Omnidirectional sensor package and method of manufacturing same

Abstract

A sensor package includes a first substrate and a second substrate. A first substrate sensing element is mounted on an inner surface of the first substrate between the first substrate and the second substrate, and a second substrate sensing element is mounted on an inner surface of the second substrate between the first substrate and the second substrate. First and second side sensing elements are vertically mounted between the first and second substrates, the first and second side sensing elements having respective sensing regions facing away from each other and facing an exterior of the sensor package, and the first and second side sensing elements are electrically coupled to at least one of the first and second substrates. First and second side transparent mold covers are formed to cover respective sensing areas of the first and second side sensing elements. An encapsulation layer is formed between the first and second substrates to encapsulate the first substrate sensing element, the second substrate sensing element, and the first and second side sensing elements.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to an omnidirectional sensor package and a method of manufacturing an omnidirectional sensor package. Background Art

[0002] Sensors are widely used in electronic devices to detect signals from the external environment. Especially in real-time applications such as advanced driver assistance systems (ADAS), artificial intelligence systems, and drones, sensors play an important role in providing reliable and accurate data for the entire system.

[0003] Traditional automotive sensors are usually unidirectional, so it is necessary to adjust the azimuth angle of the automotive sensor to detect the vehicle environment where the automotive sensor is placed in all directions. For example, a rotating component or assembly, usually composed of one or more motors, mirrors, and / or some other components, is required to rotate the automotive sensor in the horizontal plane, but this may increase the manufacturing cost and the size of the sensor.

[0004] Therefore, there is a need for further improvement in sensor devices. Summary of the Invention

[0005] An object of this application is to provide a sensor device having an omnidirectional detection ability and structure that are easy to implement.

[0006] According to one aspect of the present application, a sensor package is provided. The sensor package includes: a first substrate having a first sensor opening therethrough and a first substrate transparent mold cover filled in the first sensor opening; a second substrate having a second sensor opening therethrough and a second substrate transparent mold cover formed in the second sensor opening; a first substrate sensing element mounted on an inner surface of the first substrate between the first substrate and the second substrate, wherein the first substrate sensing element has a sensing region facing and aligned with the first sensor opening and is electrically coupled to the first substrate; a second substrate sensing element mounted on an inner surface of the second substrate between the first substrate and the second substrate, wherein the second substrate sensing element has a sensing region facing and aligned with the second sensor opening and is electrically coupled to the second substrate; a first side sensing element and a second side sensing element vertically mounted between the first substrate and the second substrate, wherein the first side sensing element and the second side sensing element have respective sensing regions facing away from each other and facing the outside of the sensor package, and wherein the first side sensing element and the second side sensing element are electrically coupled to at least one of the first substrate and the second substrate; a first side transparent mold cover and a second side transparent mold cover covering the respective sensing regions of the first side sensing element and the second side sensing element; and an encapsulation layer formed between the first substrate and the second substrate to encapsulate the first substrate sensing element, the second substrate sensing element, and the first side sensing element and the second side sensing element.

[0007] According to another aspect of the present application, a method for manufacturing a sensor package is provided. The method includes: providing a first substrate having a first sensor opening therethrough and a first substrate transparent mold cover formed within the first sensor opening, wherein a first substrate sensing element is mounted on an inner surface of the first substrate and electrically coupled to the first substrate, and wherein the first substrate sensing element has a sensing region facing and aligned with the first sensor opening; vertically mounting a first side sensor assembly and a second side sensor assembly on the inner surface of the first substrate, wherein each side sensor assembly of the first side sensor assembly and the second side sensor assembly includes a side sensing element having a sensing region facing outward and covered by a side transparent mold cover, and wherein each side sensor assembly of the first side sensor assembly and the second side sensor assembly includes a side encapsulation layer that encapsulates the side sensing element but exposes the side transparent mold cover; mounting a second substrate on the first side sensor assembly and the second side sensor assembly such that the second substrate is supported by the side sensing elements; wherein the second substrate has a second sensor opening therethrough and a second substrate transparent mold cover formed within the second sensor opening, a second substrate sensing element is mounted on an inner surface of the second substrate and electrically coupled to the second substrate, the second substrate sensing element has a sensing region facing and aligned with the second sensor opening; and wherein the side sensing elements of the first side sensor assembly and the second side sensor assembly are electrically coupled to at least one of the first substrate and the second substrate; and forming an encapsulation layer between the first substrate and the second substrate to encapsulate the first substrate sensing element and the second substrate sensing element.

[0008] It should be understood that the above general description and the following detailed description are both exemplary and explanatory and are not restrictive of the present invention. Additionally, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the specification, serve to explain the principles of the present invention.

[0009] Brief Description of the Drawings

[0010] The accompanying drawings referred to herein form a part of this specification. Unless otherwise expressly indicated in the detailed description, the features shown in the drawings illustrate only some embodiments of the present application and not all embodiments of the present application, and should not give a contrary implication to the reader of the specification.

[0011] Figure 1 A sensor package according to an embodiment of the present application is shown.

[0012] Figure 2Shows a sensor package according to another embodiment of the present application.

[0013] Figures 3A to 3E Shows a method of manufacturing a sensor package according to an embodiment of the present application.

[0014] Figures 4A to 4H Shows a sensor assembly according to an embodiment of the present application.

[0015] Figure 5 Shows another example of forming a side interconnect structure such as Figure 2 the conductive block shown.

[0016] The same reference numerals will be used throughout the drawings to refer to the same or similar parts. Detailed Description

[0017] The following detailed description of exemplary embodiments of the present application refers to the drawings that form a part of this specification. The drawings illustrate specific exemplary embodiments in which the present application may be practiced. The detailed description including the drawings describes these embodiments in sufficient detail for those skilled in the art to practice the present application. Those skilled in the art may further utilize other embodiments of the present application and make logical, mechanical, and other changes without departing from the spirit or scope of the present application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and the scope of the embodiments of the present application is defined only by the appended claims.

[0018] In the present application, unless specifically stated otherwise, the use of the singular includes the plural. In the present application, unless otherwise specified, the use of "or" means "and / or". In addition, the use of the term "including" and other forms such as "includes" and "included" is not restrictive. Additionally, unless specifically stated otherwise, terms such as "element" or "component" cover elements and components that include one unit, as well as elements or components that include more than one subunit. Additionally, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter.

[0019] As used herein, for ease of description, spatial relative terms such as "below", "beneath", "above", "over", "upper", "upper part", "lower part", "left", "right", "vertical", "horizontal", "side", etc. may be used in this text to describe the relationship of one element or feature to another element or feature, as shown in the figures. In addition to the orientations shown in the figures, the spatial relative terms are intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein may be interpreted accordingly. It should be understood that when an element is referred to as "connected to" or "coupled to" another element, it may be directly connected to or coupled to the other element, or intervening elements may exist.

[0020] As described above, traditional sensor devices need to integrate mechanical rotating components therein to equip the sensor device with omnidirectional detection capabilities. The mechanical rotating components are structurally complex and increase the manufacturing cost. To solve this problem, the inventors of the present application conceived an invention in which at least four sensing elements are integrated in a sensor package, and each sensing element can be oriented in a certain direction relative to the sensor package and has a detection range greater than 90 degrees. In this way, the external environment of a system (such as a vehicle) equipped with the sensor package can be completely covered and detected by the sensor package. In addition, at least four sensing elements can be integrated in a single sensor package using semiconductor packaging technology, which is easy to implement and has a low manufacturing cost.

[0021] Figure 1 FIG. 100 shows a sensor package 100 according to an embodiment of the present application. As Figure 1 shown, four sensing elements are integrated in the sensor package 100. For example, each sensing element protrudes from one face of the sensor package 100 whose shape may be a cuboid. However, it can be understood that in some other instances, there may be an additional two sensing elements integrated in the sensor package 100 and protruding from the other two faces of the cuboid sensor package 100. That is, each of the six faces of the cuboid sensor package 100 may have a sensing element for detecting the environment outside the package 100. In addition, in the case where the sensor package can be shaped as an octagonal prism or any other polyhedron having eight faces, sensing elements may be installed at the corresponding faces of the sensor package.

[0022] In some embodiments, the sensing element integrated within the sensor package 100 can be an optical sensor, such as an image sensor or an infrared sensor that is sensitive to certain specific wavelengths of light. In some other embodiments, the sensing element can be an ultrasonic sensor or other types of sensors that are sensitive to other types of waves, which can propagate in environments such as ground environments, underground environments, or seabed environments, and mechanical or electronic systems equipped with such sensor packages can be placed in or travel through these environments. In a preferred embodiment, the sensing element is formed using semiconductor manufacturing processes to have a relatively compact structure. In some optional embodiments, when the sensing elements are formed using semiconductor fabrication processes, other functional circuits such as signal processing and data storage can be integrated therein, so that the sensing elements can perform further calculations and signal processing based on the detected signals, thereby reducing or eliminating the need to install other types of semiconductor components (e.g., separate signal processing semiconductor chips implemented in the form of application-specific integrated circuits) in the sensor package 100. It should be understood that some other electronic components such as semiconductor chips can be integrated within the sensor package 100 as needed.

[0023] As Figure 1 shown, the sensor package 100 includes a first substrate 102 having an outer surface and an inner surface opposite to the outer surface of the first substrate 102. In particular, the first substrate 102 has a first sensor opening 104 therethrough and a first substrate transparent mold cover 106 formed within the first sensor opening 104. In Figure 1 the illustrated embodiment, the outer surface faces the outside of the sensor package 100, while the inner surface faces the inside, but it is not required that the outer surface should be exposed from the outer surface of the entire sensor package 100. In some embodiments, the first substrate 102 can include a redistribution structure having one or more dielectric layers and one or more conductive layers located between and passing through the dielectric layers. The conductive layers can define pads, traces, and plugs through which electrical signals or voltages can be distributed horizontally and vertically across the redistribution structure. The first substrate 102 can include a plurality of external conductive patterns formed on its outer surface and a plurality of internal conductive patterns formed on its inner surface. Additionally, the redistribution structure can further include a plurality of conductive vias that electrically connect at least one external conductive pattern to at least one internal conductive pattern. It can be understood that the external conductive patterns, internal conductive patterns, and conductive vias can be implemented in various structures and types, but aspects of the present application are not limited thereto.

[0024] In Figure 1 the illustrated embodiment, when in Figure 1When viewed in the direction shown, the first substrate 102 is on the top surface of the cuboid sensor package 100. However, it is not required that the first substrate 102 should always be at the very top of the entire sensor package 100 in all applications or scenarios (such as when it is used in an electronic system). At the bottom surface of the cuboid sensor package 100 opposite to the top surface where the first substrate 102 is mounted, the sensor package 100 further includes a second substrate 108. The second substrate 108 may be symmetric with the first substrate 102 about a horizontal plane passing through the center of the sensor package 100. The inner surface of the first substrate 102 faces the inner surface of the second substrate 108, while the outer surface of the second substrate 108 may face the outside and be opposite to the first substrate 102. In some embodiments, the second substrate 108 and the first substrate 102 may be formed of the same material and structure, and optionally, may have the same layout as the first substrate 102. For example, similar to the first substrate 102, the second substrate 102 may have a second sensor opening 110 passing through it and a second substrate transparent mold cover 112 formed within the second sensor opening 110. The first substrate transparent mold cover 106 and the second substrate transparent mold cover 112, as well as other transparent mold covers in the embodiments of the present application, may all be composed of a light-transmitting molding material or a sealing (encapsulant) material.

[0025] The first substrate sensing element 114 is mounted on the inner surface of the first substrate 102, and its sensing area 116 faces the first sensor opening 104. In this case, the first substrate transparent mold cover 106 can cover the sensing area 116 of the first substrate sensing element 114 to protect it from the external environment and damage. The sensing area 116 can be aligned with the first sensor opening 104 and thus further with the first substrate transparent mold cover 106 therein. In addition, since the first substrate transparent mold cover 106 can be light-transmissive or can otherwise enable the transmission of signals to be detected by the first substrate sensing element 114, the first substrate sensing element 114 can detect signals emitted from the environment as needed. In some embodiments where the first substrate sensing element 114 is an optical sensor, a filter layer can be formed between the first substrate transparent mold cover 106 and the first substrate sensing element 114, thus covering the sensing area 116 of the first substrate sensing element 114. Preferably, the filter layer includes a filter film that can selectively allow light in a specific wavelength range (less than / greater than a wavelength, within a wavelength range, at a wavelength, etc.) to pass through. For example, the filter film can be a thin film filter having alternating thin layers of materials with specific optical properties. The filter film can transmit, block, or reflect light in different wavelength ranges. The filter film can be a band-pass filter, a notch filter, a short-pass edge filter, a long-pass edge filter, a dichroic filter, or a custom filter matching any wavelength range. Preferably, the filter film can be formed via a coating process. It can be understood that the filter film can be any filter film suitable for filtering the light of the optical sensor. It can also be understood that the filter layer can include multiple filter layers with different optical properties.

[0026] The first substrate sensing element 114 is electrically coupled to the first substrate 102 to allow signal transmission therebetween. For example, the first substrate sensing element 114 can send the detected signal to the first substrate 102 and further send the detected signal (processed or unprocessed information) to an external device through the first substrate 102; and the first substrate sensing element 114 can further receive control signals or other similar signals or instructions from the external device through the first substrate 102. In an embodiment, a plurality of interconnect structures 118 can be formed between the first substrate sensing element 114 and the first substrate 102 to electrically couple the conductive patterns or pads 120 and 122 formed on the first substrate sensing element 114 and the first substrate 102. In this way, the first substrate sensing element 114 and the first substrate 102 can be electrically coupled to each other. It can be understood that the first substrate sensing element 114 can have a length greater than the length of the first sensor opening 104 and thus extends laterally beyond the first sensor opening 104. Accordingly, the sensing region 116 can occupy a part (e.g., the central part) of the outer surface of the first substrate sensing element 114, substantially in the same position as the first sensor opening 104, while other parts of the outer surface of the first substrate sensing element 114 may not be formed as the sensing region and can be used for the conductive pattern 120 and electrical connection with the interconnect structure 118. In some embodiments, the interconnect structure 118 can be a solder bump, a metal pillar, or other conductive structures.

[0027] In some embodiments, the thickness of the first substrate transparent mold cover 106 can be equal to or greater than the thickness of the first substrate 102, and alternatively, the thickness of the first substrate transparent mold cover 106 can be less than the thickness of the first substrate 102. For example, when a filter layer is formed between the first substrate transparent mold cover 106 and the first substrate sensing element 114, the filter layer can be filled in the first sensor opening 104 together with the first substrate transparent mold cover 106. In this way, the outer surface of the first substrate sensing element 114 can be outside the first sensor opening 104, for example when viewed in the Figure 1 vertical direction as shown.

[0028] As described above, the second substrate 108 and the components mounted thereon may have the same or similar configuration as the first substrate 102. Specifically, the second substrate sensing element 124 may be mounted on the inner surface of the second substrate 108 between the first substrate 102 and the second substrate 108. The second substrate sensing element 124 may have a sensing area 126 facing the second sensor opening 110. Thus, the sensing area 126 may be aligned with the second sensor opening 110 and the second substrate transparent mold cover 112. The second substrate sensing element 124 may further extend laterally beyond the second sensor opening 110 to form an interconnect structure 128 at its lateral portion that may electrically connect the second substrate sensing element 124 to the second substrate 108. Other details of the configuration of the second substrate 108 may be referred to the configuration of the first substrate, and thus will not be described in detail here.

[0029] Still referring to Figure 1 , the first substrate 102 and the components thereon are spaced apart from the second substrate 108 and the components thereon. A gap is formed between the first substrate 102 and the second substrate 108. The first side sensing element 130 and the second side sensing element 132 are vertically mounted between the first substrate 102 and the second substrate 108, that is, mounted in the gap. The first side sensing element 130 and the second side sensing element 132 may have corresponding sensing areas 134 and 136 that face away from each other and face the outside of the sensor package 100. In this way, the sensing areas of the side sensing elements 130 and 132 can be detected in two directions different from the detection directions of the first substrate sensing element 114 and the second substrate sensing element 124, thereby achieving the omnidirectional detection capability (i.e., 360-degree direction) of the sensor package 100. In some embodiments, the first side sensing element 130 and the second side sensing element 132 may have the same length in a direction perpendicular to the first substrate 102 and the second substrate 108. Thus, the first substrate 102 and the second substrate 108 are generally parallel to each other, and the first side sensing element and the second side sensing element are also generally parallel to each other.

[0030] The sensor package 100 further includes a first side transparent mold cover 138 and a second side transparent mold cover 140, which may cover the corresponding sensing areas 134 and 136 of the first side sensing element 130 and the second side sensing element 132 to protect them from external damage. Similar to the transparent mold covers 106 and 112, the first side transparent mold cover 138 and the second side transparent mold cover 140 may not block the transmission of signals to be detected by the first side sensing element 130 and the second side sensing element 132. In some embodiments where the side sensing elements 130 and 132 are optical sensors, corresponding filter layers may be formed between the side sensing element 130 or 132 and the side transparent mold cover 134 or 136.

[0031] Since the first side sensing element 130 and the second side sensing element 132 need to transmit the detected signals outward and receive control signals or instructions, electrical connections and communications with external devices are required. To achieve the connection, specific side interconnect structures are formed between the first side sensing element 130 and / or the second side sensing element 132 and the first substrate 102 and / or the second substrate 108. For example, as Figure 1 shown, bonding wires 142a serving as side interconnect structures can be formed to connect conductive patterns or pads on the outer surface of the first side sensing element 130 and some conductive patterns on the inner surface of the first substrate 102, and / or bonding wires 142b can be formed to connect conductive patterns or pads on the outer surface of the first side sensing element 130 and some conductive patterns on the inner surface of the second substrate 108, so as to electrically couple the first side sensing element 130 to the first substrate 102 and / or the second substrate 108. Similarly, bonding wires 144a and 144b can be formed between the second side sensing element 132 and the first substrate 102 and / or the second substrate 108 to electrically couple them together. In this way, the first side sensing element 130 and the second side sensing element 132 can perform data and signal communications with external devices through at least one of the first substrate 102 and the second substrate 108. It can be understood that in some optional embodiments, one of the side interconnect structures 142a and 142b can be omitted, and one of the side interconnect structures 144a and 144b can be omitted.

[0032] In addition, an encapsulation layer can be formed between the first substrate 102 and the second substrate 108 to encapsulate the first substrate sensing element 114, the second substrate sensing element 124, the first side sensing element 130, the second side sensing element 132, and various other components or structures mounted between the first substrate 102 and the second substrate 108. The encapsulation layer can integrate the sensor package 100 into a single piece and provide structural support and electrical isolation for the entire sensor package 100. In Figure 1In the illustrated embodiment, the encapsulation layer may include three portions, namely, a first portion 146a on the outer surface of the first side sensing element 130, a second portion 146b on the outer surface of the second side sensing element 132, and a third portion 146c generally surrounded by the first side sensing element 130 and the second side sensing element 132 and the first substrate 102 and the second substrate 108 (or the first substrate sensing element 114 and the second substrate sensing element 124). The first portion 146a may expose the first side transparent mold cover 138, and the second portion 146b may expose the second side transparent mold cover 140 so as not to block the transmission of the signal to be detected through the side transparent mold covers 138 and 140. In some embodiments, these portions 146a to 146c of the encapsulation layer may be separately formed by different molding steps, which will be described in detail below, but in some alternative embodiments, these portions 146a to 146c of the encapsulation layer may be formed in a single molding process. The encapsulation layers 146a to 146c may be made, in whole or in part, of a polymer composite using any suitable molding process, such as an epoxy resin with fillers, an epoxy acrylate with fillers, or a polymer with appropriate fillers.

[0033] From Figure 1 As can be seen from the illustrated embodiment, the sensor package 100 has four sensing elements 114, 124, 130, and 132 at its four faces, and each sensing element has a sensing area facing the external environment. These sensing elements 114, 124, 130, and 132 can operate simultaneously for detection purposes, and thus there is no need to use a mechanical drive mechanism such as a mechanical rotation assembly to direct the sensing area to different spaces.

[0034] In Figure 1 the illustrated embodiment, the bonding wires 142a, 142b, 144a, and 144b may be L-shaped (when viewed in a cross-section of the sensor package as shown, for example, in Figure 1 ) to connect the conductive patterns on two surfaces extending perpendicular to each other. In some alternative embodiments, the interconnect structure may be shaped in other forms to effect the electrical connection. Figure 2 A sensor package 200 is shown according to another embodiment of the present application, which has a different set of interconnect structures.

[0035] As Figure 2 shown, corresponding conductive blocks 242 may be formed between the first substrate 202 and / or the second substrate 208 and the first side sensing element 230 and / or the second side sensing element 232. Each conductive block 242 has two surfaces respectively contacting one of the first substrate 202 and the second substrate 208 and one of the first side sensing element 230 and the second side sensing element 232. It should be noted that Figure 2The illustrated embodiment is a cross-sectional view of the sensor package 200, and thus only one conductive block is shown at each intersection region between the substrate and the side sensing elements. However, a plurality of conductive blocks may be arranged along the intersection region between the substrate and the side sensing elements to provide a plurality of signal lines therebetween. It will be appreciated that Figure 1 The illustrated L-shaped bonding wires may similarly have a plurality of individual segments along the intersection region of the substrate and the side sensing elements.

[0036] Figure 1 and 2 The illustrated embodiments are all formed to have a cuboid shape, and sensing elements capable of detecting the external environment are formed on four faces of the cuboid sensor package, leaving the other two faces of the cuboid sensor package unoccupied. Therefore, at least one unoccupied face of the sensor package can be used to mount the sensor package to an external device, for example, by solder bumps. In this case, an interposer or an e-bar or other similar interconnect module may be integrated within the sensor package to electrically extend the conductive patterns within the sensor package to the unoccupied face of the sensor package, such as the conductive patterns formed on the inner surfaces of the first substrate and the second substrate, or even the conductive patterns formed on the inner surfaces of the first substrate sensing elements and the second substrate sensing elements or on the first side sensing elements and the second side sensing elements. For example, these interposers, e-bars or interconnect modules may have L-shaped bonding wires similar to Figure 1 the illustrated bonding wires 142a, 142b, 144a and 144b, or conductive blocks similar to Figure 2 the illustrated conductive block 242. However, it will be appreciated that in alternative embodiments, the sensor package may be mounted to an external device through one or both of the outer surfaces of the first substrate and the second substrate, provided that the detection of the environment by the substrate sensing elements is not obstructed by the external device.

[0037] Figures 3A to 3E Illustrated is a method of manufacturing a sensor package according to an embodiment of the present application. The method can be used to manufacture Figure 1 the illustrated sensor package 100. It will be appreciated that the method can also be used to manufacture Figure 2 the illustrated sensor package 200, with minor modifications.

[0038] As Figure 3A illustrated, a first substrate 302 is provided. The first substrate 302 may be attached to a carrier film 350, which may be releasably placed on a carrier such as a platform. It will be appreciated that Figures 3A to 3EOnly one unit of the first substrate 302 corresponding to the sensor package to be formed is shown by way of example. In practice, the first substrate 302 and other substrates can be formed in strip form, and they can be processed together and later singulated into separate parts after the packaging process is completed. Still referring to Figure 3A , the first substrate 302 has a first sensor opening 304 through the first substrate 302. The first sensor opening 304 is temporarily blocked by the carrier film 350 and can thus be filled with other structures, which will be described in detail below. A set of interconnect structures 328 are also formed on the inner surface of the first substrate 302, and they can be electrically connected to the conductive pattern on the inner surface of the first substrate 302.

[0039] Next, as Figure 3B shown, a first substrate sensor assembly 352 is mounted on the first substrate 302. The first substrate sensor assembly 352 can be a pre-formed smaller sensor package. In particular, the first substrate sensor assembly 352 has a first substrate sensing element 314 and a first substrate transparent mold cover 306, and the first substrate transparent mold cover can directly or indirectly cover the sensing area of the first substrate sensing element 314 via a filter layer. The space occupied by the first substrate sensing element 314 is larger than that of the first substrate transparent mold cover 306, and specifically, it extends laterally beyond the four edges of the first substrate transparent mold cover 306. Thus, when the first substrate sensor assembly 352 is mounted on the first substrate 302, the first substrate transparent mold cover 306 can be aligned with the first sensor opening 304 and formed within the first sensor opening 304, while the first substrate sensing element 314 can be supported above the first substrate 302 by the interconnect structures 328. The interconnect structures 328 are also connected to the conductive pattern on the outer surface of the first substrate sensing element 314, thereby electrically coupling the first substrate 302 to the first substrate sensing element 314. In a preferred embodiment, the size of the first substrate transparent mold cover 306 can be substantially the same as the size of the first sensor opening, so that the first substrate transparent mold cover 306 can fit well within the opening. In some embodiments where the size of the first substrate transparent mold cover 306 is smaller than the first sensor opening, an adhesive material such as a molding material can be further filled in the first sensor opening to form a tight sealing interface between the first substrate 302 and the first substrate transparent mold cover 306. The molding material can be formed at this time or later. Thus, the sensing area of the first substrate sensing element 314 can face and be aligned with the first sensor opening in the first substrate 302.

[0040] Next, as Figure 3CAs shown, a first side sensor assembly 354 and a second side sensor assembly 356 can be vertically mounted on the inner surface of the first substrate 302. Each of the first side sensor assembly 354 and the second side sensor assembly 356 may include a side sensing element 330 or 332 having a sensing area facing outward and directly or indirectly covered by a side transparent mold 338 or 340 via an optical sensing layer. In particular, the side sensor assemblies 354 and 356 can be mounted back-to-back at two edges of the first substrate 302 to fully expose their corresponding sensing areas. In an embodiment, both the first side sensor assembly 354 and the second side sensor assembly 356 include a side encapsulation layer 346 that encapsulates the side sensing element 330 or 332 but exposes the side transparent mold 338 or 340. The side encapsulation layer 346 can be pre-formed together with the side sensor assemblies 354 and 356. In addition, each of the first side sensor assembly 354 and the second side sensor assembly 356 has a plurality of bonding wires 342a extending adjacent to the first substrate 302 within the side encapsulation layer 346. The bonding wires 342a can be connected to a conductive pattern on the inner surface of the first substrate 302 and a conductive pattern on the outer surface of the side sensing element 330 or 332 to electrically couple the first substrate 302 to the side sensing element 330 or 332. In an embodiment, the bonding wires 342a are formed in an L-shaped structure, while in some other embodiments, the bonding wires 342a can be replaced with any other suitable interconnect structure, such as Figure 2 the conductive block 242 shown. Similarly, a plurality of bonding wires 342b are formed in the side encapsulation layer adjacent to the edges of the side sensing elements 330 and 332 opposite to the first substrate 302, and the bonding wires 342b partially expose from the corresponding edges.

[0041] Next, as Figure 3DAs shown, the second substrate 308 can be mounted onto the first side sensor assembly 354 and the second side sensor assembly 356. In some embodiments, the second substrate 308 can be attached to a carrier film 358 that can be moved by a robotic arm or a carrier to place the second substrate 308 above the side sensor assemblies 354 and 356 and further onto the side sensor assemblies 354 and 356. Accordingly, the second substrate 308 can be supported by the side sensing elements 330 and 332 and the side encapsulation layer 346. By mounting the second substrate 308 onto the side sensor assemblies 354 and 356, the interconnect structure 342b can be connected to the conductive patterns formed on the second substrate 308. In this way, the second substrate 308 and the side sensor assemblies 354 and 356 or specifically the side sensing elements 330 and 332 can be electrically coupled together through the interconnect structure 342b. The second substrate 308 can have a structure similar to that of the first substrate 302, and the second substrate sensor assembly 360 can be mounted on the second substrate 308 in a manner that is the same as or similar to the configuration of the first substrate sensor assembly 352 on the first substrate 302, which will not be elaborated herein. It can be understood that the second substrate sensor assemblies 360 can be pre-mounted on the second substrate 308 such that they can be mounted onto the side sensor assemblies 354 and 356 together.

[0042] Next, as Figure 3E shown, an encapsulation layer 346 can be formed between the first substrate 302 and the second substrate 308 to encapsulate the first substrate sensing element 330 and the second substrate sensing element 332 mounted on the first substrate 302 and the second substrate 308, respectively. The encapsulation layer 346 can contact the side sensing elements 330 and 332, as Figure 3E shown.

[0043] After Figures 3A to 3E the respective steps shown, a sensor package can be obtained. One of the carrier films 350 and 358 can be removed, and the other carrier film can be removed from the sensor package at a later time after separation from the individual unit packages in the tape package.

[0044] The substrate sensor assembly and the side sensor assembly can be pre-formed through a separate process. Figures 4A to 4H A method for forming the side sensor assembly is shown. Some modifications can be made to the Figures 4A to 4H method shown as needed to form the substrate sensor assembly.

[0045] As Figure 4AAs shown, a sensing element 410 is provided. The sensing element 410 includes a sensor front surface 411, and the sensor front surface 411 includes a sensing region 412 and a conductive pattern region 413. It can be understood that the sensing element 410 may not be a separate sensor chip that has been separated from the sensor wafer. Instead, the sensing element 410 can be one sensing element (unit) or cell formed in the sensor wafer, as well as other identical or similar sensing elements or cells. That is to say, the method or at least most of its steps can be implemented as a wafer-level process.

[0046] A patterned photoresist layer is formed on the sensor front surface 411, and the patterned photoresist layer at least partially covers the conductive pattern region 413 of the sensing element 410 but exposes the sensing region 412. The patterned photoresist layer can be formed using ultraviolet (UV) lithography process, which is shown in Figure 4B and 4C . Specifically, as Figure 4B shown, a photoresist layer 414 that completely covers the sensor front surface 411 is formed on the top of the sensor front surface 411. For example, the photoresist layer 414 can be formed using printing, spin coating or spraying. Then, the photoresist layer 414 is formed with certain patterns using, for example, a lithography process. For example, as Figure 4C shown, the photoresist layer 414 can be a positive photoresist layer, and a set of positions of the photoresist layer 414 that are desired to be retained can be covered or masked by a mask 415 having a desired pattern. Then, the entire structure is exposed to UV light, and the exposed portion of the photoresist layer can be removed later using, for example, a developer, while the covered portion of the photoresist layer can be retained after the developing process. In some other embodiments, the photoresist layer can be a negative photoresist layer, and a mask needs to be configured to cover the positions that are desired to be removed, which is exactly the opposite of the embodiment shown in Figure 4C . Ideally, the edges of the photoresist pattern can be perpendicular to the covered surface. However, in some cases, during UV exposure, since the light intensity gradually decreases through absorption in the photoresist, a slope may appear at the edge of the photoresist pattern, and the portion of the photoresist closest to the surface is exposed to the highest intensity of light, but the bottom is exposed to the lowest intensity of light. Therefore, when the photoresist is developed, the positive photoresist can obtain a positive slope of the photoresist profile along the edge of the opening, as Figure 4C shown.

[0047] Further referring to Figure 4D, at least one filter layer 420 is formed on the top of the front surface 411 of the sensor. The at least one filter layer 420 covers and is in direct contact with the sensing area 412 of the sensing element 410 and the patterned photoresist layer 414. Preferably, the at least one filter layer 420 completely covers the exposed portions of the sensing area 412 and the patterned photoresist layer 414.

[0048] Next, as Figure 4E shown, a transparent molding layer 430 is formed on the top of the at least one filter layer 420, wherein the transparent molding layer 430 is light-transmissive so as not to have an undesirable light-shielding effect on the underlying sensor. The transparent molding layer 430 is used to form a transparent mold cover as described in the embodiments shown in reference Figure 1 and 2 shown. Preferably, the transparent molding layer 430 can completely cover the at least one filter layer 420. Preferably, the transparent molding layer 430 is configured to protect the underlying sensing element from external influences or damage. Additionally, preferably, the transparent molding layer 430 is light-transmissive and does not have any filtering effect. It can be understood that the thickness of the photoresist layer 414, the thickness of the at least one filter layer 420, and the thickness of the transparent molding layer 430 can vary according to the design and function of the present application.

[0049] Next, as Figure 4F shown, a part of the transparent molding layer 430, a part of the at least one filter layer 420, and the patterned photoresist layer are removed so as to at least partially expose the conductive pattern area 413. In some embodiments, the removal can be performed by a semi-cutting process using a saw or a laser cutting tool. The position where the semi-cutting process is performed is configured such that the conductive pattern area 413 is at least partially exposed after the semi-cutting process. The depth of the semi-cutting process can be equal to or greater than the total thickness of the transparent molding layer 430 and the at least one filter layer 420, but less than the total thickness of the transparent molding layer 430, the at least one filter layer 420, and the patterned photoresist layer. In some embodiments where the depth of the semi-cutting process is less than the total thickness of the transparent molding layer 430, the at least one filter layer 420, and the patterned photoresist layer, some of the patterned photoresist layer remains. In other words, the patterned photoresist layer may not be completely removed, such that the remaining photoresist layer can protect the underlying conductive pattern area from being damaged during the semi-cutting process. The remaining patterned photoresist layer can be removed later using a photoresist stripping process, such as organic stripping, inorganic stripping, or dry stripping.

[0050] After the step shown in Figures 4A to 4F , a sensor assembly can be obtained, such as the substrate sensor assemblies 352 and 360 shown in Figure 3D . Because Figure 3DThe side sensor assemblies 354 and 356 shown may have some other structures, so additional steps may be performed.

[0051] In particular, as Figure 4G shown, a side interconnect structure, such as bonding wire 440, may be formed on the front surface of the sensing element 410. In particular, when viewed at the entire wafer level, the side interconnects may extend between the conductive pattern regions 413 of every two adjacent sensing elements 410. The two adjacent sensing elements 410 may be formed in the same sensor wafer. For example, each side interconnect structure may be formed in an "n" shape. Next, as Figure 4H shown, an encapsulation layer 450 may be formed on the front surface of the sensing element 410 to fill the corresponding gaps between every two adjacent transparent mold caps 430. The encapsulation layer 450 may encapsulate the bonding wires 440 to protect them from external damage. The excess encapsulation material formed on the transparent mold caps 430 may be removed to expose the transparent mold caps 430. In addition, a sawing process may be performed on the encapsulation layer 450 to separate the sensor assemblies from each other. The sawing process may separate the encapsulation layer 450 and the "n" shaped bonding wires, thereby forming an L-shaped bonding wire with contacts or pads exposed from the encapsulation layer 450. In this way, the side sensor assemblies 354 and 356 as Figure 3D shown may be obtained.

[0052] Figure 5 Another example showing the formation of a side interconnect structure such as Figure 2 shown conductive block 242. As Figure 5 shown, a set of wider conductive blocks 540 may be formed between every two sensing elements 510 and then encapsulated with an encapsulation layer 550. Next, the encapsulation layer 550 may be cut using a sawing process to divide the wider conductive blocks 540 into two parts, each part of which may be exposed from the encapsulation layer 550. In this way, the conductive pattern 513 on the front surface of the sensing element 510 may be electrically coupled to other conductive patterns through the exposed conductive blocks 540.

[0053] The discussion herein includes many illustrative figures showing various parts of an omnidirectional sensor package and methods for manufacturing such a sensor package. For clarity of illustration, such figures do not show all aspects of each example sensor package. Any one example package provided herein may share any or all features with any or all other packages provided herein.

[0054] The present document has described various embodiments with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made thereto, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Further, other embodiments will be apparent to those skilled in the art by considering the specification and practice of one or more embodiments of the invention disclosed herein. Accordingly, it is intended that the present application and the examples herein be considered only as exemplary, with the true scope and spirit of the invention being indicated by the list of appended exemplary claims.

Claims

1. A sensor package, characterized in that Comprising: A first substrate having a first sensor opening therethrough and a first substrate transparent mold cover formed within the first sensor opening; A second substrate having a second sensor opening therethrough and a second substrate transparent mold cover formed within the second sensor opening, A first substrate sensing element mounted on an inner surface of the first substrate between the first substrate and the second substrate, wherein the first substrate sensing element has a sensing area facing and aligned with the first sensor opening and is electrically coupled to the first substrate; A second substrate sensing element mounted on an inner surface of the second substrate between the first substrate and the second substrate, wherein the second substrate sensing element has a sensing area facing and aligned with the second sensor opening and is electrically coupled to the second substrate; A first side sensing element and a second side sensing element vertically mounted between the first substrate and the second substrate, wherein the first side sensing element and the second side sensing element have respective sensing areas facing away from each other and facing the exterior of the sensor package, and wherein the first side sensing element and the second side sensing element are electrically coupled to at least one of the first substrate and the second substrate; A first side transparent mold cover and a second side transparent mold cover covering the respective sensing areas of the first side sensing element and the second side sensing element; And An encapsulation layer formed between the first substrate and the second substrate to encapsulate the first substrate sensing element, the second substrate sensing element, and the first side sensing element and the second side sensing element.

2. The sensor package according to claim 1, wherein, The first side sensing element and the second side sensing element are electrically coupled to both the first substrate and the second substrate.

3. The sensor package according to claim 2, wherein The first side sensing element and the second side sensing element are electrically coupled to both the first substrate and the second substrate via respective L-shaped bonding wires or respective conductive blocks.

4. The sensor package according to claim 1, wherein, The encapsulation layer is formed such that the first side sensing element and the second side sensing element are encapsulated by the encapsulation layer and the first side transparent mold cover and the second side transparent mold cover, wherein the first side transparent mold cover and the second side transparent mold cover are exposed from the encapsulation layer.

5. The sensor package according to claim 1, wherein Each of the respective sensing areas of the first substrate, the second substrate, the first side sensing element, and the second side sensing element is covered by a filter layer.

6. The sensor package according to claim 1, wherein Further comprising: An interconnect module for electrically extending a conductive pattern inside the sensor package to a face of the sensor package not occupied by any of the substrate sensing elements and the side sensing elements.

7. The sensor package according to claim 1, wherein The first side sensing element and the second side sensing element have the same length in a direction perpendicular to the first substrate and the second substrate.

8. A method for manufacturing a sensor package, characterized in that, The method includes: Provide a first substrate having a first sensor opening therethrough and a first substrate transparent mold cover formed within the first sensor opening, wherein a first substrate sensing element is mounted on an inner surface of the first substrate and electrically coupled to the first substrate, and wherein the first substrate sensing element has a sensing region facing and aligned with the first sensor opening; Vertically mount a first side sensor assembly and a second side sensor assembly on the inner surface of the first substrate, wherein each side sensor assembly of the first side sensor assembly and the second side sensor assembly includes a side sensing element having a sensing region facing outward and covered by a side transparent mold cover, and wherein each side sensor assembly of the first side sensor assembly and the second side sensor assembly includes a side encapsulation layer that encapsulates the side sensing element but exposes the side transparent mold cover; Mount a second substrate on the first side sensor assembly and the second side sensor assembly such that the second substrate is supported by the side sensing elements; wherein the second substrate has a second sensor opening therethrough and a second substrate transparent mold cover formed within the second sensor opening, a second substrate sensing element is mounted on an inner surface of the second substrate and electrically coupled to the second substrate, the second substrate sensing element has a sensing region facing and aligned with the second sensor opening; and wherein the side sensing elements of the first side sensor assembly and the second side sensor assembly are electrically coupled to at least one of the first substrate and the second substrate; and Form an encapsulation layer between the first substrate and the second substrate to encapsulate the first substrate sensing element and the second substrate sensing element.

9. The method according to claim 8, wherein After mounting the second substrate on the first side sensor assembly and the second side sensor assembly, the side sensing elements are electrically coupled to both the first substrate and the second substrate.

10. The method according to claim 9, wherein The side sensing elements are electrically coupled to both the first substrate and the second substrate via respective L-shaped bonding wires or respective conductive blocks.

11. The method according to claim 10, characterized in that, The L-shaped bonding wires are formed using the following process: Form an "n"-shaped bonding wire between the side sensing element and another side sensing element adjacent to the side sensing element in the same sensor wafer; Form an encapsulation layer between the side sensing element and the another side sensing element to encapsulate the "n"-shaped bonding wire; And Cut the encapsulation layer and the "n"-shaped bonding wire into two parts to form the L-shaped bonding wire.

12. The method according to claim 10, wherein The conductive blocks are formed using the following process: Form a conductive block between the side sensing element and another side sensing element adjacent to the side sensing element in the same sensor wafer; Form an encapsulation layer between the side sensing element and the another side sensing element to encapsulate the "n"-shaped bonding wire; And Cut the encapsulation layer and the conductive block into two parts such that each of the side sensing element and the another side sensing element has a respective part of the conductive block.

13. The method according to claim 8, wherein Each corresponding sensing region of the first substrate sensing element, the second substrate sensing element, the first side sensing element, and the second side sensing element is covered by a filter layer.

14. The method according to claim 8, wherein The method further includes: Forming an interconnect module within the encapsulation layer to electrically extend a conductive pattern inside the sensor package to a surface of the sensor package not occupied by any of the substrate sensing elements and the side sensing elements.

15. The method according to claim 8, wherein The first side sensing element and the second side sensing element have the same length in a direction perpendicular to the first substrate and the second substrate.

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