Laminating device and laminating method

Abstract

The invention discloses a wafer combining device and method, and the device comprises a manipulator which is used for conveying a tray and a wafer; the sensor is used for identifying center coordinates and directions of the tray and the wafer; the moving platform can reciprocate in the X-axis direction and the Y-axis direction relative to the sensor; the X axis and the Y axis are positioned in the same horizontal plane; the first bearing assembly is arranged on the moving platform and comprises a first bearing part used for bearing the tray or the combination of the tray and the wafer; the first driving mechanism is connected with the first bearing assembly and used for driving the first bearing part to rotate along the first axis so as to adjust the direction of the tray; and the lifting mechanism can penetrate through the center position of the first bearing assembly in the vertical direction to perform lifting motion and is used for driving local parts of the wafer and / or the tray to perform lifting motion or descending motion. According to the invention, frequent calibration of the center position or direction of the wafer or the tray can be avoided, and the wafer combination efficiency of the wafer and the tray is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a wafer bonding device and a wafer bonding method. Background Art

[0002] During the semiconductor manufacturing process, wafers are usually picked and placed from a tray in an automated manner (such as the cooperation of a lifting mechanism and a manipulator). This picking and placing method places extremely high requirements on the center alignment accuracy of both the tray and the wafer. However, in semiconductor processes, the tray is prone to positional deviation after multiple translational and lifting movements, resulting in a decrease in the center alignment accuracy between the tray and the wafer. In such a case, manual alignment operations on the tray and the wafer are often required, which are complex and affect the picking and placing efficiency of the wafer.

[0003] In addition, when performing the operation of placing the wafer on the tray (i.e., the wafer bonding operation), if the positions of the tray and the wafer have been corrected, and then the wafer is transported to the tray by the manipulator for wafer bonding, the wafer bonding accuracy between the wafer and the tray will be reduced due to the displacement generated by the manipulator, and even wafer bonding cannot be achieved. Therefore, it is necessary to adjust the wafer bonding method between the wafer and the tray. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer bonding device and a wafer bonding method. After calibrating the center positions of the wafer and the tray, when performing subsequent operations of adjusting the directions of the tray and the wafer and placing the wafer on the tray, the center positions or directions of the adjusted wafer or tray will no longer change, which can avoid frequent calibration and thus effectively improve the wafer bonding efficiency between the wafer and the tray.

[0005] To achieve the above purpose, the present invention is realized through the following technical solutions:

[0006] A wafer bonding device, comprising:

[0007] A manipulator for transporting the tray and the wafer;

[0008] A sensor for identifying the center coordinates and directions of the tray and the wafer;

[0009] A moving platform that can reciprocate along the X-axis and Y-axis directions relative to the sensor; the X-axis and the Y-axis are in the same horizontal plane;

[0010] A first carrying component disposed on the moving platform, which includes a first supporting portion for carrying the tray or the combination of the tray and the wafer;

[0011] A first driving mechanism connected to the first carrying component for driving the first supporting portion to rotate along a first axis to adjust the direction of the tray; and

[0012] A lifting mechanism, which can penetrate through the central position of the first bearing component in the vertical direction to perform lifting motion, and is used to drive a part of the wafer and / or the tray to move up or down.

[0013] Optionally, a first mark is provided on the wafer, a second mark is provided on the tray, and the sensor determines the direction of the wafer or the tray based on the detected first mark or second mark;

[0014] The sensor is electrically connected to the first driving mechanism. When the sensor detects that the second mark is at the set position, a first driving mechanism stop signal is generated to adjust the direction of the tray to be consistent with the direction of the wafer.

[0015] Optionally, the wafer bonding device further includes: a centering mechanism, which expands and contracts along the direction of approaching or moving away from the first axis to push against the tray and calibrate the central position of the tray.

[0016] Optionally, the centering mechanism includes:

[0017] A centering part, which is at the same horizontal height as the first supporting part;

[0018] A second driving mechanism, which is connected to the centering part and is used to drive the centering part to perform telescopic motion of approaching or moving away from the first axis, so that the central axis of the tray coincides with the first axis.

[0019] Optionally, the wafer bonding device further includes: a second bearing component, which is fixed relative to the sensor and includes a supporting structure; the supporting structure includes a second supporting part for supporting the wafer, and the second supporting part is located above the first supporting part;

[0020] The second bearing component further includes at least one contraction mechanism, and the contraction mechanism drives the second supporting part to switch between a contraction position and a bearing position relative to the supporting structure; and in the contraction position, the distance between the second supporting part and the supporting center of the second supporting part is greater than the radius of the wafer; in the bearing position, the distance between the second supporting part and the supporting center of the second supporting part is less than the radius of the wafer.

[0021] On the other hand, the present invention also provides a wafer bonding method using the wafer bonding device as described above. The tray is configured as a split tray with an inner tray and an outer tray or the tray is configured as an annular tray. The wafer bonding method includes:

[0022] Step S1, transporting the tray to the moving platform of the wafer bonding device and calibrating the central position of the tray;

[0023] Step S2: Transfer the wafer above the moving platform and hold the position of the wafer by a holding structure;

[0024] Step S3: Identify the center coordinates and orientation of the wafer;

[0025] Step S4: Move the moving platform directly below the wafer and adjust the orientation of the tray to be consistent with the orientation of the wafer;

[0026] Step S5: Lift the wafer indirectly by jacking up the inner tray through the lifting mechanism or directly lift the wafer through the inner space of the annular tray;

[0027] Step S6: The lifting mechanism drops to place the combination of the wafer and the inner tray or the wafer on the tray; wherein, between Step S5 and Step S6, the holding structure provides a clearance space for the up and down movement of the wafer.

[0028] Optionally, Step S1 includes:

[0029] Transfer the tray above the moving platform by a manipulator and lift the tray, identify the center coordinates of the tray, move the moving platform directly below the tray, and then place the tray on the first supporting part;

[0030] Or,

[0031] Place the tray on the first supporting part by the manipulator and calibrate the center position of the tray through the centering mechanism of the combined sheet.

[0032] Optionally, the holding structure in Step S2 is configured as the second carrying component of the manipulator or the wafer combining device.

[0033] Optionally, the method of making the holding structure provide a clearance space for the up and down movement of the wafer between Step S5 and Step S6 includes: when the holding structure is configured as the manipulator, withdraw the manipulator to provide the clearance space; when the holding structure is configured as the second carrying component, make the second supporting part in the retracted position to provide the clearance space.

[0034] The present invention has at least one of the following advantages compared with the prior art:

[0035] A wafer bonding device and method provided by the present invention can calibrate the central positions of a tray and a wafer through the cooperation of a sensor and a moving platform; the direction of the tray can be adjusted through the cooperation of the sensor, a first driving mechanism, and a first carrying component so that the direction of the tray is consistent with that of the wafer; the wafer can be placed on the tray through a lifting mechanism to achieve wafer bonding with the tray. After the central positions of the wafer and the tray are calibrated in the present invention, when performing subsequent operations of adjusting the direction of the tray to be consistent with that of the wafer and placing the wafer on the tray, the central positions or directions of the adjusted wafer or tray will no longer change, which can avoid frequent calibration of the central positions or directions of the wafer and the tray, thereby effectively improving the wafer bonding efficiency between the wafer and the tray, and further effectively improving the semiconductor process efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic cross-sectional view of a wafer bonding device provided in Embodiment 1 of the present invention;

[0037] Figure 2 is a top view of a wafer bonding device provided in Embodiment 1 of the present invention;

[0038] Figure 3 is a schematic structural view of a tray provided by the present invention;

[0039] Figure 4 is a schematic structural view of a wafer provided by the present invention;

[0040] Figure 5 is a schematic structural view of a first fork tooth of a robot provided by the present invention;

[0041] Figure 6 is a schematic structural view of a second fork tooth of a robot provided by the present invention.

[0042] Figure 7 is a schematic cross-sectional view of a wafer bonding device provided in Embodiment 2 of the present invention;

[0043] Figure 8 is a top view of a wafer bonding device provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0044] The following further elaborates on a laminating device and a laminating method proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features, and advantages of the present invention more obvious and understandable, please refer to the accompanying drawings. It should be known that the structures, scales, sizes, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that the present invention can produce and the purpose that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0045] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article, or device comprising the said element.

[0046] Example 1

[0047] In conjunction with the attached Figures 1 to 6As shown in the figure, this embodiment provides a wafer bonding device, including: a manipulator for transporting the tray 101 and the wafer 102; a sensor 110 for identifying the center coordinates and directions of the tray 101 and the wafer 102; a moving platform 120 that can reciprocate relative to the sensor 110 in the X-axis and Y-axis directions; the X-axis and the Y-axis are located in the same horizontal plane, and in a preferred embodiment, the X-axis and the Y-axis are perpendicular to each other; a first carrying component 130 disposed on the moving platform 120, which includes a first supporting portion 1301 for carrying the tray 101 or the combination of the tray 101 and the wafer 102; a first driving mechanism 140 connected to the first carrying component 130 for driving the first supporting portion 1301 to rotate along the first axis A-A to adjust the direction of the tray 101; and a lifting mechanism 150 that can pass through the center position of the first carrying component 130 in the vertical direction to perform lifting movement for driving the wafer 102 and / or a part of the tray 101 to move up or down.

[0048] Specifically, in one embodiment, as Figure 5 and Figure 6 shown, the manipulator includes a first fork tooth 181 for carrying the tray 101 and a second fork tooth 182 for carrying the wafer 102; and the moving trajectories of the first fork tooth 181 and the second fork tooth 182 do not interfere with each other, so that the manipulator can transport the tray 101 and the wafer 102 simultaneously or non-simultaneously. Optionally, the upper surface of the first fork tooth 181 (i.e., the surface for carrying the tray) is provided with a first pit 1811 matching the tray 101 to limit the tray 101, thereby preventing the tray 101 from sliding during the movement of the manipulator and further avoiding the risk of the tray 101 falling; similarly, the upper surface of the second fork tooth 182 (i.e., the surface for carrying the wafer) is provided with a second pit 1821 matching the wafer 102 to limit the wafer 102, thereby preventing the wafer 102 from sliding during the movement of the manipulator and further avoiding the risk of the wafer 102 falling, but the present invention is not limited thereto.

[0049] Specifically, in one embodiment, the first fork teeth 181 in the robot arm can transfer the tray 101 above the moving platform 120 and lift the tray 101 to maintain the position of the tray 101. Subsequently, the sensor 110 can identify the central coordinates of the tray 101, and the moving platform 120 is moved directly below the tray 101. At this time, the central axis of the tray 101 coincides with the first axis A-A. Then, the tray 101 is placed on the first supporting part 1301, thereby completing the central position calibration of the tray 101 relative to the moving platform 120. Optionally, the central axis of the moving platform 120 can be set to coincide with the first axis A-A, or the central axis of the lifting mechanism 150 can be set to coincide with the first axis A-A. Preferably, the central axes of the moving platform 120 and the lifting mechanism 150 coincide, but the present invention is not limited thereto.

[0050] Specifically, in one embodiment, after completing the central position calibration of the wafer 102 relative to the moving platform 120, the second fork teeth 182 of the robot arm can transfer the wafer 102 above the moving platform 120 and lift the wafer 102 to maintain the position of the wafer 102. Subsequently, the sensor 110 identifies the central coordinates of the wafer 102, and the moving platform 120 carrying the tray 101 is moved directly below the wafer 102. At this time, the central axis of the wafer 102 coincides with the first axis A-A, thereby completing the central position calibration of the wafer 102 relative to the moving platform 120, and further making the central axis of the wafer 102 coincide with the central axis of the tray 101 to ensure the centering accuracy between the wafer 102 and the tray 101. However, the present invention is not limited thereto.

[0051] Specifically, in one embodiment, after completing the central position calibration of the wafer 102 relative to the moving platform 120, the direction of the wafer 102 is identified by the sensor 110. Subsequently, the direction of the tray 101 on the first supporting part 1301 is adjusted through the cooperation of the sensor 110 and the first driving mechanism 140 to make the direction of the tray 101 consistent with the direction of the wafer 102. More specifically, after completing the direction adjustment of the tray 101, the wafer 102 is lifted from the second fork teeth 182 of the robot arm by the lifting mechanism 150 and the wafer 102 is supported. Subsequently, the robot arm is withdrawn to create a clearance space for the wafer 102 to descend. Then, the lifting mechanism 150 descends to place the wafer 102 on the tray 101, thereby completing the wafer bonding of the wafer 102 and the tray 101.

[0052] As can be seen from the above, in this embodiment, after calibrating the central positions of the wafer 102 and the tray 101, when performing subsequent operations of adjusting the direction of the tray 101 to be consistent with the direction of the wafer 102 and placing the wafer 102 on the tray 101, the central positions of the wafer 102 and the tray 101 will no longer change, which can avoid frequent calibration of the central positions of the wafer 102 and the tray 101, thereby effectively improving the wafer bonding efficiency between the wafer 102 and the tray 101, and further effectively improving the semiconductor process efficiency.

[0053] In addition, in one embodiment, the number of the first supporting portions 1301 may be multiple, and the multiple first supporting portions 1301 may be arranged at intervals along the circumferential direction of the first carrying component 130 to stably carry the tray 101 or the combination of the tray 101 and the wafer 102. Optionally, the first supporting portion 1301 has a bearing surface for carrying the tray 101 (not shown in the figure), and the bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm, so that the first supporting portion 1301 can carry trays with different diameters, and also makes the wafer bonding device have a wide range of applicability. Optionally, the first carrying component 130 is rotatably connected to the moving platform 120 through a bearing 190, and the first driving mechanism 150 may be fixed on the moving platform 120, but the present invention is not limited thereto.

[0054] Please continue to refer to Figure 1 、 Figure 3 and Figure 4 , a first mark 1021 is provided on the wafer 102, a second mark 1014 is provided on the tray 101, and the sensor 110 determines the direction of the wafer 102 based on the detected first mark 1021 and determines the direction of the tray 101 based on the detected second mark 1014; optionally, the sensor 110 uses the polar angle of the first mark 1021 or the second mark 1014 in a preset polar coordinate system as the corresponding direction of the wafer 102 or the tray 101; taking Figure 3 and Figure 4 as an example, the first mark 1021 is configured at the midpoint position of the flat edge of the wafer 102, and the second mark 1014 is configured at the V tip position of the V groove at the edge of the tray 101.

[0055] It can be understood that the sensor 110 is electrically connected to the first driving mechanism 140. When the sensor 110 detects that the second mark 1014 is at the set position, a first driving mechanism stop signal is generated to adjust the direction of the tray 101 to be consistent with the direction of the wafer 102.

[0056] Specifically, in one embodiment, after the center position calibration of the wafer 102 relative to the moving platform 120 is completed, the sensor 110 detects the first mark 1021 and determines the direction of the wafer 102 according to the detected first mark 1021. Subsequently, the first driving mechanism 140 drives the first supporting portion 1301 and the tray 101 to rotate. When the sensor 110 detects that the second mark 1014 is at the set position, it indicates that the direction of the tray 101 is consistent with the direction of the wafer 102. At this time, the adjustment of the direction of the tray 101 is completed, and the sensor 110 sends the first driving mechanism stop signal to the first driving mechanism 140, so that the first supporting portion 1301 and the tray 101 stop rotating. After that, the wafer 102 is placed on the tray 101 through the lifting mechanism 150, and the wafer bonding of the wafer 102 and the tray 101 can be completed. Optionally, the sensor 110 can be a CCD linear module or an image sensor, but the present invention is not limited thereto.

[0057] Specifically, in one embodiment, as Figure 3 shown, the tray 101 can be configured as a split tray having an inner tray 1012 and an outer tray 1011, where the inner tray 1012 is used to carry the wafer 102, and the outer tray 1011 is used to carry the inner tray 1012 or the combination of the inner tray 1012 and the wafer 102. In this case, when the wafer 102 is placed on the tray 101, the lifting mechanism 150 abuts against the inner tray 1012 and indirectly jacks up the wafer 102 to support the combination of the wafer 102 and the inner tray 1012 and separate the wafer 102 from the second fork 182 of the manipulator. And after the manipulator withdraws, the lifting mechanism 150 falls back to place the combination of the wafer 102 and the inner tray 1012 on the outer tray 1011, thereby completing the wafer bonding of the wafer 102 and the tray 101. Optionally, a gap 1821 for the lifting mechanism 150 and the inner tray 1012 to pass through is further provided on the second fork 182 of the manipulator, so that the lifting mechanism 150 can jack up the wafer 102. Optionally, a receiving groove 1013 matching the wafer 102 is further provided on the outer tray 1011 to receive the wafer 102, but the present invention is not limited thereto.

[0058] In some other embodiments, the tray can also be configured as an annular tray, and the inner diameter of the annular tray is smaller than the diameter of the wafer 102, so that the annular tray can carry the wafer 102; at the same time, the inner diameter of the annular tray is also larger than the diameter of the lifting mechanism 150, so that the lifting mechanism 150 can pass through the inner space of the annular tray and directly jack up the wafer 102 from below to support the wafer 102 and separate the wafer 102 from the second fork teeth 182 of the manipulator. Similarly, after the manipulator withdraws, the lifting mechanism 150 drops back to place the wafer 102 on the annular tray, thus completing the lamination of the wafer 102 and the tray 101, but the present invention is not limited thereto.

[0059] Embodiment 2

[0060] Combined with the attached Figures 3 to 8 As shown in the figure, the difference between this embodiment and Embodiment 1 is that the lamination device further includes: a centering mechanism 160 that expands and contracts along a direction approaching or departing from the first axis A-A to push against the tray 101 and calibrate the central position of the tray 101.

[0061] Specifically, in one embodiment, when calibrating the central position of the tray 101 relative to the moving platform 120, the tray 101 can be directly transferred to the first supporting portion 1301 by the first fork teeth 181 in the manipulator; subsequently, the centering mechanism 160 pushes against the tray 101 carried on the first supporting portion 1301 to make the central axis of the tray 101 coincide with the first axis A-A, thereby completing the calibration of the central position of the tray 101 relative to the moving platform 120. As can be seen from the above, the provision of the centering mechanism 160 can eliminate the operations of the manipulator lifting the tray 101 to maintain the position of the tray 101 and moving the moving platform 120 to directly below the tray 101. In this way, the efficiency of calibrating the central position of the tray 101 can be further improved, the calibration accuracy can be ensured, and at the same time, the manipulator can be prevented from being occupied by the tray for a long time, improving the utilization efficiency of the manipulator, but the present invention is not limited thereto.

[0062] More specifically, the centering mechanism 160 includes: a centering portion 1601 at the same horizontal height as the first supporting portion 1301; a second driving mechanism 1602 connected to the centering portion 1601 for driving the centering portion 1601 to perform an expansion and contraction movement approaching or departing from the first axis A-A, so that the central axis of the tray 101 coincides with the first axis A-A.

[0063] In one embodiment, the number of the centering parts 1601 may be multiple. The multiple centering parts 1601 may be arranged at intervals along the circumferential direction of the first bearing component 130, and each centering part 1601 may perform synchronous telescopic movement of approaching or departing from the first axis A-A driven by the second driving mechanism 1602, so as to adjust the central position of the tray 101 in multiple directions, thereby improving the calibration efficiency of the central position of the tray 101. Optionally, the second driving mechanism 1602 may be installed on the moving platform 120, and the second driving mechanism 1602 may be connected to the centering part 1601 through a connecting rod 1603, but the present invention is not limited thereto.

[0064] Combined with the attached Figures 7 to 8 As shown, the difference between this embodiment and the first embodiment is further that the wafer bonding device further includes: a second bearing component 170, which is fixed relative to the sensor 110 and includes a supporting structure; the supporting structure includes a second supporting part 1701 for supporting the wafer 102, and the second supporting part 1701 is located above the first supporting part 1301.

[0065] It can be understood that the second bearing component 170 further includes at least one contraction mechanism (not shown in the figure), and the contraction mechanism drives the second supporting part 1701 to switch between a contraction position and a bearing position relative to the supporting structure. The second supporting part 1701 includes a bearing area (not shown in the figure) for bearing the wafer. It may be defined that the center of this bearing area is the supporting center of the second supporting part 1701. When in the bearing position, the distance between the second supporting part 1701 and the supporting center is less than the radius of the wafer 102, so that the second supporting part 1701 can bear the wafer 102; when in the contraction position, the distance between the second supporting part 1701 and the supporting center is greater than the radius of the wafer 102, so as to provide a clearance space for the up and down movement of the wafer 102.

[0066] Specifically, in one embodiment, after the central position of the tray 101 relative to the moving platform 120 is calibrated, the wafer 102 can be directly transferred onto the second supporting part 1701 through the second fork teeth 182 of the manipulator and the wafer 102 can be held in position by the second supporting part 1701; subsequently, the central coordinates of the wafer 102 are identified by the sensor 110, and the moving platform 120 carrying the tray 101 is moved to directly below the wafer 102. At this time, the central axis of the wafer 102 coincides with the first axis A-A, thereby completing the calibration of the central position of the wafer 102 relative to the moving platform 120, and further making the central axis of the wafer 102 coincide with the central axis of the tray 101.

[0067] Specifically, in one embodiment, after completing the orientation adjustment of the tray 101 and making the orientation of the tray 101 consistent with the orientation of the wafer 102, the wafer 102 is lifted from the second supporting portion 1701 by the lifting mechanism 150 and the wafer is supported; subsequently, the second supporting portion 1701 can be switched from the carrying position to the retracted position through the retracting mechanism to create a clearance space for the wafer 102 to descend; then the lifting mechanism 150 is lowered to place the wafer 102 on the tray 101, thereby completing the wafer bonding of the wafer 102 and the tray 101.

[0068] As can be seen from the above, the setting of the second carrying component 170 can cancel the operation of the manipulator lifting the wafer 102 to maintain the position of the wafer 102, which can further improve the efficiency of central position calibration of the wafer 102, ensure the calibration accuracy, and at the same time avoid the manipulator being occupied by the wafer for a long time, improving the utilization efficiency of the manipulator, but the present invention is not limited thereto.

[0069] In addition, in one embodiment, the upper surface of the second supporting portion 1701 (i.e., the surface for carrying the wafer) is provided with a third pit 1702 matching the wafer 102 to limit the wafer 102, thereby avoiding the risk of the wafer 102 slipping off the second supporting portion 1701, but the present invention is not limited thereto.

[0070] Based on the same inventive concept, the present invention further provides a wafer bonding method using the wafer bonding device as described above. The tray 101 is configured as a split tray having an inner tray 1012 and an outer tray 1011 or the tray is configured as an annular tray. The wafer bonding method includes: Step S1, transporting the tray 101 to the moving platform 120 of the wafer bonding device and calibrating the central position of the tray 101; Step S2, transporting the wafer 102 above the moving platform 120 and holding the position of the wafer 102 by a holding structure; Step S3, identifying the central coordinates and orientation of the wafer 102; Step S4, moving the moving platform 120 directly below the wafer 102 and adjusting the orientation of the tray 101 to be consistent with the orientation of the wafer 102; Step S5, indirectly jacking up the wafer 102 by jacking up the inner tray 1012 through the lifting mechanism 150 or directly jacking up the wafer 102 through the inner space of the annular tray; Step S6, the lifting mechanism 150 retracts to place the combination of the wafer 102 and the inner tray 1012 or the wafer 102 on the tray 101; wherein, a clearance space for the up and down movement of the wafer 102 is provided by the holding structure between Step S5 and Step S6.

[0071] Specifically, in one embodiment, when the centering mechanism 160 is not provided in the wafer bonding device, Step S1 includes: transporting the tray 101 above the moving platform 120 by a manipulator and lifting the tray 101, identifying the central coordinates of the tray 101, moving the moving platform 120 directly below the tray 101, and then placing the tray 101 on the first supporting portion 1301.

[0072] In another embodiment, when the centering mechanism 160 is provided in the wafer bonding device, Step S1 includes: placing the tray 101 on the first supporting portion 1031 by the manipulator and calibrating the central position of the tray 101 by the centering mechanism 160 of the wafer bonding device.

[0073] Specifically, in one embodiment, when the second supporting assembly 170 is not provided in the wafer bonding device, the holding structure in Step S2 is configured as the manipulator; and the method for providing a clearance space for the up and down movement of the wafer by the holding structure between Step S5 and Step S6 includes: when the holding structure is configured as the manipulator, withdrawing the manipulator to provide the clearance space.

[0074] In another embodiment, when the wafer bonding device is provided with the second carrying component 170, the holding structure configuration in step S2 can be the second carrying component 170 of the wafer bonding device; and the method for making the holding structure provide a clearance space for the wafer to move up and down between step S5 and step S6 includes: when the holding structure is configured as the second carrying component 170, making the second supporting portion 1701 be in the retracted position to provide the clearance space.

[0075] In summary, for the wafer bonding device and the wafer bonding method provided by the present invention, the center positions of the tray and the wafer can be calibrated through the cooperation of the sensor and the moving platform; the direction of the tray can be adjusted through the cooperation of the sensor, the first driving mechanism, and the first carrying component so that the direction of the tray is consistent with that of the wafer; the wafer can be placed on the tray through the lifting mechanism to realize the wafer bonding with the tray. After the center positions of the wafer and the tray are calibrated in the present invention, when performing subsequent operations of adjusting the direction of the tray to be consistent with that of the wafer and placing the wafer on the tray, the center position or direction of the adjusted wafer or tray will no longer change, which can avoid frequent calibration of the center position or direction of the wafer and the tray, thereby effectively improving the wafer bonding efficiency between the wafer and the tray, and further effectively improving the semiconductor process efficiency. In addition, the setting of the centering mechanism in the present invention can cancel the operations of the manipulator lifting the tray to maintain the position of the tray and moving the moving platform to directly below the tray, which can further improve the efficiency of calibrating the center position of the tray, ensure the calibration accuracy, avoid the manipulator being occupied by the tray for a long time, and improve the use efficiency of the manipulator; the setting of the second carrying component can cancel the operation of the manipulator lifting the wafer to maintain the position of the wafer, which can further improve the efficiency of calibrating the center position of the wafer, ensure the calibration accuracy, avoid the manipulator being occupied by the wafer for a long time, and improve the use efficiency of the manipulator.

[0076] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be construed as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and substitutions to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A laminating device, characterized in that, Comprising: A manipulator for transporting trays and wafers; A sensor for identifying the center coordinates and directions of the tray and the wafer; A moving platform that can reciprocate along the X-axis and Y-axis directions relative to the sensor; the X-axis and the Y-axis are in the same horizontal plane; A first carrying assembly disposed on the moving platform, which includes a first supporting portion for carrying the tray or the combination of the tray and the wafer; A first driving mechanism connected to the first carrying assembly for driving the first supporting portion to rotate along a first axis to adjust the direction of the tray; And A lifting mechanism that can penetrate the center position of the first carrying assembly in the vertical direction for lifting and lowering movements, for driving a part of the wafer and / or the tray to move up or down.

2. The laminating device according to claim 1, wherein, A first mark is provided on the wafer, and a second mark is provided on the tray. The sensor determines the direction of the wafer or the tray based on the detected first mark or second mark; The sensor is electrically connected to the first driving mechanism. When the sensor detects that the second mark is at a set position, a first driving mechanism stop signal is generated to adjust the direction of the tray to be consistent with the direction of the wafer.

3. The laminating device according to claim 2, wherein, Further comprising: A centering mechanism that expands and contracts along a direction approaching or departing from the first axis to push against the tray and calibrate the center position of the tray.

4. The laminating device according to claim 3, wherein, The centering mechanism includes: A centering portion at the same horizontal height as the first supporting portion; A second driving mechanism connected to the centering portion for driving the centering portion to perform an expansion and contraction movement approaching or departing from the first axis, so that the central axis of the tray coincides with the first axis.

5. The laminating device according to claim 4, characterized in that, Further comprising: A second carrying assembly fixed relative to the sensor, which includes a supporting structure; the supporting structure includes a second supporting portion for carrying the wafer, and the second supporting portion is above the first supporting portion; The second carrying assembly further includes at least one contraction mechanism that drives the second supporting portion to switch between a contraction position and a carrying position relative to the supporting structure; and in the contraction position, the distance between the second supporting portion and the center of support of the second supporting portion is greater than the radius of the wafer; in the carrying position, the distance between the second supporting portion and the center of support of the second supporting portion is less than the radius of the wafer.

6. A laminating method using the laminating device according to any one of claims 1-5, wherein the tray is configured as a split tray having an inner tray and an outer tray or the tray is configured as an annular tray, characterized in that, The wafer bonding method includes: Step S1, transporting the tray to the moving platform of the wafer bonding device and calibrating the center position of the tray; Step S2, transporting the wafer above the moving platform and holding the position of the wafer through a holding structure; Step S3, identifying the center coordinates and direction of the wafer; Step S4, moving the moving platform directly below the wafer and adjusting the direction of the tray to be consistent with the direction of the wafer; Step S5, indirectly jacking up the wafer by pushing against the inner tray through the lifting mechanism or directly jacking up the wafer through the inner space of the annular tray; Step S6: The lifting mechanism descends to place the combination of the wafer and the inner tray or the wafer on the tray; wherein, a clearance space for the up-and-down movement of the wafer is provided by the holding structure between step S5 and step S6.

7. The laminating method according to claim 6, wherein, The step S1 includes: Transferring the tray above the moving platform by a manipulator and lifting the tray, identifying the center coordinates of the tray, moving the moving platform directly below the tray, and then placing the tray on the first supporting portion; Or, Placing the tray on the first supporting portion by the manipulator and calibrating the center position of the tray by the centering mechanism of the wafer bonding device.

8. The laminating method according to claim 6, wherein The holding structure in step S2 is configured as the second load-bearing component of the manipulator or the wafer bonding device.

9. The laminating method according to claim 8, wherein, The method of providing a clearance space for the up-and-down movement of the wafer by the holding structure between step S5 and step S6 includes: when the holding structure is configured as the manipulator, withdrawing the manipulator to provide the clearance space; when the holding structure is configured as the second load-bearing component, moving the second supporting portion to the retracted position to provide the clearance space.

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