Camera module and forming process

Abstract

The invention relates to the technical field of camera devices, and discloses a camera module and a forming process. The camera module comprises a bearing part and a metal cover body, and the bearing part is used for bearing an image sensor; the metal cover body is provided with a containing groove, a long-strip-shaped hole is formed in the connecting position of the groove bottom of the containing groove and the first side wall of the containing groove, a plurality of reinforcing holes are formed in the side wall of the containing groove, the containing groove wraps the outer wall of the bearing part, a plurality of bosses are arranged on the outer wall of the bearing part, and the bosses are located in the long-strip-shaped hole and the reinforcing holes respectively. The heat dissipation performance of the bearing part is improved, the assembling strength of the bearing part and the metal cover body is improved, and the performance of the camera module is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of imaging devices, and particularly to an imaging module and a forming process. Background Art

[0002] In the era of the booming development of today's electronic products, as a key component for obtaining image information, the imaging module is widely used in various devices such as mobile phones, tablet computers, cameras, etc. The core part of the imaging module includes an image sensor, whose function is to convert the received light into an electrical signal, thereby generating an image.

[0003] A large amount of heat is generated during the operation of the image sensor. However, at present, most of the carriers that carry the image sensor in the imaging module are made of plastic. Although plastic has the advantages of low cost, light weight, easy processing and forming, etc., its heat dissipation performance is relatively poor. Due to the low heat dissipation of the plastic carrier, the heat generated by the image sensor cannot be dissipated in time and effectively, resulting in an increase in the temperature around the image sensor. Excessive temperature will not only affect the normal operation of the image sensor, reduce the image quality, such as the problems of increased noise and color distortion, but also may shorten the service life of the image sensor, and even damage the entire imaging module.

[0004] Based on this, there is an urgent need for an imaging module and a forming process to solve the above existing problems. Summary of the Invention

[0005] Based on the above, the purpose of the present invention is to provide an imaging module and a forming process, which improve the heat dissipation performance of the carrier, improve the assembly strength between the carrier and the metal cover, and improve the performance of the imaging module.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] On the one hand, an imaging module is provided, including:

[0008] A carrier for carrying an image sensor;

[0009] A metal cover, the metal cover is provided with a receiving groove, a long hole is provided at the connecting part of the bottom of the receiving groove and the first side wall of the receiving groove, a plurality of strengthening holes are provided on the side wall of the receiving groove, the receiving groove covers the outer wall of the carrier, and a plurality of convex platforms are provided on the outer wall of the carrier, and the plurality of convex platforms are respectively located in the long hole and the plurality of strengthening holes.

[0010] As a preferred technical solution of the imaging module, a notch is provided at one end of the first side wall away from the bottom of the groove, and the convex platform is provided in the notch.

[0011] As a preferred technical solution of a camera module, the camera module further includes:

[0012] A base assembly;

[0013] A housing, connected to the base assembly, an accommodation cavity is formed between the housing and the base assembly, the carrier is slidably disposed in the accommodation cavity along a first direction, and the housing is provided with a central opening;

[0014] A lens assembly, fixed in the central opening of the housing;

[0015] An image sensor, fixed to one side of the carrier close to the base assembly, and the lens assembly and the image sensor are coaxially arranged;

[0016] A driving module, drivingly connected to the carrier, and the driving module is used to drive the carrier to move along the first direction.

[0017] As a preferred technical solution of a camera module, the driving module includes a magnet assembly and a coil assembly, the magnet assembly is disposed on one side of the carrier; the coil assembly is fixedly disposed in the accommodation cavity and is disposed opposite to the magnet assembly; the coil assembly includes a circuit board, a coil support plate and a coil arranged in sequence, the coil is fixed on the coil support plate, a first lead is led out from the inner side of the coil, and a second lead is led out from the outer side; a first accommodation groove penetrating through the edge of the coil support plate is formed on the surface of the coil support plate facing the coil, and the first lead passes through the first accommodation groove and is electrically connected to the circuit board.

[0018] As a preferred technical solution of a camera module, the outer contour dimension of the coil support plate is larger than the outer contour dimension of the coil; the coil has a first central hole, and a second central hole is formed on the coil support plate, and the size of the second central hole is smaller than the size of the first central hole.

[0019] As a preferred technical solution of a camera module, the coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrosymmetric figure; a second accommodation groove is further formed on the surface of the coil support plate facing the coil, and the first accommodation groove and the second accommodation groove are symmetrically arranged about the center of the coil support plate or are arranged by rotating 180 degrees about the axis of the second central hole.

[0020] As a preferred technical solution of a camera module, the shapes of the first accommodation groove and the second accommodation groove are both arc-shaped, and the first accommodation groove and the second accommodation groove are disposed at diagonal positions of the coil support plate.

[0021] As a preferred technical solution of a camera module, both the first accommodating groove and the second accommodating groove include: a first extending section, a second extending section, and an arc connecting section connecting between the first extending section and the second extending section, wherein the included angle between the first extending section and the second extending section is an obtuse angle, and the second extending section penetrates through the edge of the coil support plate.

[0022] As a preferred technical solution of a camera module, the base assembly includes a base and a fixing member, and the fixing member is disposed on the base and on one side of the base;

[0023] A first sliding groove is disposed on one side of the carrier member close to the fixing member, a second sliding groove is disposed on one side of the fixing member close to the carrier member, and a guiding member is installed between the first sliding groove and the second sliding groove to slidably connect the carrier member and the fixing member; and / or,

[0024] A first installation groove is disposed on one side of the carrier member close to the fixing member, and the magnet assembly is installed in the first installation groove; a second installation groove is disposed on one side of the fixing member close to the carrier member, and the coil assembly is installed in the second installation groove; and / or,

[0025] The carrier member includes a moving through hole that longitudinally penetrates the carrier member, the image sensor is located below the moving through hole, the lens assembly is located above the moving through hole, and the outer diameter of the lens assembly is smaller than the aperture of the moving through hole; and / or,

[0026] The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or,

[0027] The magnet assembly includes a shielding plate and at least one magnet, and each magnet is fixed on the shielding plate.

[0028] As a preferred technical solution of a camera module, the base and the fixing member are of a split structure, and the fixing member is fixed on the base;

[0029] A first limiting member is disposed at the lower end of the first sliding groove, and a second limiting member is disposed at the upper end of the second sliding groove for preventing the guiding member from sliding out between the first sliding groove and the second sliding groove.

[0030] On the other hand, a molding process is provided for manufacturing the carrier member and the metal cover body in any one of the above-mentioned camera modules, and the molding process includes the following steps:

[0031] S1. Making a metal plate with a preset shape, and the preset shape is the shape after the metal cover body is unfolded;

[0032] S2. Process strengthening holes and notches at preset positions on the metal plate;

[0033] S3. Bend the metal plate to form the metal cover body and the long holes of the metal cover body;

[0034] S4. Carry out insert injection molding on the metal cover body in an injection mold to form the carrier. Protrusions of the carrier are formed in the strengthening holes, the notches and the long holes.

[0035] The beneficial effects of the present invention are as follows:

[0036] The present invention provides a camera module and a forming process. By using the accommodation groove of the metal cover body to cover the carrier, when the image sensor generates heat, the heat of the image sensor can be dissipated through the carrier and the metal cover body. The metal cover body improves the heat dissipation performance of the carrier, and the heat generated by the image sensor can be effectively dissipated, improving the performance of the camera module. Moreover, the protrusions on the outer wall of the carrier are respectively located in the long holes and the strengthening holes, improving the assembly strength between the carrier and the metal cover body. When the camera module is in use or undergoes a drop test, it prevents the carrier from separating from the metal cover body, further improving the performance of the camera module. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments of the present invention. Obviously, the following-described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to the content of the embodiments of the present invention and these drawings.

[0038] Figure 1 is a schematic structural diagram of the camera module provided in Embodiment 1 of the present invention;

[0039] Figure 2 is an exploded view of the camera module provided in Embodiment 1 of the present invention;

[0040] Figure 3 is a schematic structural diagram of the camera module removing the housing and the lens assembly provided in Embodiment 1 of the present invention;

[0041] Figure 4 is an exploded view of the carrier and the magnet assembly provided in Embodiment 1 of the present invention;

[0042] Figure 5 is an exploded view of the fixing member, the coil assembly and the guiding member provided in Embodiment 1 of the present invention;

[0043] Figure 6It is a schematic diagram of the first angle of the coil and the coil support plate provided in the first embodiment of the present invention;

[0044] Figure 7 It is a schematic diagram of the second angle of the coil and the coil support plate provided in the first embodiment of the present invention;

[0045] Figure 8 It is a schematic diagram of the coil provided in the first embodiment of the present invention;

[0046] Figure 9 It is a schematic diagram of the coil support plate provided in the first embodiment of the present invention;

[0047] Figure 10 It is a schematic diagram of the base provided in the first embodiment of the present invention;

[0048] Figure 11 It is a schematic diagram of the assembly structure of the carrier and the metal cover provided in the first embodiment of the present invention;

[0049] Figure 12 It is an exploded view of the structure of the carrier and the metal cover provided in the first embodiment of the present invention;

[0050] Figure 13 It is a schematic diagram of the process flow of the forming process provided in the first embodiment of the present invention;

[0051] Figure 14 It is a schematic diagram of the metal plate with a preset shape provided in the first embodiment of the present invention;

[0052] Figure 15 It is a schematic diagram of the bending and forming of the metal plate provided in the first embodiment of the present invention;

[0053] Figure 16 It is an exploded view of the camera module provided in the second embodiment of the present invention;

[0054] Figure 17 It is a schematic diagram of the first angle of the base assembly provided in the second embodiment of the present invention;

[0055] Figure 18 It is a schematic diagram of the second angle of the base assembly provided in the second embodiment of the present invention;

[0056] Figure 19 It is a schematic diagram of the carrier provided in the second embodiment of the present invention.

[0057] In the figure:

[0058] 1. Base assembly; 11. Base; 111. Side frame; 112. Bottom frame; 1121. Installation opening; 1122. Glue-bearing groove; 113. Limit block; 12. Fixing member; 121. Second chute; 1211. Second limiting member; 1212. Fourth limiting member; 122. Second installation groove; 123. Dent structure; 13. Image sensor; 14. Driver circuit; 15. Bottom plate; 2. Carrier; 21. First chute; 211. First limiting member; 212. Third limiting member; 22. First installation groove; 23. Moving through hole; 24. Anti-collision block; 25. Boss; 3. Magnet assembly; 31. Shielding plate; 32. Magnet; 4. Coil assembly; 41. Circuit board; 42. Coil support plate; 421. First accommodation groove; 4211. First extension section; 4212. Second extension section; 4213. Arc connection section; 422. Second accommodation groove; 423. Second central hole; 43. Coil; 431. First lead wire; 432. Second lead wire; 433. First central hole; 44. Magnetic sensor; 5. Housing; 51. Central opening; 6. Guide; 7. Lens assembly; 8. Metal cover; 81. Accommodation groove; 82. First side wall; 83. Long hole; 84. Reinforcing hole; 85. Notch. Detailed implementation manner

[0059] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that, for the sake of description, only parts related to the present invention are shown in the drawings, rather than all structures.

[0060] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0061] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0062] In the description of this embodiment, the orientation or positional relationship terms such as "upper", "lower", "left" and "right" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0063] An embodiment of the present invention provides an imaging module, which can be applied to the camera of an electronic product, and realizes the automatic focusing or optical image stabilization function of the lens through the driving form of a voice coil motor.

[0064] Embodiment 1

[0065] As Figures 1 to 10As shown in the figure, this embodiment provides an imaging module, which includes a base assembly 1, a carrier 2, a housing 5, a lens assembly 7, an image sensor 13, and a driving module. The base assembly 1 includes a base 11 and a fixing member 12. The fixing member 12 is disposed on the base 11 and is located on one side of the base 11. Preferably, the fixing member 12 is perpendicular to the base 11. The housing 5 is connected to the base 11, and an accommodation cavity is formed between the housing 5 and the base assembly 1. The housing 5 is provided with a central opening 51, and the size of the central opening 51 is adapted to the size of the lens assembly 7. The lens assembly 7 is fixed in the central opening 51. The carrier 2 is slidably disposed in the accommodation cavity along a first direction. The first direction is specifically the optical axis direction of the lens assembly 7. The image sensor 13 is located in the accommodation cavity and is fixed to one side of the carrier 2 close to the base 11. The lens assembly 7 and the image sensor 13 are coaxially disposed. The carrier 2 can drive the image sensor 13 to move along the optical axis direction in the accommodation cavity, changing the distance between the image sensor 13 and the lens assembly 7, thereby adjusting the focus of the lens. The image sensor 13 can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) sensor, and the image projected on the image sensor 13 can be captured, stored, and / or presented to the user. Further, the carrier 2 has an annular structure, and a moving through hole 23 is provided at the center thereof. The moving through hole 23 longitudinally penetrates the carrier 2. The image sensor 13 is located below the moving through hole 23, and the lens assembly 7 is located above the moving through hole 23. This allows light to pass through the lens assembly 7 and then through the moving through hole 23 to reach the image sensor 13 to obtain an image. Moreover, the outer diameter of the lens assembly 7 is smaller than the aperture of the moving through hole 23, which allows the lens assembly 7 to smoothly pass through the moving through hole 23 when the carrier 2 drives the image sensor 13 to move. The driving module is drivingly connected to the carrier 2, and the driving module is used to drive the carrier 2 to move along the first direction, realizing automatic focusing of the lens.

[0066] Further, in this embodiment, by directly fixing the lens assembly 7 in the central opening 51 of the housing 5, light can directly pass through the lens assembly 7 to reach the image sensor 13, which can ensure that the normal passage of light will not be blocked under any circumstances. In this embodiment, by first fixing the housing 5 and the lens assembly 7, during assembly, it only needs to ensure that the image sensor 13 and the lens assembly 7 are coaxial in the optical axis, and the assembly accuracy can be ensured, which is more conducive to the optimization of the assembly process. The lens assembly 7 may specifically include one or more lenses, which can focus light on the image sensor 13 under their mutual interaction.

[0067] In this embodiment, the driving module uses a voice coil motor to drive the image sensor 13. The voice coil motor specifically includes a magnet assembly 3 and a coil assembly 4. The magnet assembly 3 is disposed on one side of the carrier 2 close to the fixing member 12, and the coil assembly 4 is disposed on one side of the fixing member 12 close to the carrier 2, and the coil assembly 4 is disposed opposite to the magnet assembly 3. Due to the close proximity between the magnet assembly 3 and the coil assembly 4, the coil assembly 4 can be excited by an electric current to generate a magnetic field that interacts with the magnetic field of the magnet assembly 3. The attractive or repulsive force between the magnetic fields drives the carrier 2 and the image sensor 13 to move upward or downward along the optical axis in the accommodating cavity, so as to adjust the distance between the image sensor 13 and the lens assembly 7 and realize the function of autofocus.

[0068] The driving module of this embodiment further includes a bottom plate 15 and a driver circuit 14. The bottom plate 15 is fixed below the base 11, and the driver circuit 14 is mounted on the bottom plate 15. The driver circuit 14 is electrically coupled to the image sensor 13 and the coil assembly 4 respectively. The driver circuit 14, such as a driver IC, delivers power to the coil assembly 4 to excite the coil assembly 4 and generate a second magnetic field that interacts with the magnetic field of the magnet assembly 3. The driver IC can excite the coil assembly 4 in response to a control signal provided to the driver IC from an external controller such as a microprocessor or other data processing device. In some embodiments, the driver IC can adjust the magnetic field emitted from the coil assembly 4 to drive the carrier 2 to move upward or downward to an accurate position, for example, by reversing the direction of the current delivered to the coil assembly 4 (thus reversing the polarity of the magnetic field generated from the coil assembly 4) and adjusting the effective strength of the magnetic field (e.g., using pulse width modulation) to adjust the amount of attractive or repulsive force between the magnet assembly 3 and the coil assembly 4, so that the magnet assembly 3 drives the image sensor 13 to move up and down through the carrier 2. The image sensor 13 can feedback the detected image information to the control module of the imaging device through the driver circuit 14. Further, the driver circuit 14 also has an elastic function, which can help the image sensor 13 to reset after moving, and at the same time make the image sensor 13 more stable when moving up and down.

[0069] Optionally, a first sliding groove 21 is provided on one side of the carrier 2 opposite to the fixing member 12, and a second sliding groove 121 is provided on one side of the fixing member 12 opposite to the carrier 2. Both the first sliding groove 21 and the second sliding groove 121 extend along the optical axis direction of the lens assembly 7. A guiding member 6 is installed between the first sliding groove 21 and the second sliding groove 121, so that the carrier 2 can slide relative to the fixing member 12. With such a setting, the smoothness and running accuracy of the carrier 2 moving along the optical axis direction are increased, and the frictional resistance is reduced. Specifically, the guiding member 6 can be a number of ball bearings, or can be a guiding column extending along the optical axis direction, both of which can play a good guiding role. Preferably, the guiding member 6 of this embodiment uses ball bearings for guiding.

[0070] In this embodiment, the base 11 and the fixing member 12 are of a split structure, and the fixing member 12 is fixed on the base 11. For example, it can be fixed by means of adhesion, screwing, clamping, etc. The base assembly 1 of this embodiment adopts a split structure, which is convenient for the separate processing of the base 11 and the fixing member 12. For this split structure, preferably in this embodiment, a first limiting member 211 is provided at the lower end of the first sliding groove 21, and a second limiting member 1211 is provided at the upper end of the second sliding groove 121, which is used to prevent the guiding member 6 from sliding out between the first sliding groove 21 and the second sliding groove 121, and limit the stroke of the bearing member 2 moving along the optical axis direction. Of course, in other embodiments, the first limiting member 211 can also be provided at the upper end of the first sliding groove 21, and the second limiting member 1211 can also be provided at the lower end of the second sliding groove 121, which can also play a limiting role.

[0071] Furthermore, a first installation groove 22 is provided on the side of the bearing member 2 facing the fixing member 12, and the magnet assembly 3 is installed in the first installation groove 22. Optionally, the magnet assembly 3 includes a shielding plate 31 and at least one magnet 32. In this embodiment, the shielding plate 31 is a magnetic plate, and the magnetic plate is made of a high-permeability material. A plurality of magnets 32 are fixed on the shielding plate 31 by means of adhesion, etc. After the plurality of magnets 32 are combined, a magnet surface facing the coil assembly 4 is formed. A second installation groove 122 is provided on the side of the fixing member 12 facing the bearing member 2, and the coil assembly 4 is installed in the second installation groove 122, and the coil assembly 4 and the magnet assembly 3 are arranged opposite to each other.

[0072] The coil assembly 4 of this embodiment includes a circuit board 41, a coil support plate 42, a coil 43 and a magnetic sensor 44. The circuit board 41, the coil support plate 42 and the coil 43 are sequentially installed in the second installation groove 122 of the fixing member 12 from far away from the magnet assembly 3 to close to the magnet assembly 3; the coil 43 is fixed (such as by adhesion) on the coil support plate 42 and is electrically connected to the circuit board 41, and the circuit board 41 provides a control signal and a driving current, etc. for the coil 43; the magnetic sensor 44 is located in the middle of the coil 43 and is electrically connected to the circuit board 41, and is used to sense the intensity of the magnetic field. The circuit board 41 of this embodiment can be a flexible circuit board, a rigid circuit board or a flexible-rigid combined circuit board; when the circuit board 41 is a flexible circuit board, a reinforcing plate can also be provided to increase the strength of the flexible circuit board.

[0073] The coil 43 is usually wound with copper-clad wire. After winding, a first lead wire 431 is led out from the inner side thereof, and a second lead wire 432 is led out from the outer side. Both the first lead wire 431 and the second lead wire 432 are electrically connected to the circuit board 41. When assembling the coil assembly 4, the first lead wire 431 located inside the coil 43 needs to penetrate laterally outwards, so that the first lead wire 431 is clamped between the end face of the coil 43 and the coil support plate 42. This will cause interference between the first lead wire 431 and the coil support plate 42, resulting in excessive extrusion of the first lead wire 431 and even breaking the first lead wire 431, thus affecting the normal use of the camera module.

[0074] To solve the above problems, in this embodiment, a first accommodation groove 421 penetrating the edge of the coil support plate 42 is formed on the surface of the coil support plate 42 facing the coil 43, so as to accommodate the first lead wire 431 extending laterally outwards from the inner side of the coil 43. After the first lead wire 431 passes through the first accommodation groove 421, it is electrically connected to the circuit board 41. In this way, interference between the first lead wire 431 and the coil support plate 42 is avoided, and the risk of the first lead wire 431 being extruded or even broken is greatly reduced, ensuring the reliability of the camera module in use.

[0075] The housing 5 of this embodiment is a housing structure with an opening on the lower side. The housing 5 is buckled on the base 11, and the carrier 2, the fixing member 12, the image sensor 13, the magnet assembly 3 and the coil assembly 4 are all housed in the accommodation cavity. In this way, the housing 5 can provide good protection for the internal components. Preferably, the material of the housing 5 is metal, and the shape of the housing 5 is a quadrilateral housing with an open lower end, which can be specifically manufactured by processes such as punching and bending of metal materials. The metal housing 5 can protect the camera module from electromagnetic interference (EMI) that may occur in the environment.

[0076] In this embodiment, the coil support plate 42 is made of a soft magnetic metal material, which has the characteristics of low coercivity and high magnetic permeability, and is easy to magnetize and demagnetize. Specifically, the coil support plate 42 can be made of iron-silicon alloy, soft ferrite, etc. When the magnet assembly 3, the carrier 2, and the image sensor 13 move along the optical axis direction and leave the initial position, there is a certain restoring force between the magnet assembly 3 and the coil support plate 42, which can make the magnet assembly 3, the carrier 2, and the image sensor 13 return to the initial position. To ensure the accuracy of the reset of the magnet assembly 3, the carrier 2, and the image sensor 13, in this embodiment, the shape of the coil support plate 42 is preferably a centrosymmetric figure, so that the magnetic force acting on the magnet assembly 3 is symmetric. Exemplarily, the coil support plate 42 can be circular, elliptical, rectangular, etc. Further, a second accommodation groove 422 is formed on one side of the coil support plate 42 facing the coil 43. The structure of the second accommodation groove 422 is the same as that of the first accommodation groove 421, and the second accommodation groove 422 and the first accommodation groove 421 are symmetrically arranged about the center of the coil support plate 42. In this way, the weight balance of the coil support plate 42 is further ensured, the magnetic force acting on the magnet assembly 3 is symmetric, and the smoothness and accuracy of the movement of the magnet assembly 3, the carrier 2, and the image sensor 13 are increased; at the same time, the setting of the second accommodation groove 422 is also beneficial to reducing the product weight.

[0077] In this embodiment, the outer contour shape of the coil support plate 42 is the same as that of the coil 43, and the outer contour size of the coil support plate 42 is larger than that of the coil 43; a first central hole 433 is formed by winding the coil 43, and a second central hole 423 is formed on the coil support plate 42. The size of the second central hole 423 is smaller than that of the first central hole 433. With such a setting, the coil 43 can be completely accommodated on the coil support plate 42, with a compact structure and reliable use.

[0078] The thickness of the coil support plate 42 affects the magnitude of the Lorentz force on the magnet assembly 3. Specifically, the greater the thickness of the coil support plate 42, the greater the Lorentz force on the magnet assembly 3. To ensure sufficient driving force is provided to the magnet assembly 3, therefore, when manufacturing the first receiving groove 421 and the second receiving groove 422, not too much of the thickness of the coil support plate 42 should be removed. In this embodiment, the depths of the first receiving groove 421 and the second receiving groove 422 are 20% - 40% of the thickness of the coil support plate 42. In this way, while providing an appropriate receiving space for the first guiding wire 431, the loss of magnetic force can be minimized as much as possible. Preferably, the first receiving groove 421 and the second receiving groove 422 in this embodiment are manufactured by stamping. For ease of processing, the depths of the first receiving groove 421 and the second receiving groove 422 in this embodiment are set to 30% of the thickness of the coil support plate 42, that is, 30% of the thickness of the coil support plate 42 is removed. It should be noted that when the thickness of the coil support plate 42 itself is relatively thick, the depths of the first receiving groove 421 and the second receiving groove 422 can be greater than or equal to the diameter of the first guiding wire 431, so that the first guiding wire 431 can be completely buried in the first receiving groove 421; while when the thickness of the coil support plate 42 itself is not large, the depths of the first receiving groove 421 and the second receiving groove 422 can be slightly less than the diameter of the first guiding wire 431. At this time, the first guiding wire 431 is partially received in the first receiving groove 421, which can also play a role in reducing the interference and extrusion between the first guiding wire 431 and the coil support plate 42.

[0079] Furthermore, since the first guiding wire 431 may move during the use and testing of the camera module, if the width of the first receiving groove 421 is set to be the same as the diameter of the first guiding wire 431, interference is likely to occur between the two. Therefore, in this embodiment, the width of the first receiving groove 421 is greater than the diameter of the first guiding wire 431. Preferably, the width of the first receiving groove 421 is 5 - 10 times the diameter of the first guiding wire 431 to provide sufficient movement space for the first guiding wire 431. To ensure structural symmetry, the width of the second receiving groove 422 is also 5 - 10 times the diameter of the first guiding wire 431, and the width of the second receiving groove 422 is the same as the width of the first receiving groove 421.

[0080] To better adapt to the actual routing of the first guiding wire 431, in this embodiment, the shape of the first accommodating groove 421 is preferably arc-shaped. Specifically, the first accommodating groove 421 includes: a first extension section 4211, a second extension section 4212, and an arc-shaped connecting section 4213 connecting between the first extension section 4211 and the second extension section 4212. The included angle between the first extension section 4211 and the second extension section 4212 is an obtuse angle, and the second extension section 4212 penetrates through the edge of the coil support plate 42. The shape of the second accommodating groove 422 is the same as that of the first accommodating groove 421, which will not be elaborated in this embodiment. Further, the first accommodating groove 421 and the second accommodating groove 422 are arranged at diagonal positions of the coil support plate 42. Such an arrangement facilitates connecting the first guiding wire 431 to the circuit board 41 after leading it out along the first accommodating groove 421 and is also convenient for the processing of the grooves. Of course, in other embodiments, the shape of the first accommodating groove 421 can also be linear, polyline-shaped, etc., and is not limited to this embodiment.

[0081] In this embodiment, a plurality of anti-collision blocks 24 are further provided on the top and / or side of the carrier 2. When the camera module is subjected to external impacts or severe vibrations, the anti-collision blocks 24 can play a role in shock absorption and buffering; at the same time, the anti-collision blocks 24 can limit and buffer the movement of the carrier 2, reduce the impact force between the carrier 2 and the housing 5 during the movement of the carrier 2, and improve the shock absorption and noise reduction performance of the camera module. Preferably, the anti-collision blocks 24 are made of elastic materials such as silica gel, rubber, or resin, so as to better absorb the impact force generated by the vibration and protect the camera module from the influence of vibration.

[0082] In the prior art, a large amount of heat is generated during the operation of the image sensor 13. However, currently, most of the carriers 2 carrying the image sensor 13 in the camera module are made of plastic materials. Although plastic has the advantages of low cost, light weight, and easy processing and molding, its heat dissipation performance is relatively poor. Due to the low heat dissipation of the plastic carrier 2, the heat generated by the image sensor 13 cannot be dissipated in a timely and effective manner, resulting in an increase in the temperature around the image sensor 13. Excessive temperature will not only affect the normal operation of the image sensor 13 and reduce the image quality, such as an increase in noise and color distortion, but may also shorten the service life of the image sensor 13 and even damage the entire camera module.

[0083] To solve the above problems, as Figure 11 and Figure 12As shown in the figure, in this embodiment, the camera module further includes a metal housing 8, and the carrier 2 is used to carry the image sensor 13; the metal housing 8 is provided with a receiving groove 81, and a long hole 83 is provided at the connection part between the bottom of the receiving groove 81 and the first side wall 82 of the receiving groove 81, and a plurality of reinforcing holes 84 are provided on the side wall of the receiving groove 81. The receiving groove 81 of the metal housing 8 covers the outer wall of the carrier 2, and a plurality of protrusions 25 are provided on the outer wall of the carrier 2, and the plurality of protrusions 25 are respectively located in the long hole 83 and the plurality of reinforcing holes 84. By using the receiving groove 81 of the metal housing 8 to cover the carrier 2, when the image sensor 13 generates heat, the heat of the image sensor 13 can be dissipated through the carrier 2 and the metal housing 8. The metal housing 8 improves the heat dissipation performance of the carrier 2, and the heat generated by the image sensor 13 can be effectively dissipated, improving the performance of the camera module. Furthermore, the protrusions 25 on the outer wall of the carrier 2 are respectively located in the long hole 83 and the reinforcing holes 84, which improves the assembly strength between the carrier 2 and the metal housing 8. When the camera module is in use or during a drop test, it prevents the carrier 2 from separating from the metal housing 8 and improves the reliability of the camera module.

[0084] Preferably, a notch 85 is provided at one end of the first side wall 82 facing away from the bottom of the groove, and a protrusion 25 is provided in the notch 85. After the carrier 2 is connected to the metal housing 8, the protrusions 25 in the long hole 83 and the protrusions 25 in the notch 85 respectively abut against both ends of the first side wall 82 along the first direction, thereby being able to limit the metal housing 8 from shaking relative to the carrier 2 along the first direction and improving the connection strength between the carrier 2 and the metal housing 8.

[0085] In the prior art, the metal housing 8 is often processed by a stretching forming process. Before forming, holes are provided at the corners of the receiving groove 81 of the metal housing 8 to facilitate forming and cooperation with plastic parts. During the stretching forming process, the holes are easily damaged or deformed, and the accuracy is poor. If the holes are deformed, it will affect the strength of the carrier 2, resulting in a phenomenon where the carrier 2 and the metal housing 8 are not properly fitted. During testing, it is easy to cause the carrier 2 to deform or break.

[0086] To solve the above problems, as Figures 13 to 15 shown, this embodiment also provides a forming process for manufacturing the carrier 2 and the metal housing 8 in the above camera module. The forming process includes the following steps:

[0087] S1. Make a metal plate with a preset shape, and the preset shape is the shape after the metal housing 8 is unfolded;

[0088] S2. Machine the reinforcing holes 84 and the notches 85 at the preset positions on the metal plate;

[0089] S3. Bend the metal plate to form the metal housing 8, and form the long hole 83 of the formed metal housing 8;

[0090] S4. The metal cover body 8 is insert-molded in the injection mold to form the carrier 2. The bosses 25 of the carrier 2 are formed in the reinforcement holes 84, the notches 85 and the elongated holes 83.

[0091] Among them, the metal cover 8 is punched before forming and formed by a bending process. The metal cover 8 is formed by a bending process. Compared with the stretching process, the difficulty of manufacturing the metal cover 8 is reduced, the precision of the reinforcement hole 84, the notch 85 and the long hole 83 is improved, and the probability of product abnormality is reduced. The carrier 2 is molded by insert injection molding on the metal cover 8 to increase the connection strength between the metal cover 8 and the carrier 2, prevent the metal cover 8 from falling off, and reduce the uncertainty in the production process. Moreover, it is also possible to form a long hole 83 with a larger size and higher precision at the connection part between the bottom of the receiving groove 81 and the first side wall 82 of the receiving groove 81.

[0092] Furthermore, if Figures 1 - 10 As shown, the base 11 of this embodiment includes a bottom frame 112 and a side frame 111 arranged on the bottom frame 112. The bottom surface of the housing 5 can be connected to the bottom frame 112 by adhesive, and the side frame 111 surrounds the outer periphery of the housing 5. The connection method between the housing 5 and the base 11 makes the connection more firm; at the same time, the base 11 can provide a more accurate installation position for the housing 5, so that the lens assembly 7 on the housing 5 can quickly achieve optical axis coaxiality with the image sensor 13. The middle position of the bottom frame 112 has an installation opening 1121, and the size of the installation opening 1121 is smaller than the inner size of the side frame 111, so that a certain width of the bottom frame 112 can be exposed to receive the housing 5, reducing the manufacturing difficulty and increasing the product stability; and the installation opening 1121 can enable the coil assembly 4 to be electrically connected to the driver circuit 14.

[0093] The bottom frame 112 is also provided with a glue receiving groove 1122, which is formed by the upper surface of the bottom frame 112 being recessed downwards, and is used to store a small amount of glue when bonding the outer shell 5 to the base 11, so as to avoid glue overflow, reduce the probability of product abnormality, and ensure product functional characteristics.

[0094] The base 11 further includes a stopper 113, one end of which is connected to the inner side of the bottom frame 112, and the other end of which extends toward the inside of the installation opening 1121. The stopper 113 is used to receive the carrier 2 to prevent the carrier 2 from moving out of the accommodating cavity. The stopper 113 can limit the downward movement of the carrier 2. When the carrier 2 moves to the lowest position, the bottom surface of the carrier 2 abuts against the upper surface of the stopper 113.

[0095] Optionally, the upper surface of the limit block 113 is higher than the upper surface of the bottom frame 112. Since the area of the limit block 113 is small, it is easy to control its flatness. Thus, when the carrier 2 contacts the limit block 113, the image sensor 13 can still maintain optical axis coaxiality with the lens assembly 7. Moreover, the above arrangement can also prevent the glue from being squeezed onto the upper surface of the limit block 113 when the housing 5 is bonded to the base 11, which may affect the movement of the carrier 2.

[0096] Embodiment 2

[0097] As Figures 16 to 19 shown, this embodiment provides another camera module, whose structure is basically the same as that in Embodiment 1, and also includes a base assembly 1, a carrier 2, a magnet assembly 3, a coil assembly 4, a housing 5, a guiding member 6, a lens assembly 7, an image sensor 13, a driver circuit 14, a bottom plate 15, a first mounting groove 22, a moving through hole 23, a shock-absorbing block 24, a central opening 51, a second mounting groove 122, etc. The following content of this embodiment only describes the differences from Embodiment 1, and the parts identical to those in Embodiment 1 will not be elaborated again.

[0098] In this embodiment, the base assembly 1 includes a base 11 and a fixing member 12. The base 11 is used to contact the carrier 2, and the fixing member 12 is used to carry the coil assembly 4. The fixing member 12 of this embodiment is integrally provided on the base 11 and located on one side of the base 11, that is, the base assembly 1 is an integral structure and is made by an integral molding process. Further, the fixing member 12 is perpendicular to the base 11. The base assembly 1 of this embodiment adopts an integral structure, which not only improves the structural strength, reduces the number of components, and is beneficial to cost saving, but also eliminates the assembly steps between the base 11 and the fixing member 12, reduces the assembly difficulty, reduces the assembly error, improves the positioning accuracy between the carrier 2 and the housing 5, and avoids the uncertainty during the assembly process. In addition, it also ensures the perpendicularity between the fixing member 12 and the base 11, avoiding the situation where the perpendicularity of the assembly of the fixing member 12 and the base 11 is relatively unstable when using a split structure, and increasing the product robustness.

[0099] Furthermore, in this embodiment, a first sliding groove 21 is provided on the side of the carrier 2 close to the fixing member 12, and a second sliding groove 121 is provided on the side of the fixing member 12 close to the carrier 2. A guiding member 6 is installed between the first sliding groove 21 and the second sliding groove 121 to realize the sliding connection between the carrier 2 and the fixing member 12. Since the base assembly 1 of this embodiment is an integral structure, the carrier 2 needs to be assembled to the base assembly 1 from above. If a limiting member is provided at the upper end of the second sliding groove 121 of the fixing member 12, it will interfere with the assembly of the carrier 2 and affect the assembly of the carrier 2. For this reason, in this embodiment, a third limiting member 212 is provided at the upper end of the first sliding groove 21 of the carrier 2, and a fourth limiting member 1212 is provided at the lower end of the second sliding groove 121, so as to prevent the guiding member 6 from sliding out between the first sliding groove 21 and the second sliding groove 121. Such a setting avoids interfering with the assembly of the carrier 2, facilitates the smooth installation of the carrier 2, reduces the assembly difficulty, and increases the product robustness.

[0100] Preferably, the housing 5 and the fixing member 12 of this embodiment are fixed by bonding, and its assembly is simple and the connection is reliable. In the prior art, the surface of the fixing member 12 is usually smooth, which causes the glue to be difficult to adhere to the surface of the fixing member 12, thus affecting the bonding effect between the housing 5 and the fixing member 12. To solve the above problems, in this embodiment, a dent structure 123 is provided on the surface (i.e., the outer side) of the fixing member 12 away from the carrier 2. In this way, when the adhesive is applied to the outer side of the fixing member 12, the adhesive can remain and adhere to the dent structure 123, so as to realize the reliable bonding between the outer side of the fixing member 12 and the inner side wall of the housing 5.

[0101] Specifically, the above-mentioned dent structure 123 includes a plurality of long strip-shaped grooves, and each groove extends along the horizontal direction, which enables the adhesive to better adhere to the outer side of the fixing member 12. Further, the above-mentioned plurality of grooves are uniformly arranged in an array form on the outer side of the fixing member 12 to increase the balance of the bonding to the housing 5. In this embodiment, the adhesive is preferably glue.

[0102] In addition, the base 11 of this embodiment includes a side frame 111 extending around the periphery of the housing 5 and a bottom frame 112 having an installation opening 1121, wherein the fixing member 12 is integrally provided in the bottom frame 112; the base 11 further includes a limiting block 113, and the limiting block 113 is connected to the inner side surface of the bottom frame 112 and extends towards the inside of the installation opening 1121, and the bottom surface of the carrier 2 contacts the limiting block 113.

[0103] Further, in this embodiment, three limiting blocks 113 are provided on the inner side of the bottom frame 112, one of the limiting blocks 113 is located on the side opposite to the fixing member 12; the other two limiting blocks 113 are symmetrically arranged on the two inner sides of the bottom frame 112, and these two limiting blocks 113 extend to be connected to the two side parts of the fixing member 12 in a one-to-one correspondence. The arrangement of the above three limiting blocks 113 can improve the balance of the impact force of the limiting blocks 113 by the bearing member 2 and increase the support stability for the bearing member 2; and the two limiting blocks 113 located on both sides are respectively connected to the fixing member 12, which can increase the structural strength of the limiting blocks 113, and the lengths of the limiting blocks 113 on both sides are also extended to a certain extent, thereby increasing the area of the limiting blocks 113, further improving the structural stability and bending resistance of the limiting blocks 113, and preventing the limiting blocks 113 from being bent or broken due to the impact of the bearing member 2.

[0104] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An imaging module, characterized in that, Comprising: A carrier for carrying an image sensor; A metal cover body, the metal cover body is provided with a receiving groove, a long hole is provided at the connecting part of the bottom of the receiving groove and the first side wall of the receiving groove, a plurality of strengthening holes are provided on the side wall of the receiving groove, the receiving groove covers the outer wall of the carrier, and a plurality of bosses are provided on the outer wall of the carrier, and the plurality of bosses are respectively located in the long hole and the plurality of strengthening holes.

2. The camera module according to claim 1, wherein A notch is provided at one end of the first side wall away from the bottom of the groove, and the boss is provided in the notch.

3. The camera module according to claim 1, wherein The camera module further comprises: A base assembly; A housing connected to the base assembly, a receiving cavity is formed between the housing and the base assembly, the carrier is slidably arranged in the receiving cavity along a first direction, and the housing is provided with a central opening; A lens assembly fixed in the central opening of the housing; An image sensor fixed on one side of the carrier close to the base assembly, and the lens assembly is coaxially arranged with the image sensor; A driving module drivingly connected to the carrier, the driving module is used to drive the carrier to move along the first direction.

4. The camera module according to claim 3, characterized in that, The driving module includes a magnet assembly and a coil assembly, the magnet assembly is arranged on one side of the carrier; the coil assembly is fixedly arranged in the receiving cavity and is arranged opposite to the magnet assembly; the coil assembly includes a circuit board, a coil support plate and a coil arranged in sequence, the coil is fixed on the coil support plate, a first lead is led out from the inner side of the coil, and a second lead is led out from the outer side; a first receiving groove penetrating through the edge of the coil support plate is formed on the surface of the coil support plate facing the coil, and the first lead passes out from the first receiving groove and is electrically connected to the circuit board.

5. The camera module according to claim 4, wherein, The outer contour dimension of the coil support plate is larger than the outer contour dimension of the coil; the coil has a first central hole, a second central hole is formed on the coil support plate, and the dimension of the second central hole is smaller than the dimension of the first central hole.

6. The camera module according to claim 5, wherein The coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrally symmetric figure; a second receiving groove is further formed on the surface of the coil support plate facing the coil, and the first receiving groove and the second receiving groove are symmetrically arranged about the center of the coil support plate or are arranged by rotating 180 degrees about the axis of the second central hole.

7. The camera module according to claim 6, wherein The shapes of the first receiving groove and the second receiving groove are both arc-shaped, and the first receiving groove and the second receiving groove are arranged at diagonal positions of the coil support plate.

8. The camera module according to claim 7, wherein Both the first receiving groove and the second receiving groove include: a first extension section, a second extension section, and an arc-shaped connection section connecting the first extension section and the second extension section, wherein the included angle between the first extension section and the second extension section is an obtuse angle, and the second extension section penetrates through the edge of the coil support plate.

9. The camera module according to claim 4, wherein The base assembly includes a base and a fixing member, and the fixing member is arranged on the base and is located on one side of the base; A first sliding groove is provided on one side of the carrier close to the fixing member, and a second sliding groove is provided on one side of the fixing member close to the carrier. A guiding member is installed between the first sliding groove and the second sliding groove to slidably connect the carrier and the fixing member; and / or, A first mounting groove is provided on one side of the carrier close to the fixing member, and the magnet assembly is installed in the first mounting groove; a second mounting groove is provided on one side of the fixing member close to the carrier, and the coil assembly is installed in the second mounting groove; and / or, The carrier includes a moving through hole that longitudinally penetrates the carrier. The image sensor is located below the moving through hole, and the lens assembly is located above the moving through hole, and the outer diameter of the lens assembly is smaller than the aperture of the moving through hole; and / or, The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or, The magnet assembly includes a shielding plate and at least one magnet, and each magnet is fixed on the shielding plate.

10. The camera module according to claim 9, wherein The base and the fixing member are of a split structure, and the fixing member is fixed on the base; A first limiting member is provided at the lower end of the first sliding groove, and a second limiting member is provided at the upper end of the second sliding groove to prevent the guiding member from sliding out between the first sliding groove and the second sliding groove.

11. A molding process, characterized in that, For manufacturing the carrier and the metal cover in the camera module according to any one of claims 1-10, the forming process includes the following steps: S1. Fabricate a metal plate with a preset shape, and the preset shape is the shape after the metal cover is unfolded; S2. Process strengthening holes and notches at preset positions on the metal plate; S3. Bend the metal plate to form the metal cover and form the long strip holes of the metal cover; S4. Perform insert injection molding on the metal cover in an injection mold to form the carrier, and bosses of the carrier are formed in the strengthening holes, the notches and the long strip holes.

Images