recording the sheet fork where the corresponding status signal and the instruction of the corresponding sheet fork are inconsistent.

[0009] Furthermore, the wrist includes a first wrist and a second wrist that can rotate coaxially. One or more of the sheet forks and the detection parts corresponding to the sheet forks are provided on the first wrist and the second wrist. The detection parts corresponding to all the sheet forks on the first wrist and the second wrist are communicatively connected to the signal processor.

[0010] Furthermore, the wrist includes a first wrist and a second wrist that can rotate coaxially. The first wrist is disposed above the second wrist. The first wrist is provided with a plurality of the wafer forks, and the second wrist is provided with a single wafer fork. The detection parts corresponding to the plurality of wafer forks on the first wrist are communicatively connected to the signal processor, and the detection part corresponding to the single wafer fork on the second wrist is communicatively connected to the second controller. The second controller compares the status signal of the wafer fork on the second wrist with the instruction of the corresponding wafer fork in the handling instruction to determine whether the wafer fork corresponding to the second wrist has an abnormal handling situation.

[0011] Furthermore, the end effector further includes a driving module, and the wafer fork further includes a fixing part. The second controller can control the driving module to drive the fixing part to fix and release the wafer, and the detection part can detect the fixing part and send the status signal of fixing or releasing the wafer to the signal processor.

[0012] Furthermore, the wafer fork is a clamping type wafer fork, the fixing part is a clamping member for clamping the wafer, the driving module is a telescopic rod, and the detection part can send the signal of whether the clamping member clamps the wafer to the signal processor.

[0013] Furthermore, the wafer fork is a suction type wafer fork, the fixing part is the vacuum channel of the suction type wafer fork, the driving module is a switching valve capable of opening and closing the vacuum channel, and the detection part can detect the vacuum degree of the vacuum channel between the switching valve and the suction end of the suction type wafer fork and send the signal of whether the vacuum degree is greater than or equal to a set threshold to the signal processor. Description of the Drawings

[0014] Figure 1 Schematic structural diagram of a handling manipulator in an embodiment of the present invention; Figure 2 Block diagram of the control system of a handling manipulator in an embodiment of the present invention; Figure 3 Block diagram of the control system of a handling manipulator in another embodiment of the present invention; Figure 4 Flow chart of the control method in an embodiment of the present invention Figure 1 ; Figure 5 Flow chart of the control method in an embodiment of the present invention Figure 2 ; Figure 6 Flow chart of the control method in an embodiment of the present invention Figure 3 ; Figure 7 Flow chart of the control method in an embodiment of the present inventionFigure 4 ; Figure 8 is the flow of the control method in an embodiment of the present invention Figure 5 。

[0015] In the figure: 1. Robotic arm; 2. Wrist; 21. First wrist; 22. Second wrist; 3. Chip fork; 4. Driving module; 5. Signal processor. Detailed implementation manners

[0016] The following will elaborate on the preferred embodiments of the present invention in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0017] See the attached Figure 1 As shown, a handling manipulator of the present invention includes a robotic arm 1, an end effector, and a control device. The end effector is connected to the robotic arm 1 and moves under the drive of the robotic arm 1; the end effector is used to pick up wafers; the control device is communicatively connected to the robotic arm 1 and the end effector and is used to control the actions of the robotic arm 1 and the end effector.

[0018] See the attached Figure 2 As shown, the end effector includes a wrist 2 connected to the robotic arm 1, a plurality of chip forks 3 connected to the wrist 2, and a detection part provided on each chip fork. The plurality of chip forks are connected to the robotic arm 1 through the wrist 2, and the detection part detects the state of the corresponding chip fork picking up wafers. The state of picking up wafers includes two states: normal handling and abnormal handling. When the chip fork has abnormal handling, the handling should be stopped to avoid damage to the wafers.

[0019] The control device includes a first controller, a second controller, and a signal processor 5 that are communicatively connected to each other in pairs. The second controller is connected to the robotic arm and the end effector for control, and the signal processor 5 is communicatively connected to all detection parts.

[0020] See the attached Figure 4As shown in the figure, the handling method includes: when a wafer needs to be handled, the first controller sends a handling instruction to both the second controller and the signal processor. After receiving the handling instruction, the second controller drives the robotic arm and the end effector to act to handle the specified wafer. The detection unit corresponding to each wafer fork detects the state of whether the wafer has been picked up. The detection unit corresponding to each wafer fork sends the state signal of whether the wafer has been picked up by each wafer fork to the signal processor. The signal processor compares the handling instruction received from the first controller with the state signal received from the detection unit to determine whether each wafer fork correctly handles the wafer. When each wafer fork correctly handles the wafer, the signal processor sends the confirmation information to the second controller through a cable. After receiving the confirmation information, the second controller executes the next handling instruction from the first controller, and the robotic arm and the end effector are controlled by the second controller to handle the wafer again. When there is an abnormal handling by a wafer fork, the signal processor does not send the confirmation information or sends an error message to the second controller. The second controller does not execute the next handling instruction from the first controller, and at the same time, the signal processor or the first controller obtains the information of the abnormal wafer fork.

[0021] In this application, by communicatively connecting the signal processor with all detection units, and the signal processor is communicatively connected to the first controller and the second controller respectively. The signal processor can compare the handling instruction issued by the first controller with the state signal detected by the detection unit corresponding to each wafer fork, so as to determine whether each wafer fork correctly handles the wafer. The second controller can obtain the signal of whether to execute the next handling instruction only through a single cable connected to the signal processor, which can avoid damage to the wafer during the subsequent handling of the wafer by a wafer fork when there is an abnormal handling of the wafer by one of the multiple wafer forks. At the same time, by setting the signal processor on the wrist, the length of the multiple cables between the signal processor and the detection unit corresponding to each wafer fork can be shortened. There is no need to pass the multiple cables between the signal processor and the detection unit corresponding to each wafer fork through the robotic arm. Only a single cable needs to be set between the signal processor and the second controller. The single cable set between the signal processor and the second controller is easy to hide in the narrow cavity of the robotic arm, which can avoid the situation that after the cables connected to the multiple detection units pass through the narrow space inside the robotic arm, the cables are squeezed and rubbed against each other due to the movement of the robotic arm, resulting in loosening at the connection between the cable and the detection unit and the second controller not receiving the confirmation signal. In addition, by communicatively connecting the signal processor with all detection units and the first controller respectively, the state signal corresponding to each wafer fork can be sent to the signal processor or the first controller through the detection unit. The signal processor or the first controller can compare the handling instruction with the state signal corresponding to each wafer fork, so as to obtain the information of the abnormal wafer fork, and the personnel can quickly review and find the specific abnormal wafer fork through the information of the abnormal wafer fork.

[0022] The signal processing module can be a PCB board. The first controller and the second controller can have multiple types. For example, they can be a computer or a PLC.

[0023] In some embodiments, referring to the appendix Figure 5 As shown, the signal processor compares the status signal with the handling instruction to determine whether there is a handling abnormality for each wafer fork. Specifically, it includes: the status signals corresponding to each wafer fork form a signal data in sequence, and compare whether the numerical values of the signal data and the handling instruction are equal; if so, there is no handling abnormality for each wafer fork; if not, there is a wafer fork with a handling abnormality.

[0024] When determining whether there is a handling abnormality for each wafer fork, first form a signal data in sequence with the status signals corresponding to each wafer fork, and then compare whether the numerical values of the signal data and the handling instruction are equal. The numerical values of the signal data and the handling instruction can both be binary numerical values or both be decimal numerical values. This embodiment does not limit the numerical types of the two. When the numerical values of the signal data and the handling instruction are equal, there is no handling abnormality for each wafer fork. Since when the manipulator performs multiple handling operations, the number of times when each wafer fork has no abnormality usually accounts for the vast majority, and the situation that there is a wafer fork with a handling abnormality among each wafer fork is a small probability event. When comparing in this way, it is only necessary to compare once to determine whether there is a handling abnormality for each wafer fork. Therefore, the number of comparison and judgment times is reduced and the time for handling wafers is saved.

[0025] When the numerical values of the signal data and the handling instruction are not equal, there is a wafer fork with a handling abnormality. It is necessary to further determine which wafer fork has an abnormality. It can be judged in the signal processor or the first controller and obtain the information of the wafer fork with a handling abnormality.

[0026] Referring to the appendix Figure 6 As shown, when the signal processor needs to obtain the information of the abnormal wafer fork, the signal processor compares the status signals corresponding to each wafer fork with the instructions of the corresponding wafer forks in the handling instruction, and records the information of the wafer forks where the corresponding status signals and the instructions of the corresponding wafer forks are inconsistent.

[0027] When the first controller needs to obtain the information of the abnormal wafer fork, referring to the appendix Figure 7 As shown, the signal processor sends the status signals corresponding to each wafer fork to the first controller. The first controller compares the status signals corresponding to each wafer fork with the instructions of the corresponding wafer forks in the handling instruction, and records the information of the wafer forks where the corresponding status signals and the instructions of the corresponding wafer forks are inconsistent. In this way, the first controller processes the multiple operations of comparing the status signals corresponding to each wafer fork with the instructions of the corresponding wafer forks in the handling instruction, which can reduce the operation pressure of the signal processor, improve the speed of the signal processor sending the confirmation signal to the second controller, and further save the time for handling wafers.

[0028] In some embodiments, referring to the appendix Figure 8As shown, the signal processor compares the status signal with the handling instruction to determine whether there is any handling abnormality for each wafer fork. Specifically, it includes: searching for the instructions of each wafer fork in the handling instruction. The signal processor compares the status signal corresponding to each wafer fork with the instruction of the corresponding wafer fork. If the status signal corresponding to each wafer fork is consistent with the instruction of the corresponding wafer fork, there is no wafer fork with handling abnormality. If they are inconsistent, there is a wafer fork with handling abnormality; The information that the signal processor obtains about the wafer fork with handling abnormality includes: when the status signal corresponding to the wafer fork is inconsistent with the instruction of the corresponding wafer fork, recording the wafer fork for which the corresponding status signal and the instruction of the corresponding wafer fork are inconsistent.

[0029] When the signal processor receives the status signals sent by the detection parts corresponding to each wafer fork, it can compare the status signals corresponding to each wafer fork with the instructions of the corresponding wafer forks in the handling instruction. After multiple comparisons, it can judge and record which wafer fork has handling abnormality, and at the same time can send the information on whether the second controller executes the next handling instruction. When the status signals corresponding to each wafer fork are consistent with the instruction contents of the corresponding wafer forks in the handling instruction, a confirmation signal is sent to the second controller, and the second controller executes the next handling instruction. When they are inconsistent, no confirmation signal is sent to the second controller, and the second controller does not execute the next handling instruction if it does not receive the confirmation signal. It is also possible to send a high-level signal to the second controller when the status signals corresponding to each wafer fork are consistent with the instruction contents of the corresponding wafer forks in the handling instruction, and the second controller executes the next handling instruction. When they are inconsistent, a low-level signal is sent to the second controller, and the second controller does not execute the next handling instruction.

[0030] In some embodiments, see the appendix Figure 1 As shown, the wrist 2 includes a first wrist 21 and a second wrist 22 that can rotate coaxially. One or more wafer forks and detection parts corresponding to the wafer forks are provided on the first wrist and the second wrist. The detection parts corresponding to all the wafer forks on the first wrist and the second wrist are communicatively connected to the signal processor.

[0031] Connect the detection parts corresponding to one or more wafer forks on the first wrist to the signal processor communicatively, and at the same time connect the detection parts corresponding to one or more wafer forks on the second wrist to the signal processor communicatively. After the signal processor compares the status signals sent by the detection parts with the instruction contents of the wafer forks in the handling instruction, it can send the information on whether to execute the next handling instruction to the second controller through only one cable, without connecting the cables connected to the detection parts corresponding to the wafer forks on the first wrist or the second wrist to the second controller through the robotic arm. Therefore, the number of cables inside the robotic arm 1 can be further reduced, and the mutual extrusion and friction of the cables inside the manipulator can be reduced, thereby avoiding loosening at the connection between the cable and the second detection part.

[0032] In some embodiments, see the appendix Figure 3As shown, the wrist includes a first wrist and a second wrist that can rotate coaxially. The first wrist is disposed above the second wrist. The first wrist is provided with a plurality of wafer forks, and the second wrist is provided with a single wafer fork. The detection parts corresponding to the plurality of wafer forks on the first wrist are communicatively connected to the signal processor, and the detection part corresponding to the single wafer fork on the second wrist is communicatively connected to the second controller. The second controller compares the status signal of the wafer fork corresponding to the second wrist with the instruction of the corresponding wafer fork in the handling instruction to determine whether there is an abnormal handling of the wafer fork corresponding to the second wrist.

[0033] In some embodiments, the end effector further includes a driving module 4. The wafer fork further includes a fixing part (not shown in the figure). The second controller can control the driving module 4 to drive the fixing part to fix and release the wafer. The detection part can detect the fixing part to send the status signal of fixing or releasing the wafer to the signal processor. It should be noted that the status signal of fixing the wafer refers to the signal that the fixing part fixes the wafer. The status signal of releasing the wafer includes the signal that the fixing part executes the action of fixing the wafer but does not fix to the wafer and the signal that the fixing part does not execute the action of fixing the wafer. When the detection part detects that the fixing part fixes to the wafer, the detection part sends a status signal to the signal processor. When the detection part does not detect that the fixing part fixes to the wafer, the detection part sends another status signal to the signal processor. The status signal can be, for example, a high or low level signal. After receiving the status signals corresponding to each wafer fork sent by the detection part, the signal processor compares the handling signal with the status signal. If the instruction of the wafer fork in the handling signal is consistent with the status signals corresponding to each wafer fork, an acknowledgement signal is sent to the second controller, and the second controller executes the next handling instruction. If they are inconsistent, no signal is sent or another signal is sent to the second controller, and the second controller does not execute the next handling instruction.

[0034] In some embodiments, the wafer fork is a clamping type wafer fork, the fixing part is a clamping member for clamping the wafer, the driving module is a telescopic rod, and the detection part can send the signal of whether the clamping member reaches the position of clamping the wafer to the signal processor.

[0035] The telescopic rod can be an electric cylinder or a pneumatic cylinder. The clamping member is connected to the telescopic rod, and the clamping member can move under the push of the telescopic rod to clamp the wafer. The detection unit is a sensor that can detect position or pressure. When the detection unit is a sensor that can detect position, the detection unit can be a photoelectric sensor or a travel switch. When the clamping member does not clamp or is pushed by the telescopic rod but does not clamp the wafer, the detection unit does not detect that the telescopic rod is in a position capable of clamping the wafer, and the detection unit outputs a low-level signal to the signal processor. When the detection unit is pushed by the telescopic rod to clamp the wafer, the detection unit outputs a high-level signal to the signal processor. When the detection unit is a sensor that detects pressure, the detection unit can be a pressure sensor. The pressure sensor is connected to the telescopic rod or the clamping member. When the clamping member clamps the wafer, the pressure sensor outputs a high-level signal to the signal processor. When the clamping member does not clamp or is pushed by the telescopic rod but does not clamp the wafer, the pressure sensor outputs a low level to the signal processor.

[0036] In some embodiments, the wafer fork is an adsorption type wafer fork, the fixing part is the vacuum channel of the adsorption type wafer fork, the driving module is a switching valve capable of opening and closing the vacuum channel, and the detection unit can detect the vacuum degree of the vacuum channel between the switching valve and the adsorption end of the adsorption type wafer fork, and send a signal indicating whether the vacuum degree is greater than or equal to the set threshold to the signal processor.

[0037] The detection unit can be a vacuum sensor. The vacuum sensor is located on the vacuum channel between the switching valve and the adsorption end. When the switching valve is opened, the vacuum channel on the adsorption type wafer fork can generate an adsorption force on the adsorption end. After the adsorption end of the adsorption type wafer fork adsorbs the wafer, the vacuum degree detected by the vacuum sensor is greater than or equal to the set threshold, and the vacuum sensor sends a high-level signal to the signal processor. When the switching valve is closed or no wafer is placed on the adsorption end of the adsorption type wafer fork after the switching valve is opened, at this time the vacuum degree detected by the vacuum sensor is less than the set threshold, and the vacuum sensor sends a low-level signal to the signal processor.

[0038] The above embodiments are only for explaining the technical concept and characteristics of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it, and it cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A control method for a handling manipulator, characterized in that: The handling manipulator includes: A robotic arm; An end effector, including a wrist connected to the robotic arm, a plurality of wafer forks connected to the wrist, and a detection unit provided on each of the wafer forks; A control device, including a first controller, a second controller, and a signal processor that are communicatively connected to each other in pairs. The first controller and the second controller are away from the robotic arm, and the signal processor is provided on the wrist and communicatively connected to all the detection units; The control method includes: The first controller sends a handling instruction to both the second controller and the signal processor; The second controller controls the movement of the robotic arm according to the handling instruction and controls the corresponding wafer fork to pick up the wafer according to the handling instruction; The detection unit collects the status signal of whether the wafer fork has picked up the wafer and sends the status signal to the signal processor; The signal processor compares the status signal with the handling instruction to determine whether there is any handling abnormality for each wafer fork; If there is no wafer fork with handling abnormality, the second controller obtains the confirmation information from the signal processor, and the second controller executes the next received handling instruction; If there is a wafer fork with handling abnormality, the signal processor or the first controller obtains the information of the wafer fork with handling abnormality.

2. The control method of the handling manipulator according to claim 1, wherein: The signal processor compares the status signal with the handling instruction to determine whether there is any handling abnormality for each wafer fork, which specifically includes: The status signals corresponding to the respective wafer forks sequentially form a signal data; Compare whether the values of the signal data and the handling instruction are equal; If so, there is no handling abnormality for each wafer fork; If not, there is a wafer fork with handling abnormality.

3. The control method of the handling manipulator according to claim 2, wherein: The signal processor obtains the information of the wafer fork with handling abnormality, which specifically includes: The signal processor compares the status signals corresponding to the respective wafer forks with the instructions of the respective wafer forks corresponding to the handling instruction; Record the information of the wafer fork whose corresponding status signal and the instruction of the corresponding wafer fork are inconsistent.

4. The control method of the handling manipulator according to claim 2, characterized in that: The first controller obtains the information of the wafer fork with handling abnormality, which specifically includes: the signal processor sends the status signals corresponding to the respective wafer forks to the first controller; the first controller compares the status signals corresponding to the respective wafer forks with the instructions of the respective wafer forks corresponding to the handling instruction; Record the information of the wafer fork whose corresponding status signal and the instruction of the corresponding wafer fork are inconsistent.

5. The control method of the handling manipulator according to claim 1, wherein: The signal processor compares the status signal with the handling instruction to determine whether there is any handling abnormality for each wafer fork, which specifically includes: the signal processor separately compares the status signals corresponding to the respective wafer forks with the instructions of the corresponding wafer forks in the handling instruction, and determines whether the status signals corresponding to the respective wafer forks and the instructions of the corresponding wafer forks are consistent. If so, there is no wafer fork with handling abnormality; if not, there is a wafer fork with handling abnormality; The information about the wafer fork with abnormal handling obtained by the signal processor includes: when the state signal corresponding to the wafer fork and the instruction corresponding to the wafer fork are inconsistent, recording the wafer fork with the inconsistent state signal and the wafer fork instruction corresponding thereto.

6. The control method of the handling manipulator according to claim 1, characterized in that: The wrist includes a first wrist and a second wrist that can rotate coaxially. One or more wafer forks and the detection parts corresponding to the wafer forks are provided on the first wrist and the second wrist. The detection parts corresponding to all the wafer forks on the first wrist and the second wrist are communicatively connected to the signal processor.

7. The control method of the handling manipulator according to claim 1, characterized in that: The wrist includes a first wrist and a second wrist that can rotate coaxially. The first wrist is arranged above the second wrist. A plurality of wafer forks are provided on the first wrist, and a single wafer fork is provided on the second wrist. The detection parts corresponding to the plurality of wafer forks on the first wrist are communicatively connected to the signal processor. The detection part corresponding to the single wafer fork on the second wrist is communicatively connected to the second controller. The second controller compares the state signal of the wafer fork on the second wrist with the instruction of the corresponding wafer fork in the handling instruction to determine whether the wafer fork corresponding to the second wrist has abnormal handling.

8. The control method of the handling manipulator according to claim 1, characterized in that: The end effector further includes a driving module, and the wafer fork further includes a fixing part. The second controller can control the driving module to drive the fixing part to fix and release the wafer. The detection part can detect the fixing part to send the state signal of fixing or releasing the wafer to the signal processor.

9. The control method of the handling manipulator according to claim 8, characterized in that: The wafer fork is a clamping type wafer fork, the fixing part is a clamping member for clamping the wafer, the driving module is a telescopic rod, and the detection part can send the signal of whether the clamping member clamps the wafer to the signal processor.

10. The control method of the handling manipulator according to claim 8, characterized in that: The wafer fork is a suction type wafer fork, the fixing part is the vacuum channel of the suction type wafer fork, the driving module is a switching valve capable of opening and closing the vacuum channel, and the detection part can detect the vacuum degree of the vacuum channel between the switching valve and the suction end of the suction type wafer fork and send the signal of whether the vacuum degree is greater than or equal to the set threshold to the signal processor.

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