Lower electrode device and semiconductor process equipment

Abstract

The invention provides a lower electrode device and semiconductor process equipment, and the device comprises a chuck assembly which is used for bearing a wafer; the radio frequency feed-in component is arranged in the center of the bottom of the chuck assembly and provided with a hollow space and at least three openings, the at least three openings are evenly distributed in the circumferential direction of the radio frequency feed-in component, and each opening penetrates from the outer circumferential face of the radio frequency feed-in component to the inner circumferential face forming the hollow space; the lifting driving part is arranged in the hollow space, and the lifting driving part and the radio frequency feed-in part are arranged in an equipotential manner; the at least three connecting parts are connected with the driving part of the lifting driving part and are used for lifting under the driving of the lifting driving part; in addition, the connecting parts penetrate through the openings in a one-to-one correspondence mode, extend out of the hollow space and are used for being connected with ejector pin devices of the semiconductor process equipment respectively.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular, to a lower electrode device and a semiconductor process equipment. Background Art

[0002] With the rapid development of the semiconductor industry, etching equipment, as a key equipment in the semiconductor manufacturing process, has an increasing demand. In the etching equipment, the lower electrode structure is one of the important components affecting the etching effect.

[0003] The existing lower electrode structure mainly includes a radio frequency feed-in, a back helium interface, a cooling pipeline interface, a temperature measurement optical fiber interface, etc. Among them, the radio frequency feed-in is the core part of the lower electrode structure. It feeds radio frequency energy into the lower electrode and then transfers it to the electrostatic chuck, ensuring that the radio frequency energy is evenly distributed in a circle on the electrostatic chuck, thereby generating a uniform plasma to meet the high requirements of the etching process for plasma uniformity.

[0004] However, the radio frequency feed-in carries extremely high energy and is prone to breakdown of the surrounding air, generating discharge and sparking phenomena with the surrounding metal devices, resulting in device damage. To prevent radio frequency from discharging and sparking with the surrounding devices, two methods are usually adopted in the prior art: one is to keep the surrounding metal devices at a sufficient distance from the radio frequency feed-in devices; the other is to add non-metal devices between them for isolation.

[0005] In the lower electrode radio frequency feed-in structure and the three-pin lifting structure of the prior art, the radio frequency column is located at the center of the lower electrode, and the radio frequency energy is transferred to the electrostatic chuck through the interface plate. The cylinder of the three-pin lifting structure is offset at the edge of the lower electrode and is connected to the interface plate through a cylinder fixing block made of resin material. Although this design can reduce the risk of sparking to a certain extent, there are also some disadvantages. First, in the etching process with a high aspect ratio, a higher radio frequency energy is required. At this time, a greater safety distance for preventing sparking is needed, but the space of the lower electrode is limited, and the radio frequency feed-in structure and the three-pin lifting structure are prone to sparking. Second, in order to increase the distance between the radio frequency feed-in and the surrounding metal devices to reduce the risk of sparking, it will occupy the space of the lower electrode, thus bringing difficulties to the installation, disassembly, and maintenance of the three-pin mechanism. Summary of the Invention

[0006] The present invention aims to at least solve one of the technical problems existing in the prior art, and provides a lower electrode device and a semiconductor process equipment, which can eliminate the sparking risk between the radio frequency feed-in and the surrounding metal devices, increase the space for the installation, disassembly, and maintenance of the thimble device, and will not affect the uniformity of the radio frequency circuit.

[0007] To achieve the purpose of the present invention, a lower electrode device is provided, which is applied to a semiconductor process equipment and includes:

[0008] A chuck assembly for holding a wafer;

[0009] A radio frequency feeding component, disposed at the center of the bottom of the chuck assembly, having a hollow space and at least three openings, and the at least three openings are evenly distributed along the circumference of the radio frequency feeding component, and each opening penetrates from the outer peripheral surface of the radio frequency feeding component to the inner peripheral surface forming the hollow space;

[0010] A lifting driving component, disposed in the hollow space and isopotential with the radio frequency feeding component; and

[0011] At least three connecting components, all connected to the driving part of the lifting driving component for lifting under the drive of the lifting driving component; and each connecting component extends outside the hollow space through each opening correspondingly for connecting with the thimble device of the semiconductor processing equipment.

[0012] In some embodiments, the lifting driving component includes a first cylinder body and a first cylinder rod, the first cylinder body is disposed in the hollow space and fixedly connected to the radio frequency feeding component;

[0013] One end of the first cylinder rod is located in the first cylinder body and divides the interior of the first cylinder body into two first spaces; the other end of the first cylinder rod serves as the driving part of the lifting driving component, vertically penetrates the top of the first cylinder body and extends outside the first cylinder body, and is fixedly connected to each connecting component;

[0014] By selectively introducing fluid into one of the first spaces, the lifting of the first cylinder rod is controlled, and the connecting components are driven to lift synchronously.

[0015] In some embodiments, the lifting driving component further includes a second cylinder body and a second cylinder rod, the second cylinder body is located between the bottom surface of the first cylinder body and the bottom surface forming the hollow space, the second cylinder body is fixedly connected to and electrically conductive with the first cylinder body and the radio frequency feeding component respectively;

[0016] One end of the second cylinder rod is located in the second cylinder body, and is electrically conductive with the second cylinder body and divides the interior of the second cylinder body into two second spaces; the other end of the second cylinder rod vertically penetrates the bottom of the hollow space and extends outside the second cylinder body and the radio frequency feeding component for connecting with a specified fixing part;

[0017] By selectively introducing fluid into one of the second spaces, the lifting of the second cylinder body is controlled, and the radio frequency feeding component is driven to lift synchronously.

[0018] In some embodiments, each of the connecting members is a connecting rod, at least three of the connecting rods are evenly distributed along the circumference of the radio frequency feeding member, and one ends of at least three of the connecting rods are fixedly connected to the other end of the first cylinder rod through a central connecting portion; the other ends of at least three of the connecting rods respectively pass through the openings and extend outside the hollow space along different radial directions of the radio frequency feeding member;

[0019] The central connecting portion is electrically connected to each of the connecting rods and the first cylinder rod.

[0020] In some embodiments, the lower electrode device further includes at least three height adjusting structures, each of the height adjusting structures is used to connect each of the connecting members to the corresponding thimble device one by one, and can adjust the height of the corresponding thimble device.

[0021] In some embodiments, each of the height adjusting structures includes a mounting member, a first adjusting member and a second adjusting member. Among them, the mounting member is located below the corresponding connecting member and is fixedly connected to the corresponding thimble device; the first adjusting member can support the mounting member, penetrates the mounting member in the vertical direction, and is threadedly connected to the connecting member, and is used to lift the mounting member relative to the connecting member by rotation; the second adjusting member penetrates the mounting member in the vertical direction and is threadedly connected to the connecting member, and the second adjusting member is configured to be able to adjust the distance between the mounting member and the connecting member so that the mounting member can be lifted or lowered relative to the connecting member.

[0022] In some embodiments, the second adjusting member includes an adjusting screw and an adjusting nut. The stud of the adjusting screw penetrates the mounting member in the vertical direction and is fixedly connected to the connecting member; the adjusting nut is sleeved on the stud and the screw head of the adjusting screw and is located below the mounting member; the adjusting nut is threadedly connected to the stud and supports the mounting member.

[0023] In some embodiments, the radio frequency feeding member includes a cylinder, the cylinder is coaxially arranged with the chuck assembly, and is used to feed radio frequency power to the chuck assembly; the inside of the cylinder forms the hollow space; the opening penetrates the circumferential wall of the cylinder along the radial direction of the cylinder.

[0024] In some embodiments, the chuck assembly includes a chuck body and an interface plate arranged below the chuck body;

[0025] The cylinder is fixedly connected to the central position of the bottom of the interface plate.

[0026] As another technical solution, the present invention also provides a semiconductor processing apparatus, including:

[0027] The above lower electrode device provided by the present invention;

[0028] At least three thimble devices are evenly distributed circumferentially along the chuck assembly in the lower electrode device, and are lifted above the bearing surface of the chuck assembly or lowered below the bearing surface under the drive of each connecting component.

[0029] The present invention has the following beneficial effects:

[0030] For the lower electrode device provided by the present invention, by setting the radio frequency feeding component as a hollow structure, that is, provided with a hollow space and at least three openings, and arranging the lifting drive component in the hollow space, and making the lifting drive component and the radio frequency feeding component equipotential, the risk of discharge and sparking caused by potential difference can be completely eliminated, thereby improving the safety and reliability of the equipment. On this basis, by arranging the lifting drive component in the hollow space and connecting the driving parts of the lifting drive component to each thimble device through each connecting component, the space occupied by the lifting drive component can be reduced while realizing the lifting of the thimble device. Compared with the prior art, there is no need for additional space to maintain the safety distance between the radio frequency feeding component and the thimble device, thereby providing more space for the maintenance of the entire lower electrode device and facilitating the installation, disassembly and maintenance operations of the lower electrode device. In addition, since the radio frequency feeding component is arranged at the central position at the bottom of the chuck assembly, and the lifting drive component is equipotentially integrated in the hollow space of the radio frequency feeding component, a uniform radio frequency circuit can be formed to generate uniform plasma, so that while eliminating the risk of sparking and increasing the maintenance space, it will not have any negative impact on the high requirements for plasma uniformity in the etching process, ensuring the high performance and high precision of the etching equipment.

[0031] For the semiconductor process equipment provided by the present invention, by adopting the above lower electrode device provided by the present invention, the risk of discharge and sparking caused by potential difference can be completely eliminated, thereby improving the safety and reliability of the equipment, increasing the space for the installation, disassembly and maintenance of the thimble device, and having no impact on the uniformity of the radio frequency circuit. Description of the Drawings

[0032] Figure 1 Structural diagram of the lower electrode device provided for the related art;

[0033] Figure 2 Partial enlarged view of the lower electrode device provided for the related art;

[0034] Figure 3 Structural diagram of the lower electrode device provided by the embodiment of the present invention;

[0035] Figure 4A cross-sectional view of the lower electrode device provided by an embodiment of the present invention;

[0036] Figure 5 A structural diagram of the interface plate and the components below it in an embodiment of the present invention;

[0037] Figure 6 A top view of the interface plate in an embodiment of the present invention;

[0038] Figure 7 A structural diagram of the radio frequency feeding component in an embodiment of the present invention;

[0039] Figure 8 A cross-sectional view of the lifting drive component in an embodiment of the present invention;

[0040] Figure 9 A structural diagram of the connection component installed on the radio frequency feeding component in an embodiment of the present invention;

[0041] Figure 10 A partial enlarged view of the connection part between the connection component and the lifting drive component in an embodiment of the present invention;

[0042] Figure 11 A schematic diagram of the radio frequency circuit where the lower electrode device provided by an embodiment of the present invention is located. Detailed implementation manners

[0043] To enable those skilled in the art to better understand the technical solutions of the present invention, the following will describe in detail the lower electrode device and semiconductor process equipment provided by the present invention with reference to the accompanying drawings.

[0044] Please refer to Figure 1, Related technologies provide a lower electrode device 01, which includes an electrostatic chuck 011, an interface plate 012, a cylinder 013, a cylinder fixing block 014, a cylinder connecting piece 015, a height adjusting mechanism 016, and a radio frequency post 017. Among them, the radio frequency post 017 is fixedly connected to the interface plate 012 with screws at the center position of the bottom of the interface plate 012, and is used to feed radio frequency energy into the interface plate 012 from the center position, and then transfer it to the electrostatic chuck 011 through the interface plate 012 to ensure that the radio frequency energy is evenly distributed in the circumferential direction of the electrostatic chuck 011. The cylinder 013 is offset and fixed at the edge position of the bottom of the interface plate 012 through a cylinder fixing block 014 made of resin. The cylinder fixing block 014 made of resin can insulate the cylinder 013 from the interface plate 012 to prevent the current on the interface plate 012 from being transmitted to the cylinder 013, resulting in radio frequency path deviation and affecting the uniformity of radio frequency transmission. The piston rod of the cylinder 013 is connected to the height adjusting mechanism 016 through a cylinder connecting piece 015. Driven by the cylinder 013, the height adjusting mechanism 016 makes a lifting motion. The height adjusting mechanism 016 includes an annular base 0161 and an adjusting block. Among them, the annular base 0161 is arranged around the radio frequency post 017 and is fixedly connected to the cylinder connecting piece 015; and, the annular base 0161 is respectively connected to three thimble devices 018 through three adjusting blocks 0162. The adjusting block 0162 can adjust the height of the thimble device 018 so that the tops of the three thimble devices 018 are flush.

[0045] Specifically, please refer to Figure 2 , the thimble device 018 in the related technology includes a thimble (not shown in the figure) and a bellows 0182 sleeved on the thimble. The upper end of the bellows 0182 is hermetically connected to the interface plate 012 through a resin spacer 0183, and the lower end is hermetically connected to the outer peripheral wall of the mounting cylinder located below the thimble. The resin spacer 0183 is used to prevent the current on the interface plate 012 from being transmitted to the cylinder 013 through the bellows 0182, resulting in radio frequency path deviation. One end of the adjusting block 0162 is connected to the annular base 0161 through an adjusting screw 0163, and the other end is fixedly connected to the thimble. The adjusting block 0162, the thimble, and the bellows 0182 are set at the same potential. The adjusting screw 0163 is used to adjust the relative height between the adjusting block 0162 and the annular base 0161, so that the relative height between the thimble and the annular base 0161 can be adjusted. Therefore, by adjusting the relative height between the thimble and the annular base 0161, the height of the thimble relative to the interface plate 012 can be adjusted, so that the tops of the thimbles of the three thimble devices 018 can be made flush.

[0046] The related technology has the following disadvantages in practical applications:

[0047] In the etching process with a high aspect ratio, a relatively high RF energy is required, so the safety distance for preventing arcing needs to be farther. However, the space below the interface plate 12 is limited, and the distance between the RF post 017 and the annular base 0161 and the adjustment block 0162 in the height adjustment mechanism 016 and the RF post 017 is relatively close, making it easy to occur arcing phenomenon. Although the safety distance for preventing arcing can be increased, this will occupy more space, thus bringing great inconvenience to the installation, disassembly and maintenance of the ejector pin device 018.

[0048] To solve the above problems, please refer to Figure 3 and Figure 4 together. The lower electrode device 100 provided by an embodiment of the present invention is applied to a semiconductor process equipment, and includes a chuck assembly 1, an RF feeding component 2, a lifting driving component 3 and at least three connecting components 4. Among them, the chuck assembly 1 is used to carry a wafer. The chuck assembly 1 includes, for example, a chuck body 11 and an interface plate 12 disposed below the chuck body 11. Among them, the chuck body 11 is, for example, an electrostatic chuck. The RF feeding component 2 is used to feed RF energy into the interface plate 12, and the interface plate 12 is responsible for uniformly transferring these energies to the electrostatic chuck. On this basis, the interface plate 12 is also used to install at least three ejector pin devices 5.

[0049] The RF feeding component 2 is disposed at the central position of the bottom of the chuck assembly 1 (i.e., the interface plate 12) and is used to feed RF energy into the interface plate 12. As Figure 5 and Figure 6 shown, the RF feeding component 2 is fixedly connected to the interface plate 12 through, for example, a plurality of fixing screws 21, and the plurality of fixing screws 21 are evenly distributed along the circumferential direction of the interface plate 12 to ensure that the RF energy can be uniformly transferred to the interface plate 12.

[0050] As Figure 7As shown, the RF feeding component 2 is provided with a hollow space 22 and at least three openings 23. The at least three openings 23 are evenly distributed along the circumferential direction of the RF feeding component 2. Each opening 23 penetrates from the outer peripheral surface of the RF feeding component 2 to the inner peripheral surface forming the hollow space 22. Each opening 23 is used to communicate the hollow space 22 with the space outside the RF feeding component 2. In some embodiments, the RF feeding component 2 includes, for example, a cylinder that is coaxially arranged with the chuck assembly 1 (i.e., the interface disk 12) and is used to feed RF power to the chuck assembly 1; the interior of the cylinder forms the hollow space 22; the openings 23 penetrate the circumferential wall of the cylinder in the radial direction of the cylinder. In some examples, in order to facilitate the installation of the lifting drive component 3 in the hollow space 22, the upper end of the cylinder is an open end, and in order to facilitate the fixing and supporting of the lifting drive component 3, the lower end of the cylinder is a closed end. The upper end of the above-mentioned opening 23 can extend to the upper end surface of the cylinder, that is, the opening 23 is open on the upper end surface of the cylinder to facilitate passing the connecting component 4 through the opening 23. The opening 23 is, for example, strip-shaped, and the length direction of the opening 23 is parallel to the axial direction of the cylinder, so as to provide sufficient space for the lifting of the connecting component 4.

[0051] The lifting drive component 3 is arranged in the hollow space 22 and is set to be equipotential with the RF feeding component 2. The lifting drive component 3 is used to provide lifting power. At least three connecting components 4 are all connected to the drive part of the lifting drive component 3 and are used to lift under the drive of the lifting drive component 3; and each connecting component 4 extends out of the hollow space 22 through each opening 23 correspondingly and is used to be respectively connected to at least three thimble devices 5 of the semiconductor process equipment. Each connecting component 4 is used to transmit the lifting power provided by the lifting drive component 3 to each thimble device 5 correspondingly, so that each thimble device 5 can lift synchronously, so that it can rise above the bearing surface of the chuck assembly 1 (i.e., the chuck body 11) or descend below the bearing surface to be able to cooperate with the manipulator to realize the wafer pick-up and placement operation.

[0052] By setting the radio frequency feeding component 2 as a hollow structure, that is, provided with a hollow space 22 and at least three openings 23, and arranging the lifting driving component 3 in the hollow space 22 and making the lifting driving component 3 and the radio frequency feeding component 2 equipotential, the risk of discharge and sparking caused by potential difference can be completely eliminated, thereby improving the safety and reliability of the equipment. On this basis, by arranging the lifting driving component 3 in the hollow space 22 and connecting the driving parts of the lifting driving component 3 to the respective thimble devices 5 through the respective connecting components 4, the space occupied by the lifting driving component 3 can be reduced while realizing the lifting of the thimble devices 5. Compared with the prior art, no additional space is required to maintain the safety distance between the radio frequency feeding component 2 and the thimble devices 5, thereby providing a larger space for the maintenance of the entire lower electrode device 100 and facilitating the installation, disassembly and maintenance operations of the lower electrode device 100. In addition, since the radio frequency feeding component 2 is arranged at the central position of the bottom of the chuck assembly 1 and the lifting driving component 3 is equipotentially integrated into the hollow space 22 of the radio frequency feeding component 2, a uniform radio frequency circuit can be formed, as Figure 11 shown, the black arrows represent the paths of the radio frequency circuits of the lower electrodes where the lower electrode devices provided in the embodiments of the present invention are located; the gray arrows represent the paths of the radio frequency circuits of the upper electrodes of the semiconductor process equipment provided in the embodiments of the present invention. As Figure 11 can be seen, the radio frequency fed by the radio frequency feeding component 2 can form a uniform radio frequency circuit in the chuck assembly to generate uniform plasma, so that while eliminating the sparking risk and increasing the maintenance space, it will not have any negative impact on the high requirements for plasma uniformity in the etching process, ensuring the high performance and high precision of the etching equipment.

[0053] In some embodiments, as Figure 5 and Figure 8 shown, the lifting driving component 3 includes a first cylinder body 31 and a first cylinder rod 32. The first cylinder body 31 is arranged in the hollow space 22, fixedly connected to the radio frequency feeding component 2 and electrically conducted, so as to realize the equipotential setting of the two. One end of the first cylinder rod 32 is located in the first cylinder body 31, electrically conducted with the first cylinder body 31, and divides the interior of the first cylinder body 31 into two first spaces 33, Figure 5 and Figure 8The end of the first cylinder rod 32 located in the first cylinder block 31 abuts against the bottom surface of the internal space of the first cylinder block 31. In this case, the volume of the first space 33 located below this end is 0, while the volume of the first space 33 located above this end is the largest. The other end of the first cylinder rod 32 penetrates vertically upward through the top of the first cylinder block 31, extends to the outside of the first cylinder block 31, and is fixedly connected to each connecting component 4 and is electrically conductive. In this way, the first cylinder rod 32, the first cylinder block 31, and each connecting component 4 are set at the same potential, thereby completely eliminating the risk of discharge and sparking between these components and the radio frequency feeding component 2, thus improving the safety and reliability of the equipment. By selectively introducing a fluid (such as a gas or a liquid) into one of the first spaces 33, the lifting of the first cylinder rod 32 is controlled, and the synchronous lifting of each connecting component 4 is driven. Specifically, when a fluid is introduced into the first space 33 located below the end of the first cylinder rod 32 in the first cylinder block 31, the first cylinder rod 32 rises under the action of the fluid pressure, thereby driving the synchronous rise of each connecting component 4 and each thimble device 5; conversely, when a fluid is introduced into the first space 33 located above the end of the first cylinder rod 32 in the first cylinder block 31, the first cylinder rod 32 descends under the action of the fluid pressure, thereby driving the synchronous descent of each connecting component 4 and each thimble device 5.

[0054] In some embodiments, in order to achieve the overall lifting movement of the chuck assembly 1 and the components connected thereto, as Figure 5 and Figure 8 shown, the lifting drive component 3 further includes a second cylinder block 34 and a second cylinder rod 35. The second cylinder block 34 is located between the bottom surface of the first cylinder block 31 and the bottom surface of the hollow space 22. The second cylinder block 34 is fixedly connected to and electrically conductive with the first cylinder block 31 and the radio frequency feeding component 2 respectively, thereby realizing the equipotential setting of the two. One end of the second cylinder rod 35 is located in the second cylinder block 34, and is electrically conductive with the second cylinder block 34, and divides the interior of the second cylinder block 34 into two second spaces 36; Figure 5 and Figure 8At the end where the second cylinder rod 35 is located in the second cylinder block 34, it abuts against the top surface of the internal space of the second cylinder block 34. In this case, the volume of the second space 36 above this end is 0, while the volume of the second space 36 below this end is the largest. The other end of the second cylinder rod 35 vertically penetrates downward through the bottom of the hollow space 22 and extends outside the second cylinder block 34 and the radio frequency feeding component 2 for connection with a designated fixing member (not shown in the figure). The designated fixing member is, for example, the bottom wall of the process chamber or other fixing brackets, which provides an installation foundation for the second cylinder rod 35 and plays a supporting role. By selectively introducing a fluid (such as gas or liquid) into one of the second spaces 36, the lifting and lowering of the second cylinder block 34 are controlled, and the radio frequency feeding component 2 is driven to lift and lower synchronously. Specifically, when a fluid is introduced into the second space 36 below the end of the second cylinder rod 35 in the second cylinder block 34, the second cylinder rod 35 is fixed due to its connection with the designated fixing member, and the second cylinder block 34 descends relative to the second cylinder rod 35 under the action of the fluid pressure, thereby driving the radio frequency feeding component 2, the chuck assembly 1, the first cylinder block 31, the respective connecting components 4, and the respective thimble devices 5 fixedly connected to the second cylinder block 34 to descend synchronously; conversely, when a fluid is introduced into the second space 36 above the end of the second cylinder rod 35 in the second cylinder block 34, the second cylinder rod 35 is fixed due to its connection with the designated fixing member, and the second cylinder block 34 ascends relative to the second cylinder rod 35 under the action of the fluid pressure, thereby driving the radio frequency feeding component 2, the chuck assembly 1, the first cylinder block 31, the respective connecting components 4, and the respective thimble devices 5 fixedly connected to the second cylinder block 34 to ascend synchronously. Of course, in practical applications, the second cylinder block 34 and the second cylinder rod 35 can also be omitted, or other driving mechanisms that can drive the chuck assembly 1 to lift and lower can be used instead.

[0055] In an embodiment where the radio frequency feeding component 2 includes, for example, a cylinder, the above-mentioned first cylinder block 31 and second cylinder block 34 can both be circular cylinder blocks, square cylinder blocks, or cylinder blocks of any other shape, and the maximum dimension of the circumferential profile of these cylinder blocks is smaller than the inner diameter of the cylinder to ensure that these cylinder blocks can be installed in the hollow space 22. As Figure 5 and Figure 8 shown, a cushion block 37 is provided between the bottom surface of the second cylinder block 34 and the bottom surface of the hollow space 22 formed by the cylinder. The cushion block 37 is made of, for example, a flexible material to play a buffering role when the bottom surface of the second cylinder block 34 descends and contacts the cushion block 37, thereby avoiding vibration and impact on the cylinder block and the cylinder. As Figure 8As shown, the spacer block 37 can be fixedly connected to the bottom of the cylinder through a plurality of fixing screws 38. On this basis, the lower end of the second cylinder rod 35 sequentially penetrates the bottom wall of the second cylinder body 34, the spacer block 37 and the bottom wall of the cylinder, and extends below the cylinder to be able to connect with a specified fixing member. In addition, the second cylinder body 34 and the second cylinder rod 35 are electrically connected through the spacer block 37 to achieve equipotential setting.

[0056] In some embodiments, the top surface of the second cylinder body 34 is in contact with the bottom surface of the first cylinder body 31 to achieve equipotential setting between the first cylinder body 31 and the second cylinder body 34. The first cylinder body 31 and the second cylinder body 34 are fixed together, for example, through a plurality of fixing screws (not shown in the figure).

[0057] In some embodiments, as Figure 9 and Figure 10 shown, each connecting member 4 is a connecting rod, at least three connecting rods are evenly distributed along the circumference of the radio frequency feeding member 2, and one end of at least three connecting rods is fixedly connected to the other end (i.e., the upper end) of the first cylinder rod 32 through a central connecting portion 41; the central connecting portion 41 is, for example, a circular connecting block, which is arranged in the hollow space 22 and coaxially arranged with the first cylinder rod 32. The upper end of the first cylinder rod 32 is fixedly connected to the circular connecting block through a fixing screw 42, for example. The other ends of at least three connecting rods respectively pass through the openings 23 and extend outside the hollow space 22 along different radial directions of the radio frequency feeding member 2. That is to say, at least three connecting rods extend radially outward from the central connecting portion 41, and the extending direction coincides with one of the radial directions of the radio frequency feeding member 2, and the extending directions of different connecting rods coincide with different radial directions. Such a design can further enhance the uniformity of the radio frequency signal. Since the connecting rods are evenly distributed along the circumference of the radio frequency feeding member 2 and the central connecting portion 41 is coaxially arranged with the first cylinder rod 32, this structure can ensure that the radio frequency energy is more evenly distributed during the transmission process, thereby improving the quality and consistency of the etching process. Each connecting rod and the central connecting portion 41 are integrally formed, for example, to simplify the structure and improve the stability and reliability of the connection structure.

[0058] On this basis, the central connecting portion 41 is electrically connected to each connecting rod and the first cylinder rod 32 respectively. In this way, equipotential setting can be achieved between each connecting rod, the first cylinder rod 32, the first cylinder body 31 and the radio frequency feeding member 2 in sequence, thereby eliminating the risk of arcing.

[0059] In some embodiments, in order to ensure that the tops of at least three thimble devices 5 are flush with each other to ensure the flatness of the wafer when carrying the wafer. As Figure 4 , Figure 5 and Figure 9As shown, the lower electrode device 100 further includes at least three height adjustment structures 6. Each height adjustment structure 6 is used to connect each connecting component 4 to the corresponding thimble device 5 in a one-to-one correspondence, and can adjust the height of the corresponding thimble device 5.

[0060] Each height adjustment structure 6 for realizing the above functions, for example, includes a mounting component 61, a first adjusting member 62, and a second adjusting member. Among them, the mounting component 61 is located below the corresponding connecting component 4 and is fixedly connected to the corresponding thimble device 5, for example, connected together by fastening screws 64. The mounting component 61 is, for example, a strip-shaped block or a stepped strip-shaped block. As Figure 4 , Figure 5 and Figure 9 shown, the thimble device 5, for example, includes a thimble 51 and a bellows 52 sleeved on the thimble 51. The upper end of the bellows 52 is hermetically connected to the interface plate 12 through a resin spacer 53, and the lower end is hermetically connected to the outer peripheral wall of a mounting cylinder 54 located below the thimble 51. In this case, the mounting component 61 is fixedly connected to the corresponding mounting cylinder 54 located below the thimble 51. The mounting cylinder 54 is used to provide a mounting base and support for the thimble 51, and it can drive the thimble 51 to rise and fall under the drive of the mounting component 61.

[0061] As Figure 4 shown, the first adjusting member 62 penetrates the mounting component 61 in the vertical direction and is threadedly connected to the connecting component 4, and is used to lift the mounting component 61 relative to the connecting component 4 by rotation. The first adjusting member 62 is, for example, an adjusting screw. The second adjusting member penetrates the mounting component 61 in the vertical direction and is threadedly connected to the connecting component 4, and the second adjusting member is arranged to be able to adjust the distance between the mounting component 61 and the connecting component 4, so as to lift the mounting component 61 relative to the connecting component 4. By using the first adjusting member 62 and the second adjusting member in cooperation, the height of the mounting component 61 relative to the connecting component 4 can be adjusted, so as to realize the adjustment of the height of the corresponding thimble device 5.

[0062] Further, in some embodiments, the second adjusting member includes an adjusting screw 63 and an adjusting nut 66. The stud of the adjusting screw 63 penetrates the mounting member 61 in the vertical direction and is fixedly connected to the connecting member 4. In this case, the adjusting screw 63 is relatively fixed to the connecting member 4. The adjusting nut 66 is sleeved on the screw head and the stud of the adjusting screw 63 and is located below the mounting member 61. The adjusting nut 66 is threadedly connected to the stud of the adjusting screw 63 and supports the mounting member 61. By rotating the adjusting nut 66, with the cooperation of the adjusting nut 66 and the stud of the adjusting screw 63, the adjusting nut 66 can be lifted or lowered relative to the adjusting screw 63. At the same time, since the adjusting nut 66 supports the mounting member 61, the adjusting nut 66 can drive the mounting member 61 to lift or lower together, so that the distance between the mounting member 61 and the connecting member 4 can be adjusted, and the mounting member 61 can be lifted or lowered relative to the connecting member 4. Preferably, the diameter of the through hole on the mounting member 61 for the fastening screw 64 to pass through should be greater than the outer diameters of the stud and the screw head of the fastening screw 64, so that enough space can be reserved for the inclination of the mounting member 61 when adjusting the height of the mounting member 61.

[0063] As another technical solution, an embodiment of the present invention further provides a semiconductor process equipment, including the above-mentioned lower electrode device 100 provided by the embodiment of the present invention, and at least three thimble devices 5. The at least three thimble devices 5 are evenly distributed along the circumference of the chuck assembly 1 in the lower electrode device 100, and are driven by the respective connecting members 4 to rise above the bearing surface of the chuck assembly 1 or fall below the bearing surface.

[0064] The semiconductor process equipment provided by the embodiment of the present invention can completely eliminate the risk of discharge and sparking caused by potential difference by adopting the above-mentioned lower electrode device 100 provided by the embodiment of the present invention, thereby improving the safety and reliability of the equipment. At the same time, it increases the space for the installation, disassembly and maintenance of the thimble device 5, and does not affect the uniformity of the RF circuit.

[0065] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention. However, the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A lower electrode device is applied to semiconductor process equipment, characterized in that, Comprising: A chuck assembly for carrying a wafer; A radio frequency feeding component disposed at the center of the bottom of the chuck assembly, having a hollow space and at least three openings, the at least three openings being evenly distributed circumferentially along the radio frequency feeding component, and each opening penetrating from the outer peripheral surface of the radio frequency feeding component to the inner peripheral surface forming the hollow space; A lifting drive component disposed in the hollow space and isopotential with the radio frequency feeding component; and At least three connecting components, all connected to the driving part of the lifting drive component, for lifting under the drive of the lifting drive component; And each connecting component extends out of the hollow space through each opening correspondingly, for connecting with the ejector pin device of the semiconductor process equipment.

2. The lower electrode device according to claim 1, wherein The lifting drive component includes a first cylinder body and a first cylinder rod, the first cylinder body is disposed in the hollow space and fixedly connected to the radio frequency feeding component; One end of the first cylinder rod is located in the first cylinder body and divides the interior of the first cylinder body into two first spaces; the other end of the first cylinder rod serves as the driving part of the lifting drive component, vertically penetrating the top of the first cylinder body and extending to the outside of the first cylinder body, and fixedly connected to each connecting component; By selectively introducing fluid into one of the first spaces, the lifting of the first cylinder rod is controlled, and the synchronous lifting of each connecting component is driven.

3. The lower electrode device according to claim 2, characterized in that, The lifting drive component further includes a second cylinder body and a second cylinder rod, the second cylinder body is located between the bottom surface of the first cylinder body and the bottom surface forming the hollow space, the second cylinder body is fixedly connected to and electrically conductive with the first cylinder body and the radio frequency feeding component respectively; One end of the second cylinder rod is located in the second cylinder body and is electrically conductive with the second cylinder body, and divides the interior of the second cylinder body into two second spaces; the other end of the second cylinder rod vertically penetrates the bottom of the hollow space and extends to the outside of the second cylinder body and the radio frequency feeding component, for connecting with a designated fixing member; By selectively introducing fluid into one of the second spaces, the lifting of the second cylinder body is controlled, and the synchronous lifting of the radio frequency feeding component is driven.

4. The lower electrode device according to claim 2, wherein Each connecting component is a connecting rod, at least three connecting rods are evenly distributed circumferentially along the radio frequency feeding component, and one ends of at least three connecting rods are fixedly connected to the other end of the first cylinder rod through a central connecting part; the other ends of at least three connecting rods penetrate through each opening correspondingly and extend out of the hollow space along different radial directions of the radio frequency feeding component; The central connecting part is electrically conductive with each connecting rod and the first cylinder rod respectively.

5. The lower electrode device according to claim 1, characterized in that, The lower electrode device further includes at least three height adjustment structures, each height adjustment structure is used to connect each connecting component with the corresponding ejector pin device correspondingly, and can adjust the height of the corresponding ejector pin device.

6. The lower electrode device according to claim 5, characterized in that, Each of the height adjustment structures includes a mounting component, a first adjusting member, and a second adjusting member. Among them, the mounting component is located below the corresponding connecting component and is fixedly connected to the corresponding thimble device; the first adjusting member can support the mounting component, penetrates the mounting component in the vertical direction, and is threadedly connected to the connecting component, and is used to lift the mounting component relative to the connecting component by rotation; the second adjusting member penetrates the mounting component in the vertical direction, and is threadedly connected to the connecting component, and the second adjusting member is arranged to be able to adjust the distance between the mounting component and the connecting component so that the mounting component can be lifted or lowered relative to the connecting component.

7. The lower electrode device according to claim 6, characterized in that, The second adjusting member includes an adjusting screw and an adjusting nut. The stud of the adjusting screw penetrates the mounting component in the vertical direction and is fixedly connected to the connecting component; the adjusting nut is sleeved on the stud and the screw head of the adjusting screw and is located below the mounting component; the adjusting nut is threadedly connected to the stud and supports the mounting component.

8. The lower electrode device according to any one of claims 1-7, characterized in that, The radio frequency feeding component includes a cylinder, which is coaxially arranged with the chuck assembly and is used to feed radio frequency power to the chuck assembly; the interior of the cylinder constitutes the hollow space; the opening penetrates the circumferential wall of the cylinder in the radial direction of the cylinder.

9. The lower electrode device according to claim 8, characterized in that, The chuck assembly includes a chuck body and an interface plate arranged below the chuck body; The cylinder is fixedly connected to the central position of the bottom of the interface plate.

10. A semiconductor processing apparatus, characterized in that, Comprising: The lower electrode device according to any one of claims 1-9; At least three thimble devices, which are evenly distributed along the circumference of the chuck assembly in the lower electrode device, and are lifted above the bearing surface of the chuck assembly or lowered below the bearing surface under the drive of each connecting component.

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