Solder body processing tool and solder body processing method using same

Abstract

The present invention relates to a solder body processing tool and a solder body processing method using the same, and more particularly, to a solder body processing tool for processing a solder body having a height greater than a long side of a cross-section, and a solder body processing method using the same, the solder body processing tool comprising: a mounting plate in which accommodating parts are arranged in a preset pattern, the storage part is used for storing the solder bodies one by one; a pressure adjusting part for applying suction pressure to the accommodating part; and a pressing member that has a pressing block that is movable with respect to the housing part, and a plurality of pressing pins that extend from the pressing block and at least a part of which is inserted into the housing part, and that pushes the solder body to the outside of the housing part by means of the pressing pins. Therefore, the columnar solder body which is larger than the height of the substrate element is accurately adhered to the preset position of the substrate in an upright posture.

Description

Technical Field

[0001] The present invention relates to a solder body processing tool and a solder body processing method using the same. More specifically, the present invention relates to a solder body processing tool and a solder body processing method using the same, in which a solder body with a high height is installed in a storage part arranged in a preset pattern in a lower processing tool, the solder body is transferred to an upper processing tool having the same pattern, and the solder body is adhered to a substrate without error in the form of the pattern by the upper processing tool. Background Art

[0002] Recently, with the miniaturization and high performance of electronic devices, the integration degree of semiconductor packages has been increasing. Accordingly, semiconductor chips are stacked in a state where components are mounted on a substrate to form a high-performance semiconductor package.

[0003] That is, as Figure 1a shown, in a unit chip U1 for forming one semiconductor package, mounting parts Cx are provided in a pattern form for electrically connecting an upper substrate and a lower substrate stacked thereon. In addition, solder balls mB as conductive materials are integrated with the lower substrate based on a reflow process in a state of being mounted in the mounting parts Cx of the lower substrate, and the upper substrate is stacked to form a semiconductor package in a state where the upper and lower substrates are in electrical contact.

[0004] In order to mount the solder balls mB in the mounting parts Cx of the substrate S, a processing tool 20 as Figure 1b shown can be used. By applying a suction pressure py to the internal space of the processing tool 20 based on a pressure adjusting part P2, the solder balls mB are sucked into the storage part 22 of the processing tool 20 and held. While the processing tool 20 is located above the substrate S and maintains a state of being separated by a preset distance h2, when the suction pressure py is removed, the solder balls mB fall and adhere to the upper side of the solder paste F pre-coated in the mounting parts Cx of the substrate S.

[0005] Reference numeral Bx not shown in the drawings represents a region corresponding to the unit chip U1 for forming one semiconductor package.

[0006] However, recently, there has been a trend that the installation height hk of the components K mounted on the substrate S gradually increases, and the size and pitch of the solder balls mB gradually become denser. As described above, due to the height hk of the components K mounted on the substrate S, the distance h2 between the processing tool 20 and the substrate S has to be far. After the processing tool 20 removes the suction pressure py, during the fall of the solder balls mB, if the processing tool 20 or the suction pressure py shakes slightly, the falling trajectory of the solder balls mB shifts and forms a path inconsistent with the direction of gravity, resulting in the problem that the solder balls mB cannot accurately fall and adhere to the mounting parts Cx.

[0007] In addition, the higher the height hk of the component K mounted on the substrate S, the higher the height of the solder ball mB used for electrically contacting the stacked lower substrate and upper substrate should be. However, as the height of the spherical solder ball mB increases, the size of the solder ball mB also increases accordingly, resulting in the problem that the solder ball mB cannot be arranged on the mounting portion Cx of the substrate S with a dense distribution.

[0008] Therefore, in the process of manufacturing semiconductor packages using a stacking method, there is an urgent need for a method of mounting columnar solder bodies. Even when the height hk of the component K mounted on the substrate S increases, while electrically contacting the upper and lower substrates using the columnar solder bodies, during the process of accurately picking up the columnar solder bodies into the storage part of the processing tool and mounting the solder bodies stored in the storage part of the processing tool at the preset position on the substrate, the columnar solder bodies can be mounted in an upright state without tipping over.

[0009] Furthermore, recently, the size and pitch of the electrical contact points used for manufacturing semiconductor packages have gradually become more dense. In the process of transferring or adhering ultra-small solder bodies with a smaller cross-section, the problems of defects generated in the electrostatic force transfer or adhesion process also need to be urgently solved.

[0010] The above structure is used to explain the background for the proposal of the present invention, rather than the structure disclosed before the filing date of the present invention. Summary of the Invention

[0011] Technical Problem

[0012] In order to solve the above problems, the present invention aims to provide a solder body processing tool and a solder processing method using the same, which can accurately fix the columnar solder body, which is an electrical connection material, in an upright posture on the mounting portion of the substrate, and the mounting portion is arranged in a preset pattern of the substrate.

[0013] In other words, the present invention can adhere the columnar solder bodies to the substrate in a preset pattern even when the height of the substrate components increases.

[0014] To this end, the object of the present invention is to mount the columnar solder bodies into the storage part of the holding processing tool.

[0015] In addition, the object of the present invention is to reliably transfer the solder bodies mounted in the storage part of the holding processing tool to the second storage part of the adhesion processing tool.

[0016] In addition, the object of the present invention is to accurately adhere the solder bodies stored in the second storage part of the adhesion processing tool to the preset position on the substrate.

[0017] In addition, an object of the present invention is to prevent the remaining solder bodies from being contaminated or damaged during the process of mounting the solder bodies into the storage portions of the gripping and processing tools, so that the reused solder bodies exhibit the same stacking quality as the newly supplied solder bodies.

[0018] In addition, an object of the present invention is to prevent defects from occurring in the mounting process of the solder bodies, when forming the electrical contact points of the substrate based on the ultra-small solder bodies, the solder bodies are difficult to separate from the storage holes of the processing tools due to electrostatic force.

[0019] Therefore, an object of the present invention is to accurately arrange the columnar solder bodies at the preset contact positions even when the distance between the upper and lower substrates stacked is increased due to the components mounted on the substrate, so that the upper and lower substrates are in electrical contact, thereby enabling the manufacture of semiconductor packages using substrates with various components mounted thereon.

[0020] Technical Solution

[0021] To achieve the above object, the present invention provides a solder body processing tool for processing solder bodies with a height greater than the long side of the cross-section. The solder body processing tool includes: a mounting plate on which storage portions are arranged in a preset pattern, and each of the storage portions stores one of the solder bodies; a pressure adjustment portion for applying a suction pressure to the storage portions; and a pressing member having a pressing block movable relative to the storage portions and a plurality of pressing pins extending from the pressing block and at least a part of which is inserted into the storage portions, for pushing the solder bodies out of the storage portions through the pressing pins.

[0022] In addition, the present invention provides a solder body processing method for processing solder bodies with a height greater than the long side of the cross-section, which includes: a solder body storage step of applying a suction pressure to the storage portions of an adhesion processing tool having a mounting plate to store the solder bodies one by one in the storage portions, where the storage portions are formed on the mounting plate in a preset pattern; a processing tool placement step of placing the processing tool at a height corresponding to a preset distance z2 from the adhesion object; and a solder body pressing step of pushing out the solder bodies by using the pressing members arranged in each of the storage portions.

[0023] In addition, the present invention provides a method for processing a solder body, which is used to supply the solder body to a storage part distributed in a preset pattern of a placement plate and perform processing. The method includes: a solder body supply step of supplying a solder body with a height greater than the long side of the cross-section to one side of a solder body processing device, where the solder body processing device includes a holding processing tool and a placement plate continuously provided at the same height as the mounting plate. In the holding processing tool, the opening of the storage part formed on the mounting plate and having a specified pattern faces upward, and a plurality of pressing pins can move from the lower part to the upper part of the storage part, and a suction pressure can be applied to the storage part; a solder body movement step of driving a first vibrator arranged on one side of the placement plate and a second vibrator arranged on the other side of the placement plate, and based on the vibration of the placement plate, making the solder body rebound and move while passing above the storage part; a solder body storage step of, in a state where the solder body is above the storage part, simultaneously driving the first vibrator and the second vibrator, inducing the solder body to rebound in place and be stored in the storage part.

[0024] The term ′solder paste′ described in this specification and the claims refers to a general term for materials with auxiliary components used when placing a solder body on a substrate, and is defined to include paste, welding paste, and flux.

[0025] The term ′storage part′ described in this specification and the claims refers to a groove or hole of a preset processing tool for mounting a solder body.

[0026] The ′long side′ described in this specification and the claims refers to the diameter when the cross-section is circular, twice the major radius when the cross-section is elliptical, and the maximum diagonal length when the cross-section is polygonal.

[0027] The term ′solder body′ described in this specification and the claims refers to a solder different from the solder balls in the existing embodiments, which is formed of a conductive material and is columnar with a column height greater than the long side of the cross-section.

[0028] The term ′opening′ described in this specification and the claims refers to the entrance of the storage part or the second storage part that houses at least a part of the solder body and is used to insert the solder body.

[0029] The term ′outer side′ and its similar terms described in this specification and the claims refer to the direction from the internal space of the housing through the storage part towards the outside, and the term ′inner side′ and its similar terms described in this specification and the claims refer to the direction towards the internal space of the housing. Therefore, the solder body moves inward and is stored in the storage part, and the solder body stored in the storage part moves outward and exits the storage part.

[0030] Advantages of the Invention

[0031] According to the present invention, the beneficial effect can be obtained that a columnar solder body with a height greater than the height of the component on the substrate is accurately adhered to a preset position on the substrate in an upright posture.

[0032] In other words, in the present invention, in a state where the columnar solder body is accommodated in the second accommodating portion for transferring the solder body, the state of pushing the solder body toward the substrate is maintained by the pressing pin or pressure is repeatedly applied, and the solder body is firmly adhered to the preset position on the substrate in an upright posture based on the adhesive force of the solder paste.

[0033] Among them, in the present invention, the pressing pin is used and pressure is applied based on air pressure to push out the solder body, so that the lower end of the solder body can apply continuous pressure to the solder paste for a preset period of time, thereby firmly fastening the solder body to the solder paste on the substrate in an upright state.

[0034] In particular, in the present invention, in order to make the lower end of the solder body contact the solder paste without the solder body detaching from the second accommodating portion, pressure is applied by the pressing pin to push out the solder body, so that the beneficial effect can be obtained that the columnar solder body does not tilt and is fixed to the substrate in an upright posture.

[0035] In addition, in the present invention, the pressure of pushing out the solder body by the pressing pin is repeatedly applied at least twice, and the remaining solder bodies among the picked-up multiple solder bodies whose lower ends are not pasted to the solder paste are repeatedly pressured to make them close to the solder paste, so that the effect that all the solder bodies are close to the solder paste and adhered in an upright state can be obtained.

[0036] In addition, as the solder body is mechanically pushed out by the pressing pin and closely attached to the solder paste, the ultra-small solder body does not separate from the second accommodating portion of the adhesion processing tool, and further the effect of preventing the occurrence of adhesion failure can be obtained.

[0037] In addition, in the present invention, by holding the solder body in the same form as the transferred solder body and mounting the solder body on the accommodating portion distributed in a preset pattern in the substrate, the effect of adhering the solder body to the preset position on the substrate through the transferred solder body can be obtained.

[0038] Among them, in the present invention, in order to transmit vibration, the mounting plate of the holding processing tool and the resting plate for vibrating the solder body are arranged as a continuous whole, so that the supplied solder body rebounds and moves, and is placed in the accommodating portion in a non-contact manner. Furthermore, not only can the solder body be prevented from being damaged and the columnar solder body be adhered to the substrate in its original shape, but also no pollution problem occurs. Even when reused when adhering to the next substrate, the effect of placing the solder body in the expected shape and posture can be obtained.

[0039] At this time, the present invention forms an inclined surface inclined at an angle of 25 degrees to 35 degrees with respect to the depth direction at the opening of the storage portion, and the depth of the inclined surface is 1 / 3 times to 2 / 3 times the height of the solder body. As a result, a part of the solder body that moves back and forth flows into the inclined surface of the storage portion, then stands up by itself and flows into the storage portion to achieve placement, so that the effect of significantly reducing the time required to place the solder body in the storage portion can be obtained.

[0040] Thus, in the state where components are mounted on the substrate, the present invention can also form a small cross-section with a pin-shaped solder body and electrically connect the substrates that are separated by a large distance up and down in contact, thereby achieving the high integration effect of the stacked semiconductor package. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1a It is a three-dimensional structure diagram of a unit chip included in an installation portion for adhering a solder body.

[0042] Figure 1b It is a schematic structural diagram of a structure for manufacturing a plurality of unit chips with adhered solder balls.

[0043] Figure 2 It is a schematic structural diagram of a substrate on which the unit chips in FIG. 1 are arranged vertically and horizontally.

[0044] Figure 3a It is a schematic structural diagram of a solder body processing tool according to an embodiment of the present invention.

[0045] Figure 3b It is a schematic structural diagram of a solder body processing tool according to another embodiment of the present invention.

[0046] Figure 4 It is Figure 3a An enlarged view of the 'A' part of

[0047] Figure 5 It is based on Figure 3b A cross-sectional view taken along the tangent line Xa-Xa of

[0048] Figure 6 It is based on Figure 3a and Figure 3b An example diagram of a solder body processed by a solder body processing tool of

[0049] Figure 7 It is to Figure 3a A three-dimensional structure diagram of a processing device that uses the solder body processing tool of as a gripping processing tool.

[0050] Figure 8 It is Figure 7 A schematic structural diagram of the processing device of

[0051] Figures 9a to 9e It sequentially illustrates placing the solder body inFigure 7 Structural diagram of the storage part of the holding processing tool of the processing device

[0052] Figure 10 is Figure 9d Enlarged view of part 'B' of, and is a diagram for explaining the working principle of placing the solder body in the storage part

[0053] Figures 11a to 11d Is a schematic structural diagram showing the transfer of the solder body placed in the storage part of the holding processing tool to the second storage part of the adhesion processing tool in sequence

[0054] Figures 12a to 12g Is a schematic structural diagram showing the transfer of the solder body stored in the adhesion processing tool to the substrate in sequence Detailed implementation mode

[0055] Next, with reference to the drawings, the structure of the solder body processing tool 100 according to an embodiment of the present invention and the processing device 1 using the same will be described

[0056] As Figures 3a to 5 shown, the solder body processing tool 100 according to an embodiment of the present invention is a mechanism used in processing processes such as sucking, storing, transferring, or adhering a columnar solder body hB, and includes: a housing 110 having, on one side, a mounting plate 112 provided with a plurality of storage parts 115 and forming a space isolated from the outside; a pressure adjustment part P for adjusting the internal pressure of the housing 110; and a pressurizing member 120 provided with a pressurizing pin 122 in each storage part 115 and reciprocating in the through direction of the storage part 115 based on a pressurizing drive part M

[0057] Among them, the solder body hB refers to solder formed of a conductive material and having a shape in which the height hh is greater than the longest side dd in the cross section. For example, the solder body hB can be formed of highly conductive copper or the like

[0058] The long side dd of the solder body hB can be approximately 200 μm to 300 μm, and the long side dd of the ultra-small solder body hB used in the present invention can also be 50 μm to 150 μm. In addition, the height hh of the solder body hB can be 1.2 times to 5.0 times the long side dd

[0059] As Figure 6 shown, when the solder body hB is cylindrical, the long side of the solder body is the diameter dd of the circle, when the solder body hB is an elliptical cylinder, the long side of the solder body is twice the long radius of the ellipse, and when the solder body hB is a prism, the long side of the solder body is the length of the longest diagonal of the polygon

[0060] As shown in FIG. 3, the housing 110 is set to be isolated from the outside and the pressure is adjusted based on the pressure adjustment unit P. A receiving portion 115 is formed through the mounting plate 112 that forms one side of the housing 110. The receiving portions 115 are arranged in a pattern aligned with the mounting portions Cx, and the mounting portions Cx are located on the substrate S where a plurality of unit chips U1 are connected vertically and horizontally.

[0061] Among them, the receiving portion 115 includes various shapes and can be used to receive at least a part of the solder body hB. For example, the receiving portion 115 can be formed in a groove shape or in a through-hole shape. According to a preferred embodiment of the present invention, as Figure 4 shown, the receiving portion 115 is formed by a through-hole, and the front end 122e of the pressure pin 122 is provided on the opposite side of the opening that exposes the receiving portion 115 to the outside. A support surface can be formed on the front end 122e of the pressure pin 122 for receiving the solder body hB in the receiving portion 115, so that the insertion depth of the front end of the solder body hB installed in the receiving portion 115 can be determined based on the front end 122e of the pressure pin 122.

[0062] At this time, the pressure driving unit M can reciprocate with a preset stroke of the pressure block 121. For example, in the state where the pressure block 121 is farthest away from the receiving portion 115 and retracts, the position where the solder body hB is received in the receiving portion 115 can be determined. In the state where the pressure block 121 moves closest to the receiving portion 115, the position where the solder body hB is pushed out of the receiving portion 115 can be determined. Therefore, a limiter can also be provided at the end of the moving stroke of the pressure block 121. However, the present invention is not limited thereto, and it can also be set to electrically control the moving stroke of the pressure block 121 based on the control unit 160 as needed.

[0063] The solder body hB is set to be in contact with the front end 122e of the pressure pin 122 in the state of being received in the receiving portion 115. The ionization device (not shown) is arranged close to the pressure block 121 connected to the pressure pin 122, so that ions with a polarity opposite to that of the solder body hB among the ions generated by the ionization device can move towards the solder body hB, polymerization is generated based on the combination of the ions and the charge of the solder body, and the electrostatic force that may be generated between the solder body hB and the pressure pin 122 is removed. Therefore, a smooth separation effect of the ultra-fine solder body hB from the receiving portion 115 of the mounting plate 112 can also be obtained. Among them, the ionization device can be applied to apply voltage or provide the ions required for ionization as various well-known means.

[0064] In addition, the receiving portion 115 can also be formed through with a specified cross-section. As Figure 4 shown, an inclined surface 1151 that opens towards the outside and has a gradually increasing cross-section can be formed on the opening side exposed to the outside. Thus, the processing tool 100 is in Figure 7In the illustrated processing device 1, while the solder body hB can rebound, the time for installing the solder body hB using the opening of the storage part 115 can be shortened.

[0065] Among them, the inclination angle ang1 of the inclined surface 1151 is formed to be an angle inclined 25 degrees to 35 degrees with respect to the depth direction of the storage part 115. This is because referring to the experimental results based on various inclination angles, it can be known that if the inclination angle ang1 of the inclined surface 1151 is within 25 degrees, the opening cross-section of the storage part 115 is small, and the proportion of the solder body hB flowing into the interior of the storage part 115 is significantly reduced, which is not advisable. If the inclination angle ang1 of the inclined surface 1151 exceeds 35 degrees, even if a part of the solder body hB flows into the storage part 115 through the opening, since it is not installed inside the storage part 115, the possibility of rebounding outward again is significantly increased.

[0066] At the same time, the inclined surface 1151 is formed with a depth d1 that is 1 / 3 times to 2 / 3 times the height hh from the opening of the storage part 115 to the solder body hB. Thus, as Figure 10 shown, the following advantages can be obtained: In the process of storing the solder body hB in the storage part of the holding processing tool 101, as long as the end part of the solder body hB flows into the opening, the solder body hB can be induced to be stored in the storage part 115. Also, in the process of adhering the solder body hB to the substrate S, while maintaining the state where one end of the solder body hB is in contact with the surface of the substrate S to be adhered, with a part zz of the solder body hB stored in the storage through-hole 1153 of the storage part 115, the solder body hB can be pressed downward by the pressing pin 122.

[0067] In addition, as Figure 4 shown, an inner inclined surface 1152 that opens inward and has a gradually increasing cross-section can also be formed on the opposite side of the opening of the storage part 115. Thus, even if there is an error in the alignment state between the pressing pin 122 and the storage part 115, the pressing pin 122 can be guided by the inner through-hole 1154 of the storage part 115, and while at least a part of the solder body hB is stored in the solder storage part 113, the front end of the solder body hB can be made to contact the front end 122e of the pressing pin 122, enabling the accurate storage of the solder body hB. When discharging the solder body hB from the storage part 115, the pressure for pushing outward can be accurately introduced.

[0068] A storage through-hole 1153 is provided between the inner through-hole 1154 of the storage part 115 and the inclined surface 1151. The diameter dx of the storage through-hole 1153 is smaller than that of the inner through-hole 1154. The inner through-hole 1154 is used to store the pressing pin 122, and the guide pin is used to store the solder body hB. Among them, the diameter dx of the storage through-hole 1153 can be 1.2 times to 1.5 times the long side dd of the solder body hB.

[0069] In addition, a guiding portion 113 may be provided in the housing 110 to guide the linear reciprocating motion of the pressing member 120. As Figure 3a shown, when a pressing member 120 is provided inside the housing 110, a guiding portion 113 for guiding the linear reciprocating motion 120d of the pressing member 120 is provided on the inner peripheral surface of the side wall of the housing 110 to suppress the tilting displacement that causes the pressing member 120 to tilt. For example, the guiding portion 113 is in the shape of a linear guide rail and can be inserted into the groove portion of the pressing block 121 of the pressing member 120.

[0070] The housing 110 may form the outer contour of the processing tool 100, and the mounting plate 112 is formed corresponding to the shape of the substrate S. For example, as illustrated in the figure, if the substrate S including a plurality of unit chips U1 is quadrilateral in shape, the mounting plate 112 is also quadrilateral in shape, and the housing 110 is in the shape of a straight hexahedron. In addition, if the substrate S is circular in shape like a wafer, the mounting plate 112 is also circular in shape, and the housing 110 may be in the shape of a low-height cylinder. However, the present invention is not limited thereto, and may include various-shaped structures provided with a storage portion 115 that matches the layout of the mounting portion Cx in the substrate S. Hereinafter, for the sake of convenience of explanation, a structure in which a solder body hB is adhered to a quadrilateral substrate S shown in the drawings will be described as an example.

[0071] The pressure regulating portion P is used to regulate the pressure in the internal space of the housing 110. In order to maintain the pick-up operation of storing the solder body hB in the storage portion 115 and maintain the picked-up state of the storage, a suction pressure py is applied. When performing the release operation of pushing out the solder body hB from the storage portion 115, the suction pressure py is removed or a static pressure py' is applied as needed.

[0072] The pressing member 120 includes: a pressing block 121, which is disposed inside the housing 110 and moves back and forth in a direction close to or away from the storage portion 115 of the mounting plate 112; and a plurality of pressing pins 122, which protrude from the pressing block 121 toward the storage portion 115. The pressing block 121 performs a linear reciprocating motion based on a pressing drive portion M controlled by the control portion 160. Thus, the end of the pressing pin 122 extending from the pressing block 121 can move into the storage portion 115 until it can be inserted, and at the same time, when releasing the solder body hB from the storage portion 115, the solder pin hB stored in the storage portion 115 can be mechanically pushed out of the storage portion 115.

[0073] Among them, the pressing drive portion M may be composed of various drive sources including a drive motor. Preferably, it can be driven so that the pressing block 121 moves toward the storage portion 115 based on pneumatic pressure. Thus, as Figure 12fAs shown, solder body hB stored in the second storage part 215 is applied with a pressure Fm of a preset magnitude at a preset position on the substrate S, thereby improving the accuracy of adhering the solder body hB in an upright state to the solder paste F on the substrate S. That is, instead of using a method of controlling the pushing displacement of the pressing block 121, a method of controlling the load by the thrust of the pressing block 121 is adopted, so that damage such as deformation caused by applying excessive force to the micro-sized solder body hB can be avoided, and the reliability of point electrical contact can also be improved in the state of adhering to the substrate.

[0074] At this time, the pressing member 120 presses the solder body hB at least twice in a state where the solder body hB is in contact with the surface of the substrate S coated with the solder paste F as the adhesion object. Thus, even if a part of the solder body hB cannot be fixed by the adhesive force of the solder paste F when a pressure is applied once, the solder body hB can be closely attached through the adhesive force of the solder paste F by the subsequent pressure, thereby further improving the reliability of adhering in an upright state.

[0075] At this time, an air cylinder can also be provided as the pressing drive part M for the pressing block 121. In order to suppress the tilting displacement of the pressing block 121, although not shown in the drawings, a plurality of air cylinders can also be provided at the central position of the pressing block 121 and at a plurality of positions symmetric to the central position as the pressing drive part M.

[0076] In addition, the pressing block 121 can also be set to move back and forth based on the air cylinder, and can also be set such that a plurality of springs (not shown) are compressively provided between the pressing block 121 and the mounting plate 112, and a stopper for restricting the backward movement of the pressing block 121 is provided at the position where the pressing block 121 retreats the most relative to the storage part 115. Thus, only when the pressing pin 122 pushes out the solder body hB, it operates based on the pressing drive part M composed of the air cylinder, and based on reducing the air pressure in the air cylinder and the elastic restoring force of the spring, the pressing block 121 is restored to the backward position.

[0077] In addition, as shown in Figure 3a the pressing member 120 can be formed by one pressing block 121, and as shown in Figure 3b it can be formed by a plurality of divided pressing blocks 121: 121A, 121B, 121C, and 121D. At this time, during the reciprocating movement 120d of each of the divided pressing blocks 121A, 121B, 121C, and 121D, in order to suppress the tilting displacement that occurs, a guide part 118 is provided, which protrudes from the top plate 116 of the housing 110 toward the mounting plate 112 and between each of the pressing blocks 121A, 121B, 121C, and 121D. For example, as shown in Figure 5As shown, a groove 118x is formed in the guide portion 118 that crosses between each of the divided pressurizing blocks 121A, 121B, 121C, and 121D, and a protrusion 120y is formed protrudingly on the side of each of the divided pressurizing blocks 121A, 121B, 121C, and 121D, and is used to be inserted into the groove 118x. Based on the groove 118x and the protrusion 120y, the divided pressurizing blocks 121A, 121B, 121C, and 121D can be assisted to move back and forth without tilting. At this time, if the pressurizing member 120 is formed by a plurality of divided pressurizing blocks 121A, 121B, 121C, and 121D, the pressurizing driving unit M can be formed by a plurality of air cylinders, and each of the divided pressurizing blocks 121A, 121B, 121C, and 121D can be moved back and forth 120d.

[0078] The processing tool 100 of the present invention constructed as above is Figures 7 to 9e As shown, it can also be used as a holding tool 101 for mounting the solder body hB in the receiving portion 115, as shown in FIG. Figures 12a to 12g As shown, it can also be used as an adhesion processing tool 201 for releasing the solder body hB in a picked-up state to an adhesion object and adhering it. That is, by using the processing tool 100 of the same or similar structure as the holding processing tool 101 and the adhesion processing tool 201, the processing tool 100 that needs to be processed ultra-precision can be made into a single body and used to achieve various actions.

[0079] In the following, in describing the structures of the aforementioned processing tool 100 used as the holding processing tool 101 and the adhering processing tool 201, similar reference numerals are used for the same or similar corresponding structures, and the names of the adhering processing tool 201 are described by adding '2nd to'.

[0080] The solder body processing device 1 according to an embodiment of the present invention comprises: a holding processing tool 101, which is arranged so that the mounting plate 112 faces upward (z-axis direction); a shelf plate 199, which is arranged in a continuous form and is widely arranged at the same height as the upper surface of the mounting plate 112 of the holding processing tool 101; a protective wall 198, which is used to surround the periphery of the shelf plate 199; a solder body supply device 90, which is movably arranged to supply the solder body hB to the upper surface of the shelf plate 199; a first exciter 130, which is arranged on one side S1 of the shelf plate 199 and vibrates the shelf plate 199 to make the supplied solder body h B rebounds and moves in the direction X2 of the other side S2; the second vibrator 140, which is arranged on the other side S2 of the shelf 199 and vibrates the shelf 199, so that the supplied solder body hB rebounds and moves in the direction X1 of the one side S1; the adhesion processing tool 201, which receives the solder body hB installed in the storage part 115 of the holding processing tool 101 and transfers it to the installation part Cx of the adhesion object, namely the substrate S; the control part 160, which is used to control the solder body supply device 90, the holding processing tool 101, the vibrators 130, 140, the camera 170 and the adhesion processing tool 201.

[0081] The storage portions 115 of the holding processing tool 101 and the second storage portions 215 of the adhesion processing tool 201 are both arranged in the same pattern as the mounting portions Cx of the substrate S to be finally adhered.

[0082] The handling tool 101 is disposed with the mounting plate 112 facing upward, and the mounting plate 199 is continuously arranged around the mounting plate 112. The unexplained symbol Bx in the figure indicates a region corresponding to the unit chip U1 for forming a semiconductor package, and has a plurality of mounting portions Cx for attaching the solder body hB.

[0083] The mounting plate 112 and the shelf plate 199 are formed of the same thickness and material, and are configured to transmit the vibration applied to the shelf plate 199 by at least any one of the exciters 131, 132, 141, and 142 to the mounting plate 112. Preferably, the mounting plate 112 and the shelf plate 199 may be formed of an integral plate, which may be achieved by making the mounting plate 112 for holding the processing tool 110 larger in area than the shelf plate 199.

[0084] In addition, a protective wall 198 is arranged around the placement plate 199. The protective wall 198 surrounds with a sufficient height to prevent the solder body hB from detaching. In order to ensure that the vibration of the placement plate 199 based on any one of the exciters 131, 132, 141, and 142 is not obstructed by the protective wall 198, there is a fine gap cc between the placement plate 199 and the protective wall 198 and they are separated from each other. Among them, the size of the gap cc between the placement plate 199 and the protective wall 198 is set to a degree that can inhibit the solder body hB from falling off from the gap cc.

[0085] The first exciter 130 provided on one side S1 of the placement plate 199 can be realized by respectively arranging the first-1 exciter 131 and the first-2 exciter 132 near the two top corners on one side S1 of the placement plate 199. The second exciter 140 provided on the other side S2 of the placement plate 199 can be realized by respectively arranging the second-1 exciter 141 and the second-2 exciter 142 near the two top corners on the other side S2 of the placement plate 199. Among them, the exciters 131, 132, 141, and 142 can be used as exciters in a feeder.

[0086] Thus, in the state where the solder body hB is supplied on one side of the placement plate 199, if the one side of the placement plate 199 vibrates based on the first-1 exciter 131 and the first-2 exciter 132, the solder body hB rebounds and is transferred in the direction X2 from one side S1 of the placement plate 199 to the other side S2. On the contrary, in the state where the solder body hB is supplied on the other side of the placement plate 199, if the other side of the placement plate 199 vibrates based on the second-1 exciter 141 and the second-2 exciter 142, the solder body hB rebounds and moves in the direction X1 from the other side S2 of the placement plate 199 to one side S1.

[0087] Similarly, if vibration is performed on one side Sa of the side surface of the placement plate 199 based on the first-1 exciter 131 and the second-1 exciter 141, the solder body hB rebounds and moves in the direction Yb from one side Sa of the side surface of the placement plate 199 to the other side Sb of the side surface. On the contrary, if vibration is generated on the other side Sb of the side surface of the placement plate 199 based on the first-2 exciter 132 and the second-2 exciter 142, the solder body hB rebounds and moves in the direction Ya from the other side Sb of the side surface of the placement plate 199 to the other side Sa of the side surface.

[0088] At this time, if the vibration intensity based on the 1-1st vibrator 131 and the 1-2nd vibrator 132 is greater than that of the 2-1st vibrator 141 and the 2-2nd vibrator 142, the solder body hB is transferred only based on the 1-1st vibrator 131 and the 1-2nd vibrator 132 in the direction X2 to the other side. Similarly, if the vibration intensity based on the 2-1st vibrator 141 and the 2-2nd vibrator 142 is greater than that of the 1-1st vibrator 131 and the 1-2nd vibrator 132, the solder body hB is transferred only based on the 2-1st vibrator 141 and the 2-2nd vibrator 142 in the direction X1 to one side. Additionally, if within the specified error range, the vibration intensity based on the 1-1st vibrator 131 and the 1-2nd vibrator 132 is equal to that of the 2-1st vibrator 141 and the 2-2nd vibrator 142, the solder body hB is in a state of rebounding in place without moving.

[0089] In the embodiment shown in the drawings, although a structure is shown in which each of the one side S1 and the other side S2 of the placing plate 199 has two vibrators, the present invention is not limited thereto, and each of the one side S1 and the other side S2 of the placing plate 199 may also have one vibrator or three or more vibrators.

[0090] The camera 170 takes an image and checks whether the solder body hB is properly installed in the receiving portion 115 of the gripping processing tool 101 while vibrating based on the vibrators 130 and 140.

[0091] When the adhesion processing tool 201 senses the normal installation state of the solder body hB based on the image taken by the camera 170, it receives the solder body hB installed in the receiving portion 115 of the gripping processing tool 101 and transfers the solder body hB in a state of being vertically erected at the preset installation portion Cx of the adhesion object, i.e., the substrate S.

[0092] Next, the structure for supplying the solder body hB to the receiving portion 115 of the gripping processing tool 101 using the processing device 1 configured as described above will be described in sequence.

[0093] Step 1: First, as Figure 9a shown, the solder body hB selected in consideration of the height of the component K to be mounted on the adhesion object is supplied 71 by the solder body supply device 90 to the placing plate 199 of the solder body processing device 1.

[0094] Step 2: Then, as Figure 9b shown, the 1-1st vibrator 131 and the 1-2nd vibrator 132 arranged on one side S1 of the placing plate 199 start to vibrate, causing the solder body hB placed on the upper surface of one side of the placing plate 199 to rebound and move 72 in the direction X2 to the other side S2 of the placing plate 199.

[0095] If the supplied solder body hB partially stacks from the upper side of the receiving portion 115 of the mounting plate 112 to the other side S2 of the placing plate 199, as Figure 9c shown, drive the 2-1 vibrator 141 and the 2-2 vibrator 142 arranged on the other side S2 of the placing plate 199, so that while the solder body hB rebounds on the upper surface of the placing plate 199, it moves 73 in the direction X1 toward the side S1.

[0096] As needed, by adjusting the vibration intensities of the 1-1 vibrator 131, the 1-2 vibrator 132, the 2-1 vibrator 141, and the 2-2 vibrator 142, adjust the transfer speed of the solder body hB, so that the solder body stays on the upper surfaces of one side and the other side of the placing plate 199 to the minimum extent. In addition, as needed, by driving the 1-1 vibrator 131 and the 2-1 vibrator 141, or driving the 2-1 vibrator 141 and the 2-2 vibrator 142, it is also possible to transfer in the axial direction (±y-axis direction). Thus, most of the solder bodies hB are placed on the upper side of the receiving portion 115 of the mounting plate 112.

[0097] Step 3: Then, as Figure 9d shown, by adjusting the vibration intensities of the 1-1 vibrator 131, the 1-2 vibrator 132, the 2-1 vibrator 141, and the 2-2 vibrator 142 to the same or similar magnitudes to be below a preset deviation, guide the solder body hB located on the upper side of the mounting plate 112 to perform a rebounding movement 74 in place.

[0098] Meanwhile, the pressure adjustment portion P1 of the holding processing tool 101 adjusts the inside of the housing 110 to a negative pressure state, inducing the suction pressure py to act in each receiving portion 115. Especially as Figure 10 shown, an inclined surface 1151 that is inclined at an angle ang1 of 25 degrees to 35 degrees with respect to the depth direction of the receiving portion 115 is formed at the opening of the receiving portion 115. If a part of the end of the rebounding solder body hB falls into the widened opening based on the inclined surface 1151, the solder body hB is installed in a state of being guided and inserted into the receiving portion 115 while rotating in the direction indicated by the reference numeral 99 along the inclined surface 1151. In addition, the widened opening based on the inclined surface 1151, as shown by the reference numeral 98, helps the solder body hB to be directly installed in the receiving portion 115.

[0099] Therefore, the solder body hB remains in the state of being received in the receiving portion 115 until the lower end contacts the front end of the pressing pin 122. Based on the inclined surface 1151 formed at the opening of the receiving portion 115, it has the beneficial effect of being able to significantly shorten the process time required to receive the solder body hB in the receiving portion 115 of the holding processing tool 101.

[0100] If the process of mounting the solder body hB in the storage section 115 is carried out sufficiently, while maintaining the state in which a suction pressure py is applied to the storage section 115 of the holding processing tool 101, a blower (not shown) that linearly jets air is blown along the upper surfaces of the placement plate 199 and the mounting plate 112, and the solder body remaining on the upper surface of the mounting plate 112 of the holding processing tool 101 is moved to one side or the other side of the placement plate 199.

[0101] Step 4: Then, as Figure 9e shown, the camera 170 is used to photograph whether the solder body hB is stored in the storage section 115 of the holding processing tool 101, and the captured image is transmitted to the control section 160.

[0102] The control section 160 receives the captured image from the camera 170 and determines whether the storage state of the solder body hB in the storage section 115 is within the normal range. If the storage state of the solder body is within the normal range, the process of transferring the solder body is carried out using the adhesion processing tool 201. If the storage state of the solder body is not within the normal range, that is, if there is no solder body stored in a part of the storage section 115 of the holding processing tool 101, etc., steps 2 and 3 are repeated.

[0103] Step 5: In step 4, if the storage state of the solder body in the storage section 115 of the holding processing tool 101 is determined to be within the normal range, that is, it is determined that the solder body storage step of storing the solder bodies hB one by one in the storage section 115 arranged in a preset pattern has been completed, as Figure 11a and Figure 11b shown, the adhesion processing tool 201 is moved 201d1 to a position aligned with the holding processing tool 101 based on the movement drive section MC. At this time, a sensing sensor may be provided for sensing the alignment position of the adhesion processing tool 201.

[0104] The first storage section 215 of the adhesion processing tool 201 is formed in the same pattern as the storage section 115 of the holding processing tool 101, and in the state where the adhesion processing tool 201 is aligned with the holding processing tool 101, the first storage section 215 of the adhesion processing tool 201 and the storage section 115 of the holding processing tool 101 are in a state of facing each other vertically.

[0105] At this time, in a state where the second pressure adjustment unit P2 of the adhesion processing tool 201 is not operating, the storage unit 215 maintains atmospheric pressure, and the second pressure application drive unit M2 moves the pressure pin 222 upward by 220d1 to maintain a state where the second storage unit 215 can store the solder body hB. In addition, the pressure adjustment unit P1 of the gripping processing tool 101 adjusts the internal space of the housing 110 to a negative pressure state, and the suction pressure py acts in the storage unit 115. The pressure application drive unit M1 moves the pressure pin 222 downward and maintains a state where the solder body hB is stored in each storage unit 115.

[0106] The distance z1 between the adhesion processing tool 201 and the gripping processing tool 101 is set to be less than the value obtained by subtracting the depth d1 of the inclined surface 1151 of the storage unit 115 of the gripping processing tool 101 from the height hh of the solder body hB (hh - d1). More preferably, the distance z1 between the adhesion processing tool 201 and the gripping processing tool 101 is set to be less than the value obtained by subtracting the sum of the depth d1 of the inclined surface 1151 of the storage unit 115 of the gripping processing tool 101 and the depth dz of the second inclined surface 2151 of the second storage unit 215 of the adhesion processing tool 201 from the height hh of the solder body hB (hh - d1 - dz). Thus, as Figure 11b shown, during the process of supplying the solder body hB from the storage unit 115 of the gripping processing tool 101 to the second storage unit 215 of the adhesion processing tool 201, when the pressure pin 122 of the gripping processing tool 101 lifts upward and ejects the solder body hB, as confirmed in the position of the solder body indicated by the dashed line in the enlarged view of FIG. 11, a part of the lower portion of the solder body hB is located in the storage through-hole 1153 of the storage unit 115 of the gripping processing tool 101, and a part of the upper portion of the solder body hB is located in the second storage through-hole 2153 of the second storage unit 215 of the adhesion processing tool 201, thereby having the beneficial effect of preventing the solder body hB from tipping over and falling off.

[0107] Step 6: Then, as Figure 11c shown, the pressure adjustment unit P1 of the gripping processing tool 101 removes the suction pressure, and the pressure application drive unit M1 pushes the pressure pin 122 upward by 120d2. At this time, the pressure adjustment unit P1 can also apply a static pressure while removing the suction pressure.

[0108] In addition, the second pressure adjustment unit P2 of the adhesion processing tool 201 maintains the inside of the second housing 210 in a negative pressure state so that the suction pressure py acts on the second storage unit 215, and the second pressure application drive unit M2 maintains a state of pulling the second pressure pin 222 upward to store the solder body hB pushed upward from the storage unit 115 of the gripping processing tool 101.

[0109] As described above, in order to keep the lower end and the upper end of the solder body hB in contact with the receiving through-hole 1153 of the holding processing tool 101 and the second receiving through-hole 2153 of the adhesion processing tool 201 simultaneously, the distance z1 between the adhesion processing tool 201 and the holding processing tool 101 is set, so as to prevent the problem that the vertically standing solder body hB topples over and detaches during the transfer of the solder body hB from the holding processing tool 101 to the adhesion processing tool 201.

[0110] Furthermore, the pressing pin 122 of the holding processing tool 101 pushes the solder body hB upward until the upper end of the solder body hB is in contact with the front end 222e of the second pressing pin 222 of the second receiving portion 215. The solder body hB always maintains the state of being supported by the pressing pin 122 below. In the state where the upper end of the solder body hB is in contact with the front end 222e of the second pressing pin 222, the solder body hB can be stably and accurately picked up into the second receiving portion 215 under the action of the suction pressure py.

[0111] Step 7: After applying the suction pressure py in the second receiving portion 215 in Step 6 and receiving the solder bodies hB one by one, as Figure 11d shown, the adhesion processing tool 201 is separated from the holding processing tool 101 based on the movement driving unit MC, and as Figure 12a shown, moves upward by 201d2 toward the upper side of the substrate S, which is the adhesion object.

[0112] In addition, before performing Step 8, an appropriate amount of solder paste F is pre-coated in the mounting portion Cx of the substrate S. The solder paste F is applied to the mounting portion Cx of the substrate S in a predetermined amount based on a printing method, a dotting method, or a coating method using a mask. The solder paste F can be a flux or a welding paste.

[0113] Step 8: The layout pattern of the second receiving portion 215 is the same as the pattern of the mounting portion Cx of the substrate S, which is the adhesion object. As the enlarged view of the ′D′ part in Figure 12b , that is, as Figure 12c shown, the second receiving portion 215 of the adhesion processing tool 201 is aligned with the mounting portion Cx of the substrate S, and the adhesion processing tool 201 is placed at a position 201d3 separated from the substrate S by a preset distance z2.

[0114] At this time, the second pressure portion P2 of the adhesion processing tool 201 is in a state of applying the suction pressure py to the second receiving portion 215. At this time, the solder body hB remains in the state of being picked up into the second receiving portion 215 and held, and the upper end is in contact with the pressing pin 222.

[0115] Step 9: Then, as Figure 12d and Figure 12fAs shown, the second pressing drive unit M2 moves the 220d2 pressing block 221 downward, and based on the second pressing pin 222, the solder bodies hB stored in each of the second storage units 215 are pushed outwards. At the same time, the second pressure adjustment unit P2 removes the suction pressure py applied to the second storage unit 215.

[0116] In step 8, the distance z2 between the adhesion processing tool 201 and the substrate S is set to be less than the height hh of the solder body hB minus the depth dz of the inclined surface 2151 of the second storage unit 215. That is, in order to store the solder body hB in the second storage through-hole 2153 of the second storage unit 215 with a partial length zz, and at the same time to maintain the state of contacting the solder paste F formed on the surface of the substrate S, the position and height of the second mounting plate 212 are set relative to the substrate S.

[0117] Thus, in step 9, if the second storage unit 215 of the adhesion processing tool 201 releases the solder body hB, even if the lower end of the solder body hB is in a state of completely penetrating the solder paste F and contacting the surface of the substrate S, the upper end portion of the solder body hB remains in an interference state with a preset length zz in the second storage through-hole 2153 of the second storage unit 215 of the adhesion processing tool 201, and the solder body hB can maintain the state of standing vertically in the second storage through-hole 2153 with the upper end in interference.

[0118] More importantly, as Figure 12d shown, for the second pressing pin 222, the other end of the solder body hB is stored in the second storage through-hole 2153 of the second storage unit 215 in an interference state with a preset length zz, and in the state where one end of the solder body hB contacts the solder paste F, a pressure Fm towards the solder paste F is applied to the solder body hB based on the second pressing pin 222.

[0119] As described above, the second pressing drive unit M2 for driving the movement of the second pressing member 220 can be formed by a pneumatic cylinder, and a preset magnitude of force can be accurately applied based on the pneumatic cylinder. Therefore, through the second pressing pin 222, a specified magnitude of pressure Fm in the direction towards the solder paste F is applied to the solder body hB, and while the solder body hB does not undergo bending deformation, the lower end portion of the solder body hB can be attached and fixed in an upright state based on the adhesive force of the solder paste F.

[0120] For this purpose, the pressure Fm applied to the solder body hB based on the pneumatic cylinder through the second pressing pin 222 can be set to apply a pressure to the solder body hB for a preset time period in the state where one end of the solder body hB contacts the solder paste F. As described above, the time period (for example, about 0.5 seconds to 2 seconds) of the pressure Fm applied to the solder body hB is set to a sufficient duration so that the lower end portion of the solder body hB is firmly fixed in an upright posture based on the adhesive force of the solder paste F.

[0121] In addition, the pressure Fm applied by the air pressure cylinder to the solder body hB via the second pressing pin 222 can be set such that at least two pressures are applied to the solder body hB by the second pressing pin 222 in a state where one end of the solder body hB is in contact with the solder paste F. As described above, the number of times the pressure Fm is applied to the solder body hB is set to at least two times. As Figure 12e shown, for the solder body ehB that cannot be fixed to the solder paste F with a single pressure, as Figure 12f shown, the pressure Fm is repeatedly applied to the solder body hB by the second pressing pin 222, so that the lower end of the solder body hB is firmly fixed in an upright posture based on the adhesive force of the solder paste F.

[0122] In addition, if necessary, the second pressure regulating unit P2 can also apply static pressure as the force pushing out from the second storage unit 215. This is because the upper end of the solder body hB is interferentially maintained in the second storage unit 215 of the adhesion processing tool 201 in an upright posture. Therefore, even if there is an air flow from the second storage unit 215 to the outside due to the second pressure regulating unit P2, there will be no problem of the posture distortion or tipping of the solder body hB. In addition, through the air flow regulated by the second pressure regulating unit P2, the electrostatic force that may be generated between the lower end 222e of the second pressing pin 222 and the solder body hB can be overcome. Therefore, after the pressure Fm is applied to the solder body hB by the second pressing pin 222, when the second pressing pin 222 moves away from the upper end of the solder body hB while retreating (movement 220d1), even if there is an electrostatic force between the second pressing pin 222 and the solder body hB, the second pressing pin 222 is forcibly separated from the solder body hB by forced air flow, so that in the solder body adhesion process, all the solder bodies hB in the numerous second storage units 215 of the adhesion processing tool 201 are transferred to the mounting portion Cx of the substrate S without residue, which has beneficial effects.

[0123] Step 10: After the solder body hB is adhered to the mounting portion Cx of the substrate S in an upright posture based on Step 9, as Figure 12g shown, the adhesion processing tool 201 moves 201d4 and away from the substrate S. Then, referring to Figure 11a , the adhesion processing tool 201 approaches the gripping processing tool 101 to transfer the solder body hB and adhere it to a new substrate S.

[0124] In addition, the solder body hB is adhered in an upright state at a preset pattern position on the substrate S, and this substrate will be transferred to subsequent processes such as reflow.

[0125] Explanation of reference numerals:

[0126] 1: Solder body processing device 100: Solder body processing tool

[0127] 101: Holding processing tool 110: Housing

[0128] 112: Mounting plate 115: Storage part

[0129] 1151: Inclined surface 1153: Storage through-hole

[0130] 120: Pressing member 121: Pressing block

[0131] 122: Pressing pin 199: Resting plate

[0132] 201: Adhesion processing tool 210: Second housing

[0133] 212: Second mounting plate 215: Second storage part

[0134] 2151: Second inclined surface 2153: Second storage through-hole

[0135] 220: Second pressing member 221: Second pressing block

[0136] 222: Second pressing pin hB: Solder body

[0137] Industrial applicability

[0138] Although some preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments. It should be understood that various changes and modifications can be made without departing from the scope of the present invention defined in the claims.

Claims

1. A solder body processing tool for processing a solder body having a height greater than the long side of the cross-section, comprising: A mounting plate arranged with receiving portions in a preset pattern, and each of the receiving portions receives the solder body; A pressure adjusting portion for applying a suction pressure to the receiving portion; A pressing member having a pressing block movable relative to the receiving portion and a plurality of pressing pins extending from the pressing block and at least a part of which is inserted into the receiving portion, for pushing the solder body out of the receiving portion through the pressing pins.

2. The solder body processing tool according to claim 1, wherein: The pressure adjusting portion applies a suction pressure when receiving the solder body into the receiving portion and picking it up, and removes the suction pressure when pushing the solder body out of the receiving portion and releasing it.

3. The solder body processing tool according to claim 2, wherein: When releasing the solder body from the receiving portion, the pressing member mechanically pushes the solder body out of the receiving portion.

4. The solder body processing tool according to claim 3, wherein: The front end of the pressing pin forms a supporting surface for receiving the solder body into the receiving portion.

5. The solder body processing tool according to claim 3, wherein: In a state where a part of the solder body is received in the receiving portion, the pressing member presses the solder body while maintaining the state where one end of the solder body is in contact with the surface of the adhesion object.

6. The solder body processing tool according to claim 5, wherein: The pressing pin presses the solder body based on pneumatic pressure.

7. The solder body processing tool according to claim 6, wherein: The pressing pin presses the solder body with a preset pressure for load control.

8. The solder body processing tool according to claim 6, wherein: An elastic restoring force of a spring is applied between the mounting plate and the pressing block, and this elastic restoring force causes the pressing block to retreat away from the receiving portion, and the pneumatic pressure is only applied when the pressing pin pushes the solder body out of the receiving portion.

9. The solder body processing tool according to claim 6, wherein: The pressing member presses at least twice in a state where the solder body is in contact with the surface of the adhesion object.

10. The solder body processing tool according to claim 1, wherein: The receiving portion is formed with an inclined surface whose opening cross-section gradually expands toward the opening, the inclined surface forms a preset depth from the opening, and is inclined at an angle of 25 degrees to 35 degrees with respect to the depth direction of the receiving portion.

11. The solder body processing tool according to claim 10, wherein: The inclined surface is formed with a depth equivalent to 1 / 3 times to 2 / 3 times the height of the solder body.

12. The solder body processing tool according to claim 1, wherein: The main material of the solder body is copper.

13. The solder body processing tool according to any one of claims 1 to 12, wherein: The processing tool is used to adhere the solder body to the surface of a substrate coated with solder paste.

14. The solder body processing tool according to any one of claims 1 to 12, characterized in that the mounting plate is arranged at the opening of the placing plate in such a manner that the opening of the accommodating portion faces upward; when a solder body is supplied from the solder body supply portion to the surface of the placing plate, the first vibrator arranged on one side of the placing plate and the second vibrator arranged on the other side of the placing plate start to vibrate, causing the placing plate to vibrate and the solder body to rebound, so as to place the solder body into the accommodating portion to which a suction pressure is applied.

15. The solder body processing tool according to any one of claims 1 to 10, characterized in that the pressing member is composed of a plurality of pressing blocks.

16. A solder body processing method for processing a solder body whose height is greater than the long side of the cross section, comprising: a solder body accommodating step of applying a suction pressure to the second accommodating portion of the adhesion processing tool having a mounting plate to accommodate the solder bodies one by one into the second accommodating portion, and the second accommodating portions arranged in a preset pattern are formed on the mounting plate; a processing tool placing step of placing the processing tool at a height corresponding to a preset distance (z2) from the adhesion object; a solder body pressing step of pushing out the solder body to the outside of the second accommodating portion by the second pressing pins arranged in each of the second accommodating portions.

17. The solder body processing method according to claim 16, characterized in that it further includes a suction pressure removing step of removing the suction pressure applied to the accommodating portion before the solder body pressing step or during the solder body pressing step.

18. The solder body processing method according to claim 17, characterized in that, It further includes: a step of applying a static pressure to the second accommodating portion after performing the suction pressure removing step.

19. The solder body processing method according to claim 16, characterized in that it further includes a solder paste forming step of forming a solder paste at a position on the surface of the adhesion object for adhering the solder body before the solder body pressing step.

20. The solder body processing method according to claim 16, characterized in that in the adhesion processing tool placing step, the position and height of the second mounting plate are set relative to the adhesion object, so that while part of the solder bodies are accommodated in the second accommodating portion, the state where the solder bodies are in contact with the solder paste formed on the surface of the adhesion object is maintained.

21. The solder body processing method according to claim 20, characterized in that in the solder body pressing step, while the other end of the solder body is accommodated in the second accommodating portion and one end of the solder body is in contact with the solder paste, a pressure is applied to the solder body toward the solder paste by the second pressing pins.

22. The solder body processing method according to claim 21, characterized in that in the solder body pressing step, while one end of the solder body is in contact with the solder paste, a pressure is applied to the solder body for a preset period of time by the second pressing pins.

23. The solder body processing method according to claim 21, characterized in that In the solder body pressing step, pressure is applied to the solder body based on air pressure through the second pressing pin.

24. The solder body processing method according to claim 21, wherein in the solder body pressing step, in a state where one end of the solder body is in contact with the solder paste, pressure is applied to the solder body at least twice using the second pressing pin.

25. The solder body processing method according to claim 16, wherein the inclined surface is formed to be inclined at an angle of 25 degrees to 35 degrees with respect to the depth direction of the storage portion.

26. A method for processing a solder body, which is used to supply the solder body to a storage part distributed in a preset pattern of a shelving board and perform processing, characterized in that, Comprising: A solder body supply step of supplying a solder body having a height greater than the long side of the cross section to one side of a solder body processing apparatus, wherein the solder body processing apparatus includes a holding processing tool and a placing plate continuously provided at the same height as the mounting plate, in the holding processing tool, an opening of a storage portion formed on the mounting plate and having a predetermined pattern faces upward, a plurality of pressing pins are arranged to be movable from the lower part to the upper part of the storage portion, and a suction pressure can be applied to the storage portion; A solder body moving step of driving a first vibrator arranged on one side of the placing plate and a second vibrator arranged on the other side of the placing plate, and based on the vibration of the placing plate, moving the solder body while making it bounce back to pass over the upper side of the storage portion; A solder body storage step of, in a state where the solder body is located above the storage portion, simultaneously driving the first vibrator and the second vibrator to induce the solder body to bounce back in place and be stored in the storage portion.

27. The solder body processing method according to claim 26, wherein the storage portion is formed with an inclined surface whose opening cross section gradually expands toward the opening, and the inclined surface is inclined at an angle of 25 degrees to 35 degrees with respect to the depth direction of the storage portion.

28. The solder body processing method according to claim 26, wherein the mounting plate and the placing plate are formed of one plate material, so that vibration is transmitted to the mounting plate based on at least one of the first vibrator and the second vibrator.

29. The method for processing a solder body according to claim 26, wherein, Further comprising: An adhesion processing tool placing step of placing the adhesion processing tool at a position aligned with the upper side of the mounting plate of the holding processing tool, wherein the adhesion processing tool includes: a second mounting plate, on which second storage portions are arranged in the same pattern as the pattern of the mounting plate, and the second storage portions are used to individually store the solder bodies; a pressure adjusting portion for applying a suction pressure to the storage portion; a second pressing pin for pushing out the solder body stored in the storage portion to the outside of the storage portion; A pressing pin pressing step of pushing out the solder body stored in the storage portion of the holding processing tool upward by the pressing pin so that at least a part of the solder body is inserted into the second storage portion of the adhesion processing tool; A solder body suction step of applying a suction pressure to the second storage portion of the adhesion processing tool so that the solder body is mounted in the second storage portion.

30. The solder body processing method according to claim 29, wherein In the solder body pressing step, the distance (z1) between the adhesion processing tool and the gripping processing tool is less than the value obtained by subtracting the depth (d1) of the inclined surface of the storage portion from the height (hh) of the solder body.

31. The solder body processing method according to claim 29, characterized in that In the solder body pressing step, the solder body is pushed upward by the pressing pin until the upper end of the solder body is in contact with the second pressing pin of the second storage portion.

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