Loudspeaker module and electronic device

Abstract

The application provides a loudspeaker module and an electronic device, relates to the technical field of electronic devices, and can reduce the noise of the loudspeaker module and improve the audio experience of the loudspeaker module. The loudspeaker module comprises a shell, a core, sound-absorbing particles and a screen structure. At least part of the core is arranged in the shell, and the core and at least part of the inner wall surface of the shell enclose a back cavity of the loudspeaker module. The sound-absorbing particles are filled in the back cavity. The screen structure is arranged in the back cavity and is used for separating the core and the sound-absorbing particles. The screen structure comprises a screen and a first buffer layer. The screen has a first surface, the first surface faces away from the core, and the first buffer layer is arranged on the first surface. The loudspeaker module provided in the application is applied to an electronic device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a loudspeaker module and an electronic device. BACKGROUND

[0002] The loudspeaker module is used to restore audio electrical signals such as music and voice into sound, and can support the function of audio playback, so it has been more and more widely applied in electronic devices such as mobile phones, tablet computers, and notebook computers.

[0003] With the development of electronic devices such as mobile phones and tablet computers, people have higher demands for the audio experience of the loudspeaker module. Higher low-frequency loudness can bring better audio experience. The key factor affecting the low-frequency loudness of the loudspeaker module is the size of the back cavity. The larger the size of the back cavity, the higher the low-frequency loudness. However, under the trend of thinness and miniaturization of electronic devices, the size of the back cavity is limited, which will make it difficult to improve the audio experience of the loudspeaker module. SUMMARY

[0004] Embodiments of the present application provide a loudspeaker module and an electronic device, which can reduce the noise of the loudspeaker module and improve the audio experience of the loudspeaker module.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0006] In a first aspect, some embodiments of the present application provide a loudspeaker module, which includes a shell, a core, sound-absorbing particles, and a mesh structure. At least a part of the core is arranged in the shell, and the core and at least part of the inner wall of the shell enclose a back cavity of the loudspeaker module. The sound-absorbing particles are filled in the back cavity. In addition, the mesh structure is arranged in the back cavity to separate the core and the sound-absorbing particles. Specifically, the mesh structure can cover or not cover the part of the core located in the back cavity. Furthermore, the mesh structure includes a mesh and a first buffer layer. The mesh includes but is not limited to a gauze mesh and a metal mesh. The mesh has a first surface, the first surface faces away from the core, and the first buffer layer is arranged on the first surface. The first buffer layer covers the entire first surface. It can also not cover the first surface. The first surface refers to the whole formed by the surfaces of the plurality of wall plates of the mesh facing away from the core.

[0007] In the embodiments of the present application, the first buffer layer is arranged on the first surface of the mesh. The first buffer layer can dissipate the vibration energy of the sound-absorbing particles in contact with it. Therefore, when the sound-absorbing particles in the back cavity collide with the area of the mesh where the first buffer layer is arranged, the noise generated will be reduced. Thus, the overall noise caused by the collision of the sound-absorbing particles with the mesh when they are moving can be reduced, thereby improving the sound production effect of the loudspeaker module.

[0008] In a possible implementation manner of the first aspect, the mesh has mesh holes, and a vertical projection of the first buffer layer on the mesh is staggered with the mesh holes, that is, the vertical projection of the first buffer layer on the mesh does not overlap with the mesh holes, that is, the first buffer layer does not cover the mesh holes. In this way, the sound transmission efficiency between the inner core and the rear cavity can be improved, and the low-frequency effect of the loudspeaker module can be improved.

[0009] In a possible implementation manner of the first aspect, the first buffer layer is in an integrated structure with the mesh, and the first buffer layer is attached to the first surface. Specifically, the first buffer layer can be formed on the mesh by spraying or brushing. In this way, on the one hand, the processing technology of the first buffer layer can be simplified; on the other hand, the connection strength between the first buffer layer and the mesh can be strengthened.

[0010] In a possible implementation manner of the first aspect, the material of the first buffer layer includes rubber and / or resin, that is, the first buffer layer can include only rubber, can include only resin, or can include both rubber and resin. In this way, the material of the first buffer layer is easy to obtain and easy to purchase.

[0011] In a possible implementation manner of the first aspect, at least a part of the inner wall surface of the rear cavity is provided with a second buffer layer, that is, a part of the inner wall surface of the rear cavity can be provided with the second buffer layer, or the entire inner wall surface of the rear cavity can be provided with the second buffer layer. In this way, the vibration energy of the sound-absorbing particles near the second buffer layer can be dissipated, and the noise caused by the collision of the sound-absorbing particles with the shell during movement can be reduced.

[0012] In a possible implementation manner of the first aspect, the inner core includes a diaphragm and a driving device, an inner surface of the diaphragm and the driving device enclose a vibration space, and the driving device has a communication passage that communicates the vibration space and the rear cavity. Specifically, the driving device includes a voice coil fixedly connected to the diaphragm, a magnetic circuit system arranged on one side of the diaphragm, and a frame for mounting the diaphragm and the magnetic circuit system. The communication passage includes but is not limited to a hole formed in the frame, a hole formed in the magnetic circuit system, and an assembly gap between the magnetic circuit system and the frame. As long as the driving device has a communication passage, it is acceptable.

[0013] An end of the communication passage away from the vibration space has a first opening, the second buffer layer includes a first part, and the first opening faces the first part. Specifically, a vertical orthogonal projection of the first part in a plane parallel to the plane in which the first opening is located overlaps with the first opening. Wherein, "overlapping" means "partially overlapping" or "completely overlapping".

[0014] In this way, the vibration energy of the sound-absorbing particles near the first opening can be dissipated through the first part, and the noise caused by the collision of the sound-absorbing particles with the shell during movement can be reduced.

[0015] In one possible implementation of the first aspect, the housing includes a first housing portion and a second housing portion fixed together, the first housing portion and the second housing portion being arranged side by side and communicating in a first direction; the first direction is parallel to the diaphragm;

[0016] In the vibration direction of the diaphragm, the first housing part includes a first wall plate and a second wall plate. The first wall plate has a through hole. The core is fixed inside the first housing part, and the diaphragm blocks the through hole. Specifically, the diaphragm can be set at the first end of the through hole near the receiving chamber, or at the second end of the through hole away from the receiving chamber, or inside the through hole, i.e., between the first end and the second end.

[0017] The drive unit is located between the diaphragm and the second wall panel, with the first opening facing the second wall panel and the first part fixed to the second wall panel.

[0018] In this way, on the one hand, the vibration energy of the sound-absorbing particles near the first opening can be dissipated by the first part, reducing the noise caused by the sound-absorbing particles colliding with the shell when they move; on the other hand, since the first opening is parallel to the direction of diaphragm vibration, the gas flow between the vibration space and the rear cavity is maximized, which helps to reduce the air compression effect. Therefore, the speaker module can maintain a more linear response, thereby improving the accuracy and clarity of the sound.

[0019] In one possible implementation of the first aspect, the speaker module further includes an elastic adhesive portion, which includes, but is not limited to, a gel. The elastic adhesive portion is bonded between the second wall panel and the drive device; the elastic adhesive portion and the first portion are distributed in a direction parallel to the diaphragm, i.e., the first portion and the elastic adhesive portion do not overlap.

[0020] In this way, on the one hand, the core can be more stably fixed in the first shell part, and on the other hand, the vibration energy generated by the core can be absorbed and dispersed, thereby improving the sound effect and clarity of the speaker module.

[0021] In one possible implementation of the first aspect, a mesh structure is disposed within the first housing portion and surrounds the core; the mesh has a first mesh portion stacked with the second wall panel, and an elastic adhesive portion passes through the first mesh portion. This avoids interference between the mesh and the elastic adhesive portion.

[0022] In one possible implementation of the first aspect, the housing includes a first housing portion and a second housing portion fixed together, the first housing portion and the second housing portion being arranged side by side and communicating in a first direction; the first direction is parallel to the diaphragm;

[0023] The first shell part comprises a first wall plate, a second wall plate and a first side frame, the first wall plate and the second wall plate are oppositely and spacedly arranged in the vibration direction of the diaphragm, and the first side frame is connected between the first wall plate and the second wall plate; and the inner core is integrally fixed in the first shell part.

[0024] The second buffer layer comprises a second part, and the second part is fixed on the inner circumferential surface of the first side frame. The second part can cover the entire inner circumferential surface of the first side frame, or can be arranged only on part of the inner circumferential surface of the first side frame. In this way, the noise caused by the collision of the sound-absorbing particles with the inner wall surface of the first side frame during movement can be reduced.

[0025] In a possible implementation manner of the first aspect, a filling opening is formed in the second shell part, and the shape of the filling opening includes but is not limited to a circle, a square, a polygon and the like. The filling opening is in communication with the rear cavity. The sound-absorbing particles can be filled into the shell through the filling opening. A sealing cover is arranged on the filling opening, and the sealing cover is used to block the filling opening. In this way, the filling of the sound-absorbing particles is facilitated.

[0026] In a possible implementation manner of the first aspect, the shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side in the first direction and are in communication; and the inner core is fixed in the first shell part.

[0027] The second shell part comprises a first cavity and a second cavity, the second cavity is located at one end of the first cavity away from the first shell part, the second cavity is in communication with the first shell part through the first cavity, and the area of the cross section of the second cavity perpendicular to the first direction is greater than the area of the cross section of the first cavity perpendicular to the first direction; and the second cavity has a filling opening formed in the second shell part;

[0028] The second buffer layer comprises a third part, and the third part is arranged on the inner wall surface of the first cavity. The third part can cover the entire inner wall surface of the first cavity, or can be arranged only on part of the inner wall surface of the first cavity. In this way, the noise caused by the collision of the sound-absorbing particles with the inner wall surface of the first cavity during movement can be reduced.

[0029] In a possible implementation manner of the first aspect, the second buffer layer is foam or silica gel. In this way, the structure of the second buffer layer is simple, and the production is convenient.

[0030] In a possible implementation manner of the first aspect, the second buffer layer comprises a closed flexible bag body and a fluid medium. The material of the flexible bag body includes but is not limited to rubber, polyvinyl chloride (PVC) and polyethylene (PE). The flexible bag body is fixedly connected with the inner wall surface of the rear cavity. The fluid medium is filled in the flexible bag body. The fluid medium includes but is not limited to water, air and oil.

[0031] In this way, when the sound-absorbing particles come into contact with the flexible bag body, the flexible bag body will deform and transmit the impact force to the internal fluid medium. Since the fluid medium has certain viscosity and compressibility, it can effectively absorb and disperse the impact energy, thereby playing a buffering role.

[0032] In a possible implementation of the first aspect, the fluid medium is a non-Newtonian fluid. The non-Newtonian fluid includes but is not limited to a starch suspension, ink. In this way, when an external force acts on the fluid medium, the molecular structure of the fluid medium is rearranged to form a temporary network structure similar to an adhesive. This structure increases the viscosity of the fluid medium, thereby providing additional resistance, and thus can more effectively absorb and disperse impact energy.

[0033] In a possible implementation of the first aspect, the shell includes a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and communicate in a first direction; the core includes a diaphragm; a width of the first shell part in a second direction is greater than a width of the second shell part in the second direction to define an avoiding space; wherein the second direction is perpendicular to the first direction, and the first direction and the second direction are both parallel to the diaphragm. When the loudspeaker module is applied in an electronic device, the avoiding space can avoid the loudspeaker module.

[0034] In a possible implementation of the first aspect, the second shell part includes a first plate body and a second plate body arranged opposite in the second direction; the first plate body includes a bending segment and a flat plate segment, the bending segment and the flat plate segment are arranged and connected in the first direction, the bending segment is arched towards a side where the second plate body is located, and a first cavity is formed between the bending segment and the second plate body; a second cavity is formed between the flat plate segment and the second plate body; a surface of the bending segment opposite to the second plate body defines an avoiding groove. When the loudspeaker module is applied in an electronic device, the avoiding groove can avoid electronic components on the circuit board.

[0035] In a possible implementation of the first aspect, the first shell part includes a first side plate and a second side plate arranged opposite in the second direction, and an outer surface of the second side plate is flush with an outer surface of the flat plate segment;

[0036] In the second direction, the second plate body is located between the first side plate and the second side plate; in the second direction, the avoiding space is between the second plate body and the first side plate. In this way, when the width of the second shell part in the second direction is unchanged, the width of the avoiding space in the second direction can be increased, so that the avoiding space can avoid a camera module with a greater width in the second direction.

[0037] In a second aspect, some embodiments of the present application provide an electronic device, comprising a screen, a back shell, and the loudspeaker module according to any one of the technical solutions above; the screen is fixed to the back shell, and the screen and the back shell enclose a containing space, and the loudspeaker module is located in the containing space.

[0038] The electronic device provided by the embodiments of the present application comprises the loudspeaker module according to any one of the technical solutions above, and thus the same technical problems can be solved and the same technical effects can be achieved.

[0039] In a possible implementation manner of the second aspect, the back shell comprises a frame and a back cover, and the back cover is arranged in a stack with the screen; the back shell comprises the frame and the back cover, and the back cover is fixed to the frame. The screen, the frame, and the back cover jointly enclose a containing space of the electronic device. The electronic device further comprises a middle plate, the middle plate is arranged in a stack between the back cover and the screen, and the frame is arranged around the edges of the back cover, the middle plate, and the screen; the loudspeaker module is arranged between the middle plate and the back cover; the middle plate has a through hole; the inner core comprises a diaphragm, the diaphragm seals the through hole and encloses a front cavity of the loudspeaker module with the through hole.

[0040] The frame has a sound outlet hole; and / or, a part of the outer circumferential surface of the screen is spaced apart from the frame to define the sound outlet hole; that is, the sound outlet hole can be arranged only on the frame, or can be defined only by the part of the outer circumferential surface of the screen being spaced apart from the frame, or can be composed of the sound outlet hole arranged on the frame and the sound outlet hole defined by the part of the outer circumferential surface of the screen being spaced apart from the frame. The sound outlet hole is in communication with the front cavity.

[0041] By arranging the through hole on the middle plate and forming the front cavity by using the diaphragm to seal the through hole, the compactness of the structure of the electronic device can be achieved, and the front cavity does not need to be arranged in a space outside the middle plate, which is conducive to the thinness of the electronic device.

[0042] In a possible implementation manner of the second aspect, the shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and in communication in a first direction; the inner core comprises a diaphragm; the width of the first shell part in a second direction is greater than the width of the second shell part in the second direction to define an avoiding space; the second direction is perpendicular to the first direction, and the first direction and the second direction are both parallel to the diaphragm; the electronic device further comprises a camera module, the camera module is located between the middle plate and the back cover and is fixed opposite to the middle plate; a part of the camera module is located in the avoiding space.

[0043] In this way, on the one hand, the compactness of the internal structure of the electronic device can be ensured; on the other hand, the problem of the large thickness of the electronic device caused by the camera module and the loudspeaker module being arranged in a stack in the thickness direction of the electronic device can be prevented, which is conducive to the thinness of the electronic device.

[0044] On the basis of the above technical solutions, the electronic device further comprises a circuit board, the circuit board is arranged in layers between the loudspeaker module and the back cover, the circuit board has an avoiding gap opposite to the avoiding space, and part of the camera module is located in the avoiding gap. In this way, on the one hand, the compactness of the internal structure of the electronic device can be ensured; on the other hand, the problem of large thickness of the electronic device caused by the layering of the camera module and the main circuit board in the thickness direction of the electronic device can be prevented, and the thinning of the electronic device is facilitated.

[0045] In a possible implementation manner of the second aspect, the second housing portion comprises a first plate body and a second plate body oppositely arranged in the second direction; the first plate body comprises a bending segment and a flat segment, the bending segment and the flat segment are arranged and connected in the first direction, the bending segment is arched towards a side where the second plate body is located, and a first cavity is formed between the bending segment and the second plate body; a second cavity is formed between the flat segment and the second plate body; and a surface of the bending segment opposite to the second plate body defines an avoiding groove.

[0046] The surface of the circuit board facing the loudspeaker module is provided with electronic components, and at least part of the electronic components is located in the avoiding groove, that is, part of the electronic components can be located in the avoiding space, or each part of the electronic components is located in the avoiding space. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 A structural schematic diagram of an electronic device provided for some embodiments of the present application;

[0048] Figure 2 A structural schematic diagram of an electronic device provided for some embodiments of the present application; Figure 1 An exploded view of the electronic device shown in FIG. 1;

[0049] Figure 3 A sectional schematic diagram of the electronic device shown in FIG. 1 at A-A line; Figure 1 A sectional schematic diagram of the electronic device shown in FIG. 1 at B-B line;

[0050] Figure 4 A sectional schematic diagram of the electronic device shown in FIG. 1 at B-B line; Figure 1 A sectional schematic diagram of the electronic device shown in FIG. 1 at B-B line;

[0051] Figure 5 A sectional schematic diagram of the electronic device shown in FIG. 1 at B-B line; Figure 4 A three-dimensional structural schematic of the loudspeaker module in the electronic device shown in FIG. 1;

[0052] Figure 6 A three-dimensional structural schematic of the loudspeaker module in the electronic device shown in FIG. 1; Figure 3 An enlarged view of the electronic device shown in FIG. 1 at A;

[0053] Figure 7 An enlarged view of the electronic device shown in FIG. 1 at A; Figure 4 An enlarged view of the electronic device shown in FIG. 1 at A;

[0054] Figure 8 Fig. 2 is a perspective view of a loudspeaker module according to an embodiment of the present application; Figure 7 Fig. 3 is a perspective view of a mesh structure in the loudspeaker module shown in Fig. 2;

[0055] Figure 9 Fig. 4 is a cross-sectional view of the mesh structure shown in Fig. 3; Figure 8 Fig. 5 is a cross-sectional view of a second buffer layer in the loudspeaker module shown in Fig. 2. DETAILED DESCRIPTION

[0056] Figure 10 In the description of the present application, the term "exemplarily" or "for example" is used to represent an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. In fact, the term "exemplarily" or "for example" is intended to present the relevant concept in a specific manner. Figure 7 In the description of the embodiments of the present application, the term "and / or" means and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0057] In the description of the embodiments of the present application, unless specifically defined and limited, the terms "mount", "connected", "connection" should be understood broadly, for example, "connection" can be detachable connection, or can be non-detachable connection, can be direct connection, or indirect connection through intermediate medium.

[0058] In the description of the embodiments of the present application, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive containing, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element.

[0059] In the description of the embodiments of the present application, unless specifically defined and limited, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive containing, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element.

[0060] In the description of the embodiments of the present application, unless specifically defined and limited, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive containing, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other same elements in the process, method, article or device including the element.

[0061] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions that are approximately the recited condition, the range of which is within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel can be, for example, within ±10°; "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable deviation range for approximately perpendicular can also be, for example, within ±10°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, a difference between the two that is less than or equal to 5% of either.

[0062] The present application provides an electronic device, which is a kind of electronic device with a loudspeaker module. Specifically, the electronic device includes but is not limited to a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, and the like.

[0063] Please refer to Figures 1-2 , Figure 1 a structural schematic diagram of an electronic device 100 provided by some embodiments of the present application; Figure 2 for Figure 1 an exploded view of the electronic device 100 shown. In the embodiment shown in Figure 1 , the electronic device 100 is a mobile phone. Specifically, the electronic device 100 includes a screen 3, a back cover 1, a middle plate 2, a battery 4, a main circuit board 5, a secondary circuit board 6, a connecting structure 7, a camera module 8, and a loudspeaker module 9.

[0064] It should be noted that Figure 1 , Figure 2 and the relevant drawings below only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Figure 1 , Figure 2 and the drawings below. In addition, when the electronic device 100 is some other form of device, the electronic device 100 can also not include the secondary circuit board 6, the connecting structure 7, and the battery 4.

[0065] For the convenience of description, the width direction of the electronic device 100 is defined as the X-axis. The length direction of the electronic device 100 is the Y-axis. The thickness direction of the electronic device 100 (i.e., the stacking direction of the back shell 1 and the screen 3) is the Z-axis. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs.

[0066] The screen 3 is used to display image information, video information, etc. The screen 3 includes a light-transmitting cover plate 31 and a display screen 32. The light-transmitting cover plate 31 is in the form of a flat plate. Specifically, the shape of the light-transmitting cover plate 31 includes but is not limited to a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate, and an elliptical flat plate. The material of the light-transmitting cover plate 31 includes but is not limited to glass, plastic, and ceramic. The light-transmitting cover plate 31 is stacked with the display screen 32 and fixedly connected. The connection mode between the light-transmitting cover plate 31 and the display screen 32 includes but is not limited to adhesion. The light-transmitting cover plate 31 is mainly used to protect and prevent dust from entering the display screen 32.

[0067] The display screen 32 can be a flexible display screen or a rigid display screen. For example, the display screen 32 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light emitting diode (QLED) display screen, a liquid crystal display (LCD), etc. The display surface of the display screen 32 faces the light-transmitting cover plate 31, so that the image, video, etc. displayed by the display screen 32 can be observed by the user through the light-transmitting cover plate 31. It should be noted that the screen 3 can be a flat screen or a curved screen, which is not limited here.

[0068] Please refer to Figures 2-3 wherein, Figure 3 is Figure 1A cross-sectional view of the electronic device 100 at the line A-A is shown. The screen 3 is fixed to the back cover 1, and forms a containing space together with the back cover 1. The connection between the screen 3 and the back cover 1 includes, but is not limited to, adhesion. The containing space of the electronic device 100 can be used to contain the main circuit board 5, the auxiliary circuit board 6, the connecting structure 7, the loudspeaker module 9, the camera module 8, the battery 4, and the like.

[0069] Please continue to refer to Figure 2 and Figure 3 The back cover 1 includes a back cover 12 and a frame 11. The back cover 12 is arranged in a stack with the screen 3. The frame 11 is arranged around the edges of the back cover 12 and the screen 3. In this way, the screen 3, the frame 11, and the back cover 12 together enclose the containing space of the electronic device 100.

[0070] The back cover 12 is fixed to the frame 11. For example, the back cover 12 can be fixedly connected to the frame 11 by adhesive. The back cover 12 can also be an integral structure with the frame 11, i.e., the back cover 12 and the frame 11 are an integral structure. Please continue to refer to Figure 2 and Figure 3 The middle plate 2 is fixed in the containing space of the electronic device 100. The middle plate 2 is flat, and the shape of the middle plate 2 is adapted to the shape of the light-transmitting cover plate 31. The middle plate 2 is arranged in a stack between the back cover 12 and the screen 3, specifically, the frame 11 is arranged around the edges of the middle plate 2. For example, the middle plate 2 can be an integral structure with the frame 11. In other embodiments, the frame 11 and the middle plate 2 can also be assembled together, and the connection between the two includes, but is not limited to, adhesion, clamping, screw connection, and the like.

[0071] The middle plate 2 serves as the structural "skeleton" of the electronic device 100, and the main circuit board 5, the auxiliary circuit board 6, the loudspeaker module 9, the camera module 8, the battery 4, and the like can be fixed to the middle plate 2. It can be understood that in other embodiments, the electronic device 100 can also not include the middle plate 2.

[0072] The battery 4 is used to provide power for the main circuit board 5, the auxiliary circuit board 6, the screen 3, the camera module 8, and the loudspeaker module 9, and the like. In some embodiments, the surface of the middle plate 2 facing the back cover 12 is provided with a battery mounting groove 21, and the battery 4 is mounted in the battery mounting groove 21. In other embodiments, when the back cover 1 does not include the middle plate 2, the battery 4 can be fixed to the surface of the back cover 12 facing the display screen 32.

[0073] Please continue to refer to Figure 2 and Figure 3The main circuit board 5 can be fixed to the surface of the middle plate 2 facing the back cover 12 in a stacked manner, and specifically, the main circuit board 5 and the battery 4 are arranged along the Y-axis direction. In other embodiments, when the electronic device 100 does not include the middle plate 2, the main circuit board 5 can be fixed to the surface of the display screen 32 facing the back cover 12.

[0074] The main circuit board 5 can be a hard circuit board, a flexible circuit board, or a combination of a hard circuit board and a flexible circuit board. The main circuit board 5 can be made of an FR-4 medium plate, a Rogers medium plate, a combination of an FR-4 medium plate and a Rogers medium plate, or the like. Here, FR-4 is a code of a fire-resistant material grade, and the Rogers medium plate is a high-frequency plate. The main circuit board 5 can be used for integrated chips. The chips can be, for example, an application processor (AP), a double data rate (DDR) synchronous dynamic random access memory, a universal flash storage (UFS), or the like. The main circuit board 5 is electrically connected to the display screen 32, and the main circuit board 5 is used to control the display screen 32 to display images or videos.

[0075] The auxiliary circuit board 6 is located on the side of the battery 4 away from the main circuit board 5. The auxiliary circuit board 6 can be fixed to the surface of the middle plate 2 facing the back cover 12. In other embodiments, when the back shell 1 does not include the middle plate 2, the auxiliary circuit board 6 can also be fixed to the side of the display screen 32 facing the back cover 12.

[0076] The auxiliary circuit board 6 can be a hard circuit board, a flexible circuit board, or a combination of a hard circuit board and a flexible circuit board. The auxiliary circuit board 6 can be made of an FR-4 medium plate, a Rogers medium plate, a combination of an FR-4 medium plate and a Rogers medium plate, or the like. The auxiliary circuit board 6 can be used for electronic components 51 such as an integrated antenna (for example, a 5G antenna) radio frequency front end and a universal serial bus (USB) device.

[0077] The auxiliary circuit board 6 is electrically connected to the main circuit board 5 through the connection structure 7 to realize data and signal transmission between the auxiliary circuit board 6 and the main circuit board 5. The connection structure 7 can be a flexible circuit board. In other embodiments, the connection structure 7 can also be a wire or an enameled wire.

[0078] The camera module 8 is used for taking photos / videos. The camera module 8 can be a camera module with at least one of the functions of adjusting the amount of light, automatic focusing (AF), and optical image stabilization (OIS). For example, the camera module 8 can be an automatic zoom camera module. The camera module 8 can also be a type of camera module without functions such as adjusting the amount of light, automatic focusing (AF), and optical image stabilization (OIS). For example, the camera module 8 is a fixed-focus camera module, including but not limited to a wide-angle camera module and a macro camera module.

[0079] The camera module 8 can be a front camera or a rear camera. The embodiment takes the camera module 8 as a front camera as an example for description.

[0080] Please continue to refer to Figure 2 The camera module 8 is located between the middle plate 2 and the back cover 12, and is fixed relative to the middle plate 2. Specifically, the camera module 8 can be fixed to the surface of the middle plate 2 facing the back cover 12. The connection mode between the camera module 8 and the middle plate 2 includes but is not limited to gluing, clamping, screw connection, etc. In other embodiments, when the electronic device 100 does not include the middle plate 2, the camera module 8 can also be fixed to the surface of the display screen 32 facing the back cover 12.

[0081] Specifically, the middle plate 2 is provided with a second opening 22 corresponding to the position of the shooting area of the camera module 8, and the display screen 32 is provided with a third opening 321 corresponding to the position of the shooting area of the camera module 8. The camera module 8 can shoot various things on the side of the screen 3 away from the back cover 12 through the second opening 22 and the third opening 321.

[0082] Please continue to refer to Figure 2 In order to facilitate the electrical connection between the camera module 8 and the main circuit board 5, the camera module 8 and the main circuit board 5 are located on the same side of the battery 4. In some embodiments, please continue to refer to Figure 2 The main circuit board 5 is provided with a avoiding gap K, and part of the camera module 8 is located in the avoiding gap K. In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the problem of large thickness of the electronic device 100 caused by the stacking of the camera module 8 and the main circuit board 5 in the Z-axis direction can be prevented, which is beneficial to realize the lightness and thinness of the electronic device 100.

[0083] In other embodiments, the main circuit board 5 is not provided with the avoiding gap K, and the camera module 8 and the main circuit board 5 are stacked between the back cover 12 and the middle plate 2.

[0084] In addition, when the camera module 8 is on the same side of the battery 4 as the sub-circuit board 6, a relief gap K for avoiding the camera module 8 can be provided on the sub-circuit board 6. In the following description, it is assumed that the main-circuit board 5 is provided with the relief gap K, and part of the camera module 8 is located in the relief gap K.

[0085] The speaker module 9, also referred to as a "loudspeaker", is used to convert an audio electrical signal into an acoustic signal. The electronic device 100 can listen to music or listen to a hands-free call through the speaker module 9, so that the electronic device 100 can support sound externalization.

[0086] The speaker module 9 is arranged between the middle plate 2 and the back cover 12. Specifically, please refer to Figure 2 and Figure 3 , the middle plate 2, the speaker module 9, the main-circuit board 5 and the back cover 12 are sequentially stacked.

[0087] In order to avoid the camera module 8, please refer to Figure 2 , the speaker module 9 has a relief space M opposite the relief gap K. Part of the camera module 8 is located in the relief space M.

[0088] Please refer to Figure 4 and Figure 5 , wherein, Figure 4 is a cross-sectional view of the electronic device 100 at the B-B line. Figure 1 is a perspective view of the speaker module 9 in the electronic device 100 shown in Figure 5 . Figure 4

[0089] The shell 91 is used to protect the internal structure. The material of the shell 91 includes but is not limited to plastic, metal and the combination of plastic and metal.

[0090] In order to form the above-mentioned relief space M to avoid the camera module 8. In some embodiments, the shell 91 has the relief space M. Specifically, the shell 91 includes a first shell part 911 and a second shell part 912 fixed together. The first shell part 911 and the second shell part 912 are arranged side by side in the X-axis direction (i.e., the first direction) and are in communication.

[0091] The width of the first shell part 911 in the Y-axis direction (i.e., the second direction) is greater than the width of the second shell part 912 in the second direction, so as to define the relief space M.

[0092] ​In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the problem of the large thickness of the electronic device 100 caused by the camera module 8 and the speaker module 9 being arranged in a stacked manner in the Z-axis direction can be prevented, and the thinness of the electronic device 100 can be facilitated.

[0093] Since the main circuit board 5 and the speaker module 9 are arranged in a stacked manner, when the surface of the main circuit board 5 facing the speaker module 9 is provided with electronic components 51 (in combination with Figure 2 ), in order to avoid the electronic components 51, the second housing portion 912 has an avoidance groove N. At least part of the electronic components 51 is located in the avoidance groove N, that is, part of the electronic components 51 can be located in the avoidance groove N, or each part of the electronic components 51 can be located in the avoidance groove N.

[0094] In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the thickness of the whole composed of the main circuit board 5 and the speaker module 9 can be reduced, and the thinness of the electronic device 100 can be facilitated.

[0095] The first housing portion 911 can be a one-piece housing or can be formed by assembling multiple parts. Similarly, the second housing portion 912 can be a one-piece housing or can be formed by assembling multiple parts.

[0096] Please refer to Figure 4 , the first housing portion 911 surrounds an accommodation cavity J. The first housing portion 911 has a first wall plate 9111, a second wall plate 9112, and a first side frame 9113. The first wall plate 9111 and the second wall plate 9112 are arranged in the thickness direction of the speaker module 9, that is, the Z-axis direction. The first wall plate 9111 and the second wall plate 9112 are arranged opposite to and spaced apart from each other. The first side frame 9113 is connected between the first wall plate 9111 and the second wall plate 9112, and specifically, the first side frame 9113 is arranged around the edges of the first wall plate 9111 and the second wall plate 9112.

[0097] The second housing portion 912 includes a first cavity 9121 and a second cavity 9122.

[0098] The second cavity 9122 is located at one end of the first cavity 9121 away from the first housing portion 911. The second cavity 9122 communicates with the first housing portion 911 through the first cavity 9121.

[0099] Specifically, the second housing portion 912 has a third wall plate 9123, a fourth wall plate 9124, and a second side frame 9125. The third wall plate 9123 and the fourth wall plate 9124 are arranged along the thickness direction of the speaker module 9, that is, the Z-axis direction. The third wall plate 9123 and the fourth wall plate 9124 are oppositely arranged. The second side frame 9125 is arranged around the edges of the third wall plate 9123 and the fourth wall plate, and the second side frame 9125 is connected to the first side frame 9113.

[0100] Referring to Figure 5 In some embodiments, the second side frame 9125 includes a first plate body 9125a and a second plate body 9125b oppositely arranged in the Y-axis direction, that is, the second housing portion 912 includes the first plate body 9125a and the second plate body 9125b oppositely arranged in the Y-axis direction. The first plate body 9125a includes a bent segment 9125a1 and a flat segment 9125a2. The bent segment 9125a1 and the flat segment 9125a2 are arranged in the X-axis direction and connected. A first cavity 9121 is formed between the bent segment 9125a1 and the second plate body 9125b; and a second cavity 9122 is formed between the flat segment 9125a2 and the second plate body 9125b.

[0101] The bent segment 9125a1 is arched towards the side where the second plate body 9125b is located. The surface of the bent segment 9125a1 facing away from the second plate body 9125b defines the aforementioned avoidance slot N.

[0102] Referring to Figure 4 and Figure 5 In some embodiments, the outer surface of the third wall plate 9123 is coplanar with the outer surface of the first wall plate 9111. The outer surface of the third wall plate 9123 refers to the surface of the third wall plate 9123 facing away from the first cavity 9121, and the outer surface of the first wall plate 9111 refers to the surface of the first wall plate 9111 facing away from the accommodation chamber J.

[0103] In this way, the speaker module 9 can be tightly fitted with the surface of the middle plate 2 facing the back cover 12, so as to ensure the compactness of the electronic device 100. It can be understood that in other embodiments, the outer surface of the third wall plate 9123 can also be non-coplanar with the outer surface of the first wall plate 9111.

[0104] Referring to Figure 4 and Figure 5 In some embodiments, the outer surface of the second wall plate 9112 is coplanar with the outer surface of the fourth wall plate 9124. The outer surface of the fourth wall plate 9124 refers to the surface of the fourth wall plate 9124 facing away from the first cavity 9121, and the outer surface of the second wall plate 9112 refers to the surface of the second wall plate 9112 facing away from the accommodation chamber J.

[0105] This allows the speaker module 9 to fit tightly against the surface of the main circuit board 5 facing the middle plate 2, ensuring the compact structure of the electronic device 100. It is understood that in other embodiments, the outer surfaces of the second wall panel 9112 and the fourth wall panel 9124 may not be coplanar.

[0106] Please see Figure 4 and Figure 5 In some embodiments, the first side frame 9113 includes a first side plate 9113a and a second side plate 9113b disposed opposite to each other in the Y-axis direction. That is, the first housing portion 911 includes the first side plate 9113a and the second side plate 9113b disposed opposite to each other in the second direction. The outer surface of the second side plate 9113b is flush with the outer surface of the flat plate segment 9125a2. In the Y-axis direction, the second plate 9125b is located between the first side plate 9113a and the second side plate 9113b; in the Y-axis direction, the clearance space M is located between the second plate 9125b and the first side plate 9113a. The outer surface of the second side plate 9113b refers to the surface of the second side plate 9113b facing away from the receiving chamber J, and the outer surface of the flat plate segment 9125a2 refers to the surface of the flat plate segment 9125a2 facing away from the second cavity 9122.

[0107] In this way, while keeping the width of the second housing portion 912 in the Y-axis direction unchanged, the width of the clearance space M in the second direction can be increased, so that the clearance space M can avoid the camera module 8, which has a larger width in the second direction.

[0108] Please see Figure 6 , Figure 6 for Figure 3 The electronic device 100 shown is an enlarged view at point A. The speaker module 9 also includes a core 92. The core 92 is the core element in the speaker module 9 for generating sound. At least a portion of the core 92 is disposed within the housing 91, that is, either a part of the core 92 is disposed within the housing 91, or the entire core 92 is disposed within the housing 91.

[0109] Please continue reading. Figure 6 In this embodiment, the core 92 is fixed inside the first housing portion 911.

[0110] Specifically, the core 92 includes a diaphragm 921 and a drive unit 922.

[0111] The first wall panel 9111 has a through hole 9111a, and the diaphragm 921 blocks the through hole 9111a. The diaphragm 921 can be disposed at the first end of the through hole 9111a near the receiving chamber J, or at the second end of the through hole 9111a away from the receiving chamber J, or inside the through hole 9111a, i.e., between the first end and the second end.

[0112] The diaphragm 921 extends in the XY direction. That is, the diaphragm 921 is parallel to the X-axis direction and the Y-axis direction, and the vibration direction of the diaphragm 921 is the same as the Z-axis direction.

[0113] Please continue to refer to Figure 6 , the middle plate 2 has a communication hole 23; the communication hole 23 is opposite to the through hole 9111a, the diaphragm 921 blocks the communication hole 23, and the communication hole 23 is surrounded to form the front cavity C1 of the loudspeaker module 9.

[0114] In order to reduce the distortion generated by the loudspeaker module 9 when playing sound, and improve the overall auditory experience of the loudspeaker module 9. A part of the outer circumferential surface of the screen 3 is spaced apart from the frame 11 to define a sound outlet hole 111, and the sound outlet hole 111 is in communication with the front cavity C1. In this way, the sound generated by the air vibration in the front cavity C1 pushed by the loudspeaker module 9 can be transmitted out from the sound outlet hole 111.

[0115] In other examples, the sound outlet hole 111 can also be formed on the frame 11, that is, the frame 11 has the sound outlet hole 111. Alternatively, in other examples, part of the sound outlet hole formed on the frame 11 and part of the outer circumferential surface of the screen 3 spaced apart from the frame 11 to define part of the sound outlet hole together form the sound outlet hole 111. As long as the frame 11 has the sound outlet hole 111, and / or part of the outer circumferential surface of the screen 3 is spaced apart from the frame 11 to define the sound outlet hole 111.

[0116] Specifically, the sound outlet hole 111 is in communication with the front cavity C1 through a sound outlet channel 93. Specifically, the display screen 32 is spaced apart from the middle plate 2 to form the sound outlet channel 93, and the sound outlet hole 111 is in communication with the front cavity C1 through the sound outlet channel 93. The air flow path in the front cavity C1 is shown by the arrow in Figure 3 It can be understood that in other embodiments, when the position of the communication hole 23 is close to the frame 11, the sound outlet channel 93 can also not be provided, and the sound outlet hole 111 is directly in communication with the front cavity C1.

[0117] Please refer to Figure 7 , Figure 7 for Figure 4 the internal structure diagram of the loudspeaker module 9 in the electronic device 100 shown. The inner core 92 and the inner wall surface of the shell 91 surround the back cavity C2 of the loudspeaker module 9. In other examples, the inner core 92 and part of the inner wall surface of the shell 91 surround the back cavity C2 of the loudspeaker module 9, and the inner core 92 and part of the inner wall surface of the shell 91 surround the front cavity C1 of the loudspeaker module 9. As long as the inner core 92 and at least part of the inner wall surface of the shell 91 surround the back cavity C2 of the loudspeaker module 9.

[0118] The driving device 922 is used to drive the diaphragm 921 to vibrate, thereby causing the air in the front cavity C1 to vibrate and form sound waves. The driving device 922 includes, but is not limited to, an electric (moving coil) driving device, an electrostatic (capacitive) driving device, an electromagnetic (reed) driving device, or a piezoelectric (crystal) driving device.

[0119] The driving device 922 is stacked with the second wall panel 9112, and the driving device 922 is located between the diaphragm 921 and the second wall panel 9112. The driving device 922 and the inner surface of the diaphragm 921 enclose a vibration space 923. The inner surface of the diaphragm 921 refers to the surface of the diaphragm 921 that faces away from the front cavity C1.

[0120] In some embodiments, the drive device 922 is a moving-coil drive device. Specifically, please refer to... Figure 7 The driving device 922 includes a voice coil 9221 fixedly connected to the diaphragm 921, a magnetic circuit system 9222 disposed on one side of the diaphragm 921, and a frame 9223 for mounting the diaphragm 921 and the magnetic circuit system 9222. When energized, the voice coil 9221 generates an induced magnetic field, thereby being displaced by the magnetic force of the magnetic circuit system 9222, thereby driving the diaphragm 921 to vibrate.

[0121] Please continue reading. Figure 7 To balance the pressure difference on both sides of the diaphragm 921 and reduce the nonlinear movement of the diaphragm 921 caused by air pressure changes, thereby reducing distortion generated by the speaker module 9 when playing sound, in some embodiments, the drive device 922 has a communication channel 9224 that connects the vibration space 923 and the rear cavity C2. This communication channel 9224 includes, but is not limited to, holes formed in the frame 9223, holes formed in the magnetic circuit system 9222, and assembly gaps between the magnetic circuit system 9222 and the frame 9223. It is sufficient to ensure that the drive device 922 has a communication channel 9224. For example, in... Figure 7 In the illustrated embodiment, the connecting channel 9224 is a hole formed in the frame 9223. For example, the connecting channel 9224 may be formed at the four apex corners of the frame 9223 near the second wall panel 9112.

[0122] To improve the low-frequency loudness of speaker module 9 without increasing the physical volume of its rear cavity C2. See [reference needed]. Figure 7 In some embodiments, the speaker module 9 further includes sound-absorbing particles 94, the materials of which include, but are not limited to, one or more of melamine, zeolite, glass fiber, activated carbon, etc. The shape of the sound-absorbing particles 94 can be spherical, rod-shaped, sheet-like, cubic, irregularly shaped, etc. It should be noted that there are multiple sound-absorbing particles 94.

[0123] Sound-absorbing particles 94 are filled into the rear cavity C2. Specifically, a filling port 9126 is provided on the second housing portion 912. The shape of the filling port 9126 includes, but is not limited to, circular, square, polygonal, etc. The filling port 9126 communicates with the rear cavity C2. The sound-absorbing particles 94 can be filled into the housing 91 through the filling port 9126. A sealing cap (not shown in the figure) is installed on the filling port 9126, which is used to seal the filling port 9126.

[0124] In addition, when the sealing cap does not seal the filling port 9126 to the rear cavity C2, the filling port 9126 can be used to balance the air pressure between the rear cavity C2 and the external environment.

[0125] In this way, the sound-absorbing particles 94 can slow down the propagation speed of sound waves in the rear cavity C2 and reduce sound wave reflection, thereby increasing the equivalent volume of the rear cavity C2 and improving the low-frequency performance of the speaker module 9.

[0126] Based on the above embodiments, to avoid the sound-absorbing particles 94 interfering with the movement of the drive device 922 and the diaphragm 921 within the core 92, please continue reading. Figure 7 The speaker module 9 also includes a mesh structure 95. The mesh structure 95 is disposed within the rear cavity C2 and serves to separate the core 92 and the sound-absorbing particles 94. For details, please refer to [link / reference needed]. Figure 7 The mesh structure 95 is disposed within the first housing portion 911 and surrounds the core 92.

[0127] Of course, this application is not limited to this. In other embodiments, the mesh structure 95 is annular, and its two axial ends are fixedly connected to the first wall plate 9111 and the second wall plate 9112, respectively. In still some embodiments, the mesh structure 95 may not surround the core 92, and the mesh structure 95 may be flat and disposed at the communication port between the first housing portion 911 and the second housing portion 912.

[0128] In the speaker module 9 provided in the above embodiment, the diaphragm 921 vibrates during operation, causing the surrounding air molecules to vibrate and form an airflow. Furthermore, the connection channel 9224 allows airflow between the rear cavity C2 and the vibration space 923. This airflow exerts a force on the sound-absorbing particles 94 in the rear cavity C2, causing the particles to vibrate and flow. During vibration, the sound-absorbing particles 94 collide with the mesh 951 and the inner wall of the rear cavity C2, thereby generating noise.

[0129] To reduce noise generated by the sound-absorbing particles 94 colliding with the mesh 951 during operation. Please refer to... Figure 8 and Figure 9 , Figure 8 for Figure 7 The diagram shows a three-dimensional structural schematic of the mesh structure 95 in the speaker module 9.Figure 9 As shown in FIG. 9, a cross-sectional structure diagram of the mesh structure 95 is shown. The mesh structure 95 includes a mesh 951 and a first buffer layer 952. Figure 8

[0130] The mesh 951 includes, but is not limited to, a gauze and a metal mesh.

[0131] The mesh 951 has a first surface 9511. The first surface 9511 faces away from the inner core 92. The first buffer layer 952 is arranged on the first surface 9511. Here, the first surface 9511 refers to the entirety of the surfaces on the plurality of wall plates of the mesh 951 that face away from the inner core 92. For example, in the embodiment shown in FIG. 9, the first buffer layer 952 covers the entire first surface 9511. It can be understood that in other embodiments, the first buffer layer 952 can also cover part of the first surface 9511. Figure 8

[0132] In this way, when the sound-absorbing particles 94 in the rear cavity C2 collide with the area of the mesh 951 on which the first buffer layer 952 is arranged, part of the vibration energy of the sound-absorbing particles 94 can be dissipated through the first buffer layer 952, thereby reducing the overall noise caused by the collision of the sound-absorbing particles 94 with the mesh 951 when the sound-absorbing particles 94 are in motion, and thereby improving the sound production effect of the loudspeaker module 9.

[0133] Please continue to refer to Figure 8 and Figure 9 In some embodiments, the mesh 951 has mesh holes 9512, and the vertical projection of the first buffer layer 952 on the mesh 951 is offset from the mesh holes 9512, i.e., the vertical projection of the first buffer layer 952 on the mesh 951 does not overlap the mesh holes 9512, i.e., the first buffer layer 952 does not cover the mesh holes 9512. In this way, it is beneficial to improve the transmission efficiency of sound between the inner core 92 and the rear cavity C2, and to improve the low-frequency effect of the loudspeaker module 9.

[0134] It can be understood that when the first buffer layer 952 covers part of the first surface 9511, the vertical projection of the first buffer layer 952 on the mesh 951 can also be offset from the mesh holes 9512, i.e., the first buffer layer 952 covers part of the mesh holes 9512.

[0135] In some embodiments, the first buffer layer 952 and the mesh 951 are in an integral structure, and the first buffer layer 952 is attached to the first surface 9511. For example, the first buffer layer 952 can be formed on the mesh 951 by spraying or brushing. In this way, on the one hand, the processing technology of the first buffer layer 952 can be simplified; on the other hand, the connection strength between the first buffer layer 952 and the mesh 951 can also be strengthened.

[0136] ​​The material of the first buffer layer 952 includes rubber and / or resin, that is, the first buffer layer 952 can only include rubber, only include resin, or include both rubber and resin. Of course, the application is not limited to this, and the material of the first buffer layer 952 can also be silicone, polyurethane, or other materials.

[0137] It can be understood that in other embodiments, the first buffer layer 952 can also be a solid structure with elasticity such as foam or silicone. At this time, the first buffer layer 952 is provided with a first through hole corresponding to the mesh hole 9512 of the mesh 951, and the first buffer layer 952 and the mesh 951 are fixedly connected by bonding, screw connection, clamping or the like.

[0138] It can be understood that at this time, the first buffer layer 952 can be a single-layer structure or a multi-layer structure. It should be noted that the first buffer layer 952 adopts a multi-layer structure design, which can more effectively disperse and absorb energy by interlayer friction, thereby improving the buffering performance of the first buffer layer 952.

[0139] In some embodiments, please continue to refer to Figure 7 , the loudspeaker module 9 further includes an elastic adhesive part 96. The elastic adhesive part 96 includes but is not limited to gel. The elastic adhesive part 96 is bonded between the second wall plate 9112 and the driving device 922.

[0140] In this way, on the one hand, the inner core 92 can be more stably fixed in the first housing part 911; on the other hand, the vibration energy generated by the inner core 92 can also be absorbed and dispersed, thereby improving the sound effect and the clarity of the sound of the loudspeaker module 9.

[0141] Specifically, in the embodiment shown in Figure 7 , the mesh 951 has a first mesh part 9513 which is laminated with the second wall plate 9112, and the elastic adhesive part 96 is arranged in the first mesh part 9513. In this way, interference between the mesh 951 and the elastic adhesive part 96 can be avoided.

[0142] For example, the elastic adhesive part 96 is arranged in the mesh hole 9512 on the first mesh part 9513. Of course, the application is not limited to this. In other embodiments, the first mesh part 9513 is provided with a second through hole, the radius of the second through hole is greater than the radius of the mesh hole 9512, and the elastic adhesive part 96 is arranged in the second through hole on the first mesh part 9513.

[0143] To reduce the noise generated by the sound-absorbing particles 94 colliding with the inner wall of the housing 91 during movement, in some embodiments, a second buffer layer 97 is provided on at least a portion of the inner wall of the rear cavity C2. This means the second buffer layer 97 can be provided on a portion of the inner wall of the rear cavity C2, or it can be provided on the entire inner wall of the rear cavity C2. In this way, the vibration energy of the sound-absorbing particles 94 can be dissipated through the second buffer layer 97, reducing the noise generated by the sound-absorbing particles 94 colliding with the inner wall of the housing 91 during movement, thereby improving the sound output performance of the speaker module 9.

[0144] Please see Figure 7 Because the second cavity 9122 has a filling port 9126 opened on the second housing portion 912, the sound-absorbing particles 94 can only fill the rear cavity C2 sequentially in the order of the second cavity 9122, the first cavity 9121, and the receiving chamber J. The cross-sectional area of ​​the second cavity 9122 perpendicular to the first direction is larger than that of the first cavity 9121 perpendicular to the first direction. This makes it more difficult for the sound-absorbing particles 94 to enter the first cavity 9121 from the second cavity 9122, resulting in a lower filling rate of the sound-absorbing particles 94 in the first cavity 9121, and consequently, fewer sound-absorbing particles entering the receiving chamber J. Furthermore, since the core 92 occupies most of the space in the accommodating chamber J, the gap formed between the outer circumferential surface of the mesh 951 in the accommodating chamber J and the inner circumferential surface of the first side frame 9113 is very narrow. This makes it more difficult for the sound-absorbing particles 94 to enter the accommodating chamber J of the first housing part 911, resulting in a lower filling rate and amount of sound-absorbing particles 94 in the accommodating chamber J.

[0145] When the filling rate of the sound-absorbing particles 94 is low, the space between the sound-absorbing particles 94 and between the sound-absorbing particles 94 and the inner wall of the cavity will be larger. This arrangement will cause the sound-absorbing particles 94 to vibrate more significantly under the action of sound waves. Therefore, the collision between the sound-absorbing particles 94 and the inner wall of the first cavity 9121 and the inner wall of the first side frame 9113 will be more intense, generating greater noise.

[0146] To reduce noise generated by the sound-absorbing particles 94 colliding with the inner wall of the first cavity 9121 during operation, in some embodiments, the second buffer layer 97 includes a third portion 973. The third portion 973 is disposed on the inner wall of the first cavity 9121. The third portion 973 may cover the entire inner wall of the first cavity 9121, or it may be disposed only on a portion of the inner wall of the first cavity 9121.

[0147] For example, in Figure 7 In the embodiment shown, the third part 973 is disposed on the portion of the third wall plate 9123 corresponding to the portion of the first cavity 9121 and on the portion of the fourth wall plate 9124 corresponding to the portion of the first cavity 9121.

[0148] In order to reduce the noise caused by the sound-absorbing particles 94 colliding with the inner wall surface of the first side frame 9113 when moving, in some embodiments, the second buffer layer 97 comprises a second portion 972. The second portion 972 is fixed to the inner circumferential surface of the first side frame 9113. The second portion 972 can cover the entire inner circumferential surface of the first side frame 9113, or can be arranged only on part of the inner circumferential surface of the first side frame 9113. The present embodiment does not make any limitation here.

[0149] When the diaphragm 921 vibrates, the gas in the vibration space 923 will flow into the rear cavity C2 through the communication passage 9224. Specifically, the end of the communication passage 9224 away from the vibration space 923 has a first opening 9224a, and the gas in the vibration space 923 flows into the rear cavity C2 from the first opening 9224a. The flowing gas exerts a force on the sound-absorbing particles 94 near the first opening 9224a, which increases the moving speed of the sound-absorbing particles 94 near the first opening 9224a. This will make the sound-absorbing particles 94 near the first opening 9224a collide more violently with the area of the inner wall surface of the rear cavity C2 that is directly opposite the communication passage 9224, generating more noise.

[0150] To solve the above technical problems, please refer to Figure 7 In some embodiments, the second buffer layer 97 comprises a first portion 971, and the first opening 9224a is directed towards the first portion 971. Specifically, the first portion 971 is vertically projected on the plane parallel to the plane on which the first opening 9224a is located and overlaps with the first opening 9224a. Wherein, the "overlap" means "partial overlap" or "complete overlap". In this way, the vibration energy of the sound-absorbing particles 94 near the first opening 9224a can be dissipated by the first portion 971, and the noise caused by the sound-absorbing particles 94 near the first opening 9224a colliding with the inner wall surface of the first wall plate 9111 when moving can be reduced.

[0151] Please refer to Figure 7 In some embodiments, the first opening 9224a is directed towards the second wall plate 9112, and the first portion 971 is fixed to the second wall plate 9112. In this way, on the one hand, the vibration energy of the sound-absorbing particles 94 near the first opening 9224a can be dissipated by the first portion 971, and the noise caused by the sound-absorbing particles 94 near the first opening 9224a colliding with the inner wall surface of the first wall plate 9111 when moving can be reduced; on the other hand, since the first opening 9224a is directed towards the direction parallel to the vibration direction of the diaphragm 921, the gas flow between the vibration space 923 and the rear cavity C2 is maximized, which helps to reduce the air compression effect. Therefore, the loudspeaker module 9 can maintain a more linear response, thereby improving the accuracy and clarity of the sound.

[0152] It should be noted that the first portion 971 and the elastic adhesive portion 96 are distributed in a direction parallel to the diaphragm 921, i.e., the first portion 971 and the elastic adhesive portion 96 do not overlap together. Of course, the present application is not limited thereto. In other embodiments, the first portion 971 and the elastic adhesive portion 96 can overlap together.

[0153] In some embodiments, referring to Figure 10 , Figure 10 Figure 7 A sectional view of the second buffer layer 97 in the loudspeaker module 9. The second buffer layer 97 includes a closed flexible bag 974 and a fluid medium 975. The flexible bag 974 is fixedly connected with the inner wall of the back cavity C2. The fixed connection between the flexible bag 974 and the inner wall of the back cavity C2 includes but is not limited to bonding. The material of the flexible bag 974 includes but is not limited to rubber, polyvinyl chloride (PVC), polyethylene (PE).

[0154] The fluid medium 975 is filled in the flexible bag 974. At this time, the principle of the second buffer layer 97 for reducing the impact force of the sound-absorbing particles 94 is as follows: when the sound-absorbing particles 94 come into contact with the flexible bag 974, the flexible bag 974 will deform and transmit the impact force to the internal fluid medium 975. Since the fluid medium 975 has certain viscosity and compressibility, it can effectively absorb and disperse impact energy.

[0155] In some embodiments, the fluid medium 975 is a non-Newtonian fluid. The non-Newtonian fluid includes but is not limited to starch suspension, ink. In this way, when external force acts on the fluid medium 975, its molecular structure rearranges to form a temporary network structure similar to an adhesive. This structure increases the viscosity of the fluid medium 975, thereby providing additional resistance, and thus can more effectively absorb and disperse impact energy. In other examples, the fluid medium can also be water, air or oil.

[0156] It can be understood that the second buffer layer 97 is not limited to the above-mentioned structure of the flexible bag and the fluid medium, and in other embodiments, the second buffer layer 97 is foam or silica gel.

[0157] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0158] ​Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A speaker module, characterized by The loudspeaker module comprises a shell, a core, sound-absorbing particles and a mesh structure; At least a part of the core is arranged in the shell, and the core and at least a part of the inner wall surface of the shell form a rear cavity of the loudspeaker module; The sound-absorbing particles are filled in the rear cavity, and the mesh structure is arranged in the rear cavity to separate the core and the sound-absorbing particles; The mesh structure comprises a mesh and a first buffer layer, the mesh has a first surface facing away from the core, and the first buffer layer is arranged on the first surface; A second buffer layer is arranged on at least a part of the inner wall surface of the rear cavity; The core comprises a diaphragm and a driving device, an inner surface of the diaphragm and the driving device form a vibration space, and the driving device has a communication channel communicating the vibration space and the rear cavity; An end of the communication channel away from the vibration space has a first opening, and the second buffer layer comprises a first part, and the first opening faces the first part.

2. The speaker module of claim 1, wherein, The mesh has mesh holes, and a vertical projection of the first buffer layer on the mesh is staggered with the mesh holes.

3. The speaker module of claim 1, wherein, The first buffer layer and the mesh are in an integrated structure, and the first buffer layer is attached to the first surface.

4. The speaker module of claim 1, wherein, The material of the first buffer layer comprises rubber and / or resin.

5. The loudspeaker module of any one of claims 1-4, wherein, The shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and communicated in a first direction, and the first direction is parallel to the diaphragm; In the vibration direction of the diaphragm, the first shell part comprises a first wall plate and a second wall plate, the first wall plate has a through hole, the core is fixed in the first shell part as a whole, and the diaphragm blocks the through hole; the driving device is located between the diaphragm and the second wall plate, the first opening faces the second wall plate, and the first part is fixed to the second wall plate.

6. The speaker module of claim 5, wherein, The loudspeaker module further comprises an elastic adhesive part, the elastic adhesive part is bonded between the second wall plate and the driving device, and the elastic adhesive part is distributed in a direction parallel to the diaphragm together with the first part.

7. The speaker module of claim 6, wherein, The mesh structure is arranged in the first shell part and surrounds the core; The mesh has a first mesh part stacked with the second wall plate, and the elastic adhesive part is arranged in the first mesh part.

8. The loudspeaker module of any one of claims 1-4, wherein, The shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and communicated in a first direction, and the first direction is parallel to the diaphragm; The first shell part comprises a first wall plate, a second wall plate and a first side frame, the first wall plate and the second wall plate are arranged opposite to and spaced apart from each other in the vibration direction of the diaphragm, and the first side frame is connected between the first wall plate and the second wall plate; the core is fixed in the first shell part as a whole; The mesh structure is arranged in the first shell part and surrounds the core; The second buffer layer comprises a second part fixed to the inner circumferential surface of the first side frame.

9. The loudspeaker module of any one of claims 1-4, wherein, The shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and communicated in a first direction; the inner core is fixed to the first shell part; The second shell part comprises a first cavity and a second cavity, the second cavity is located at one end of the first cavity away from the first shell part, the second cavity is communicated with the first shell part through the first cavity, the area of the cross section of the second cavity perpendicular to the first direction is greater than the area of the cross section of the first cavity perpendicular to the first direction; the second cavity has a filling port opened on the second shell part; The second buffer layer comprises a third part, the third part is arranged on the inner wall surface of the first cavity.

10. The loudspeaker module of any one of claims 1-4, wherein, The second buffer layer is foam or silica gel.

11. The loudspeaker module of any one of claims 1-4, wherein, The second buffer layer comprises a closed flexible bag body and a fluid medium, the fluid medium is filled in the flexible bag body.

12. The speaker module of claim 11, wherein, The fluid medium is a non-Newtonian fluid.

13. The loudspeaker module of any one of claims 1-4, wherein, The shell comprises a first shell part and a second shell part fixed together, the first shell part and the second shell part are arranged side by side and communicated in a first direction; the inner core comprises a diaphragm; The width of the first shell part in a second direction is greater than the width of the second shell part in the second direction, so as to define an avoiding space; Wherein, the second direction is perpendicular to the first direction, and the first direction and the second direction are both parallel to the diaphragm.

14. The speaker module of claim 13, wherein, The second shell part comprises a first plate body and a second plate body arranged oppositely in a second direction; The first plate body comprises a bending segment and a flat plate segment, the bending segment and the flat plate segment are arranged and connected in the first direction, the bending segment is arched towards the side where the second plate body is located, and the bending segment and the second plate body form a first cavity; the flat plate segment and the second plate body form a second cavity; The surface of the bending segment away from the second plate body defines an avoiding groove.

15. The speaker module of claim 14, wherein, The first shell part comprises a first side plate and a second side plate arranged oppositely in a second direction, the outer surface of the second side plate is flush with the outer surface of the flat plate segment; In the second direction, the second plate body is located between the first side plate and the second side plate; in the second direction, the avoiding space is between the second plate body and the first side plate.

16. An electronic device, comprising: The electronic device comprises a screen, a back shell and the loudspeaker module of any one of claims 1-15; The screen is fixed to the back shell and encloses a containing space with the back shell, and the loudspeaker module is located in the containing space.

17. The electronic device of claim 16, wherein, The back shell comprises a frame and a back cover, and the back cover is arranged in a stack with the screen; The electronic device further comprises a middle plate arranged in a stack between the back cover and the screen, the frame is arranged around the edges of the back cover, the middle plate and the screen, and the loudspeaker module is arranged between the middle plate and the back cover; The middle plate has a communication hole; the inner core comprises a diaphragm, the diaphragm blocks the communication hole and encloses a front cavity of the loudspeaker module with the communication hole; The frame has a sound outlet hole; And / or, a part of the outer circumferential surface of the screen is spaced apart from the frame to define a sound outlet hole; the sound outlet hole communicates with the front cavity.

18. The electronic device of claim 17, wherein, The loudspeaker module is the loudspeaker module according to claim 13, The electronic device further comprises a camera module, the camera module is located between the middle plate and the back cover, and is fixed opposite to the middle plate; part of the camera module is located in the avoiding space.

19. The electronic device of claim 18, wherein, The electronic device further comprises a circuit board, the circuit board is arranged between the loudspeaker module and the back cover in a laminated manner, the circuit board has an avoiding gap opposite to the avoiding space, and part of the camera module is located in the avoiding gap.

20. The electronic device of claim 19, wherein, The loudspeaker module is the loudspeaker module according to claim 14, The surface of the circuit board facing the loudspeaker module is provided with electronic components, and at least part of the electronic components is located in the avoiding groove.

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