Substrate adsorption device

Abstract

A substrate suction apparatus may include: a stage including a plurality of first suction holes and an insertion port, and allowing a product to be placed on an upper surface of the stage; and a mask having a shape substantially the same as the shape of the product and including a plurality of second suction holes. In a case where the mask is inserted into the stage along the insertion port, the plurality of second suction holes may be aligned with some of the plurality of first suction holes in a plan view.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0002781, filed with the Korean Intellectual Property Office (KIPO) on January 8, 2024, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] Various embodiments of the present disclosure relate to a substrate adsorption device. Background art

[0004] With the development of information technology, the importance of display devices as a connection medium between users and information has been emphasized. Due to the importance of display devices, the use of various types of display devices such as liquid crystal display devices and organic light - emitting display devices has increased.

[0005] The process of manufacturing a display device can be performed after the substrate is fastened to the stage. As the size of display devices diversifies, the size and shape of the substrates for display devices also become more and more diverse. If the stage is changed for each substrate for display devices, labor for setting the flatness of the stage may be required and costs for stage replacement may be incurred. Summary of the invention

[0006] Various embodiments of the present disclosure relate to a substrate adsorption device capable of using substrates having various sizes and shapes.

[0007] An embodiment of the present disclosure may provide a substrate adsorption device including: a stage including a plurality of first adsorption holes and an insertion port, and having an upper surface on which a product can be placed; and a mask having a shape substantially the same as the shape of the product and including a plurality of second adsorption holes. When the mask is inserted into the stage along the insertion port, in a plan view, some of the plurality of second adsorption holes may be aligned with some of the plurality of first adsorption holes.

[0008] In one embodiment, the plurality of first adsorption holes may be located in the upper surface of the stage, and the plurality of first adsorption holes may communicate with the internal space of the insertion port.

[0009] In one embodiment, the stage may further include a vacuum hole. The vacuum hole may be located in the lower surface of the stage, and the vacuum hole may communicate with the internal space of the insertion port.

[0010] In one embodiment, the first adsorption holes among the plurality of first adsorption holes that are aligned with the plurality of second adsorption holes may form a vacuum area corresponding to the shape of the product.

[0011] In one embodiment, the size of each of the plurality of first adsorption holes may be substantially the same as the size of each of the plurality of second adsorption holes. Each arrangement interval between the plurality of first adsorption holes may be substantially the same as each arrangement interval between the plurality of second adsorption holes.

[0012] In one embodiment, the plurality of first adsorption holes may be arranged in parallel in a first direction and a second direction.

[0013] In one embodiment, the insertion port may be formed by etching in the first direction.

[0014] In one embodiment, the plurality of first adsorption holes and the plurality of second adsorption holes may be formed by etching in a third direction perpendicular to the first direction and the second direction.

[0015] One embodiment of the present disclosure may provide a substrate adsorption device, which includes: a stage including a plurality of adsorption holes and an insertion port, and allowing a product to be placed on the upper surface of the stage; and a mask including an opening having a shape substantially the same as the shape of the product. When the mask is inserted into the stage along the insertion port, in a plan view, the opening may overlap some of the plurality of adsorption holes.

[0016] In one embodiment, the plurality of adsorption holes may be located in the upper surface of the stage, and the plurality of adsorption holes may communicate with the internal space of the insertion port.

[0017] In one embodiment, the stage may further include a vacuum hole. The vacuum hole may be located in the lower surface of the stage, and the vacuum hole may communicate with the internal space of the insertion port.

[0018] In one embodiment, the substrate adsorption device may further include a vacuum pump for sucking gas from the stage. The vacuum hole may be connected to the vacuum pump.

[0019] In one embodiment, the adsorption holes among the plurality of adsorption holes that overlap the opening in a plan view may be open, and a vacuum area corresponding to the shape of the product may be formed.

[0020] In one embodiment, the adsorption holes among the plurality of adsorption holes that do not overlap the opening in a plan view may be closed.

[0021] In one embodiment, the plurality of adsorption holes may be arranged in parallel in a first direction and a second direction.

[0022] In one embodiment, the insertion port may be formed by etching in the first direction.

[0023] In one embodiment, the stage may further include fastening holes formed by etching in the first direction. The substrate adsorption device may further include plugs assembled into the fastening holes.

[0024] In one embodiment, a plurality of adsorption holes and openings may be formed by etching in a third direction perpendicular to the first and second directions.

[0025] In one embodiment, the stage may further include a track formed in the internal space of the insertion port in the first direction. The mask may further include a roller that rolls on the track.

[0026] In one embodiment, the track may have an inclined portion at an end of the track in the first direction in the internal space of the insertion port. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In conjunction with the accompanying drawings, the above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description.

[0028] Figure 1 FIG. 16 is a schematic perspective view of a substrate adsorption device according to an embodiment of the present disclosure.

[0029] Figure 2 FIG. Figure 1 is a schematic plan view of the stage of

[0030] Figure 3 FIG. Figure 2 is a schematic cross-sectional view of the stage taken along line I-I' illustrated in

[0031] Figure 4 FIG. 32 is a schematic plan view of the stage, and the mask is inserted into the stage.

[0032] Figure 5 FIG. Figure 4 is a schematic cross-sectional view of the stage taken along line II-II' illustrated in

[0033] Figure 6 FIG. 42 is a schematic perspective view of a substrate adsorption device according to an embodiment of the present disclosure.

[0034] Figure 7 and Figure 8 FIGS. 48A and 48B are schematic plan views each illustrating the stage according to an embodiment, and the mask is inserted into the stage.

[0035] Figure 9 FIG. Figure 8 is a schematic cross-sectional view of the stage taken along line III-III' illustrated in

[0036] Figure 10 FIG. 58 is a schematic perspective view illustrating the stage according to an embodiment of the present disclosure.

[0037] Figure 11 FIG. Figure 10 is a schematic plan view of the stage illustrated in

[0038] Figure 12 A schematic cross-sectional view of the stage taken along line IV-IV' illustrated in Figure 11 . DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in various different forms and is not limited to the embodiments to be described herein.

[0040] In the drawings, parts not related to the present disclosure may be omitted to clarify the description of the present disclosure, and the same reference numerals may be used throughout different drawings to represent the same or similar components.

[0041] It will be further understood that when used in this specification, the terms "comprising", "including", "having", etc. indicate the presence of the recited features, integers, steps, operations, elements, components and / or their combinations, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their combinations. Further, in the case where a first component such as a layer, film, region or plate is provided on a second component, the first component may be directly on the second component, or a third component may be interposed between the first component and the second component. Additionally, in the case where it is expressed that a first component such as a layer, film, region or plate is formed on a second component, the surface of the second component on which the first component is formed is not limited to the upper surface of the second component, but may include other surfaces such as the side surface or the lower surface of the second component. Conversely, in the case where a first component such as a layer, film, region or plate is under a second component, the first component may be directly under the second component, or a third component may be interposed between the first component and the second component.

[0042] The term "and / or" includes all combinations that one or more of the related configurations can define. For example, "A and / or B" can be understood as "A, B, or A and B".

[0043] For the purposes of the present disclosure, the phrase "at least one of A and B" can be interpreted as only A, only B, or any combination of A and B. Additionally, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z.

[0044] In the present disclosure, when two elements are "connected" to each other, the two elements can be connected to each other such that a passage through the two elements can be formed.

[0045] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in a common dictionary, should be interpreted as having a meaning that is consistent with their meaning in the relevant art and the context of this disclosure, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0046] Figure 1 FIG. 4 is a schematic perspective view of a substrate adsorption device 10 according to an embodiment of the present disclosure.

[0047] See Figure 1 , according to an embodiment of the present disclosure, the substrate adsorption device 10 may include a stage 100 and a mask 200a.

[0048] The stage 100 may provide a space in which a product can be placed. For example, the product may be a substrate for a display device.

[0049] The product may be placed on the upper surface of the stage 100. For example, in the case where the product is a substrate for a display device, the substrate may be placed on the upper surface of the stage 100, and a process of forming a thin film or pattern on the substrate, a process of mounting electronic components on the substrate, or a process of moving the substrate may be performed.

[0050] The stage 100 may include a plurality of first adsorption holes HL1, an insertion port 110, and a vacuum hole 120. The plurality of first adsorption holes HL1 may be arranged in parallel in a first direction DR1 and a second direction DR2. The first adsorption holes HL1 may be formed in the upper surface of the stage 100 in the first direction DR1 and the second direction DR2. The first adsorption holes HL1 may be formed by etching in a third direction DR3. The first direction DR1, the second direction DR2, and the third direction DR3 may be directions perpendicular to each other. The third direction DR3 may be a direction perpendicular to the first direction DR1 and the second direction DR2.

[0051] The insertion port 110 may be formed by etching in the side surface of the stage 100 in the first direction DR1. The internal space of the insertion port 110 may communicate with each of the first adsorption holes HL1.

[0052] The vacuum hole 120 may be formed by etching in the lower surface of the stage 100 in the third direction DR3. The vacuum hole 120 may communicate with the internal space of the insertion port 110.

[0053] In one embodiment, the first adsorption holes HL1, the internal space of the insertion port 110, and the vacuum holes 120 may communicate with each other, thereby forming a passage through which gas can be discharged from the internal space of the stage 100. The internal space of the stage 100 may refer to the same space as the internal space of the insertion port 110 that can be formed by etching in the first direction DR1.

[0054] In one embodiment, the substrate adsorption device 10 may further include a vacuum pump (not illustrated) configured to suck gas from the internal space of the stage 100. The vacuum pump (not illustrated) may be connected to the vacuum holes 120 to discharge gas from the internal space of the stage 100 to the outside.

[0055] The mask 200a may have a shape that is substantially the same as or similar to the shape of the product to be placed on the upper surface of the stage 100. The mask 200a may be inserted into the stage 100 along the insertion port 110.

[0056] The mask 200a may include a plurality of second adsorption holes HL2. The plurality of second adsorption holes HL2 may be formed in the upper surface of the mask 200a in the first direction DR1 and the second direction DR2. The second adsorption holes HL2 may be formed by etching in the third direction DR3.

[0057] The size of each of the first adsorption holes HL1 may be the same as the size of each of the second adsorption holes HL2. The arrangement interval between the first adsorption holes HL1 may be the same as the arrangement interval between the second adsorption holes HL2.

[0058] Figure 2 For Figure 1 schematic plan view of the stage 100. Figure 3 For along Figure 2 schematic cross-sectional view of the stage 100 taken along the line I-I' illustrated in

[0059] See Figure 2 , the first adsorption holes HL1 of the stage 100 are illustrated. See Figure 3 , the first adsorption holes HL1, the internal space of the insertion port 110, and the vacuum holes 120 may communicate with each other. Since the first adsorption holes HL1, the internal space of the insertion port 110, and the vacuum holes 120 may communicate with each other, a passage through which gas can be discharged from the internal space of the stage 100 can be formed.

[0060] Figure 4 Schematic plan view of the stage 100 with the mask 200a inserted into the stage 100.

[0061] See Figure 1 and Figure 4, the mask 200a can be inserted into the stage 100 through the insertion port 110 formed by etching in the first direction DR1. When the mask 200a is inserted into the stage 100, in a plan view, some of the second adsorption holes HL2 of the mask 200a can be aligned with some of the first adsorption holes HL1 of the stage 100.

[0062] Accordingly, some of the second adsorption holes HL2 and the first adsorption holes HL1 aligned with the second adsorption holes HL2 can form an opening hole OH. The opening hole OH can communicate with the internal space of the insertion port 110 and the vacuum hole 120, thus forming a channel through which gas can be discharged from the internal space of the stage 100.

[0063] Figure 5 For Figure 4 a schematic cross-sectional view of the stage 100 taken along the line II-II' illustrated in

[0064] See Figure 5 , the mask 200a can be inserted into the stage 100, and the product OB can be placed on the upper surface of the stage 100.

[0065] The mask 200a can have a shape that is substantially the same as or similar to the shape of the product OB.

[0066] The second adsorption holes HL2 can communicate with some of the first adsorption holes HL1 respectively, thus forming a channel. For example, the first adsorption hole HL1_1 can communicate with the second adsorption hole HL2_1, the first adsorption hole HL1_2 can communicate with the second adsorption hole HL2_2, and the first adsorption hole HL1_3 can communicate with the second adsorption hole HL2_3, thus forming a channel. For example, in a plan view, some of the first adsorption holes HL1 can be aligned with the second adsorption holes HL2.

[0067] The product OB can be placed above the channel formed by connecting the respective second adsorption holes HL2 and the corresponding some of the first adsorption holes HL1. When gas is discharged from the internal space of the stage 100 through the vacuum hole 120, a vacuum area corresponding to the shape of the product OB can be formed.

[0068] For example, among the first adsorption holes HL1, the first adsorption holes HL1_1 to HL1_3 aligned with the second adsorption holes HL2 can form a vacuum area corresponding to the shape of the product OB.

[0069] Although three second adsorption holes HL2_1 to HL2_3 are illustrated in Figure 5 , the number of the second adsorption holes HL2 can be changed according to the shape of the product OB. In addition, when the number of the second adsorption holes HL2 can be changed, the number of the holes in the first adsorption holes HL1 aligned with the second adsorption holes HL2 can be changed.

[0070] A mask 200a having a shape substantially the same as or similar to the shape of the product OB can be inserted into the stage 100 without replacing the stage 100 on which the product OB is placed. Accordingly, even if the shape of the product OB changes, the substrate adsorption device 10 can adsorb the product OB while maintaining the flattening of the stage 100.

[0071] Since the flattening of the stage 100 can be maintained while adsorbing the product OB even if the shape of the product OB changes, the labor for setting the flattening of the stage 100 and the cost for replacing the top plate of the stage 100 each time the shape of the product OB changes can be reduced.

[0072] Figure 6 FIG. is a schematic perspective view of a substrate adsorption device 10 according to an embodiment of the present disclosure.

[0073] See Figure 6 , a substrate adsorption device 10 according to an embodiment of the present disclosure may include a stage 100 and a mask 200b. Figure 6 The stage 100 of Figure 1 may be substantially the same as or similar to the stage 100 of

[0074] ; thus, its redundant explanation will be omitted.

[0075] Figure 7 and Figure 8 are schematic plan views each illustrating a stage 100 according to an embodiment, and a mask 200b is inserted into the stage.

[0076] See Figures 6 - 8 , the mask 200b can be inserted into the stage 100 along an insertion port 110 formed by etching in a first direction DR1. See Figure 7 and Figure 8 , illustrating the mask 200b, each mask 200b has an opening 210 corresponding to the shape of the product OB (see Figure 9 ). Although Figure 7 illustrates an opening 210 corresponding to a product OB having a polygonal shape, and Figure 8 illustrates an opening 210 corresponding to a product OB having a circular shape, the present disclosure is not limited thereto. The mask 200b may include openings 210 corresponding to product OBs having various shapes.

[0077] When the mask 200b is inserted into the stage 100, in a plan view, the opening 210 of the mask 200b may overlap some of the first suction holes HL1 of the stage 100.

[0078] More specifically, some of the first suction holes HL1 may overlap with the opening 210, thereby forming an open hole OH. The open hole OH may communicate with the internal space of the insertion port 110 and the vacuum hole 120, thereby forming a passage through which gas can be discharged from the internal space of the stage 100. For example, among the first suction holes HL1, the suction holes overlapping with the opening 210 may be open, thus forming a vacuum area corresponding to the shape of the product OB.

[0079] Some of the first suction holes HL1 do not overlap with the opening 210, thereby forming a closed hole CH. The closed hole CH may not communicate with the internal space of the insertion port 110 and the vacuum hole 120. For example, among the first suction holes HL1, the suction holes not overlapping with the opening 210 may be closed.

[0080] Figure 9 For Figure 8 is a schematic cross-sectional view of the stage 100 taken along the line III-III' illustrated in

[0081] See Figure 9 , the mask 200b can be inserted into the stage 100, and the product OB can be placed on the upper surface of the stage 100.

[0082] The mask 200b may have a shape that is substantially the same as or similar to the shape of the product OB.

[0083] The opening 210 may communicate with the first suction holes HL1, thus forming a passage. For example, some of the holes HL1_1 to HL1_3 in the first suction holes HL1 may be open holes OH, and some of the holes HL1_4 to HL1_7 in the first suction holes HL1 may be closed holes CH.

[0084] The product OB can be placed above the passage formed by the overlap of the opening 210 and some of the holes HL1_1 to HL1_3 in the first suction holes HL1. When gas is discharged from the internal space of the stage 100 through the vacuum hole 120, a vacuum area corresponding to the shape of the product OB can be formed.

[0085] For example, the opening 210 and some of the holes HL1_1 to HL1_3 in the first suction holes HL1 may form a vacuum area corresponding to the shape of the product OB.

[0086] In Figure 9 has Figure 8The mask 200b depicting the opening 210 is inserted into the stage 100 such that some of the holes HL1_1 to HL1_3 in the first suction holes HL1 are open holes OH, and some of the holes HL1_4 to HL1_7 in the first suction holes HL1 are closed holes CH. However, the present disclosure is not limited to the foregoing examples, and the shape of the opening 210 may be changed according to the shape of the product OB. Therefore, the number of open holes OH and closed holes CH may be changed.

[0087] For example, in the case where the mask 200b depicting the opening 210 in Figure 7 is inserted into the stage 100, some of the holes HL1_1 to HL1_3 and HL1_6 to HL1_7 in the first suction holes may be open, and some of the holes HL1_4, HL1_5 in the first suction holes may be closed. For example, since the mask 200b having an opening 210 with a shape substantially the same as or similar to the shape of the product OB can be inserted into the stage 100 without replacing the stage 100 on which the product OB is placed, the opening and closing of the first suction holes HL1 can be controlled according to the shape of the product OB.

[0088] Because even when the shape of the product OB changes, the flattening of the stage 100 can be maintained while the product OB is adsorbed, the labor for setting the flattening of the stage 100 and the cost for replacing the top plate of the stage 100 each time the shape of the product OB changes can be reduced.

[0089] Figure 10 is a schematic perspective view illustrating a stage 100 according to an embodiment of the present disclosure.

[0090] See Figure 10 , the stage 100 including fastening holes 130 and tracks 140 is illustrated. Figure 10 The stage 100 of Figure 1 may be similar to the stage 100 of

[0091] ; therefore, its redundant explanation will be omitted.

[0092] See Figure 10 , the substrate adsorption device 10 may further include a plug (not shown). In one embodiment, when the mask 200a is inserted into the stage 100, the plug (not shown) may be fitted into the fastening hole 130.

[0093] The stage 100 may further include tracks 140 formed in the internal space of the insertion port 110 in the first direction DR1. The mask 200a may further include rollers (not shown) that roll on the tracks 140.

[0094] Figure 11 is Figure 10 a schematic plan view of the stage 100 illustrated in

[0095] Refer to Figure 11 , which illustrates a stage 100 including a first adsorption hole HL1, a fastening hole 130, and a track 140. In the plan view, the first adsorption hole HL1, the fastening hole 130, and the track 140 may all be spaced apart from each other.

[0096] Although Figure 10 and Figure 11 illustrate a stage 100 including one fastening hole 130 and one track 140, the present disclosure is not limited thereto, and the stage 100 may include one or more fastening holes and one or more tracks.

[0097] Figure 12 is a schematic cross-sectional view of the stage 100 taken along the line IV-IV' illustrated in Figure 11 . Refer to Figure 10 and Figure 12 , which is a cross-sectional view of the stage 100 including the track 140.

[0098] In one embodiment, the track 140 may have an inclined portion at an end of the track 140 in the first direction DR1 in the internal space of the insertion port 110. In the case where the mask 200a includes a roller (not shown), the roller (not shown) rolls along the inclined portion of the track 140, thereby allowing the mask 200a to be easily set at the upper end of the internal space of the insertion port 110.

[0099] According to the substrate adsorption device of the present disclosure, the labor for setting the flattening of the stage and the cost for stage replacement can be reduced.

[0100] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure pertains will be able to make various modifications and variations. Therefore, the embodiments of the present disclosure described above may be implemented alone or in combination with each other.

[0101] The embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but are intended to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the claims, and it should be interpreted that all technical spirits within the equivalent scope are included in the scope of the present disclosure.

Claims

1. A substrate adsorption device, comprising: A stage, including a plurality of first adsorption holes and an insertion port, and having an upper surface on which a product is allowed to be placed; And A mask, having the same shape as the shape of the product, and including a plurality of second adsorption holes, Wherein when the mask is inserted into the stage along the insertion port, in a plan view, some of the plurality of second adsorption holes are aligned with some of the plurality of first adsorption holes.

2. The substrate adsorption device according to claim 1, wherein The plurality of first adsorption holes are located in the upper surface of the stage, and The plurality of first adsorption holes communicate with the internal space of the insertion port.

3. The substrate adsorption device according to claim 1, wherein The stage further includes a vacuum hole, The vacuum hole is located in the lower surface of the stage, and The vacuum hole communicates with the internal space of the insertion port.

4. The substrate adsorption device according to claim 1, wherein the first adsorption holes among the plurality of first adsorption holes that are aligned with the plurality of second adsorption holes form a vacuum area corresponding to the shape of the product.

5. The substrate adsorption device according to claim 1, wherein The size of each of the plurality of first adsorption holes is the same as the size of each of the plurality of second adsorption holes, and The arrangement interval between each of the plurality of first adsorption holes is the same as the arrangement interval between each of the plurality of second adsorption holes.

6. The substrate adsorption device according to claim 1, wherein the plurality of first adsorption holes are arranged in parallel in a first direction and a second direction.

7. The substrate adsorption device according to claim 6, wherein the insertion port is formed by etching in the first direction.

8. The substrate adsorption device according to claim 6, wherein the plurality of first adsorption holes and the plurality of second adsorption holes are formed by etching in a third direction perpendicular to the first direction and the second direction.

9. A substrate adsorption device, comprising: A stage, including a plurality of adsorption holes and an insertion port, and allowing a product to be placed on the upper surface of the stage; And A mask, including an opening having the same shape as the shape of the product, Wherein when the mask is inserted into the stage along the insertion port, in a plan view, the opening overlaps some of the plurality of adsorption holes.

10. The substrate adsorption device according to claim 9, wherein The plurality of adsorption holes are located in the upper surface of the stage, and The plurality of adsorption holes communicate with the internal space of the insertion port.

11. The substrate adsorption device according to claim 9, wherein The stage further includes a vacuum hole, The vacuum hole is located in the lower surface of the stage, and The vacuum hole communicates with the internal space of the insertion port.

12. The substrate adsorption device according to claim 11, further comprising: A vacuum pump, sucking gas from the stage, Wherein the vacuum hole is connected to the vacuum pump.

13. The substrate adsorption device according to claim 9, wherein, in a plan view, the adsorption holes among the plurality of adsorption holes that overlap with the opening are open, and a vacuum area corresponding to the shape of the product is formed.

14. The substrate adsorption device according to claim 9, wherein, in a plan view, the adsorption holes among the plurality of adsorption holes that do not overlap with the opening are closed.

15. The substrate adsorption device according to claim 9, wherein the plurality of adsorption holes are arranged in parallel in a first direction and a second direction.

16. The substrate adsorption device according to claim 15, wherein the insertion port is formed by etching in the first direction.

17. The substrate adsorption device according to claim 16, wherein the stage further includes fastening holes formed by etching in the first direction, and the substrate adsorption device further includes plugs fitted into the fastening holes.

18. The substrate adsorption device according to claim 15, wherein the plurality of adsorption holes and the opening are formed by etching in a third direction perpendicular to the first direction and the second direction.

19. The substrate adsorption device according to claim 15, wherein the stage further includes tracks formed in the first direction in the internal space of the insertion port, and the mask further includes rollers that roll on the tracks.

20. The substrate adsorption device according to claim 19, wherein the tracks have inclined portions at the ends of the tracks in the first direction in the internal space of the insertion port.

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