Square substrate glue supply coating control system based on multi-sensor fusion

Abstract

The invention discloses a square substrate glue supply coating control system based on multi-sensor fusion, and relates to the technical field of coating control. Comprises: a creation module: creating a fusion sensing module, the fusion sensing module at least comprising two sensing assemblies to obtain sensing assembly items, the sensing assembly items being respectively used for obtaining basic attribute feedback information, preprocessing feedback information and glue supply feedback information of a substrate in a glue supply process; and the acquisition module is used for acquiring the overall image information of the target substrate based on the sensing assembly item to obtain a target image item. Fine control of the glue supply process is achieved through the multi-sensor fusion technology, the fusion sensing module integrates basic attributes, preprocessing and glue supply feedback information, a multi-dimensional data closed loop is formed, the detection redundancy and environmental adaptability are effectively improved, joint analysis of wettability and roughness data is achieved, and the detection accuracy is improved. The temperature adjusting formula can dynamically optimize the colloid temperature, and it is ensured that the viscosity of the colloid is highly matched with the characteristics of the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of coating control, and specifically to a glue supply and coating control system for square substrates based on multi-sensor fusion. Background Art

[0002] Substrate glue supply and coating refers to the coating process of applying glue or coating on a square substrate. This process usually involves evenly coating the glue on the substrate surface for subsequent process steps, such as bonding, encapsulation, or protection. The square substrate can be a substrate of electronic components, such as a printed circuit board or a substrate in other industrial applications. Common methods for coating glue include spraying, scraping, dipping, etc. The specific selection depends on the material of the substrate and the coating requirements. When coating glue on a square substrate, it is necessary to control the control system according to the actual coating situation.

[0003] The substrate coating equipment and substrate coating method with the patent publication number CN113967570A, through designs such as the first coating machine station and the second coating machine station, enable relevant manufacturers to use a single coating equipment to repeatedly coat the surface of a single substrate with coating. Relevant manufacturers do not need to purchase additional coating equipment. Moreover, after a single substrate enters the feeding machine station until it passes through the baking machine station and enters the discharging machine station, the substrate will not leave the substrate coating equipment. That is to say, relevant manufacturers can use the single substrate coating equipment of the present invention to complete the operation of repeatedly coating a single substrate with coating twice on a single production line.

[0004] When performing infiltration pretreatment on the substrate with the above and similar technical solutions, when the roughness of the substrate surface and the infiltration degree of the substrate are different, since the temperature during glue discharge is fixed, when the fixed-state glue falls on substrates in different states, it will affect the spreading speed of the glue during the subsequent rotational glue supply process of the substrate. When the substrate roughness is low or the infiltration degree is high, it will cause the glue to spread quickly to the edge of the substrate, resulting in insufficient glue uniformity and even glue overflow. When the substrate roughness is high or the infiltration degree is low, it will cause the glue spreading speed to be slow, and then it will be difficult to control the glue supply and coating process. Summary of the Invention

[0005] The purpose of the present invention is to provide a glue supply and coating control system for square substrates based on multi-sensor fusion to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A glue supply and coating control system for square substrates based on multi-sensor fusion, including: Creation Module: Create a fusion sensing module. The fusion sensing module includes at least two sensing components to obtain sensing component items, which are respectively used to obtain the basic attribute feedback information, preprocessing feedback information, and glue supply feedback information of the substrate during the glue supply process; Acquisition Module: Based on the sensing component items, obtain the overall image information of the target substrate to get the target image items, and based on the target image items, obtain the matching glue supply data to get the basic information items, where the basic information items are used to represent the basic glue supply information adapted to the target image items; It is characterized in that: Analysis Module: Obtain the surface wettability data of the target substrate to get the wettability information items, and based on the sensing component items, obtain the calculation information of the wettability information items. At the same time, obtain the surface roughness data of the target substrate to get the roughness information items, and based on the sensing component items, obtain the calculation information of the roughness information items; Adjustment Module: Based on the wettability information items and the roughness information items, create a temperature adjustment formula, and based on the calculation results of the temperature adjustment formula, change the temperature of the colloid so that the colloid has different temperatures when dispensing glue, making the glue supply effect of the colloid more adaptable to different substrate wettability data and substrate roughness data under the basic information items; Monitoring Module: Based on the sensing component items, obtain the spreading state of the glue layer on the target substrate during the glue supply process to get the monitoring feedback items. Based on the monitoring feedback items, adjust the glue supply through the adjustment method, and cooperate with adjusting the glue dispensing temperature of the colloid in a multi-sensor fusion manner to control the glue supply coating of the substrate.

[0007] Furthermore, the sensing component items include a contact angle measurement device, a surface tension sensing device, and a camera device. The method for obtaining the wettability information items includes: Create a wettability data acquisition formula: ; where is the wettability information item, is the contact angle, is the surface tension of the colloid, is the wetting time, is the reference surface tension, is the first fitting coefficient.

[0008] Furthermore, the sensing component items include a white light interferometer. The method for obtaining the roughness information items includes: Create a roughness data acquisition formula: ; where is the roughness information item, is the arithmetic mean roughness, is the ideal roughness, is the porosity, is the reference porosity.

[0009] Furthermore, the method for obtaining the porosity includes: Based on the sensing component item, perform a serpentine path scan along the surface of the target substrate to obtain a high-resolution surface topography image, and obtain the topography image item; Based on the topography image item, integrate local images through an image stitching algorithm to generate a complete three-dimensional surface model, and obtain the topography model item; Use binary processing to distinguish pores from the matrix, calculate the proportion of pore area, and further obtain the porosity.

[0010] Furthermore, the method for obtaining the basic information item includes: Based on the target image item, obtain the glue supply amount, glue supply thickness, and glue supply rotation speed corresponding to the target image item through data acquisition, obtain the mapping relationship between the thickness and the glue supply amount, and the substrate rotation speed; Based on the comparison relationship between the required glue supply thickness and the mapping relationship between the thickness and the glue supply amount, obtain the glue supply amount under the condition of the required glue supply thickness, and obtain the target glue amount item; The combination of the target glue amount item and the substrate rotation speed results in the basic information item.

[0011] Furthermore, the sensing component item includes an infrared scanning device, and the method for obtaining the target image item includes: Based on the infrared scanning device, obtain the vertex position information of the target substrate, obtain the vertex information item, and use the vertex information item as the connection feature points to obtain the image connection information of the target substrate; Based on the image connection information, obtain the length data of the connection, obtain the edge length data of the target substrate, and based on the edge length data and the image information combined by the edge length data, further obtain the target image item.

[0012] Furthermore, the sensing component item includes a temperature sensing device, and the temperature adjustment formula includes: ; where is the basic temperature of the glue liquid, is the second fitting coefficient, which is negative. As the infiltration information item increases, the temperature needs to be reduced to reduce fluidity, is the third fitting coefficient, which is positive. As the roughness information item increases, the temperature needs to be increased to enhance the glue filling ability.

[0013] Furthermore, the sensing component item further includes a laser measurement device, and the method for obtaining the monitoring feedback item includes: Set a separation value, the separation value is a fixed ratio value. Based on the combination result of the separation value and the target image item, obtain at least two image segmentation points. Use the image segmentation points as the monitoring feature points, set an acquisition threshold, the acquisition threshold is a fixed time value. Based on the acquisition threshold, obtain the glue layer thickness data of the monitoring feature points, and obtain the monitoring feedback item.

[0014] Further, the adjustment method includes: Set the rotation speed, determine the glue supply switch time and its frequency according to the target image item, do not supply glue when there is no substrate below, obtain the target glue layer thickness, obtain the target numerical item, set the fluctuation limit value based on the target numerical item, and judge whether the glue layer thickness data of the monitoring feature point is within the fluctuation limit value. When it is within the fluctuation limit value, stop supplying glue. When it is not within the fluctuation limit value, use the monitoring feature point close to the center position of the target substrate as the starting feature point, sort the monitoring feature points in sequence, judge whether the glue layer thickness of the starting feature point is within the fluctuation limit value. When it is within the fluctuation limit value, stop supplying glue until the glue layer thickness of the monitoring feature point farthest from the starting feature point is within the fluctuation limit value, and complete the glue supply.

[0015] Compared with the prior art, the beneficial effects of the present invention are: The square substrate glue supply coating control system based on multi-sensor fusion realizes the refined control of the glue supply process through multi-sensor fusion technology. First, the fusion sensing module integrates the basic attributes, preprocessing and glue supply feedback information to form a multi-dimensional data closed-loop, effectively improving the detection redundancy and environmental adaptability. The joint analysis of the wettability and roughness data enables the temperature adjustment formula to dynamically optimize the colloid temperature, ensuring a high degree of adaptation between the colloid viscosity and the substrate characteristics. Compared with the traditional single-sensor scheme, the multi-source data complementarity of this technology significantly reduces the error risk caused by the failure of a single sensor.

[0016] At the same time, through the distributed fusion architecture, real-time monitoring and dynamic adjustment are realized. The monitoring module uses visual sensor detection technology to capture the glue layer dispersion state in real time, monitor the glue layer thickness data in real time. When the thickness is consistent, stop supplying glue. When the thickness is inconsistent, use the monitoring feature point close to the center position of the target substrate as the starting feature point, sort the monitoring feature points in sequence, judge whether the glue layer thickness of the starting feature point reaches the target numerical item. When it reaches the target numerical item, stop supplying glue until the glue layer thickness of the monitoring feature point farthest from the starting feature point reaches the target numerical item, and complete the glue supply, effectively preventing the occurrence of uneven glue supply or glue overflow. Description of the Drawings

[0017] Figure 1 is the overall flow schematic diagram of the present invention; Figure 2 is the schematic diagram of the sensing component item of the present invention; Figure 3 is the schematic diagram of the substrate glue supply process of the present invention; Figure 4 is the schematic diagram of the target image item of the present invention. Detailed Embodiments

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] During the glue supply process, the glue forms a uniform thin film on the substrate surface through rotation. However, before that, the glue will first drop onto the stationary substrate surface to form an initial glue droplet state. At this time, the characteristics of the substrate surface, especially roughness and wettability, will have a significant impact on the spreading speed and final shape of the glue droplet. Since the temperature during glue dispensing is usually fixed, the initial state of the glue droplet mainly depends on the physicochemical properties of the substrate surface. When the substrate surface has a low roughness and a high wettability, the wettability between the glue and the substrate is good, and the contact angle is small, which is conducive to the rapid spreading of the glue. Low roughness means fewer surface defects and microstructures, reducing the resistance to glue spreading. High wettability indicates that the substrate surface has strong hydrophilicity, resulting in a strong interaction force between the glue molecules and the substrate surface, promoting the diffusion of the glue. In this case, the glue will quickly spread within a short time and even spread to the edge of the substrate, forming a thin and uniform liquid film. On the other hand, when the substrate surface has a high roughness and a low wettability, the wettability between the glue and the substrate is poor, and the contact angle is large, resulting in a slow glue spreading speed. High roughness means that there are a large number of microscopic uneven structures on the surface, which will increase the surface energy barrier for glue spreading and hinder the flow of the glue. Low wettability indicates that the substrate surface has strong hydrophobicity, resulting in a weak interaction force between the glue molecules and the substrate surface, which is not conducive to the diffusion of the glue. Therefore, during the glue supply process, the influence of the substrate on the glue needs to be considered to prevent poor glue supply quality. The technical solution provided in this application realizes the refined control of the glue supply process through multi-sensor fusion technology. First, the fusion sensing module integrates basic attributes, preprocessing, and glue supply feedback information to form a multi-dimensional data closed-loop, effectively improving the detection redundancy and environmental adaptability. The joint analysis of wettability and roughness data enables the temperature adjustment formula to dynamically optimize the colloid temperature, ensuring a high degree of adaptation between the colloid viscosity and the substrate characteristics. Compared with the traditional single-sensor solution, the multi-source data complementarity of this technology significantly reduces the error risk caused by the failure of a single sensor, as Figure 1 shown, including a creation module, an acquisition module, an analysis module, an adjustment module, and a monitoring module.

[0020] Creation module: Create a fusion sensing module. The fusion sensing module includes at least two sensing components to obtain sensing component items.

[0021] It should be noted that, as Figures 2 - 3 shown, the sensing component items are respectively used to obtain the basic attribute feedback information, preprocessing feedback information, and glue supply feedback information of the substrate during the glue supply process. During the substrate glue supply process, there are a total of six steps. The first step is substrate preprocessing, which is used to improve the wettability of the substrate; the second step is coating head alignment, where the coating head moves close to the square substrate, and the length of the coating head is less than or equal to the diagonal length of the substrate; the third step is the coating head entering, where the coating head enters directly above the substrate and partially coats the substrate; the fourth step is the main coating, where the position of the coating head is fixed, and the substrate rotates one or more circles, and most of the positions of the substrate are coated; the fifth step is the coating head retraction, where the coating head is lifted and the glue supply stops; the sixth step is the glue supply, where the substrate rotates at a high speed to reach the predetermined film thickness.

[0022] It should be noted that in the above six steps, in order to improve the glue supply effect on the substrate, it is necessary to cooperate with the data feedback of the sensor in multiple or even each step to achieve real-time monitoring of the step effect. Therefore, the number of integrated sensing modules is multiple, and the coating head is composed of multiple spray heads arranged in sequence.

[0023] Acquisition module: Based on the sensing component items, obtain the overall image information of the target substrate to obtain the target image item, and based on the target image item, obtain the matching glue supply data to obtain the basic information item.

[0024] It should be noted that the basic information item is used to represent the basic glue supply information adapted to the target image item. The sensing component item includes an infrared scanning device, and the infrared scanning device is an infrared scanner. The method for obtaining the target image item includes: based on the infrared scanner, obtain the vertex position information of the target substrate to obtain the vertex information item. For example, for a square substrate, the number of its vertices is four, and the position information of the four vertices is obtained. Using the vertex information item as the connection feature points, obtain the image connection information of the target substrate; based on the image connection information, obtain the length data of the connection to obtain the edge length data of the target substrate. Based on the edge length data and the image information combined from the edge length data, further obtain the target image item.

[0025] In the specific implementation process, as Figure 4 shown, now it is necessary to obtain the overall image information of a square substrate A with glue supply. Using the infrared scanner, first scan that the four fixed-point positions of the square substrate A are respectively at the positions of (0,0), (0,10), (10,10), and (10,0) in the coordinate system. At this time, obtain the image connection information of the square substrate A, and obtain the length data of the connection to obtain the edge length data of the square substrate A, and further obtain the target image item of the square substrate A.

[0026] It should be noted that the methods for obtaining basic information items include: based on the target image item, through data acquisition, obtaining the glue supply amount, glue supply thickness, and substrate rotation speed corresponding to the target image item, obtaining the mapping relationship between thickness and glue supply amount and the substrate rotation speed; based on the comparison relationship between the required glue supply thickness and the mapping relationship between thickness and glue supply amount, obtaining the glue supply amount under the condition of the required glue supply thickness, obtaining the target glue amount item; combining the target glue amount item with the substrate rotation speed to obtain the basic information item.

[0027] In a specific implementation process, the target image item of the target substrate B is obtained as a square substrate of 100 cm * 100 cm. Based on the data acquisition method, the glue supply amount corresponding to this target image item is obtained as 150 ml, the glue supply thickness is 0.15 mm, and the substrate rotation speed is 1000 revolutions per minute. At this time, the mapping relationship between thickness and glue supply amount is obtained. Further, the required glue supply thickness is obtained as 0.3 mm. At this time, according to the combination result of the mapping relationship between thickness and glue supply amount and the required glue supply thickness, the target glue amount is obtained as 300 ml, that is, the target glue amount item is obtained. Combining the target glue amount item with the substrate rotation speed to obtain the basic information item.

[0028] Analysis module: Obtain the surface wettability data of the target substrate to obtain the wetting information item, obtain the calculation information of the wetting information item based on the sensing component item, and at the same time obtain the surface roughness data of the target substrate to obtain the roughness information item, and obtain the calculation information of the roughness information item based on the sensing component item.

[0029] It should be noted that the sensing component item includes a contact angle measurement device, a surface tension sensing device, and a camera device. Among them, the contact angle measurement device is a contact angle measuring instrument, the surface tension sensing device is a surface tension sensor, and the camera device is a camera. The method for obtaining the wetting information item includes: Create a wetting data acquisition formula: ; where is the wetting information item, is the contact angle, which is measured and obtained by a contact angle measuring instrument, is the surface tension of the colloid, which is obtained by a surface tension sensor, is the wetting time, which is obtained by a camera, is the reference surface tension, such as the surface tension of water 72 mN / m, is the first fitting coefficient, set to 8; The sensing component item includes a white light interferometer. The method for obtaining the roughness information item includes: Create a roughness data acquisition formula: ; where is the roughness information item, is the arithmetic mean roughness, is the ideal roughness, with a set value of 0.1, is the porosity, is the reference porosity, and the set value is 5%; The method for obtaining the porosity includes: based on the sensing component item, scanning along the surface of the target substrate in a serpentine path to obtain a high-resolution surface topography image, and obtaining the topography image item; based on the topography image item, integrating local images through an image stitching algorithm to generate a complete three-dimensional surface model, and obtaining the topography model item; using binary processing to distinguish pores from the matrix, calculating the proportion of pore area, and further obtaining the porosity.

[0030] In a specific implementation process, after preprocessing a square substrate C with glue supply, a contact angle of 85° was measured using an optical contact angle measuring instrument Krüss DSA100 to measure the droplet profile. The colloid used was epoxy resin glue solution, and the surface tension of the colloid was measured in real-time by a surface tension sensor to be 45 mN / m. The wetting duration of the square substrate C was obtained through a camera to be 12 s. At this time, according to the wetting degree data acquisition formula: ; The calculation is: .

[0031] By scanning the topography of the square substrate C with a white light interferometer, the arithmetic mean roughness was measured to be 2.5 μm, and a high-resolution surface topography image of the square substrate C was obtained. At 300 PPI, the total number of pixels in the high-resolution surface topography image of the square substrate C was 10,000,000, and the number of pore pixels was 1,800,000. At this time, the porosity was 1,800,000 / 10,000,000, and the result was 18%. At this time, according to the roughness data acquisition formula: ; The calculation result is: .

[0032] Adjustment module: Based on the wetting information item and the roughness information item, create a temperature adjustment formula, and change the temperature of the colloid based on the calculation result of the temperature adjustment formula.

[0033] It should be noted that when changing the temperature of the colloid according to the calculation result of the temperature adjustment formula, the colloid will have different temperatures when dispensing glue, making the glue supply effect of the colloid more adaptable to different substrate wetting data and substrate roughness data under the basic information item. The sensing component item includes a temperature sensing device, and the temperature adjustment formula includes: ; where is the basic temperature of the glue solution, is the second fitting coefficient, which is negative. When the wetting information item increases, the temperature needs to be reduced to reduce fluidity, and the set value is -5, is the third fitting coefficient, which is positive. When the roughness information item increases, the temperature needs to be increased to enhance the glue filling ability, and the set value is 3.

[0034] In a specific implementation process, after preprocessing a square substrate C with glue supply, the contact angle was measured to be 85° by using an optical contact angle measuring instrument Krüss DSA100 to measure the droplet profile. The colloid used was epoxy resin glue solution. Through real-time monitoring with a surface tension sensor, the surface tension of the colloid was measured to be 45 mN / m. The wetting duration of the square substrate C was obtained as 12 s through a camera. At this time, the wetting data item was calculated to be 0.023 according to the wetting degree data acquisition formula. By scanning the topography of the square substrate C with a white light interferometer, the arithmetic mean roughness was measured to be 2.5 μm, and a high-resolution surface topography image of the square substrate C was obtained. At 300 PPI, the total number of pixels in the high-resolution surface topography image of the square substrate C was 10,000,000, and the number of pore pixels was 1,800,000. At this time, the porosity was 1,800,000 / 10,000,000, and the result was 18%. At this time, the roughness data item was calculated to be 25.02 according to the roughness data acquisition formula. The initial temperature of the colloid was obtained as 50 °C. At this time, the temperature adjustment formula includes: ; The calculation result is: ; That is, it is necessary to raise the temperature to 70.03 °C to reduce the viscosity of the glue solution and enhance the filling ability of the pores.

[0035] Monitoring module: Based on the sensing component items, obtain the spreading state of the glue layer on the target substrate during the glue supply process to obtain the monitoring feedback items. Based on the monitoring feedback items, adjust the glue supply through the adjustment method. By means of multi-sensor fusion, cooperate with adjusting the glue outlet temperature of the colloid to control the glue coating on the substrate.

[0036] It should be noted that the sensing component items also include laser measurement equipment. The method for obtaining the monitoring feedback items includes: setting a separation value, the separation value is a fixed ratio value, which is 25%. Based on the combined result of the separation value and the target image item, taking the center point of the target image item as the combination starting point, obtain the distance from the combination starting point to the edge line in the target image item to obtain four image segmentation points. Taking the image segmentation points as the monitoring feature points, setting an acquisition threshold, the acquisition threshold is a fixed time value, which is 1 s. Based on the acquisition threshold, obtain the glue layer thickness data of the monitoring feature points to obtain the monitoring feedback items.

[0037] Specifically, when the target image item of the target substrate D is a square substrate with a side length of 100 cm * 100 cm, at this time, according to the set separation value, taking the center point of the target substrate D as the combination starting point, set a segmentation point every 12.5 cm to obtain four image segmentation points, which are used as the monitoring feature points respectively, and respectively use an acquisition threshold of 1 s to obtain the glue layer thickness data of the detection feature points respectively. Since the substrate is constantly rotating, the glue layer thickness data of the whole substrate can be obtained through the four monitoring feature points.

[0038] It should be noted that the adjustment method includes: setting the rotation speed, determining the glue supply switch time and its frequency according to the target image item, when there is no substrate under the coating head, the nozzle at the corresponding position does not supply glue, obtaining the target glue layer thickness, obtaining the target numerical item, setting the fluctuation limit value based on the target numerical item, judging whether the glue layer thickness data of the monitoring feature point is within the fluctuation limit value, when it is within the fluctuation limit value, stop supplying glue, when it is not within the fluctuation limit value, use the monitoring feature point close to the center position of the target substrate as the starting feature point, sort the monitoring feature points in sequence, judge whether the glue layer thickness of the starting feature point is within the fluctuation limit value, when it is within the fluctuation limit value, stop supplying glue, until the glue layer thickness of the monitoring feature point farthest from the starting feature point is within the fluctuation limit value, and complete the glue supply.

[0039] Specifically, the fluctuation limit value is a fixed numerical percentage, which is the maximum allowable error of the glue layer thickness, and the fixed numerical value is ±10%.

[0040] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended embodiments and their equivalents.

Claims

1. Square substrate glue supply and coating control system based on multi-sensor fusion, comprising: Creation module: Create a fusion sensing module. The fusion sensing module includes at least two sensing components to obtain sensing component items, and the sensing component items are respectively used to obtain the basic attribute feedback information, preprocessing feedback information, and glue supply feedback information of the substrate during the glue supply process; Acquisition module: Based on the sensing component items, obtain the overall image information of the target substrate to obtain a target image item, and obtain the matching glue supply data based on the target image item to obtain a basic information item, where the basic information item is used to represent the basic glue supply information adapted to the target image item; It is characterized in that: Analysis module: Obtain the surface wettability data of the target substrate to obtain a wettability information item, obtain the calculation information of the wettability information item based on the sensing component items, and at the same time obtain the surface roughness data of the target substrate to obtain a roughness information item, and obtain the calculation information of the roughness information item based on the sensing component items; Adjustment module: Based on the wettability information item and the roughness information item, create a temperature adjustment formula, and change the temperature of the colloid based on the calculation result of the temperature adjustment formula, so that the colloid has different temperatures when discharging glue, and make the glue supply effect of the colloid more adapted to different substrate wettability data and substrate roughness data under the basic information item; Monitoring module: Based on the sensing component items, obtain the spreading state of the glue layer on the target substrate during the glue supply process to obtain a monitoring feedback item. Based on the monitoring feedback item, adjust the glue supply through an adjustment method, and cooperate with adjusting the glue discharging temperature of the colloid in a multi-sensor fusion manner to control the glue supply and coating of the substrate.

2. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, wherein: The sensing component items include a contact angle measurement device, a surface tension sensing device, and a camera device. The method for obtaining the wettability information item includes: Create a formula for obtaining wetting degree data: ; where is the wetting information item, is the contact angle, is the colloid surface tension, is the wetting time, is the reference surface tension, is the first fitting coefficient.

3. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, characterized in that: The sensing component items include a white light interferometer. The method for obtaining the roughness information item includes: Create a roughness data acquisition formula: ; where is the rough information item, is the arithmetic mean roughness, is the ideal roughness, is the porosity, is the reference porosity.

4. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 3, characterized in that: The method for obtaining the porosity includes: Based on the sensing component items, perform a serpentine path scan along the surface of the target substrate to obtain a high-resolution surface topography image to obtain a topography image item; Based on the topography image item, integrate the local images through an image stitching algorithm to generate a complete surface three-dimensional model to obtain a topography model item; Use binary processing to distinguish pores from the matrix, calculate the proportion of the pore area, and then obtain the porosity.

5. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, characterized in that: The method for obtaining the basic information item includes: Based on the target image item, obtain the glue supply amount, glue supply thickness, and glue supply rotation speed corresponding to the target image item through data acquisition to obtain the mapping relationship between the thickness and the glue supply amount and the substrate rotation speed; Based on the comparison relationship between the required glue supply thickness and the mapping relationship between the thickness and the glue supply amount, obtain the glue supply amount under the condition of the required glue supply thickness to obtain a target glue amount item; The combination of the target glue amount item and the substrate rotation speed obtains the basic information item.

6. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, characterized in that: The sensing component items include an infrared scanning device. The method for obtaining the target image item includes: Based on the infrared scanning device, obtain the vertex position information of the target substrate to obtain a vertex information item, and use the vertex information item as the connection feature point to obtain the image connection information of the target substrate. Based on the image connection information, obtain the length data of the connection line to get the edge length data of the target substrate. Based on the edge length data and the image information combined from the edge length data, further obtain the target image item.

7. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, wherein: The described sensing component item includes a temperature sensing device, and the temperature adjustment formula is as follows: ; where is the base temperature of the adhesive liquid, is the second fitting coefficient, which is negative. As the infiltration information item increases, the temperature needs to be decreased to reduce fluidity, is the third fitting coefficient, which is positive. As the roughness information item increases, the temperature needs to be increased to enhance the adhesive liquid filling ability.

8. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 1, characterized in that: The sensing component item further includes a laser measurement device. The obtaining method of the monitoring feedback item includes: Set a separation value, which is a fixed ratio value. Based on the combination result of the separation value and the target image item, obtain at least two image segmentation points. Use the image segmentation points as monitoring feature points. Set an acquisition threshold, which is a fixed time value. Based on the acquisition threshold, obtain the adhesive layer thickness data of the monitoring feature points to get the monitoring feedback item.

9. The square substrate glue supply and coating control system based on multi-sensor fusion according to claim 8, characterized in that: The adjustment method includes: Set the rotation speed. Determine the glue supply switch time and its frequency according to the target image item. Do not supply glue when there is no substrate below. Obtain the target adhesive layer thickness to get the target numerical item. Set a fluctuation limit value based on the target numerical item. Judge whether the adhesive layer thickness data of the monitoring feature points is within the fluctuation limit value. When it is within the fluctuation limit value, stop supplying glue. When it is not within the fluctuation limit value, use the monitoring feature point close to the center position of the target substrate as the starting feature point, sort the monitoring feature points in sequence, judge whether the adhesive layer thickness of the starting feature point is within the fluctuation limit value. When it is within the fluctuation limit value, stop supplying glue until the adhesive layer thickness of the monitoring feature point farthest from the starting feature point is within the fluctuation limit value to complete the glue supply.

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