Process method for realizing glass-based packaging antenna through temporary bonding and de-bonding

Abstract

The invention relates to the field of antenna packaging processing, in particular to a process method for realizing a glass-based packaging antenna through temporary bonding and de-bonding, which comprises the following steps of: electroplating filling metal after a hole is formed in a glass substrate; after a glass substrate is temporarily bonded on a glass support plate, wiring layer metal I, an organic insulating layer I, a wiring layer and antenna layer metal are processed, after de-bonding, the other surface of the glass substrate is bonded on the surface of the glass support plate, and wiring layer metal II, an organic insulating layer II and a metal bonding terminal layer are processed and reflow soldering with a PCB substrate is carried out. The glass-based packaged antenna is subjected to double-sided packaging processing, the glass substrate is used as a substrate, the heat dissipation effect of the antenna is ensured, the glass through holes are formed in the glass substrate, the structures on the two sides of the glass substrate can be communicated, the double-sided wiring process of the double-sided antenna is achieved, and through two times of temporary bonding and de-bonding, the heat dissipation efficiency of the double-sided antenna is improved. And the glass substrate is positioned and fixed, so that the glass substrate is prevented from being broken, and double-sided packaging processing of the antenna is facilitated.

Description

Technical Field

[0001] The present invention relates to the field of antenna packaging processing, and specifically to a process method for glass-based packaged antennas realized through temporary bonding and debonding. Background Art

[0002] With the mature application of 5G technology and the development of millimeter-wave technology, improving the spectral efficiency and bandwidth capacity of radio transmission has become a key requirement for achieving higher data rates and lower latency. The simultaneous transmit and receive (STAR) technology, also known as in-band full-duplex (IBFD) technology, theoretically doubles the spectral efficiency and bandwidth capacity of a wireless communication system. This patent proposes a processing method for glass-based packaged full-duplex millimeter-wave antennas realized through temporary bonding and debonding.

[0003] However, in practical applications, achieving the expected doubling of bandwidth capacity is severely affected by self-interference (SI) between the transmitter and the receiver. The key challenge in realizing STAR operation lies in meeting the high self-interference cancellation (SIC) requirements. Through a series of SIC technologies across the antenna, analog, and digital domains, a sufficiently high isolation (110 dB) is required between the transmit end (TX) and the receive end (RX). Due to the relative difficulty of improving SIC in the analog and digital domains, ensuring high isolation in the antenna domain becomes particularly crucial. Compared with the PCB substrate, the glass substrate has better signal isolation and anti-interference capabilities. However, due to defects such as the hard and brittle nature of the glass material, there are great process difficulties in double-sided wiring processing. Therefore, a process method for glass-based packaged antennas realized through temporary bonding and debonding needs to be designed. Summary of the Invention

[0004] The purpose of the present invention is to provide a process method for glass-based packaged antennas realized through temporary bonding and debonding to solve the problems in the prior art.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A process method for glass-based packaged antennas realized through temporary bonding and debonding, wherein the glass-based packaged antenna includes a glass substrate, and a plurality of interconnected glass vias are provided through the glass substrate. A first wiring layer metal is fixedly provided on the front surface of the glass substrate, and a second wiring layer metal is fixedly provided on the back surface of the glass substrate. The first wiring layer metal and the second wiring layer metal are respectively located at both ends of the interconnected glass vias.

[0007] An organic insulating layer one is fixedly provided on the front surface of the glass substrate, the organic insulating layer one covers the first wiring layer metal, and an antenna and an antenna layer metal are fixedly provided on the organic insulating layer one. A plurality of antennas and antenna layer metals are fixed on the organic insulating layer one.

[0008] Further, an organic insulating layer two is fixedly provided on the back surface of the glass substrate. The organic insulating layer two covers the wiring layer metal two. A bonding terminal layer is fixedly provided on the side of the organic insulating layer two away from the glass substrate, and a plurality of bonding terminal layers are fixed on the organic insulating layer two.

[0009] Further, the bonding terminal layer is electrically connected to the wiring layer metal two. Solder balls are fixedly provided on the bonding terminal layer, and the solder balls are fixed on the PCB substrate for soldering to fix the bonding terminal layer on the PCB substrate.

[0010] A process method for a glass-based packaged antenna realized by temporary bonding and debonding, the process method comprising the following steps:

[0011] S1. First, fabricate glass vias on the glass substrate by laser-induced etching, and then fill the glass vias by processes such as electroplating.

[0012] S2. By the temporary bonding process, first coat a layer of photosensitive or thermosensitive material on the surface of the glass carrier, and then temporarily bond the filled glass substrate to the surface of the glass carrier.

[0013] S3. Fabricate a metal thin film on the back surface of the glass substrate by coating processes such as PVD, electroplating, and evaporation, and fabricate the wiring layer metal one through coating, exposure, development, etching, and stripping.

[0014] S4. Fabricate an organic insulating layer one through coating, exposure, and development.

[0015] S5. Fabricate a metal thin film on the surface of the glass substrate by coating processes such as PVD, electroplating, and evaporation, then fabricate the wiring layer and the antenna layer metal through coating, exposure, development, etching, and stripping, and then remove the glue and the carrier through processes such as laser or heating and temporary debonding.

[0016] S6. Then, by the temporary bonding process, first coat a layer of photosensitive or thermosensitive material on the surface of the glass carrier, and then temporarily bond the front surface of the glass substrate after completing the antenna layer and other processes to the surface of the glass carrier.

[0017] S7. Fabricate a metal thin film on the back surface of the glass substrate by coating processes such as PVD, electroplating, and evaporation, and then fabricate the wiring layer metal two through coating, exposure, development, etching, and stripping.

[0018] S8. Fabricate an organic insulating layer two through coating, exposure, and development, fabricate a metal thin film on the surface of the glass substrate by coating processes such as PVD, electroplating, and evaporation, and then fabricate the metal bonding terminal layer through coating, exposure, development, etching, and stripping.

[0019] S9. Remove the glue and the carrier board through processes such as temporary debonding by laser or heating, and complete the permanent bonding of the glass substrate of the antenna and the PCB substrate through processes such as reflow soldering.

[0020] Further, the glass via filling material in S1 is a metal material such as Cu or Sn.

[0021] Further, the first metal of the wiring layer, the metal of the wiring layer and the antenna layer, the second metal of the wiring layer, and the metal bonding terminal layer are used to fabricate a patterned metal layer on the material surface through processes such as printing.

[0022] Further, the thickness of the first organic insulating layer and the second organic insulating layer is 1 - 50 μm.

[0023] Further, the metal thin films prepared by the process method are all single-layer or multi-layer structures with a thickness of 100 nm - 5 μm.

[0024] Further, the material of the metal thin film prepared by the process method is one of metal materials such as Al, Cu, Ti, Ag, and Au.

[0025] Advantages of the present invention:

[0026] 1. The process method of the present invention performs double-sided encapsulation processing on the glass-based packaged antenna, uses the glass substrate as the base to ensure the heat dissipation effect of the antenna, opens glass vias on the glass substrate, can connect the structures on both sides of the glass substrate, and realizes the two-sided wiring process of the double-sided antenna;

[0027] 2. The process method of the present invention bonds the glass substrate to the glass carrier board and the glass carrier tray through two temporary bonding and debonding operations, positions and fixes the glass substrate, prevents the glass substrate from cracking, helps the double-sided encapsulation processing of the antenna, simplifies the temporary bonding and debonding operations of the antenna during the operation process, and does not cause damage to the glass substrate. Description of the drawings

[0028] The present invention will be further described below in conjunction with the drawings.

[0029] Figure 1 is a schematic structural diagram of the glass-based packaged antenna of the present invention;

[0030] Figure 2 is a process flow chart of the present invention;

[0031] Figure 3 is a schematic diagram of the process flow of the present invention;

[0032] Figure 4 is a schematic diagram of the process flow of the present invention;

[0033] Figure 5It is a schematic diagram of the process flow of the present invention;

[0034] Figure 6 It is a schematic diagram of the process flow of the present invention;

[0035] Figure 7 It is a flowchart of the method of the present invention.

[0036] The attached drawings are described as follows:

[0037] 1 is a glass substrate, 2 is an interconnected glass via hole, 3 is the first metal of the wiring layer, 4 is an organic insulating layer, 5 is an antenna and the metal of the antenna layer, 6 is the second metal of the wiring layer, 7 is an organic insulating layer, 8 is a bonding terminal layer, 9 is a solder ball, and 10 is a PCB substrate. Specific embodiments

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0039] A process method for a glass-based packaged antenna realized through temporary bonding and debonding, as Figure 1 shown, the glass-based packaged antenna includes a glass substrate 1, and a plurality of interconnected glass via holes 2 are opened on the glass substrate 1. The interconnected glass via holes 2 penetrate through the glass substrate 1. On the front surface of the glass substrate 1, the first metal of the wiring layer 3 is fixedly provided, and on the back surface, the second metal of the wiring layer 6 is fixedly provided. The first metal of the wiring layer 3 and the second metal of the wiring layer 6 are respectively located at both ends of the interconnected glass via hole 2 and are connected through the interconnected glass via hole 2.

[0040] On the front surface of the glass substrate 1, an organic insulating layer 4 is fixedly provided. The organic insulating layer 4 covers the first metal of the wiring layer 3. On the organic insulating layer 4, an antenna and the metal of the antenna layer 5 are fixedly provided. A plurality of antennas and the metal of the antenna layer 5 are fixedly installed on the organic insulating layer 4.

[0041] On the back surface of the glass substrate 1, an organic insulating layer 7 is fixedly provided. The organic insulating layer 7 covers the second metal of the wiring layer 6. On the side of the organic insulating layer 7 away from the glass substrate 1, a bonding terminal layer 8 is fixedly provided. A plurality of bonding terminal layers 8 are fixed on the organic insulating layer 7 and are electrically connected to the second metal of the wiring layer 6. A solder ball 9 is fixedly provided on the bonding terminal layer 8. The solder ball 9 is fixed on the PCB substrate 10. The bonding terminal layer 8 is fixed on the PCB substrate 10 through soldering.

[0042] As Figures 2 - 7 shown, the process method includes the following steps:

[0043] S1. First, fabricate the glass vias on the glass substrate 1 through laser-induced etching, and then fill the glass vias with metal materials such as Cu and Sn by processes like electroplating.

[0044] S2. Through the temporary bonding process, first coat a layer of photosensitive or thermosensitive material on the surface of the glass carrier plate, and then temporarily bond the filled glass substrate 1 to the surface of the glass carrier plate.

[0045] S3. On the back of the glass substrate 1, fabricate a single-layer or multi-layer metal film with a thickness of 100 nm to 5 μm, such as Al, Cu, Ti, Ag, Au, etc., through coating processes like PVD, electroplating, and evaporation. Then, fabricate the metal of wiring layer - 3 through coating, exposure, development, etching, and stripping, or fabricate a patterned metal of wiring layer - 3 on the surface through processes like printing.

[0046] S4. Fabricate an organic insulating layer - 4 with a thickness of 1 to 50 μm through coating, exposure, and development.

[0047] S5. On the surface of the glass substrate, fabricate a single-layer or multi-layer metal film with a thickness of 100 nm to 5 μm, such as Al, Cu, Ti, Ag, Au, etc., through coating processes like PVD, electroplating, and evaporation. Then, fabricate the metal of the wiring layer and antenna layer - 5 through coating, exposure, development, etching, and stripping, or fabricate a patterned metal of the wiring layer and antenna layer - 5 on the surface through processes like printing. Then, remove the glue and the carrier plate through processes like laser or heating and temporary debonding.

[0048] S6. Then, through the temporary bonding process, first coat a layer of photosensitive or thermosensitive material on the surface of the glass carrier plate, and then temporarily bond the front side of the glass substrate 1 after completing the antenna layer and other processes to the surface of the glass carrier plate.

[0049] S7. On the back of the glass substrate 1, fabricate a single-layer or multi-layer metal film with a thickness of 100 nm to 5 μm, such as Al, Cu, Ti, Ag, Au, etc., through coating processes like PVD, electroplating, and evaporation. Then, fabricate the metal of wiring layer - two 6 through coating, exposure, development, etching, and stripping, or fabricate a patterned metal of wiring layer - two 6 on the surface through processes like printing.

[0050] S8. Fabricate an organic insulating layer - two 7 with a thickness of 1 to 50 μm through coating, exposure, and development. On the surface of the glass substrate, fabricate a single-layer or multi-layer metal film with a thickness of 100 nm to 5 μm, such as Al, Cu, Ti, Ag, Au, etc., through coating processes like PVD, electroplating, and evaporation. Then, fabricate the metal bonding terminal layer 8 through coating, exposure, development, etching, and stripping, or fabricate a patterned metal bonding terminal layer 8 on the surface through processes like printing.

[0051] S9. Remove the glue and the carrier plate through processes such as temporary debonding by laser or heating, and complete the permanent bonding of the glass substrate 1 of the antenna and the PCB substrate 10 through processes such as reflow soldering.

[0052] The working principle is as follows:

[0053] Through two times of temporary bonding, the processing surface of the glass substrate 1 is switched to fix the glass substrate 1, which is convenient for stable locking of the substrate module. By using the processing technology on the antenna surface, the wiring layer metal 1-3 on both sides of the antenna, the wiring layer metal 2-6, the antenna and the antenna layer metal 5, the organic insulating layer 2-7 and the bonding terminal layer 8 are processed. After each temporary bonding, the glass substrate 1 is removed by laser or heating debonding, which can effectively improve the state of the glass substrate 1 and is convenient for processing the full-duplex millimeter-wave antenna.

[0054] The above shows and describes the basic principle, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. A process method for a glass-based packaged antenna achieved through temporary bonding and debonding, characterized in that Wherein the glass-based encapsulated antenna includes a glass substrate (1), and a plurality of interconnected glass through-holes (2) are provided through the glass substrate (1). On the front surface of the glass substrate (1), a first wiring layer metal (3) is fixedly provided, and on the back surface of the glass substrate (1), a second wiring layer metal (6) is fixedly provided. The first wiring layer metal (3) and the second wiring layer metal (6) are respectively located at both ends of the interconnected glass through-holes (2). On the front surface of the glass substrate (1), a first organic insulating layer (4) is fixedly provided. The first organic insulating layer (4) covers the first wiring layer metal (3), and on the first organic insulating layer (4), an antenna and an antenna layer metal (5) are fixedly provided. A plurality of antennas and antenna layer metals (5) are fixedly provided on the first organic insulating layer (4).

2. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 1, characterized in that, On the back surface of the glass substrate (1), a second organic insulating layer (7) is fixedly provided. The second organic insulating layer (7) covers the second wiring layer metal (6), and on the side of the second organic insulating layer (7) away from the glass substrate (1), a bonding terminal layer (8) is fixedly provided. A plurality of bonding terminal layers (8) are fixedly provided on the second organic insulating layer (7).

3. The process method of the glass-based packaged antenna achieved through temporary bonding and debonding according to claim 2, characterized in that, The bonding terminal layer (8) is electrically connected to the second wiring layer metal (6), and a solder ball (9) is fixedly provided on the bonding terminal layer (8). The solder ball (9) is fixedly provided on the PCB substrate (10) and is used for soldering to fix the bonding terminal layer (8) on the PCB substrate (10).

4. The process method of the glass-based packaged antenna achieved through temporary bonding and debonding according to claim 3, characterized in that, The process method includes the following steps: S1. First, fabricate the glass through-holes on the glass substrate (1) by laser-induced etching, and then fill the glass through-holes by processes such as electroplating; S2. Through the temporary bonding process, first coat a photosensitive or thermosensitive material on the surface of the glass carrier, and then temporarily bond the filled glass substrate (1) to the surface of the glass carrier; S3. On the back surface of the glass substrate (1), fabricate a metal thin film by coating processes such as PVD, electroplating, and evaporation, and fabricate the first wiring layer metal (3) through coating, exposure, development, etching, and stripping; S4. Fabricate a first organic insulating layer (4) through coating, exposure, and development; S5. On the surface of the glass substrate, fabricate a metal thin film by coating processes such as PVD, electroplating, and evaporation, and then fabricate the wiring layer and the antenna layer metal (5) through coating, exposure, development, etching, and stripping. Then, remove the glue and the carrier through processes such as laser or heating and temporary debonding; S6. Then, through the temporary bonding process, first coat a photosensitive or thermosensitive material on the surface of the glass carrier, and then temporarily bond the front surface of the glass substrate (1) after completing the antenna layer and other processes to the surface of the glass carrier; S7. On the back surface of the glass substrate (1), fabricate a metal thin film by coating processes such as PVD, electroplating, and evaporation, and then fabricate the second wiring layer metal (6) through coating, exposure, development, etching, and stripping; S8. Fabricate a second organic insulating layer (7) through coating, exposure, and development. On the surface of the glass substrate, fabricate a metal thin film by coating processes such as PVD, electroplating, and evaporation, and then fabricate the metal bonding terminal layer (8) through coating, exposure, development, etching, and stripping. S9. Remove the glue and carrier plate through processes such as temporary debonding by laser or heating, and complete the permanent bonding of the glass substrate (1) and the PCB substrate (10) of the antenna through processes such as reflow soldering.

5. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 4, characterized in that, In S1, the glass via filling material is a metal material such as Cu or Sn.

6. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 4, characterized in that, The first metal of the wiring layer (3), the metal of the wiring layer and the antenna layer (5), the second metal of the wiring layer (6), and the metal bonding terminal layer (8) are used to fabricate a patterned metal layer on the material surface through processes such as printing.

7. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 4, wherein The thickness of the first organic insulating layer (4) and the second organic insulating layer (7) is 1 - 50 um.

8. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 4, characterized in that The metal thin films prepared by the process method are all single-layer or multi-layer structures with a thickness of 100 nm - 5 um.

9. The process method of the glass-based packaged antenna achieved by temporary bonding and debonding according to claim 8, characterized in that, The material of the metal thin films prepared by the process method is one of metal materials such as Al, Cu, Ti, Ag, Au, etc.

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