Special-shaped packaging frame structure and manufacturing method thereof

Abstract

The special-shaped packaging frame structure comprises a chip body and a frame assembly, the frame assembly is arranged on the side of the chip body, a bottom plate is arranged on the lower side of the frame assembly, pins electrically connected with the chip body are arranged on the bottom plate, and the top of the chip body is exposed. The manufacturing method is used for manufacturing the special-shaped packaging frame structure. Comprising the following steps: placing a chip body in a frame assembly; electrically connecting the chip body with the pins on the bottom plate; and the bottom plate is fixedly connected with the frame assembly. The frame assembly used when the chip body is packaged is of an upper exposed structure, so that the upper surface of the chip body can be completely exposed, shielding of the surface of the chip body is reduced, the phenomenon of heat accumulation of the chip body can be effectively avoided, and the performance of the packaged chip body is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically relates to a special-shaped packaging frame structure and a manufacturing method thereof. Background Art

[0002] An integrated chip refers to first integrating transistors into a die with specific functions, and then integrating the die into a chip through semiconductor technology according to application requirements. Among them, a die refers to a pre-fabricated wafer with specific functions that can be combined and integrated, also known as a "small chip", and its functions can include general-purpose processors, memories, graphics processors, encryption engines, network interfaces, etc.

[0003] In the prior art, during the conventional chip packaging operation, after installing the target chip on the lower shell, glue is directly applied to the lower shell, and then the upper shell is covered on the lower shell, and the upper and lower shells are fixed and packaged together by the solidification of the glue. Since the upper and lower shells completely wrap the target chip, and due to the poor thermal conductivity of the glue, the heat dissipation ability of the target chip to the outside is weakened, which easily causes the target chip to accumulate heat and results in performance degradation. Summary of the Invention

[0004] The present invention provides a special-shaped packaging frame structure and a manufacturing method thereof to solve the problems raised in the background art.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0006] A special-shaped packaging frame structure includes a chip body and a frame component. The frame component is arranged on the side of the chip body. A bottom plate is arranged on the lower side of the frame component, and pins electrically connected to the chip body are arranged on the bottom plate. The top of the chip body is exposed.

[0007] Preferably, the frame component includes a side frame, and a top frame is arranged on the upper side of the side frame. The top frame is perpendicular to the side frame;

[0008] A bottom frame is arranged on the lower side of the side frame. The bottom frame is perpendicular to the side frame. The chip body is fixed between the top frame and the bottom frame;

[0009] Flanks are arranged on the side of the chip body, and the flanks are arranged between the top frame and the bottom frame.

[0010] Preferably, a first limit protection member is arranged at the bending part of the side frame and the top frame. The first limit protection member is of a cavity structure, and the cross-section of the first limit protection member is in the shape of a cavity "7". The bending part of the first limit protection member abuts against the top surface and the side surface of the flank;

[0011] The thickness of the flank is lower than the thickness of the chip body;

[0012] A second limit protection member is connected to the chassis, the top end of the second limit protection member is connected to the lower surface of the flank, and the second limit protection member is located on the side of the chip body;

[0013] A pressure stabilizing member is connected to the chassis. There is a gap between the lower side of the pressure stabilizing member and the upper surface of the second limit protection member. A bottom plate is clamped between the pressure stabilizing member and the second limit protection member, and the bottom plate is located below the chip body.

[0014] Preferably, a friction plate is arranged on the bottom plate, and the friction plate is attached to the lower surface of the chip body;

[0015] Reinforcing ribs are arranged inside the first limit protection member, and the reinforcing ribs are arranged at the bending part of the first limit protection member;

[0016] A second shock-absorbing member is arranged between the upper side of the second limit protection member and the flank;

[0017] A first shock-absorbing member is arranged between the lower side of the second limit protection member and the bottom plate.

[0018] Preferably, a groove is arranged on the chassis, the side of the pressure stabilizing member is bent in the groove on the chassis, and the pressure stabilizing member and the second limit protection member are fixedly connected to the chassis through a locking member.

[0019] Preferably, a stabilizing assembly is fixedly connected to the top frame, the stabilizing assembly is arranged above the chip body, and the stabilizing assembly is used to assist in fixing the chip body.

[0020] Preferably, the stabilizing assembly includes a first top fixing plate, a first bottom contact plate, and an intermediate block. The side of the first top fixing plate is fixedly connected to the top frame. The lower surface of the first top fixing plate is provided with a concave arc surface. The intermediate block is embedded in the arc surface of the lower surface of the first top fixing plate. The intermediate block is attached to the arc surface, and the intermediate block and the arc surface can slide relative to each other. The lower surface of the intermediate block is fixedly connected to the first bottom contact plate, and the first bottom contact plate is attached to the upper surface of the chip body;

[0021] A plurality of fixing blocks are arranged on the upper surface of the first bottom contact plate. The fixing blocks are arranged on the outer periphery of the intermediate block, and elastic members are fixedly connected to the fixing blocks. The upper ends of the elastic members are fixedly connected to the first top fixing plate;

[0022] A surrounding ring is arranged on the side of the first bottom contact plate. The surrounding ring is located on the periphery of the first top fixing plate. A side shock-absorbing pad is arranged between the side wall of the first top fixing plate and the surrounding ring;

[0023] The first top fixing plate is densely provided with grooves;

[0024] The first top fixing plate, the first bottom contact plate, and the intermediate block are all made of metal.

[0025] Preferably, the stabilizing component includes a second top fixing plate and a second bottom contact plate. The second top fixing plate is fixedly connected to the top frame. A central elastic member is provided at the center of the second top fixing plate. The lower end of the central elastic member is fixedly connected to the second bottom contact plate, and the second bottom contact plate is attached to the upper surface of the chip body.

[0026] Below the second top fixing plate, there are four groups of first trapezoidal blocks, side elastic members, and second trapezoidal blocks. A sliding rod is fixedly connected to the lower surface of the second top fixing plate. The sliding rod is slidably connected to the first trapezoidal block. The second trapezoidal block is fixedly connected to the second bottom contact plate, and a side elastic member is provided between the first trapezoidal block and the second trapezoidal block.

[0027] A linkage plate is fixedly connected to the end of the second trapezoidal block. Two linkage rods penetrate between two symmetric linkage plates. Limit rings are provided at both ends of the linkage rod. An elastic body is provided on the linkage rod between the limit ring and the linkage plate. An elastic body is also provided on the linkage rod between the two linkage plates.

[0028] The side elastic member includes a rigid member and a flexible member. Several groups of the rigid members and flexible members are arranged at intervals, and the flexible member is adhered to the rigid member.

[0029] A method for manufacturing a special-shaped encapsulation frame is used to manufacture the special-shaped encapsulation frame structure described above.

[0030] Preferably, it includes the following steps:

[0031] S1: Place the chip body into the frame component.

[0032] S2: Electrically connect the chip body to the pins on the bottom plate.

[0033] S3: Fix the bottom plate to the frame component.

[0034] Compared with the prior art, the present invention has at least the following beneficial effects:

[0035] In this application, the frame component used for encapsulating the chip body is a structure with an upper exposed part, so that the upper surface of the chip body can be completely exposed, reducing the occlusion on the surface of the chip body, effectively avoiding the phenomenon of heat accumulation in the chip body, and ensuring the performance of the chip body after encapsulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0037] Figure 2 It is a schematic diagram of a structure of the stabilizing component of the present invention;

[0038] Figure 3 Schematic diagram of the second stabilizing component of the present invention;

[0039] Figure 4 Partial schematic diagram of the structure of the second stabilizing component of the present invention;

[0040] Figure 5 Schematic diagram of the structure of the side-mounted elastic member of the present invention.

[0041] In the figure: 1, chip body; 2, bottom plate; 3, side frame; 4, first limit protection member; 5, top frame; 6, bottom frame; 7, pressure stabilizing member; 8, second limit protection member; 9, locking member; 10, first shock-absorbing member; 11, second shock-absorbing member; 12, friction plate; 21, first top fixing plate; 22, first bottom contact plate; 23, intermediate block; 24, arc surface; 25, side shock-absorbing pad; 26, limit groove; 27, fixing block; 28, elastic member; 29, second top fixing plate; 30, second bottom contact plate; 31, middle elastic member; 32, first trapezoidal block; 33, side-mounted elastic member; 34, second trapezoidal block; 35, linkage plate; 36, limit ring; 37, slide bar; 38, linkage rod; 39, flank; 331, rigid member; 332, flexible member. Detailed implementation manners

[0042] In the present invention, descriptions such as "first" and "second" are only for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are merely used to distinguish the protection components or operations described with the same technical terms, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions and technical features between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0043] Embodiment 1

[0044] Please refer to Figure 1 , a special-shaped encapsulation frame structure, including a chip body 1 and a frame assembly. The frame assembly is arranged on the side of the chip body 1. A bottom plate 2 is arranged under the frame assembly. Pins electrically connected to the chip body 1 are arranged on the bottom plate 2, and the top of the chip body 1 is exposed.

[0045] A method for manufacturing a special-shaped encapsulation frame, used for manufacturing the above-mentioned special-shaped encapsulation frame structure.

[0046] Including the following steps:

[0047] S1: Place the chip body 1 inside the frame assembly;

[0048] S2: Electrically connect the chip body 1 to the pins on the bottom plate 2;

[0049] S3: Fix the bottom plate 2 to the frame assembly.

[0050] Working principle and beneficial effects of the above solution:

[0051] In this application, the frame assembly used for encapsulating the chip body 1 has an exposed upper structure, enabling the upper surface of the chip body 1 to be completely exposed, reducing the obstruction on the surface of the chip body 1, effectively avoiding the phenomenon of heat accumulation in the chip body 1, and ensuring the performance of the chip body 1 after encapsulation.

[0052] Embodiment 2

[0053] Please refer to Figure 1 , based on Embodiment 1, the frame assembly includes a side frame 3, a top frame 5 is arranged on the upper side of the side frame 3, and the top frame 5 is perpendicular to the side frame 3;

[0054] A bottom frame 6 is arranged on the lower side of the side frame 3, the bottom frame 6 is perpendicular to the side frame 3, and the chip body 1 is fixed between the top frame 5 and the bottom frame 6;

[0055] A side wing 39 is arranged on the side of the chip body 1, and the side wing 39 is arranged between the top frame 5 and the bottom frame 6.

[0056] A first limit protection member 4 is arranged at the bending part of the side frame 3 and the top frame 5, the first limit protection member 4 is a cavity structure, the cross-section of the first limit protection member 4 is in the shape of a cavity "7", and the bending part of the first limit protection member 4 abuts against the top surface and the side surface of the side wing 39;

[0057] The thickness of the side wing 39 is lower than the thickness of the chip body 1;

[0058] A second limit protection member 8 is connected to the bottom frame 6, the top end of the second limit protection member 8 is connected to the lower surface of the side wing 39, and the second limit protection member 8 is located on the side of the chip body 1;

[0059] A pressure stabilizing member 7 is connected to the bottom frame 6, a gap is formed between the lower side of the pressure stabilizing member 7 and the upper surface of the second limit protection member 8, the bottom plate 2 is clamped between the pressure stabilizing member 7 and the second limit protection member 8, and the bottom plate 2 is located under the chip body 1.

[0060] A friction plate 12 is arranged on the bottom plate 2, and the friction plate 12 is attached to the lower surface of the chip body 1;

[0061] The first limiting and protecting member 4 is internally provided with reinforcing ribs, and the reinforcing ribs are arranged at the bending part of the first limiting and protecting member 4;

[0062] A second shock-absorbing member 11 is arranged between the upper side of the second limiting and protecting member 8 and the side wing 39;

[0063] A first shock-absorbing member 10 is arranged between the lower side of the second limiting and protecting member 8 and the bottom plate 2.

[0064] A groove is arranged on the chassis 6, the side of the pressure stabilizing member 7 is bent in the groove on the chassis 6, and the pressure stabilizing member 7 and the second limiting and protecting member 8 are fixedly connected to the chassis 6 through a locking member 9.

[0065] The working principle and beneficial effects of the above solution:

[0066] When encapsulating, first place the first limiting and protecting member 4 between the side frame 3 and the top frame 5, and fit the side wing 39 with the first limiting and protecting member 4. The first limiting and protecting member 4 limits and protects the chip body 1. Then, press the second limiting and protecting member 8 and the second shock-absorbing member 11 on the lower surface of the side wing 39, and make the second limiting and protecting member 8 located on the side of the chip body 1 to fix and protect the chip body 1. Place the bottom plate 2 on the lower surface of the chip body 1, and the friction plate 12 on the upper surface of the bottom plate 2 contacts the lower surface of the chip body 1. Due to the large friction between the friction plate 12 and the chip body 1, it is difficult for the chip body 1 to move relative to the friction plate 12. By fixing the bottom plate 2, the relative stability of the position of the chip body 1 and the frame assembly is ensured. Then, insert the bent part of the pressure stabilizing member 7 into the groove of the chassis 6, which not only makes the pressure stabilizing member 7 firmly fixed, but also determines the position of the pressure stabilizing member 7. The chassis 6, the pressure stabilizing member 7, and the second limiting and protecting member 8 are fixed into one body by the second top fixing plate 29, ensuring the structural stability of the frame assembly;

[0067] The reinforcing ribs are arranged in the first limiting and protecting member 4 with a cavity structure, which can not only reduce the weight of the frame assembly, but also reduce the deformation amount, and ensure the use strength of the first limiting and protecting member 4 on the basis of having a certain flexibility.

[0068] Embodiment 3

[0069] Please refer to Figure 2 , on the basis of Embodiments 1-2, the top frame 5 is fixedly connected with a stabilizing assembly, the stabilizing assembly is arranged above the chip body 1, and the stabilizing assembly is used to assist in fixing the chip body 1.

[0070] The stabilizing component includes a first top fixing plate 21, a first bottom contact plate 22, and an intermediate block 23. The side of the first top fixing plate 21 is fixedly connected to the top frame 5. The lower surface of the first top fixing plate 21 is provided with a concave arc surface 24. The intermediate block 23 is embedded in the arc surface 24 on the lower surface of the first top fixing plate 21. The intermediate block 23 fits with the arc surface 24, and the intermediate block 23 and the arc surface 24 can slide relative to each other. The lower surface of the intermediate block 23 is fixedly connected to the first bottom contact plate 22, and the first bottom contact plate 22 is in contact with the upper surface of the chip body 1;

[0071] The upper surface of the first bottom contact plate 22 is provided with a plurality of fixing blocks 27. The fixing blocks 27 are arranged on the outer periphery of the intermediate block 23. An elastic member 28 is fixedly connected to the fixing blocks 27, and the upper end of the elastic member 28 is fixedly connected to the first top fixing plate 21;

[0072] A surrounding ring is provided on the side of the first bottom contact plate 22. The surrounding ring is located on the peripheral side of the first top fixing plate 21. A side shock pad 25 is provided between the side wall of the first top fixing plate 21 and the surrounding ring;

[0073] The first top fixing plate 21 is densely provided with grooves;

[0074] The first top fixing plate 21, the first bottom contact plate 22, and the intermediate block 23 are all made of metal.

[0075] The working principle and beneficial effects of the above solution:

[0076] A stabilizing component is provided above the chip body 1. By connecting the chip body 1 and the frame component through the stabilizing component, the strength of the chip body 1 after encapsulation can be effectively guaranteed. Moreover, the stabilizing component made of metal with the first top fixing plate 21, the first bottom contact plate 22, and the intermediate block 23 closely attached to each other and in contact with the chip body 1 can quickly transfer the heat generated on the chip body 1 to the first top fixing plate 21. The grooves densely arranged on the first top fixing plate 21 increase the contact area with the outside air, enabling rapid and effective heat dissipation of the chip body 1, ensuring that the chip body 1 is at an appropriate working temperature, guaranteeing the performance of the chip body 1, and preventing the chip body 1 from reducing its frequency due to excessive temperature and resulting in performance degradation;

[0077] And when the package is subjected to external force, the frame component will drive the first top fixing plate 21 to move. The chip body 1 inside the frame component will tend to remain stationary due to inertia. As a result, the first bottom contact plate 22 drives the intermediate block 23 to slide relative to the first top fixing plate 21, and the side shock pad 25 and the elastic member 28 are stressed to offset the impact, effectively ensuring the stability of the chip body 1 and preventing damage.

[0078] Embodiment 4

[0079] Please refer toFigures 3 - 5 Based on Embodiments 1-2, a stabilizing component is fixedly connected to the top frame 5. The stabilizing component is disposed above the chip body 1 and is used to assist in fixing the chip body 1.

[0080] The stabilizing component includes a second top fixing plate 29 and a second bottom contact plate 30. The second top fixing plate 29 is fixedly connected to the top frame 5. A central elastic member 31 is disposed at the center of the second top fixing plate 29. The lower end of the central elastic member 31 is fixedly connected to the second bottom contact plate 30, and the second bottom contact plate 30 is attached to the upper surface of the chip body 1.

[0081] Four groups of first trapezoidal blocks 32, side elastic members 33, and second trapezoidal blocks 34 are disposed below the second top fixing plate 29. A sliding rod 37 is fixedly connected to the lower surface of the second top fixing plate 29. The sliding rod 37 is slidably connected to the first trapezoidal block 32. The second trapezoidal block 34 is fixedly connected to the second bottom contact plate 30. A side elastic member 33 is disposed between the first trapezoidal block 32 and the second trapezoidal block 34.

[0082] A linkage plate 35 is fixedly connected to the end of the second trapezoidal block 34. Two linkage rods 38 penetrate between two symmetrically arranged linkage plates 35. Limit rings 36 are disposed at both ends of the linkage rod 38. Elastic bodies are disposed on the linkage rod 38 between the limit ring 36 and the linkage plate 35, and elastic bodies are also disposed on the linkage rod 38 between the two linkage plates 35.

[0083] The side elastic member 33 includes a rigid member 331 and a flexible member 332. A plurality of groups of the rigid member 331 and the flexible member 332 are arranged at intervals, and the flexible member 332 is adhered to the rigid member 331.

[0084] The working principle and beneficial effects of the above solution:

[0085] By disposing the stabilizing component above the chip body 1 and connecting the chip body 1 with the frame component through the stabilizing component, the strength of the chip body 1 after encapsulation can be effectively guaranteed.

[0086] When the package is subjected to external force, the frame component will drive the second top fixing plate 29 to move. The impact acting on the chip body 1 is reduced by the central elastic member 31 and the side elastic member 33 disposed between the second top fixing plate 29 and the second bottom contact plate 30, and the elastic bodies on the linkage rod 38 can further reduce the impact, ensuring the stability of the chip body 1.

[0087] The inclined surface contact of the first trapezoidal block 32 and the second trapezoidal block 34 can simultaneously reduce the transverse and longitudinal impacts received by the chip body 1, effectively ensuring the stability of the chip body 1 and avoiding damage.

[0088] It is obvious to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, in any respect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A special-shaped encapsulation frame structure, characterized in that it includes a chip body (1) and a frame component. The frame component is arranged on the side of the chip body (1). A bottom plate (2) is arranged on the lower side of the frame component. Pins electrically connected to the chip body (1) are arranged on the bottom plate (2), and the top of the chip body (1) is exposed.

2. The special-shaped encapsulation frame structure according to claim 1, characterized in that the frame component includes a side frame (3). A top frame (5) is arranged on the upper side of the side frame (3), and the top frame (5) is perpendicular to the side frame (3); a bottom frame (6) is arranged on the lower side of the side frame (3), and the bottom frame (6) is perpendicular to the side frame (3). The chip body (1) is fixed between the top frame (5) and the bottom frame (6); flanks (39) are arranged on the side of the chip body (1), and the flanks (39) are arranged between the top frame (5) and the bottom frame (6).

3. The special-shaped encapsulation frame structure according to claim 2, characterized in that a first limit protection part (4) is arranged at the bending part of the side frame (3) and the top frame (5). The first limit protection part (4) is of a cavity structure. The cross-section of the first limit protection part (4) is in the shape of a cavity "7". The bending part of the first limit protection part (4) abuts against the top surface and the side surface of the flank (39); the thickness of the flank (39) is lower than the thickness of the chip body (1); a second limit protection part (8) is connected to the bottom frame (6). The top end of the second limit protection part (8) is connected to the lower surface of the flank (39), and the second limit protection part (8) is located on the side of the chip body (1); a pressure stabilizing part (7) is connected to the bottom frame (6). A gap is formed between the lower side of the pressure stabilizing part (7) and the upper surface of the second limit protection part (8). The bottom plate (2) is clamped between the pressure stabilizing part (7) and the second limit protection part (8), and the bottom plate (2) is located under the chip body (1).

4. The special-shaped encapsulation frame structure according to claim 3, characterized in that a friction plate (12) is arranged on the bottom plate (2), and the friction plate (12) is attached to the lower surface of the chip body (1); reinforcing ribs are arranged inside the first limit protection part (4), and the reinforcing ribs are arranged at the bending part of the first limit protection part (4); a second shock-absorbing part (11) is arranged between the upper side of the second limit protection part (8) and the flank (39); a first shock-absorbing part (10) is arranged between the lower side of the second limit protection part (8) and the bottom plate (2).

5. The special-shaped encapsulation frame structure according to claim 3, characterized in that a groove is arranged on the bottom frame (6). The side of the pressure stabilizing part (7) is bent in the groove on the bottom frame (6). The pressure stabilizing part (7) and the second limit protection part (8) are fixedly connected to the bottom frame (6) through a locking part (9).

6. The special-shaped encapsulation frame structure according to claim 2, characterized in that The top frame (5) is fixedly connected with a stabilizing component, the stabilizing component is arranged above the chip body (1), and the stabilizing component is used to assist in fixing the chip body (1).

7. The special-shaped encapsulation frame structure according to claim 6, characterized in that The stabilizing component includes a first top fixing plate (21), a first bottom contact plate (22), and an intermediate block (23). The side of the first top fixing plate (21) is fixedly connected with the top frame (5). The lower surface of the first top fixing plate (21) is provided with a concave arc surface (24). The intermediate block (23) is embedded in the arc surface (24) on the lower surface of the first top fixing plate (21). The intermediate block (23) fits with the arc surface (24), and the intermediate block (23) and the arc surface (24) can slide relative to each other. The lower surface of the intermediate block (23) is fixedly connected to the first bottom contact plate (22), and the first bottom contact plate (22) is in contact with the upper surface of the chip body (1); A plurality of fixing blocks (27) are arranged on the upper surface of the first bottom contact plate (22). The fixing blocks (27) are arranged on the outer periphery of the intermediate block (23). An elastic member (28) is fixedly connected to the fixing blocks (27), and the upper end of the elastic member (28) is fixedly connected to the first top fixing plate (21); A surrounding ring is arranged on the side of the first bottom contact plate (22). The surrounding ring is located on the periphery of the first top fixing plate (21). A side shock pad (25) is arranged between the side wall of the first top fixing plate (21) and the surrounding ring; The first top fixing plate (21) is densely provided with grooves; The first top fixing plate (21), the first bottom contact plate (22), and the intermediate block (23) are all made of metal.

8. The special-shaped encapsulation frame structure according to claim 6, characterized in that The stabilizing component includes a second top fixing plate (29) and a second bottom contact plate (30). The second top fixing plate (29) is fixedly connected to the top frame (5). A central elastic member (31) is arranged at the center of the second top fixing plate (29). The lower end of the central elastic member (31) is fixedly connected to the second bottom contact plate (30), and the second bottom contact plate (30) is in contact with the upper surface of the chip body (1); Four groups of first trapezoidal blocks (32), side elastic members (33), and second trapezoidal blocks (34) are arranged below the second top fixing plate (29). A sliding rod (37) is fixedly connected to the lower surface of the second top fixing plate (29). The sliding rod (37) is slidably connected to the first trapezoidal block (32). The second trapezoidal block (34) is fixedly connected to the second bottom contact plate (30). A side elastic member (33) is arranged between the first trapezoidal block (32) and the second trapezoidal block (34); One end of the second trapezoidal block (34) is fixedly connected with a linkage plate (35). Two linkage rods (38) penetrate between two symmetrically arranged linkage plates (35). Limit rings (36) are arranged at both ends of the linkage rods (38). An elastic body is arranged on the linkage rods (38) between the limit rings (36) and the linkage plates (35), and an elastic body is also arranged on the linkage rods (38) between the two linkage plates (35). The side elastic member (33) includes a rigid member (331) and a flexible member (332). A plurality of the rigid members (331) and the flexible members (332) are arranged at intervals, and the flexible members (332) are adhered to the rigid members (331).

9. A method for manufacturing a special-shaped encapsulation frame, characterized in that, For manufacturing a special-shaped encapsulation frame structure according to any one of claims 1-8.

10. A method for manufacturing a special-shaped encapsulation frame according to claim 9, characterized in that, Comprising the following steps: S1: Place the chip body (1) into the frame assembly. S2: Electrically connect the chip body (1) with the pins on the bottom plate (2). S3: Fix the bottom plate (2) and the frame assembly together.

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