Automatic semiconductor packaging machine with integrated intelligent positioning function

Abstract

The invention discloses an automatic semiconductor packaging machine with an integrated intelligent positioning function, which comprises an openable and closable shell, a longitudinal conveying belt is arranged in the shell, and a tray for placing a substrate is continuously conveyed on the conveying belt; the transverse servo guide rail is erected above the conveying belt; the longitudinal servo guide rail is arranged on the transverse servo guide rail in a sliding manner; the suction nozzle is arranged in the longitudinal servo guide rail, and three-dimensional positioning is achieved through cooperative movement of the transverse servo guide rail and the longitudinal servo guide rail; the plurality of feeder feeders are linearly arranged along one side of the conveyor belt and are used for supplying chips of different specifications to the conveyor belt; the alignment assembly comprises supports symmetrically arranged on the two sides of the conveying belt, and the side, facing the center of the conveying belt, of each support is provided with a side plate in sliding connection through a sliding rod; compared with the prior art, the layered supporting structure is introduced, the pressure is counteracted in real time in the welding process, and the interlayer gap is stabilized.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically to a semiconductor automatic packaging machine with an integrated intelligent positioning function. Background Art

[0002] With the rapid development of semiconductor devices towards high performance, miniaturization, and high integration, 3D packaging technology has become a key path to break through the bottleneck of traditional planar packaging due to its significant advantage in space utilization. 3D packaging vertically stacks multiple chips or chip layers and uses through-silicon vias (TSVs) bumping to achieve interlayer electrical signal transmission, which can greatly shorten the interconnect length, reduce signal delay, and improve system energy efficiency.

[0003] The core of 3D packaging lies in the precise stacking and interconnection of multiple layers of chips. Its process flow usually includes steps such as chip picking, interlayer alignment, temporary fixing, and reflow soldering. Traditional packaging equipment mostly uses multi-axis robotic arms to complete chip picking, placing, and stacking, and its positioning accuracy is limited by the repetitive positioning accuracy of the robotic arm and the accumulation of kinematic errors. Especially during multi-layer stacking, the layer-by-layer positioning error of the robotic arm will be amplified exponentially, resulting in an increase in the interlayer misalignment rate. In addition, the robotic arm lacks a real-time feedback and dynamic compensation mechanism. When the chip undergoes a small displacement due to thermal expansion or mechanical stress, the system cannot actively correct the position deviation, ultimately affecting the packaging yield.

[0004] During the reflow soldering process, the weight of the upper chip and the soldering pressure will be transmitted to the lower chip through the micro-bumps, resulting in excessive solder collapse. The collapse not only poses a risk of short circuit between adjacent bumps but also causes interface cracks due to stress concentration, reducing the product lifespan. Existing technologies have tried to alleviate this problem by reducing the soldering temperature or using high-hardness solder, but this will sacrifice the soldering strength or increase the process complexity.

[0005] Therefore, it is necessary to provide a semiconductor automatic packaging machine with an integrated intelligent positioning function to solve the problems raised in the above background art. Summary of the Invention

[0006] To achieve the above object, the present invention provides the following technical solution: A semiconductor automatic packaging machine with an integrated intelligent positioning function, comprising:

[0007] An openable and closable housing, inside which there is a longitudinally arranged conveyor belt, and trays for placing substrates are continuously conveyed on the conveyor belt;

[0008] A horizontal servo guide rail, erected above the conveyor belt;

[0009] A vertical servo guide rail, slidably arranged on the horizontal servo guide rail;

[0010] A nozzle, which is arranged in the longitudinal servo guide rail and realizes three-dimensional positioning through the coordinated movement of the transverse servo guide rail and the longitudinal servo guide rail;

[0011] A plurality of feeder units are linearly arranged along one side of the conveyor belt and are used to supply chips of different specifications;

[0012] An alignment component includes brackets symmetrically arranged on both sides of the conveyor belt, and on one side of each bracket facing the center of the conveyor belt, there is a side plate slidably connected through a slide bar.

[0013] Further, preferably, a welding device slidably connected to the longitudinal servo guide rail is fixed on one side of the nozzle.

[0014] Further, preferably, at the end of each slide bar away from the side plate, a connecting rod is hinged, and a slide rail parallel to the running direction of the conveyor belt is fixed between the two brackets. A slider is slidably arranged in the slide rail, and both connecting rods are hinged to the slider;

[0015] An electric push rod is fixed at the end of the slide rail, and the telescopic shaft of the electric push rod is fixed to the slider.

[0016] Further, preferably, a plurality of vertically arranged quartz sheets penetrate horizontally through each side plate, and insertion blocks embedded in the quartz sheets are slidably arranged respectively at the front and back of the side of the side plate away from the center of the conveyor belt.

[0017] Further, preferably, an end plate perpendicular to the running direction of the conveyor belt is fixed in the insertion block;

[0018] A pull rod is hinged in the insertion block. The two pull rods in the same side plate are respectively hinged to both ends of a rotating rod. A spline shaft is fixed at the center of the rotating rod, and the spline shaft is rotatably arranged in the corresponding bracket on one side.

[0019] Further, preferably, the spline shaft is connected to a gear through a ball spline sleeve. The gear is rotatably arranged in the corresponding bracket, and a drive motor for driving the gear is also arranged in the bracket.

[0020] Further, preferably, a plurality of vertical insertion sheets are inserted into the end plate, and the insertion sheets are movably connected to the end plate in the front and back directions.

[0021] Further, preferably, a through tooth groove is formed in each insertion sheet, and a tooth shaft penetrates through the tooth grooves of each insertion sheet in the same end plate. The tooth shaft is rotatably connected to the end plate in a loose and tight manner.

[0022] Further, preferably, the quartz sheet is slidably connected to the side plate in the transverse direction;

[0023] A plurality of laminations are fixedly stacked inside the inserted block, and each quartz sheet is respectively inserted into the gap between the laminations;

[0024] Outer sliding grooves and inner sliding grooves are respectively formed in the laminations, and the outer sliding groove and the inner sliding groove are transitioned through an arc-shaped sliding groove;

[0025] A sliding sheet is fixed in the quartz sheet, and the sliding sheet is slidably arranged in the outer sliding groove or the inner sliding groove or the arc-shaped sliding groove.

[0026] Further, as a preference, the front and rear positions of the arc-shaped sliding grooves of each lamination in the same inserted block are different;

[0027] Moreover, when two inserted blocks in the same side plate approach each other from the farthest point, the positions of the arc-shaped sliding grooves of different laminations enable the quartz sheets to extend out of the side plate from bottom to top in sequence

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] In the present invention, the symmetrical alignment component drives two connecting rods through an electric push rod to ensure that the two side plates always move in mirror symmetry, perform left and right positioning on the chip, effectively eliminate the center offset phenomenon during chip stacking, and can control the front and rear positioning of the inserted sheet through a driving motor.

[0030] In the present invention, a hierarchical and gradual quartz sheet support is adopted. Through the sliding groove design of the lamination, the quartz sheets extend out from bottom to top in the stacking order, can be accurately inserted into the chip gap, and form a physical support barrier during reflow soldering. Description of the Drawings

[0031] Figure 1 It is a schematic diagram of the overall structure of a semiconductor automatic packaging machine with an integrated intelligent positioning function;

[0032] Figure 2 It is a schematic diagram of the structure in the conveyor belt;

[0033] Figure 3 It is a top view structure schematic diagram of the alignment component;

[0034] Figure 4 It is a schematic diagram of the overall structure of the alignment component;

[0035] Figure 5 It is a schematic diagram of the structure of the side plate;

[0036] Figure 6 It is a schematic diagram of the structure where the sliding sheet in the inserted block is at the outer sliding groove;

[0037] Figure 7 It is a schematic diagram of the structure where the sliding sheet in the inserted block is at the inner sliding groove;

[0038] In the figure: 1. Outer shell; 2. Conveyor belt; 3. Transverse servo guide rail; 4. Longitudinal servo guide rail; 5. Suction nozzle; 6. Feeder; 7. Welding device; 8. Alignment component; 81. Bracket; 82. Side plate; 821. Quartz plate; 822. Rotating rod; 823. Pull rod; 824. Spline shaft; 825. Gear; 83. Slide bar; 84. Link; 85. Slide rail; 851. Slide block; 86. Electric push rod; 87. End plate; 871. Insert piece; 872. Tooth groove; 873. Tooth shaft; 88. Insert block; 881. Laminated sheet; 882. Outer chute; 883. Inner chute; 884. Arc chute; 885. Sliding piece; 89. Driving motor; 9. Tray. Detailed implementation mode

[0039] Please refer to Figures 1 - 7 , in the embodiment of the present invention, a semiconductor automatic packaging machine with an integrated intelligent positioning function includes:

[0040] An openable and closable outer shell 1, inside which a longitudinally arranged conveyor belt 2 is provided, and a tray 9 for placing a substrate is continuously conveyed on the conveyor belt 2;

[0041] A transverse servo guide rail 3 is erected above the conveyor belt 2;

[0042] A longitudinal servo guide rail 4 is slidably arranged on the transverse servo guide rail 3;

[0043] A suction nozzle 5 is arranged in the longitudinal servo guide rail 4, and three-dimensional positioning is realized through the coordinated movement of the transverse servo guide rail 3 and the longitudinal servo guide rail 4;

[0044] A plurality of feeders 6 are linearly arranged along one side of the conveyor belt 2 for supplying chips of different specifications;

[0045] An alignment component 8 includes brackets 81 symmetrically arranged on both sides of the conveyor belt 2, and on one side of each bracket 81 facing the center of the conveyor belt 2, there is a side plate 82 slidably connected through a slide bar 83.

[0046] That is to say, through the transverse servo guide rail 3 and the longitudinal servo guide rail 4, the suction nozzle 5 can be driven to sequentially pick up the chips in different feeders 6 and stack them on the substrate on the tray 9 passing through the center of the alignment component 8, so as to realize 3D packaging of the chips. By moving the side plates 82 on both sides towards the center, the chips on the substrate can be aligned left and right, thus playing a positioning role.

[0047] In this embodiment, a welding device 7 slidably connected to the longitudinal servo guide rail 4 is fixed on one side of the suction nozzle 5.

[0048] The soldering method of the soldering device 7 can be hot air reflow soldering or infrared reflow soldering. After the chips are stacked on the substrate and aligned, the soldering device 7 is aligned with the position where the substrate is located, and the chips can be soldered and encapsulated.

[0049] In this embodiment, a connecting rod 84 is hinged to one end of each of the two sliding rods 83 away from the side plate 82. A slide rail 85 parallel to the running direction of the conveyor belt 2 is fixed between the two brackets 81. A slider 851 is slidably arranged in the slide rail 85, and the two connecting rods 84 are both hinged to the slider 851;

[0050] An electric push rod 86 is fixed to the end of the slide rail 85, and the telescopic shaft of the electric push rod 86 is fixed to the slider 851.

[0051] That is to say, the electric push rod 86 can drive the slider 851 to slide, so that the two connecting rods 84 synchronously drive the two sliding rods 83 to slide, making the two side plates 82 approach or move away from each other, and their positions always remain symmetrical.

[0052] In this embodiment, a plurality of vertically arranged quartz sheets 821 penetrate horizontally through each side plate 82. Plug blocks 88 embedded in the quartz sheets 821 are slidably arranged respectively in the front and rear of the side of the side plate 82 away from the center of the conveyor belt 2.

[0053] By inserting the quartz sheets 821 into the gaps between each layer of chips to support each layer of chips, when the soldering device 7 heats the chips to melt the bumps at the solder joints, it can prevent the solder joints from collapsing and keep the bump spacing between the upper and lower layers of chips unchanged.

[0054] In this embodiment, an end plate 87 perpendicular to the running direction of the conveyor belt 2 is fixed in the plug block 88;

[0055] A pull rod 823 is hinged in the plug block 88. The two pull rods 823 in the same side plate 82 are respectively hinged to both ends of a rotating rod 822. A spline shaft 824 is fixed at the center of the rotating rod 822, and the spline shaft 824 is rotatably arranged in the corresponding bracket 81.

[0056] In this embodiment, the spline shaft 824 is connected to a gear 825 through a ball spline sleeve. The gear 825 is rotatably arranged in the corresponding bracket 81, and a drive motor 89 for driving the gear 825 is also arranged in the bracket 81.

[0057] The spline shaft 824 can slide in the gear 825 along with the movement of the side plate 82 through the ball spline sleeve. The drive motor 89 can drive the gear 825 to drive the spline shaft 824 to rotate, so as to adjust the inclination angle of the rotating rod 822, so that the pull rods 823 pull the two plug blocks 88 to approach or move away from each other, and further enable the end plate 87 to align the chips front and back.

[0058] In this embodiment, multiple vertical inserts 871 are inserted into the end plate 87, and the inserts 871 are connected to the end plate 87 in a manner that allows for front-back movement. The inserts 871 can precisely contact the front and back of the chip.

[0059] In this embodiment, each insert 871 is provided with a through-going tooth groove 872, and a tooth shaft 873 penetrates through the tooth grooves 872 of each insert 871 in the same end plate 87. The tooth shaft 873 is rotatably connected to the end plate 87 in a manner that allows for tightening and loosening.

[0060] By adjusting the number of rotation turns of the tooth shaft 873, the front-back positions of each insert 871 in the end plate 87 can be quickly adjusted to ensure that when the inserts 88 approach each other to the closest point, the inserts 871 exactly fit against the front or back end of the chip.

[0061] In this embodiment, the quartz plate 821 is connected to the side plate 82 in a manner that allows for lateral sliding;

[0062] Multiple stacked plates 881 are fixedly stacked inside the insert 88, and each quartz plate 821 is respectively inserted into the gaps between the stacked plates 881;

[0063] Outer sliding grooves 882 and inner sliding grooves 883 are respectively formed in the stacked plates 881, and the outer sliding groove 882 and the inner sliding groove 883 are transitioned through an arc-shaped sliding groove 884;

[0064] A sliding piece 885 is fixed to the quartz plate 821, and the sliding piece 885 is slidably disposed in the outer sliding groove 882 or the inner sliding groove 883 or the arc-shaped sliding groove 884.

[0065] That is to say, when the insert 88 slides back and forth, it will cause the sliding piece 885 to switch between the outer sliding groove 882 and the inner sliding groove 883, thereby causing the quartz plate 821 to extend out of the side plate 82 or retract into the side plate 82.

[0066] In this embodiment, the front-back positions of the arc-shaped sliding grooves 884 of each stacked plate 881 in the same insert 88 are different;

[0067] Moreover, when two inserts 88 in the same side plate 82 approach each other from the farthest point, the positions of the arc-shaped sliding grooves 884 of different stacked plates 881 cause the quartz plates 821 to extend out of the side plate 82 successively from bottom to top.

[0068] That is to say, during the process of the two inserts 88 approaching each other, the bottommost quartz plate 821 first extends out of the side plate 82. When the suction nozzle 5 places the chip on the upper layer, the side of the chip presses on this layer of quartz plate 821. The two inserts 88 continue to approach, causing the quartz plate 821 on the upper layer to extend out of the side plate 82. Thereafter, the suction nozzle 5 continues to place the chip on the layer above, thereby ensuring that the chips and the quartz plates 821 are stacked in sequence.

[0069] During specific implementation, the suction nozzle 5 moves above the target feeder 6 to adsorb the chip and then moves to the specified coordinates above the substrate, and releases the chip onto the substrate surface;

[0070] The electric push rod 86 pushes the slider 851, and through the connecting rod 84, the two side rods 83 are linked, so that the side plate 82 pushes the chip to the centrosymmetric position;

[0071] After the first layer of chips is placed, the drive motor 89 is started, the gear 825 drives the spline shaft 824 to rotate, the rotating rod 822 obliquely pulls the pull rod 823, so that the two insertion blocks 88 approach each other, and the bottom quartz sheet 821 first extends out of the side plate 82 and inserts into the gap between the chip and the substrate;

[0072] After each layer of chip stacking is completed, the two insertion blocks 88 continue to approach, and the quartz sheets 821 extend out in sequence from bottom to top to support the newly stacked chips;

[0073] After the two insertion blocks 88 approach until the topmost quartz sheet 821 extends out, the insertion sheet 871 precisely fits the front and rear edges of the chip;

[0074] The suction nozzle 5 carries the welding device 7 and moves above the substrate, heats the chip solder joints to the molten state, and the quartz sheet 821 supports the chip layer gap to prevent the solder joints from collapsing and ensure the stability of the bump pitch;

[0075] After welding is completed, the two insertion blocks 88 move to the farthest point, all the quartz sheets 821 completely retract into the side plate 82, and the side plate 82 leaves the side of the chip;

[0076] The conveyor belt 2 is started, and the substrate after encapsulation is conveyed to the end, the tray 9 is taken out and transferred to the next process.

[0077] The above-mentioned are only the preferred specific implementation manners of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A semiconductor automatic packaging machine with an integrated intelligent positioning function, characterized in that, Comprising: An openable and closable housing (1), inside which a longitudinally arranged conveyor belt (2) is provided, and trays (9) for placing substrates are continuously conveyed on the conveyor belt (2); A transverse servo guide rail (3) erected above the conveyor belt (2); A longitudinal servo guide rail (4) slidably arranged on the transverse servo guide rail (3); A suction nozzle (5) provided in the longitudinal servo guide rail (4), and three-dimensional positioning is achieved through the coordinated movement of the transverse servo guide rail (3) and the longitudinal servo guide rail (4); A plurality of feeder units (6) linearly arranged along one side of the conveyor belt (2) for supplying chips of different specifications; An alignment assembly (8) including brackets (81) symmetrically arranged on both sides of the conveyor belt (2), and on one side of each bracket (81) facing the center of the conveyor belt (2), there is a side plate (82) slidably connected through a slide bar (83).

2. The semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 1, wherein, On one side of the suction nozzle (5), a welding device (7) slidably connected to the longitudinal servo guide rail (4) is fixed.

3. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 1, characterized in that, At the ends of the slide bars (83) on both sides away from the side plates (82), connecting rods (84) are hinged. A slide rail (85) parallel to the running direction of the conveyor belt (2) is fixed between the two brackets (81), and a slider (851) is slidably arranged in the slide rail (85), and the two connecting rods (84) are both hinged to the slider (851); At the end of the slide rail (85), an electric push rod (86) is fixed, and the telescopic shaft of the electric push rod (86) is fixed to the slider (851).

4. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 1, characterized in that, In each side plate (82), a plurality of vertically arranged quartz plates (821) penetrate horizontally. On the front and back of the side of the side plate (82) away from the center of the conveyor belt (2), plug blocks (88) embedded in the quartz plates (821) are slidably arranged respectively.

5. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 5, characterized in that, In the plug block (88), an end plate (87) perpendicular to the running direction of the conveyor belt (2) is fixed; In the plug block (88), a pull rod (823) is hinged. The two pull rods (823) in the same side plate (82) are respectively hinged to both ends of a rotating rod (822), and a spline shaft (824) is fixed at the center of the rotating rod (822), and the spline shaft (824) is rotatably arranged in the corresponding bracket (81).

6. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 5, characterized in that, The spline shaft (824) is connected to a gear (825) through a ball spline sleeve, the gear (825) is rotatably arranged in the corresponding bracket (81), and a drive motor (89) for driving the gear (825) is also arranged in the bracket (81).

7. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 4, characterized in that, A plurality of vertical inserts (871) are inserted into the end plate (87), and the inserts (871) are movably connected to the end plate (87) in the front and back directions.

8. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 7, characterized in that, In each insert (871), a through tooth groove (872) is formed. In the tooth grooves (872) of each insert (871) in the same end plate (87), a tooth shaft (873) penetrates through together, and the tooth shaft (873) is rotatably connected to the end plate (87) in a loose and tight manner.

9. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 4, characterized in that, The quartz plate (821) is slidably connected to the side plate (82); A plurality of laminations (881) are fixedly stacked inside the insertion block (88), and each quartz sheet (821) is inserted into the gap between the laminations (881); Outer sliding grooves (882) and inner sliding grooves (883) are respectively formed in the laminations (881), and the outer sliding groove (882) and the inner sliding groove (883) are transitioned through an arc-shaped sliding groove (884); A sliding piece (885) is fixed in the quartz sheet (821), and the sliding piece (885) is slidably disposed in the outer sliding groove (882) or the inner sliding groove (883) or the arc-shaped sliding groove (884).

10. A semiconductor automatic packaging machine with an integrated intelligent positioning function according to claim 9, characterized in that, The front and rear positions of the arc-shaped sliding grooves (884) of each lamination (881) in the same insertion block (88) are different; Moreover, when the two insertion blocks (88) in the same side plate (82) approach each other from the farthest point, the positions of the arc-shaped sliding grooves (884) of different laminations (881) are such that the quartz sheets (821) extend out of the side plate (82) from bottom to top in sequence.

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