Coating device for laser chip and coating method thereof

By designing a laser chip coating device with an automatic pick-up and placement mechanism, the problem of inefficient coating efficiency caused by manual pick-up and placement is solved, and the automatic pick-up and placement and uniform coating of the laser chip are realized.

CN120272865AInactive Publication Date: 2025-07-08GUANGXI HUXIN TECH CO LTD
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Patent Information

Application Number
CN202510364871.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2025-07-08
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing laser chip coating devices require manual pick-up and placement, resulting in inefficient coating processes.

Method used

A coating device including an automatic pick-up and placement mechanism is designed, and the automatic pick-up and placement of the chip and vacuum coating are realized using threaded screws, vortex proximity switches and motor-controlled grabbers.

Benefits of technology

It realizes automatic pick-up and placement of laser chips and uniform coating, improving coating efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of semiconductor processing, in particular to a laser chip coating device which comprises a workbench, a sliding table base is in threaded connection with the outer portion of a threaded lead screw, an eddy current type proximity switch is fixedly installed on the inner rear wall of a coating box, and a grabbing piece is arranged at the top of a translation table. A planetary gear piece is arranged on the top of the clamp ring base, and clamping pieces are arranged on the inner side of the clamp ring base. According to the coating device of the laser chip and the coating method of the coating device, a first gear motor drives a second bevel gear and a first bevel gear through a chain gear, a shaft rod controls claw pieces to gather and swing to clamp and fix a bar clamp placed in a translation table, and then a stepping motor drives a threaded lead screw to control the translation table to move left and right along the threaded lead screw; when the eddy current type proximity switch detects that the translation table moves to the position under the clamp ring base, the first gear motor controls the shaft rod, the hook claw pieces are expanded for discharging, and therefore the automatic material taking and discharging effect is achieved.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and specifically relates to a coating device and a coating method for a laser chip. Background Art

[0002] Coating of laser chips is an important process in semiconductor processing technology. By depositing one or more layers of thin films on the cavity surface of the laser chip, the optical performance and stability of the chip can be improved. Therefore, in order to improve the coating efficiency, high-efficiency coating processing needs to be carried out through a coating device for laser chips during semiconductor processing.

[0003] After retrieval, according to the invention patent with the Chinese patent publication number CN114293151A, a method for preparing a semiconductor laser and a coating device are disclosed. The chip coating device in this invention patent also forms a vapor atomic structure of the coating raw material based on the evaporation coating method and coats the chip surface. However, this coating device for laser chips requires manual picking and placing of the chips and cannot achieve the effect of automatically picking and placing the chips, resulting in relatively low efficiency of the coating process. Therefore, the coating device for laser chips needs to further improve the chip picking and placing structure, and thus a coating device and a coating method for laser chips are proposed. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the present invention provides a coating device and a coating method for a laser chip, which have the advantages of facilitating automatic picking and placing of chips for efficient vacuum coating, and solve the problem that the existing coating device for laser chips uses manual picking and placing for loading and unloading, which easily leads to low efficiency of the coating process in the above background art.

[0006] (2) Technical Solutions

[0007] To achieve the above purpose of facilitating automatic picking and placing of chips for efficient vacuum coating, the present invention provides the following technical solutions: A coating device for a laser chip, including a workbench and a coating chamber arranged on the top of the workbench, and an automatic picking and placing mechanism is arranged inside the coating chamber;

[0008] The automatic picking and placing mechanism includes a lead screw rotatably connected to the inside of the coating chamber. A slide seat is threadedly connected to the outside of the lead screw. An eddy current proximity switch is fixedly installed on the inner rear wall of the coating chamber. A translation stage is fixedly connected to the outside of the slide seat. A grasping member is arranged on the top of the translation stage. A fixture ring seat is fixed on the inner top wall of the coating chamber. A planetary gear member is arranged on the top of the fixture ring seat. An eccentric wheel is rotatably connected to the inside of the fixture ring seat. A clamping piece is arranged inside the fixture ring seat.

[0009] Preferably, a groove plate is fixedly installed on the right side of the coating box. Inside the groove plate, two pulleys that drive each other are rotatably connected. There are two threaded lead screws, and the right ends of the two threaded lead screws are coaxially fixed to the left ends of the two pulleys respectively. A stepper motor is fixedly installed on the right side of the groove plate, and the output shaft of the stepper motor is coaxially fixed to the right end of one of the pulleys.

[0010] Preferably, there are two sliding table seats. A metal ring is fixedly connected to the rear side of one of the sliding table seats. The eddy current proximity switch has a magnetic field generating end on the front side. A control box is fixedly installed on the back of the coating box. The inside of the control box includes a power supply module, a single-chip microcomputer module, a motor controller module, and a relay module. The eddy current proximity switch is electrically connected to the single-chip microcomputer module.

[0011] Preferably, the grasping member includes a shaft rod rotatably connected to the top of the translation table. A hook claw piece is fixedly sleeved on the outside of the shaft rod, and a first bevel gear is coaxially fixed to one end of the shaft rod. A second bevel gear is rotatably connected to the top of the translation table. The second bevel gear meshes with the outside of the first bevel gear. A chain gear is rotatably connected to the bottom of the translation table. A rotating rod is fixedly connected to the top of the chain gear. The top of the shaft rod is rotatably connected to the bottom of the second bevel gear. A first reduction motor is fixedly installed on the bottom of the translation table, and the output end of the first reduction motor is fixedly connected to the bottom of the chain gear.

[0012] Preferably, a ring groove is formed in the top of the fixture ring seat. The planetary gear member includes a double-sided tooth ring rotatably connected to the inner side of the ring groove. The inner tooth layer of the double-sided tooth ring meshes with an internal tooth disk. A second reduction motor is fixedly installed on the top of the fixture ring seat, and the output end of the second reduction motor is fixedly connected to the top of the internal tooth disk. The outer tooth layer of the double-sided tooth ring meshes with four outer tooth disks, and the four outer tooth disks are distributed in an annular array.

[0013] Preferably, there are four eccentric wheels, and the four eccentric wheels are respectively fixedly connected to the bottoms of the four outer tooth disks. Four lead screws are fixed to the inner top wall of the fixture ring seat. There are four clamping pieces, and the four clamping pieces are respectively slidably connected to the outside of the four lead screws. A connecting rod is rotatably connected to the bottom of each of the four eccentric wheels. The other ends of the four connecting rods away from the eccentric wheels are respectively rotatably connected to the outside of the four clamping pieces. A foam layer structure is laid on the inner side of each of the four clamping pieces.

[0014] Preferably, sealing hatch doors are hinged to both the left side and the top of the coating chamber, and an electroplating assembly is provided inside the coating chamber. The electroplating assembly includes a crucible rack fixedly installed on the inner bottom wall of the coating chamber. An electron beam gun is fixedly installed on the left side of the crucible rack. Inside the crucible rack, a target sheet located directly below the fixture ring seat is placed. A control panel is provided on the front of the control box, and the control panel is electrically connected to the electron beam gun.

[0015] Preferably, a pressure gauge is fixedly installed on the top of the coating chamber. The bottom of the pressure gauge is a pressure-sensitive probe and extends into the interior of the coating chamber. A vacuum pump is fixedly installed on the front of the coating chamber. The top of the vacuum pump is fixedly connected to an air extraction pipe, and the air extraction pipe is connected to the front of the coating chamber in a penetrating manner. The control panel is electrically connected to the vacuum pump.

[0016] A coating method for a laser chip includes the following specific steps:

[0017] S1. First, open the sealing hatch door on the top of the coating chamber. Drive two belt pulleys by a stepping motor to control the synchronous rotation of two threaded lead screws, so that the translation stage moves to the right along the threaded lead screws.

[0018] S2. Place the bar fixture inside the translation stage. Operate the control panel of the control box. Drive the chain gear by a first reduction motor. The chain gear drives the second bevel gear through a rotating rod, and drives the shaft rod by meshing with the first bevel gear. At this time, the shaft rod controls the converging swing of the claw pieces to stably clamp the outside of the bar fixture.

[0019] S3. The stepping motor drives the threaded lead screws in the reverse direction, so that the translation stage moves to the left along the threaded lead screws. When the metal ring of the sliding table seat enters the magnetic field area of the eddy current proximity switch, a detection signal is generated inside the eddy current proximity switch, and is received and judged by the single-chip microcomputer module that the translation stage is located in the area directly below the fixture ring seat.

[0020] S4. Drive the internal gear disk by a second reduction motor, drive the external gear disk by meshing with the double-sided tooth ring. At this time, the external gear disk drives the eccentric wheel synchronously, and the eccentric wheel controls the connecting rod to perform eccentric motion, so that the clamping piece approaches the outside of the bar fixture.

[0021] S5. Then, simultaneously control the first reduction motor to drive the chain gear in the reverse direction, control the shaft rod to drive the claw pieces to expand and swing, release the clamping force on the bar fixture, and use the clamping piece to clamp and fix the outside of the bar fixture. At this time, close the two sealing hatch doors, use the vacuum pump to pump the coating chamber to vacuum, and detect the air pressure change in the chamber through the pressure gauge.

[0022] S6. The operation control panel preheats the electron beam gun to a stable state, causing the electron beam gun to emit a high-energy electron beam that moves in a parabolic motion and focuses on the surface of the target thin sheet. After the high-energy electron beam bombards the target, it causes local melting and evaporation of the target to form a vapor cloud. The vapor atoms move linearly in a vacuum environment and are uniformly deposited on the surface of the chip above, achieving a uniform coating effect.

[0023] (III) Beneficial Effects

[0024] Compared with the prior art, the present invention provides a coating device and a coating method for a laser chip, having the following beneficial effects:

[0025] 1. For the coating device and the coating method of the laser chip, the first reduction motor drives the second bevel gear and the first bevel gear through a chain gear. The shaft rod controls the gathering and swinging of the hook claw pieces to clamp and fix the bar fixture placed on the translation table. Then, the stepping motor controls the translation table to move left and right along the lead screw by driving the lead screw. When the eddy current proximity switch detects that the translation table moves to directly below the fixture ring seat, the first reduction motor controls the shaft rod to expand the hook claw pieces for discharging, thus achieving the effect of automatic material taking and placing.

[0026] 2. For the coating device and the coating method of the laser chip, by closing the two sealing hatches, the coating chamber is evacuated by a vacuum pump. At this time, the operation control panel preheats the electron beam gun, and the electron beam gun emits a high-energy electron beam and focuses it on the surface of the target thin sheet, causing local melting and evaporation of the target to form a vapor cloud. The vapor atoms are uniformly deposited on the surface of the chip above in a vacuum environment, achieving a uniform coating effect. Description of the Drawings

[0027] Figure 1 It is a schematic structural diagram of the workbench of the present invention;

[0028] Figure 2 It is Figure 1 A sectional view from a

[0029] Figure 3 It is Figure 2 A bottom view from a

[0030] Figure 4 It is Figure 3 A partial schematic diagram in the

[0031] Figure 5 It is Figure 4 A schematic structural diagram of the bottom of the fixture ring seat in

[0032] Figure 6 It is Figure 4 A schematic structural diagram of the top of the fixture ring seat in

[0033] Figure 7 It is Figure 4Schematic diagram of the middle translation stage structure;

[0034] Figure 8 Schematic diagram of the grasping part structure of the present invention;

[0035] Figure 9 Schematic diagram of the internal modules of the control box of the present invention.

[0036] In the figure: 1, workbench; 2, coating box; 3, automatic picking and placing mechanism; 301, threaded lead screw; 302, slide base; 303, eddy current proximity switch; 304, translation stage; 305, grasping part; 3051, shaft rod; 3052, hook claw piece; 3053, first bevel gear; 3054, second bevel gear; 306, fixture ring base; 307, planetary gear part; 3071, double-sided toothed ring; 3072, internal toothed disk; 3073, external toothed disk; 308, eccentric wheel; 309, clamping piece; 4, groove plate; 5, pulley; 6, stepping motor; 7, metal ring; 8, control box; 9, chain gear; 10, first reduction motor; 11, second reduction motor; 12, lead screw; 13, connecting rod; 14, sealed hatch; 15, electroplating assembly; 1501, crucible holder; 1502, electron beam gun; 1503, target thin sheet; 16, pressure gauge; 17, vacuum pump. Specific embodiments

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] Embodiment 1

[0039] Specifically, in this embodiment, one of the pulleys 5 is driven by the stepping motor 6, and the two mutually driving pulleys 5 are used to synchronously drive the two threaded lead screws 301, so as to control the left and right movement of the slide base 302 and the translation stage 304 along the threaded lead screw 301;

[0040] When the translation stage 304 moves to the sealed hatch 14 at the top of the coating box 2, by opening the sealed hatch 14 at this place, the bar fixture is placed into the translation stage 304. At this time, the control panel of the control box 8 is operated, and the single-chip microcomputer module controls the switch and output direction of the first reduction motor 10 through the motor controller module and the relay module. The first reduction motor 10 drives one of the chain gears 9, and the four chain gears 9 respectively drive the four second bevel gears 3054 through the rotating rod. The first bevel gear 3053 is driven by meshing the second bevel gear 3054, so that the shaft rod 3051 controls the converging swing of the hook claw piece 3052 to stably clamp the outside of the bar fixture;

[0041] When the translation stage 304 moves to the area directly below the fixture ring seat 306, the metal ring 7 of the sliding table seat 302 enters the magnetic field area of the eddy current proximity switch 303 at this time. An eddy current effect is generated inside the metal ring 7 and acts back on the inside of the proximity switch. An oscillator is provided inside the proximity switch. This eddy current effect will cause the oscillator to oscillate and decay until it stops oscillating and then generates an electrical signal. After being processed by the internal amplifier circuit, it is transmitted to the single-chip microcomputer module. The analog-to-digital converter and digital signal processor in the single-chip microcomputer module convert the electrical signal into a digital signal. After being processed by the single-chip microcomputer module, a level signal is output to the motor controller module, and then the relay module controls the switch of the stepping motor 6 to achieve the detection and identification effect of the relative position between the translation stage 304 and the fixture ring seat 306.

[0042] Embodiment 2

[0043] Specifically, in this embodiment, when the translation stage 304 moves to directly below the fixture ring seat 306, the single-chip microcomputer module outputs a level signal to the motor controller module. The motor controller module controls the first reduction motor 10 to start rotating in the reverse direction, so that the shaft rod 3051 controls the hook claw piece 3052 to expand and swing, releasing the clamping force on the bar fixture.

[0044] At the same time, the motor controller module starts the second reduction motor 11 through the relay module. The second reduction motor 11 drives the internal gear disk 3072, uses the internal gear disk 3072 to mesh and drive the double-sided gear ring 3071, and then the double-sided gear ring 3071 drives the four external gear disks 3073. The four external gear disks 3073 synchronously drive the four eccentric wheels 308, and the eccentric wheels 308 drive the connecting rod 13 to perform eccentric motion, so that the connecting rod 13 drives the clamping piece 309 to slide along the lead screw 12, and the four clamping pieces 309 move closer to the bar fixture side to re-clamp and fix the outside of the bar fixture.

[0045] The four hook claw pieces 3052 and the four clamping pieces 309 are distributed at staggered positions, so there will be no position interference between the hook claw pieces 3052 and the clamping pieces 309 when the hook claw pieces 3052 move.

[0046] Embodiment 3

[0047] Specifically, in this embodiment, after the clamping piece 309 inside the fixture ring seat 306 clamps and fixes the bar fixture, the stepping motor 6 drives the threaded lead screw 301 to control the translation stage 304 to move out of the area above the fixture ring seat 306.

[0048] At this time, open the sealed hatch 14 on the left side of the coating chamber 2, place the target thin sheet 1503 inside the crucible holder 1501, and the target thin sheet 1503 is directly below the fixture ring seat 306 and between the two electron beam guns 1502. After closing the sealed hatch 14 on the left side, operate the control panel to turn on the vacuum pump 17 to suck and vacuum the inside of the coating chamber 2, and detect the air pressure change in the chamber under the vacuum state through the pressure gauge 16;

[0049] Continue to operate the control panel to preheat the electron beam gun 1502 to a stable state, so that the electron beam gun 1502 emits a high-energy electron beam in a parabolic state and focuses on the surface of the target thin sheet 1503. Use the high-energy electron beam to bombard the target to locally melt and evaporate it to form a vapor cloud. The vapor atoms in the vapor cloud move in a straight line in the vacuum environment, so they directly rise to the surface of the chip. After uniformly depositing on the chip surface and then annealing and cooling the chip, the coating effect can be achieved.

[0050] In summary, for the coating device and coating method of the laser chip, the first reduction motor 10 drives the second bevel gear 3054 and the first bevel gear 3053 through the chain gear 9. The shaft rod 3051 controls the gathering and swinging of the hook claw piece 3052 to clamp and fix the bar fixture placed on the translation stage 304. Then, the stepping motor 6 drives the threaded lead screw 301 to control the translation stage 304 to move left and right along the threaded lead screw 301. When the eddy current proximity switch 303 detects that the translation stage 304 moves directly below the fixture ring seat 306, the first reduction motor 10 controls the shaft rod 3051 to expand and release the hook claw piece 3052, thus achieving the effect of automatic material picking and placing;

[0051] By closing the two sealed hatches 14 and using the vacuum pump 17 to suck and vacuum the coating chamber 2, at this time, operate the control panel to preheat the electron beam gun 1502, use the electron beam gun 1502 to emit a high-energy electron beam and focus on the surface of the target thin sheet 1503, so that the target is locally melted and evaporated to form a vapor cloud, and the vapor atoms are uniformly deposited on the chip surface in the vacuum environment to achieve a uniform coating effect.

[0052] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0053] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A coating device for a laser chip, comprising a workbench (1) and a coating box (2) arranged on the top of the workbench (1), characterized in that: An automatic picking and placing mechanism (3) is arranged inside the coating box (2); The automatic picking and placing mechanism (3) includes a lead screw (301) rotatably connected to the inside of the coating box (2). A slide base (302) is threadedly connected to the outside of the lead screw (301). An eddy current proximity switch (303) is fixedly installed on the inner rear wall of the coating box (2). A translation table (304) is fixedly connected to the outside of the slide base (302). A grasping member (305) is arranged on the top of the translation table (304). A fixture ring seat (306) is fixed to the inner top wall of the coating box (2). A planetary gear member (307) is arranged on the top of the fixture ring seat (306). An eccentric wheel (308) is rotatably connected to the inside of the fixture ring seat (306). A clamping piece (309) is arranged inside the fixture ring seat (306).

2. The coating device for a laser chip according to claim 1, wherein: A groove plate (4) is fixedly installed on the right side of the coating box (2). Two pulleys (5) that are in transmission with each other are rotatably connected to the inside of the groove plate (4). There are two lead screws (301). The right ends of the two lead screws (301) are coaxially fixed to the left ends of the two pulleys (5) respectively. A stepping motor (6) is fixedly installed on the right side of the groove plate (4). The output shaft of the stepping motor (6) is coaxially fixed to the right end of one of the pulleys (5).

3. The coating device for a laser chip according to claim 1, characterized in that: There are two slide bases (302). A metal ring (7) is fixedly connected to the rear side of one of the slide bases (302). The eddy current proximity switch (303) has a magnetic field generating end on the front side. A control box (8) is fixedly installed on the back of the coating box (2). The inside of the control box (8) includes a power supply module, a single-chip microcomputer module, a motor controller module, and a relay module. The eddy current proximity switch (303) is electrically connected to the single-chip microcomputer module.

4. A coating device for a laser chip according to claim 1, characterized in that: The grasping member (305) includes a shaft rod (3051) rotatably connected to the top of the translation table (304). A hook claw piece (3052) is fixedly sleeved on the outside of the shaft rod (3051). One end of the shaft rod (3051) is coaxially fixed with a first bevel gear (3053). A second bevel gear (3054) is rotatably connected to the top of the translation table (304). The second bevel gear (3054) is meshed with the outside of the first bevel gear (3053). A chain gear (9) is rotatably connected to the bottom of the translation table (304). A rotating rod is fixedly connected to the top of the chain gear (9). The top of the shaft rod is rotatably connected to the bottom of the second bevel gear (3054). A first reduction motor (10) is fixedly installed on the bottom of the translation table (304). The output end of the first reduction motor (10) is fixedly connected to the bottom of the chain gear (9).

5. A coating device for a laser chip according to claim 1, characterized in that: A ring groove is formed at the top of the fixture ring seat (306). The planetary gear member (307) includes a double-sided tooth ring (3071) rotatably connected to the inner side of the ring groove. An inner gear disk (3072) is engaged with the inner tooth layer of the double-sided tooth ring (3071). A second reduction motor (11) is fixedly installed at the top of the fixture ring seat (306). The output end of the second reduction motor (11) is fixedly connected to the top of the inner gear disk (3072). The outer tooth layer of the double-sided tooth ring (3071) is engaged with four outer gear disks (3073). The four outer gear disks (3073) are distributed in an annular array.

6. The coating device for a laser chip according to claim 5, characterized in that: There are four eccentric wheels (308), and the four eccentric wheels (308) are respectively fixedly connected to the bottoms of the four outer gear disks (3073). Four lead screws (12) are fixedly installed on the inner top wall of the fixture ring seat (306). There are four clamping pieces (309), and the four clamping pieces (309) are respectively slidably connected to the exteriors of the four lead screws (12). One end of each of the four connecting rods (13) away from the eccentric wheel (308) is rotatably connected to the outer sides of the four clamping pieces (309). Foam layer structures are laid on the inner sides of the four clamping pieces (309).

7. A coating device for a laser chip according to claim 3, characterized in that: Sealed hatch doors (14) are hinged to the left side and the top of the coating chamber (2), and an electroplating assembly (15) is arranged inside the coating chamber (2). The electroplating assembly (15) includes a crucible holder (1501) fixedly installed on the inner bottom wall of the coating chamber (2). An electron beam gun (1502) is fixedly installed on the left side of the crucible holder (1501). A target thin sheet (1503) located directly below the fixture ring seat (306) is placed inside the crucible holder (1501). A control panel is arranged on the front surface of the control box (8), and the control panel is electrically connected to the electron beam gun (1502).

8. The coating device for a laser chip according to claim 7, characterized in that: A pressure gauge (16) is fixedly installed on the top of the coating chamber (2). The bottom of the pressure gauge (16) is a pressure-sensitive probe and extends into the coating chamber (2). A vacuum pump (17) is fixedly installed on the front surface of the coating chamber (2). A suction pipe is fixedly connected to the top of the vacuum pump (17), and the suction pipe is connected to the front surface of the coating chamber (2) in a penetrating manner. The control panel is electrically connected to the vacuum pump (17).

9. A coating method for a laser chip, characterized in that: It includes the following specific steps: S1. First, open the sealed hatch door (14) on the top of the coating chamber (2). The stepper motor (6) drives the two belt pulleys (5) to control the synchronous rotation of the two threaded lead screws (301), so that the translation stage (304) moves to the right along the threaded lead screws (301). S2. Place the bar fixture inside the translation stage (304). Operate the control panel of the control box (8). The first reduction motor (10) drives the chain gear (9). The chain gear (9) drives the second bevel gear (3054) through a rotating rod, and drives the shaft rod (3051) by engaging with the first bevel gear (3053). At this time, the shaft rod (3051) controls the gathering and swinging of the hook pieces (3052) to stably clamp the outside of the bar fixture. S3. The stepper motor (6) drives the lead screw (301) in the reverse direction, so that the translation stage (304) moves to the left along the lead screw (301). When the metal ring (7) of the sliding table seat (302) enters the magnetic field area of the eddy current proximity switch (303), a detection signal is generated inside the eddy current proximity switch (303), which is received by the single-chip microcomputer module and judges that the translation stage (304) is located in the area directly below the fixture ring seat (306). S4. Drive the internal gear disk (3072) through the second reduction motor (11), drive the external gear disk (3073) by engaging with the double-sided gear ring (3071). At this time, the external gear disk (3073) synchronously drives the eccentric wheel (308), and the eccentric wheel (308) controls the link rod (13) to perform eccentric motion, so that the clamping piece (309) approaches the outside of the bar fixture. S5. Then, simultaneously control the first reduction motor (10) to drive the chain gear (9) in the reverse direction, control the shaft rod (3051) to drive the hook pieces (3052) to expand and swing, release the clamping force on the bar fixture, and use the clamping piece (309) to clamp and fix the outside of the bar fixture. At this time, close the two sealing hatches (14), use the vacuum pump (17) to pump the coating chamber (2) to vacuum, and detect the air pressure change in the chamber through the pressure gauge (16). S6. Operate the control panel to preheat the electron beam gun (1501) to a stable state, so that the electron beam gun (1501) emits a high-energy electron beam that makes a parabolic motion and focuses on the surface of the target thin sheet (1503). After the high-energy electron beam bombards the target, it locally melts and evaporates to form a vapor cloud. The vapor atoms move linearly in a vacuum environment and are uniformly deposited on the surface of the chip above to achieve a uniform coating effect.

Citation Information

Patent Citations

  • Semiconductor laser preparation method and coating device

    CN114293151A