Feeding device for electroplating processing of circuit board and processing method

Abstract

The invention discloses a feeding device for circuit board electroplating machining and a machining method, and belongs to the technical field of circuit board electroplating machining. The feeding device comprises an electroplating box, a transfer feeding mechanism is arranged on the electroplating box, the transfer feeding mechanism comprises a supporting table fixedly installed on one side of the electroplating box, and a fixing frame is fixedly installed at the top of the supporting table; a first motor is fixedly installed in the fixing frame, a rotating disc connected with the output end of the first motor is movably installed at the top of the fixing frame, a supporting frame is fixedly installed at the top of the rotating disc, and a plurality of hydraulic cylinders are evenly and fixedly installed on the supporting frame. Through the arrangement of the transfer feeding mechanism, circuit boards can be automatically and continuously fed and conveyed and can be automatically clamped and transferred into an electroplating box, the circuit boards do not need to be manually transferred into the electroplating box in the whole process, operation is more convenient, the circuit boards can be continuously fed all the time, and the production efficiency is improved. And the electroplating processing efficiency of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to a loading device for circuit board electroplating processing, in particular to a loading device and processing method for circuit board electroplating processing, belonging to the technical field of circuit board electroplating processing. Background Technique

[0002] An integrated circuit board uses semiconductor manufacturing technology to fabricate many transistors, resistors, capacitors and other components on a smaller single crystal silicon wafer, and combines the components into a complete electronic circuit according to the method of multi-layer wiring or tunneling wiring. In order to improve the wear resistance, conductivity, reflectivity and corrosion resistance of the integrated circuit board, an electroplating device is required to electroplate the integrated circuit board. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of the integrated circuit board using the electrolysis principle, which is convenient to achieve the anti-oxidation effect.

[0003] When processing circuit board electroplating, a loading device is needed to load the circuit board. However, the commonly used loading device only functions to convey the circuit board, but cannot clamp and transfer the circuit board into the electroplating tank. The entire process still requires manual participation to transfer the circuit board into the electroplating tank, which is not convenient to operate and cannot continuously load the circuit board, resulting in low efficiency of circuit board electroplating processing. Summary of the Invention

[0004] The main purpose of the present invention is to solve the above problems, and to provide a loading device and processing method for circuit board electroplating processing.

[0005] By setting up a transfer and loading mechanism, it can automatically and continuously load and convey the circuit board and automatically clamp and transfer the circuit board into the electroplating tank. The entire process does not require manual transfer of the circuit board into the electroplating tank, which is more convenient to operate and can continuously load the circuit board, improving the efficiency of circuit board electroplating processing.

[0006] A feeding device and processing method for circuit board electroplating processing, including an electroplating tank, a transfer and feeding mechanism is arranged on the electroplating tank. The transfer and feeding mechanism includes a support table fixedly installed on one side of the electroplating tank. A fixed frame is fixedly installed on the top of the support table. A first motor is fixedly installed inside the fixed frame. A turntable connected to the output end of the first motor is movably installed on the top of the fixed frame. A support frame is fixedly installed on the top of the turntable. A plurality of hydraulic cylinders are evenly and fixedly installed on the support frame. A fixed block is fixedly installed at the output end of the hydraulic cylinder. A support plate is arranged at the bottom of the fixed block. A plurality of hydraulic clamps are fixedly installed at the bottom of the support plate. A feeding conveyor is fixedly installed on one side of the support table. A plurality of material racks are arranged on the feeding conveyor. A discharging conveyor is fixedly installed on the other side of the support table.

[0007] Preferably, a plurality of support blocks are evenly and fixedly installed on the surface of the feeding conveyor. A plurality of partitions adapted to the support blocks are arranged on the feeding conveyor. A first magnet is fixedly embedded inside the support block. A plurality of second magnets are fixedly installed at the bottom of the partition.

[0008] Preferably, a plurality of limiting grooves are formed on the partition. Limiting blocks slidably connected to the limiting grooves are fixedly installed on both sides of the material rack. The shapes of the limiting grooves and the limiting blocks are both set to convex shapes.

[0009] Preferably, a plurality of springs are fixedly installed on the surface of the fixed block. Clamping rods fixedly connected to the plurality of springs are movably installed on both sides of the fixed block. A clamping block is fixedly installed on the top of the support plate. A pull rod is fixedly installed on one side of the clamping rod.

[0010] Preferably, two support rods are symmetrically and fixedly installed on the fixed block. A third magnet is fixedly installed on the support rod. A fourth magnet is fixedly installed on one side of the pull rod.

[0011] Preferably, two fixing plates are arranged on the top of the electroplating tank. A blower is fixedly installed on the top of the fixing plate. The two blowers are arranged in a staggered manner on the top of the electroplating tank.

[0012] Preferably, two fixed frames are fixedly installed on the surface of the electroplating tank. A second motor is fixedly installed on one side of the fixed frame. A screw rod connected to the second motor is movably installed inside the fixed frame. A moving block fixedly connected to the bottom of the fixing plate is installed on the screw rod.

[0013] Preferably, a solenoid valve is fixedly installed on the other side of the electroplating tank. A filter tank is fixedly installed on one side of the solenoid valve. A filter screen is fixedly installed inside the filter tank. A drain pipe is fixedly installed on one side of the filter tank.

[0014] Preferably, two support frames are symmetrically and fixedly installed at the bottom of the filter box, a sealing plate is movably installed between the two support frames, and a viewing window is fixedly installed at the top of the filter box.

[0015] Preferably, a processing method of a loading device for circuit board electroplating processing includes the following steps;

[0016] S1. Concentrate multiple circuit boards in a rack, then place the rack on the loading conveyor table and set it between two adjacent partitions for limit fixation. Subsequently, start the loading conveyor table to drive the rack to move and load the circuit boards.

[0017] S2. When the rack is transported to the lower part of the support plate, start the hydraulic cylinder to drive the support plate to descend to the top of the rack. Then start multiple hydraulic clamps to clamp the top of the rack. Subsequently, the hydraulic cylinder contracts to drive the rack to rise and separate from the loading conveyor table. Then start the first motor to drive the overall rotation of the turntable and the support frame, transfer the rack above the electroplating tank. Finally, start the hydraulic cylinder to extend to drive the rack to descend, and immerse the circuit boards in the rack completely into the electroplating tank for electroplating processing.

[0018] S3. After the circuit boards are electroplated, the hydraulic cylinder contracts to lift the rack. Then start two second motors to run and drive two screws to rotate. The rotation of the screws drives the moving block to move, which drags the fan to move. At this time, the two fans move alternately on the top of the electroplating tank under the action of transmission, and start them during the movement to air-dry the circuit boards in the rack.

[0019] S4. After the circuit boards are air-dried, start the first motor again to drive the support frame to rotate, transfer the rack above the unloading conveyor table. Then start the hydraulic cylinder and the hydraulic clamps to lower the rack onto the unloading conveyor table, so that the unloading conveyor table unloads the circuit boards. Since there are multiple hydraulic cylinders and hydraulic clamps on the support frame, after the first support plate clamps and transfers the rack on the loading conveyor table, the next hydraulic cylinder and the support plate also move above the loading conveyor table to clamp and load the next rack, so as to continuously transfer and load the circuit boards.

[0020] The beneficial technical effects of the present invention: According to a loading device and a processing method for circuit board electroplating processing of the present invention, through the setting of the transfer and loading mechanism, it can automatically and continuously load and convey the circuit boards and automatically clamp and transfer the circuit boards into the electroplating tank. Rely on the rack to convey the circuit boards, and rely on multiple hydraulic cylinders, support plates and hydraulic clamps to clamp and transfer the circuit boards for loading. The whole process does not require manual transfer of the circuit boards into the electroplating tank, which is more convenient to operate, and can continuously load the circuit boards all the time, improving the efficiency of circuit board electroplating processing. Brief Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall structure according to a preferred embodiment of the present invention;

[0022] Figure 2 It is a schematic diagram of the structure of the feeding conveyor table according to a preferred embodiment of the present invention;

[0023] Figure 3 It is a schematic diagram of the structure of the support block and the partition board according to a preferred embodiment of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of the limiting groove and the limiting block according to a preferred embodiment of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of the clamping block according to a preferred embodiment of the present invention;

[0026] Figure 6 It is according to a preferred embodiment of the present invention Figure 5 Enlarged view of part A;

[0027] Figure 7 It is a top view schematic diagram of the structure of the electroplating tank according to a preferred embodiment of the present invention;

[0028] Figure 8 It is a schematic diagram of the internal structure of the filter tank according to a preferred embodiment of the present invention.

[0029] In the figure: 1. Electroplating tank; 2. Transfer feeding mechanism; 3. Support table; 4. Fixed frame; 5. First motor; 6. Turntable; 7. Support frame; 8. Hydraulic cylinder; 9. Fixed block; 10. Support plate; 11. Hydraulic clamp; 12. Feeding conveyor table; 13. Rack; 14. Discharging conveyor table; 15. Support block; 16. Partition board; 17. First magnet; 18. Second magnet; 19. Limiting groove; 20. Limiting block; 21. Spring; 22. Clamping rod; 23. Clamping block; 24. Pull rod; 25. Support rod; 26. Third magnet; 27. Fourth magnet; 28. Fixed plate; 29. Fan; 30. Fixed frame; 31. Second motor; 32. Screw rod; 33. Moving block; 34. Solenoid valve; 35. Filter tank; 36. Filter net; 37. Drain pipe; 38. Support frame; 39. Sealing plate; 40. Window. Detailed Description of the Preferred Embodiment

[0030] To make the technical solutions of the present invention clearer and more definite for those skilled in the art, the present invention will be further described in detail below with reference to the embodiments and the accompanying drawings. However, the embodiments of the present invention are not limited thereto.

[0031] As Figures 1-8As shown in the figure, a feeding device and a processing method for circuit board electroplating processing provided in this embodiment include an electroplating tank 1. A transfer feeding mechanism 2 is arranged on the electroplating tank 1. The transfer feeding mechanism 2 includes a support platform 3 fixedly installed on one side of the electroplating tank 1. A fixed frame 4 is fixedly installed on the top of the support platform 3. A first motor 5 is fixedly installed inside the fixed frame 4. A turntable 6 connected to the output end of the first motor 5 is movably installed on the top of the fixed frame 4. A support frame 7 is fixedly installed on the top of the turntable 6. A plurality of hydraulic cylinders 8 are uniformly fixedly installed on the support frame 7. A fixed block 9 is fixedly installed at the output end of the hydraulic cylinder 8. A support plate 10 is arranged at the bottom of the fixed block 9. A plurality of hydraulic clamps 11 are fixedly installed at the bottom of the support plate 10. A feeding conveyor 12 is fixedly installed on one side of the support platform 3. A plurality of material racks 13 are arranged on the feeding conveyor 12. A discharging conveyor 14 is fixedly installed on the other side of the support platform 3. Through the setting of the transfer feeding mechanism 2, the circuit board can be automatically and continuously fed and conveyed, and the circuit board can be automatically clamped and transferred into the electroplating tank 1. The circuit board is conveyed by relying on the material rack 13, and then the circuit board is clamped and transferred for feeding by relying on a plurality of hydraulic cylinders 8, the support plate 10 and the hydraulic clamps 11. The whole process does not require manual transfer of the circuit board into the electroplating tank 1, which is more convenient to operate, and can continuously feed the circuit board, improving the efficiency of circuit board electroplating processing.

[0032] In this embodiment, as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown in the figure, a plurality of support blocks 15 are uniformly and fixedly installed on the surface of the loading conveyor table 12. A plurality of partition plates 16 adapted to the support blocks 15 are arranged on the loading conveyor table 12. A first magnet 17 is fixedly embedded inside the support block 15. A plurality of second magnets 18 are fixedly installed at the bottom of the partition plate 16. A plurality of limiting grooves 19 are formed in the partition plate 16. Limiting blocks 20 slidably connected to the limiting grooves 19 are fixedly installed on both sides of the material rack 13. The shapes of the limiting grooves 19 and the limiting blocks 20 are both set as convex shapes. A plurality of springs 21 are fixedly installed on the surface of the fixed block 9. Clamping rods 22 fixedly connected to the plurality of springs 21 are movably installed on both sides of the fixed block 9. A clamping block 23 is fixedly installed on the top of the support plate 10. A pull rod 24 is fixedly installed on one side of the clamping rod 22. Through the settings of the support blocks 15, the partition plates 16, the first magnets 17 and the second magnets 18, after a plurality of partition plates 16 are arranged on the loading conveyor table 12, a plurality of material racks 13 can be separated and placed, avoiding mutual extrusion and collision between the plurality of material racks 13. After separating the plurality of material racks 13 by a certain distance, it is convenient for the hydraulic clamp 11 to clamp and lift. At the same time, the setting of the plurality of support blocks 15 enables the partition plates 16 to change the spacing according to the size of the material rack 13, so as to adapt to the use of different sizes of material racks 13. After inserting the partition plate 16 on the support block 15 to change the position, it can be fixed by relying on the first magnet 17 and the second magnet 18 to prevent shaking and falling off. Through the settings of the limiting grooves 19 and the limiting blocks 20, after the material rack 13 is placed on the loading conveyor table 12, the limiting blocks 20 on both sides of the material rack 13 are inserted into the limiting grooves 19 formed in the turntable 6 at this time. Relying on the connection and limitation of the limiting grooves 19 and the limiting blocks 20, the two turntables 6 limit the material rack 13, so that the material rack 13 is transported and loaded on the loading conveyor table 12 more stably, avoiding damage to the circuit board placed inside due to shaking. Through the settings of the springs 21, the clamping rods 22, the clamping blocks 23 and the pull rods 24, the support plate 10 and the fixed block 9 are installed and fixed by the clamping connection of the plurality of clamping rods 22 and the clamping blocks 23. After pulling the clamping rod 22 outwards so that one end thereof disengages from the clamping block 23, the support plate 10 can be disassembled and removed from the fixed block 9, so as to facilitate replacing the support plate 10 with different specifications according to different sizes of the material rack 13 for convenient clamping and lifting.

[0033] In this embodiment, as Figure 1 , Figure 5 , Figure 6 and Figure 7As shown, two support rods 25 are symmetrically and fixedly installed on the fixed block 9. A third magnet 26 is fixedly installed on the support rod 25. A fourth magnet 27 is fixedly installed on one side of the pull rod 24. Two fixing plates 28 are arranged on the top of the electroplating tank 1. A blower 29 is fixedly installed on the top of the fixing plate 28. The two blowers 29 are staggeredly distributed on the top of the electroplating tank 1. Two fixing frames 30 are fixedly installed on the surface of the electroplating tank 1. A second motor 31 is fixedly installed on one side of the fixing frame 30. A screw rod 32 connected to the second motor 31 is movably installed inside the fixing frame 30. A moving block 33 fixedly connected to the bottom of the fixing plate 28 is installed on the screw rod 32. Through the settings of the support rod 25, the third magnet 26 and the fourth magnet 27, when disassembling the support plate 10, the clamping rod 22 needs to be gradually pulled. After pulling the clamping rod 22 away from the clamping block 23, the fourth magnet 27 on the pull rod 24 is attached to the third magnet 26 arranged on the support rod 25. Relying on the adsorption of the third magnet 26 and the fourth magnet 27, the clamping rod 22 can be fixed to prevent the clamping rod 22 from resetting during the gradual disassembly process. Through the settings of the fixing plate 28, the blower 29, the fixing frame 30, the second motor 31, the screw rod 32 and the moving block 33, the electroplated circuit board can be dried. Start the two second motors 31 to run and drive the two screw rods 32 to rotate. The rotation of the screw rod 32 drives the moving block 33 to move, so as to drive the blower 29 to move. At this time, the two blowers 29 move staggeredly on the top of the electroplating tank 1 under the action of transmission, and are started during the movement to blow the circuit board in the material rack 13, so that the circuit board can be quickly unloaded after being dried.

[0034] In this embodiment, as Figure 1 and Figure 8As shown in the figure, a solenoid valve 34 is fixedly installed on the other side of the electroplating tank 1. A filter tank 35 is fixedly installed on one side of the solenoid valve 34. A filter screen 36 is fixedly installed inside the filter tank 35. A drain pipe 37 is fixedly installed on one side of the filter tank 35. Two support frames 38 are symmetrically and fixedly installed at the bottom of the filter tank 35. A sealing plate 39 is movably installed between the two support frames 38. A viewing window 40 is fixedly installed at the top of the filter tank 35. Through the settings of the solenoid valve 34, the filter tank 35, the filter screen 36 and the drain pipe 37, during the electroplating process of the circuit board, metal ions such as iron, copper, zinc, and lead will be generated in the electroplating solution in the electroplating tank 1. When discharging, the impurities in the electroplating solution can be filtered and separated through the filter tank 35 and the filter screen 36, so that the metal ion impurities are convenient for recycling and waste is avoided. Through the settings of the support frame 38, the sealing plate 39 and the viewing window 40, the sealing plate 39 is movably arranged at the bottom of the filter tank 35. After the sealing plate 39 is opened, it is convenient to take out the metal impurities filtered and collected inside the filter tank 35. At the same time, relying on the setting of the viewing window 40, it is convenient to check the capacity of the metal impurities filtered and collected in the filter tank 35, so as to clean it in time to avoid blockage.

[0035] In this embodiment, as Figures 1-8 shown, the working process of a feeding device and a processing method for circuit board electroplating provided in this embodiment is as follows:

[0036] Step 1: Concentrate multiple circuit boards and place them in the rack 13. Then place the rack 13 on the feeding conveyor 12 and set it between two adjacent partitions 16 for limit fixation. Subsequently, start the feeding conveyor 12 to drive the rack 13 to move for feeding the circuit boards.

[0037] Step 2: When the rack 13 is transported to the lower part of the support plate 10, start the hydraulic cylinder 8 to drive the support plate 10 to descend to the top of the rack 13. Then start multiple hydraulic clamps 11 to clamp the top of the rack 13. Subsequently, the hydraulic cylinder 8 contracts to drive the rack 13 to rise and separate from the feeding conveyor 12. Then start the first motor 5 to drive the turntable 6 and the support frame 7 to rotate as a whole, transfer the rack 13 above the electroplating tank 1, and finally start the hydraulic cylinder 8 to extend to drive the rack 13 to descend, and immerse the circuit boards in the rack 13 completely into the electroplating tank 1 for electroplating processing.

[0038] Step 3: After the circuit board is electroplated, the hydraulic cylinder 8 contracts to lift the rack 13. Then start two second motors 31 to run and drive two screw rods 32 to rotate. The rotation of the screw rods 32 drives the moving block 33 to move, so as to drag the fan 29 to move. At this time, the two fans 29 move alternately on the top of the electroplating tank 1 under the action of transmission, and start them during the movement to dry the circuit boards in the rack 13.

[0039] Step 4: After the circuit board is air-dried, start the first motor 5 again to drive the support frame 7 to rotate, transfer the material rack 13 above the blanking conveyor table 14, and then start the hydraulic cylinder 8 and the hydraulic fixture 11 to lower the material rack 13 onto the blanking conveyor table 14, so that the blanking conveyor table 14 discharges the circuit board. Since there are multiple hydraulic cylinders 8 and hydraulic fixtures 11 on the support frame 7, after the first support plate 10 picks up and transfers the material rack 13 on the loading conveyor table 12, the next hydraulic cylinder 8 and the support plate 10 also move above the loading conveyor table 12 to clamp and load the next material rack 13, so as to continuously transfer and load the circuit board.

[0040] In summary, in this embodiment, according to a loading device and a processing method for circuit board electroplating processing in this embodiment, through the settings of the support blocks 15, partition plates 16, first magnetic blocks 17, and second magnetic blocks 18, after arranging a plurality of partition plates 16 on the loading conveyor table 12, a plurality of racks 13 can be separated and placed, avoiding mutual extrusion and collision between the plurality of racks 13. After separating the plurality of racks 13 by a certain distance, it is convenient for the hydraulic clamp 11 to clamp and lift. At the same time, the setting of a plurality of support blocks 15 enables the partition plates 16 to change the spacing according to the size of the racks 13, so as to adapt to the use of racks 13 of different sizes. After inserting the partition plates 16 on the support blocks 15 and changing their positions, they can be fixed by the first magnetic blocks 17 and the second magnetic blocks 18 to prevent shaking and falling off. Through the settings of the limit grooves 19 and the limit blocks 20, after placing the rack 13 on the loading conveyor table 12, the limit blocks 20 on both sides of the rack 13 are inserted into the limit grooves 19 opened on the turntables 6. Relying on the connection and limitation of the limit grooves 19 and the limit blocks 20, the two turntables 6 limit the rack 13, so that the rack 13 is transported and loaded on the loading conveyor table 12 more stably, avoiding damage to the circuit board placed inside it due to shaking. Through the settings of the springs 21, the clamping rods 22, the clamping blocks 23, and the pull rods 24, the support plate 10 and the fixed block 9 are installed and fixed by the clamping connection of a plurality of clamping rods 22 and clamping blocks 23. After pulling the clamping rod 22 outwards so that one end of it disengages from the clamping block 23, the support plate 10 can be disassembled and removed from the fixed block 9, so as to facilitate replacing the support plate 10 of different specifications according to the size of different racks 13 to facilitate clamping and lifting. Through the settings of the support rods 25, the third magnetic blocks 26, and the fourth magnetic blocks 27, when disassembling the support plate 10, the clamping rod 22 needs to be pulled step by step. After pulling the clamping rod 22 out of the clamping block 23, the fourth magnetic block 27 on the pull rod 24 is attached to the third magnetic block 26 arranged on the support rod 25. Relying on the adsorption of the third magnetic block 26 and the fourth magnetic block 27, the clamping rod 22 can be fixed to avoid the situation that the clamping rod 22 resets during the gradual disassembly process. Through the settings of the fixing plate 28, the fan 29, the fixing frame 30, the second motor 31, the screw rod 32, and the moving block 33, it can play a role in air-drying the electroplated circuit board. Start the two second motors 31 to run and drive to drive the two screw rods 32 to rotate. The rotation of the screw rod 32 drives the moving block 33 to move, so that the moving block 33 drags the fan 29 to move. At this time, the two fans 29 move alternately on the top of the electroplating tank 1 under the action of transmission, and start them during the movement to blow the circuit board in the rack 13, and air-dry the circuit board so that it can be quickly unloaded. Through the settings of the solenoid valve 34, the filter tank 35, the filter screen 36, and the drain pipe 37, during the electroplating processing of the circuit board, metal ions such as iron, copper, zinc, and lead will be generated in the electroplating solution in the electroplating tank 1. When discharging, the filter tank 35 and the filter screen 36 can filter and separate the impurities in the electroplating solution.The metal ion impurities can be conveniently recycled to avoid waste. Through the settings of the support frame 38, the sealing plate 39 and the viewing window 40, the sealing plate 39 is movably arranged at the bottom of the filter box 35. After the sealing plate 39 is opened, it is convenient to take out the metal impurities filtered and collected inside the filter box 35. At the same time, relying on the setting of the viewing window 40, it is convenient to check the capacity of the metal impurities filtered and collected in the filter box 35, so as to clean it in time to avoid blockage.

[0041] The above is only a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the scope disclosed by the present invention, according to the technical solution and its concept of the present invention, makes equivalent substitutions or changes, all belong to the protection scope of the present invention.

Claims

1. A feeding device for electroplating processing of a circuit board, including an electroplating tank (1), characterized in that, A transfer and loading mechanism (2) is provided on the electroplating tank (1). The transfer and loading mechanism (2) includes a support table (3) fixedly installed on one side of the electroplating tank (1). A fixed frame (4) is fixedly installed on the top of the support table (3). A first motor (5) is fixedly installed inside the fixed frame (4). A turntable (6) connected to the output end of the first motor (5) is movably installed on the top of the fixed frame (4). A support frame (7) is fixedly installed on the top of the turntable (6). A plurality of hydraulic cylinders (8) are evenly and fixedly installed on the support frame (7). A fixed block (9) is fixedly installed at the output end of the hydraulic cylinder (8). A support plate (10) is provided at the bottom of the fixed block (9). A plurality of hydraulic clamps (11) are fixedly installed at the bottom of the support plate (10). A loading conveyor table (12) is fixedly installed on one side of the support table (3). A plurality of material racks (13) are provided on the loading conveyor table (12). A unloading conveyor table (14) is fixedly installed on the other side of the support table (3).

2. The feeding device for electroplating processing of a circuit board according to claim 1, wherein, A plurality of support blocks (15) are evenly and fixedly installed on the surface of the loading conveyor table (12). A plurality of partition plates (16) adapted to the support blocks (15) are provided on the loading conveyor table (12). A first magnet (17) is fixedly embedded inside the support block (15). A plurality of second magnets (18) are fixedly installed at the bottom of the partition plate (16).

3. The feeding device for electroplating processing of a circuit board according to claim 2, characterized in that, A plurality of limiting grooves (19) are formed on the partition plate (16). Limiting blocks (20) slidably connected to the limiting grooves (19) are fixedly installed on both sides of the material rack (13). The shapes of the limiting grooves (19) and the limiting blocks (20) are both set as convex shapes.

4. The feeding device for electroplating processing of a circuit board according to claim 1, wherein, A plurality of springs (21) are fixedly installed on the surface of the fixed block (9). Clamping rods (22) fixedly connected to the plurality of springs (21) are movably installed on both sides of the fixed block (9). A clamping block (23) is fixedly installed on the top of the support plate (10). A pull rod (24) is fixedly installed on one side of the clamping rod (22).

5. The feeding device for electroplating processing of a circuit board according to claim 4, wherein, Two support rods (25) are symmetrically and fixedly installed on the fixed block (9). A third magnet (26) is fixedly installed on the support rod (25). A fourth magnet (27) is fixedly installed on one side of the pull rod (24).

6. The feeding device for electroplating processing of a circuit board according to claim 1, characterized in that, Two fixing plates (28) are provided on the top of the electroplating tank (1). A blower (29) is fixedly installed on the top of the fixing plate (28). The two blowers (29) are staggeredly distributed on the top of the electroplating tank (1).

7. The feeding device for electroplating processing of a circuit board according to claim 6, characterized in that, Two fixed frames (30) are fixedly installed on the surface of the electroplating tank (1). A second motor (31) is fixedly installed on one side of the fixed frame (30). A screw rod (32) connected to the second motor (31) is movably installed inside the fixed frame (30). A moving block (33) fixedly connected to the bottom of the fixing plate (28) is installed on the screw rod (32).

8. The feeding device for electroplating processing of a circuit board according to claim 1, characterized in that, On the other side of the electroplating tank (1), a solenoid valve (34) is fixedly installed. On one side of the solenoid valve (34), a filter tank (35) is fixedly installed. Inside the filter tank (35), a filter screen (36) is fixedly installed. On one side of the filter tank (35), a drain pipe (37) is fixedly installed.

9. The feeding device for electroplating processing of a circuit board according to claim 8, characterized in that, On the bottom of the filter tank (35), two support frames (38) are symmetrically and fixedly installed. Between the two support frames (38), a sealing plate (39) is movably installed. On the top of the filter tank (35), a viewing window (40) is fixedly installed.

10. A processing method of a feeding device for circuit board electroplating processing according to claims 1-9, characterized in that, It includes the following steps; S1. Concentrate multiple circuit boards and place them in the rack (13). Then place the rack (13) on the loading conveyor (12) and set it between two adjacent partition plates (16) for limit fixation. Subsequently, start the loading conveyor (12) to drive the rack (13) to move and load the circuit boards. S2. When the rack (13) is transported below the support plate (10), start the hydraulic cylinder (8) to drive the support plate (10) to descend to the top of the rack (13). Then start multiple hydraulic clamps (11) to clamp the top of the rack (13). Subsequently, the hydraulic cylinder (8) contracts to drive the rack (13) to rise and separate from the loading conveyor (12). Then start the first motor (5) to drive the turntable (6) and the support frame (7) to rotate as a whole, transfer the rack (13) above the electroplating tank (1). Finally, start the hydraulic cylinder (8) to extend to drive the rack (13) to descend, and immerse the circuit boards in the rack (13) completely into the electroplating tank (1) for electroplating processing. S3. After the circuit boards are electroplated, the hydraulic cylinder (8) contracts to lift the rack (13). Then start two second motors (31) to operate and drive two screw rods (32) to rotate. When the screw rods (32) rotate, they drive the moving block (33) to move, which drags the fan (29) to move. At this time, the two fans (29) move alternately on the top of the electroplating tank (1) under the action of transmission, and start them during the movement to dry the circuit boards in the rack (13). S4. After drying the circuit boards, start the first motor (5) again to drive the support frame (7) to rotate, transfer the rack (13) above the unloading conveyor (14). Then start the hydraulic cylinder (8) and the hydraulic clamps (11) to lower the rack (13) onto the unloading conveyor (14), so that the unloading conveyor (14) unloads the circuit boards. Since there are multiple hydraulic cylinders (8) and hydraulic clamps (11) on the support frame (7), after the first support plate (10) clamps and transfers the rack (13) on the loading conveyor (12), the next hydraulic cylinder (8) and the support plate (10) also move above the loading conveyor (12) to clamp and load the next rack (13), so as to continuously transfer and load the circuit boards.

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