Inkjet wafer circuit structure

Abstract

An inkjet wafer circuit structure includes: a first power supply unit; the first power supply control unit is coupled with the first power supply unit, and the first power supply unit controls the first power supply control unit to be turned on and off; the addressing unit transmits an addressing signal to supply the power required by the first power supply control unit; the second power supply control unit is controlled by the first power supply unit and the addressing signal to be turned on and off; a second power supply unit for supplying power required by the second power control unit; a third power supply unit that supplies power; the third power supply control unit is coupled with the third power supply unit, the first power supply control unit and the second power supply control unit, and controls the discharge of the second power supply control unit; the heating unit is coupled to the second power supply unit. When the addressing unit provides power and the first power control unit and the second power control unit are both started, the heating unit heats the ink.

Description

Technical Field

[0001] The present invention relates to an inkjet wafer circuit structure. More specifically, it is an inkjet wafer circuit structure that optimizes the configuration corresponding to the nozzles to improve the existing printing requirements. Background Art

[0002] Inkjet printing technology, commonly known as "Inkjet Printing", is a widely used printing technology. Its history can be traced back to the 1950s when the British company HP (Hewlett-Packard) invented inkjet printing technology. Since then, inkjet printing technology has developed rapidly, making inkjet printers the mainstream technology for home and commercial printing. Inkjet printers have many advantages, including: low cost, especially having economic advantages in home and small business applications; high printing quality, capable of providing high-resolution and high-quality images, especially for photos or pictures; convenient to use, inkjet printers are easy to install, and most inkjet printers can be printed through a computer or mobile device. When combined with office machines that have emerged in recent years with multi-functional capabilities (including fax, photocopying, scanning), the flexibility of document operations in the office can be quickly expanded.

[0003] Please refer to Figure 1 , which describes the matching and control method between the ink cartridge 10 and the printer in the existing known technology. In Figure 1 , it can be seen that the ink cartridge 10 includes a flexible circuit board 100. An inkjet wafer 100A is provided on the flexible circuit board 100. Ink supply holes are provided thereon, and several circuit board contacts corresponding to the inkjet wafer 100A and used to transmit printer control signals. The inkjet wafer 100A stores information such as the ink cartridge serial number, ink type, and matching information between the inkjet head and the printer, and at the same time controls the ejection of ink droplets for printing.

[0004] However, as mentioned above, although the current inkjet printing technology can meet various output requirements in schools, office documents, 3D printing, and industry, the demand for various printing performances in inkjet printing in the current consumer market, such as color, resolution, printing range, and printing speed, is becoming increasingly stringent. In the current situation of the general industry, there is still a great demand to continuously pursue the above inkjet printing performances to maintain the competitiveness of industrial utilization. Therefore, in the current market situation, it is still urgently necessary to continuously improve and optimize performances such as printing speed and printing range. Thus, the corresponding inkjet wafer printing circuit needs to be re-architected. In view of this, the above-mentioned demand has become the topic to be explored in the present invention. Summary of the Invention

[0005] The main object of the present invention is to provide an inkjet wafer circuit structure, which is designed to cooperate with the optimized nozzle structure in the inkjet wafer for corresponding control, thereby improving the printing performance of color, resolution, printing range, and printing speed in the inkjet printing technology. For the detailed technical solution, please refer to the following description.

[0006] To achieve the above object, the present invention provides a novel inkjet wafer circuit structure, which includes: a plurality of control modules for controlling inkjet printing. The plurality of control modules further include: a first power supply unit; a first power control unit coupled to the first power supply unit, and the on / off of the first power control unit is controlled by the first power supply unit; an addressing unit coupled to the first power control unit, and the required power of the first power control unit is supplied by transmitting an addressing signal; a second power control unit coupled to the first power control unit, and the on / off of the second power control unit is controlled by the first power supply unit and the addressing signal from the addressing unit; a second power supply unit coupled to the second power control unit to supply the required power of the second power control unit; a third power supply unit coupled to the first power control unit; a third power control unit coupled to the third power supply unit and the first power control unit to control the on / off of the third power control unit; and a heating unit coupled to the second power supply unit to heat the ink required for inkjet printing. Among them, when both the first power control unit and the second power control unit are turned on, and the third power control unit is turned off, the heating unit starts to heat the ink required for inkjet printing, and the printing range controlled by the inkjet wafer circuit structure is between 23900μm - 27000μm.

[0007] According to the content of the present invention, the inkjet wafer circuit structure includes more than 600 nozzles.

[0008] According to the content of the present invention, the inkjet wafer circuit structure further includes a first grounding unit and a second grounding unit, which are respectively coupled to the third power control unit and the second power control unit to provide power protection for grounding the inkjet wafer circuit structure.

[0009] According to the content of the present invention, the third power control unit included in the inkjet wafer circuit structure is coupled to the first power control unit, thereby adjusting the magnitude of the current and voltage in the input power according to the application requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The following detailed description of the present invention and the schematic diagrams of the embodiments should enable the present invention to be more fully understood; however, it should be understood that this is only for reference in understanding the application of the present invention and does not limit the present invention to a specific embodiment.

[0011] Figure 1 Describe the configuration method of the inkjet wafer structure in the known ink cartridge.

[0012] Figure 2A Illustrate one embodiment of the detailed structure of the inkjet chip structure associated with the present invention.

[0013] Figure 2B Illustrate one embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure associated with the present invention.

[0014] Figure 2C Illustrate another embodiment of the detailed structure of the inkjet chip structure associated with the present invention.

[0015] Figure 2D Illustrate another embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure associated with the present invention.

[0016] Figure 2E Illustrate yet another embodiment of the detailed structure of the inkjet chip structure associated with the present invention.

[0017] Figure 2F Illustrate yet another embodiment of the detailed structure after further magnification of the detailed structure of the inkjet chip structure associated with the present invention.

[0018] Figure 3 Illustrate the architecture of the inkjet chip circuit structure in the present invention.

[0019] Figure 4 Illustrate the architecture of the inkjet chip circuit structure in the present invention.

[0020]

Symbol Explanation

[0021] 10: Ink cartridge

[0022] 100: Flexible circuit board

[0023] 100A: Inkjet chip

[0024] 200: Inkjet chip structure

[0025] 200A: Ink supply hole

[0026] 210: Nozzle

[0027] 300: Inkjet chip circuit structure

[0028] 310: Control module

[0029] 311: First power supply unit

[0030] 312: Heating unit

[0031] 313: First power control unit

[0032] 314: First grounding unit

[0033] 315: Addressing unit

[0034] MJ24A-1322CN_24A456 1TWCN_Chinese Simplified

[0035] 316: Second power supply unit

[0036] 317: Second power control unit

[0037] 318: Second grounding unit

[0038] 319: Third power supply unit

[0039] 320: Third power control unit Detailed implementation manners

[0040] The present invention will be described in detail with preferred embodiments and viewpoints, so that readers can thoroughly understand the implementation manners of these embodiments. However, those skilled in the art should understand that the present invention can also be implemented without these details. In addition, the present invention can also be applied and implemented by other specific embodiments, and the details described in this specification can also be applied based on different requirements, and various different modifications or changes can be made without departing from the spirit of the present invention. Therefore, the present invention will be described with preferred embodiments and viewpoints, and such descriptions are to explain the structure of the present invention and are only used for illustration rather than for limiting the scope of patent application of the present invention. The terms used in the following descriptions will be interpreted in the broadest reasonable manner so that they can be used together with the detailed descriptions of a specific embodiment of the present invention. In addition, when the present invention describes directions, such as vertical or horizontal, unless otherwise defined in this specification, the relative directions of vertical or horizontal can be understood with reference to the current description and the accompanying drawings in the context. In this way, those skilled in the art can adjust the structure of the present invention according to manufacturing or application requirements to meet the needs of the actual industry, and this is hereby stated in advance.

[0041] Please refer to Figure 2A 、 Figure 2B 、 Figure 2C 、 Figure 2D 、 Figure 2E and Figure 2F In the present invention, in order to achieve the aforementioned purpose of improving printing performance in the present invention, the inkjet chip circuit structure 300 proposed by the present invention is used to control an inkjet chip structure 200. Among them, the plurality of nozzle holes 210 form a nozzle hole double-row parallel structure as shown in Figure 2A 、 Figure 2B on the surface of the inkjet chip structure 200 (this nozzle hole double-row parallel structure is on the same Y-axis and can be used for the same printing point to be printed twice by the left and right row nozzle holes 210, making the printing color bright and full), such as Figure 2C 、 Figure 2DThe double-row staggered structure of the nozzle holes shown in FIG. 1 (the double-row staggered structure of the nozzle holes can make the printing color bright and full), or Figure 2E , Figure 2F The single-row structure of the nozzles shown; wherein in the double-row parallel structure of the nozzles, the vertical distance between two longitudinally adjacent nozzles 210 in a single row is 80μm-90μm, and in the double-row staggered structure, the vertical distance between two laterally staggered adjacent nozzles 210 is 40μm-45μm, and in the single-row structure of the nozzles, the vertical distance between any two longitudinally adjacent nozzles 210 in the single row is 40μm-45μm. In addition, in the above-mentioned embodiments, the width of the ink supply hole 200A is more than 80μm.

[0042] In order to effectively control the above-mentioned inkjet wafer structure 200, please refer to Figure 3 and Figure 4 The present invention proposes a novel inkjet chip circuit structure 300, which includes: a plurality of control modules 310, thereby controlling inkjet printing, and the plurality of control modules 310 further have: a first power supply unit 311; a first power control unit 313, coupled to the first power supply unit 311, and controlling the opening and closing of the first power control unit 313 by the first power supply unit 311; an addressing unit 315, coupled to the first power control unit 313, and supplying the first power control unit 313 with power required for operation by transmitting an addressing signal; a second power control unit 317, coupled to the first power control unit 313, and controlling the opening and closing of the second power control unit 317 by the first power supply unit 311 and the addressing signal from the addressing unit 315; a second power supply unit 316, coupled to the second power control unit 317; The control unit 316 supplies the power required by the second power control unit 317; the third power supply unit 319 is coupled to the first power control unit 313; the third power control unit 320 is coupled to the third power supply unit 319 and the first power control unit 313, so that the third power supply unit 319 and the first power control unit 313 control the opening and closing of the third power control unit 320; and the heating unit 312 is coupled to the second power supply unit 316 to heat the ink required for inkjet printing; wherein, when the first power control unit 313 and the second power control unit 317 are both turned on and the third power control unit 320 is turned off, the heating unit 312 starts to heat the ink required for inkjet printing, and the printing range of the inkjet chip circuit structure control 300 is between 23900μm-27000μm.

[0043] According to an embodiment of the present invention, the operating mechanism of the above-disclosed inkjet wafer circuit structure 300 is as follows. When an addressing signal is input through the addressing unit 315 and the power input through the first power supply unit is a relatively high voltage, the first power control unit 313 will conduct. And if the power input through the second power supply unit 316 also provides a high voltage at this time, the second power control unit 317 will also be in a conducting state. At the same time, if the power from the third power supply unit 319 is a low voltage, the third power control unit 320 will be turned off. At this time, when the first power control unit 315 and the second power control unit 317 are turned on and the third power control unit 320 is turned off, the heating unit 312 will obtain the energy to heat the ink and the inkjet printing signal, and start to heat the ink, causing the ink to generate bubbles and be extruded to eject the ink from the nozzle 210. On the contrary, when the first power supply unit 311 provides a low voltage, the second power supply unit 316 provides a low voltage, and the third power supply unit 319 is a high voltage, the addressing signal will not be transmitted to the second power control unit 317 through the first power control unit 313, and the heating unit 312 will not start to heat the ink, thereby achieving the purpose of controlling inkjet printing of the inkjet wafer circuit structure 300.

[0044] Please refer to Figure 4 , according to an embodiment of the present invention, the plurality of control modules 310 can form an array with two rows S1 and S2 in the inkjet wafer circuit structure 300, corresponding to more than 600 nozzles 210 included in the inkjet wafer structure 200. This array is beneficial to the wiring layout that matches the arrangement space of the nozzles 210 on the inkjet wafer structure 200, so as to effectively improve the printing quality. In the embodiment of the present invention, S1 and S2 can respectively correspond to Figure 2A , Figure 2B the double-row side-by-side structure of the nozzles shown, thereby respectively controlling the nozzles 210 in the left and right rows, such as Figure 2C , Figure 2D the double-row staggered structure of the nozzles shown, thereby respectively controlling the nozzles 210 in the left and right rows, or such as Figure 2E , Figure 2FThe shown nozzle single-row structure is used to separately control the odd-numbered nozzles 210 (the 1st, 3rd, 5th,...) from top to bottom and the even-numbered nozzles 210 (the 2nd, 4th, 6th,...) from top to bottom. It should be noted that the left and right two rows or the odd and even nozzles 210 corresponding to the above S1 and S2 are only examples and are not used to limit the aspects of the present invention. Those skilled in the art can adjust the nozzles 210 corresponding to S1 and S2 or the arrangement aspect of the control module 310 in the inkjet chip circuit structure 300 according to the above description and the application requirements after reading the specification of the present invention, which is hereby described. According to an aspect of the present invention, in the arrays of the two rows of S1 and S2, corresponding first power supply units 311 will provide the corresponding power, so that the single and double control of the two rows of nozzles 210 such as the above left and right double-row parallel structure and double-row staggered structure, and the single row of nozzles 120 in the nozzle single-row structure can be completed. The description here is only an example, and those skilled in the art can adjust the structure of the present invention according to the manufacturing or application requirements to meet the needs of the actual industry.

[0045] According to the content of the present invention, the inkjet chip circuit structure 300 further includes a first grounding unit 314 and a second grounding unit 318, which are respectively coupled to the third power supply control unit 320 and the second power supply control unit 317 to provide power protection for grounding the inkjet chip circuit structure 300.

[0046] According to the content of the present invention, the third power supply control unit 320 in the inkjet chip circuit structure 300 is coupled to the first power supply control unit 313 to adjust the magnitude of the current and voltage in the input power according to the application requirements.

[0047] According to the content of the present invention, the resolution DPI (Dots Per Inch, the number of dots per inch) range corresponding to the inkjet chip circuit structure 300 is between 150 and 48000 DPI.

[0048] In summary, the main purpose of the present invention is to provide an inkjet chip circuit structure to control the corresponding inkjet chip structure. By optimizing the wiring of the inkjet chip circuit structure and cooperating with the spatial arrangement layout of the nozzles on the inkjet chip structure, the overall performance such as the printing color, resolution, printing range, and printing speed is further improved to meet the increasingly stringent requirements of the market and meet the needs of industrial utilization.

Claims

1. An inkjet chip circuit structure, applicable to controlling an inkjet chip structure, comprising: A plurality of control modules for controlling inkjet printing, and the plurality of control modules further include: A first power supply unit; A first power control unit, coupled to the first power supply unit, and controlling the opening and closing of the first power control unit by the first power supply unit; An addressing unit, coupled to the first power control unit, and supplying the power required for the operation of the first power control unit by transmitting an addressing signal; A second power control unit, coupled to the first power control unit, and controlling the opening and closing of the second power control unit by the first power supply unit and the addressing signal; A second power supply unit, coupled to the second power control unit, and supplying the power required by the second power control unit; A third power supply unit, coupled to the first power control unit; A third power control unit, coupled to the third power supply unit and the first power control unit, enabling the third power supply unit and the first power control unit to control the opening and closing of the third power control unit; and A heating unit, coupled to the second power supply unit, for heating the ink; Wherein, when the first power control unit and the second power control unit are turned on, and the third power control unit is turned off, the heating unit heats the ink, and the printing range controlled by the inkjet chip circuit structure is between 23900μm - 27000μm.

2. The inkjet chip circuit structure according to claim 1, further comprising a first grounding unit and a second grounding unit, respectively coupled to the third power control unit and the second power control unit, to provide grounding power protection.

3. The inkjet chip circuit structure according to claim 1, wherein the number of nozzles controlled by the inkjet chip circuit structure is more than 600.

4. The inkjet chip circuit structure according to claim 1, wherein the arrangement form of the plurality of nozzles controlled by the inkjet chip circuit structure is selected from a double-row parallel nozzle structure, a double-row staggered nozzle structure, or a single-row nozzle structure.

5. The inkjet chip circuit structure according to claim 4, wherein the resolution DPI range corresponding to the inkjet chip circuit structure is between 150 and 48000 DPI.

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