Inkjet wafer circuit structure

Abstract

In order to perform corresponding control in cooperation with a spray hole structure in an ink-jet wafer, the invention provides an ink-jet wafer circuit structure, which comprises a plurality of control modules for controlling ink-jet printing, and is provided with an electrical control resistor, a plurality of conductive terminals and a plurality of conductive terminals, a first power supply unit; the first power supply control unit is coupled with the first power supply unit, and the first power supply unit is used for controlling on and off of the first power supply control unit; the addressing unit is coupled with the first power supply control unit and is used for transmitting an addressing signal to control and supply electric power required by ink-jet printing; the second power supply control unit is coupled with the first power supply control unit and the electrical control resistor, and controls the second power supply control unit to be turned on and off by means of an addressing signal; a second power supply unit supplying a second power required to heat the ink; and the heating unit is coupled with the second power supply unit and is used for heating ink required by ink-jet printing.

Description

Technical Field

[0001] The present invention relates to an inkjet wafer circuit structure. More specifically, it is an inkjet wafer circuit structure that optimizes the configuration corresponding to the nozzles to improve the existing printing requirements. Background Art

[0002] Inkjet printing technology, commonly known as "Inkjet Printing", is a widely used printing technology. Its history can be traced back to the 1950s when the British company HP (Hewlett-Packard) invented inkjet printing technology. Since then, inkjet printing technology has developed rapidly, making inkjet printers the mainstream technology for home and commercial printing. Inkjet printers have many advantages, including: low cost, especially having an economic advantage in home and small business applications; high printing quality, capable of providing high-resolution and high-quality images, especially in the case of photos or pictures; convenient to use, inkjet printers are easy to install, and most inkjet printers can be printed through a computer or mobile device. When combined with office machines that have emerged in recent years with multi-functional capabilities (including fax, photocopying, scanning), the flexibility of office document operations can be quickly expanded.

[0003] Please refer to Figure 1 , which describes the matching and control method between the ink cartridge 10 and the printer in the existing known technology. In Figure 1 , it can be seen that the ink cartridge 10 includes a flexible circuit board 100. An inkjet wafer 100A is provided on the flexible circuit board 100. Ink supply holes are provided thereon, and a plurality of circuit board contacts corresponding to the inkjet wafer 100A and used to transmit printer control signals. The inkjet wafer 100A stores information such as the ink cartridge serial number, ink type, and matching information between the inkjet head and the printer, and at the same time controls the ejection of ink droplets for printing.

[0004] However, as mentioned above, although the current inkjet printing technology can meet various output requirements in schools, office documents, 3D printing, and industries, the current consumer market has increasingly stringent requirements for various printing performances in inkjet printing, such as color, resolution, printing range, and printing speed. In the current situation of the general industry, there is still a great demand to continuously pursue the above-mentioned inkjet printing performances to maintain the competitiveness of industrial utilization. Therefore, in the current market situation, it is still urgently necessary to continuously improve and optimize performances such as printing speed and printing range. Therefore, the corresponding inkjet wafer printing circuit needs to be re-architected. In view of this, the above-mentioned needs have become the topic to be explored in the present invention. Summary of the Invention

[0005] The main objective of the present invention is to provide an inkjet wafer circuit structure, which aims to cooperate with the optimized nozzle structure in the inkjet wafer for corresponding control, thereby improving the printing performance of color, resolution, printing range, and printing speed of the finished product in inkjet printing technology. For the detailed technical solution, please refer to the following description.

[0006] To achieve the above objectives, the present invention proposes a novel inkjet wafer circuit structure, which includes: a plurality of control modules for controlling inkjet printing. The plurality of control modules further include: an electrically controlled resistor; a first power supply unit; a first power control unit coupled to the first power supply unit, and the on / off of the first power control unit is controlled by the first power supply unit; an addressing unit coupled to the first power control unit, and the first power control unit controls the transmission of the first power by transmitting an addressing signal; a second power control unit coupled to the first power control unit and the electrically controlled resistor, and the on / off of the second power control unit is controlled by the first power and the addressing signal; a second power supply unit coupled to the second power control unit, supplying the second power required for heating the ink; and a heating unit coupled to the second power supply unit, heating the ink required for inkjet printing. Among them, when both the first power control unit and the second power control unit are turned on, the heating unit starts to heat the ink required for inkjet printing by the second power, and the printing range controlled by the inkjet wafer circuit structure is between 23900μm - 27000μm.

[0007] According to the content of the present invention, the inkjet wafer circuit structure includes more than 600 nozzles.

[0008] According to the content of the present invention, the inkjet wafer circuit structure further includes a first grounding unit and a second grounding unit, which are respectively coupled to the first power control unit and the second power control unit to provide power protection for grounding the inkjet wafer circuit structure.

[0009] According to the content of the present invention, the electrically controlled resistor included in the inkjet wafer circuit structure is coupled to the first power control unit to adjust the magnitude of the current and voltage in the first power according to the application requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The following detailed description of the present invention and the schematic diagrams of the embodiments should enable the present invention to be more fully understood; however, it should be understood that this is only for reference in understanding the application of the present invention and does not limit the present invention to a specific embodiment.

[0011] Figure 1 Describe the configuration method of the inkjet wafer structure in the known ink cartridge.

[0012] Figure 2A Describe one embodiment of the detailed structure of the inkjet wafer structure matched with the present invention.

[0013] Figure 2B Illustrate one embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure paired with the present invention.

[0014] Figure 2C Illustrate another embodiment of the detailed structure of the inkjet chip structure paired with the present invention.

[0015] Figure 2D Illustrate another embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure paired with the present invention.

[0016] Figure 2E Illustrate yet another embodiment of the detailed structure of the inkjet chip structure paired with the present invention.

[0017] Figure 2F Illustrate yet another embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure paired with the present invention.

[0018] Figure 3 Illustrate the architecture of the inkjet chip circuit structure in the present invention.

[0019] Figure 4 Illustrate the architecture of the inkjet chip circuit structure in the present invention.

[0020]

Symbol Explanation

[0021] 10: Ink cartridge

[0022] 100: Flexible circuit board

[0023] 100A: Inkjet chip

[0024] 200: Inkjet chip structure

[0025] 200A: Ink supply hole

[0026] 210: Nozzle

[0027] 300: Inkjet chip circuit structure

[0028] 310: Control module

[0029] 311: First power supply unit

[0030] 312: Heating unit

[0031] 313: First power control unit

[0032] 314: First grounding unit

[0033] 315: Addressing unit

[0034] 316: Second power supply unit

[0035] MJ24A-1320CN_24A454 1TWCN_Chinese Simplified Version

[0036] 317: Second Power Supply Control Unit

[0037] 318: Second Grounding Unit

[0038] R: Electrically Controlled Resistor Detailed Implementation Manner

[0039] The present invention will be described in detail with preferred embodiments and viewpoints, so that readers can thoroughly understand the implementation methods of these embodiments. However, those skilled in the art should understand that the present invention can also be implemented without these details. In addition, the present invention can also be applied and implemented through other specific embodiments, and the details described in this specification can also be applied based on different requirements, and various different modifications or changes can be made without departing from the spirit of the present invention. Therefore, the present invention will be described with preferred embodiments and viewpoints. Such descriptions are to explain the structure of the present invention and are only used for illustration rather than to limit the scope of patent application of the present invention. The terms used in the following description will be interpreted in the broadest reasonable manner so that they can be used together with the detailed description of a specific embodiment of the present invention. In addition, when the present invention describes directions, such as vertical or horizontal, unless otherwise defined in this specification, the relative directions of vertical or horizontal can be understood with reference to the illustration of the accompanying drawings and the context at the current description. In this way, those skilled in the art can adjust the structure of the present invention according to manufacturing or application requirements to meet the needs of the actual industry. Therefore, it is described in advance here.

[0040] Please refer to Figure 2A 、 Figure 2B 、 Figure 2C 、 Figure 2D 、 Figure 2E and Figure 2F , in the present invention, in order to achieve the aforementioned purpose of improving printing performance of the present invention, the inkjet chip circuit structure 300 proposed by the present invention is used to control an inkjet chip structure 200. Among them, the plurality of nozzles 210 form a nozzle double-row parallel structure as shown in Figure 2A 、 Figure 2B on the surface of the inkjet chip structure 200 (in this nozzle double-row parallel structure on the same Y-axis, it can spray twice from the left and right rows of nozzles 210 at the same printing point, making the printed color bright and full), such as the nozzle double-row staggered structure shown in Figure 2C 、 Figure 2D (this nozzle double-row staggered structure can make the printed color bright and full), or as shown in Figure 2E 、 Figure 2FThe single-row structure of the nozzle holes shown; among them, in the double-row parallel structure of the nozzle holes, the vertical distance between two longitudinally adjacent nozzle holes 210 in one row is 80 μm - 90 μm; in the double-row staggered structure, the vertical distance between two transversely staggered adjacent nozzle holes 210 is 40 μm - 45 μm, and in the single-row structure of the nozzle holes, the vertical distance between any two longitudinally adjacent nozzle holes 210 in this single row is 40 μm - 45 μm. In addition, in the above-mentioned embodiments, the width of the ink supply hole 200A is all 80 μm or more.

[0041] In order to effectively control the inkjet wafer structure 200 disclosed above, please refer to Figure 3 and Figure 4 , the present invention proposes a novel inkjet wafer circuit structure 300, which includes: a plurality of control modules 310 for controlling inkjet printing. The plurality of control modules 310 further have: an electrical control resistor R; a first power supply unit 311; a first power control unit 313, coupled to the first power supply unit 311, to control the opening and closing of the first power control unit 313 by the first power supply unit 311; an addressing unit 315, coupled to the first power control unit 313, to transmit an addressing signal to control the power supply required for inkjet printing; a second power control unit 317, coupled to the first power control unit 313, to control the opening and closing of the second power control unit 317 by the first power; a second power supply unit 316, coupled to the second power control unit 313, to supply the second power required for heating the ink; and a heating unit 312, coupled to the second power supply unit 316, to heat the ink required for inkjet printing. Wherein, when both the first power control unit 313 and the second power control unit 317 are turned on, the heating unit 312 starts to heat the ink required for inkjet printing by the second power, and the printing range of the inkjet wafer circuit structure control 300 is between 23900 μm - 27000 μm.

[0042] According to an embodiment of the present invention, the operating mechanism of the inkjet wafer circuit structure 300 disclosed above is as follows. When an addressing signal is input through the addressing unit 315 and a first power is input through the first power supply unit 311, and the first power is a relatively high voltage, the first power control unit 313 will be turned on. At the same time, the first power in the high voltage state will be transmitted to the second power control unit 317. And if the second power supply unit 316 also provides a second power at this time, and the second power is also a high voltage, then the second power control unit 317 will also be in the on state, so that the heating unit 312 obtains the energy to heat the ink and the inkjet printing signal, and starts to heat the ink, causing the ink to generate bubbles and be extruded to eject the ink from the nozzle 210. When the first power supply unit 311 does not provide the first power (or the first power is not a high voltage), then the first power or the addressing signal will not be transmitted to the second power control unit 317 through the first power control unit 313. And because the second power control unit 317 is electrically connected to the control resistor R, when the first power supply unit 311 does not provide the first power (or the first power is not a high voltage), or when the first power control unit 313 does not have an addressing signal, the second power supply unit 316 will not be turned on.

[0043] Please refer to Figure 4 , according to an embodiment of the present invention, the plurality of control modules 310 can form an array with two rows S1 and S2 in the inkjet wafer circuit structure 300, corresponding to more than 600 nozzles 210 contained in the inkjet wafer structure 200. This array is beneficial to the wiring layout that matches the arrangement space of the nozzles 210 on the inkjet wafer structure 200, so as to effectively improve the printing quality. In the embodiment of the present invention, S1 and S2 can respectively correspond to Figure 2A , Figure 2B the double-row side-by-side structure of the nozzles shown, thereby respectively controlling the nozzles 210 in the left and right rows, such as Figure 2C , Figure 2D the double-row staggered structure of the nozzles shown, thereby respectively controlling the nozzles 210 in the left and right rows, or such as Figure 2E , Figure 2FThe shown nozzle single-row structure is used to separately control the odd-numbered nozzles 210 from top to bottom (the 1st, 3rd, 5th,...) and the even-numbered nozzles 210 from top to bottom (the 2nd, 4th, 6th,...); it should be noted that the left and right two rows or the odd and even nozzles 210 corresponding to the above S1 and S2 are only examples and are not used to limit the aspects of the present invention. Those skilled in the art can adjust the nozzles 210 corresponding to S1 and S2 according to the above description and the application requirements after reading the specification of the present invention, or adjust the arrangement pattern of the control module 310 in the inkjet chip circuit structure 300, which is hereby described. According to one aspect of the present invention, in the arrays of the two rows of S1 and S2, corresponding first power supply units 311 will provide corresponding first power, so that the odd and even control of the two rows of nozzles 210 such as the above left and right double-row parallel structure and double-row staggered structure, and the single row of nozzles 120 in the nozzle single-row structure can be completed. For example, when the Am addressing unit 315 provides an addressing signal (for example, m = 15), Pn second power supply units 317 provide second power (for example, n = 20), and Sx first power supply units 313 provide first power (for example, x = 2), then 15 * 20 * 2 = 600 nozzles 210 can be controlled. Or, when m = 20, for example, n = 15, x = 2, 20 * 15 * 2 = 600 nozzles 210 can also be controlled. The description here is only an example, and those skilled in the art can adjust the structure of the present invention according to the manufacturing or application requirements to meet the actual industrial needs.

[0044] According to the content of the present invention, the inkjet chip circuit structure 300 further includes a first grounding unit 314 and a second grounding unit 318, which are respectively coupled to the first power supply control unit 313 and the second power supply control unit 317 to provide power protection for grounding the inkjet chip circuit structure 300.

[0045] According to the content of the present invention, the inkjet chip circuit structure 300 further includes an electrically controlled resistor R, which is coupled to the first power supply control unit 313 to adjust the magnitudes of the current and voltage in the first power according to the application requirements.

[0046] According to the content of the present invention, the resolution DPI (Dots Per Inch, the number of dots per inch) that the inkjet chip circuit structure 300 can correspond to ranges from 150 to 48000 DPI.

[0047] In summary, the main purpose of the present invention is to provide an inkjet chip circuit structure to control the corresponding inkjet chip structure. By optimizing the wiring of the inkjet chip circuit structure and cooperating with the spatial arrangement layout of the nozzles on the inkjet chip structure, the overall performance such as the printing color, resolution, printing range, printing speed, etc. is further improved to meet the increasingly stringent requirements of the market and meet the needs of industrial utilization.

Claims

1. An inkjet wafer circuit structure, applicable to controlling an inkjet wafer structure, comprising: A plurality of control modules for controlling inkjet printing, and the plurality of control modules further include: An electrical control resistor; A first power supply unit; A first power control unit, coupled to the first power supply unit, and controlling the on / off of the first power control unit by means of the first power supply unit; An addressing unit, coupled to the first power control unit, and transmitting an addressing signal to control the power supply required for inkjet printing; A second power control unit, coupled to the first power control unit, and controlling the on / off of the second power control unit by means of the first power; A second power supply unit, coupled to the second power control unit and the electrical control resistor, and controlling the on / off of the second power control unit; and, A heating unit, coupled to the second power supply unit, for heating the ink; Wherein, when both the first power control unit and the second power control unit are turned on, the heating unit starts to heat the ink, and the printing range controlled by the inkjet wafer circuit structure is between 23900μm - 27000μm.

2. The inkjet wafer circuit structure according to claim 1, further comprising a first grounding unit and a second grounding unit, which are respectively coupled to the first power control unit and the second power control unit to provide grounded power protection.

3. The inkjet wafer circuit structure according to claim 1, wherein the number of nozzles controlled by the inkjet wafer circuit structure is more than 600.

4. The inkjet wafer circuit structure according to claim 1, wherein the arrangement form of the plurality of nozzles controlled by the inkjet wafer circuit structure is selected from a double-row parallel nozzle structure, a double-row staggered nozzle structure, or a single-row nozzle structure.

5. The inkjet wafer circuit structure according to claim 6, wherein the resolution DPI range corresponding to the inkjet wafer circuit structure is between 150 and 48000 DPI.

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