Chip packaging structure

Abstract

The present invention relates to the field of chip packaging technology, and specifically discloses a chip packaging structure, including a packaging machine, a sealing structure and a cleaning mechanism. The sealing structure includes an outer frame and an inner frame. The inner frame is longitudinally slidably installed inside the outer frame, and an accommodating cavity for accommodating bonding wires is provided between the two. An air port is provided on the side wall of the inner frame corresponding to the position of each bonding wire. Multiple groups of partitions are installed on the outer wall of the inner frame. A turntable and a driving member are installed on the packaging machine. An adsorption member is provided at the lower end of the turntable. The cleaning mechanism includes a purge member and a cleaning member. The purge member is installed at the lower end of the turntable. An air outlet that can communicate with the air port is provided on the purge member. The cleaning member is installed at the lower end of the purge member, and the distance between the cleaning member and the turntable can be adapted as the turntable moves up and down. The present invention can adsorb impurities on the surface of the chip through the cleaning member, and can purge the bonding wire position through the purge member to improve the cleaning effect.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging structure. Background Art

[0002] Chip packaging involves attaching a semiconductor chip (bare die) to a substrate, connecting the chip's electrodes to external circuits through wire bonding or flip-chip techniques, and encapsulating the chip with packaging materials (such as plastic, ceramic, or metal) to form a complete chip module. Wire bonding is one of the most common electrical connection methods, connecting the chip's electrodes to the pins on the packaging substrate using thin metal wires (usually gold or aluminum) to form bond wires.

[0003] During packaging, in order to ensure the subsequent packaging effect and chip performance, it is first necessary to clean the impurities on the surface of the chip and substrate, then place the outer frame on the substrate, and cover the upper end of the outer frame. Then, inject epoxy resin glue into the space enclosed by the outer frame, substrate and cover, and perform curing treatment to ensure that the glue is completely cured. After curing is completed, the packaged chip module is inspected and tested to ensure the sealing of the package.

[0004] The patent document with announcement number CN118866774B discloses a chip packaging structure and chip packaging method, including a workbench, a substrate rack installed on the top of the workbench, a support frame installed on one side wall of the workbench, a first electric slide installed on one side wall of the support frame, a compatible limit assembly connected to the output end of the first electric slide, a packaging assembly installed on the compatible limit assembly, and two sets of edge grinding assemblies are symmetrically arranged. When in use, the two sets of adsorption mud glue are pushed to adhere to the surface of the chip, penetrate into the openings on the surface of the chip to adsorb impurities, and in the process of pushing the adsorption mud glue for adsorption, it can drive the second sliding plate to slide and buffer in the second socket plate, avoiding the problem of chip damage due to excessive pressure, improving the impurity adsorption effect, and at the same time improving the chip packaging accuracy.

[0005] However, using this packaging structure to clean impurities from the chip surface presents several challenges. First, if impurities (such as hard particles) adhere to the surface of the adsorption mortar during its movement, these impurities can scratch the chip surface, breaking the protective layer on the chip surface and affecting chip reliability. Second, using adsorption mortar to clean bond wires can easily damage the bond wires, affecting chip operation. Summary of the Invention

[0006] The present invention provides a chip packaging structure, which aims to solve the problem that when cleaning the chip, scratches may be left on the chip surface, affecting the chip quality, and making it inconvenient to clean the bonding wire area.

[0007] A chip packaging structure of the present invention includes a packaging machine, which is provided with a workbench, a sealing structure and a cleaning mechanism;

[0008] The sealing structure includes an outer frame and an inner frame. The inner frame is longitudinally slidably installed inside the outer frame, and a cavity for accommodating bonding wires is provided between the inner frame and the inner frame. An air port is provided on the side wall of the inner frame corresponding to the position of each bonding wire. Multiple groups of partitions are installed on the outer wall of the inner frame. Each group of partitions includes two partitions, and the two partitions are respectively installed on both sides of the air port. A turntable and a driving member 1 are installed on the packaging machine. The driving member 1 is used to drive the turntable to move longitudinally. The lower end of the turntable is provided with an adsorption member for adsorbing the outer frame.

[0009] The cleaning mechanism includes a purge part and a cleaning part. The purge part is installed at the lower end of the turntable. The purge part is provided with an air outlet that can communicate with the air port. After the gas in the purge part is discharged from the air outlet, it will flow through the air port to the channel formed between the two partitions to purge the bonding wire. The cleaning part is installed at the lower end of the purge part and can clean impurities on the surface of the chip. The distance between the cleaning part and the turntable can be adapted as the turntable moves up and down.

[0010] The combined outer frame and inner frame are placed on the workbench, the turntable is driven downward by the driving part 1, and the outer frame is adsorbed by the adsorption part, and then the turntable is driven upward by the driving part 1, and the outer frame is driven upward at the same time. During this process, the inner frame will move downward relative to the outer frame under the action of gravity, so that the lower end of the inner frame is lower than the lower end of the outer frame; the bonded chip and substrate are placed on the workbench, and the turntable is driven downward by the driving part 1, and the outer frame, the purge part and the cleaning part are driven downward at the same time. During this process, the lower end of the inner frame will first contact the surface of the substrate, and the cleaning part will just move above the chip to remove impurities on the chip surface. The material is cleaned while avoiding scratches on the chip surface; then, as the turntable and the outer frame continue to move downward, the inner frame and the cleaning piece remain stationary, and the purge piece blows air into the accommodating cavity through the air outlet and the air port, and purges and cleans the bonding wires through the channel between the two partitions to avoid damage to the bonding wires; when the lower end of the outer frame contacts the surface of the substrate, the assembly between the outer frame, the inner frame and the substrate is completed, and then the adsorption piece releases the adsorption of the outer frame, and drives the turntable, the purge piece and the cleaning piece to move upward synchronously through the driving piece, and exit from the inner frame; finally, glue is injected for curing to obtain a complete chip module.

[0011] Preferably, the sealing structure also includes a cover plate, which can close the upper end of the outer frame to form a filling cavity for filling glue through the outer frame, inner frame and cover plate. A cavity for accommodating glue is provided inside the turntable. The upper end of the turntable is connected to a pipe communicating with the interior of the turntable. A through hole is provided on the cover plate, and the cover plate can be installed on the outside of the pipe through the through hole. The packaging machine is provided with a driving component 2 for driving the turntable to rotate.

[0012] The effect is that, through the coordinated control of the turntable rotation and longitudinal movement, the cover can be automatically assembled and the glue injection path can be optimized.

[0013] Preferably, a slide groove is longitudinally provided on the inner wall of the outer frame, and a slider is fixedly installed on the outer wall of the inner frame. The inner frame slides longitudinally with the slide groove through the slider. An opening is provided at the lower end of the slide groove so that the interior of the slide groove is communicated with the accommodating cavity. The width of the opening is smaller than the width of the slider to prevent the slider from detaching from the slide groove.

[0014] The effect is that as the glue in the accommodating cavity gradually increases, the glue can enter the interior of the slide groove through the opening at the lower end of the slide groove. When solidified, a mechanical interlocking structure can be formed between the inner frame and the outer frame, making the fixing effect between the inner frame and the outer frame better.

[0015] Preferably, the adsorption component includes a plurality of suction cups and a driving component for driving the suction cups to perform adsorption. Mounting portions for mounting the suction cups are provided on both sides of the turntable, and the lower ends of the suction cups and the lower end of the turntable are located at the same height.

[0016] Preferably, the purge member is an airbag, which is installed at the lower end of the turntable. The airbag is made of elastic material, and the air outlet is provided on the side wall of the airbag. When the adsorption member adsorbs the outer frame, the lower end of the turntable can close the upper end of the outer frame.

[0017] The effect is that the airbag can expand under the gravity of the cleaning piece and automatically replenish the gas. During the assembly process of the sealing structure, the airbag can be compressed to achieve automatic discharge of gas, and the bonding wire area can be directed purged. At the same time, it can ensure that the distance between the cleaning piece and the chip is constant to avoid damage to the chip.

[0018] Preferably, the cleaning piece is cleaning mud, which is formed by flexible material. A shell is installed at the lower end of the airbag, the shape of the shell is adapted to the shape of the inner frame, the lower end of the shell is open, and the cleaning mud can be detachably installed in the shell.

[0019] Preferably, the driving member 1 is provided on the packaging machine, and the output end extends vertically downward, the output end of the driving member 1 is connected to a U-shaped frame, the turntable is rotatably mounted on the U-shaped frame, and the driving member 2 is mounted on the U-shaped frame, and the output end extends horizontally.

[0020] Preferably, an air passage is longitudinally opened on the inner wall of the inner frame, and the lower end of the air passage is communicated with the air port, so that the air outlet is communicated with the air port through the air passage.

[0021] Preferably, the opposite sides of the two partitions are both in the shape of an inclined surface, and the inclined surface is inclined from top to bottom in a direction away from the other partition.

[0022] The effect is that the inclined surface design can guide the airflow to flush the bonding wire surface in a more gentle manner, and at the same time can increase the contact area between the inner frame and the substrate, so that the fixing effect between the inner frame and the substrate is better.

[0023] Preferably, the lower ends of the outer frame and the inner frame are both provided with notches for accommodating pins.

[0024] The beneficial effects of the present invention are:

[0025] The present invention is provided with a sealing structure and a cleaning mechanism. The sealing structure is formed by arranging an outer frame and an inner frame that can slide relative to each other. During the cleaning process, the bonding wires and the cleaning mechanism are effectively isolated to prevent damage caused by physical contact, while realizing rapid and accurate assembly of the sealing structure. During the assembly process, the impurities on the chip surface can be adsorbed and cleaned by the cleaning part, and the bonding wire parts can be purged and cleaned in a non-contact manner by the purge part. This has the advantages of preventing the chip surface from being scratched during the cleaning process, avoiding damage to the bonding wires, and improving the cleaning effect and the assembly efficiency of the sealing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0027] Figure 2 It is a schematic diagram of the assembly structure of the packaging machine and the cleaning mechanism of the present invention.

[0028] Figure 3 It is a structural schematic diagram of the present invention cut along the longitudinal direction.

[0029] Figure 4 The present invention Figure 3 Schematic diagram of the enlarged structure at point A in the middle.

[0030] Figure 5 It is a schematic diagram of the assembly structure of the turntable, the purge component and the cleaning component of the present invention.

[0031] Figure 6 It is a schematic diagram of the assembly structure of the outer frame and the inner frame of the present invention.

[0032] Figure 7 It is a schematic diagram of the assembly structure of the sealing structure and the substrate of the present invention.

[0033] Figure 8 It is a schematic diagram of the assembly structure of the substrate and the chip of the present invention.

[0034] Reference numerals:

[0035] 1. Packaging machine; 11. Turntable; 111. Pipeline; 12. Driving part 1; 13. Driving part 2; 14. U-shaped frame; 15. Suction cup; 21. Outer frame; 211. Slide groove; 22. Inner frame; 221. Air port; 222. Partition; 223. Slider; 224. Airway; 23. Cover; 231. Through hole; 3. Airbag; 31. Air outlet; 4. Cleaning mud; 41. Housing; 51. Substrate; 52. Chip; 53. Pin; 54. Bonding wire. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0037] like Figures 1 to 8 As shown, a chip packaging structure of the present invention includes a packaging machine 1, a sealing structure and a cleaning mechanism.

[0038] The packaging machine 1 is equipped with a workbench, which is equipped with a processing station for placing workpieces. When packaging a chip 52, the chip 52 is first fixed to the substrate 51, and the pins 53 of the chip 52 are connected to the pins 53 on the substrate 51 through wire bonding to form bonding wires 54. The substrate 51 is then placed on the processing station, and the chip 52 is packaged with a sealing structure to form a complete chip 52 module. During the packaging process, the packaging machine 1 is used to assemble the sealing structure and the chip 52. The cleaning mechanism is used to clean impurities from the surfaces of the substrate 51 and chip 52 to ensure the reliability and sealing of the subsequent packaging.

[0039] like Figures 1 to 8As shown, the sealing structure includes an outer frame 21, an inner frame 22 and a cover plate 23. The outer frame 21 and the inner frame 22 are both in the shape of a ring. The size of the outer frame 21 is adapted to the size of the substrate 51. The inner frame 22 is longitudinally slidably installed inside the outer frame 21, and a cavity for accommodating the bonding wire 54 is formed between the two. The lower ends of the outer frame 21 and the inner frame 22 are provided with notches for accommodating the pins 53, which realize the avoidance function of the pins 53 on the surface of the substrate 51. At the same time, it can effectively fix the position of the pins 53 during the subsequent glue filling process to prevent the glue from flowing and causing the pins 53 to deviate. The cover plate 23 can be pressed on the upper end of the outer frame 21 and seal the outer frame 21, so as to form a filling cavity for filling glue by enclosing the outer frame 21, the inner frame 22 and the cover plate 23. A plurality of air vents 221 are provided in the area near the bottom of the side wall of the inner frame 22, and each air vent 221 corresponds to the position of the bonding wire 54. Multiple groups of partitions are installed on the outer wall of the inner frame 22, each group of partitions includes two oppositely arranged plate structures, such as partitions 222, and the two partitions 222 are respectively installed on both sides of the air port 221, thereby forming a directional airflow channel to constrain the gas flow direction.

[0040] The cleaning mechanism includes a purge member and a cleaning member. The purge member is installed at the lower end of the turntable 11. The purge member is provided with a plurality of air outlets 31 that can communicate with the air port 221. After the gas in the purge member is discharged from the air outlet 31, it will flow through the air port 221 to the air flow channel formed between the two partitions 222, thereby realizing non-contact purging of the bonding wire 54. The cleaning member is installed at the lower end of the purge member and can clean the impurities on the surface of the chip 52. The distance between the cleaning member and the turntable 11 can be adapted as the turntable 11 moves up and down to ensure that the cleaning distance between the cleaning member and the surface of the chip 52 is constant during the packaging process. The packaging machine 1 is equipped with a turntable 11 and a driving member 12. The driving member 12 is used to drive the turntable 11 to move longitudinally. The lower end of the turntable 11 is provided with an adsorption member for adsorbing the outer frame 21.

[0041] During operation, the combined outer frame 21 and inner frame 22 are first placed on a workbench. The turntable 11 is driven downward by the driver 12, allowing the purge and cleaning components to enter the interior of the inner frame 22. The outer frame 21 is then attracted by the adsorption component. The turntable 11 is then driven upward by the driver 12, simultaneously driving the outer frame 21 upward. During this process, the inner frame 22 moves downward relative to the outer frame 21 under the action of gravity until the inner frame 22 reaches its lowest limit position relative to the outer frame 21, with the lower end of the inner frame 22 lower than the lower end of the outer frame 21. At this point, the turntable 11 and outer frame 21 continue to move upward, and the inner frame 22 moves upward synchronously. Next, the bonded chip 52 and substrate 51 are placed on the workbench, and the turntable 11 is driven downward by the driving member 12, and the outer frame 21, the purge member and the cleaning member are driven downward at the same time. During this process, the lower end of the inner frame 22 will first contact the surface of the substrate 51. At this time, the cleaning member just moves above the chip 52 to clean the impurities on the surface of the chip 52. Then, as the turntable 11 and the outer frame 21 continue to move downward, the inner frame 22 and the cleaning member remain stationary, and the purge member blows air into the accommodating cavity through the air outlet 31 and the air port 221, and performs a purge-type cleaning on the bonding wire 54 through the channel between the two partitions 222 until the lower end of the outer frame 21 contacts the surface of the substrate 51, completing the assembly between the outer frame 21, the inner frame 22 and the substrate 51. Subsequently, the adsorption member releases the adsorption of the outer frame 21, and drives the turntable 11, the purge member and the cleaning member to move upward synchronously through the driving member 12, and exits from the inside of the inner frame 22. At this point, the cover plate 23 can be pressed against the upper end of the outer frame 21 to form a filling cavity between the cover plate 23, the outer frame 21, and the substrate 51. Epoxy resin glue is then injected into the filling cavity for curing to obtain a complete chip 52 module. Furthermore, during the glue injection process, the bonding wires 54 can be isolated and protected by the inner frame 22, allowing the glue to gradually flow into the accommodating cavity through the air port 221 and cover and protect the bonding wires 54, rather than directly impacting the bonding wires 54, thereby preventing damage to the bonding wires 54.

[0042] Therefore, dynamic sealing is achieved through the relative sliding of the outer frame 21 and the inner frame 22, and gravity is used to ensure that the inner frame 22 contacts the substrate 51 first, forming a positioning reference. By maintaining a constant cleaning distance between the cleaning element and the surface of the chip 52, impurities are effectively cleaned while avoiding damage to the chip 52. The air port 221 and the partition 222 form a directional airflow channel, enabling non-contact cleaning of the bond wires 54, avoiding damage to the bond wires 54 caused by traditional physical contact cleaning.

[0043] like Figures 1 to 5As shown, a cavity for storing glue is provided inside the turntable 11. The upper end of the turntable 11 is connected to a pipe 111 that communicates with the inside of the turntable 11 for injecting and discharging glue. A solenoid valve is provided on the pipe 111. A through hole 231 is provided on the cover plate 23. The cover plate 23 can be plugged and installed on the outside of the pipe 111 through the through hole 231 to achieve detachable fixation between the cover plate 23 and the turntable 11. The driving member 12 is provided on the packaging machine 1, and the output end extends vertically downward. The output end of the driving member 12 is connected to the U-shaped frame 14. The driving member 12 can be a cylinder, an electric push rod, etc. The turntable 11 is rotatably mounted on the U-shaped frame 14. The packaging machine 1 is provided with a driving member 2 13 for driving the turntable 11 to rotate. The driving member 2 13 is installed on the U-shaped frame 14, and the output end extends horizontally. The driving member 2 13 can be a motor.

[0044] Specifically, in the initial state, the lower end of the turntable 11 faces downward. At this time, the turntable 11 is driven downward by the driving member 12, and the outer frame 21 can be adsorbed by the adsorption member. Then, the turntable 11 is driven to rise to a predetermined height by the driving member 12, and the outer frame 21 and the inner frame 22 are driven to move upward. After the bonded substrate 51 and the chip 52 are placed on the workbench, the turntable 11 is driven downward again by the driving member 12 to realize the assembly of the outer frame 21, the inner frame 22 and the substrate 51. In this process, the surface of the chip 52 is cleaned by the cleaning member, and the bonding wire 54 is cleaned by the purge member. In the process of adsorbing the outer frame 21, the cover plate 23 can be placed on the upper end of the turntable 11 by manual or mechanical assistance, so that the cover plate 23 is fixed to the outside of the pipe 111 through the through hole 231. After the outer frame 21 is assembled, the turntable 11 is moved upward by the driving member 12, so that the cleaning member and the purge member are withdrawn from the inner frame 22. The turntable 11 is then rotated 180 degrees by the driving member 2 13, so that the upper end of the turntable 11 faces downward, and the cover plate 23 is moved to the bottom of the turntable 11. The turntable 11 is then driven downward again by the driving member 12, and the cover plate 23 is pressed against the upper end of the outer frame 21, completing the automatic installation of the outer frame 21 and the cover plate 23. The solenoid valve is then opened, and the glue is injected from the cavity of the turntable 11 into the filling cavity through the pipe 111. After the glue injection is completed, the solenoid valve is closed, and the turntable 11 is driven upward by the driving member 12. The turntable 11 is then driven to rotate and reset by the driving member 2 13. Therefore, this process achieves the dual guarantee of optimizing the glue injection path and ensuring the sealing performance through the coordinated control of the rotation and longitudinal movement of the turntable 11.

[0045] like Figures 2 to 6As shown, in order to achieve longitudinal sliding between the outer frame 21 and the inner frame 22, a slide groove 211 is longitudinally provided on the inner wall of the outer frame 21, and a slider 223 is fixedly installed on the outer wall of the inner frame 22. The inner frame 22 can longitudinally slide with the slide groove 211 through the slider 223. The lower end of the slide groove 211 is provided with an opening, so that the interior of the slide groove 211 is connected to the accommodating cavity, and the width of the opening is smaller than the width of the slider 223 to prevent the slider 223 from escaping from the slide groove 211. In addition, in order to improve the fixing effect between the outer frame 21 and the cover plate 23, a protrusion adapted to the slide groove 211 is connected to the peripheral side of the cover plate 23. When the cover plate 23 is buckled onto the upper end of the outer frame 21, the protrusion can be stuck in the slide groove 211.

[0046] Specifically, after the glue is injected into the inner frame 22 from the pipe 111, the glue will flow into the accommodating cavity through the air port 221 on the side wall of the inner frame 22. As the glue in the accommodating cavity gradually increases, the glue can enter the interior of the chute 211 through the opening at the lower end of the chute 211 and flow upward along the inner wall of the chute 211, covering the contact surface between the slider 223 and the chute 211. During the curing process, the glue forms a glue layer that wraps around the slider 223 and fills the chute 211, forming a mechanical interlocking structure between the outer frame 21 and the inner frame 22, thereby improving the fixing effect between the outer frame 21 and the inner frame 22. The design of the opening width of the chute 211 being smaller than the width of the slider 223 makes it impossible for the slider 223 to detach through the opening when sliding in the chute 211.

[0047] like Figures 1 to 5 As shown, the adsorption component includes a plurality of suction cups 15 and a driving component three for driving the suction cups 15 to perform adsorption. Mounting portions for mounting the suction cups 15 are provided on both sides of the turntable 11. The number of suction cups 15 can be four or six, evenly distributed on the mounting portions on both sides of the turntable 11, and the spacing between adjacent suction cups 15 can be adjusted according to the size of the outer frame 21. The suction cup 15 can be made of silicone or rubber, and its adsorption surface can be provided with a corrugated texture to increase contact friction. The driving component three can be an air pump or a vacuum generator, which is connected to each suction cup 15 through an independent air path to achieve independent adjustment of the adsorption force of a single suction cup 15.

[0048] like Figures 2 to 5As shown, the purge part is an airbag 3, which is fixedly mounted on the lower end of the turntable 11 by a snap-fit ​​structure for easy disassembly and replacement. The airbag 3 is made of an elastic material, such as silicone or rubber material, and has compression rebound properties. It can play a role of buffering and gas storage during the cleaning process, and the air outlets 31 are distributed in an array on the circumferential side wall of the airbag 3. The lower end of the suction cup 15 is at the same height as the lower end of the turntable 11, so that when the adsorption part adsorbs the outer frame 21, the lower end of the turntable 11 and the upper end of the outer frame 21 can be at the same height, and then the upper end of the outer frame 21 is closed by the turntable 11. The cleaning part is cleaning mud 4, which is made of flexible materials such as silicone and rubber. It has good plasticity and adsorption properties and can avoid the risk of scratches caused by rigid contact with the chip 52. A housing 41 is mounted at the lower end of the airbag 3. Made of hard plastic or metal, its shape matches the internal contour of the inner frame 22. This allows the suction element to adhere to the outer frame 21, creating a sealed space between the turntable 11 and the housing 41. This prevents the gas within the airbag 3 from escaping through the air outlet 31, concentrating the airflow on the bond wire 54 and enhancing the targeted purge effect. The lower end of the housing 41 is open, and the cleaning mud 4 is removably mounted within the housing 41 using snaps or magnetic attachment, facilitating replacement and cleaning.

[0049] Specifically, in the initial state, the airbag 3 expands downward due to the gravity of the cleaning mud 4, causing external air to flow into the airbag 3 through the air outlet 31, keeping the airbag 3 in a certain state of expansion. When the turntable 11 is driven downward by the driving member 12, the outer frame 21 adsorbed by the suction cup 15 can be driven to move downward synchronously. During this process, the inner frame 22 will first contact the surface of the substrate 51, and the lower end of the cleaning mud 4 will just contact the surface of the chip 52, using its adsorption properties to clean impurities on the surface of the chip 52. Then, as the turntable 11 and outer frame 21 continue to move downward, the inner frame 22 and the cleaning mud 4 remain stationary, causing the turntable 11 to move downward relative to the cleaning mud 4. During this process, the airbag 3 is compressed, and the air inside it is discharged outward through the air outlet 31. It acts on the surface of the bonding wire 54 through the directional channel, purging impurities on the surface of the bonding wire 54. When the turntable 11 is driven upward by the driving member 12, the airbag 3 and the cleaning mud 4 can be driven to withdraw from the inner frame 22. During this process, the airbag 3 will expand again under the gravity of the cleaning mud 4, replenishing the gas in the airbag 3 and preparing for the next purge.

[0050] like Figures 4 to 7As shown, an air channel 224 is provided on the inner wall of the inner frame 22. The air channel 224 extends longitudinally along the inner wall of the inner frame 22. Its cross-sectional shape can be rectangular or semicircular. The lower end of the air channel 224 is connected to the air port 221, and the upper end extends to an area close to the top of the inner frame 22, forming a complete gas transmission path, ensuring that the air outlet 31 can communicate with the air port 221 through the air channel 224. A guide groove or a smooth coating can be provided on the inner wall of the air channel 224 to further reduce flow resistance. When the turntable 11 drives the airbag 3 downward, the air outlet 31 on the side wall of the airbag 3 is aligned with the top of the air channel 224. When the gas enters the air channel 224, it is restricted by the longitudinal channel and cannot diffuse horizontally. Therefore, it acts on the channel formed by the two partitions 222 at the air port 221, effectively covering the area where the bonding wire 54 is located, and enhancing the cleaning effect of the bonding wire 54.

[0051] like Figure 6 and Figure 7 As shown, the opposing sides of the two partitions 222 are both beveled, with the bevels sloping downwards away from the other partition 222. The beveled sidewalls of the partitions 222 form a gradually expanding channel structure from top to bottom, allowing the airflow to gradually diffuse during longitudinal flow, guiding the airflow to more gently cover the surface of the bonding wire 54, enhancing the ability to flush impurities on both sides of the bonding wire 54, while also preventing damage to the bonding wire 54 due to concentrated airflow. In addition, the beveled design increases the contact area between the inner frame 22 and the substrate 51, resulting in a better fixation between the inner frame 22 and the substrate 51.

[0052] The packaging structure of the present invention operates as follows: Initially, the turntable 11 is raised to a predetermined height by the driver 12, ensuring sufficient space beneath the turntable 11 for placing the workpiece. At this point, the airbag 3 expands downward due to the gravity of the cleaning mud 4, causing ambient air to flow into the airbag 3 through the air outlet 31, maintaining a constant state of expansion. The assembled outer and inner frames 21 and 22 are then placed on a workbench, while the cover 23 is placed on the upper end of the turntable 11.

[0053] The turntable 11 is driven downward by the driving member 12, allowing the purge and cleaning members to enter the interior of the inner frame 22. When the lower end of the suction cup 15 contacts the outer frame 21, the driving member 3 is activated, and the outer frame 21 is sucked by the suction cup 15. The turntable 11 is then driven upward by the driving member 12, which also drives the outer frame 21 upward. During this process, the inner frame 22 moves downward relative to the outer frame 21 under the action of gravity, causing the slider 223 to slide downward along the slide groove 211 until the slider 223 is at the lowest end of the slide groove 211. At this point, the inner frame 22 is at its lowest limit position relative to the outer frame 21, causing the lower end of the inner frame 22 to be lower than the lower end of the outer frame 21. The turntable 11 and outer frame 21 are then driven upward by the driving member 12, and the inner frame 22 moves upward synchronously. After the turntable 11 moves up to the set height, the bonded chip 52 and substrate 51 are placed on the workbench. The turntable 11 is then driven downward by the driving member 12, which simultaneously drives the outer frame 21, the airbag 3, and the cleaning mud 4 downward. During this process, the lower end of the inner frame 22 first contacts the surface of the substrate 51, while the lower end of the cleaning mud 4 just contacts the surface of the chip 52, using its adsorption properties to remove impurities from the surface of the chip 52. Then, as the turntable 11 and outer frame 21 continue to move downward, the inner frame 22 and the cleaning mud 4 remain stationary. During this process, the airbag 3 is compressed, and the gas inside it is discharged outward through the air outlet 31 and flows downward along the air channel 224. It then flows from the air outlet 221 into the channel formed between the two partitions 222, performing a purge-type cleaning on the bonding wire 54 until the lower end of the outer frame 21 contacts the surface of the substrate 51, completing the assembly between the outer frame 21, the inner frame 22, and the substrate 51.

[0054] Subsequently, driver 3 is closed, releasing the suction cup 15 from the outer frame 21, and driver 1 12 drives the turntable 11, airbag 3, and cleaning mud 4 to move upward synchronously and exit from the interior of the inner frame 22. Driver 2 13 then drives the turntable 11 to rotate 180 degrees, so that the upper end of the turntable 11 faces downward. Driver 1 12 then drives the turntable 11 downward again, pressing the cover plate 23 against the upper end of the outer frame 21, completing the automatic installation of the outer frame 21 and the cover plate 23, and forming a filling cavity between the cover plate 23, the outer frame 21, and the base plate 51. The solenoid valve is then opened, injecting the epoxy resin glue stored in turntable 11 into the filling cavity. The glue flows into the receiving cavity through air port 221. As the glue in the receiving cavity gradually overflows, it enters the interior of chute 211 through the opening at the lower end of chute 211 and flows upward along the inner wall of chute 211. After the glue is injected, the solenoid valve is closed, and the turntable 11 is driven upward by driver 12. Then, driver 2 13 drives the turntable 11 to rotate and reset. The packaged chip 52 is sent to the next step for curing to ensure that the glue is completely cured, resulting in a complete chip 52 module.

[0055] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A chip packaging structure, comprising a packaging machine (1), wherein a workbench is provided on the packaging machine (1), characterized in that: Also includes a sealing structure and a cleaning mechanism; The sealing structure includes an outer frame (21) and an inner frame (22), the inner frame (22) is longitudinally slidably installed inside the outer frame (21), and a cavity for accommodating a bonding wire (54) is provided between the inner frame (22), an air port (221) is provided on the side wall of the inner frame (22) corresponding to the position of each bonding wire (54), a plurality of groups of partitions are installed on the outer wall of the inner frame (22), each group of partitions includes two partitions (222), and the two partitions (222) are respectively installed on both sides of the air port (221), a turntable (11) and a driving member (12) are installed on the packaging machine (1), the driving member (12) is used to drive the turntable (11) to move longitudinally, and an adsorption member for adsorbing the outer frame (21) is provided at the lower end of the turntable (11); The cleaning mechanism includes a purge member and a cleaning member. The purge member is installed at the lower end of the turntable (11). The purge member is provided with an air outlet (31) that can communicate with the air port (221). After the gas in the purge member is discharged from the air outlet (31), it will flow through the air port (221) to the channel formed between the two partitions (222) to purge the bonding wire (54). The cleaning member is installed at the lower end of the purge member and can clean impurities on the surface of the chip (52). The distance between the cleaning member and the turntable (11) can be adapted as the turntable (11) moves up and down.

2. The chip packaging structure according to claim 1, wherein: The sealing structure further includes a cover plate (23), which can seal the upper end of the outer frame (21) so as to form a filling cavity for filling glue by enclosing the outer frame (21), the inner frame (22) and the cover plate (23). A cavity for accommodating glue is provided inside the turntable (11). The upper end of the turntable (11) is connected to a pipe (111) communicating with the inside of the turntable (11). A through hole (231) is provided on the cover plate (23), and the cover plate (23) can be installed on the outside of the pipe (111) through the through hole (231). The packaging machine (1) is provided with a driving member 2 (13) for driving the turntable (11) to rotate.

3. The chip packaging structure according to claim 1, wherein: A slide groove (211) is longitudinally provided on the inner wall of the outer frame (21), and a slider (223) is fixedly installed on the outer wall of the inner frame (22). The inner frame (22) longitudinally slides with the slide groove (211) through the slider (223). An opening is provided at the lower end of the slide groove (211) so that the interior of the slide groove (211) communicates with the accommodating cavity. The width of the opening is smaller than the width of the slider (223) to prevent the slider (223) from detaching from the slide groove (211).

4. The chip packaging structure according to claim 1, wherein: The adsorption component includes a plurality of suction cups (15) and a driving component 3 for driving the suction cups (15) to perform adsorption. Mounting portions for mounting the suction cups (15) are provided on both sides of the turntable (11). The lower ends of the suction cups (15) and the lower end of the turntable (11) are located at the same height.

5. The chip packaging structure according to claim 4, characterized in that: The purge member is an airbag (3), which is installed at the lower end of the turntable (11). The airbag (3) is made of elastic material, and the air outlet (31) is provided on the side wall of the airbag (3). When the adsorption member adsorbs the outer frame (21), the lower end of the turntable (11) can close the upper end of the outer frame (21).

6. The chip packaging structure according to claim 5, characterized in that: The cleaning piece is cleaning mud (4), which is formed by a flexible material. A shell (41) is installed at the lower end of the airbag (3). The shape of the shell (41) is adapted to the shape of the interior of the inner frame (22). The lower end of the shell (41) is open, and the cleaning mud (4) is detachably installed in the shell (41).

7. The chip packaging structure according to claim 2, wherein: The first driving member (12) is provided on the packaging machine (1), and the output end thereof extends vertically downward. The output end of the first driving member (12) is connected to a U-shaped frame (14). The turntable (11) is rotatably mounted on the U-shaped frame (14). The second driving member (13) is mounted on the U-shaped frame (14), and the output end thereof extends horizontally.

8. The chip packaging structure according to claim 1, wherein: An air passage (224) is longitudinally provided on the inner wall of the inner frame (22), and the lower end of the air passage (224) is communicated with the air port (221), so that the air outlet (31) is communicated with the air port (221) through the air passage (224).

9. The chip packaging structure according to claim 1, wherein: The opposite sides of the two partitions (222) are both in the shape of an inclined surface, and the inclined surface is inclined from top to bottom in a direction away from the other partition (222).

10. The chip packaging structure according to claim 1, wherein: The lower ends of the outer frame (21) and the inner frame (22) are both provided with notches for accommodating the pins (53).

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