Electronic device
By setting up a magnetic loss structure on the conductive structure, the standing wave is converted into thermal energy, and the interference problem of antenna transmitting signals on the functional components of electronic equipment is solved, achieving efficient decoupling and improving signal quality.
Patent Information
- Application Number
- CN202311849803.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2025-07-08
AI Technical Summary
In traditional electronic devices, the problem of interference of other functional components such as camera components due to the antenna transmitting signals, affecting the user experience.
A magnetic loss structure is set up on the conductive structure, and a magnetic loss material is used to convert the standing wave into heat energy, which reduces the magnetic field strength and propagation distance of the standing wave, and reduces interference to functional components.
It effectively improves the interference problem of standing waves on other functional components of electronic devices, improves signal reception quality and saves space, and is suitable for decoupling problems in any frequency band.
Smart Images

Figure CN120282383A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electronic devices, and particularly to an electronic device. Background Art
[0002] With the rapid development of communication technologies, various communication electronic devices have emerged in an endless stream. Correspondingly, in order to meet the requirements of communication, in electronic devices such as mobile phones and tablets, the layout of antennas is becoming increasingly dense.
[0003] During the use of traditional electronic devices, the problem of other functional components in the electronic device being interfered by the signals emitted by the antenna occurs more and more frequently. For example, when the antenna emits signals, as one of the functional components, the camera component will experience problems such as screen flickering, freezing, and stuttering, which greatly affect the user experience. Summary of the Invention
[0004] Embodiments of this application provide an electronic device for improving the problem that other functional components in the electronic device are interfered by the signals emitted by the antenna during the use of the electronic device in related technologies.
[0005] To achieve the above object, the embodiments of this application adopt the following technical solutions:
[0006] In a first aspect, embodiments of this application provide an electronic device, which includes a radiator, a conductive member, and a magnetic loss structure;
[0007] The conductive member includes a conductive structure;
[0008] The radiator and the conductive structure are arranged adjacent to each other, and the electromagnetic wave radiated by the radiator can excite a standing wave propagating in a first direction on the conductive structure. The standing wave has multiple magnetic field strength points, and the multiple magnetic field strength points are spaced apart in the first direction;
[0009] The magnetic loss structure is arranged at a position of the conductive structure corresponding to the magnetic field strength point; along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure is greater than 0.
[0010] In some of these embodiments, the electronic device further includes a camera component, and the conductive structure is located between the radiator and the camera component.
[0011] In some of these embodiments, along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure is greater than 2.
[0012] In some of these embodiments, along the magnetic field direction of the standing wave, the length of the magnetic loss structure is greater than or equal to one-third of the length of the conductive structure.
[0013] In some of these embodiments, along the magnetic field direction of the standing wave, the length of the conductive structure is less than or equal to 3 mm, and the length of the magnetic loss structure is greater than or equal to 1 mm.
[0014] In some of these embodiments, the electromagnetic wave radiated by the radiator can excite a standing wave propagating in the first direction on the first surface of the conductive structure. The magnetic loss structure is located on the first surface of the conductive structure, and the first surface is the surface of the conductive structure close to the screen of the electronic device.
[0015] In some of these embodiments, the thickness of the magnetic loss structure in the direction perpendicular to the first surface is less than or equal to 2 mm.
[0016] In some of these embodiments, the electromagnetic wave radiated by the radiator can excite a standing wave propagating in the first direction on the second surface of the conductive structure. The magnetic loss structure is located on the second surface of the conductive structure, and the second surface is the surface of the conductive structure close to the back cover of the electronic device.
[0017] In some of these embodiments, the thickness of the magnetic loss structure in the direction perpendicular to the second surface is less than or equal to 2 mm.
[0018] In some of these embodiments, the magnetic loss structure covers the conductive structure.
[0019] In some of these embodiments, the distance between the radiator and the conductive structure is less than or equal to 30 mm.
[0020] In some of these embodiments, the conductive member is at least one of a bracket, a circuit board, a decorative member, a heat sink, a shielding cover, a power supply, a housing, and a screen.
[0021] In some of these embodiments, the magnetic loss material is at least one of a carbon-based wave-absorbing material, an iron-based wave-absorbing material, and a ceramic wave-absorbing material.
[0022] In some of these embodiments, the carbon-based wave-absorbing material is at least one of graphene, graphite, carbon black, carbon fiber, and carbon nanotubes; the iron-based wave-absorbing material is at least one of ferrite, magnetic iron nanomaterials, iron hydroxide, iron carbonyl, and iron silicon aluminum; and the ceramic wave-absorbing material is at least one of silicon carbide, magnesium oxide, and silicon nitride.
[0023] In some of these embodiments, the magnetic loss structure and the conductive structure are connected by bonding, clamping, welding, or fastening; or, the magnetic loss structure is evaporated on the conductive structure.
[0024] The electronic device provided by the embodiment of the present application has at least the following technical effects:
[0025] Since it includes a radiator, a conductive member, and a magnetic loss structure, the magnetic loss structure is provided at a position corresponding to the magnetic field strong point of the conductive structure, and along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure is greater than 0. Therefore, when the electromagnetic wave radiated by the radiator excites a standing wave on the conductive structure of the conductive member, the magnetic loss structure can convert the standing wave into heat energy, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator increases, thereby making the overall intensity of the standing wave gradually weaken as the distance from the radiator increases, and further shortening the propagation distance of the standing wave, effectively improving the interference problem caused by the standing wave to other functional components of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is a three-dimensional assembly diagram of the electronic device provided by the embodiment of the present application;
[0027] Figure 2 is Figure 1 a three-dimensional exploded view of the electronic device shown;
[0028] Figure 3 is Figure 1 a three-dimensional view of the bracket in the electronic device shown;
[0029] Figure 4 is Figure 1 a model diagram of the conductive structure, radiator, and magnetic loss structure of the conductive member in the electronic device shown;
[0030] Figure 5 is a simulation schematic diagram of the antenna - MIPI (Mobile Industry Processor Interface) isolation degree in a traditional electronic device;
[0031] Figure 6 is a simulation schematic diagram of the electric field distribution and magnetic field distribution on the conductive structure in a traditional electronic device;
[0032] Figure 7 is a simulation schematic diagram of the energy loss distribution of the conductive structure in different order modes in the electronic device provided by the embodiment of the present application;
[0033] Figure 8 In (a) of
[0034] Figure 8 is a magnetic field distribution diagram on the conductive structure of a traditional electronic device;
[0035] Figure 9To place the magnetic loss structure at Figure 4 Antenna-MIPI isolation degree comparison diagram of different positions of the conductive structure shown;
[0036] Figure 10 Is the magnetic field and electric field distribution diagram when the magnetic loss structure is placed at the dotted line position of the conductive structure (the radiation body is at the strong magnetic field point of the 5.73 GHz radio frequency mode);
[0037] Figure 11 Is to Figure 4 Magnetic field and electric field distribution diagram when the magnetic loss structure shown is placed at the dotted line position of the conductive structure (the position of the weak magnetic field point of the 4.4 GHz radio frequency mode of the emitter);
[0038] Figure 12 Is Figure 10 And Figure 11 Corresponding antenna-MIPI isolation degree comparison diagram;
[0039] Figure 13 Is Figure 4 Schematic diagram of the antenna-MIPI isolation degree when the real part of the magnetic permeability of the magnetic loss structure in the X direction in the electronic device shown is 2 and the tangent of the loss angle is 10;
[0040] Figure 14 Is Figure 4 Schematic diagram of the antenna-MIPI isolation degree when the real part of the magnetic permeability of the magnetic loss structure in the Y direction in the electronic device shown is 2 and the tangent of the loss angle is 10;
[0041] Figure 15 Is Figure 4 Schematic diagram of the antenna-MIPI isolation degree when the real part of the magnetic permeability of the magnetic loss structure in the Z direction in the electronic device shown is 2 and the tangent of the loss angle is 10;
[0042] Figure 16 Is Figure 4 Schematic diagram of the antenna-MIPI isolation degree when the imaginary parts of the magnetic permeability of the magnetic loss structure in the X direction in the electronic device shown are 0, 1, 2, 6, and 12 respectively;
[0043] Figure 17 Is Figure 1 Three-dimensional view of the decorative part in the electronic device shown;
[0044] Figure 18 Is Figure 1 Three-dimensional view of the camera module in the electronic device shown;
[0045] Figure 19 Is Figure 1 Three-dimensional view of another perspective of the electronic device shown;
[0046] Figure 20Another perspective of the exploded perspective view of the electronic device shown in Figure 1 . Figure 1
[0047] Among them, the reference numerals in the figure are as follows:
[0048] 100, electronic device;
[0049] 10, radiator;
[0050] 20, conductive member;
[0051] 201, bracket; 202, decorative member; 203, housing; 2031, rear cover; 2032, middle frame; 204, circuit board; 205, screen;
[0052] 21, conductive structure;
[0053] 30, magnetic loss structure;
[0054] 40, camera assembly;
[0055] 200, magnetic field strong point. Detailed implementation manners
[0056] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application and should not be construed as a limitation to the present application.
[0057] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0058] The terms "first", "second", "third", "fourth", etc. are only used for distinguishing descriptions and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. For example, the first pushing part and the second pushing part are only for distinguishing different pushing parts, and do not limit their order. The first pushing part can also be named the second pushing part, and the second pushing part can also be named the first pushing part without departing from the scope of the described embodiments. And the terms "first", "second", "third", "fourth", etc. do not limit that the indicated features must be different.
[0059] In this application, unless otherwise clearly defined or limited, terms such as "connected" and "coupled" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0060] In this application, "and / or" is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally indicates that the associated objects before and after are in an "or" relationship.
[0061] It should be noted that in this application, words such as "in one embodiment", "exemplarily", and "for example" are used to give examples, illustrations, or explanations. Any embodiment or design solution described as "in one embodiment", "exemplarily", or "for example" in this application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, the use of words such as "in one embodiment", "exemplarily", and "for example" aims to present relevant concepts in a specific manner.
[0062] In order to make the purpose, technical solution, and advantages of this application clearer, the following further details this application in combination with the accompanying drawings and embodiments.
[0063] During the use of traditional electronic devices, since the antenna and various functional components are all arranged inside the electronic device, the problem of interference of functional components caused by the signal emitted by the antenna occurs more and more frequently, greatly affecting the user experience. Among them, the functional components are camera components, microphones, speakers, antennas, screens, motherboards, etc.
[0064] The electronic device is also provided with conductive components such as brackets, motherboards, decorative parts (Deco), heat sinks, shielding covers, circuit boards, housings, and screens. When the antenna emits a radio frequency signal, the wavelength of the electromagnetic wave radiated by it corresponds to the size of the conductive structure of the conductive component. For example, when the size of the conductive structure of the conductive component is equal to or close to 1 / 4 or 1 / 2 of the wavelength of the electromagnetic wave, the conductive structure couples the electromagnetic wave radiated by the antenna, so that standing waves are generated in the conductive structures of these conductive components.
[0065] A standing wave includes a changing magnetic field and a changing electric field. There are strong electric field points / strong magnetic field points in the propagation direction of the standing wave, and the conductive structure has positions corresponding to the strong electric field points / strong magnetic field points, resulting in a very strong near-field coupling easily occurring between the conductive structure corresponding to the strong electric field points / strong magnetic field points and the functional components, which will further cause problems of interference to other functional components in the electronic device.
[0066] In view of this, an embodiment of the present application provides an electronic device that can improve the above technical problems.
[0067] The electronic device provided by the embodiment of the present application can be an electronic device with an antenna such as a mobile phone, a tablet computer, a wearable device (such as a watch), a personal digital assistant (PDA), a notebook computer, an augmented reality (AR) / virtual reality (VR) device, a vehicle-mounted device, etc., but is not limited thereto. In the embodiment of the present application, the electronic device is taken as a mobile phone as an example for introduction and description.
[0068] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , Figure 1 is a three-dimensional assembly diagram of the electronic device 100 provided by the embodiment of the present application, Figure 2 is Figure 1 the three-dimensional exploded view of the electronic device 100 shown in Figure 3 is Figure 1 the three-dimensional view of the bracket 201 in the electronic device 100 shown in Figure 4 is Figure 1 the model diagram of the radiator 10, the conductive structure 21 of the conductive member 20, and the magnetic loss structure 30 in the electronic device 100 shown in Figure 3 in, the bracket 201 is the conductive member 20.
[0069] In a first aspect, an embodiment of the present application provides an electronic device 100, and the electronic device 100 includes a radiator 10, a conductive member 20, and a magnetic loss structure 30.
[0070] The radiator 10 is a communication antenna on the electronic device 100, and is used to receive and send electromagnetic waves. These electromagnetic waves can be used to transmit signals such as voice, data, and images. For example, the radiator 10 can be a 5G WIFI antenna or a 5G N78 antenna, etc. The radiator 10 can radiate electromagnetic waves of multiple frequency bands.
[0071] Specifically, the radiator 10 can be integrated into the housing 203 of the electronic device 100. For example, the radiator 10 can be integrally formed in the middle frame 2032 of the housing 203, which can better protect the antenna and avoid interference from other components to the radiator 10, thereby improving the signal reception quality. In addition, the middle frame 2032 can also provide better support and fixation for the antenna. Integrating the radiator 10 into the middle frame 2032 of the housing 203 can improve the integrity and aesthetics of the mobile phone. At least part of the frame of the middle frame 2032 of the housing 203 can serve as the radiator 10.
[0072] The conductive member 20 includes a conductive structure 21.
[0073] The material of the conductive structure 21 can be metal or other materials with conductivity. A part of the conductive member 20 is the conductive structure 21. Alternatively, the entire conductive member 20 is the conductive structure 21.
[0074] The radiator 10 and the conductive structure 21 are arranged adjacent to each other. The electromagnetic wave radiated by the radiator 10 can excite a standing wave propagating in the first direction on the conductive structure 21. The standing wave has multiple magnetic field intensity points, and the multiple magnetic field intensity points are spaced apart in the first direction.
[0075] Among them, the distance between the radiator 10 and the conductive structure 21 can be less than or equal to 30 mm, such as 3 mm, 8 mm, 15 mm, 22 mm, 26 mm or 30 mm, etc.
[0076] It can be understood that when the size of the conductive structure 21 of the conductive member 20 is within the electrical size range of the standing wave mode of the antenna radio frequency band on the electronic device 100, that is, when the antenna is in some radio frequency bands, the wavelength of the electromagnetic wave (radio frequency) emitted by it corresponds to the size of the conductive structure 21. For example, when the size of the conductive structure 21 is equal to or close to 1 / 4 or 1 / 2 of the wavelength of the electromagnetic wave, the conductive structure 21 couples the electromagnetic wave radiated by the antenna, and a standing wave is generated in the conductive structure 21. At the same time, since the standing wave includes a changing magnetic field and a changing electric field, and there are electric field intensity points / magnetic field intensity points in the propagation direction of the standing wave, and the conductive member 20 has positions corresponding to the electric field intensity points / magnetic field intensity points, it is very easy to occur extremely strong near-field coupling between the conductive structure 21 corresponding to the electric field intensity points / magnetic field intensity points and the functional components of the electronic device 100, resulting in interference problems of the functional components.
[0077] A magnetic loss structure 30 is provided at the part of the conductive structure 21 corresponding to the magnetic field intensity point; along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure 30 is greater than 0.
[0078] A magnetic loss structure 30 is provided at a position corresponding to a magnetic field strong point of the conductive structure 21. That is, multiple magnetic loss structures 30 can be provided. The conductive structure 21 has multiple positions corresponding to multiple magnetic field strong points, and each position is provided with a magnetic loss structure 30. Or, the conductive structure 21 has multiple positions corresponding to multiple magnetic field strong points, and at least one position is provided with a magnetic loss structure 30. The material of the magnetic loss structure 30 is a magnetic loss material.
[0079] The magnetic loss structure 30 and the conductive structure 21 can be connected by bonding, clamping, welding or fastening connection. The fasteners can be bolts, screws or buckles, etc. Or, the magnetic loss structure 30 is vapor-deposited on the conductive structure 21, that is, a magnetic loss material is directly vapor-deposited on the conductive structure 21, so that the magnetic loss material forms the magnetic loss structure 30.
[0080] The imaginary part of the magnetic permeability represents the loss property of the magnetic material. It describes the absorption ability of the magnetic loss material to the magnetic field. Specifically, it means that the magnetic field will be absorbed in the magnetic loss material, and the energy of the magnetic field will be converted in the magnetic material. The magnitude of the imaginary part determines the absorption degree of the magnetic loss material to the magnetic field. A larger imaginary part means a stronger absorption ability of the magnetic loss material to the magnetic field.
[0081] Specifically, the magnetic loss structure 30 can be provided on one surface of the conductive structure 21 where the standing wave is located. When standing waves are generated on the surfaces of the conductive structure 21, the magnetic loss structure 30 covers the conductive structure 21.
[0082] For example, please refer to Figure 4 , in this embodiment, the electromagnetic wave radiated by the radiator 10 can excite a standing wave propagating in the first direction on the conductive structure 21 of the conductive member 20. The first direction is, for example, Figure 4 the Y direction in Figure 4 . The magnetic field direction of the standing wave is parallel to Figure 4 the X direction in
[0083] The standing wave has multiple magnetic field strong points, and all the magnetic field strong points are spaced apart in the first direction. Multiple positions of the conductive structure 21 corresponding to the multiple magnetic field strong points are all provided with magnetic loss structures 30.
[0084] Among them, the carbon-based wave-absorbing material can be at least one of graphene, graphite, carbon black, carbon fiber, and carbon nanotubes; the iron-based wave-absorbing material is at least one of ferrite, magnetic iron nanomaterials, iron hydroxide, iron carbonyl, and FeSiAl (FeSiAl); the ceramic wave-absorbing material is at least one of silicon carbide, magnesium oxide, and silicon nitride. The magnetic loss material can absorb electromagnetic wave energy and convert it into heat energy.
[0085] It can be understood that when manufacturing the magnetic loss structure 30 using the magnetic loss material, it is only necessary to ensure that the imaginary part of the magnetic permeability of the magnetic loss structure 30 is greater than 0 in the magnetic field direction of the standing wave (i.e., Figure 4 the direction parallel to the X direction in ) and there is no requirement for the imaginary part of the magnetic permeability of the magnetic loss structure 30 in other directions. In this way, it is convenient to manufacture the magnetic loss structure 30.
[0086] Among them, along the first direction, as the distance from the radiator 10 increases, that is, as it gradually moves away from the radiator 10, the magnetic field strength of the standing wave gradually weakens, so that the overall strength of the standing wave gradually weakens as the distance from the radiator 10 increases, and further shortens the propagation distance of the standing wave, effectively improving the interference problem caused by the standing wave to the functional components.
[0087] It can be understood that overall, since part of the energy of the standing wave is converted into heat energy by the magnetic loss material, the overall strength of the standing wave gradually weakens as the distance from the radiator 10 increases, and further shortens the propagation distance of the standing wave, effectively improving the interference problem caused by the standing wave to the functional components.
[0088] As can be seen from the above, for the electronic device 100 provided by the embodiment of the present application, since it includes a radiator 10, a conductive member 20, and a magnetic loss structure 30, the magnetic loss structure 30 is provided at the part of the conductive structure 21 corresponding to the strong magnetic field point, and along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure 30 is greater than 0. Therefore, when the electromagnetic wave radiated by the radiator 10 excites a standing wave on the conductive structure 21 of the conductive member 20, the magnetic loss structure 30 can convert the standing wave into heat energy, so that the magnetic field strength of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby making the overall strength of the standing wave gradually weaken as the distance from the radiator 10 increases, and further shortening the propagation distance of the standing wave, effectively improving the interference problem caused by the standing wave to other functional components of the electronic device 100.
[0089] In the traditional electronic device 100, when the functional component in the electronic device 100 is the camera component 40, the standing wave generated on the conductive structure 21 includes a changing magnetic field and a changing electric field. There are electric field strong points / magnetic field strong points in the propagation direction of the standing wave. The conductive structure 21 has positions corresponding to the electric field strong points / magnetic field strong points, resulting in extremely strong near-field coupling easily occurring between the conductive member 20 corresponding to the electric field strong point / magnetic field strong point and the camera component 40. The electromagnetic wave electric field / magnetic field carrying the image information signal on the MIPI line of the camera component 40 and the electric field / magnetic field of the standing wave will be superimposed on each other to form a superimposed signal. When the superimposed signal is transmitted to the SoC (System on Chip) for demodulation, the SoC cannot demodulate the superimposed signal, which will cause interference problems of the camera component 40.
[0090] To solve the above problems, in this embodiment, the electronic device 100 further includes a camera component 40, and the conductive structure 21 is located between the radiator 10 and the camera component 40.
[0091] With such a setting, when the electromagnetic wave radiated by the radiator 10 excites a standing wave on the conductive structure 21 that propagates in the first direction and has multiple spaced magnetic field strong points, the magnetic loss structure 30 can convert part of the standing wave into heat energy, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases. Thus, the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and further the propagation distance of the standing wave is shortened, effectively improving the interference problem caused by the standing wave to the camera component 40.
[0092] The electronic device 100 provided by the embodiment of the present application can achieve efficient decoupling between the camera component 40 and the radiator 10, thereby solving the anti-interference problem of the camera component 40; compared with the traditional grounding methods such as pasting conductive cloth and conductive foam required for grounding, the anti-interference structure provided by the embodiment of the present application can save space and avoid problems such as RSE (Radiated Spurious Emiss); the anti-interference structure provided by the embodiment of the present application is applicable to the decoupling problem of any frequency band without the defect of frequency band limitation; the anti-interference structure provided by the embodiment of the present application is also beneficial for solving the antenna clutter problem.
[0093] It can be understood that the conductive structure 21 is located between the radiator 10 and the imaging component 40. That is, the conductive structure 21 is not necessarily located on the line connecting the radiator 10 and the imaging component 40. The conductive structure 21 can be located in any space between the radiator 10 and the imaging component 40. For example, the radiator 10 defines a first plane (not shown in the figure), and the imaging component 40 defines a second plane (not shown in the figure). Both the first plane and the second plane are perpendicular to the first direction. Then the conductive structure 21 is located in the space between the first plane and the second plane, and the first direction is the direction from the conductive member 20 to the imaging component 40.
[0094] Please continue to refer to Figure 2 、 Figure 3 and Figure 4 , in some of these embodiments, along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure 30 is greater than 2.
[0095] By adopting the above solution, the magnetic loss structure 30 can convert a relatively large part of the standing wave into heat energy, so that the magnetic field strength of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall strength of the standing wave gradually weakens as the distance from the radiator 10 increases. Furthermore, the propagation distance of the standing wave is shortened, and the interference problem of the standing wave on the functional components is further improved.
[0096] Please refer to Figure 2 、 Figure 3 and Figure 4 , in some of these embodiments, along the magnetic field direction of the standing wave, the length of the magnetic loss structure 30 is greater than or equal to one-third of the length of the conductive structure 21.
[0097] By adopting the above solution, the magnetic loss structure 30 can convert a relatively large part of the standing wave into heat energy, so that the magnetic field strength of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall strength of the standing wave gradually weakens as the distance from the radiator 10 increases. Furthermore, the propagation distance of the standing wave is shortened.
[0098] It can be understood that as an electromagnetic wave, the overall strength of the standing wave is determined by its own energy size, and the energy size of the electromagnetic wave is determined by the Poynting vector, that is, S = E × H, where S is the Poynting vector, E is the electric field strength, and H is the magnetic field strength. Therefore, when the magnetic loss structure 30 converts a relatively large part of the standing wave into heat energy, so that the magnetic field strength of the standing wave gradually weakens as the distance from the radiator 10 increases, the overall strength of the standing wave will also gradually weaken as the distance from the radiator 10 increases, and further shorten the propagation distance of the standing wave.
[0099] Optionally, along the magnetic field direction of the standing wave, the length of the conductive structure 21 is less than or equal to 3 mm, and the length of the magnetic loss structure 30 is greater than or equal to 1 mm. With such a setting, a larger part of the standing wave can be converted into heat energy by the magnetic loss structure 30, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0100] For example, in the magnetic field direction of the standing wave, the size of the conductive structure 21 is equal to 3 mm, and the size of the magnetic loss structure 30 is equal to 1 mm or 1.2 mm, etc.; or, in the magnetic field direction of the standing wave, the size of the conductive structure 21 is equal to 6 mm, and the size of the magnetic loss structure 30 is equal to 2 mm or 2.5 mm, etc.; or, in the magnetic field direction of the standing wave, the size of the conductive structure 21 is equal to 2 mm, and the size of the magnetic loss structure 30 is equal to 0.7 mm or 0.8 mm, etc.
[0101] Optionally, the electromagnetic wave radiated by the radiator 10 can excite a standing wave propagating in the first direction on the first surface of the conductive structure 21. The magnetic loss structure 30 is located on the first surface of the conductive structure 21, and the first surface is the surface of the conductive structure 21 close to the screen 205 of the electronic device 100. With such a setting, a larger part of the standing wave generated on the first surface can be converted into heat energy by the magnetic loss structure 30, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0102] Since the magnetic field has a certain range, in order to convert a larger part of the standing wave into heat energy, the thickness of the magnetic loss structure 30 in the direction perpendicular to the first surface is less than or equal to 2 mm. With such a setting, a larger part of the standing wave generated on the first surface can be converted into heat energy by the magnetic loss structure 30, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0103] In this embodiment, the electromagnetic wave radiated by the radiator 10 can excite a standing wave propagating in the first direction on the second surface of the conductive structure 21. The magnetic loss structure 30 is located on the second surface of the conductive structure 21, and the second surface is the surface of the conductive structure 21 close to the back cover 2031 of the electronic device 100. Such a setting can enable the magnetic loss structure 30 to convert a larger part of the standing wave generated on the second surface into heat energy, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0104] Since the magnetic field has a certain range, in order to convert a larger part of the standing wave into heat energy, the thickness of the magnetic loss structure 30 in the direction perpendicular to the second surface is less than or equal to 2 mm. Such a setting can enable the magnetic loss structure 30 to convert a larger part of the standing wave generated on the second surface into heat energy, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0105] Exemplarily, when the electronic device is placed on a table with the screen of the electronic device facing up, the first surface is the upper surface of the conductive structure 21, and the second surface is the lower surface of the conductive structure 21. Along the vertical direction, the distance between the magnetic loss structure 30 and the first surface is less than or equal to 2 mm, and the distance between the magnetic loss structure 30 and the second surface is less than or equal to 2 mm.
[0106] Please refer to Figure 2 、 Figure 3 and Figure 4 , in some of these embodiments, the magnetic loss structure 30 covers the conductive structure 21.
[0107] By adopting the above solution, when standing waves are generated on all surfaces of the conductive structure 21, a larger part of the standing wave can be converted into heat energy by the magnetic loss structure 30, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0108] Please refer to Figure 5 , Figure 5 is a simulation schematic diagram of the antenna-MIPI (Mobile Industry Processor Interface) isolation in the traditional electronic device 100. The magnetic loss structure 30 is not provided in the relevant structure of the traditional electronic device 100, that is Figure 5 For Figure 4The corresponding structural model after removing the magnetic loss structure 30 in the anti-interference structure in, according to Figure 5 The simulation schematic diagram of the antenna-MIPI isolation obtained from the corresponding structural model. Figure 5 In, the conductive member 20 is the bracket 201.
[0109] Figure 5 The corresponding structural model is simulated by the finite-difference time-domain method, the simulation frequency range is 0GHz - 7GHz, and the simulation boundary condition is the open boundary condition. Figure 5 The corresponding structural model includes the camera component 40 and its internal refined wiring, the bracket 201, and the antenna. And port 1 is set at the connection between the antenna and the RF path, port 2 is set between the MIPI wiring and the ground, and the internal resistances of port 1 and port 2 are both set to 50 ohms because the input impedance of both the MIPI wiring and the RF wiring is 50 ohms in the actual scenario.
[0110] From Figure 5 It can be seen that by calculating the antenna-MIPI isolation, when the frequencies of the standing waves excited by the electromagnetic waves radiated by the radiator 10 on the conductive structure 21 of the conductive member 20 are 1.98Ghz, 3.14Ghz, 4.41Ghz, and 5.73Ghz respectively, the antenna-MIPI isolation is poor, which easily leads to the problem of interference to the camera component 40.
[0111] Please refer to Figure 6 , Figure 6 is the simulation schematic diagram of the electric field distribution and magnetic field distribution on the conductive structure 21 of the conductive member 20 in the traditional electronic device 100. From bottom to top, they are the fundamental mode to the higher-order modes, corresponding to the peak frequency points of the isolation from low frequency to high frequency respectively.
[0112] From Figure 6It can be seen that for the relevant frequency points with poor isolation at 1.98 Ghz, 3.14 Ghz, 4.41 Ghz, and 5.73 Ghz, the field distribution of the standing wave shows a stable alternating distribution of strong and weak points of the electric field / magnetic field, indicating that the main physical mechanism of the relevant frequency points with poor isolation is the excitation of the standing wave mode of the conductive structure 21. Compared with the non-standing wave mode state, the strong magnetic field points of the standing wave will greatly enhance the near-field coupling between the conductive structure 21 and the imaging component 40. The characteristics of this standing wave mode are: when the radiator 10 emits a radio frequency signal, the wavelength of the electromagnetic wave radiated by it corresponds to the size of the conductive structure 21. When the size of the conductive structure 21 is equal to or close to 1 / 4 or 1 / 2 of the wavelength of the electromagnetic wave, the conductive structure 21 couples the electromagnetic wave radiated by the radiator 10, causing standing waves to be generated in these conductive structures 21. The standing wave includes a changing magnetic field and a changing electric field, and there will be an alternating distribution of strong and weak magnetic field positions on the conductive structure 21, and the magnetic field direction is along the width direction of the conductive structure 21 (parallel to Figure 4 the X direction in
[0113] Please refer to Figure 7 , Figure 7 which is a schematic diagram of the energy loss distribution simulation of the conductive structure 21 in the electronic device 100 provided by the embodiment of the present application in different order modes.
[0114] From Figure 7 it can be seen that after the magnetic loss structure 30 is provided at the part of the conductive structure 21 corresponding to the strong magnetic field point, the magnetic loss structure 30 converts the standing wave into heat energy. As Figure 7 shown, for the energy loss distributions of different order modes, their distribution positions are consistent with the positions of the strong magnetic field points of the standing wave, rather than being evenly distributed. That is to say, the heat effect position of the magnetic loss structure 30 is consistent with the position of the strong magnetic field point of the standing wave.
[0115] Please refer to Figure 8 in (a) of Figure 8 and Figure 8 in (b) of Figure 8 . (a) in
[0116] is the magnetic field distribution diagram on the conductive structure 21 in the traditional electronic device 100, Figure 8 and (b) in Figure 8In (b) thereof, the conductive member 20 is the bracket 201. The radiator 10 is located on the right side of the conductive member 20, the imaging assembly 40 is located on the left side of the conductive member 20, the first direction is the direction from the conductive member 20 to the imaging assembly 40, the main board is located below the conductive member 20. A magnetic loss structure 30 is provided at a portion of the conductive structure 21 of the bracket 201 corresponding to the magnetic field intensity strong point 200. The magnetic loss structure 30 is provided on the surface of the conductive structure 21 facing the main board, that is, the magnetic loss structure 30 is provided on the lower surface of the conductive structure 21.
[0117] In Figure 8 in (a) and Figure 8 in (b) thereof, the shade of the color in the magnetic field intensity strong point 200 region represents the magnitude of the magnetic field intensity. The darker the color, the greater the magnetic field intensity, and the lighter the color, the smaller the magnetic field intensity.
[0118] From Figure 8 in (a) and Figure 8 in (b) thereof, it can be seen that, compared with the traditional conductive structure 21 without the magnetic loss structure 30, after the magnetic loss structure 30 is provided at the portion of the conductive structure 21 corresponding to the magnetic field intensity strong point 200, due to the loss effect of the magnetic loss structure 30, the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases. In Figure 8 in (b) thereof, it is manifested as the color of the magnetic field intensity strong point 200 region becoming lighter, and the overall intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave.
[0119] Please refer to Figure 9 , Figure 9 which is a comparison diagram of the antenna-MIPI isolation degree when the magnetic loss structure 30 is provided at different positions of the conductive structure 21 shown in Figure 4 .
[0120] From Figure 9 it can be seen that the standing wave is formed on the lower surface of the conductive structure 21. If the magnetic loss structure 30 is provided on the lower surface of the conductive structure 21, there is an isolation degree improvement effect of more than 10 dB on the standing wave frequency point position with poor isolation degree (shown by the dotted line isolation degree). If the magnetic loss structure 30 is only provided on the upper surface of the conductive structure 21, that is, at a position far from the magnetic field formed by the standing wave, there is no effect (shown by the solid line isolation degree). Of course, for the scenario where the standing wave is formed on the upper surface of the conductive structure 21, the magnetic loss structure 30 needs to be provided on the upper surface of the conductive structure 21 to be effective, that is, the magnetic loss structure 30 needs to be placed in the magnetic field of the standing wave excited on the upper surface of the conductive structure 21.
[0121] Please refer to Figure 10 , Figure 11 and Figure 12 , Figure 10It is the magnetic field and electric field distribution diagrams when the magnetic loss structure 30 is placed at the dotted line position of the conductive structure 21 (the strong magnetic field point of the standing wave when the frequency of the standing wave is 5.73 GHz). The radiation body 10 being in the 5.73 GHz radio frequency mode means that the frequency of the standing wave excited by the electromagnetic wave radiated by the radiation body 10 on the conductive structure 21 is 5.73 GHz. Figure 11 It is to Figure 4 The magnetic field and electric field distribution diagrams when the magnetic loss structure 30 in the shown anti-interference structure is placed at the dotted line position of the conductive structure 21 (the weak magnetic field position of the standing wave when the frequency of the standing wave is 4.4 GHz). Figure 12 It is Figure 10 and Figure 11 The comparison diagram of the antenna-MIPI isolation corresponding to it.
[0122] In Figure 10 When the magnetic loss structure 30 is set at the position corresponding to the dotted line on the conductive structure 21, the position corresponding to the dotted line is also the strong magnetic field point of the standing wave when the frequency of the standing wave is 5.73 GHz, and it is also the weak magnetic field position of the standing wave when the frequency of the standing wave is 4.4 GHz.
[0123] In Figure 11 When the magnetic loss structure 30 is set at the position corresponding to the solid line on the conductive structure 21, the position corresponding to the solid line is also the weak magnetic field point of the standing wave when the frequency of the standing wave is 5.73 GHz, and it is also the strong magnetic field position of the standing wave when the frequency of the standing wave is 4.4 GHz.
[0124] From Figure 12 it can be seen that when the magnetic loss structure 30 is set at the position corresponding to the dotted line on the conductive structure 21, the isolation of the standing wave with a frequency of 5.73 GHz is improved more (as shown by the solid line in Figure 12 ), and when the magnetic loss structure 30 is set at the position corresponding to the solid line on the conductive structure 21, the isolation of the standing wave with a frequency of 5.73 GHz is improved more (as shown by the solid line in Figure 12 ).
[0125] Therefore, setting the magnetic loss structure 30 at the part corresponding to the strong magnetic field point of the conductive structure 21 will have a great loss effect on the standing wave. The loss effect means that the magnetic loss structure 30 can convert part of the standing wave into heat energy, so that the magnetic field strength of the standing wave gradually weakens as the distance from the radiation body 10 increases, and thus the overall strength of the standing wave gradually weakens as the distance from the radiation body 10 increases, and the isolation at the 4.41 GHz frequency point is improved greatly. On the contrary, the loss effect is small.
[0126] Please refer to Figure 13 、 Figure 14 and Figure 15 , Figure 13 It is Figure 4Schematic diagram of the antenna-MIPI isolation degree where the real part of the magnetic permeability of the magnetic loss structure 30 in the electronic device 100 shown in the X direction is 2 and the tangent of the loss angle is 10 Figure 14 is Figure 4 Schematic diagram of the antenna-MIPI isolation degree where the real part of the magnetic permeability of the magnetic loss structure 30 in the electronic device 100 shown in the Y direction is 2 and the tangent of the loss angle is 10 Figure 15 is Figure 4 Schematic diagram of the antenna-MIPI isolation degree where the real part of the magnetic permeability of the magnetic loss structure 30 in the electronic device 100 shown in the Z direction is 2 and the tangent of the loss angle is 10
[0127] By comparing Figure 13 、 Figure 14 and Figure 15 it can be seen that by setting the imaginary part of the magnetic permeability of the magnetic loss structure 30 to be anisotropic (where the X direction is the magnetic field direction of the standing wave), as Figure 15 shown, the magnetic loss structure 30 needs to ensure that the imaginary part of the magnetic permeability in the magnetic field direction is greater than or equal to 2 to achieve a higher isolation degree gain. In the embodiment of the present application, in the magnetic field direction, it is the width direction of the conductive structure 21, and only in other directions, setting the imaginary part of the magnetic permeability of the magnetic loss structure 30 to 2 has no effect
[0128] Please refer to Figure 16 , Figure 16 is Figure 4 Schematic diagram of the antenna-MIPI isolation degree when the imaginary parts of the magnetic permeability of the magnetic loss structure 30 in the electronic device 100 shown in the X direction are 0, 1, 2, 6, 12 (corresponding to the data curves arranged from top to bottom in sequence)
[0129] From Figure 16 it can be seen that using a material with a high imaginary part of the magnetic permeability for the magnetic loss structure 30 can improve the isolation degree at the frequency points of the standing wave mode by 15 - 30 dB. As the imaginary part of the magnetic permeability increases, the improvement degree of the anti-interference isolation degree increases, and generally it needs to be greater than 2 to have an obvious effect
[0130] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 , Figure 17 is Figure 1 Three-dimensional view of the decorative part 202 in the electronic device 100 shown Figure 18 is Figure 1 Three-dimensional view of the camera assembly 40 in the electronic device 100 shown Figure 19 is Figure 1 Three-dimensional view of another perspective of the electronic device 100 shown Figure 20Another perspective exploded perspective view of the electronic device 100 shown in Figure 1 . Figure 1 Shown in and
[0131] .
[0131] In some of these embodiments, the conductive member 20 is at least one of a bracket 201, a circuit board 204, a decoration member (Deco) 202, a heat sink, a shielding cover, a power supply, a housing 203, and a screen 205.
[0132] By adopting the above solution, when the electromagnetic wave radiated by the radiator 10 excites a standing wave that propagates in the first direction and has multiple magnetically strong points distributed at intervals on the conductive structure 21, the magnetic loss structure 30 can convert part of the standing wave into heat energy, so that the magnetic field intensity of the standing wave gradually weakens as the distance from the radiator 10 increases, thereby shortening the propagation distance of the standing wave and effectively improving the interference problem caused by the standing wave to the functional components.
[0133] Among them, the bracket 201 can be a structural member of the electronic device 100 for supporting and fixing components such as the screen 205, the main board, and the battery. The bracket 201 generally has precise dimensions and shapes to ensure the stability and reliability of the components of the electronic device 100.
[0134] The circuit board 204 can be the main board inside the electronic device 100 or the flexible circuit board 204 in the camera assembly 40. The main board is mainly composed of electronic components such as chips, transistors, capacitors, and resistors, and generally includes parts such as a processor, a memory, a storage, and a graphics card. The processor, as the core of the electronic device 100, is responsible for data processing and operation; the memory provides temporary storage space for storing running programs and data; the storage is used for long-term data storage; and the graphics card is responsible for image processing and display. Components such as a power management chip, an audio processing chip, a Bluetooth chip, and a WIFI chip can also be integrated on the main board.
[0135] The decoration member 202 can be made of a metal material and is disposed between the rear camera assembly 40 and the rear cover 2031 of the housing 203 for protecting the rear camera assembly 40 and at the same time achieving a metal decoration effect.
[0136] The heat sink is a heat dissipation material inside the electronic device 100 for transferring the heat inside the electronic device 100 to the outside to maintain the normal operating temperature of the electronic device 100. The heat sink is generally made of graphite and has good heat conduction performance, which can evenly distribute the heat to a larger area, thereby effectively transferring the heat inside the electronic device 100 to the outside. It is generally used in high-heat areas such as the CPU (Central Processing Unit) and GPU (Graphics Processing Unit) of mobile phones to help these areas dissipate heat quickly.
[0137] The shielding cover is a device inside the electronic device 100 that prevents the interference electromagnetic field from spreading outwards. It is usually made of metal or conductive materials, which can prevent the electromagnetic interference inside the electronic device 100 from spreading outwards and also prevent the impact of external electromagnetic interference on the electronic device 100.
[0138] The power supply is used to provide power for the electronic device 100 to make it operate normally.
[0139] The housing 203 generally includes a middle frame 2032 and a rear cover 2031, which are used to form a space for accommodating various functional components of the electronic device 100.
[0140] The screen 205 is connected to the housing 203. The screen 205 and the rear cover 2031 are generally located on opposite sides of the middle frame 2032. The screen 205 is also called a display screen and is used to display images and colors.
[0141] It can be understood that the magnetic loss structure 30 can be provided on the support 201, the circuit board 204, the decorative member 202, the heat sink, the shielding cover, the power supply, the housing 203, and the screen 205; or, the magnetic loss structure 30 can be provided on one, two, or more of the support 201, the circuit board 204, the decorative member 202, the heat sink, the shielding cover, the power supply, the housing 203, and the screen 205. The support 201, the circuit board 204, the decorative member 202, the heat sink, the shielding cover, the power supply, the housing 203, and the screen 205 all have a conductive structure 21. The electromagnetic wave radiated by the radiator 10 can excite a standing wave on the conductive structure 21, but the direction of the standing wave is related to the type, size, and shape of the conductive member 20.
[0142] It should be noted that in the electronic device 100, the standing wave excited by the radiator 10 on the conductive structure 21 of the decorative member 202 is the first standing wave, and the first standing wave may also excite a second standing wave on the conductive structure 21 of the support 201. At this time, the magnetic loss structure 30 can be provided on both the conductive structure 21 of the decorative member 202 and the conductive structure 21 of the support 201.
[0143] It can be understood that components such as the camera module 40, the screen 205, the flexible PCB (Printed Circuit Board), and the power supply in the electronic device 100 also radiate electromagnetic waves. For example, the image information signal carried on the MIPI line of the camera module 40 propagates in the form of electromagnetic waves. The electromagnetic waves radiated by components such as the camera module 40, the screen 205, the flexible PCB, and the power supply may also excite standing waves on the conductive structure 21 of the conductive member 20, and the excited standing waves are coupled to the radiator 10, affecting the radiator 10's reception of electromagnetic waves from the base station, and deteriorating the receiving sensitivity of the antenna. The electronic device 100 provided by the embodiments of the present application can also be used to improve the interference problem of components such as the camera module 40, the screen 205, the flexible PCB, and the power supply that can radiate electromagnetic waves to the radiator 10, and its principle is the same as that of improving the interference problem of the camera module 40.
[0144] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application.
Claims
1. An electronic device, characterized in that, The electronic device includes a radiator, a conductive member, and a magnetic loss structure; The conductive member includes a conductive structure; The radiator and the conductive structure are arranged adjacent to each other. The electromagnetic wave radiated by the radiator can excite a standing wave propagating in a first direction on the conductive structure. The standing wave has multiple magnetic field intensity points, and the multiple magnetic field intensity points are spaced apart in the first direction; The magnetic loss structure is provided at a portion of the conductive structure corresponding to the magnetic field intensity point; along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure is greater than 0.
2. The electronic device according to claim 1, wherein The electronic device further includes a camera assembly, and the conductive structure is located between the radiator and the camera assembly.
3. The electronic device according to claim 1 or 2, characterized in that Along the magnetic field direction of the standing wave, the imaginary part of the magnetic permeability of the magnetic loss structure is greater than 2.
4. The electronic device according to claim 1 or 2, characterized in that, Along the magnetic field direction of the standing wave, the length of the magnetic loss structure is greater than or equal to one-third of the length of the conductive structure.
5. The electronic device according to claim 4, wherein Along the magnetic field direction of the standing wave, the length of the conductive structure is less than or equal to 3 mm, and the length of the magnetic loss structure is greater than or equal to 1 mm.
6. The electronic device according to claim 1, characterized in that, The electromagnetic wave radiated by the radiator can excite a standing wave propagating in a first direction on a first surface of the conductive structure. The magnetic loss structure is located on the first surface of the conductive structure, and the first surface is the surface of the conductive structure close to the screen side of the electronic device.
7. The electronic device according to claim 6, wherein The thickness of the magnetic loss structure in a direction perpendicular to the first surface is less than or equal to 2 mm.
8. The electronic device according to claim 1, characterized in that, The electromagnetic wave radiated by the radiator can excite a standing wave propagating in a first direction on a second surface of the conductive structure. The magnetic loss structure is located on the second surface of the conductive structure, and the second surface is the surface of the conductive structure close to the back cover side of the electronic device.
9. The electronic device according to claim 8, wherein The thickness of the magnetic loss structure in a direction perpendicular to the second surface is less than or equal to 2 mm.
10. The electronic device according to claim 1, characterized in that, The magnetic loss structure covers the conductive structure.
11. The electronic device according to claim 1, wherein The distance between the radiator and the conductive structure is less than or equal to 30 mm.
12. The electronic device according to any one of claims 1 to 11, characterized in that, The conductive member is at least one of a bracket, a circuit board, a decorative member, a heat sink, a shielding cover, a power supply, a housing, and a screen.
13. The electronic device according to any one of claims 1 to 11, characterized in that, The magnetic loss material is at least one of a carbon-based wave-absorbing material, an iron-based wave-absorbing material, and a ceramic wave-absorbing material.
14. The electronic device according to claim 13, wherein The carbon-based wave-absorbing material is at least one of graphene, graphite, carbon black, carbon fiber, and carbon nanotubes; the iron-based wave-absorbing material is at least one of ferrite, magnetic iron nanomaterials, iron hydroxide, iron carbonyl, and iron silicon aluminum; the ceramic wave-absorbing material is at least one of silicon carbide, magnesium oxide, and silicon nitride.
15. The electronic device according to any one of claims 1 to 11, characterized in that, The magnetic loss structure and the conductive structure are connected by bonding, clamping, welding, or fastening; or, the magnetic loss structure is evaporated on the conductive structure.