Camera module

Abstract

The invention relates to the technical field of camera shooting equipment, and discloses a camera shooting module which comprises a base assembly, a shell, a lens assembly, a bearing part, an image sensor and a driving module, a containing cavity is formed between the shell and the base assembly, and the shell is provided with a center opening; the lens assembly is fixed in the central opening of the shell; the bearing part is arranged in the accommodating cavity in a sliding manner; the image sensor is fixed on the bearing part; the driving module comprises a magnet assembly and a coil assembly, and the magnet assembly is arranged on one side of the bearing part; the coil assembly is fixedly arranged in the accommodating cavity and is opposite to the magnet assembly; the coil assembly comprises a circuit board, a coil supporting plate and a coil, the coil is fixed on the coil supporting plate, and a first guide wire is led out of the inner side of the coil; the coil supporting plate is provided with a first containing groove, and the first guide wire penetrates out of the first containing groove and is electrically connected with the circuit board. Interference between the first guide wire and the coil supporting plate is avoided, and the risk that the first guide wire is pressed to be broken is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of imaging devices, and particularly to an imaging module. Background Art

[0002] A voice coil motor (VCM) has advantages such as simple structure, small size, low energy consumption, high acceleration, fast response speed, accurate displacement, and low price. Therefore, for the autofocus function of imaging devices currently, the voice coil motor is still a cost-effective solution.

[0003] The voice coil motor in the imaging module includes a magnet assembly and a coil assembly that interact with each other. The coil assembly includes a coil, a coil support plate, a circuit board, etc. After the coil is wound, first and second lead wires extend from both ends of the coil. The first lead wire is located inside the coil, and the second lead wire is located outside the coil. The first and second lead wires are used for electrical connection with components such as the circuit board. When assembling the coil assembly, the first lead wire located inside the coil needs to pass through laterally and outwards, so that the first lead wire is clamped between the end face of the coil and the coil support plate. This will cause interference between the first lead wire and the coil support plate, resulting in excessive extrusion of the first lead wire, and even breaking the first lead wire, thus affecting the normal use of the imaging module.

[0004] Therefore, there is an urgent need for an imaging module to solve the above technical problems. Summary of the Invention

[0005] Based on the above, the purpose of the present invention is to provide an imaging module that can avoid interference between the first lead wire of the coil and the coil support plate and reduce the risk of the first lead wire being broken.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] An imaging module, comprising:

[0008] A base assembly;

[0009] A housing, connected to the base assembly, an accommodation cavity is formed between the housing and the base assembly, and the housing is provided with a central opening;

[0010] A lens assembly, fixed in the central opening of the housing;

[0011] A carrier, slidably disposed in the accommodation cavity along a first direction;

[0012] An image sensor, fixed to a side of the carrier close to the base assembly, and the lens assembly and the image sensor are coaxially arranged;

[0013] The driving module includes a magnet component and a coil component. The magnet component is arranged on one side of the carrier; the coil component is fixedly arranged in the accommodating cavity and is arranged opposite to the magnet component; the coil component includes a circuit board, a coil support plate and a coil arranged in sequence. The coil is fixed on the coil support plate. A first lead wire is led out from the inner side of the coil, and a second lead wire is led out from the outer side; a first accommodating groove penetrating through the edge of the coil support plate is formed on the surface of the coil support plate facing the coil. The first lead wire passes out of the first accommodating groove and is electrically connected to the circuit board.

[0014] In some possible embodiments, the outer contour dimension of the coil support plate is larger than the outer contour dimension of the coil; the coil has a first central hole, and a second central hole is formed on the coil support plate. The size of the second central hole is smaller than the size of the first central hole.

[0015] In some possible embodiments, the coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrosymmetric figure; a second accommodating groove is further formed on the surface of the coil support plate facing the coil. The first accommodating groove and the second accommodating groove are symmetrically arranged about the center of the coil support plate or are arranged by rotating 180 degrees about the axis of the second central hole.

[0016] In some possible embodiments, the depth of the first accommodating groove and the second accommodating groove is 20% - 40% of the thickness of the coil support plate.

[0017] In some possible embodiments, the width of the first accommodating groove and the second accommodating groove is 5 - 10 times the diameter of the first lead wire.

[0018] In some possible embodiments, the shapes of the first accommodating groove and the second accommodating groove are both arc-shaped, and the first accommodating groove and the second accommodating groove are arranged at the diagonal positions of the coil support plate.

[0019] In some possible embodiments, the first accommodating groove and the second accommodating groove both include: a first extension section, a second extension section, and an arc-shaped connection section connecting the first extension section and the second extension section, wherein the included angle between the first extension section and the second extension section is an obtuse angle, and the second extension section penetrates through the edge of the coil support plate.

[0020] In some possible embodiments, the base component includes a base and a fixing member. The fixing member is arranged on the base and is located on one side of the base;

[0021] On one side of the carrier close to the fixing member, a first sliding groove is provided. On one side of the fixing member close to the carrier, a second sliding groove is provided. A guiding member is installed between the first sliding groove and the second sliding groove to enable the carrier to be slidably connected to the fixing member; and / or,

[0022] On one side of the carrier close to the fixing member, a first installation groove is provided, and the magnet assembly is installed in the first installation groove; on one side of the fixing member close to the carrier, a second installation groove is provided, and the coil assembly is installed in the second installation groove; and / or,

[0023] The carrier includes a moving through hole that longitudinally penetrates the carrier. The image sensor is located below the moving through hole, and the lens assembly is located above the moving through hole, and the outer diameter of the lens assembly is smaller than the aperture of the moving through hole; and / or,

[0024] The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or,

[0025] The magnet assembly includes a shielding plate and at least one magnet, and each magnet is fixed on the shielding plate.

[0026] In some possible implementation manners, the base and the fixing member are of a split structure, and the fixing member is fixed on the base;

[0027] A first limiting member is provided at the lower end of the first sliding groove, and a second limiting member is provided at the upper end of the second sliding groove to prevent the guiding member from sliding out between the first sliding groove and the second sliding groove.

[0028] In some possible implementation manners, the base includes a side frame extending around the periphery of the housing and a bottom frame having an installation opening. A glue receiving groove is provided on the bottom frame; the base further includes a limiting block, the limiting block is connected to the inner side surface of the bottom frame and extends toward the inside of the installation opening, and the bottom surface of the carrier contacts the limiting block.

[0029] In some possible implementation manners, the driving module further includes a bottom plate and a driver circuit. The bottom plate is fixed on the base, the driver circuit is installed on the bottom plate, and the driver circuit is electrically coupled to the image sensor and the coil assembly respectively.

[0030] Advantages of the present invention:

[0031] In the present invention, a first accommodation groove penetrating the edge is provided on the coil support plate, facilitating the accommodation of the first guiding wire laterally extending from the inner side of the coil, enabling the first guiding wire to pass through the first accommodation groove and be electrically connected to the circuit board. In this way, interference between the first guiding wire and the coil support plate is avoided, greatly reducing the risk of the first guiding wire being squeezed or even broken, and ensuring the reliable use of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 FIG. 6 is a schematic structural view of the camera module provided in the first embodiment of the present invention;

[0033] Figure 2 FIG. 10 is an exploded view of the camera module provided in the first embodiment of the present invention;

[0034] Figure 3 FIG. 14 is a schematic structural view of the camera module provided in the first embodiment of the present invention with the housing and the lens assembly removed;

[0035] Figure 4 FIG. 18 is an exploded view of the carrier and the magnet assembly provided in the first embodiment of the present invention;

[0036] Figure 5 FIG. 22 is an exploded view of the fixing member, the coil assembly, and the guiding member provided in the first embodiment of the present invention;

[0037] Figure 6 FIG. 26 is a schematic structural view of the coil and the coil support plate at a first angle provided in the first embodiment of the present invention;

[0038] Figure 7 FIG. 30 is a schematic structural view of the coil and the coil support plate at a second angle provided in the first embodiment of the present invention;

[0039] Figure 8 FIG. 34 is a schematic structural view of the coil provided in the first embodiment of the present invention;

[0040] Figure 9 FIG. 38 is a schematic structural view of the coil support plate provided in the first embodiment of the present invention;

[0041] Figure 10 FIG. 42 is a schematic structural view of the base provided in the first embodiment of the present invention;

[0042] Figure 11 FIG. 46 is an exploded view of the camera module provided in the second embodiment of the present invention;

[0043] Figure 12 FIG. 50 is a schematic structural view of the base assembly at a first angle provided in the second embodiment of the present invention;

[0044] Figure 13 FIG. 54 is a schematic structural view of the base assembly at a second angle provided in the second embodiment of the present invention;

[0045] Figure 14 It is a schematic structural diagram of the carrier provided in the second embodiment of the present invention;

[0046] Figure 15 It is a schematic structural diagram of the assembly of the carrier and the metal cover provided in the third embodiment of the present invention;

[0047] Figure 16 It is an exploded view of the structure of the carrier and the metal cover provided in the third embodiment of the present invention;

[0048] Figure 17 It is a schematic flow chart of the forming process provided in the third embodiment of the present invention;

[0049] Figure 18 It is a schematic structural diagram of the metal plate with a preset shape provided in the third embodiment of the present invention;

[0050] Figure 19 It is a schematic structural diagram of the bending and forming of the metal plate provided in the third embodiment of the present invention.

[0051] In the figure:

[0052] 1. Base assembly; 11. Base; 111. Side frame; 112. Bottom frame; 1121. Installation opening; 1122. Glue-bearing groove; 113. Limiting block; 12. Fixing member; 121. Second chute; 1211. Second limiting member; 1212. Fourth limiting member; 122. Second installation groove; 123. Dent structure; 13. Image sensor; 14. Driver circuit; 15. Bottom plate; 2. Carrier; 21. First chute; 211. First limiting member; 212. Third limiting member; 22. First installation groove; 23. Moving through hole; 24. Anti-collision block; 25. Boss; 3. Magnet assembly; 31. Shielding plate; 32. Magnet; 4. Coil assembly; 41. Circuit board; 42. Coil support plate; 421. First accommodation groove; 4211. First extension segment; 4212. Second extension segment; 4213. Arc connection segment; 422. Second accommodation groove; 423. Second central hole; 43. Coil; 431. First lead wire; 432. Second lead wire; 433. First central hole; 44. Magnetic sensor; 5. Housing; 51. Central opening; 6. Guide member; 7. Lens assembly; 8. Metal cover; 81. Accommodation groove; 82. First side wall; 83. Long strip hole; 84. Reinforcing hole; 85. Notch. Detailed implementation manners

[0053] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only some structures related to the present invention are shown in the drawings, rather than all structures.

[0054] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first feature and the second feature, or may include the situation where the first feature and the second feature are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0056] In the description of the present invention, the orientation or positional relationships such as "above", "below", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0057] An embodiment of the present invention provides an imaging module, which can be applied to electronic products and realizes the automatic focusing or optical image stabilization function of the lens through the driving form of a voice coil motor.

[0058] Embodiment 1

[0059] As Figures 1 to 10As shown in the figure, this embodiment provides an imaging module, which includes a base assembly 1, a carrier 2, a housing 5, a lens assembly 7, an image sensor 13, and a driving module. The base assembly 1 includes a base 11 and a fixing member 12. The fixing member 12 is disposed on the base 11 and is located on one side of the base 11. Preferably, the fixing member 12 is perpendicular to the base 11. The housing 5 is connected to the base 11, and an accommodating cavity is formed between the housing 5 and the base assembly 1. The housing 5 is provided with a central opening 51, and the size of the central opening 51 is adapted to the size of the lens assembly 7. The lens assembly 7 is fixed in the central opening 51. The carrier 2 is slidably disposed in the accommodating cavity along a first direction. The first direction is specifically the optical axis direction of the lens assembly 7. The image sensor 13 is located in the accommodating cavity and is fixed to one side of the carrier 2 close to the base 11. The lens assembly 7 and the image sensor 13 are coaxially arranged. The carrier 2 can move the image sensor 13 along the optical axis direction in the accommodating cavity, changing the distance between the image sensor 13 and the lens assembly 7, thereby adjusting the focus of the lens. The image sensor 13 can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) sensor. The image projected onto the image sensor 13 can be captured, stored, and / or presented to the user. Further, the carrier 2 has an annular structure, and a moving through hole 23 is provided at the center thereof. The moving through hole 23 longitudinally penetrates the carrier 2. The image sensor 13 is located below the moving through hole 23, and the lens assembly 7 is located above the moving through hole 23. This allows light to pass through the lens assembly 7 and then through the moving through hole 23 to reach the image sensor 13 to obtain an image. Moreover, the outer diameter of the lens assembly 7 is smaller than the aperture of the moving through hole 23, which enables the lens assembly 7 to smoothly pass through the moving through hole 23 when the carrier 2 moves the image sensor 13.

[0060] In this embodiment, by directly fixing the lens assembly 7 in the central opening 51 of the housing 5, the light can directly pass through the lens assembly 7 to reach the image sensor 13, which can ensure that the normal passage of light will not be blocked under any circumstances. In this embodiment, by first fixing the housing 5 and the lens assembly 7, during assembly, it only needs to ensure that the image sensor 13 and the lens assembly 7 are coaxial with the optical axis, and the assembly accuracy can be ensured, which is more conducive to the optimization of the assembly process. The lens assembly 7 may specifically include one or more lenses, which can focus the light onto the image sensor 13 under their mutual interaction.

[0061] In this embodiment, a driving module is adopted to drive the image sensor 13. The driving module includes a magnet assembly 3 and a coil assembly 4. The magnet assembly 3 is disposed on one side of the carrier 2 close to the fixing member 12, and the coil assembly 4 is disposed on one side of the fixing member 12 close to the carrier 2, and the coil assembly 4 is disposed opposite to the magnet assembly 3. Due to the close proximity between the magnet assembly 3 and the coil assembly 4, the coil assembly 4 can be excited by an electric current to generate a magnetic field that interacts with the magnetic field of the magnet assembly 3. The attractive or repulsive force between the magnetic fields drives the carrier 2 and the image sensor 13 to move up or down along the optical axis in the accommodation cavity, so as to adjust the distance between the image sensor 13 and the lens assembly 7 and realize the function of automatic focusing.

[0062] The driving module of this embodiment further includes a bottom plate 15 and a driver circuit 14. The bottom plate 15 is fixed below the base 11, and the driver circuit 14 is mounted on the bottom plate 15. The driver circuit 14 is electrically coupled to the image sensor 13 and the coil assembly 4 respectively. The driver circuit 14, such as a driver IC, delivers power to the coil assembly 4 to excite the coil assembly 4 and generate a second magnetic field that interacts with the magnetic field of the magnet assembly 3. The driver IC can excite the coil assembly 4 in response to a control signal provided to the driver IC by an external controller such as a microprocessor or other data processing device. In some embodiments, the driver IC can adjust the magnetic field emitted from the coil assembly 4 to drive the carrier 2 to move up or down to an accurate position, for example, by reversing the direction of the current delivered to the coil assembly 4 (thus reversing the polarity of the magnetic field generated from the coil assembly 4) and adjusting the effective strength of the magnetic field (e.g., using pulse width modulation) to adjust the amount of the attractive or repulsive force between the magnet assembly 3 and the coil assembly 4, so that the magnet assembly 3 drives the image sensor 13 to move up and down through the carrier 2. The image sensor 13 can feedback the detected image information to the control module of the imaging device through the driver circuit 14. Further, the driver circuit 14 also has an elastic function, which can help the image sensor 13 to reset after moving, and at the same time make the image sensor 13 more stable when moving up and down.

[0063] Optionally, a first sliding groove 21 is provided on one side of the carrier 2 opposite to the fixing member 12, and a second sliding groove 121 is provided on one side of the fixing member 12 opposite to the carrier 2. Both the first sliding groove 21 and the second sliding groove 121 extend along the optical axis direction of the lens assembly 7. A guiding member 6 is installed between the first sliding groove 21 and the second sliding groove 121, so that the carrier 2 can slide relative to the fixing member 12. With such a setting, the smoothness and running accuracy of the carrier 2 moving along the optical axis direction are increased, and the frictional resistance is reduced. Specifically, the guiding member 6 can be a plurality of balls or a guiding column extending along the optical axis direction, both of which can play a good guiding role. Preferably, the guiding member 6 of this embodiment adopts balls for guiding.

[0064] In this embodiment, the base 11 and the fixing member 12 are of a split structure. The fixing member 12 is fixed to the base 11, and can be fixed by means such as bonding, screwing, clamping, etc. The base assembly 1 of this embodiment adopts a split structure, which is convenient for the separate processing of the base 11 and the fixing member 12. For this split structure, preferably in this embodiment, a first limiting member 211 is provided at the lower end of the first sliding groove 21, and a second limiting member 1211 is provided at the upper end of the second sliding groove 121, which is used to prevent the guiding member 6 from sliding out between the first sliding groove 21 and the second sliding groove 121, and limit the stroke of the bearing member 2 moving along the optical axis direction. Of course, in other embodiments, the first limiting member 211 can also be provided at the upper end of the first sliding groove 21, and the second limiting member 1211 can also be provided at the lower end of the second sliding groove 121, which can also play a limiting role.

[0065] Furthermore, a first installation groove 22 is provided on one side of the bearing member 2 facing the fixing member 12, and the magnet assembly 3 is installed in the first installation groove 22. Optionally, the magnet assembly 3 includes a shielding plate 31 and at least one magnet 32. Each magnet 32 is fixed to the shielding plate 31 by means such as bonding, and after the combination of each magnet 32, a magnet surface facing the coil assembly 4 is formed. A second installation groove 122 is provided on one side of the fixing member 12 facing the bearing member 2, and the coil assembly 4 is installed in the second installation groove 122, and the coil assembly 4 is arranged opposite to the magnet assembly 3.

[0066] The coil assembly 4 of this embodiment includes a circuit board 41, a coil support plate 42, a coil 43 and a magnetic sensor 44. The circuit board 41, the coil support plate 42 and the coil 43 are sequentially installed in the second installation groove 122 of the fixing member 12 from far away from the magnet assembly 3 to close to the magnet assembly 3; the coil 43 is fixed (such as by bonding) to the coil support plate 42 and is electrically connected to the circuit board 41, and the circuit board 41 provides a control signal, a driving current, etc. for the coil 43; the magnetic sensor 44 is located in the middle of the coil 43 and is electrically connected to the circuit board 41, and the magnetic sensor 44 is used to sense the change of the magnetic field. The circuit board 41 of this embodiment can be a flexible circuit board, a rigid circuit board or a combination of rigid and flexible circuit boards; when the circuit board 41 is a flexible circuit board, a reinforcing plate can also be provided to increase the strength of the flexible circuit board.

[0067] The coil 43 is usually wound with copper-clad wire. After winding, a first lead wire 431 is led out from the inner side thereof, and a second lead wire 432 is led out from the outer side. Both the first lead wire 431 and the second lead wire 432 are electrically connected to the circuit board 41. When assembling the coil assembly 4, the first lead wire 431 located inside the coil 43 needs to penetrate laterally outwards, so that the first lead wire 431 is clamped between the end face of the coil 43 and the coil support plate 42. This will cause interference between the first lead wire 431 and the coil support plate 42, resulting in excessive extrusion of the first lead wire 431 and even breaking the first lead wire 431, thus affecting the normal use of the camera module.

[0068] To solve the above problems, in this embodiment, a first accommodation groove 421 penetrating the edge of the coil support plate 42 is formed on the surface of the coil support plate 42 facing the coil 43, so as to facilitate accommodating the first lead wire 431 extending laterally outwards from the inner side of the coil 43. After the first lead wire 431 passes through the first accommodation groove 421, it is electrically connected to the circuit board 41. In this way, interference between the first lead wire 431 and the coil support plate 42 is avoided, and the risk of the first lead wire 431 being extruded or even broken is greatly reduced, ensuring the reliability of the use of the camera module.

[0069] The housing 5 of this embodiment is a housing structure with an opening on the lower side. The housing 5 is buckled on the base 11, and the carrier 2, the fixing member 12, the image sensor 13, the magnet assembly 3 and the coil assembly 4 are all accommodated in the accommodation cavity. In this way, the housing 5 can provide good protection for the internal components. Preferably, the material of the housing 5 is metal, and the shape of the housing 5 is a quadrilateral housing with an open lower end, which can be specifically manufactured by processes such as punching and bending from metal materials. The metal housing 5 can protect the camera module from electromagnetic interference (EMI) that may occur in the environment.

[0070] In this embodiment, the outer contour shape of the coil support plate 42 is the same as the outer contour shape of the coil 43, and the outer contour size of the coil support plate 42 is larger than the outer contour size of the coil 43; the coil 43 is wound to form a first central hole 433, and a second central hole 423 is formed on the coil support plate 42. The size of the second central hole 423 is smaller than the size of the first central hole 433. With such a setting, the coil 43 can be completely accommodated on the coil support plate 42, with a compact structure and reliable use.

[0071] In this embodiment, the coil support plate 42 is made of a metal soft magnetic material, which has the characteristics of low coercivity and high magnetic permeability, and is easy to magnetize and demagnetize. Specifically, the coil support plate 42 can be made of iron-silicon alloy, soft ferrite, etc. When the magnet assembly 3, the carrier 2, and the image sensor 13 move along the optical axis direction and leave the initial position, there is a certain restoring force between the magnet assembly 3 and the coil support plate 42, which can make the magnet assembly 3, the carrier 2, and the image sensor 13 return to the initial position. To ensure the accuracy of the reset of the magnet assembly 3, the carrier 2, and the image sensor 13, in this embodiment, the shape of the coil support plate 42 is preferably a centrosymmetric figure, so that the magnetic force acting on the magnet assembly 3 is symmetric. Exemplarily, the coil support plate 42 can be circular, elliptical, rectangular, etc. Further, a second accommodation groove 422 is formed on one side of the coil support plate 42 facing the coil 43, and the structure of the second accommodation groove 422 is the same as that of the first accommodation groove 421. The second accommodation groove 422 and the first accommodation groove 421 are symmetrically arranged about the center of the coil support plate 42, or the second accommodation groove 422 and the first accommodation groove 421 are arranged by rotating 180 degrees about the axis of the second central hole 423. In this way, the weight balance of the coil support plate 42 is further ensured, the magnetic force acting on the magnet assembly 3 is symmetric, and the smoothness and accuracy of the movement of the magnet assembly 3, the carrier 2, and the image sensor 13 are increased; at the same time, the weight of the product is reduced by providing the second accommodation groove 422.

[0072] The thickness of the coil support plate 42 affects the magnitude of the Lorentz force on the magnet assembly 3. Specifically, the greater the thickness of the coil support plate 42, the greater the Lorentz force on the magnet assembly 3. To ensure sufficient driving force is provided to the magnet assembly 3, when manufacturing the first accommodation groove 421 and the second accommodation groove 422, not too much of the thickness of the coil support plate 42 should be removed. In this embodiment, the depth of the first accommodation groove 421 and the second accommodation groove 422 is 20% - 40% of the thickness of the coil support plate 42, so that while providing an appropriate accommodation space for the first guiding wire 431, the loss of magnetic force can be minimized as much as possible. Preferably, the first accommodation groove 421 and the second accommodation groove 422 of this embodiment are manufactured by stamping. For ease of processing, the depth of the first accommodation groove 421 and the second accommodation groove 422 in this embodiment is set to 30% of the thickness of the coil support plate 42, that is, 30% of the thickness of the coil support plate 42 is removed. It should be noted that when the thickness of the coil support plate 42 itself is relatively thick, the depth of the first accommodation groove 421 and the second accommodation groove 422 can be greater than or equal to the diameter of the first guiding wire 431, so that the first guiding wire 431 can be completely buried in the first accommodation groove 421; when the thickness of the coil support plate 42 itself is not large, the depth of the first accommodation groove 421 and the second accommodation groove 422 can be slightly less than the diameter of the first guiding wire 431. At this time, the first guiding wire 431 is partially accommodated in the first accommodation groove 421, which can also play a role in reducing the interference and extrusion between the first guiding wire 431 and the coil support plate 42.

[0073] Furthermore, during the use and testing of the camera module, the first guiding wire 431 may move. Therefore, if the width of the first accommodation groove 421 is set to be the same as the diameter of the first guiding wire 431, interference is likely to occur between the two. Therefore, in this embodiment, the width of the first accommodation groove 421 is greater than the diameter of the first guiding wire 431. Preferably, the width of the first accommodation groove 421 is 5 - 10 times the diameter of the first guiding wire 431 to provide sufficient movement space for the first guiding wire 431. To ensure structural symmetry, the width of the second accommodation groove 422 is also 5 - 10 times the diameter of the first guiding wire 431, and the width of the second accommodation groove 422 is the same as the width of the first accommodation groove 421.

[0074] In order to better adapt to the actual routing of the first guide wire 431, in this embodiment, the shape of the first receiving groove 421 is preferably an arc. Specifically, the first receiving groove 421 includes: a first extension section 4211, a second extension section 4212, and an arc-shaped connecting section 4213 connected between the first extension section 4211 and the second extension section 4212, wherein the angle between the first extension section 4211 and the second extension section 4212 is an obtuse angle, and the second extension section 4212 runs through the edge of the coil support plate 42. The shape of the second receiving groove 422 is the same as that of the first receiving groove 421, and this embodiment will not be repeated. Further, the first receiving groove 421 and the second receiving groove 422 are arranged at the diagonal position of the coil support plate 42. Such an arrangement facilitates the first guide wire 431 to be connected to the circuit board 41 after being led out along the first receiving groove 421, and facilitates the processing of the groove. Of course, in other embodiments, the shape of the first receiving groove 421 can also be a straight line or a broken line, etc., and is not limited to this embodiment.

[0075] In this embodiment, a plurality of anti-collision blocks 24 are also provided on the top and / or side of the carrier 2. When the camera module is subjected to external impact or severe vibration, the anti-collision blocks 24 can play a role in shock absorption and buffering; at the same time, the anti-collision blocks 24 can limit and buffer the movement of the carrier 2, reduce the impact force between the carrier 2 and the housing 5 during the movement, and improve the shock absorption and noise reduction performance of the camera module. Preferably, the anti-collision blocks 24 are made of elastic materials, such as silicone, rubber or resin, so as to better absorb the impact force generated by the vibration and protect the camera module from the vibration.

[0076] The base 11 of this embodiment includes a bottom frame 112 and a side frame 111 arranged on the bottom frame 112. The bottom surface of the housing 5 can be connected to the bottom frame 112 by adhesive, and the side frame 111 surrounds the outer periphery of the housing 5. The connection method between the housing 5 and the base 11 makes the connection more secure; at the same time, the base 11 can provide a more accurate installation position for the housing 5, so that the lens assembly 7 on the housing 5 can quickly achieve optical axis coaxiality with the image sensor 13. The middle position of the bottom frame 112 has an installation opening 1121, and the size of the installation opening 1121 is smaller than the inner size of the side frame 111, so that a certain width of the bottom frame 112 can be exposed to receive the housing 5, reducing the manufacturing difficulty and increasing the product stability; and the installation opening 1121 can enable the coil assembly 4 to be electrically connected to the driver circuit 14.

[0077] The bottom frame 112 is also provided with a glue receiving groove 1122, which is formed by the upper surface of the bottom frame 112 being recessed downwards, and is used to store a small amount of glue when bonding the outer shell 5 to the base 11, so as to avoid glue overflow, reduce the probability of product abnormality, and ensure product functional characteristics.

[0078] The base 11 further includes a limiting block 113. One end of the limiting block 113 is connected to the inner side surface of the bottom frame 112, and the other end extends towards the inside of the mounting opening 1121. The limiting block 113 is used to support the carrier 2 to prevent the carrier 2 from moving out of the accommodation cavity. The limiting block 113 can limit the downward movement of the carrier 2. When the carrier 2 moves to the lowest position, the bottom surface of the carrier 2 abuts against the upper surface of the limiting block 113.

[0079] Optionally, the upper surface of the limiting block 113 is higher than the upper surface of the bottom frame 112. Since the area of the limiting block 113 is small, it is easy to control its flatness, so that when the carrier 2 contacts the limiting block 113, the image sensor 13 can still be coaxial with the optical axis of the lens assembly 7; moreover, the above setting can also prevent the glue from being extruded onto the upper surface of the limiting block 113 when the housing 5 is bonded to the base 11, which affects the movement of the carrier 2.

[0080] Embodiment 2

[0081] As Figures 11 to 14 shown, this embodiment provides another camera module, whose structure is basically the same as that in Embodiment 1, and also includes a base assembly 1, a carrier 2, a magnet assembly 3, a coil assembly 4, a housing 5, a guiding member 6, a lens assembly 7, an image sensor 13, a driver circuit 14, a bottom plate 15, a first mounting groove 22, a moving through hole 23, a shock-absorbing block 24, a central opening 51, a second mounting groove 122, etc. The following content of this embodiment only describes the differences from Embodiment 1, and the parts that are the same as those in Embodiment 1 will not be described again.

[0082] In this embodiment, the base assembly 1 includes a base 11 and a fixing member 12. The base 11 is used to contact the carrier 2, and the fixing member 12 is used to carry the coil assembly 4. The fixing member 12 of this embodiment is integrally provided on the base 11 and is located on one side of the base 11, that is, the base assembly 1 is an integral structure and is made by an integral molding process. Further, the fixing member 12 is perpendicular to the base 11. The base assembly 1 of this embodiment adopts an integral structure, which not only improves the structural strength, reduces the number of components, and is beneficial to cost saving; but also omits the assembly steps between the base 11 and the fixing member 12, reduces the assembly difficulty, reduces the assembly error, improves the positioning accuracy between the carrier 2 and the housing 5, and avoids the uncertainty during the assembly process; in addition, it also ensures the perpendicularity between the fixing member 12 and the base 11, avoiding the situation where the perpendicularity of the assembly of the fixing member 12 and the base 11 is relatively unstable when using a split structure, and increasing the product robustness.

[0083] Furthermore, in this embodiment, a first sliding groove 21 is provided on the side of the carrier 2 close to the fixing member 12, and a second sliding groove 121 is provided on the side of the fixing member 12 close to the carrier 2. A guiding member 6 is installed between the first sliding groove 21 and the second sliding groove 121 to achieve the sliding connection between the carrier 2 and the fixing member 12. Since the base assembly 1 of this embodiment is an integral structure, the carrier 2 needs to be assembled to the base assembly 1 from above. If a limiting member is provided at the upper end of the second sliding groove 121 of the fixing member 12, it will interfere with the assembly of the carrier 2 and affect the assembly of the carrier 2. For this reason, in this embodiment, a third limiting member 212 is provided at the upper end of the first sliding groove 21 of the carrier 2, and a fourth limiting member 1212 is provided at the lower end of the second sliding groove 121, so as to prevent the guiding member 6 from sliding out between the first sliding groove 21 and the second sliding groove 121. With this setting, the interference with the assembly of the carrier 2 is avoided, the carrier 2 can be smoothly installed, the assembly difficulty is reduced, and the product robustness is increased.

[0084] Preferably, the housing 5 and the fixing member 12 of this embodiment are fixed by bonding, and its assembly is simple and the connection is reliable. In the prior art, the surface of the fixing member 12 is usually smooth, which causes the glue to be difficult to adhere to the surface of the fixing member 12, thereby affecting the bonding effect between the housing 5 and the fixing member 12. To solve the above problems, in this embodiment, a dent structure 123 is provided on the surface (i.e., the outer side surface) of the fixing member 12 away from the carrier 2. In this way, when the adhesive is applied to the outer side surface of the fixing member 12, the adhesive can remain and adhere to the dent structure 123, so as to achieve reliable bonding between the outer side surface of the fixing member 12 and the inner side wall of the housing 5.

[0085] Specifically, the above-mentioned dent structure 123 includes a plurality of long strip-shaped grooves, and each groove extends along the horizontal direction, which enables the adhesive to better adhere to the outer side surface of the fixing member 12. Further, the above-mentioned plurality of grooves are uniformly arranged in an array form on the outer side surface of the fixing member 12 to increase the balance of the bonding to the housing 5. In this embodiment, the adhesive is preferably glue.

[0086] In addition, the base 11 of this embodiment includes a side frame 111 extending around the periphery of the housing 5 and a bottom frame 112 having an installation opening 1121, wherein the fixing member 12 is integrally provided in the bottom frame 112; the base 11 further includes a limiting block 113, and the limiting block 113 is connected to the inner side surface of the bottom frame 112 and extends towards the inside of the installation opening 1121, and the bottom surface of the carrier 2 is in contact with the limiting block 113.

[0087] Further, in this embodiment, three limiting blocks 113 are provided on the inner side surface of the bottom frame 112. One of the limiting blocks 113 is located on the side opposite to the fixing member 12; the other two limiting blocks 113 are symmetrically arranged on the two inner sides of the bottom frame 112, and these two limiting blocks 113 extend to be connected to the two side parts of the fixing member 12 in a one-to-one correspondence. The arrangement of the above three limiting blocks 113 can improve the balance of the impact force of the limiting blocks 113 by the bearing member 2 and increase the support stability for the bearing member 2; and the two limiting blocks 113 on both sides are respectively connected to the fixing member 12, which can increase the structural strength of the limiting blocks 113, and the lengths of the limiting blocks 113 on both sides are also extended to a certain extent, thereby increasing the area of the limiting blocks 113, further improving the structural stability and bending resistance of the limiting blocks 113, and preventing the limiting blocks 113 from being bent or broken due to the impact of the bearing member 2.

[0088] Embodiment III

[0089] This embodiment provides another camera module, whose structure is basically the same as that in Embodiment I, except that the camera module in this embodiment further includes a metal cover 8.

[0090] In the prior art, a large amount of heat is generated during the operation of the image sensor 13. However, at present, most of the bearing members 2 that carry the image sensor 13 in the camera module are made of plastic. Although plastic has the advantages of low cost, light weight, easy processing and molding, etc., its heat dissipation performance is relatively poor. Due to the low heat dissipation of the plastic bearing member 2, the heat generated by the image sensor 13 cannot be dissipated in time and effectively, resulting in an increase in the temperature around the image sensor 13. The too high temperature will not only affect the normal operation of the image sensor 13 and reduce the image quality, such as problems like increased noise and color distortion, but may also shorten the service life of the image sensor 13 and even damage the entire camera module.

[0091] To solve the above problems, as Figures 15 to 16As shown in the figure, in this embodiment, the camera module further includes a metal housing 8. The metal housing 8 is provided with a receiving groove 81. A long hole 83 is provided at the connecting portion of the bottom of the receiving groove 81 and the first side wall 82 of the receiving groove 81. A plurality of strengthening holes 84 are provided on the side wall of the receiving groove 81. The receiving groove 81 covers the outer wall of the carrier 2. A plurality of bosses 25 are provided on the outer wall of the carrier 2. The plurality of bosses 25 are respectively located in the long hole 83 and the plurality of strengthening holes 84. By using the receiving groove 81 of the metal housing 8 to cover the carrier 2, when the image sensor 13 generates heat, the heat of the image sensor 13 can be dissipated through the carrier 2 and the metal housing 8. The metal housing 8 improves the heat dissipation performance of the carrier 2, and the heat generated by the image sensor 13 can be effectively dissipated, improving the performance of the camera module. Furthermore, the bosses 25 on the outer wall of the carrier 2 are respectively located in the long hole 83 and the strengthening holes 84, which improves the assembly strength between the carrier 2 and the metal housing 8. When the camera module is in use or during a drop test, it prevents the carrier 2 from separating from the metal housing 8, improving the reliability of the camera module.

[0092] Preferably, a notch 85 is provided at one end of the first side wall 82 away from the bottom of the groove. A boss 25 is provided in the notch 85. After the carrier 2 is connected to the metal housing 8, the bosses 25 in the long hole 83 and the boss 25 in the notch 85 respectively abut against both ends of the first side wall 82 along the first direction, thereby being able to limit the metal housing 8 from shaking relative to the carrier 2 along the first direction, improving the connection strength between the carrier 2 and the metal housing 8.

[0093] In the prior art, the metal housing 8 is often processed by a stretching forming process. Before forming, holes are provided at the corners of the receiving groove 81 of the metal housing 8 to facilitate forming and cooperation with plastic parts. During the stretching forming process, the holes are easily damaged or deformed, and the accuracy is poor. If the holes are deformed, it will affect the strength of the carrier 2, resulting in a phenomenon that the carrier 2 and the metal housing 8 are not properly fitted. During testing, it is easy to cause the carrier 2 to deform or break.

[0094] To solve the above problems, as Figures 17 to 19 shown, this embodiment also provides a forming process for manufacturing the carrier 2 and the metal housing 8 in the above camera module. The forming process includes the following steps:

[0095] S1. Make a metal plate with a preset shape, and the preset shape is the shape after the metal housing 8 is unfolded;

[0096] S2. Machine the strengthening holes 84 and the notch 85 at the preset positions on the metal plate;

[0097] S3. Bend the metal plate to form the metal housing 8, and form the long hole 83 of the formed metal housing 8;

[0098] S4. The metal housing 8 is subjected to insert injection molding in an injection mold to form the carrier 2, and bosses 25 of the carrier 2 are formed in both the reinforcing holes 84, the notches 85 and the long holes 83.

[0099] Among them, the metal housing 8 is drilled before molding and formed by a bending process. The metal housing 8 is formed by a bending process, which reduces the manufacturing difficulty of the metal housing 8 compared with the stretching process, improves the accuracy of the reinforcing holes 84, the notches 85 and the long holes 83, reduces the probability of product abnormalities. The carrier 2 is formed by insert injection molding on the metal housing 8, which increases the connection strength between the metal housing 8 and the carrier 2, prevents the metal housing 8 from falling off, and reduces the uncertainty in the production process. Moreover, a long hole 83 with a relatively large size and high precision can be formed at the connection part between the bottom of the accommodation groove 81 and the first side wall 82 of the accommodation groove 81.

[0100] Obviously, the above-mentioned embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. An imaging module, characterized in that Comprising: A base assembly; A housing, connected to the base assembly, a receiving cavity being formed between the housing and the base assembly, the housing being provided with a central opening; A lens assembly, fixed within the central opening of the housing; A carrier, slidably disposed within the receiving cavity in a first direction; An image sensor, fixed to a side of the carrier close to the base assembly, the lens assembly and the image sensor being coaxially arranged; A driving module, including a magnet assembly and a coil assembly, the magnet assembly being disposed on one side of the carrier; the coil assembly being fixedly disposed within the receiving cavity and oppositely arranged with respect to the magnet assembly; the coil assembly includes a circuit board, a coil support plate, and a coil arranged in sequence, the coil being fixed to the coil support plate, a first lead being led out from the inner side of the coil, and a second lead being led out from the outer side of the coil; a first receiving groove penetrating through the edge of the coil support plate is formed on a surface of the coil support plate facing the coil, and the first lead passes out from within the first receiving groove and is electrically connected to the circuit board.

2. The camera module according to claim 1, wherein The outer contour dimension of the coil support plate is larger than the outer contour dimension of the coil; the coil has a first central hole, and a second central hole is formed on the coil support plate, the dimension of the second central hole being smaller than the dimension of the first central hole.

3. The camera module according to claim 2, wherein The coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrosymmetric figure; a second receiving groove is further formed on a surface of the coil support plate facing the coil, and the first receiving groove and the second receiving groove are symmetrically arranged about the center of the coil support plate or arranged by rotating 180 degrees about the axis of the second central hole.

4. The camera module according to claim 3, characterized in that, The depth of the first receiving groove and the second receiving groove is 20% - 40% of the thickness of the coil support plate.

5. The camera module according to claim 3, wherein The width of the first receiving groove and the second receiving groove is 5 - 10 times the diameter of the first lead.

6. The imaging module according to claim 3, wherein The shapes of the first receiving groove and the second receiving groove are both arc-shaped, and the first receiving groove and the second receiving groove are disposed at diagonal positions of the coil support plate.

7. The camera module according to claim 6, wherein Both the first receiving groove and the second receiving groove include: a first extension section, a second extension section, and an arc-shaped connection section connecting between the first extension section and the second extension section, wherein the included angle between the first extension section and the second extension section is an obtuse angle, and the second extension section penetrates through the edge of the coil support plate.

8. The imaging module according to any one of claims 1 - 7, wherein The base assembly includes a base and a fixing member, the fixing member being disposed on the base and on one side of the base; A first sliding groove is formed on a side of the carrier close to the fixing member, a second sliding groove is formed on a side of the fixing member close to the carrier, and a guiding member is installed between the first sliding groove and the second sliding groove to enable the carrier to be slidably connected to the fixing member; and / or, A first mounting groove is provided on a side of the carrier close to the fixing member, and the magnet assembly is mounted in the first mounting groove; a second mounting groove is provided on a side of the fixing member close to the carrier, and the coil assembly is mounted in the second mounting groove; and / or, The carrier includes a moving through hole that longitudinally penetrates the carrier. The image sensor is located below the moving through hole, the lens assembly is located above the moving through hole, and an outer diameter of the lens assembly is smaller than a diameter of the moving through hole; and / or, The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or, The magnet assembly includes a shielding plate and at least one magnet, and each of the magnets is fixed on the shielding plate.

9. The camera module according to claim 8, wherein The base and the fixing member are of a split structure, and the fixing member is fixed on the base; A first limiting member is provided at a lower end of the first sliding groove, and a second limiting member is provided at an upper end of the second sliding groove for preventing the guiding member from sliding out between the first sliding groove and the second sliding groove.

10. The camera module according to claim 8, wherein The base includes a side frame extending around a periphery of the housing and a bottom frame having a mounting opening. A glue receiving groove is provided on the bottom frame; the base further includes a limiting block, the limiting block is connected to an inner side surface of the bottom frame and extends toward an interior of the mounting opening, and a bottom surface of the carrier contacts the limiting block.

11. The camera module according to claim 8, wherein, The driving module further includes a bottom plate and a driver circuit. The bottom plate is fixed on the base, the driver circuit is mounted on the bottom plate, and the driver circuit is electrically coupled to the image sensor and the coil assembly respectively.

Images