High-precision integrated circuit chip defect optical detection equipment and method
Through high-precision integrated circuit chip defect optical detection equipment, the chip position and focal length are automatically adjusted using components such as LED light sources and high-definition cameras, which solves the problem of the inability to finely detect internal defects of the chip in the existing technology, and achieves high-precision automated detection.
Patent Information
- Application Number
- CN202510495367.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2025-07-08
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing integrated circuit chip defect detection methods cannot finely detect cracks, holes and contamination inside the chip, and rely on low manual recognition accuracy, resulting in insufficient detection accuracy.
It adopts high-precision integrated circuit chip defect optical detection equipment, including detection support plate, lift adjustment mechanism, adjustment clamping mechanism, distance focusing mechanism and PLC controller, providing uniform light through LED light source, high-definition camera and electron microscope cooperate to automatically adjust the chip position and focal length to achieve fine detection.
It realizes fine detection of internal defects of integrated circuit chips, improves detection accuracy, reduces manual operation, and can automatically adjust the chip position and focal length, capture high-definition images, and detects tiny defects.
Smart Images
Figure CN120275413A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of integrated circuit chip defect detection, and specifically provides a high-precision optical detection device and method for integrated circuit chip defects. Background Technique
[0002] A high-precision integrated circuit chip refers to an integrated circuit with extremely high precision and reliability in design, manufacturing, testing, and application. Such chips are usually used in fields with extremely strict performance requirements, such as aerospace, military, medical equipment, and high-performance computing. After processing such high-precision integrated circuit chips, it is necessary to detect their defects.
[0003] For the existing integrated circuit chip defect detection, only the cooperation of a camera and a microscope is used to magnify and capture a high-definition image of the surface of the integrated circuit chip, and the high-definition image of the integrated circuit chip is identified manually to judge the quality of the integrated circuit chip. This integrated circuit chip defect detection method can only detect the defects on the surface of the integrated circuit chip, but cannot finely detect the cracks, holes, and contaminations inside the integrated circuit chip. Moreover, the accuracy of human eye recognition is relatively low, and it is easy to miss the defect detection of the integrated circuit chip, thus reducing the accuracy of the integrated circuit chip defect detection. Summary of the Invention
[0004] The purpose of the present invention is to provide a high-precision optical detection device and method for integrated circuit chip defects to solve the problems raised in the above background technique.
[0005] To solve the above technical problems, the present invention provides the following technical solution: A high-precision optical detection device and method for integrated circuit chip defects, including a detection support plate. A lifting and adjusting mechanism is jointly arranged below and above the detection support plate. An adjusting and clamping mechanism is arranged above the lifting and adjusting mechanism. A distance focusing mechanism is arranged above the detection support plate. The lifting and adjusting mechanism includes an installation cylinder. The upper surface of the installation cylinder is fixedly connected to the bottom surface of the detection support plate. A lifting hydraulic rod is fixedly connected to the inner bottom wall of the installation cylinder. The telescopic end of the lifting hydraulic rod is fixedly connected to an LED light source. A detection table plate is fixedly connected to the outer surface of the LED light source. A detection transparent smooth plate is fixedly connected to the upper surface of the LED light source. The outer surface of the detection transparent smooth plate is fixedly connected to the inner wall of the detection table plate;
[0006] The adjustment clamping mechanism includes two horizontal electric telescopic rods. The bottom surface of each horizontal electric telescopic rod is fixedly connected to the upper surface of the detection table board. The telescopic end of each horizontal electric telescopic rod is fixedly connected with an L-shaped sliding plate. The bottom surface of each L-shaped sliding plate is in contact with the upper surface of the detection table board. The inner bottom wall of each L-shaped sliding plate is fixedly connected with a vertical electric telescopic rod. The telescopic end of each vertical electric telescopic rod is fixedly connected with a clamping plate. The bottom surface of each clamping plate is in contact with the upper surface of the detection transparent smooth plate. Above the detection transparent smooth plate, there is a chip to be detected. The two sides of the chip to be detected are respectively in contact with the mutually approaching side surfaces of the two clamping plates;
[0007] The distance focusing mechanism includes two groups of fixed columns. The bottom end of each group of fixed columns is fixedly connected to the upper surface of the detection support plate. The tops of the two groups of fixed columns are jointly fixedly connected with a mounting frame. The inner wall of the mounting frame is fixedly connected with an adjustment telescopic rod. The telescopic end of the adjustment telescopic rod is fixedly connected with a high-definition camera. The bottom surface of the high-definition camera is fixedly connected with an electron microscope. Display screens are arranged on the front and back of the electron microscope. Two PLC controllers are fixedly connected to the upper surface of the detection support plate. The two display screens are respectively connected to the two PLC controllers through wires for data connection. The lifting hydraulic rod, the LED light source, each horizontal electric telescopic rod, each vertical electric telescopic rod, the adjustment telescopic rod, the high-definition camera and the electron microscope are all connected to the two PLC controllers through wires for signal connection.
[0008] Preferably, the bottom surface of the detection support plate is fixedly connected with two groups of support legs. The bottom end of each group of support legs is fixedly connected with a support bottom plate.
[0009] The support structure composed of the two groups of support legs and the support bottom plate can stably support the device at the required position.
[0010] Preferably, the inner wall of the detection support plate is fixedly connected with two groups of stabilizing cylinders. The upper surface of each group of stabilizing cylinders is in contact with the bottom surface of the detection table board. The bottom surface of the detection table board is fixedly connected with two groups of stabilizing sliding columns. The two groups of stabilizing sliding columns are respectively slidably connected inside the two groups of stabilizing cylinders.
[0011] By sliding the stabilizing sliding columns inside the stabilizing cylinders, the up-and-down sliding of the detection table board can be limited, thereby improving the sliding stability of the detection table board.
[0012] Preferably, the telescopic end of the lifting hydraulic rod is fixedly connected with a reinforcing ring. The upper surface of the reinforcing ring is fixedly connected with the bottom surface of the LED light source.
[0013] Use a reinforcement ring to fix it at the connection between the telescopic end of the lifting hydraulic rod and the LED light source, thereby improving the lifting stability of the LED light source.
[0014] Preferably, two sets of limit sliding grooves are opened on the upper surface of the detection table board, and two limit sliding bars are fixedly connected to the bottom surface of each L-shaped sliding plate. The two sets of limit sliding bars are respectively slidably connected inside the two sets of limit sliding grooves.
[0015] By using the limit sliding bars to slide in the limit sliding grooves, it is possible to conveniently limit the sliding of the L-shaped sliding plate along the upper surface of the detection table board, so that the L-shaped sliding plate can stably slide on the detection table board.
[0016] Preferably, heat dissipation through grooves arranged in an equidistant circular pattern are opened on the outer surface of the installation cylinder, and there are at least two sets of the heat dissipation through grooves.
[0017] By opening heat dissipation through grooves on the outer surface of the installation cylinder, it is possible to dissipate the heat generated by the lifting hydraulic rod working inside the installation cylinder, thereby improving the working environment of the lifting hydraulic rod.
[0018] Preferably, a reinforcement frame is fixedly connected to the outer surface of each set of fixed columns, and the upper surface of each reinforcement frame is fixedly connected to the bottom surface of the installation frame.
[0019] Use the reinforcement frame to fix it between the fixed column and the installation frame, thereby improving the connection stability between the fixed column and the installation frame.
[0020] Preferably, control boards are fixedly connected to the mutually remote side surfaces of the two reinforcement frames, the bottom surface of each control board is fixedly connected to the upper surface of the detection support board, and the mutually close side surfaces of the two display screens and the mutually close side surfaces of the two PLC controllers are respectively fixedly connected to the mutually remote side surfaces of the two control boards.
[0021] Through the control board, the display screen and the PLC controller can be installed on both sides, so that it is convenient to use the PLC controller to control the device.
[0022] Preferably, two sets of fixed lamp seats are fixedly connected to the bottom surface of the high-definition camera, and lighting lamps are respectively clamped inside each set of fixed lamp seats.
[0023] By installing the lighting lamp inside the fixed lamp seat, it is convenient to use the light emitted by the lighting lamp to illuminate the surface of the chip to be detected.
[0024] A detection method for a high-precision integrated circuit chip defect optical detection device includes the following steps:
[0025] S1: During use, first connect the lifting hydraulic rod and the LED light source to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the support structure composed of two sets of support legs and the support base plate to enable the device to be stably supported at the required position. Through the mounting cylinder fixed to the bottom surface of the detection support plate, the lifting hydraulic rod is installed on the inner wall of the mounting cylinder. By using the heat dissipation through grooves opened on the outer surface of the mounting cylinder, the heat generated by the operation of the lifting hydraulic rod in the mounting cylinder can be dissipated, thereby improving the working environment of the lifting hydraulic rod. Thus, it is convenient to drive the LED light source to move up and down by controlling the power supply of the lifting hydraulic rod. The reinforcement ring is fixed at the connection between the telescopic end of the lifting hydraulic rod and the LED light source, thereby improving the lifting stability of the LED light source. Thus, the height of the detection table plate fixed outside the LED light source can be adjusted. By sliding the stable slide bar inside the stable cylinder, the up-and-down sliding of the detection table plate can be limited, thereby improving the sliding stability of the detection table plate. A detection transparent smooth plate is fixed on the LED light source, which can facilitate clamping the chip to be detected onto the detection transparent smooth plate. Using the LED light source to provide uniform and high-brightness illumination ensures the clarity of the detection area. By controlling the power supply of the LED light source, light sources of different wavelengths can be used to detect different types of defects of the chip to be detected. Thus, fine detection of cracks, holes, and contamination inside the integrated circuit chip can be performed;
[0026] S2: During use, first connect the horizontal electric telescopic rod and the vertical electric telescopic rod to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the two horizontal electric telescopic rods fixed on the detection table plate to push the L-shaped sliding plate to slide horizontally on the detection table plate. By using the limit slide bar to slide in the limit slide groove, it is convenient to limit the sliding of the L-shaped sliding plate along the upper surface of the detection table plate. Thus, the L-shaped sliding plate can slide stably on the detection table plate. A vertical electric telescopic rod is fixed on the upper surface of the L-shaped sliding plate, which can output vertical power through the vertical electric telescopic rod. Since a clamping plate is fixed at the telescopic end of the vertical electric telescopic rod, it is convenient to use two adjacent clamping plates to clamp the chip to be detected on the detection transparent smooth plate, and it is also convenient to adjust the longitudinal position of the chip to be detected. By controlling the two horizontal electric telescopic rods, it is convenient to adjust the horizontal position of the clamped chip to be detected. Thus, the horizontal position of the chip to be detected can be adjusted conveniently without manual operation;
[0027] S3: During use, first connect the telescopic rod, high-definition camera, electron microscope, display screen, and PLC controller to the power supply. When it is necessary to use this optical detection device to conduct optical detection on the defects of high-precision integrated circuit chips, first use the fixed column and mounting bracket to fix the telescopic rod. Use the reinforcement bracket to fix it between the fixed column and the mounting bracket, thereby improving the connection stability between the fixed column and the mounting bracket, and adjusting the distance between the high-definition camera and the electron microscope and the chip to be detected. Through the control board, the display screen and the PLC controller can be installed on both sides, so that it is convenient to use the PLC controller to control this device. And by controlling this device through the PLC controller, it is convenient to use the cooperation of the high-definition camera and the electron microscope to capture high-definition images and magnify the surface details of the chip to be detected to detect minute defects. By installing the lighting lamp in the fixed lamp holder, it is convenient to illuminate the surface of the chip to be detected with the light emitted by the lighting lamp.
[0028] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:
[0029] First, by providing an adjustment clamping mechanism, the present invention can use two horizontal electric telescopic rods fixed on the detection table board to push the L-shaped sliding plate to slide horizontally on the detection table board. And a vertical electric telescopic rod is fixed on the upper surface of the L-shaped sliding plate, which can output vertical power through the vertical electric telescopic rod. Since a clamping plate is fixed at the telescopic end of the vertical electric telescopic rod, it is convenient to use two adjacent clamping plates to clamp the chip to be detected on the detection transparent smooth plate, and it is also convenient to adjust the vertical position of the chip to be detected. By controlling the two horizontal electric telescopic rods, it is convenient to adjust the horizontal position of the clamped chip to be detected, so that it is convenient to adjust the horizontal position of the chip to be detected without manual operation, and it can accurately detect cracks, holes, and contamination inside the integrated circuit chip.
[0030] Second, through the cooperation of the lifting adjustment mechanism and the distance focusing mechanism provided in the present invention, the lifting hydraulic rod can be installed on the inner wall of the mounting cylinder fixed to the bottom surface of the detection support plate, so that it is convenient to control the power supply of the lifting hydraulic rod, and it is convenient to drive the LED light source to move up and down, thereby adjusting the height of the detection table plate fixed outside the LED light source. A detection transparent smooth plate is fixed on the LED light source, which can facilitate clamping the chip to be detected onto the detection transparent smooth plate. The LED light source provides uniform and high-brightness illumination to ensure the clarity of the detection area. By controlling the power supply of the LED light source, light sources with different wavelengths can be used to detect different types of defects, so as to finely detect cracks, holes, and contaminations inside the integrated circuit chip. The adjustment telescopic rod fixed by the fixed column and the mounting frame is used to adjust the distance between the high-definition camera and the electron microscope and the chip to be detected. And through the PLC controller to control the equipment, it is convenient to use the cooperation of the high-definition camera and the electron microscope to capture high-definition images, and to magnify the details on the chip surface to detect minute defects, which plays a role in improving the accuracy of the high-precision integrated circuit chip defect optical detection equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 is a perspective view of the detection support plate of the present invention;
[0032] Figure 2 is a perspective view of the lifting hydraulic rod of the present invention;
[0033] Figure 3 is a bottom perspective view of the mounting cylinder of the present invention;
[0034] Figure 4 is a bottom perspective view of the electron microscope of the present invention;
[0035] Figure 5 is a perspective view of the chip to be detected of the present invention;
[0036] Figure 6 is a bottom perspective view of the LED light source of the present invention;
[0037] Figure 7 is a perspective view of the L-shaped sliding plate of the present invention.
[0038] Wherein: 1. Detection support plate; 2. Lifting and adjusting mechanism; 201. Installation cylinder; 202. Lifting hydraulic rod; 203. LED light source; 204. Detection table board; 205. Detection transparent smooth board; 3. Adjusting clamping mechanism; 301. Transverse electric telescopic rod; 302. L-shaped sliding plate; 303. Longitudinal electric telescopic rod; 304. Clamping plate; 305. Chip to be detected; 4. Distance focusing mechanism; 401. Fixed column; 402. Installation frame; 403. Adjusting telescopic rod; 404. High-definition camera; 405. Electron microscope; 406. Display screen; 407. PLC controller; 5. Support leg; 6. Support bottom plate; 7. Lighting lamp; 8. Reinforcing ring; 9. Stabilizing cylinder; 10. Stabilizing sliding column; 11. Limit sliding groove; 12. Limit sliding strip; 13. Reinforcing frame; 14. Control board; 15. Fixed lamp holder; 16. Heat dissipation through groove. Detailed implementation manner
[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0040] Embodiment 1
[0041] Please refer to Figure 1-7, including a detection support plate 1. There is a lifting and adjusting mechanism 2 jointly arranged below and above the detection support plate 1. There is an adjusting clamping mechanism 3 arranged above the lifting and adjusting mechanism 2. There is a distance focusing mechanism 4 arranged above the detection support plate 1. The lifting and adjusting mechanism 2 includes an installation cylinder 201. The upper surface of the installation cylinder 201 is fixedly connected to the bottom surface of the detection support plate 1. The inner bottom wall of the installation cylinder 201 is fixedly connected with a lifting hydraulic rod 202. The telescopic end of the lifting hydraulic rod 202 is fixedly connected with an LED light source 203. The LED light source 203 is made of several very thin doped semiconductor materials. One layer has an excess of electrons, and the other layer forms positively charged holes due to the lack of electrons. When an electric current passes through, the electrons and holes combine with each other and release energy, thereby emitting light. The outer surface of the LED light source 203 is fixedly connected with a detection table plate 204. The upper surface of the LED light source 203 is fixedly connected with a detection transparent smooth plate 205. The outer surface of the detection transparent smooth plate 205 is fixedly connected with the inner wall of the detection table plate 204. By setting the lifting and adjusting mechanism 2, the lifting hydraulic rod 202 can be installed on the inner wall of the installation cylinder 201 through the installation cylinder 201 fixed to the bottom surface of the detection support plate 1, so that it is convenient to drive the LED light source 203 to move up and down by controlling the power supply of the lifting hydraulic rod 202, thereby adjusting the height of the detection table plate 204 fixed to the outside of the LED light source 203. And by fixing the detection transparent smooth plate 205 on the LED light source 203, it is convenient to clamp the chip 305 to be detected on the detection transparent smooth plate 205, and use the LED light source 203 to provide uniform and high-brightness illumination to ensure the clarity of the detection area. By controlling the power supply of the LED light source 203, light sources with different wavelengths can be used to detect different types of defects of the chip 305 to be detected, so as to finely detect the cracks, holes and contaminations inside the integrated circuit chip, and play a role in improving the accuracy of the high-precision integrated circuit chip defect optical detection device.
[0042] Two groups of support legs 5 are fixedly connected to the bottom surface of the detection support plate 1. The bottom end of each group of support legs 5 is fixedly connected with a support bottom plate 6. The support structure composed of the two groups of support legs 5 and the support bottom plate 6 can stably support the device at the required position.
[0043] Two groups of stabilizing cylinders 9 are fixedly connected to the inner wall of the detection support plate 1. The upper surface of each group of stabilizing cylinders 9 is in contact with the bottom surface of the detection table plate 204. Two groups of stabilizing sliding columns 10 are fixedly connected to the bottom surface of the detection table plate 204. The two groups of stabilizing sliding columns 10 are respectively slidably connected to the inside of the two groups of stabilizing cylinders 9. By sliding the stabilizing sliding columns 10 inside the stabilizing cylinders 9, the up and down sliding of the detection table plate 204 can be limited, thereby improving the sliding stability of the detection table plate 204.
[0044] The telescopic end of the lifting hydraulic rod 202 is fixedly connected with a reinforcing ring 8, and the upper surface of the reinforcing ring 8 is fixedly connected with the bottom surface of the LED light source 203. By using the reinforcing ring 8, the connection between the telescopic end of the lifting hydraulic rod 202 and the LED light source 203 is fixed, thereby improving the lifting stability of the LED light source 203.
[0045] The outer surface of the mounting cylinder 201 is provided with heat dissipation through grooves 16 arranged in an equidistant circular pattern. There are at least two groups of heat dissipation through grooves 16. By providing the heat dissipation through grooves 16 on the outer surface of the mounting cylinder 201, the heat generated by the operation of the lifting hydraulic rod 202 inside the mounting cylinder 201 can be dissipated, thereby improving the working environment of the lifting hydraulic rod 202.
[0046] The specific implementation manner of this embodiment is as follows: When in use, first connect the lifting hydraulic rod 202 and the LED light source 203 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the support structure composed of two support legs 5 and a support base plate 6 to stably support the device at the required position. Through the mounting cylinder 201 fixed to the bottom surface of the detection support plate 1, the lifting hydraulic rod 202 is installed on the inner wall of the mounting cylinder 201. By providing the heat dissipation through grooves 16 on the outer surface of the mounting cylinder 201, the heat generated by the operation of the lifting hydraulic rod 202 inside the mounting cylinder 201 can be dissipated, thereby improving the working environment of the lifting hydraulic rod 202. Thus, it is convenient to drive the LED light source 203 to move up and down by controlling the power supply of the lifting hydraulic rod 202. By using the reinforcing ring 8, the connection between the telescopic end of the lifting hydraulic rod 202 and the LED light source 203 is fixed, thereby improving the lifting stability of the LED light source 203. Thus, the height of the detection table plate 204 fixed outside the LED light source 203 can be adjusted. By sliding the stable sliding column 10 inside the stable cylinder 9, the up and down sliding of the detection table plate 204 can be limited, thereby improving the sliding stability of the detection table plate 204. And a detection transparent smooth plate 205 is fixed on the LED light source 203, which can facilitate clamping the chip 305 to be detected onto the detection transparent smooth plate 205. By using the LED light source 203 to provide uniform and high-brightness light, the clarity of the detection area is ensured. By controlling the power supply of the LED light source 203, light sources of different wavelengths can be used to detect different types of defects of the chip 305 to be detected, thereby enabling fine detection of cracks, holes, and contaminants inside the integrated circuit chip.
[0047] Embodiment Two
[0048] Please refer to Figure 1-7, the adjustment clamping mechanism 3 includes two transverse electric telescopic rods 301. The bottom surface of each transverse electric telescopic rod 301 is fixedly connected to the upper surface of the detection table plate 204. The telescopic end of each transverse electric telescopic rod 301 is fixedly connected with an L-shaped sliding plate 302. The bottom surface of each L-shaped sliding plate 302 is in contact with the upper surface of the detection table plate 204. The inner bottom wall of each L-shaped sliding plate 302 is fixedly connected with a longitudinal electric telescopic rod 303. The telescopic end of each longitudinal electric telescopic rod 303 is fixedly connected with a clamping plate 304. The bottom surface of each clamping plate 304 is in contact with the upper surface of the detection transparent smooth plate 205. Above the detection transparent smooth plate 205, there is a chip to be detected 305. The two side surfaces of the two clamping plates 304 close to each other are respectively in contact with the two side surfaces of the chip to be detected 305. By setting the adjustment clamping mechanism 3, the two transverse electric telescopic rods 301 fixed on the detection table plate 204 can be used to push the L-shaped sliding plate 302 to slide horizontally on the detection table plate 204. And a longitudinal electric telescopic rod 303 is fixed on the upper surface of the L-shaped sliding plate 302, which can output longitudinal power through the longitudinal electric telescopic rod 303. Since the clamping plate 304 is fixed at the telescopic end of the longitudinal electric telescopic rod 303, it is convenient to clamp the chip to be detected 305 on the detection transparent smooth plate 205 with the two close clamping plates 304, and it is also convenient to adjust the longitudinal position of the chip to be detected 305. By controlling the two transverse electric telescopic rods 301, it is convenient to adjust the horizontal position of the clamped chip to be detected 305, so that the horizontal position of the chip to be detected 305 can be adjusted conveniently without manual operation, playing a role in accurately detecting cracks, holes and contamination inside the integrated circuit chip.
[0049] Two groups of limit sliding grooves 11 are opened on the upper surface of the detection table plate 204. Two limit sliding strips 12 are fixedly connected to the bottom surface of each L-shaped sliding plate 302. The two groups of limit sliding strips 12 are respectively slidably connected inside the two groups of limit sliding grooves 11. By using the limit sliding strips 12 to slide in the limit sliding grooves 11, it is convenient to limit the sliding of the L-shaped sliding plate 302 along the upper surface of the detection table plate 204, so that the L-shaped sliding plate 302 can slide stably on the detection table plate 204.
[0050] The specific implementation of this embodiment is as follows: When in use, first connect the horizontal electric telescopic rod 301 and the vertical electric telescopic rod 303 to the power supply. When it is necessary to use this optical detection device to perform optical detection on the defects of high-precision integrated circuit chips, first use the two horizontal electric telescopic rods 301 fixed on the detection table plate 204 to push the L-shaped sliding plate 302 to slide horizontally on the detection table plate 204. By using the limit slide bar 12 to slide in the limit chute 11, it is convenient to limit the sliding of the L-shaped sliding plate 302 along the upper surface of the detection table plate 204, so that the L-shaped sliding plate 302 can slide stably on the detection table plate 204. And a vertical electric telescopic rod 303 is fixed on the upper surface of the L-shaped sliding plate 302, which can output vertical power through the vertical electric telescopic rod 303. Since the clamping plate 304 is fixed at the telescopic end of the vertical electric telescopic rod 303, it is convenient to clamp the chip 305 to be detected on the detection transparent smooth plate 205 by using the two adjacent clamping plates 304, and it is also convenient to adjust the vertical position of the chip 305 to be detected. By controlling the two horizontal electric telescopic rods 301, it is convenient to adjust the horizontal position of the clamped chip 305 to be detected, so that the horizontal position of the chip 305 to be detected can be adjusted conveniently without manual operation.
[0051] Embodiment III
[0052] Please refer to Figure 1-7, the distance focusing mechanism 4 includes two groups of fixed columns 401. The bottom end of each group of fixed columns 401 is fixedly connected to the upper surface of the detection support plate 1. The top ends of the two groups of fixed columns 401 are fixedly connected together with a mounting frame 402. The inner wall of the mounting frame 402 is fixedly connected with an adjustment telescopic rod 403. The telescopic end of the adjustment telescopic rod 403 is fixedly connected with a high-definition camera 404. The high-definition camera 404 refers to a camera of HD1080P or HD960P or HD720P. The bottom surface of the high-definition camera 404 is fixedly connected with an electron microscope 405. The electron microscope 405 is an electron instrument that uses an electron beam instead of a light beam to form an image and observes fine structures. Display screens 406 are arranged on both the front and the back of the electron microscope 405. The display screen 406 is a display tool that displays a certain electronic file onto the screen through a specific transmission device and then reflects it into the human eye. Two PLC controllers 407 are fixedly connected to the upper surface of the detection support plate 1. The PLC controller 407 is a digital electronic device with a microprocessor and is a digital logic controller for automatic control. It can load control instructions into the memory for storage and execution at any time. The two display screens 406 are respectively data-connected to the two PLC controllers 407 through wires. The lifting hydraulic rod 202, the LED light source 203, each horizontal electric telescopic rod 301, each vertical electric telescopic rod 303, the adjustment telescopic rod 403, the high-definition camera 404, and the electron microscope 405 are all signal-connected to the two PLC controllers 407 through wires. By setting the distance focusing mechanism 4 and using the adjustment telescopic rod 403 fixed by the fixed columns 401 and the mounting frame 402 to adjust the distance between the high-definition camera 404 and the electron microscope 405 and the chip 305 to be detected, and controlling the device through the PLC controller 407, it is convenient to use the cooperation of the high-definition camera 404 and the electron microscope 405 to capture high-definition images, magnify the surface details of the chip 305 to be detected, detect minute defects, and play a role in improving the accuracy of the high-precision integrated circuit chip defect optical detection device.
[0053] Reinforcing frames 13 are fixedly connected to the outer surfaces of each group of fixed columns 401. The upper surface of each reinforcing frame 13 is fixedly connected to the bottom surface of the mounting frame 402. By using the reinforcing frames 13 to be fixed between the fixed columns 401 and the mounting frame 402, the connection stability between the fixed columns 401 and the mounting frame 402 is improved.
[0054] On one side of the two reinforcing frames 13 that are far away from each other, a control board 14 is fixedly connected. The bottom surface of each control board 14 is fixedly connected to the upper surface of the detection support plate 1. One side surface of the two display screens 406 that are close to each other and one side surface of the two PLC controllers 407 that are close to each other are fixedly connected to one side surface of the two control boards 14 that are far away from each other. Through the control board 14, the display screen 406 and the PLC controller 407 can be installed on both sides, so that it is convenient to use the PLC controller 407 to control the device.
[0055] Two groups of fixed lamp holders 15 are fixedly connected to the bottom surface of the high-definition camera 404. Each group of fixed lamp holders 15 is internally clamped with a lighting lamp 7. The lighting lamp 7 is a lighting appliance, generally referring to appliances that can illuminate. By installing the lighting lamp 7 into the fixed lamp holder 15, it is convenient to use the light emitted by the lighting lamp 7 to illuminate the surface of the detected chip 305.
[0056] The specific implementation manner of this embodiment is as follows: When in use, first connect the adjusting telescopic rod 403, the high-definition camera 404, the electron microscope 405, the display screen 406 and the PLC controller 407 to the power supply. When it is necessary to use this optical detection device to perform optical detection on the defects of high-precision integrated circuit chips, first use the adjusting telescopic rod 403 fixed by the fixed column 401 and the mounting bracket 402. Use the reinforcing frame 13 to be fixed between the fixed column 401 and the mounting bracket 402, so as to improve the connection stability between the fixed column 401 and the mounting bracket 402, and adjust the distance between the high-definition camera 404 and the electron microscope 405 and the detected chip 305. Through the control board 14, the display screen 406 and the PLC controller 407 can be installed on both sides, so that it is convenient to use the PLC controller 407 to control the device. And by controlling the device through the PLC controller 407, it is convenient to use the cooperation of the high-definition camera 404 and the electron microscope 405 to capture high-definition images and magnify the details on the surface of the detected chip 305 to detect minute defects. By installing the lighting lamp 7 into the fixed lamp holder 15, it is convenient to use the light emitted by the lighting lamp 7 to illuminate the surface of the detected chip 305.
[0057] A detection method for an optical detection device for defects of high-precision integrated circuit chips includes the following steps:
[0058] S1: During use, first connect the lifting hydraulic rod 202 and the LED light source 203 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the support structure composed of two groups of support legs 5 and the support bottom plate 6 to enable the device to be stably supported at the required position. Through the mounting cylinder 201 fixed to the bottom surface of the detection support plate 1, the lifting hydraulic rod 202 is installed on the inner wall of the mounting cylinder 201. By using the heat dissipation through groove 16 opened on the outer surface of the mounting cylinder 201, the heat generated by the operation of the lifting hydraulic rod 202 in the mounting cylinder 201 can be dissipated, thereby improving the working environment of the lifting hydraulic rod 202. Thus, it is convenient to drive the LED light source 203 to move up and down by controlling the power supply of the lifting hydraulic rod 202. The reinforcement ring 8 is fixed at the connection between the telescopic end of the lifting hydraulic rod 202 and the LED light source 203, thereby improving the lifting stability of the LED light source 203. Thus, the height of the fixed detection table plate 204 outside the LED light source 203 can be adjusted. By sliding the stable slide column 10 inside the stable cylinder 9, the up and down sliding of the detection table plate 204 can be limited, thereby improving the sliding stability of the detection table plate 204. A detection transparent smooth plate 205 is fixed on the LED light source 203, which can facilitate clamping the chip 305 to be detected onto the detection transparent smooth plate 205. By using the LED light source 203 to provide uniform and high-brightness illumination, the clarity of the detection area is ensured. By controlling the power supply of the LED light source 203, light sources of different wavelengths can be used to detect different types of defects of the chip 305 to be detected, thereby enabling fine detection of cracks, holes, and contamination inside the integrated circuit chip;
[0059] S2: When in use, first connect the horizontal electric telescopic rod 301 and the vertical electric telescopic rod 303 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the two horizontal electric telescopic rods 301 fixed on the detection table 204 to push the L-shaped sliding plate 302 to slide horizontally on the detection table 204. By using the limit slide bar 12 to slide in the limit chute 11, it is convenient to limit the sliding of the L-shaped sliding plate 302 along the upper surface of the detection table 204, so that the L-shaped sliding plate 302 can slide stably on the detection table 204. And a vertical electric telescopic rod 303 is fixed on the upper surface of the L-shaped sliding plate 302, which can output longitudinal power through the vertical electric telescopic rod 303. Since the clamping plate 304 is fixed at the telescopic end of the vertical electric telescopic rod 303, it is convenient to clamp the chip 305 to be detected on the detection transparent smooth plate 205 by using the two adjacent clamping plates 304, and it is also convenient to adjust the longitudinal position of the chip 305 to be detected. By controlling the two horizontal electric telescopic rods 301, it is convenient to adjust the horizontal position of the chip 305 to be clamped, so that the horizontal position of the chip 305 to be detected can be adjusted conveniently without manual operation;
[0060] S3: When in use, first connect the adjustment telescopic rod 403, the high-definition camera 404, the electron microscope 405, the display screen 406 and the PLC controller 407 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the adjustment telescopic rod 403 fixed by the fixed column 401 and the mounting bracket 402, and use the reinforcement bracket 13 to fix it between the fixed column 401 and the mounting bracket 402, so as to improve the connection stability between the fixed column 401 and the mounting bracket 402, and adjust the distance between the high-definition camera 404 and the electron microscope 405 and the chip 305 to be detected. Through the control board 14, the display screen 406 and the PLC controller 407 can be installed on both sides, so that it is convenient to use the PLC controller 407 to control this device. And by controlling this device through the PLC controller 407, it is convenient to use the cooperation of the high-definition camera 404 and the electron microscope 405 to capture high-definition images and magnify the surface details of the chip 305 to be detected to detect tiny defects. By installing the lighting lamp 7 in the fixed lamp holder 15, it is convenient to illuminate the surface of the chip 305 to be detected with the light emitted by the lighting lamp 7.
[0061] The working principle of the present invention is as follows: When in use, first connect the lifting hydraulic rod 202 and the LED light source 203 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the support structure composed of two groups of support legs 5 and the support bottom plate 6 to enable the device to be stably supported at the required position. Through the mounting cylinder 201 fixed to the bottom surface of the detection support plate 1, the lifting hydraulic rod 202 is installed on the inner wall of the mounting cylinder 201. By providing heat dissipation through grooves 16 on the outer surface of the mounting cylinder 201, the heat generated by the operation of the lifting hydraulic rod 202 in the mounting cylinder 201 can be dissipated, thereby improving the working environment of the lifting hydraulic rod 202. Thus, it is convenient to drive the LED light source 203 to move up and down by controlling the power supply of the lifting hydraulic rod 202. The reinforcement ring 8 is fixed at the connection between the telescopic end of the lifting hydraulic rod 202 and the LED light source 203, thereby improving the lifting stability of the LED light source 203. Thus, the height of the fixed detection table plate 204 outside the LED light source 203 can be adjusted. By sliding the stable sliding column 10 inside the stable cylinder 9, the up and down sliding of the detection table plate 204 can be limited, thereby improving the sliding stability of the detection table plate 204. A detection transparent smooth plate 205 is fixed on the LED light source 203, which can facilitate clamping the chip to be detected 305 onto the detection transparent smooth plate 205. Using the LED light source 203 to provide uniform high-brightness light ensures the clarity of the detection area. By controlling the power supply of the LED light source 203, light sources of different wavelengths can be used to detect different types of defects of the chip to be detected 305, thereby enabling fine detection of cracks, holes, and contamination inside the integrated circuit chip. When in use, first connect the transverse electric telescopic rod 301 and the longitudinal electric telescopic rod 303 to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the two transverse electric telescopic rods 301 fixed on the detection table plate 204 to push the L-shaped sliding plate 302 to slide horizontally on the detection table plate 204. By sliding the limit slide bar 12 in the limit slide groove 11, it is convenient to limit the sliding of the L-shaped sliding plate 302 along the upper surface of the detection table plate 204, thereby enabling the L-shaped sliding plate 302 to slide stably on the detection table plate 204. A longitudinal electric telescopic rod 303 is fixed on the upper surface of the L-shaped sliding plate 302, which can output longitudinal power through the longitudinal electric telescopic rod 303. Since the clamping plate 304 is fixed at the telescopic end of the longitudinal electric telescopic rod 303, it is convenient to clamp the chip to be detected 305 on the detection transparent smooth plate 205 with two adjacent clamping plates 304, and it is also convenient to adjust the longitudinal position of the chip to be detected 305. By controlling the two transverse electric telescopic rods 301, it is convenient to adjust the transverse position of the clamped chip to be detected 305, thereby enabling convenient adjustment of the horizontal position of the chip to be detected 305 without manual operation. When in use,First, connect the telescopic rod 403, high-definition camera 404, electron microscope 405, display screen 406, and PLC controller 407 to the power supply. When it is necessary to use this optical detection device to perform optical detection on the defects of high-precision integrated circuit chips, first use the telescopic rod 403 fixed by the fixed column 401 and the mounting bracket 402. Use the reinforcement bracket 13 to fix it between the fixed column 401 and the mounting bracket 402, so as to improve the connection stability between the fixed column 401 and the mounting bracket 402, and adjust the distances between the high-definition camera 404 and the electron microscope 405 and the chip 305 to be detected. Through the control board 14, the display screen 406 and the PLC controller 407 can be installed on both sides, so that it is convenient to use the PLC controller 407 to control this device. And by controlling this device through the PLC controller 407, it is convenient to use the cooperation of the high-definition camera 404 and the electron microscope 405 to capture high-definition images, and to magnify the surface details of the chip 305 to be detected to detect minute defects. By installing the lighting lamp 7 into the fixed lamp socket 15, it is convenient to use the light emitted by the lighting lamp 7 to illuminate the surface of the chip 305 to be detected.,
[0062] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.
[0063] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. An optical detection device for defects of high-precision integrated circuit chips, including a detection support plate (1), characterized in that: A lifting and adjusting mechanism (2) is jointly arranged below and above the detection support plate (1). An adjusting and clamping mechanism (3) is arranged above the lifting and adjusting mechanism (2). A distance focusing mechanism (4) is arranged above the detection support plate (1). The lifting and adjusting mechanism (2) includes an installation cylinder (201). The upper surface of the installation cylinder (201) is fixedly connected to the bottom surface of the detection support plate (1). A lifting hydraulic rod (202) is fixedly connected to the inner bottom wall of the installation cylinder (201). The telescopic end of the lifting hydraulic rod (202) is fixedly connected to an LED light source (203). A detection table plate (204) is fixedly connected to the outer surface of the LED light source (203). A detection transparent and smooth plate (205) is fixedly connected to the upper surface of the LED light source (203). The outer surface of the detection transparent and smooth plate (205) is fixedly connected to the inner wall of the detection table plate (204); The adjusting and clamping mechanism (3) includes two transverse electric telescopic rods (301). The bottom surface of each transverse electric telescopic rod (301) is fixedly connected to the upper surface of the detection table plate (204). The telescopic end of each transverse electric telescopic rod (301) is fixedly connected to an L-shaped sliding plate (302). The bottom surface of each L-shaped sliding plate (302) is in contact with the upper surface of the detection table plate (204). A longitudinal electric telescopic rod (303) is fixedly connected to the inner bottom wall of each L-shaped sliding plate (302). The telescopic end of each longitudinal electric telescopic rod (303) is fixedly connected to a clamping plate (304). The bottom surface of each clamping plate (304) is in contact with the upper surface of the detection transparent and smooth plate (205). A chip to be detected (305) is arranged above the detection transparent and smooth plate (205). The two clamping plates (304) are respectively in contact with the two side surfaces of the chip to be detected (305) on the side where they face each other; The distance focusing mechanism (4) includes two groups of fixed columns (401). The bottom end of each group of fixed columns (401) is fixedly connected to the upper surface of the detection support plate (1). The top ends of the two groups of fixed columns (401) are jointly fixedly connected to a mounting frame (402). The inner wall of the mounting frame (402) is fixedly connected to an adjustment telescopic rod (403). The telescopic end of the adjustment telescopic rod (403) is fixedly connected to a high-definition camera (404). The bottom surface of the high-definition camera (404) is fixedly connected to an electron microscope (405). Display screens (406) are arranged on the front and back of the electron microscope (405). Two PLC controllers (407) are fixedly connected to the upper surface of the detection support plate (1). The two display screens (406) are respectively connected to the two PLC controllers (407) through wires for data connection. The lifting hydraulic rod (202), the LED light source (203), each horizontal electric telescopic rod (301), each vertical electric telescopic rod (303), the adjustment telescopic rod (403), the high-definition camera (404), and the electron microscope (405) are all connected to the two PLC controllers (407) through wires for signal connection.
2. The optical detection device for defects of a high-precision integrated circuit chip according to claim 1, wherein: Two groups of support legs (5) are fixedly connected to the bottom surface of the detection support plate (1). The bottom end of each group of support legs (5) is fixedly connected to a support bottom plate (6).
3. The optical detection device for defects of a high-precision integrated circuit chip according to claim 1, wherein: Two groups of stable cylinders (9) are fixedly connected to the inner wall of the detection support plate (1). The upper surface of each group of stable cylinders (9) is in contact with the bottom surface of the detection table plate (204). Two groups of stable sliding columns (10) are fixedly connected to the bottom surface of the detection table plate (204). The two groups of stable sliding columns (10) are respectively slidably connected to the inside of the two groups of stable cylinders (9).
4. The optical defect detection device for high-precision integrated circuit chips according to claim 1, wherein: The telescopic end of the lifting hydraulic rod (202) is fixedly connected to a reinforcement ring (8). The upper surface of the reinforcement ring (8) is fixedly connected to the bottom surface of the LED light source (203).
5. An optical defect detection device for high-precision integrated circuit chips according to claim 1, characterized in that: Two groups of limit sliding grooves (11) are formed on the upper surface of the detection table plate (204). Two limit sliding strips (12) are fixedly connected to the bottom surface of each L-shaped sliding plate (302). The two groups of limit sliding strips (12) are respectively slidably connected to the inside of the two groups of limit sliding grooves (11).
6. The optical detection device for defects of a high-precision integrated circuit chip according to claim 1, characterized in that: Heat dissipation through grooves (16) arranged in an equidistant circular arrangement are formed on the outer surface of the installation cylinder (201). There are at least two groups of the heat dissipation through grooves (16).
7. An optical detection device for defects of a high-precision integrated circuit chip according to claim 1, characterized in that: A reinforcement frame (13) is fixedly connected to the outer surface of each group of fixed columns (401). The upper surface of each reinforcement frame (13) is fixedly connected to the bottom surface of the mounting frame (402).
8. An optical defect detection device for high-precision integrated circuit chips according to claim 7, characterized in that: Control plates (14) are fixedly connected to the mutually remote side surfaces of the two reinforcement frames (13). The bottom surface of each control plate (14) is fixedly connected to the upper surface of the detection support plate (1). The mutually close side surfaces of the two display screens (406) and the mutually close side surfaces of the two PLC controllers (407) are respectively fixedly connected to the mutually remote side surfaces of the two control plates (14).
9. The optical detection device for defects of a high-precision integrated circuit chip according to claim 1, characterized in that: The bottom surface of the high-definition camera (404) is fixedly connected with two groups of fixed lamp holders (15), and each group of fixed lamp holders (15) is internally clamped with a lighting lamp (7).
10. The detection method of an optical detection device for defects of a high-precision integrated circuit chip according to any one of claims 1-9, characterized in that: Specifically, it includes the following steps: S1: During use, first connect the lifting hydraulic rod (202) and the LED light source (203) to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the support structure composed of two groups of support legs (5) and the support bottom plate (6) to stably support the device at the required position. Through the mounting cylinder (201) fixed to the bottom surface of the detection support plate (1), the lifting hydraulic rod (202) is installed on the inner wall of the mounting cylinder (201). By using the heat dissipation through grooves (16) opened on the outer surface of the mounting cylinder (201), the heat generated by the operation of the lifting hydraulic rod (202) in the mounting cylinder (201) can be dissipated, thereby improving the working environment of the lifting hydraulic rod (202). Thus, it is convenient to drive the LED light source (203) to move up and down by controlling the power supply of the lifting hydraulic rod (202). The reinforcing ring (8) is fixed at the connection between the telescopic end of the lifting hydraulic rod (202) and the LED light source (203), thereby improving the lifting stability of the LED light source (203). Thus, the height of the fixed detection table plate (204) outside the LED light source (203) can be adjusted. By sliding the stable slide column (10) inside the stable cylinder (9), the up and down sliding of the detection table plate (204) can be limited, thereby improving the sliding stability of the detection table plate (204). A detection transparent smooth plate (205) is fixed on the LED light source (203), which can facilitate clamping the chip to be detected (305) onto the detection transparent smooth plate (205). Using the LED light source (203) to provide uniform and high-brightness illumination ensures the clarity of the detection area. By controlling the power supply of the LED light source (203), light sources of different wavelengths can be used to detect different types of defects of the chip to be detected (305). Thus, fine detection of cracks, holes, and contamination inside the integrated circuit chip can be carried out; S2: During use, first connect the horizontal electric telescopic rod (301) and the vertical electric telescopic rod (303) to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the two horizontal electric telescopic rods (301) fixed on the detection table board (204) to push the L-shaped sliding plate (302) to slide horizontally on the detection table board (204). By using the limit slide bar (12) to slide in the limit slide groove (11), it is convenient to limit the sliding of the L-shaped sliding plate (302) along the upper surface of the detection table board (204), so that the L-shaped sliding plate (302) can slide stably on the detection table board (204). And a vertical electric telescopic rod (303) is fixed on the upper surface of the L-shaped sliding plate (302), which can output longitudinal power through the vertical electric telescopic rod (303). Since the clamping plate (304) is fixed at the telescopic end of the vertical electric telescopic rod (303), it is convenient to use the two adjacent clamping plates (304) to clamp the chip to be detected (305) on the detection transparent smooth plate (205), and it is also convenient to adjust the longitudinal position of the chip to be detected (305). By controlling the two horizontal electric telescopic rods (301), it is convenient to adjust the horizontal position of the clamped chip to be detected (305), so that the horizontal position of the chip to be detected (305) can be adjusted conveniently without manual operation; S3: During use, first connect the adjustment telescopic rod (403), the high-definition camera (404), the electron microscope (405), the display screen (406) and the PLC controller (407) to the power supply. When it is necessary to use this optical detection device to optically detect the defects of high-precision integrated circuit chips, first use the adjustment telescopic rod (403) fixed by the fixed column (401) and the mounting bracket (402), and use the reinforcement bracket (13) to be fixed between the fixed column (401) and the mounting bracket (402), so as to improve the connection stability between the fixed column (401) and the mounting bracket (402), and adjust the distance between the high-definition camera (404) and the electron microscope (405) and the chip to be detected (305). Through the control board (14), the display screen (406) and the PLC controller (407) can be installed on both sides, so that it is convenient to use the PLC controller (407) to control this device. And by controlling this device through the PLC controller (407), it is convenient to use the cooperation of the high-definition camera (404) and the electron microscope (405) to capture high-definition images and magnify the surface details of the chip to be detected (305) to detect minute defects. By installing the lighting lamp (7) into the fixed lamp holder (15), it is convenient to use the light emitted by the lighting lamp (7) to illuminate the surface of the chip to be detected (305).