Power battery welding spot detection method, system and equipment

Abstract

The invention belongs to the technical field of welding, and particularly relates to tracking of welding seams, in particular to a power battery welding spot detection method, system and equipment, and the power battery welding spot detection method comprises the steps that a control module obtains the sizes of all welding spots through image recognition and obtains the positions of the welding spots; a detection path is constructed through a control module according to the position of the welding spot, and a corresponding probe is selected according to the size of the welding spot; the control module controls the probe to move according to the detection path so as to detect all the welding spots; the method for obtaining the positions of the welding spots comprises the steps that a coordinate system is constructed through a control module, projections of all the welding spots are located in a first quadrant of the coordinate system, coordinates of all the welding spots in the coordinate system are obtained, all the welding spots are detected according to a detection path, all the welding spots are detected in order, and the detection accuracy is improved. Repeated detection of the welding spots is avoided, and the detection efficiency of the welding spots is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of welding, and specifically relates to the tracking of weld seams, and more particularly to a method, system and device for detecting solder joints of power batteries. Background Art

[0002] There are various solder joints on power batteries. In the related art, different sizes of solder joints require different probes to be carried and replaced for detection. Moreover, due to the different distributions of solder joints, all solder joints need to be detected during the detection process. Randomly traversing all solder joints will result in too long detection time for all solder joints, leading to low detection efficiency.

[0003] Therefore, due to the technical problems of long detection time and low detection efficiency caused by randomly traversing all solder joints, it is necessary to design a method, system and device for detecting solder joints of power batteries.

[0004] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, the above description is not considered as information of the prior art. Summary of the Invention

[0005] The embodiments of the present disclosure at least provide a method, system and device for detecting solder joints of power batteries.

[0006] In a first aspect, the embodiments of the present disclosure provide a method for detecting solder joints of power batteries, including: The control module obtains the sizes of all solder joints through image recognition, and obtains the positions of the solder joints; The control module constructs a detection path according to the positions of the solder joints, and selects a corresponding probe according to the sizes of the solder joints; The control module controls the movement of the probe according to the detection path to detect all solder joints; wherein The method for obtaining the positions of the solder joints includes: The control module constructs a coordinate system, and the projections of all solder joints are located in the first quadrant of the coordinate system, and obtains the coordinates of all solder joints in the coordinate system.

[0007] In an optional implementation manner, the method for constructing a detection path according to the positions of the solder joints includes: Among the solder joints of the same size, the control module judges the number of center points on the same X-axis and the number of center points on the same Y-axis according to the coordinates of the center points of each solder joint. If the number of center points on the same Y-axis is more than the number of center points on the same X-axis, the detection path is to move in a longitudinal S path starting from the starting point, traverse all solder joints to form a detection path, and the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the X-axis coordinates of the two center points and the smallest distance between the two center points; If the number of center points on the same X-axis is greater than the number of center points on the same Y-axis, the detection path moves in a horizontal S path starting from the starting point, traversing all welding points to form a detection path. The next welding point of the current welding point in this detection path is the one with the smallest difference in the Y-axis coordinates of the center points and the smallest distance between the center points of the two. If the number of center points on the same X-axis is the same as the number of center points on the same Y-axis, the detection path moves in a horizontal S path or a vertical S path starting from the starting point, traversing all welding points to form a detection path. If it moves in a horizontal S path, the next welding point of the current welding point in this detection path is the one with the smallest difference in the Y-axis coordinates of the center points and the smallest distance between the center points of the two. If it moves in a vertical S path, the next welding point of the current welding point in this detection path is the one with the smallest difference in the X-axis coordinates of the center points and the smallest distance between the center points of the two.

[0008] In an optional implementation, if the sizes of all welding points are the same and the size of the welding points is adapted to the probe, the starting point of the detection path corresponding to all welding points is as follows: the control module obtains the vertical distance between the point closest to the Y-axis on each welding point and the Y-axis, and uses the welding point with the shortest distance as the starting point of the detection path. If there are at least two welding points with the shortest distance, the welding point farther from the X-axis among them is used as the starting point.

[0009] In an optional implementation, if there are at least two types of welding points among all welding points and all types of welding points are adapted to the corresponding probes, the control module classifies all welding points according to the types of welding point sizes. Each type of welding point has a corresponding detection path. The control module obtains the distance between the point closest to the Y-axis on each welding point and the Y-axis, and uses the welding point with the shortest distance as the starting point. If there are at least two welding points with the shortest distance, the welding point farther from the X-axis among them is used as the starting point. The detection path corresponding to the type of welding point at the starting point is used as the first detection path. After the end of this detection path, the detection path corresponding to another type of welding point closest to the last welding point of this detection path is used as the next detection path until all detection paths corresponding to all types of welding points are traversed.

[0010] In an optional implementation, when there are several welding points with sizes smaller than the preset minimum size among all welding points, the control module judges the distance between adjacent two welding points among all welding points with sizes smaller than the preset minimum size. If there is a situation where the distance is greater than the preset maximum distance, the control module sends an alarm message. If not, all welding points with sizes smaller than the preset minimum size are used as one welding point for detection, and the remaining other welding points construct the corresponding detection path.

[0011] In an alternative embodiment, when there is a solder joint with a size greater than the preset maximum size among all solder joints, the control module controls the probe corresponding to the preset maximum size of the solder joint to detect the solder joint with a size greater than the preset maximum size. During the detection of the solder joint with a size greater than the preset maximum size, the probe performs an S-shaped scan on the surface of this type of solder joint to cover this type of solder joint, and the control module constructs a detection path corresponding to each size of solder joint to traverse all solder joints.

[0012] In a second aspect, an embodiment of the present disclosure further provides a power battery solder joint detection system, including: An acquisition module configured to acquire the sizes of all solder joints through image recognition and acquire the positions of the solder joints; A path module configured to construct a detection path according to the positions of the solder joints and select a corresponding probe according to the sizes of the solder joints.

[0013] In a third aspect, an embodiment of the present disclosure further provides a computer-readable storage medium, on which a computer program / instructions are stored, and when the computer program / instructions are executed by a processor, the steps of the above-mentioned power battery solder joint detection method are implemented.

[0014] In a fourth aspect, an embodiment of the present disclosure further provides a computer program product, including a computer program / instructions, and when the computer program / instructions are executed by a processor, the steps of the above-mentioned power battery solder joint detection method are implemented.

[0015] In a fifth aspect, an embodiment of the present disclosure further provides a power battery solder joint detection device, including: A control module, and a moving mechanism, a rotating mechanism and probes of several sizes electrically connected to the control module; The rotating mechanism is arranged on the moving mechanism; The probe is arranged on the rotating mechanism, and the control module is adapted to control the rotating mechanism to rotate so that the probe of the corresponding size faces downward; The control module is adapted to control the downward-facing probe to detect the solder joint; The control module is configured to adopt the above-mentioned power battery solder joint detection method to obtain a detection path to control the moving mechanism to drive the rotating mechanism to move, so that the corresponding probe detects the solder joint.

[0016] The beneficial effects of the present invention are as follows. The method for detecting solder joints of the power battery includes: the control module obtains the sizes of all solder joints through image recognition and obtains the positions of the solder joints; the control module constructs a detection path according to the positions of the solder joints and selects corresponding probes according to the sizes of the solder joints; the control module controls the movement of the probes according to the detection path to detect all solder joints; wherein the method for obtaining the positions of the solder joints includes: the control module constructs a coordinate system, the projections of all solder joints are located in the first quadrant of the coordinate system, and the coordinates of all solder joints in the coordinate system are obtained, thereby realizing the detection of all solder joints according to the detection path, detecting all solder joints in an orderly manner, avoiding repeated detection of solder joints, and improving the detection efficiency of solder joints.

[0017] Other features and advantages of the present invention will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structure specifically pointed out in the specification and the drawings.

[0018] To make the above objectives, features, and advantages of the present invention more obvious and understandable, specific preferred embodiments are hereby given, and in conjunction with the accompanying drawings, the following detailed description is provided. Description of the Drawings

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a flowchart of a method for detecting solder joints of a power battery provided by an embodiment of the present disclosure; Figure 2 It is a schematic diagram of longitudinal S-path movement provided by an embodiment of the present disclosure; Figure 3 It is a schematic diagram of transverse S-path movement provided by an embodiment of the present disclosure; Figure 4 It is a schematic diagram of detection paths for two sizes of solder joints provided by an embodiment of the present disclosure; Figure 5 It is a schematic diagram of the distribution of solder joints in the same row and the same column provided by an embodiment of the present disclosure; Figure 6 It is a schematic diagram of the structure of a power battery solder joint detection device provided by an embodiment of the present disclosure.

[0021] In the figure: 1 Rotating mechanism, 2 Connecting piece, 3 Turntable, 4 Probe. Detailed Implementation Modes

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0023] As used herein, phrases such as "in one embodiment", "according to one embodiment", "in some embodiments", etc. generally refer to the fact that the specific features, structures, or characteristics after the phrase can be included in at least one embodiment of the present disclosure. Therefore, the specific features, structures, or characteristics can be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, terms such as "example", "exemplary", etc. are used "as an example, instance, or illustration. Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily construed as being preferred or superior to other embodiments, aspects, or designs. Instead, the use of terms such as "example", "exemplary", etc. is intended to present concepts in a specific manner.

[0024] There are solder joints of various sizes on the power battery. The inventor found that in the related technology, the detection trajectories for detecting the solder joints are chaotic, which will cause many solder joints to be repeatedly passed through, reducing the detection efficiency of the solder joints. Moreover, due to the different sizes of the solder joints, the probes need to be repeatedly switched or replaced during the detection process. The same probe will be repeatedly switched to use, that is, during the detection of solder joints of the same size, the detection of other-sized solder joints will be interspersed, resulting in the repeated switching or replacement of the probe during the detection process, thus making the detection efficiency low.

[0025] Regarding the defects existing in the above solutions, they are all the results obtained by the inventor through practice and careful research. Therefore, the process of discovering the above problems and the solutions proposed in this disclosure by the present disclosure for the above problems should both be the contributions made by the inventor to the present disclosure during the process of the present disclosure.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0027] The following will describe in detail some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0028] As Figure 1As shown, at least one disclosed embodiment provides a method for detecting solder joints of a power battery, including: the control module acquires the sizes of all solder joints through image recognition and acquires the positions of the solder joints; the control module constructs a detection path according to the positions of the solder joints and selects a corresponding probe 4 according to the sizes of the solder joints; the control module controls the movement of the probe 4 according to the detection path to detect all solder joints; wherein the method for acquiring the positions of the solder joints includes: the control module constructs a coordinate system, the projections of all solder joints are located in the first quadrant of the coordinate system, acquires the coordinates of all solder joints in the coordinate system, thereby realizing the detection of all solder joints according to the detection path, detecting all solder joints in an orderly manner, avoiding the repeated detection of solder joints, and improving the detection efficiency of solder joints.

[0029] In this embodiment, the probe 4 can use a high-precision magnetic field sensor to detect the solder joints to obtain a detection curve to judge the welding effect of the solder joints. The high-precision magnetic field sensor can but is not limited to using AK8963; different probes 4 have different detection ranges and can correspond to solder joints of different sizes, so as to use the corresponding probe 4 during the solder joint detection process for more accurate detection.

[0030] In this embodiment, only the corresponding probe 4 is working during the detection process, and the other probes 4 are not working.

[0031] In this embodiment, the size can refer to the shape and area of the solder joint. The same size indicates that the shape and area of the solder joint are both the same.

[0032] In this embodiment, there will be only one size of solder joint in the same detection path, so that only one type of probe 4 will be used in the same detection path, avoiding the increase in detection time caused by the switching or replacement of the probe 4 and avoiding the reduction of detection efficiency.

[0033] In this embodiment, through the construction of the detection path, all solder joints are detected in an orderly manner, avoiding passing through the same solder joint repeatedly and increasing the detection efficiency of the solder joints.

[0034] In this embodiment, when constructing the coordinate system, the side of the power battery with solder joints can be used as the reference plane, and the projections corresponding to all solder joints are in this reference plane. A coordinate system is constructed on this reference plane so that the projections of all solder joints are completely in the first quadrant of the coordinate system, facilitating the calculation of the distance of the solder joints from the Y-axis to more simply determine the starting point of the detection path.

[0035] In an alternative embodiment, the method for constructing the detection path according to the positions of the solder joints includes: as Figure 2As shown, in solder joints of the same size, the control module determines the number of center points on the same X-axis and the number of center points on the same Y-axis according to the coordinates of the center points of each solder joint. If the number of center points on the same Y-axis is greater than the number of center points on the same X-axis, the detection path moves in a longitudinal S path starting from the starting point, traversing all solder joints to form a detection path. The next solder joint of the current solder joint in this detection path is the one with the smallest difference in the X-axis coordinates of the two center points and the smallest distance between the two center points; As Figure 3 shown, if the number of center points on the same X-axis is greater than the number of center points on the same Y-axis, the detection path moves in a horizontal S path starting from the starting point, traversing all solder joints to form a detection path. The next solder joint of the current solder joint in this detection path is the one with the smallest difference in the Y-axis coordinates of the two center points and the smallest distance between the two center points; If the number of center points on the same X-axis is the same as the number of center points on the same Y-axis, the detection path moves in a horizontal S path or a longitudinal S path starting from the starting point, traversing all solder joints to form a detection path. If it moves in a horizontal S path, the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the Y-axis coordinates of the two center points and the smallest distance between the two center points. If it moves in a longitudinal S path, the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the X-axis coordinates of the two center points and the smallest distance between the two center points.

[0036] In this embodiment, the coordinates of the center point of each solder joint are obtained. According to the coordinates of each center point, the number of center points on the same X-axis and the number of center points on the same Y-axis are obtained. As Figure 5 shown, for example, if there are existing solder joints A(1,2), B(1,3), C(1,4), D(3,3), E(5,3), it means that solder joints A, B, and C have the same X-axis coordinate, indicating that these three solder joints are in the same column, and solder joints B, D, and E have the same Y-axis coordinate, indicating that these three solder joints are in the same row.

[0037] In this embodiment, the number of center points on the same Y-axis is greater than the number of center points on the same X-axis, indicating that the number of solder joints in the same column is greater. Moving in a longitudinal S path can avoid having too many solder joints in half of an S path and avoid the influence on detection between two consecutive solder joints during the detection process.

[0038] In this embodiment, the number of center points on the same X-axis is greater than the number of center points on the same Y-axis, indicating that the number of solder joints in the same row is greater.

[0039] In this embodiment, if the distance between two adjacent solder joints in the same detection path is less than the minimum preset detection distance, after the detection of the current solder joint is completed, the probe 4 moves to the next solder joint and pauses for a preset time before performing the detection, so as to avoid the influence of the residual magnetic field during the detection of the previous solder joint on the detection of the next solder joint.

[0040] In an alternative embodiment, if all the solder joints have the same size and the size of the solder joints is adapted to the probe 4, the starting points of the detection paths corresponding to all the solder joints are: the control module obtains the vertical distance between the point closest to the Y-axis on each solder joint and the Y-axis, that is Figure 2 the length of h in the figure. The solder joint with the shortest distance is used as the starting point of the detection path. If there are at least two solder joints with the shortest distance, the solder joint farther from the X-axis is used as the starting point.

[0041] As Figure 4 shown, in an alternative embodiment, if there are at least two sizes of solder joints among all the solder joints and all types of solder joints are adapted to the corresponding probe 4, the control module classifies all the solder joints according to the solder joint size types. Each type of solder joint has a corresponding detection path. The control module obtains the distance between the point closest to the Y-axis on each solder joint and the Y-axis. The solder joint with the shortest distance is used as the starting point. If there are at least two solder joints with the shortest distance, the solder joint farther from the X-axis is used as the starting point. The detection path corresponding to the solder joint type at the starting point is used as the first detection path. After the end of this detection path, the solder joint of another type closest to the last solder joint of this detection path is used, and its corresponding detection path is the next detection path until all the detection paths corresponding to all types of solder joints are traversed.

[0042] In this embodiment, when there are at least two sizes of solder joints among all the solder joints and all types of solder joints can be directly detected by the corresponding probe 4, the solder joints of two sizes are classified. First, obtain the solder joint closest to the Y-axis among all the solder joints. If there are multiple ones, then determine the solder joint farthest from the X-axis among these solder joints. This solder joint is used as the starting point of the detection path corresponding to this type of solder joint. First, traverse all the solder joints of this size through a detection path. At the end of this detection path, judge the solder joint of another type closest to it. The obtained solder joint of another size is used as the starting point of the detection path corresponding to the corresponding type of solder joint. Repeat the process until all the solder joints of all types are traversed. Traversing the solder joints of the same type at one time can reduce the number and frequency of replacement or switching of the probe 4, shorten the detection time and improve the detection efficiency.

[0043] In an alternative embodiment, when there are a number of solder joints with sizes smaller than a preset minimum size among all the solder joints, the control module determines the distance between two adjacent solder joints among all the solder joints with sizes smaller than the preset minimum size. When there is a case where the distance is greater than a preset maximum distance, the control module sends an alarm message. If not, all the solder joints with sizes smaller than the preset minimum size are detected as one solder joint, and the remaining other solder joints are used to construct corresponding detection paths.

[0044] In this embodiment, if there are multiple solder joints with sizes smaller than the preset minimum size and they are relatively scattered, it indicates that there are problems during the welding process, and an alarm is needed to remind the staff to repair the welding equipment.

[0045] In this embodiment, if there are multiple solder joints with sizes smaller than the preset minimum size, but these solder joints are relatively close to each other and there are no solder joints of other sizes between them, it may indicate that a special situation occurred during the welding process for a period of time. At this time, these solder joints with smaller sizes can be regarded as one large solder joint, and are detected by the probe 4. The probe 4 directly traverses these solder joints with smaller sizes in an S-shaped path to judge the welding effect.

[0046] In this embodiment, if there are a number of solder joints with sizes smaller than the preset minimum size among all the solder joints, although the distance between two adjacent solder joints among all the solder joints with sizes smaller than the preset minimum size is less than the preset minimum size, but the area surrounded by these solder joints contains solder joints of other sizes, it indicates that there are problems with the welding equipment, and the control module sends an alarm message.

[0047] In an alternative embodiment, when there are solder joints with sizes larger than a preset maximum size among all the solder joints, the control module controls the probe 4 corresponding to the preset maximum size of the solder joints to detect the solder joints with sizes larger than the preset maximum size. During the detection of the solder joints with sizes larger than the preset maximum size, the probe 4 performs an S-shaped scan on the surface of this type of solder joints to cover this type of solder joints, and the control module constructs detection paths corresponding to solder joints of each size to traverse all the solder joints.

[0048] In this embodiment, when there are solder joints with sizes larger than the preset maximum size, that is, the solder joints are too large, the probe 4 with the largest detection range is used to detect this solder joint. This probe 4 can move in an S-shaped trajectory on the surface of the solder joint to cover all positions on the surface of the solder joint.

[0049] At least one other disclosed embodiment also provides a power battery solder joint detection system, including: an acquisition module configured to acquire the sizes of all solder joints and the positions of the solder joints through image recognition; a path module configured to construct a detection path according to the positions of the solder joints and select a corresponding probe 4 according to the sizes of the solder joints.

[0050] In this embodiment, the acquisition module and the path module can be virtual modules, and their functions can be integrated into processing devices such as a control module and a host computer.

[0051] At least one other disclosed embodiment also provides a computer-readable storage medium, on which computer programs / instructions are stored. When the computer programs / instructions are executed by a processor, the steps of the above-mentioned power battery solder joint detection method are implemented.

[0052] At least one other disclosed embodiment also provides a computer program product, including computer programs / instructions. When the computer programs / instructions are executed by a processor, the steps of the above-mentioned power battery solder joint detection method are implemented.

[0053] As Figure 5 shown, at least one other disclosed embodiment also provides a power battery solder joint detection device, including: a control module, and a moving mechanism, a rotating mechanism 1 and probes 4 of several sizes that are electrically connected to the control module; the rotating mechanism 1 is arranged on the moving mechanism; the probes 4 are arranged on the rotating mechanism 1, and the control module is adapted to control the rotation of the rotating mechanism 1 so that the probes 4 of the corresponding size face downward; the control module is adapted to control the downward-facing probes 4 to detect the solder joints; the control module is configured to adopt the above-mentioned power battery solder joint detection method to obtain a detection path to control the moving mechanism to drive the rotating mechanism 1 to move, so that the corresponding probes 4 detect the solder joints.

[0054] In this embodiment, the moving mechanism can be a three-axis moving pair to drive the rotating mechanism 1 to move, so that the probes 4 can pass above all the solder joints to complete the detection of the solder joints.

[0055] In this embodiment, the detection ranges corresponding to the probes 4 of different sizes are different to correspond to solder joints of different sizes.

[0056] In this embodiment, the rotating mechanism 1 can include: a connecting member 2 and a turntable 3; the turntable 3 is rotatably arranged on the connecting member 2, the connecting member 2 is arranged on the moving mechanism, different-sized probes 4 are arranged on the surface of the connecting member 2, and the turntable 3 can be connected to a motor or the like, and the turntable 3 is driven by the motor to rotate so that different probes 4 can be rotated to the downward state to detect the solder joints below.

[0057] In summary, the present power battery solder joint detection method includes: the control module obtains the sizes of all solder joints through image recognition and obtains the positions of the solder joints; the control module constructs a detection path according to the positions of the solder joints and selects the corresponding probe 4 according to the sizes of the solder joints; the control module controls the movement of the probe 4 according to the detection path to detect all solder joints; wherein the method for obtaining the positions of the solder joints includes: the control module constructs a coordinate system, the projections of all solder joints are located in the first quadrant of the coordinate system, and the coordinates of all solder joints in the coordinate system are obtained, thereby realizing the detection of all solder joints according to the detection path, detecting all solder joints in an orderly manner, avoiding repeated detection of solder joints, and improving the detection efficiency of solder joints.

[0058] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0059] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms used herein do not imply an order or sequence unless clearly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or section discussed above may be referred to as the second element, component, region, layer or section.

[0060] Spatial relative terms, such as "inner", "outer", "below", "beneath", "lower", "above", "upper", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figures. Except for the orientation depicted in the figures, the spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figures is flipped over, an element described as "below" or "beneath" another element or feature will be oriented "above" the other element or feature. Thus, the exemplary term "below" can cover both an above and a below orientation. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein are to be interpreted accordingly.

[0061] Based on the above enlightenment of the ideal embodiments of the present invention, through the above description, relevant staff can make various changes and modifications completely within the scope not deviating from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A method for detecting solder joints of a power battery, characterized in that, Including: The control module obtains the sizes of all solder joints through image recognition and obtains the positions of the solder joints. The control module constructs a detection path according to the positions of the solder joints and selects a corresponding probe (4) according to the sizes of the solder joints. The control module controls the movement of the probe (4) according to the detection path to detect all solder joints. Where The method for obtaining the positions of the solder joints includes: The control module constructs a coordinate system. The projections of all solder joints are located in the first quadrant of the coordinate system, and the coordinates of all solder joints in the coordinate system are obtained.

2. The power battery solder joint detection method according to claim 1, wherein: The method for constructing a detection path according to the positions of the solder joints includes: Among the solder joints of the same size, the control module judges the number of center points on the same X-axis and the number of center points on the same Y-axis according to the coordinates of the center points of each solder joint. If the number of center points on the same Y-axis is more than the number of center points on the same X-axis, the detection path moves in a longitudinal S path starting from the starting point, traverses all solder joints to form a detection path, and the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the X-axis coordinates of the two center points and the smallest distance between the two center points. If the number of center points on the same X-axis is more than the number of center points on the same Y-axis, the detection path moves in a horizontal S path starting from the starting point, traverses all solder joints to form a detection path, and the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the Y-axis coordinates of the two center points and the smallest distance between the two center points. If the number of center points on the same X-axis is the same as the number of center points on the same Y-axis, the detection path moves in a horizontal S path or a longitudinal S path starting from the starting point, traverses all solder joints to form a detection path. If it moves in a horizontal S path, the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the Y-axis coordinates of the two center points and the smallest distance between the two center points. If it moves in a longitudinal S path, the next solder joint of the current solder joint in this detection path is the one with the smallest difference in the X-axis coordinates of the two center points and the smallest distance between the two center points.

3. The power battery solder joint detection method according to claim 2, wherein: If the sizes of all solder joints are the same and the sizes of the solder joints are adapted to the probe (4), the starting point of the detection path corresponding to all solder joints is: the control module obtains the vertical distance between the point closest to the Y-axis on each solder joint and the Y-axis, and takes the solder joint with the shortest distance as the starting point of the detection path. If there are at least two solder joints with the shortest distance, the solder joint farther from the X-axis is taken as the starting point.

4. The power battery solder joint detection method according to claim 2, wherein: If there are at least two sizes of solder joints among all the solder joints, and all types of solder joints are adapted to the corresponding probes (4), the control module will classify all the solder joints according to the types of solder joint sizes. Each type of solder joint has a corresponding detection path. The control module obtains the distance between the point closest to the Y-axis on each solder joint and the Y-axis, and takes the solder joint with the shortest distance as the starting point. If there are at least two solder joints with the shortest distance, then the solder joint farther from the X-axis among them is taken as the starting point. The detection path corresponding to the solder joint type at the starting point is used as the first detection path. After the end of this detection path, the detection path corresponding to another type of solder joint closest to the last solder joint of this detection path is used as the next detection path until all the detection paths corresponding to all types of solder joints are traversed.

5. The power battery solder joint detection method according to claim 4, characterized in that: If there are several solder joints with sizes smaller than the preset minimum size among all the solder joints, the control module judges the distance between two adjacent solder joints among all the solder joints with sizes smaller than the preset minimum size. If there is a situation where the distance is greater than the preset maximum distance, the control module sends an alarm message. If not, all the solder joints with sizes smaller than the preset minimum size are taken as one solder joint for detection, and the remaining other solder joints construct corresponding detection paths.

6. The power battery solder joint detection method according to claim 4, characterized in that: If there are solder joints with sizes larger than the preset maximum size among all the solder joints, the control module controls the probe (4) corresponding to the preset maximum size of the solder joint to detect the solder joints with sizes larger than the preset maximum size. During the detection of the solder joints with sizes larger than the preset maximum size, the probe (4) performs an S-shaped scan on the surface of this type of solder joint to cover this type of solder joint, and the control module constructs the detection paths corresponding to each size of solder joint to traverse all the solder joints.

7. A power battery solder joint detection system, characterized in that Including: An acquisition module, which is configured to acquire the sizes of all solder joints through image recognition and acquire the positions of the solder joints; A path module, which is configured to construct a detection path according to the positions of the solder joints and select the corresponding probe (4) according to the sizes of the solder joints.

8. A computer-readable storage medium having computer programs / instructions stored thereon, characterized in that, When the computer program / instructions are executed by a processor, the steps of the power battery solder joint detection method according to any one of claims 1-6 are implemented.

9. A computer program product, comprising a computer program / instructions, characterized in that, When the computer program / instructions are executed by a processor, the steps of the power battery solder joint detection method according to any one of claims 1-6 are implemented.

10. A power battery solder joint detection device, characterized in that, Including: A control module, and a moving mechanism, a rotating mechanism (1) and probes (4) of several sizes electrically connected to the control module; The rotating mechanism (1) is arranged on the moving mechanism; The probe (4) is arranged on the rotating mechanism (1), and the control module is adapted to control the rotation of the rotating mechanism (1) so that the probe (4) of the corresponding size faces downward; The control module is adapted to control the downward probe (4) to detect the solder joints; The control module is configured to obtain a detection path by using the power battery solder joint detection method according to any one of claims 1-6 to control the moving mechanism to drive the rotating mechanism (1) to move so that the corresponding probe (4) detects the solder joints.

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