Welding-spot-free integrated packaged antenna and communication equipment

Abstract

The invention relates to the field of packaging antennas, in particular to a welding-spot-free integrated packaging antenna and communication equipment. Comprising a plurality of metal layers and dielectric layers used for isolation between the adjacent metal layers; the multiple metal layers sequentially comprise a radio frequency signal pin of the first metal layer, a grounding electric conductor of the second metal layer, a radiation patch of the third metal layer and a parasitic patch of the fourth metal layer from top to bottom; the radiation patch is connected with the radio frequency signal pin through the feed TCV array, the radiation patch is coupled with the parasitic patch, and the center of the radiation patch coincides with the center of the parasitic patch. Through the stacking design of the multiple metal layers and the dielectric layers and the coupling structure of the radiation patch and the parasitic patch, the compactness of the antenna structure is achieved, the processing complexity and the manufacturing cost are reduced through the structure, meanwhile, the radio frequency signal pin and the radiation patch are directly connected through the feed TCV array, and the antenna structure is compact. The problem of impedance mismatch introduced by a traditional welding process is avoided, and the signal transmission efficiency and stability are improved.

Description

Technical Field

[0001] The present invention relates to the field of packaged antennas, and particularly to a solderless integrated packaged antenna and a communication device. Background Art

[0002] AiP (Antenna in Package) integrates an antenna and a chip highly within a package based on packaging materials and processes, thus successfully realizing the system-level wireless function. AiP conforms to the trend of increasing semiconductor process integration, taking into account antenna performance, cost, and volume, representing a major achievement in antenna miniaturization technology and the technical upgrade direction of terminal antennas in recent years.

[0003] In the field of biomedicine, the application prospect of AiP technology is broad, but at the same time, it also faces challenges. Due to the complex internal environment of the organism, requirements are put forward for the size of the implantable packaged antenna, which needs to be small enough to avoid unnecessary interference to biological tissues; corrosion resistance is directly related to the long-term stability of the antenna in complex environments such as body fluids; and safety must ensure that the operation of the antenna in the human body will not cause any harm to the organism.

[0004] Considering the electromagnetic safety of implanting into the human body, this requires that the operating frequency of the antenna must be controlled within a reasonable range to avoid potential risks brought by too high frequencies. However, in order to ensure the rapid and accurate transmission of data such as biological information, the operating bandwidth of the antenna needs to be wide enough.

[0005] Currently, methods for reducing the antenna size and broadening the bandwidth include, for example, changing the shape of the antenna radiation patch to optimize the radiation efficiency, covering the upper surface of the antenna with a dielectric layer and adding a short-circuit structure to adjust the electromagnetic characteristics, reducing the quality factor of the antenna to broaden the frequency band, adding an impedance matching network to improve the transmission performance, etc. However, while these methods bring performance improvements, they are also accompanied by problems such as increased design complexity and processing difficulty. Summary of the Invention

[0006] Aiming at the problems mentioned in the prior art, the present invention proposes a solderless integrated packaged antenna and a communication device, which have the characteristics of compact structure, high flexibility, low processing difficulty, and good signal reception ability, and are more suitable for implantable hardware systems, which can not only significantly improve the signal transmission efficiency and stability of the electronic packaging system, but also improve the performance and reliability of the entire system.

[0007] To achieve the above object, the present invention adopts the following technical solutions: A solderless integrated packaged antenna of the present invention includes multiple metal layers and dielectric layers for isolation between adjacent metal layers; The multi-layer metal layer sequentially includes a radio frequency signal pin of a first metal layer, a ground conductor of a second metal layer, a radiation patch of a third metal layer, and a parasitic patch of a fourth metal layer from top to bottom; the radiation patch is connected to the radio frequency signal pin through a feeding TCV array, the radiation patch is mutually coupled with the parasitic patch, and the centers of the radiation patch and the parasitic patch coincide.

[0008] As a further improvement of the present invention, the sizes of the radiation patch and the parasitic patch are the same or different.

[0009] As a further improvement of the present invention, the size includes width and length; The width is determined according to the following formula:

[0010] In the formula: is the speed of light; is the relative dielectric constant of the dielectric layer; is the resonant frequency; The length is determined according to the following formula:

[0011] In the formula: is the guided wavelength of the dielectric layer.

[0012] As a further improvement of the present invention, the feeding TCV array includes a center feeding TCV and a ground TCV array, and the ground TCV array and the center feeding TCV array form a coaxial-like transmission structure.

[0013] As a further improvement of the present invention, the position of the center feeding TCV is determined according to the following formula:

[0014]

[0015] In the formula: is the length of the radiation patch; is the thickness of the second dielectric layer; is the relative dielectric constant of the dielectric layer; is the offset of the center feeding TCV from the center of the radiation patch.

[0016] As a further improvement of the present invention, the dielectric layer includes a first dielectric layer, a second dielectric layer, and a third dielectric layer; the first dielectric layer is between the first metal layer and the second metal layer, the second dielectric layer is between the second metal layer and the third metal layer, and the third dielectric layer is between the third metal layer and the fourth metal layer.

[0017] As a further improvement of the present invention, it further includes a dielectric bottom plate, and the dielectric bottom plate is arranged on the lower surface of the fourth metal layer.

[0018] As a further improvement of the present invention, the dielectric layer is ceramic.

[0019] As a further improvement of the present invention, it further includes a sealing ring surrounding the periphery of the circuit module.

[0020] A communication device includes the solderless integrated packaged antenna as described above.

[0021] The present invention has achieved the following technical effects compared with the prior art: The solderless integrated packaged antenna of the present invention realizes the compactness of the antenna structure through the stacking design of multiple metal layers and dielectric layers, and the coupling structure of the radiation patch and the parasitic patch. The structure of the present invention reduces the processing complexity and manufacturing cost. At the same time, by directly connecting the radio frequency signal pin and the radiation patch through the feeding TCV array, the impedance mismatch problem introduced by the traditional welding process is avoided, thereby improving the signal transmission efficiency and stability. In addition, the central coincidence coupling of the radiation patch and the parasitic patch forms a double resonance, which can effectively expand the working bandwidth of the antenna, enabling it to meet the small size requirements in the biomedical implantable system and ensuring the reliable transmission of high-frequency data, solving the problem that it is difficult to balance the size, bandwidth and security in the prior art.

[0022] The size design formula of the radiation patch and the parasitic patch of the present invention ensures the precise matching of the antenna resonance frequency and the guided wave wavelength, further improving the radiation efficiency and bandwidth performance; at the same time, the coaxial-like connection structure formed by the sealing ring and the grounding TCV array enhances the electromagnetic shielding ability and reduces signal interference; the dielectric layer uses ceramic materials, which not only improves the corrosion resistance and mechanical strength of the antenna, but also meets the long-term stability requirements of the complex environment in the living body; the hierarchical design of multiple dielectric layers optimizes the electromagnetic wave propagation characteristics by regulating the dielectric constant distribution, simplifies the manufacturing process and improves the reliability of the overall performance of the antenna. Description of the Drawings

[0023] Figure 1 It is a schematic cross-sectional view of the solderless integrated packaged antenna of the present invention; Figure 2 It is a bottom view of the solderless integrated packaged antenna of the present invention; Figure 3 It is a top view of the solderless integrated packaged antenna of the present invention; Figure 4 It is a schematic diagram of the feeding TCV array of the solderless integrated packaged antenna of the present invention; Figure 5 It is a diagram of the S11 simulation result of the solderless integrated packaged antenna of the present invention; Figure 6These are the E-plane and H-plane radiation patterns of the solderless integrated packaged antenna of the present invention.

[0024] Reference numerals: 1, parasitic patch; 2, radiation patch; 3, ground conductor; 4, first dielectric layer; 5, center-fed TCV; 6, ground TCV array; 7, RF signal pin; 8, sealing ring; 9, second dielectric layer; 10, third dielectric layer; 11, dielectric base plate; 12, active chip; 13, resistor-capacitor device. Detailed implementation manners

[0025] In the following text, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0026] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0028] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0030] It should be understood that when used in this specification and the appended claims, the terms "comprises" and "comprising" indicate the presence of the described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their groups.

[0031] It should also be understood that the terms used in the specification of the present invention are merely for the purpose of describing particular embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly dictates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0032] It should be further understood that the term " / and" as used in the specification of the present invention and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0033] Schematic diagrams of various structures according to the disclosed embodiments of the present invention are shown in the drawings. These figures are not drawn to scale, where certain details are enlarged for the purpose of clear expression, and certain details may be omitted. The shapes of various regions and layers shown in the figures, and their relative sizes and positional relationships are merely exemplary, and may actually deviate due to manufacturing tolerances or technical limitations, and those skilled in the art can design regions / layers with different shapes, sizes and relative positions according to actual needs.

[0034] The embodiments of the present invention will be described in detail below with reference to the drawings.

[0035] As Figure 1As shown in the figure, the present invention proposes a solderless integrated packaged antenna, which includes multiple metal layers and dielectric layers for isolation between adjacent metal layers; the multiple metal layers sequentially include a radio frequency signal pin 7 of the first metal layer, a ground conductor 3 of the second metal layer, a radiation patch 2 of the third metal layer, and a parasitic patch 1 of the fourth metal layer from top to bottom; the radiation patch 2 is connected to the radio frequency signal pin 7 through a feeding TCV array, the radiation patch 2 and the parasitic patch 1 are coupled to each other, and the centers of the radiation patch 2 and the parasitic patch 1 coincide.

[0036] In this embodiment, the first metal layer is the radio frequency signal pin 7, which is used to connect to an external radio frequency signal source. The material of the radio frequency signal pin 7 is a highly conductive metal, preferably gold, and the specific dimensions are determined according to the selected chip. The second metal layer is the ground conductor 3, and the ground conductor 3 is specifically a metal plane structure, preferably made of copper or aluminum, and is connected to the sealing ring 8 through a grounding TCV array 6, thereby forming an electromagnetic shielding structure that can prevent high-frequency signal leakage.

[0037] The third metal layer is the radiation patch 2. In the embodiment, the preferred shape is a rectangle, but it is not limited thereto, and other shapes can also be selected according to actual scenario requirements, such as a circular shape, etc. The material of the radiation patch 2 is copper or aluminum, and the thickness is adjusted according to actual simulation.

[0038] The fourth metal layer is the parasitic patch 1. The parasitic patch 1 coincides with the center of the radiation patch 2, and the antenna bandwidth is extended through the coupling effect. The size of the parasitic patch 1 can be the same as or different from that of the radiation patch 2, and the sizes of the parasitic patch 1 and the radiation patch 2 are determined according to the selected resonant frequency.

[0039] In this embodiment, the metal layers are isolated from each other by dielectric layers. The dielectric layer includes a first dielectric layer 4, which is located between the first metal layer and the second metal layer, and the thickness should meet the impedance matching requirements of the planar transmission line; the first dielectric layer 4 isolates the radio frequency signal pin 7 from the ground layer and simultaneously adjusts the electromagnetic field distribution; the second dielectric layer 9 is located between the second metal layer and the third metal layer, and the thickness is usually selected within the range of 1 / 20 to 1 / 4 of the dielectric wavelength, and is selected according to the specific packaging scenario. A thicker third dielectric layer 10 can increase the bandwidth, but it cannot be too thick, otherwise the coupling efficiency may be reduced.

[0040] The third dielectric layer 10 is located between the third metal layer and the fourth metal layer, and the thickness is usually selected within the range of 1 / 20 to 1 / 4 of the dielectric wavelength, and is selected according to the specific packaging scenario. A thicker third dielectric layer 10 can increase the bandwidth, but it cannot be too thick, otherwise the coupling efficiency may be reduced; the dielectric bottom plate 11 is located on the lower surface of the fourth metal layer, and the thickness is thin, and is specifically selected according to the use scenario.

[0041] In the embodiment, the first dielectric layer 4, the second dielectric layer 9, the third dielectric layer 10, and the dielectric bottom plate 11 are made of ceramic, preferably Al2O3 or ZrO2 ceramic. The purpose is that the high dielectric constant of this material can facilitate the reduction of the antenna size, and at the same time, it has high temperature resistance and corrosion resistance, making it suitable for the biological implantation environment. The ceramic material in the embodiment can ensure the insulation between the encapsulated antenna of the present invention and biological tissues such as muscles, and can also protect the implantable antenna from being eroded by other biological environments such as body fluids.

[0042] In the embodiment, the sizes of the radiation patch 2 and the parasitic patch 1 include width and length. As Figure 2 shown, L represents the length of the radiation patch 2 or the parasitic patch 1, and W represents the width of the radiation patch 2 or the parasitic patch 1.

[0043] The width of the radiation patch 2 and the parasitic patch 1 in the embodiment is determined according to the following formula:

[0044] In the formula: is the speed of light, generally taken as 3×10 8 m / s; is the relative dielectric constant of the dielectric layer, and the relative dielectric constant of the ceramic dielectric is taken as 9.8; is the resonant frequency.

[0045] In the embodiment, the widths of the radiation patch 2 and the parasitic patch 1 are determined according to the selected resonant frequency. When the width of the parasitic patch 1 is less than the width of the radiation patch 2, the impedance bandwidth of the antenna will extend more to the high-frequency end; when the width of the parasitic patch 1 is greater than the width of the radiation patch 2, the impedance bandwidth of the antenna will extend more to the low-frequency end.

[0046] The length of the radiation patch 2 and the parasitic patch 1 in the embodiment is determined according to the following formula:

[0047] In the formula: is the guided wavelength of the dielectric layer. In the embodiment, the guided wavelength is also determined by the resonant frequency.

[0048] As Figure 4 shown, in this embodiment, the feeding TCV array is composed of the center feeding TCV 5 and the grounded TCV array 6. The center feeding TCV 5 is specifically a ceramic through hole. The ceramic through hole vertically penetrates the second dielectric layer 9 by means of a process, directly connecting the RF signal pin 7 to the radiation patch 2. The aperture of the center feeding TCV 5 is selected according to the process requirements, ranging from 70 to 150 um. It should be noted that the distance between the center of the center feeding TCV 5 and the grounded TCV array 6 needs to meet the inner and outer diameter ratio of the coaxial line design.

[0049] The offset of the center-fed TCV 5 in the embodiment from the center of the radiating patch is determined by the following formula:

[0050]

[0051] In the formula: is the length of the radiating patch; is the thickness of the second dielectric layer; is the relative dielectric constant of the dielectric layer, taking 9.8; is the offset of the center-fed TCV from the center of the radiating patch.

[0052] By substituting the calculated parameters into the above formula for calculation, the offset of the feed point from the center of the radiating patch can be obtained , enabling the antenna to achieve impedance matching within a relatively wide frequency band.

[0053] As Figure 3 shown, in the embodiment, the sealing ring 8 is arranged around the circuit module including the RF signal pin 7, and the material is gold or nickel, which is connected to the grounded TCV array 6, ensuring the airtightness of the module and the functional stability of each internal component after being implanted into the body; the embodiment Figure 3 shows the specific structure of the circuit part for providing RF signals to the antenna, including the RF signal pin 7, multiple active chips 12, resistor-capacitor components 13, and the sealing ring 8. The RF signal is provided to the packaged antenna in the form of a via-in-package through the center-fed TCV 5.

[0054] As Figure 4 shown, the grounded TCV array 6 in the embodiment is formed by a circular array of multiple through-holes. In this embodiment, the number of through-holes is 12, but it is not limited to this. The number of through-holes can be increased or decreased according to different usage scenarios. The distance between the through-holes is less than 1 / 20 of the dielectric wavelength; to ensure the process yield, it is preferred that the aperture of the through-holes in the grounded TCV array 6 is the same as that of the through-holes in the center TCV array 5. The grounded TCV array 6 forms a quasi-coaxial structure around the center-fed TCV 5, and this structure can effectively suppress signal leakage and external interference; the radius ratio between the center TCV array 5 and the surrounding grounded TCV array 6 in this embodiment is 13.5.

[0055] As Figure 5 shown, this figure shows the antenna impedance bandwidth (S11 less than -10 dB) achieved by the specific embodiment of the present invention. The operating frequency covers 3.49 GHz to 4.0 GHz, and the relative bandwidth is 13.6%. The impedance bandwidth of a square microstrip antenna using the same glass substrate material is generally 5%. The impedance bandwidth of the patch antenna in this embodiment is 2.72 times that of the traditional patch antenna.

[0056] As shown Figure 6 in the figure, the figure shows the antenna pattern (3.5 GHz) achieved by the specific embodiment of the present invention. At this time, the achievable gain of the antenna reaches 3 dBi.

[0057] This embodiment proposes a communication device, including the solderless integrated packaged antenna as described above. Specifically, it can be used in similar structures such as wireless brain-computer interface antennas and wearable communication antennas. Taking the wireless brain-computer interface antenna as an example, the specific steps are as follows: Bond multiple active chips 12 and multiple resistor-capacitor components 13 to the RF signal pin 7 through gold wires. According to the need to adapt to the low-power transmission requirements of electroencephalogram signals, set the operating frequency of the chips to ensure that the antenna resonance frequency needs to be matched, which can be achieved by adjusting the size of the radiation patch 2 or the thickness of the dielectric layer.

[0058] Ensure that the overall size of the antenna is within the appropriate specification size to adapt to the limitations of the implantation space.

[0059] Coat the surface of the packaged antenna with a biocompatible material (such as parylene). After coating, an airtightness test needs to be carried out to ensure the safety of long-term implantation.

[0060] The solderless integrated packaged antenna proposed by the present invention preferably uses ceramic materials. Through the high-frequency characteristics of ceramic materials, it can effectively reduce signal transmission loss, ensure efficient and stable signal radiation of the antenna in a limited space. At the same time, the corrosion resistance of ceramic materials can resist the erosion of the complex physiological environment in the body, greatly ensuring the safety of use.

[0061] To increase the antenna bandwidth and improve the antenna gain, the present invention adds parasitic patches and adopts a stacked design. The introduction of parasitic patches changes the radiation field distribution of the antenna. Through the coupling effect with the radiation patch, the working bandwidth of the antenna is expanded; the stacked design further optimizes the spatial structure of the antenna and enhances the directivity of the antenna, thus significantly improving the antenna gain.

[0062] The above shows and describes the basic principles, main features and advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0063] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only to illustrate the technical idea of the present invention, and the protection scope of the present invention cannot be limited thereby. Any modification made on the basis of the technical solution according to the technical idea proposed by the present invention falls within the protection scope of the claims of the present invention.

Claims

1. A solderless integrated packaged antenna, characterized in that, It includes multiple metal layers and dielectric layers for isolation between adjacent metal layers; The multiple metal layers sequentially include, from top to bottom, a radio frequency signal pin of a first metal layer, a ground conductor of a second metal layer, a radiation patch of a third metal layer, and a parasitic patch of a fourth metal layer; the radiation patch is connected to the radio frequency signal pin through a feeding TCV array, the radiation patch and the parasitic patch are coupled to each other, and the centers of the radiation patch and the parasitic patch coincide.

2. The packaged antenna with solderless integration according to claim 1, characterized in that, The sizes of the radiation patch and the parasitic patch are the same or different.

3. The packaged antenna with solderless integration according to claim 2, characterized in that, The size includes width and length; The width is determined according to the following formula: In the formula: is the speed of light; is the relative permittivity of the dielectric layer; is the resonant frequency; The length is determined according to the following formula: In the formula: is the guided wavelength of the dielectric layer.

4. The packaged antenna with solderless integration according to claim 1, wherein The feeding TCV array includes a center feeding TCV and a ground TCV array, and the ground TCV array and the center feeding TCV array form a coaxial-like transmission structure.

5. The packaged antenna with solderless integration according to claim 4, wherein The position of the center feeding TCV is determined according to the following formula: Wherein: is the length of the radiation patch; is the thickness of the second dielectric layer; is the relative dielectric constant of the dielectric layer; is the offset distance of the center-fed TCV from the center of the radiation patch.

6. The packaged antenna with solderless integration according to claim 1, characterized in that, Wherein, The dielectric layer includes a first dielectric layer, a second dielectric layer, and a third dielectric layer; the first dielectric layer is between the first metal layer and the second metal layer, the second dielectric layer is between the second metal layer and the third metal layer, and the third dielectric layer is between the third metal layer and the fourth metal layer.

7. The packaged antenna with solderless integration according to claim 1, wherein It further includes a dielectric base plate, and the dielectric base plate is disposed on the lower surface of the fourth metal layer.

8. The packaged antenna with solderless integration according to claim 1, characterized in that, The dielectric layer is ceramic.

9. The packaged antenna with solderless integration according to claim 1, wherein It further includes a sealing ring surrounding the periphery of the circuit module.

10. A communication device, characterized in that, It includes a solderless integrated packaged antenna according to any one of claims 1 to 9.

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