Diode chip high-temperature electricity resistance test equipment and use method

Abstract

The invention relates to the technical field of chip testing, in particular to diode chip high-temperature electricity resistance testing equipment and a using method.The diode chip high-temperature electricity resistance testing equipment comprises a testing cabinet internally provided with a chip mounting frame, a cabinet door is rotationally arranged on the front face of the testing cabinet, a top plate is fixedly arranged on the top in the testing cabinet, and a sliding frame with a groove is slidably connected to the top plate; a pull rod with a hook is arranged on the inner side of the cabinet door. According to the diode chip high-temperature electricity resistance test equipment and the use method, the mechanical linkage device automatically controls the rotation motion of the isolation cover, a dynamic thermal barrier is formed when the cabinet door is opened and closed, a high-temperature test area and an operation area are effectively separated, and respective temperature stability is kept; it is ensured that the high-temperature area is physically isolated all the time in the operation process, the risk that personnel make contact with the high-temperature surface is reduced, the system minimizes the heat loss area through precise positioning of the isolation hood, the heat energy supplement requirement during repeated testing is reduced, and the overall energy efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a high-temperature electric resistance testing device for diode chips and a using method thereof. Background Technique

[0002] As a core component in electronic components, the high-temperature electric resistance performance of diode chips directly affects the reliability of devices. During the chip manufacturing process, high-temperature and energized testing is required to simulate extreme working conditions to screen defective products. Most traditional testing devices adopt a closed high-temperature cavity structure, but there are the following technical bottlenecks in actual applications: Insufficient safety protection: The cabinet door locking mechanisms of existing devices are mostly manual operations, lacking dynamic interlocking with the testing state. During the testing process, if the cabinet door accidentally opens due to vibration or misoperation, high-temperature gases and electric arcs are likely to leak, posing serious risks of scalding and electrical safety hazards.

[0003] In view of this, we propose a high-temperature electric resistance testing device for diode chips and a using method thereof. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-temperature electric resistance testing device for diode chips and a using method thereof to solve the problem of insufficient safety protection mentioned in the above background technique. To achieve the above purpose, the present invention provides the following technical solution: A high-temperature electric resistance testing device for diode chips, including a testing cabinet with a chip mounting rack inside, and a cabinet door rotatably arranged on the front of the testing cabinet. A top plate is fixedly arranged on the inner top of the testing cabinet, and a sliding frame with a groove is slidably connected to the top plate. A pull rod with a hook is arranged on the inner side of the cabinet door, and the hook body at the end of the pull rod is slidably connected inside the sliding frame. When the cabinet door is opened outwards, the pull rod drives the sliding frame to displace. A rack is fixedly connected to the sliding frame, a gear is rotatably arranged on the top plate, and the axle of the gear penetrates through the top plate and is fixedly connected to a semi-cylindrical isolation cover. Sealing edges that fit the isolation cover are fixedly arranged on both sides of the inner wall of the testing cabinet.

[0005] Preferably, an L-shaped locking frame is fixedly arranged on the inner side of the cabinet door. A vertical sliding groove is opened on the inner side wall of the testing cabinet, and a card slot extends horizontally at the top end of the sliding groove. A locking pin is slidably connected in the card slot and the sliding groove. When the locking pin moves down along the sliding groove, it is caught in the locking frame to lock the cabinet door.

[0006] Card slots and sliding grooves are mirror-symmetrically arranged on the outer side wall of the testing cabinet, and a handle is slidably connected to the external card slots and sliding grooves. Magnetic blocks that are magnetically connected to each other are arranged on both the handle and the locking pin.

[0007] Preferably, an inner groove is formed in the door panel of the cabinet door, and the inner groove penetrates through the cabinet door and is aligned with the inner card slot. An inner plate is slidably connected in the inner groove, and the outer end of the inner plate is cut with an inclined opening. When the locking pin enters the card slot from the sliding groove, it squeezes the inner plate to slide inward along the inclined opening.

[0008] A through opening communicating with the inner groove is formed at the top of the cabinet door. One end of the pull rod is inserted into the through opening, and a bayonet is formed at the inserted end of the pull rod. A plug pin is fixedly connected to the inner end of the inner plate, and when the inner plate slides inward, the plug pin is inserted into the bayonet to lock the pull rod. An open notch is formed on the inner side of the cabinet door from the inner groove. An operating handle is fixedly connected to the surface of the inner plate along the notch. A spare operating opening is also formed on the outer part of the cabinet door in case the locking pin control fails.

[0009] Preferably, the rotation angle range of the isolation cover is 0° - 180°, and a complete sealed cavity is formed with the sealing edge in its closed state.

[0010] The displacement stroke of the sliding frame has a linear proportional relationship with the opening and closing angle of the cabinet door. By limiting the rotation range of the isolation cover to 0° - 180° and dynamically cooperating with the sealing edge, a reliable closure of the sealed cavity is achieved; the linear linkage design of the sliding frame stroke and the opening and closing angle of the cabinet door enables the opening and closing of the isolation cover to be synchronized with the movement of the cabinet door. When the isolation cover is closed, a complete sealed cavity is formed with the sealing edge, preventing heat leakage during high-temperature testing and ensuring the stability of the test environment. The linkage between the sliding frame and the cabinet door realizes an automated process of "opening the cover when opening the door, closing the cover when closing the door", simplifies the operation steps, and reduces human intervention.

[0011] Preferably, a multi-stage heating ring surrounding the chip mounting rack is provided inside the test cabinet and on the inner side of the isolation cover, and each stage of the heating ring is independently connected to a temperature control module.

[0012] A temperature sensor is embedded in the top plate, and its detection end extends into the inner cavity of the isolation cover.

[0013] The temperature control module dynamically adjusts the power of the heating ring according to the data fed back by the temperature sensor. By adopting a multi-stage independent temperature control heating ring and an embedded temperature sensor, zonal temperature monitoring and dynamic power adjustment are realized. The multi-stage heating ring can set gradient temperatures for different areas of the chip to simulate complex working conditions; the temperature control module adjusts the power in real time according to the sensor feedback to avoid local overheating, improve the temperature uniformity, and reduce test errors caused by uneven heat distribution, especially suitable for high-precision electrical endurance performance evaluation.

[0014] Preferably, an explosion-proof pressure relief valve is provided on the back of the test cabinet.

[0015] A pressure sensing film is embedded on the inner side of the isolation cover, and an audible and visual alarm is triggered when the air pressure in the cabinet exceeds 5 kPa.

[0016] The bottom of the top plate is provided with an emergency exhaust shutter linked to the isolation cover, which integrates a pressure safety protection mechanism, including a pressure relief valve, a pressure sensing film and an emergency exhaust system. The pressure relief valve automatically opens to release pressure when overpressure occurs to prevent equipment from bursting. The pressure film triggers an audible and visual alarm to remind emergency shutdown. The emergency exhaust shutter is linked to the isolation cover to quickly reduce the cavity temperature and air pressure when the pressure is abnormal to avoid chain failures, which complies with industrial explosion-proof standards.

[0017] Preferably, the chip mounting frame adopts a quick-release guide rail structure, and its contact terminals are electrically connected through spring pins. The quick-release guide rail and spring pin structure design optimizes chip installation and electrical connection. The guide rail structure supports "plug-in" installation of chips, which significantly improves test efficiency and is suitable for batch testing scenarios. The spring pins adapt to contact pressure to avoid poor contact caused by vibration or thermal expansion and contraction, ensuring stable test current.

[0018] A method for using a diode chip high temperature electrical resistance test device comprises the following steps: S1. After the chip is installed, close the cabinet door. The closed door panel pushes the locking pin in the card slot into the slide slot, causing it to slide down into the locking frame and lock the cabinet door so that it cannot be opened. The cabinet door can be opened only after the internal locking pin is pushed up by the external handle into the card slot and separated from the locking frame; S2. When the cabinet door is closed, the inner pull rod pushes the slide and rack to move, and drives the gear and isolation cover to rotate clockwise, so that the isolation cover cooperates with the sealing edge to separate the cabinet door from the high-temperature test area. When the cabinet door is opened, the isolation cover is controlled to reverse, and the mounting frame is exposed at the cabinet opening, so as to separate most of the high-temperature area from the open cabinet opening; S3. Before opening the cabinet door, unlock the locking pin and enter the slot according to the process. The locking pin will simultaneously squeeze the inner plate along the oblique opening and slide inward, so that the latch pin is inserted into the slot to lock the pull rod on the cabinet door. At this time, the cabinet door opens and drives the isolation cover to separate the space inside the cabinet. If the cabinet door is opened without operating the locking pin, the inner plate lacks the locking pin control and the pull rod will not be locked on the cabinet door. Therefore, when the cabinet door is opened illegally, the isolation cover will not open.

[0019] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, double protection is provided against accidental opening: when the cabinet door is closed, the locking pin is triggered to automatically fall into the L-shaped frame, forming a mechanical hard lock (the physical position is irreversible). Even if the equipment vibrates violently or the internal pressure changes suddenly (such as air pressure shock during testing), the cabinet door can be prevented from accidentally popping open, thereby avoiding safety accidents caused by leakage of high-temperature / high-pressure media.

[0020] Positive operation forced locking: The door closing action and the sliding down of the locking pin form a linkage relationship. The operator does not need to perform additional locking actions. Closing the cabinet door will automatically lock it, eliminating the risk of unlocking the door due to human negligence, and meeting the requirements of industrial equipment safety interlocking regulations.

[0021] In the present invention, the rotational movement of the isolation cover is automatically controlled by a mechanical linkage device, forming a dynamic thermal barrier when the cabinet door is opened or closed, effectively separating the high-temperature test area from the operation area, maintaining the temperature stability of each area, and the movement of the isolation cover is synchronously linked with the opening and closing of the cabinet door, ensuring that the high-temperature area is always physically isolated during the operation process, reducing the risk of personnel contacting the high-temperature surface. Through the precise positioning of the isolation cover, the system minimizes the heat dissipation area, reduces the demand for heat energy replenishment during repeated tests, and improves the overall energy efficiency.

[0022] In the present invention, the mechanical interlock system deeply integrates the operation process with the equipment safety protection through an innovative beveled guide design. When the operator unlocks the locking pin according to the standard process, the pin body moves precisely along the beveled groove, generating a radial component force synchronously during the axial advancement process, pushing the inner plate to complete the lateral positioning, and finally enabling the bolt to accurately embed into the drawbar bayonet, forming a triple mechanical constraint. This process establishes a closed-loop safety logic of "operation permission - mechanical response", ensuring that the opening actions of the isolation cover and the cabinet door are strictly synchronized. The system is specially designed with a fail-safe mechanism that automatically cuts off the transmission link in case of non-standard operations, maintaining the locked state of the isolation cover and effectively maintaining the integrity of the thermal seal. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional structure schematic diagram of the present invention; Figure 2 is a structure schematic diagram of the top plate of the present invention and the test cabinet; Figure 3 of the present invention Figure 2 is an enlarged view of part A in the present invention; Figure 4 is an exploded view of the carriage, drawbar, rack and gear of the present invention; Figure 5 is a structure schematic diagram of the test cabinet and the isolation cover of the present invention; Figure 6 is a three-dimensional structure sectional view of the test cabinet of the present invention; Figure 7 of the present invention Figure 6 is an enlarged view of part B in the present invention; Figure 8 is a three-dimensional structure sectional view of the cabinet door of the present invention; Figure 9 of the present invention Figure 8 is an enlarged view of part C in the present invention; Figure 10 is a structure schematic diagram of the cabinet door and the locking frame of the present invention; Figure 11 of the present invention Figure 10 is an enlarged view of part D in the present invention.

[0024] In the figure: 1. Test cabinet; 2. Mounting rack; 3. Cabinet door; 4. Top plate; 5. Sliding rack; 6. Pull rod; 7. Rack; 8. Gear; 9. Isolation cover; 10. Sealing edge; 11. Locking rack; 12. Chute; 13. Card slot; 14. Locking pin; 15. Handle; 16. Magnetic block; 17. Inner groove; 18. Bevel; 19. Inner plate; 20. Bolt; 21. Through hole; 22. Bayonet. Detailed implementation

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0026] Please refer to Figures 1 to 11 , the present invention provides a technical solution: a high-temperature electric resistance test device for diode chips Structural composition: 1. The main body of the test cabinet 1 It is internally provided with a chip mounting rack 2, and a rotating cabinet door 3 is configured on the front.

[0027] The top plate 4 is fixed inside the top, and the sliding rack 5 with grooves is slidably connected.

[0028] Sealing edges 10 made of high-temperature resistant silicone material that fit the isolation cover 9 are provided on both inner walls.

[0029] 2. Linkage isolation system A pull rod 6 with a hook is provided inside the cabinet door 3, and the hook body is slidably connected in the groove of the sliding rack 5.

[0030] The sliding rack 5 is fixed with a rack 7, and the axle of the gear 8 penetrates through the top plate 4 and is connected to the semi-cylindrical isolation cover 9.

[0031] When the cabinet door 3 is linked and closed, the inner pull rod 6 pushes the sliding rack 5 to move horizontally - the rack 7 drives the gear 8 to rotate clockwise - the isolation cover 9 covers the test area, forming a high-temperature isolation cavity with the sealing edge 10; when the cabinet door 3 is opened, it moves in the reverse direction, and the isolation cover 9 rotates and retracts, and the chip mounting rack 2 is exposed outside the cabinet opening. 3. Double locking mechanism An L-shaped locking rack 11 is fixed inside the cabinet door 3, and a vertical chute 12 and a horizontal card slot 13 are opened on the inner side wall of the test cabinet 1.

[0032] The locking pin 14 slides in the chute 12 / card slot 13, and the external handle 15 and the locking pin 14 are magnetically linked through the magnetic block 16.

[0033] When S1 locks the cabinet door 3 and closes it, the door panel presses the locking pin 14 and slides down along the slide slot 12 - the locking pin 14 is inserted into the L-shaped locking frame 11 to lock the cabinet door 3; the external handle 15 needs to be pushed up to drive the locking pin 14 into the slot 13 and disengage from the locking frame 11 before the door can be unlocked and opened. When S3 is unlocked, the locking pin 14 slides inward along the oblique opening 18 of the inner groove 17 of the cabinet door 3, pressing the inner plate 19 - the latch 20 of the inner plate 19 is inserted into the bayonet 22 of the pull rod 6, and the locking pull rod 6 moves synchronously with the cabinet door 3. 4. Safety redundancy design The inner groove 17 of the cabinet door 3 is slidably connected to the inner plate 19 with an oblique opening 18, and an operating handle and a spare operating opening are arranged at the end of the inner plate 19.

[0034] S3 Anti-misopening If the locking pin 14 is not unlocked according to the process and the latch 20 of the inner plate 19 is not triggered, the pull rod 6 and the slide 5 are disconnected when the cabinet door 3 is opened - the isolation cover 9 remains in a closed state to avoid exposure to the high temperature area. The isolation cover 9 and the sealing edge 10 form a physical isolation layer to reduce the risk of heat conduction.

[0035] Running a logic closed loop 1. Compliance Operations Close the cabinet door 3 - trigger the locking pin 14 to slide down and lock S1 - link the isolation cover 9 to close the test area S2 - when unlocking, the locking pin 14 synchronously locks the pull rod 6 S3 - after opening the door, the isolation cover 9 automatically separates the high temperature area.

[0036] 2. Tolerance for illegal operations The cabinet door 3 is opened forcibly - the pull rod 6 is separated from the slide 5 - the isolation cover 9 remains closed - the high temperature area protection does not fail. Example

[0037] 1. Equipment startup preparation Pre-check process: Check the lubrication status of the slide 12; Verify the magnetic attraction of the locking pin 14; The test isolation cover 9 is limited in rotation to 180°±2°.

[0038] Chip loading: Before opening the cabinet door 3, make sure that the handle 15 is in the unlocked position; Push the chip mounting rack 2 to the "LOAD" mark position; Do not directly touch metal parts in high temperature areas.

[0039] 2. Standard operating procedures Steps Operation Points Safety Check: 1. After the door is closed and locked, a "click" sound is heard, and the cabinet door 3 is manually pulled to verify that the locking pin 14 completely locks the cabinet door 3; 2. Confirm through the observation window that the isolation cover 9 completely covers the test area and there are no visible gaps in the sealing edge 10; 3. Unlock and open the door. First, push the handle 15 upwards to the limit point, and then pull the cabinet door 3. The isolation cover 9 should retract synchronously.

[0040] III. Abnormality handling Mechanical failure: When the cabinet door 3 is stuck: Manually reset the inner plate 19 through the spare operation port; When the isolation cover 9 stops rotating: Immediately cut off the power supply and use the cooling air pump.

[0041] Emergency unlocking: Use a special tool, an internal hexagon, to rotate the shaft of the emergency gear 8; After forced unlocking, the damaged sealing edge 10 needs to be replaced.

[0042] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A high-temperature electric tolerance testing device for diode chips, characterized in that, Comprising: A test cabinet (1) with a chip mounting rack (2) inside and a cabinet door (3) rotatably connected to the front; A top plate (4) fixedly arranged at the inner top of the test cabinet (1), and a grooved carriage (5) slidably connected to its surface; A pull rod (6) arranged inside the cabinet door (3), and a hook body slidably cooperating with the carriage (5) is provided at its end; A linkage mechanism comprising a rack (7) fixed on the carriage (5), a gear (8) rotatably connected to the top plate (4), and a semi-cylindrical isolation cover (9) connected to the gear (8) through a wheel shaft; Sealing edges (10) are arranged in pairs on both sides of the inner wall of the test cabinet (1) and form a dynamic seal with the isolation cover (9).

2. The high-temperature electric tolerance test equipment for a diode chip according to claim 1, wherein: An L-shaped locking frame (11) is arranged inside the cabinet door (3), and a vertical chute (12) and a laterally extending card slot (13) are provided on the inner side wall of the test cabinet (1); A locking pin (14) is slidably arranged in the chute (12) and the card slot (13); A handle (15) is slidably connected to the outer wall of the test cabinet (1) through mirror-image chutes (12) and card slots (13); The locking pin (14) and the handle (15) form a magnetic linkage through a magnet (16).

3. The high-temperature electric endurance test device for a diode chip according to claim 2, wherein: A through inner groove (17) is provided inside the cabinet door (3), and an inner plate (19) with an inclined opening (18) is slidably connected therein; The inner end of the inner plate (19) is connected to a plug pin (20), and an operating handle is provided at the outer end; A through opening (21) communicating with the inner groove (17) is provided at the top of the cabinet door (3), and a bayonet (22) cooperating with the plug pin (20) is provided at the inserted end of the pull rod (6).

4. A high-temperature electric endurance test device for a diode chip according to claim 1, characterized in that: The rotation angle range of the isolation cover (9) is 0° - 180°, and a complete sealed cavity is formed with the sealing edge (10) in its closed state; The displacement stroke of the carriage (5) has a linear proportional relationship with the opening and closing angle of the cabinet door (3).

5. The high-temperature electric tolerance testing device for a diode chip according to claim 1, wherein: A multi-stage heating ring surrounding the chip mounting rack (2) is provided inside the test cabinet (1) and on the inner side of the isolation cover (9), and each stage of the heating ring is independently connected to a temperature control module; A temperature sensor is embedded in the top plate (4), and its detection end extends into the inner cavity of the isolation cover (9); The temperature control module dynamically adjusts the power of the heating ring according to the feedback data of the temperature sensor.

6. The high-temperature electric endurance test device for a diode chip according to claim 1, wherein: An explosion-proof pressure relief valve is provided on the back of the test cabinet (1); A pressure sensing film is embedded on the inner side of the isolation cover (9), and an audible and visual alarm is triggered when the air pressure in the cabinet exceeds 5 kPa; An emergency exhaust louvre linked to the isolation cover (9) is provided at the bottom of the top plate (4).

7. A high-temperature electric endurance test device for a diode chip according to claim 1, characterized in that: The chip mounting rack (2) adopts a quick-release rail structure, and its contact terminals are electrically connected through spring pins.

8. A method for using an electrical endurance test device for diode chips at high temperatures, using an electrical endurance test device for diode chips at high temperatures as described in claim 3, characterized in that, Including the following steps: S1. After the chip is installed, close the cabinet door (3). The closed door panel pushes the locking pin (14) in the card slot (13) into the chute (12), causing it to slide down and fall into the locking frame (11), locking the cabinet door (3) and making it unable to be opened. After the internal locking pin (14) is pushed into the card slot (13) by the external handle (15) to disengage from the locking frame (11), the cabinet door (3) can be opened; S2. When the cabinet door (3) is closed, the inner pull rod (6) on its inner side pushes the carriage (5) and the rack (7) to displace, and drives the gear (8) and the isolation cover (9) to rotate clockwise, so that the isolation cover (9) cooperates with the sealing edge (10) to separate the cabinet door (3) from the high-temperature test area. When the cabinet door (3) is opened, it controls the isolation cover (9) to reverse, exposing the mounting rack (2) at the cabinet opening to separate most of the high-temperature area from the opened cabinet opening; S3. Before opening the cabinet door (3), unlock the locking pin (14) to enter the card slot (13) according to the process. The locking pin (14) synchronously slides inward along the inclined opening (18) to squeeze the inner plate (19), so that the bolt (20) is inserted into the bayonet (22) to lock the pull rod (6) on the cabinet door (3). At this time, when the cabinet door (3) is opened, it drives the isolation cover (9) to separate the cabinet interior space. If the cabinet door (3) is opened without operating the locking pin (14), the inner plate (19) lacks the control of the locking pin (14), and the pull rod (6) will not be locked on the cabinet door (3). Therefore, when the cabinet door (3) is opened illegally, the isolation cover (9) will not open.

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