Camera module

Abstract

The invention discloses a camera module which comprises a photosensitive component and an optical lens arranged on a photosensitive path of the photosensitive component, the optical lens comprises at least one lens substrate and at least one lens unit, the at least one lens substrate is arranged at the top end of the light incident side of the optical lens, and the at least one lens unit is arranged at the top end of the light incident side of the optical lens. The at least one lens unit is integrally formed on the light outlet side of the at least one lens substrate, the lens substrate arranged at the top end of the light inlet side of the optical lens is integrated in the wafer-level lens, the end face of the optical lens is protected through the lens substrate, and the height of the camera module can be reduced. The invention also discloses a camera module, the photosensitive assembly comprises a photosensitive chip and a chip substrate installed on the front surface of the photosensitive chip, at least one of the light incident surface and the light emergent surface of the chip substrate has a curved surface type, and the curved surface type is formed on at least one of the light incident surface and the light emergent surface of the chip substrate. The height of the camera module can be reduced.

Description

A camera module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority and benefits to Chinese Patent Application No. 202211636661.4 and No. 202211636844.6 filed with the State Intellectual Property Office of China on December 26, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of camera modules, and in particular to a camera module manufactured using a wafer-level process and a camera module packaged using a CSP process. Background Art

[0004] With the development of camera technology, camera modules are increasingly being used in a variety of electronic devices, such as mobile phones, tablets, AR / VR, etc. Some of these electronic devices have higher requirements for the size of camera modules. Therefore, it is particularly important to make camera modules smaller so that they can be used in electronic devices with smaller installation spaces.

[0005] Therefore, the present application provides a camera module using a wafer-level lens and a manufacturing method thereof to meet the needs.

[0006] CSP (Chip Scale Package) stands for chip-scale packaging and is a widely used packaging technology for photosensitive components. A CSP-packaged photosensitive component consists of a photosensitive chip and a chip substrate mounted on the chip. This packaging method significantly reduces the lateral size of the chip. This packaging technology is equivalent to adding a glass cover to the photosensitive chip, which can better protect the chip and achieve surface mountability.

[0007] However, this packaging method also makes it difficult to reduce the height of the camera module, as the chip substrate occupies a certain height dimension between the optical lens and the photosensitive chip.

[0008] Therefore, an optimization solution is expected to reduce the height of the camera module packaged using the CSP process.

[0009] Summary of the Invention

[0010] According to the first design scheme of the present application, a camera module is proposed.

[0011] One purpose of the present application is to provide a camera module that overcomes the shortcomings of the prior art, integrates the lens substrate arranged at the top of the light incident side of the optical lens into the wafer-level lens, protects the end face of the optical lens through the lens substrate, and can also reduce the height of the camera module to meet the demand for miniaturization of the camera module.

[0012] According to one aspect of the present application, a camera module is provided, comprising:

[0013] A camera module, characterized by comprising:

[0014] Photosensitive components;

[0015] An optical lens is arranged on the light-sensitive path of the photosensitive component, and the optical lens includes at least one lens substrate and at least one lens unit, wherein the at least one lens substrate is arranged at the top of the light-incident side of the optical lens, and the at least one lens unit is integrally formed on the light-emitting side of the at least one lens substrate.

[0016] In some embodiments, the optical lens includes at least one wafer-level lens, and the at least one wafer-level lens includes an imaging part and a structural part, the structural part surrounds the outer peripheral side of the imaging part, at least a portion of the lens substrate is arranged on the structural part, and at least a portion of the lens unit is arranged on the imaging part.

[0017] In some embodiments, the lens substrate is made of glass, the lens unit is made of resin, the lens unit is arranged on the light incident side or the light exit side of the lens substrate, and is integrally formed on the lens substrate using an embossing process.

[0018] In some embodiments, the at least one wafer-level lens includes a first wafer-level lens, a second wafer-level lens, and a third wafer-level lens sequentially arranged along the optical axis, and the first wafer-level lens is arranged at the top of the light incident side of the optical lens.

[0019] In some embodiments, the first wafer-level lens includes a first lens substrate and a first lens unit, the first lens unit is integrally formed on a surface of a light-emitting side of the first lens substrate, and the first lens substrate is disposed on a top end of the optical lens.

[0020] In some embodiments, the optical lens further includes a support member, and the support member is disposed between the lens substrate of the first wafer-level lens and the second wafer-level lens.

[0021] In some embodiments, the second wafer-level lens and the third wafer-level lens are made of resin, and the second wafer-level lens and the third wafer-level lens are integrally formed through a stamping process.

[0022] In some embodiments, the second wafer-level lens includes a second lens substrate and a second lens unit, and the second lens unit is integrally formed on the light incident side and / or the light exit side of the second lens substrate. The third wafer-level lens includes a third lens substrate and a third lens unit, and the third lens unit is integrally formed on the light incident side and / or the light exit side of the third lens substrate. The second wafer-level lens and the third wafer-level lens are fixedly connected to the third lens substrate via the second lens substrate.

[0023] In some embodiments, the thickness of the first lens substrate is smaller than the thickness of the second lens substrate, the thickness of the second lens substrate is smaller than the thickness of the third lens substrate, and the thicknesses of the first lens substrate, the second lens substrate, and the third lens substrate sequentially arranged along the optical axis gradually increase.

[0024] In some embodiments, the camera module further includes a packaging body, which covers the photosensitive component and the peripheral side of the lens substrate of the optical lens.

[0025] According to the second design scheme of the present application, a camera module is proposed.

[0026] One purpose of the present application is to provide a camera module that overcomes the shortcomings of the prior art, reduces the height of the camera module, and achieves miniaturization.

[0027] According to one aspect of the present application, a camera module is provided, comprising:

[0028] Optical lens;

[0029] A photosensitive component, comprising a photosensitive chip and a chip substrate mounted on the front of the photosensitive chip, wherein the optical lens is arranged on the light-sensitive path of the photosensitive component, and at least one of the light-entry surface and the light-exit surface of the chip substrate has a curved surface.

[0030] In some embodiments, the photosensitive component further includes a supporting structure disposed between the chip substrate and the photosensitive chip, and the chip substrate is mounted on the front side of the photosensitive chip through the supporting structure.

[0031] In some embodiments, the photosensitive component further includes an electrical connection portion, which is disposed on the back side of the photosensitive chip and electrically connected to the photosensitive chip.

[0032] In some embodiments, the chip substrate includes a base and at least one surface portion formed on the light incident surface and / or light emitting surface of the base, and the surface of the surface portion away from the base forms the curved surface of the chip substrate.

[0033] In some embodiments, the surface-shaped portion is formed on the light-emitting surface of the substrate by etching.

[0034] In some embodiments, the surface-shaped portion is integrally formed with the base.

[0035] In some embodiments, the optical lens includes at least one stacked wafer-level lens, and adjacent wafer-level lenses are fixed by an adhesive layer.

[0036] In some embodiments, the camera module also includes an adjustment member arranged between the optical lens and the photosensitive component, wherein the adjustment member is used to fix the relative position of the optical lens and the photosensitive component, and the thickness of the adjustment member is determined by the relative position of the optical lens and the photosensitive component.

[0037] In some embodiments, the camera module further includes a light-transmitting cover plate, which is fixed to the top surface of the optical lens.

[0038] In some embodiments, the camera module also includes a packaging body, which is arranged on the side of the optical lens, the photosensitive component and the transparent cover, and the side of the optical lens, the photosensitive component and the transparent cover are all covered by the packaging body.

[0039] In some embodiments, the wafer-level lens includes a lens substrate and at least one lens unit disposed on the lens substrate, and the thickness of the lens substrate of at least one wafer-level lens of the optical lens gradually increases from the object side to the image side of the optical axis.

[0040] In the following description, some additional embodiments and features are set forth, and those skilled in the art will understand after reviewing the specification or learn these embodiments and features through practice of the disclosed subject matter. A further understanding of the features and advantages of the present disclosure may be achieved by reference to the remainder of the specification and drawings, which constitute a part of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG1 is a schematic cross-sectional view of a camera module according to an embodiment of the present application.

[0042] FIG2 is a schematic structural diagram of a first embodiment of a camera module according to an embodiment of the present application.

[0043] FIG3 is a cross-sectional schematic diagram of a first embodiment of a camera module according to an embodiment of the present application.

[0044] FIG4 is a schematic diagram of a method for manufacturing a lens panel according to a first embodiment of the present application.

[0045] FIG5 is a schematic diagram of a method for manufacturing an optical lens according to a first embodiment of the present application.

[0046] FIG6 is a schematic diagram of a method for manufacturing a camera module according to a first embodiment of the present application.

[0047] FIG7 is a schematic cross-sectional view of a second embodiment of a camera module according to an embodiment of the present application.

[0048] FIG8 is a schematic cross-sectional view of the height of the camera module according to an embodiment of the present application.

[0049] FIG9 is a schematic diagram of a method for manufacturing a lens panel according to a second embodiment of the present application.

[0050] FIG. 10 is a schematic diagram of a method for manufacturing a glass mold according to an embodiment of the present application.

[0051] FIG11 is a schematic diagram of a method for manufacturing a camera module according to a second embodiment of the present application.

[0052] FIG12 is a schematic diagram of a spray-coated encapsulation material according to an embodiment of the present application.

[0053] FIG13 is a cross-sectional schematic diagram of a third embodiment of a camera module according to an embodiment of the present application.

[0054] FIG14 is a schematic cross-sectional view of a fourth embodiment of a camera module according to an embodiment of the present application.

[0055] FIG15 is a schematic cross-sectional view of a camera module according to an embodiment of the present application.

[0056] Figure 16A is a cross-sectional schematic diagram of a first embodiment of a photosensitive component according to an embodiment of the present application.

[0057] Figure 16B is a cross-sectional schematic diagram of a second embodiment of the photosensitive component according to an embodiment of the present application.

[0058] Figure 16C is a cross-sectional schematic diagram of a third embodiment of the photosensitive component according to the embodiment of the present application.

[0059] FIG17 is a schematic structural diagram of an optical lens according to an embodiment of the present application.

[0060] FIG18 is a schematic diagram of a method for manufacturing the optical lens in FIG17 according to the present application.

[0061] FIG19 is a schematic structural diagram of a camera module including the optical lens shown in FIG3 according to an embodiment of the present application.

[0062] Figure 20 is a schematic diagram of the manufacturing method of the camera module shown in Figure 19 of this application.

[0063] Figure 21 is a schematic diagram of another manufacturing method of a camera module according to an embodiment of the present application.

[0064] Figure 22 is a schematic diagram of an assembly method for an optical lens and a photosensitive component by back focus height setting according to an embodiment of the present application.

[0065] FIG23 is a schematic structural diagram of another embodiment of an optical lens according to an embodiment of the present application.

[0066] Figure 24 is a structural schematic diagram of a camera module including the optical lens shown in Figure 23 according to an embodiment of the present application.

[0067] Figure 25 is a structural diagram of another embodiment of the camera module according to the embodiment of the present application. DETAILED DESCRIPTION

[0068] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0069] The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

[0070] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of this application.

[0071] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0072] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0073] It should be noted that, as used in this application, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0074] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections, contact connections, or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0075] Various units, circuits, or other components may be described or stated as being "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply a structure (e.g., a circuit) that performs the one or more tasks during operation by indicating that the unit / circuit / component includes that structure. Additionally, "configured to" may include general structures (e.g., general circuits) manipulated by software and / or firmware to operate in a manner capable of performing the one or more tasks to be addressed. "Configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for implementing or performing the one or more tasks.

[0076] The terms used in this description are only for the purpose of describing specific embodiments and are not intended to be limiting. As used in the specification and the appended claims, the singular forms "a", "an" and "the" are intended to also encompass the plural form, unless the context clearly indicates otherwise. It will also be understood that the terms "and / or" used herein refer to and encompass any and all possible combinations of one or more items in the items listed in association. It will also be understood that the terms "comprises" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their groupings.

[0077] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined that" or "if [stated condition or event] is detected" may be interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0078] Figures 1 to 13 show a camera module 1 and a method for manufacturing the camera module 1 according to an embodiment of the present application. The camera module 1 includes an optical lens 10, a photosensitive component 30 and a package 20, and the optical lens 10 is arranged on the light-sensitive path of the photosensitive component 30. In one embodiment of the present application, the optical lens 10 includes a relative light-entry side and a light-exiting side, wherein the light-entry side faces the object to be photographed and the light-exiting side faces the photosensitive component 30. Light enters from the light-entry side of the optical lens 10, and after being transmitted in the optical lens 10, it is emitted from the light-exiting side of the optical lens 10 to reach the photosensitive component 30. The package 20 is arranged on the peripheral side of the optical lens 10 and / or the photosensitive component 30 to prevent stray light from entering and affecting the imaging effect.

[0079] As shown in Figures 1 to 3, Figure 7 and Figure 12, in an embodiment of the present application, the photosensitive component 30 includes a photosensitive chip 31 and an electrical connection portion 33 arranged on the photosensitive chip 31, wherein other functional elements can be integrated on the electrical connection portion 33 to further process the electrical signal converted by the photosensitive chip 31.

[0080] The photosensitive chip 31 has a front side facing the optical lens 10 and a back side opposite to the front side, wherein the front side of the photosensitive chip 31 includes a photosensitive area and a non-photosensitive area, the non-photosensitive area surrounds the periphery of the photosensitive area, and the photosensitive area is used for photosensitivity.

[0081] In one embodiment of the present application, the electrical connection portion 33 is arranged on the back side of the photosensitive chip 31, wherein the electrical connection portion 33 can be implemented as multiple solder balls, and the multiple solder balls can be replaced by solder bumps, solder pads or other electrical connection elements; in another embodiment of the present application, the electrical connection portion 33 can be arranged in the non-photosensitive area of ​​the front side of the photosensitive chip 31, wherein the electrical connection portion 33 can be implemented as multiple solder pads, and the multiple solder pads can be replaced by solder bumps, solder pads or other electrical connection elements, and the present application does not impose any restrictions on this.

[0082] It can also be said that the photosensitive chip 31 of the wafer-level CSP package adopts the method of directly leading out the electrical connection part 33 from the bottom surface. The photosensitive chip 31 is directly electrically connected to the mainboard of the external electronic device through the electrical connection part 33 on the bottom surface, which can effectively shorten the signal transmission distance and reduce attenuation. It can also improve the anti-interference and anti-noise performance of the photosensitive chip 31, and reduce the lateral size of the photosensitive component 30, making the structure of the photosensitive component 30 more compact.

[0083] In one embodiment of the present application, the photosensitive chip 31 is packaged in a wafer-level CSP package, also known as a wafer-level chip. In this embodiment, the photosensitive chip 31 further includes a protective member 32, which is disposed above the photosensitive chip 31 to protect the photosensitive chip 31. In a specific example of the present application, the protective member 32 can be made of a light-transmitting material, such as transparent glass or transparent resin, and is fixed to the non-photosensitive area on the front of the photosensitive chip 31 by adhesive or other means.

[0084] It should be understood that the photosensitive chip 31 of the wafer-level CSP package is arranged between the protective member 32 and the electrical connection part 33, and the protective member 32 and the electrical connection part 33 are relatively arranged on the front and back sides of the photosensitive chip 31.

[0085] In one embodiment of the present application, the camera module 1 further includes a filter element having an infrared cutoff function, which can filter the light entering the photosensitive chip 31 and filter out stray light such as infrared light that is not necessary for imaging. In a specific example of the present application, the filter element can be arranged above the protective member 32 and located on the light sensing path of the photosensitive chip 31. That is, the filter element is arranged between the optical lens 10 and the photosensitive component 30. Along the height direction, the camera module 1 includes the optical lens 10, the filter element, the protective cover, the photosensitive chip 31 and the electrical connection part 33 in sequence.

[0086] In another specific example of the present application, the protective member 32 has an infrared cutoff function, that is, the protective member 32 acts as a filter element, thereby enabling the protective member 32 to filter the light entering the photosensitive chip 31. This configuration eliminates the need for a separate filter element, which can reduce the cost of the camera module 1 on the one hand, and the overall height of the camera module 1 on the other hand. The infrared cutoff function of the protective member 32 can be achieved, for example, by having the material of the protective member 32 itself have the function of absorbing infrared rays, or by having an infrared cutoff film coated on the surface of the protective member 32, so that the filter element and the protective member 32 are combined into one.

[0087] In another specific example of the present application, the optical lens 10 has an infrared cutoff function, filtering the light entering the photosensitive chip 31. The infrared cutoff function of the optical lens 10 can be achieved by having the material itself have the ability to absorb infrared rays, or by coating the surface of the optical lens 10 with an infrared cutoff film. This configuration eliminates the need for a separate filter element, which can reduce the cost of the camera module 1 on the one hand, and reduce the overall height of the camera module 1 on the other hand.

[0088] In one embodiment of the present application, the encapsulation body 20 is disposed around the optical lens 10 and / or the photosensitive component 30, wherein at least a portion of the optical lens 10 and / or the photosensitive component 30 is encapsulated by the encapsulation body 20 to prevent stray light from entering. The encapsulation body 20 is made of an opaque material, such as dark glue or dark molding material, to absorb stray light.

[0089] Furthermore, in a specific example of the present application, the periphery of the optical lens 10 and / or the photosensitive component 30 of the package 20 extends along the height direction of the camera module 1, so that the periphery of the optical lens 10 and / or the photosensitive component 30 is completely covered by the package 20. It should be understood that the package 20 can be formed by glue dripping, glue spraying, or injection molding, which will be described in detail later in this application.

[0090] As shown in Figures 2 to 12, an optical lens 10 according to an embodiment of the present application is illustrated, wherein the optical lens 10 is manufactured through a wafer-level manufacturing process, and includes at least one wafer-level lens 11 and a light shielding portion 12, the light shielding portion 12 being arranged on the light incident side of the at least one wafer-level lens 11 to reduce stray light from entering the at least one wafer-level lens 11. In a specific example of the present application, the light shielding portion 12 can be implemented as an aperture. Alternatively, in another specific example of the present application, the light shielding portion 12 can also be implemented as a light-shielding coating, a dark-colored paint, such as black, etc.

[0091] In one embodiment of the present application, the optical lens 10 has an optical axis, which is also the optical axis of the at least one wafer-level lens 11. Furthermore, the at least one wafer-level lens 11 includes at least one wafer-level lens arranged sequentially along the optical axis. It should be understood that the number of the at least one wafer-level lens is determined according to the requirements of the optical design, and the number can be one, two, three, or more. The at least one wafer-level lens 11 is made of a light-transmitting material suitable for transmitting visible light, such as a glass material or a resin material.

[0092] The at least one wafer-level lens 11 includes a structural part 1102 and an imaging part 1101, wherein the structural part 1102 is arranged around the outer peripheral side of the imaging part 1101, the imaging part 1101 can refract the light entering the at least one wafer-level lens 11, and the structural part 1102 can support at least one wafer-level lens 11 or adjust the distance between two adjacent wafer-level lenses.

[0093] In one embodiment of the present application, a light shielding portion 12 is disposed on the light incident side of at least one wafer-level lens 11. Furthermore, the light shielding portion 12 is disposed on a structural portion 1102 of at least one wafer-level lens 11 to reduce stray light without affecting the amount of light entering the optical lens 10. For example, the light shielding portion 12 is disposed on the structural portion 1102 on the light incident side of the first wafer-level lens. It should be understood that the first wafer-level lens refers to a wafer-level lens located on the light incident side and closest to the subject.

[0094] Furthermore, the optical lens 10 also includes an adhesive layer 13, which is disposed between adjacent wafer-level lenses to secure the adjacent wafer-level lenses. Of course, the adhesive layer 13 can also be disposed between the wafer-level lens and the light shielding portion 12 to secure the wafer-level lens to the light shielding portion 12; or the adhesive layer 13 can also be disposed between the wafer-level lens and the photosensitive component 30 to secure the wafer-level lens to the photosensitive component 30.

[0095] In the present application, the adhesive layer 13 can be implemented as a UV glue that can be cured by ultraviolet radiation (it is worth mentioning that in the present application, UV glue not only includes glue that can be cured only by ultraviolet radiation, but also includes glue that can be cured by ultraviolet radiation and other methods at the same time, such as UV thermosetting glue). It should be understood that the materials of the adhesive layer 13 provided at different positions can be the same or different. For example, in a specific example of the present application, the adhesive layer 13 can be glue. When the adhesive layer 13 is provided, the glue can be applied continuously or in a dot-shaped interval. In another specific example of the present application, the adhesive layer 13 can also be a solid glue such as double-sided tape, and the present application does not limit this.

[0096] As shown in Figures 2 to 6, in one embodiment of the present application, at least one wafer-level lens 11 includes a first wafer-level lens L11, a second wafer-level lens L12, and a third wafer-level lens L13, and the first wafer-level lens L11, the second wafer-level lens L12, and the third wafer-level lens L13 are arranged in sequence along the optical axis. In a specific example of the present application, the first wafer-level lens L11 is fixed to the light-entering side of the second wafer-level lens L12 via a structural portion 1102, and the second wafer-level lens L12 is fixed to the light-entering side of the third wafer-level lens L13 via a structural portion 1102. The structural portions 1102 of the first wafer-level lens L11, the second wafer-level lens L12, and the third wafer-level lens L13 are used to adjust the distance between adjacent wafer-level lenses and the distance between the wafer-level lenses and the photosensitive component 30.

[0097] Among them, the first wafer-level lens L11, the second wafer-level lens L12 and the third wafer-level lens L13 may individually include at least a light incident surface facing the light from the outside world and a light exit surface opposite to the light incident surface. For example, the light incident surface and the light exit surface of the first wafer-level lens L11, the light incident surface and the light exit surface of the second wafer-level lens L12, and the light incident surface and the light exit surface of the third wafer-level lens L13. In a specific example of the present application, the light incident surface and the light exit surface of the first wafer-level lens L11 are both convex surfaces; the light incident surface and the light exit surface of the second wafer-level lens L12 are convex surfaces; and the light incident surface and the light exit surface of the third wafer-level lens L13 are concave surfaces. It should be understood that a convex surface refers to a curved surface that bends toward the light incident side, and a concave surface refers to a curved surface that bends toward the light exit side.

[0098] Furthermore, an adhesive layer 13 is set between the structural part 1102 of the first wafer-level lens L11 and the structural part 1102 of the second wafer-level lens L12, and an adhesive layer 13 is set between the structural part 1102 of the second wafer-level lens L12 and the structural part 1102 of the third wafer-level lens L13, so as to combine the first wafer-level lens L11, the second wafer-level lens L12 and the third wafer-level lens L13 into one.

[0099] It should be understood that in this embodiment of the present application, the first wafer-level lens L11, the second wafer-level lens L12 and the third wafer-level lens L13 are all made of resin materials, and the coefficient of thermal expansion (CTE) of the resin materials is relatively close. Therefore, under high and low temperature impact, the deformation amounts of the first wafer-level lens L11 and the second wafer-level lens L12 are relatively close, so that the optical lens 10 avoids problems such as glue cracking and deformation, that is, the optical lens 10 is more reliable, and thus the imaging effect of the camera module 1 is better.

[0100] As shown in Figures 2 and 3, in this embodiment of the present application, the optical lens 10 further includes a light-transmitting cover plate 111, which is arranged on the top surface of the light-entering side of at least one wafer-level lens 11 to protect the at least one wafer-level lens 11. In a specific example of the present application, the top surface of at least one wafer-level lens 11 is flat, so that the light-transmitting cover plate 111 can be stably attached to the top surface of at least one wafer-level lens 11. Furthermore, in one embodiment of the present application, the light-entering side surface of the light-transmitting cover plate 111 can be provided with a light-shielding layer, for example, by coating, spraying, silk-screening, etc., to prevent stray light from entering the optical lens 10.

[0101] Specifically, the transparent cover plate 111 is disposed on the top surface of the first wafer-level lens L11. For example, the transparent cover plate 111 is fixed to the structural portion 1102 of the first wafer-level lens L11 by means of adhesive or the like. That is, the transparent cover plate 111 is disposed on the light incident side of the first wafer-level lens L11 to prevent the first wafer-level lens L11 from being directly exposed to the external environment, thereby preventing the first wafer-level lens L11 from being scratched or damaged. It should be understood that an adhesive layer 13 is provided between the transparent cover plate 111 and the structural portion 1102 of the first wafer-level lens L11 to secure the transparent cover plate 111.

[0102] The horizontal width of the transparent cover plate 111 is not less than the horizontal width of the at least one wafer-level lens 11. That is, the lateral dimension of the transparent cover plate 111 is greater than or equal to the lateral dimension of the at least one wafer-level lens 11. Furthermore, the transparent cover plate 111 can be made of a transparent material such as glass to allow light to pass through. The horizontal direction or the lateral direction is perpendicular or approximately perpendicular to the optical axis, and the height direction is parallel to the optical axis. This application will not elaborate on this.

[0103] It should be understood that in other embodiments of the present application, the shading portion 12 may also be provided on the surface of the light incident side of the transparent cover 111 to prevent stray light from entering the interior of at least one wafer-level lens 11, and the present application does not impose any limitation on this.

[0104] As shown in Figure 4, in one embodiment of the present application, at least one wafer-level lens 11 is formed by splitting the lens panel 41, and the lens panel 41 includes a plurality of connected wafer-level lenses. By splitting the lens panel 41, wafer-level lenses can be manufactured in large quantities and at low cost, and the obtained wafer-level lenses also have a relatively small size.

[0105] Furthermore, a method for manufacturing the lens panel 41 is provided, which adopts an integrated stamping molding method and specifically includes the following steps:

[0106] S110: providing a lower mold and placing a wafer-level lens material layer 45 on the lower mold. The wafer-level lens material layer 45 is a resin material;

[0107] S120: Providing an upper mold, aligning and pressing the upper mold with the lower mold, curing the wafer-level lens material layer 45, and removing the upper mold and the lower mold to form a lens panel 41 including a plurality of wafer-level lenses. The wafer-level lens includes an imaging portion 1101 and a structural portion 1102 surrounding the imaging portion 1101;

[0108] S130: Segmenting the lens panel 41 to form a plurality of wafer-level lenses. The lens panel 41 may be segmented by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, and punching to obtain individual wafer-level lenses.

[0109] It should be understood that in the above method, the entire wafer-level lens is embossed and molded by resin material, which has the advantages of uniform stress at high temperature, more flexible surface design, thinner thickness, one-time molding, and simple manufacturing process.

[0110] Using the above method, in the technical solution of the present application, as shown in FIG5 , a first wafer-level lens panel 411, a second wafer-level lens panel 412, and a third wafer-level lens panel 413 having different surface structures can be formed. The first wafer-level lens panel 411, the second wafer-level lens panel 412, and the third wafer-level lens panel 413 are stacked and an adhesive layer is provided between two adjacent wafer-level lens panels 41 to form an optical lens panel 41. Finally, the optical lens panel 41 is cut to form a single optical lens 10.

[0111] As shown in FIG6 , in one embodiment of the present application, a method for manufacturing a camera module 1 is further provided, which includes the following steps:

[0112] S210: Provide a transparent cover panel 43, and attach a single optical lens 10 to the surface of the transparent cover panel 43 by upside-down pasting. A plurality of optical lenses 10 can be arranged on one transparent cover panel 43, i.e., one transparent cover can be divided into a plurality of transparent cover panels 111, and the transparent cover panel 43 is made of glass.

[0113] S220: Attaching a single photosensitive component 30 to the optical lens 10 by reverse pasting, so that the optical lens 10 is located on the light sensing path of the photosensitive component 30. One photosensitive component 30 corresponds to one optical lens 10, so as to form a semi-finished camera module 1;

[0114] S230: Filling the gap between two adjacent optical lenses 10 and the gap between two adjacent photosensitive chips 31 with encapsulation material 21 to shield and protect the sidewalls of the semi-finished camera module 1 from light and prevent stray light from entering. After the encapsulation material 21 is cured, it forms an encapsulation body 20 that covers the sides of the optical lenses 10 and photosensitive chips 31.

[0115] S240: Cutting the transparent cover panel 43 from the light incident side along the gap between two adjacent semi-finished camera modules 1 to form a plurality of transparent cover panels 111, and refilling the gaps between the cut transparent cover panels 43 with the encapsulating material 21. The encapsulating material 21 covers the circumference of the transparent cover panels 111;

[0116] S250: cutting the light shielding material along the height direction to form a single camera module 1. The packaging body 20 covers the transparent cover plate 111, the optical lens 10 and the photosensitive component 30 along the circumference.

[0117] It should be understood that the inverted pasting in this application means that the transparent cover 111 is located below the optical lens 10 along the optical axis direction, and the optical lens 10 is located below the photosensitive component 30, and the transparent cover 111, the optical lens 10 and the photosensitive component 30 are fixed in sequence.

[0118] Because the coefficient of thermal expansion (CTE) of glass and resin differs, high and low temperature shocks can cause cracks or shattering in the glass. Therefore, to address this issue, in this application, an encapsulation body 20 is also provided around the periphery of the transparent cover plate 111 to shield and protect the periphery. Furthermore, the encapsulation body 20 can cover the entire periphery of the transparent cover plate 111.

[0119] Furthermore, in the manufacturing method of the camera module 1 described above, when filling the packaging material 21 in step S230, the packaging material 21 may overflow and overflow onto the chip surface, causing glue overflow. Therefore, in the technical solution of the present application, a dam 42 is provided on the transparent cover plate 111, wherein the dam 42 extends from the surface of the transparent cover plate 111 in the height direction and is provided on the outer periphery of multiple semi-finished camera modules 1, that is, the dam 42 is provided close to the outermost semi-finished camera modules 1. Filling the packaging material 21 between the dam 42 and the semi-finished camera modules 1 helps to prevent the packaging material 21 from overflowing.

[0120] Furthermore, when the semi-finished camera module 1 is attached upside down on the transparent cover plate 111, if the height of the dam 42 is higher than the height of the photosensitive chip 31, glue overflow may occur due to glue creep. Therefore, in a specific example of the present application, the height of the dam 42 is flush with the height of the photosensitive chip 31 to prevent the light-shielding material from overflowing onto the chip surface.

[0121] It should be understood that in the manufacturing method of the above-mentioned camera module 1, in step S210 and step S220, the optical lens 10 and the photosensitive component 30 can be assembled into one body first, and then attached to the surface of the transparent cover 111 by an inverted sticking method, and then the glue filling and splitting steps are performed.

[0122] In the above method, an adhesive layer 13 is provided between the transparent cover plate 111 and the optical lens 10 , and between the optical lens 10 and the photosensitive component 30 , respectively, to fix them to form the camera module 1 .

[0123] In the above method, two splitting operations are performed. The first splitting operation is to fill the gap formed after the splitting with the packaging material 21 to shield and protect the transparent cover 111. The second splitting operation is to split the multiple camera modules 1 formed by the transparent cover 111, the optical lens 10 and the photosensitive component 30 along the packaging material 21 to form a single camera module 1 with at least a portion of the side being covered by the packaging material 21.

[0124] Of course, in another embodiment of the present application, the packaging material 21 may not be provided during the manufacturing process of the camera module 1, and the packaging body 20 may be formed on the peripheral side of the camera module 1 by spraying glue after the camera module 1 is manufactured. Specifically, a single optical lens 10 is attached to the surface of the light-transmitting cover plate 111 by an inverted sticking method; a single photosensitive component 30 is attached to the optical lens 10 by an inverted sticking method; cutting is performed along the gap between two adjacent optical lenses 10 and the gap between two adjacent photosensitive chips 31 to form a single camera module 1; the packaging material 21 is provided on the peripheral side of the camera module 1 by spraying glue, and the packaging body 20 is formed after the packaging material 21 is cured, and the packaging body 20 covers at least a portion of the peripheral side of the camera module 1. For example, the packaging body 20 covers the peripheral side of the light-transmitting cover plate 111, the peripheral side of the optical lens 10, and the peripheral side of the photosensitive component 30. Providing the packaging body 20 by spraying glue can reduce the thickness of the side wall of the camera module 1, which is conducive to reducing the size of the camera module 1.

[0125] That is, in the technical solution of the present application, the camera module 1 includes an optical lens 10, a photosensitive component 30, and a package 20 arranged around the optical lens 10 and the photosensitive component 30. Among them, the optical lens 10 includes a first wafer-level lens L11, a second wafer-level lens L12, and a third wafer-level lens L13 arranged in sequence along the optical axis. In a specific example of the present application, the first wafer-level lens L11, the second wafer-level lens L12, and the third wafer-level lens L13 are manufactured by a process of integrally stamping a resin material. The photosensitive component 30 includes a photosensitive chip 31, a protective part 32 and an electrical connection part 33, wherein the protective part 32 is arranged on the front of the photosensitive chip 31, and the electrical connection part 33 is arranged on the back of the photosensitive chip 31. The third wafer-level lens L13 of the optical lens 10 is arranged on the protective part 32, so that the optical lens 10 is arranged on the photosensitive path of the photosensitive component 30, and the photosensitive chip 31 is electrically connected to other components such as the main board of the electronic device through the electrical connection part 33.

[0126] Furthermore, the optical lens 10 further includes a transparent cover plate 111, which is disposed on the top surface of the optical lens 10 on the light incident side to protect the optical lens 10. The peripheral side of the transparent cover plate 111 is covered by the encapsulation body 20 to prevent the transparent cover plate 111 from breaking and to prevent stray light from entering the optical lens 10.

[0127] Figures 7 to 12 illustrate at least one wafer-level lens 11 according to another embodiment of the present application. As shown in Figures 7 to 12, in another embodiment of the present application, the at least one wafer-level lens 11 includes a first wafer-level lens L21, a second wafer-level lens L22, and a third wafer-level lens L23. The first wafer-level lens L21, the second wafer-level lens L22, and the third wafer-level lens L23 are sequentially arranged along the optical axis. In a specific example of the present application, the first wafer-level lens L21 is fixed to the light incident side of the second wafer-level lens L22, and the second wafer-level lens L22 is fixed to the light incident side of the third wafer-level lens L23.

[0128] As mentioned above, in order to protect at least one wafer-level lens 11, it is necessary to set a transparent cover plate 111 on the top surface of the light-entering side of at least one wafer-level lens 11 to prevent the wafer-level lens from being directly exposed to the outside world and damaged. However, adding the transparent cover plate 111 will increase the height of the camera module 1, which is inconsistent with the requirement of miniaturization of the camera module 1. Therefore, the technical solution of the present application further proposes a new wafer-level lens, which, on the one hand, protects the wafer-level lens and, on the other hand, reduces the height of the camera module 1.

[0129] In this embodiment of the present application, the optical lens 10 includes at least one lens substrate 113 and at least one lens unit 114, wherein the at least one lens substrate 113 is arranged at the top of the light incident side of the optical lens 10, and the at least one lens unit 114 is integrally formed on the light emitting side of the at least one lens substrate 113.

[0130] At least one wafer-level lens 11 of at least one wafer-level lens 11 includes a lens substrate 113 and at least one lens unit 114, and the at least one lens unit 114 is arranged on one side or both sides of the lens substrate 113. The at least one lens unit 114 can be fixed to one side or both sides of the lens substrate 113 by means of one-piece molding such as bonding, insert injection molding or embossing. The at least one lens unit 114 can converge or diverge light. At least a portion of the lens unit 114 is located in the imaging portion 1101 of the at least one wafer-level lens 11, and at least a portion of the lens substrate 113 is located in the structural portion 1102 of the at least one wafer-level lens 11.

[0131] In a specific example of the present application, at least one wafer-level lens 11 includes a lens substrate 113 and a lens unit 114 arranged on the light-entry side or the light-exiting side of the lens substrate 113. That is, one side of the at least one wafer-level lens 11 is a flat surface type, and the other side opposite thereto is a curved surface type. In another specific example of the present application, at least one wafer-level lens 11 includes a lens substrate 113 and two lens units 114 arranged on the light-entry side and the light-exiting side of the lens substrate 113, that is, the opposite sides of the at least one wafer-level lens 11 are curved surface types. It should be understood that the curved surface type can be a spherical surface, an aspherical surface, a free-form surface, or other shapes.

[0132] The structural portion 1102 of at least one wafer-level lens 11 surrounds the outer periphery of the imaging portion 1101 , at least a portion of the lens substrate 113 is disposed on the structural portion 1102 , and at least a portion of the lens unit 114 is disposed on the imaging portion 1101 .

[0133] The lens substrate 113 and the lens unit 114 are both made of light-transmitting materials. For example, the lens substrate 113 is made of glass, and the lens unit 114 is made of resin.

[0134] In this embodiment of the present application, the lens substrate 113 is disposed on the top surface of the light incident side of at least one wafer-level lens 11. Since the lens substrate 113 can also be made of glass, it can replace the transparent cover plate 111 and be disposed on the top surface of the optical lens 10. This arrangement, on the one hand, can protect the optical lens 10 and prevent the at least one wafer-level lens 11 from being directly exposed to the outside world and being damaged; on the other hand, it can eliminate the need for a separate transparent cover plate 111, further reducing the height of the optical lens 10, and thus reducing the height of the camera module 1.

[0135] Furthermore, the width of the lens substrate 113 in the horizontal direction is not less than the width of at least one wafer-level lens 11 in the horizontal direction. That is, the lateral dimension of the lens substrate 113 is greater than or equal to the lateral dimension of at least one wafer-level lens 11. This is to protect at least one wafer-level lens 11. Furthermore, in one embodiment of the present application, the light-entering side surface of the lens substrate 113 can be provided with a light-shielding layer, such as by coating, spraying, silk-screening, etc., to prevent stray light from entering the optical lens 10.

[0136] In the technical solution of the present application, the at least one wafer-level lens 11 may further include a support member 112, which is arranged between adjacent wafer-level lenses. The support member 112 supports adjacent wafer-level lenses and is suitable for adjusting the distance between adjacent wafer-level lenses. It should be understood that in order to avoid affecting the propagation of light within the wafer-level lens, the support member 112 is arranged on the lens substrate 113 without contacting the lens unit 114. In other words, the support member 112 is arranged on the structural part 1102 of the wafer-level lens to avoid affecting the imaging. It should be understood that the support member 112 can be made of glass or resin.

[0137] As shown in Figure 8, in the technical solution of the present application, the right side is the camera module shown in Figure 3, and the top of the camera module is a light-transmitting cover plate 111, and the height of the camera module is H at this time; the left side is the camera module shown in Figure 7, and the top of the camera module is a wafer-level lens 11 including a lens substrate 113 and a lens unit 114, and the height of the camera module is h at this time. By comparison, it can be seen that h is smaller than H. This is because the light-transmitting cover plate 111 is eliminated from the camera module on the left, and its function is integrated into the wafer-level lens. Since the lens substrate 113 of the wafer-level lens 11 is arranged at the top of the camera module, it can not only realize the function of protecting the wafer-level lens, but also reduce the height of the camera module.

[0138] In this embodiment of the present application, the first wafer-level lens L21 includes a first lens substrate 113a and a first lens unit 114a. The first lens unit 114a is integrally formed on the surface of the light-emitting side of the first lens substrate 113a. The first lens substrate 113a is disposed at the top of the optical lens 10. That is, the light-entering side of the first wafer-level lens L21 is a flat surface, and the light-emitting side of the first wafer-level lens L21 is a curved surface. Furthermore, the first lens substrate 113a is made of glass, and the first lens unit 114a is made of resin. In other words, the lens substrate 113 is located on the top surface of the light-entering side of at least one wafer-level lens 11. This arrangement eliminates the need for a transparent cover plate 111, thereby reducing the height of the optical lens 10 and the camera module 1. In other words, integrating the transparent cover plate 111 into the first wafer-level lens L21 allows the first wafer-level lens L21 to not only achieve the functions of converging and diverging light, but also to protect the optical lens 10.

[0139] At least a portion of the first lens unit 114a is located in the imaging portion 1101 of the first wafer-level lens L21, and at least a portion of the first lens substrate 113a is located in the structural portion 1102 of the first wafer-level lens L21. In this way, at least a portion of the first lens unit 114a of the first wafer-level lens L21 can converge or diverge light, and at least a portion of the first lens substrate 113a of the first wafer-level lens L21 can support the first wafer-level lens L21 or adjust the distance between the first wafer-level lens L21 and the second wafer-level lens L22.

[0140] Continuing with FIG. 7 , in one embodiment of the present application, the second and third wafer-level lenses L22 and L23 differ in structure from the first wafer-level lens L21. The second and third wafer-level lenses L22 and L23 are wafer-level lenses integrally formed by imprinting a resin material. The first and second wafer-level lenses L21 and L22 are supported and secured by a support member 112 , while the second and third wafer-level lenses L22 and L23 are supported and secured by a support portion thereon.

[0141] Of course, in another embodiment of the present application, the second wafer-level lens L22 and the third wafer-level lens L23 have the same structure as the first wafer-level lens L21, and both adopt a manufacturing method of forming a lens unit 114 on a lens substrate 113, which will be described in detail later in this application.

[0142] Specifically, the support member 112 is arranged between the first lens substrate 113a of the first wafer-level lens L21 and the structural part 1102 of the second wafer-level lens L22, so as to support the first wafer-level lens L21 and the second wafer-level lens L22 through the support member 112, and also to support the distance between the first wafer-level lens L21 and the second wafer-level lens L22 through the support member 112.

[0143] Among them, the first wafer-level lens L21, the second wafer-level lens L22 and the third wafer-level lens L23 may individually include at least a light incident surface facing the light from the outside world and a light exit surface opposite to the light incident surface. For example, the light incident surface and the light exit surface of the first wafer-level lens L21, the light incident surface and the light exit surface of the second wafer-level lens L22, and the light incident surface and the light exit surface of the third wafer-level lens L23. In a specific example of the present application, the light incident surface of the first wafer-level lens L21 is a plane, and the light exit surface of the first wafer-level lens L21 is a convex surface; the light incident surface and the light exit surface of the second wafer-level lens L22 are convex surfaces; and the light incident surface and the light exit surface of the third wafer-level lens L23 are concave surfaces. It should be understood that a convex surface refers to a curved surface that bends toward the light incident side, and a concave surface refers to a curved surface that bends toward the light exit side.

[0144] Furthermore, an adhesive layer 13 is set between one end of the support member 112 and the first lens substrate 113a of the first wafer-level lens L21, an adhesive layer 13 is set between the other end of the support member 112 and the structural part 1102 of the second wafer-level lens L22, and an adhesive layer 13 is set between the structural part 1102 of the second wafer-level lens L22 and the structural part 1102 of the third wafer-level lens L23, so as to combine the first wafer-level lens L21, the second wafer-level lens L22 and the third wafer-level lens L23 into one.

[0145] As shown in FIG9 , in another embodiment of the present application, a new method for manufacturing a lens panel 41 is provided to manufacture a wafer-level lens including a lens substrate 113 and a lens unit 114. It should be understood that at least one wafer-level lens 11 is formed by dividing the lens panel 41, and the lens panel 41 includes a plurality of connected wafer-level lenses. By dividing the lens panel 41, wafer-level lenses can be manufactured in large quantities at low cost, and the obtained wafer-level lenses also have a relatively small size.

[0146] Furthermore, a method for manufacturing the lens panel 41 includes the following steps:

[0147] S310: providing a lens substrate panel 44, and placing a wafer-level lens material layer 45 on the lens substrate panel 44. The lens substrate panel 44 is made of glass, and the wafer-level lens material layer 45 is made of resin. The lens substrate panel 44 can be divided into a plurality of lens substrates 113;

[0148] S320: Provide an upper mold, press the upper mold onto the lens substrate 113, solidify the wafer-level lens material layer 45 and remove the upper mold to form a plurality of lens units 114 on the lens substrate 113, so as to form a lens panel 41 including the lens substrate 113 and the plurality of lens units 114.

[0149] S330: Segment the lens panel 41 along the gaps between adjacent lens units 114 to form a plurality of wafer-level lenses. The wafer-level lenses include a lens substrate 113 and lens units 114, with the lens units 114 disposed on one side of the lens substrate 113. Segmenting the lens panel 41 can be accomplished by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, and punching to obtain individual wafer-level lenses.

[0150] It should be understood that in the above method, the wafer-level lens is formed by embossing the lens substrate 113 and the lens unit 114. It has a transparent base supported by glass material and is easy to withstand reflow. The manufactured wafer-level lens has no yellowing and high transmittance.

[0151] The above method can form lens units 114 on a single side of the lens substrate 113. When it is necessary to form lens units 114 on both sides of the lens substrate 113, after step S320, a lower mold is provided and a wafer-level lens material layer 45 is placed on the lower mold. The opposite side of the lens substrate 113, on which the plurality of lens units 114 are formed, is pressed against the lower mold. The wafer-level lens material layer 45 is then cured and the lower mold is removed to continue forming a plurality of lens units 114 on the lens substrate 113. In this case, a plurality of lens units 114 are formed on both sides of the lens substrate 113.

[0152] It should be understood that in the manufacturing method of lens panel 41, if the wafer-level lens material layer 45 is continuously applied to the lens substrate 113, on the one hand, the mold will not be filled enough, resulting in gaps, making the surface of the lens unit 114 not meet the requirements; on the other hand, a residual layer will be generated during the mold stamping process. Therefore, in the technical solution of this application, a dispensing mechanism is used to discontinuously apply the wafer-level lens material layer 45 to the lens substrate 113 at the positions corresponding to the mold stamping forming, to solve the above problems.

[0153] Furthermore, as shown in FIG10 , in the technical solution of the present application, a glass mold 46 can also be applied to the manufacture of a wafer-level lens, so that the wafer-level lens is easier to be irradiated with UV light for curing during the manufacturing process. Specifically, the present application provides a method for manufacturing a glass mold 46. First, a hard mold is provided, wherein the hard mold is a wafer-type hard mold that can be used to manufacture a wafer-level lens; a light-transmitting material 461 is set on the hard mold, wherein the light-transmitting material can be, for example, polydimethylsiloxane (PDMS); a glass plate 462 is set on the light-transmitting material 461, that is, the light-transmitting material 461 is clamped between the glass plate 462 and the hard mold, and the light-transmitting material is cured by UV exposure or the like, and the hard mold is removed. In this way, a glass mold 46 can be formed. Since the glass mold 46 can also allow light to pass through, a UV lamp can be directly set above the glass mold 46 during the manufacture of the wafer-level lens to facilitate the curing and molding of the wafer-level lens material layer 45.

[0154] In the technical solution of the present application, the method of steps S310 to S330 can be used to form the first wafer-level lens L21, or other wafer-level lenses with different surface structures can also be formed, and the present application does not limit this. The second wafer-level lens panel 412 and the third wafer-level lens panel 413 are formed by the aforementioned steps S110 to S130, and a support member 112 is set between the first wafer-level lens panel 411 and the second wafer-level lens panel 412, and the support member 112 is fixed between the first wafer-level lens panel 411 and the second wafer-level lens panel 412 by the adhesive layer 13. Furthermore, an adhesive layer 13 is set between the second wafer-level lens panel 412 and the third wafer-level lens panel 413, and the first wafer-level lens panel 411, the second wafer-level lens panel 412 and the third wafer-level lens panel 413 are overlapped along the optical axis direction, fixed to form an optical lens panel 41, and then cut to form a single optical lens 10.

[0155] As shown in FIG11 , in one embodiment of the present application, a method for manufacturing a camera module 1 is further provided, which includes the following steps:

[0156] S410: providing an optical lens 10 and obtaining back focus data of the optical lens 10. The optical lens 10 includes a first wafer-level lens L21, a second wafer-level lens L22, and a third wafer-level lens L23 sequentially arranged along the optical axis, wherein the first wafer-level lens L21 includes a lens substrate 113 and a lens unit 114 arranged on the light-emitting side thereof;

[0157] S420: Providing a photosensitive component 30, obtaining posture data of the photosensitive component 30, including the height and position of the photosensitive chip 31. The photosensitive component 30 is a wafer-level chip, which includes the photosensitive chip 31, a protective member 32 disposed on the front of the photosensitive chip 31, and an electrical connection portion 33 disposed on the back of the photosensitive chip 31;

[0158] S430: Determine the relative positions of the optical lens 10 and the photosensitive chip 31 according to the back focus data of the optical lens 10 and the posture data of the photosensitive component 30, then set the optical lens 10 on the photosensitive path of the photosensitive component 30 according to the relative position relationship, and set an adhesive layer 13 between the optical lens 10 and the photosensitive component 30, and cure it to fix the optical lens 10 and the photosensitive component 30 to form a camera module 1.

[0159] Furthermore, in step S410, a light source can be arranged above the optical lens 10, and the optical lens 10 receives and converges the light projected by the light source and then emits it to a receiving platform. The distance between the receiving platform and the optical lens 10 is adjusted so that the optical lens 10 converges the received light on the receiving platform, thereby obtaining the back focus data of the optical lens 10. The back focus data of the optical lens 10 includes the back focus distance of the optical lens 10. Through the back focus distance, the ideal spacing between the optical lens 10 and the photosensitive component 30 can be obtained, and an adjustment element 115 of a suitable thickness can be selected to fix the ideal distance between the optical lens 10 and the photosensitive component 30. In other words, in the present application, the distance between the optical lens 10 and the photosensitive component 30 can be determined by the back focus distance of the optical lens 10.

[0160] Furthermore, in step S420, the height information of multiple points on the top surface of the photosensitive component 30 can be obtained by a laser altimeter, thereby obtaining the posture data of the photosensitive component 30. The posture data of the photosensitive component 30 includes the height position information of the photosensitive component 30. By obtaining the height position information of the photosensitive component 30, the position where the optical lens 10 should be set can be determined, so that the optical lens 10 is set above the photosensitive component 30 so that the image plane of the optical lens 10 can overlap with the photosensitive area of ​​the photosensitive chip 31 of the photosensitive component 30. Specifically, the posture data of the photosensitive component 30 can be obtained by laser altimeter.

[0161] It should be understood that in the technical solution of the present application, the back focus data of the optical lens 10 includes not only the back focus distance of the optical lens 10 but also the image plane data of the optical lens 10. The image plane data includes the tilt posture of the image plane of the optical lens 10. Therefore, in the present application, the tilt angle of the optical lens 10 relative to the photosensitive component 30 can be further adjusted so that the image plane of the optical lens 10 overlaps with the photosensitive area of ​​the photosensitive chip 31. Furthermore, the posture data of the photosensitive component 30 can also further include the tilt data of the photosensitive component 30, so as to more accurately adjust the tilt angle between the optical lens 10 and the photosensitive component 30 so that the image plane of the optical lens 10 overlaps with the photosensitive area of ​​the photosensitive chip 31. For example, the tilt angle of the optical lens 10 and the tilt angle of the photosensitive component 30 can be adjusted separately to improve the adjustment efficiency.

[0162] In step S430, the adhesive layer 13 can be adjusted according to the ideal distance between the optical lens 10 and the photosensitive component 30, and the thickness of the adhesive layer 13 is equal to the ideal distance between the optical lens 10 and the photosensitive component 30. For example, when the thickness between the optical lens 10 and the photosensitive component 30 is 20 μm, the thickness of the adhesive layer 13 is set to 20 μm. It is worth mentioning that the adhesive layer 13 has an annular structure. When there is an inclination angle between the optical lens 10 and the photosensitive component 30, the thickness of the annular adhesive layer 13 is uneven in the circumferential direction to match the gap between the optical lens 10 and the photosensitive component 30.

[0163] In a specific example of the present application, the adhesive layer 13 can be implemented as a UV glue that can be cured by ultraviolet radiation (it is worth mentioning that in the present application, UV glue not only includes glue that can be cured only by ultraviolet radiation, but also includes glue that can be cured by ultraviolet radiation and other methods at the same time, such as UV thermosetting glue). Furthermore, the adhesive layer 13 can also be a particle glue. Specifically, the adjustment element 115 includes glue and particles wrapped in the glue. The diameter of the particles can be based on the ideal distance between the optical lens 10 and the photosensitive component 30.

[0164] After the camera module 1 is obtained by the above method, a packaging material 21 is sprayed on the peripheral side of the camera module 1. After the packaging material 21 is cured, a packaging body 20 is formed, and the packaging body 20 covers the peripheral side of the camera module 1, as shown in Figure 12. The packaging body 20 can cover a part of the peripheral side of the camera module 1, or it can cover the entire peripheral side of the camera module 1. Furthermore, a protective device can be set on the top and bottom surfaces of the camera module 1, for example, a protective device can be set on the top surface of the lens substrate 113 and the bottom surface of the electrical connection part 33, so as to ensure that the packaging material 21 does not affect the top and bottom surfaces of the camera module 1 during the process of setting the packaging body 20 on the peripheral side of the camera module 1.

[0165] In the technical solution of the present application, a package 20 is provided on at least a portion of the peripheral side of the camera module 1. The package 20 covers the peripheral side of the optical lens 10 and the peripheral side of the photosensitive component 30. It should be understood that the first lens substrate 113a of the first wafer-level lens L21 is made of glass. When subjected to high and low temperature shocks, cracks will be generated in the glass material, or the glass material will be shattered. Therefore, in order to solve the above problems, in the present application, a package 20 is also provided on the peripheral side of the first lens substrate 113a to shield and protect the peripheral side of the first lens substrate 113a. In other words, the package 20 covers the entire area of ​​the peripheral side of the optical lens 10.

[0166] That is to say, in the technical solution of the present application, the camera module 1 includes an optical lens 10, a photosensitive component 30, and a package body 20 arranged around the optical lens 10 and the photosensitive component 30. Among them, the optical lens 10 includes a first wafer-level lens L21, a second wafer-level lens L22, and a third wafer-level lens L23 arranged in sequence along the optical axis. In a specific example of the present application, the first wafer-level lens L21 is manufactured by a process of imprinting and molding the lens unit 114 on the lens substrate 113. The second wafer-level lens L22 and the third wafer-level lens L23 can adopt the same manufacturing process as the first wafer-level lens L21, or can adopt a manufacturing process of integral imprint molding of resin materials. The present application does not impose any restrictions on this. The photosensitive component 30 includes a photosensitive chip 31, a protective member 32 and an electrical connection part 33, wherein the protective member 32 is arranged on the front of the photosensitive chip 31, the electrical connection part 33 is arranged on the back of the photosensitive chip 31, the optical lens 10 is arranged on the protective member 32, and the photosensitive chip 31 is electrically connected to other components such as the motherboard of the electronic device through the electrical connection part 33.

[0167] Furthermore, the packaging body 20 is arranged on the peripheral side of the camera module 1, which covers the entire area of ​​the peripheral side of the optical lens 10 and the entire area of ​​the peripheral side of the photosensitive component 30.

[0168] FIG13 shows at least one wafer-level lens 11 according to another embodiment of the present application. As shown in FIG13 , in another embodiment of the present application, the at least one wafer-level lens 11 includes a first wafer-level lens L31, a second wafer-level lens L32, and a third wafer-level lens L33. The first wafer-level lens L31, the second wafer-level lens L32, and the third wafer-level lens L33 are sequentially arranged along the optical axis. In a specific example of the present application, the first wafer-level lens L31 is fixed to the light incident side of the second wafer-level lens L32, and the second wafer-level lens L32 is fixed to the light incident side of the third wafer-level lens L33.

[0169] In the technical solution of the present application, the first wafer-level lens L31 includes a first lens substrate 113a and a first lens unit 114a, the second wafer-level lens L32 includes a second lens substrate 113b and a second lens unit 114b, and the third wafer-level lens L33 includes a third lens substrate 113c and a third lens unit 114c. The second lens unit 114b is integrally formed on the light-entry side and / or light-exit side of the second lens substrate 113b, and the third lens unit 114c is integrally formed on the light-entry side and / or light-exit side of the third lens substrate 113c. In other words, the first wafer-level lens L31, the second wafer-level lens L32, and the third wafer-level lens L33 are all manufactured using a process of imprinting and molding the lens unit 114 on the lens substrate 113.

[0170] The first lens unit 114a is located on the light-exiting side of the first lens substrate 113a, the second lens unit 114b is located on the light-incident side of the second lens substrate 113b, and the third lens unit 114c is located on the light-exiting side of the third lens substrate 113c. That is, the light-incident surface of the first wafer-level lens L31 is a flat surface, while the light-exiting surface of the first wafer-level lens L31 is a convex surface; the light-incident surface of the second wafer-level lens L32 is a convex surface, while the light-exiting surface of the second wafer-level lens L32 is a flat surface; and the light-incident surface of the third wafer-level lens L33 is a flat surface, while the light-exiting surface of the third wafer-level lens L33 is a concave surface.

[0171] Specifically, a support member 112 is provided between the first wafer-level lens L31 and the second wafer-level lens L32, and the first wafer-level lens L31 and the second wafer-level lens L32 are supported and fixed by the support member 112. The second lens substrate 113b of the second wafer-level lens L32 and the third lens substrate 113c of the third wafer-level lens L33 are connected to each other to support and fix the second wafer-level lens L32 and the third wafer-level lens L33. Specifically, the second wafer-level lens L32 and the third wafer-level lens L33 are fixedly connected via the second lens substrate 113b and the third lens substrate 113c.

[0172] Furthermore, an adhesive layer 13 is set between one end of the support member 112 and the first lens substrate 113a of the first wafer-level lens L31, an adhesive layer 13 is set between the other end of the support member 112 and the second lens substrate 113b of the second wafer-level lens L32, and an adhesive layer 13 is set between the lens substrate 113 of the second wafer-level lens L32 and the lens substrate 113 of the third wafer-level lens L33, so as to bond and fix the first wafer-level lens L31, the second wafer-level lens L32 and the third wafer-level lens L33 together.

[0173] Furthermore, in the technical solution of the present application, an adjustment element 115 is provided between the optical lens 10 and the photosensitive component 30. Since the camera module 1 in the present application is a fixed-focus module, the back focus of the camera module 1 can be adjusted by adjusting the height of the adjustment element 115 so that the photosensitive chip 31 is located on the focal plane of the optical lens 10 imaging. In a specific example of the present application, the adjustment element 115 is provided between the third wafer-level lens L33 and the protective member 32 of the photosensitive component 30. The adjustment element 115 has a certain height so that the light passing through the optical lens 10 can reach the photosensitive chip 31. The adjustment element 115 is made of a light-transmitting material, such as glass or resin.

[0174] Furthermore, a support member 112 is provided between the adjustment element 115 and the third wafer-level lens L33 to support and fix the third wafer-level lens L33, and can also prevent the adjustment element 115 from contacting the third lens unit 114c of the third wafer-level lens L33, causing damage to the third lens unit 114c of the third wafer-level lens L33.

[0175] It should be understood that the adjustment element 115 has an infrared cutoff function, that is, the adjustment element 115 acts as a filter element, thereby enabling the adjustment element 115 to filter the light entering the photosensitive chip 31. This configuration eliminates the need for a separate filter element, which can reduce the cost of the camera module 1 and the overall height of the camera module 1. The infrared cutoff function of the adjustment element 115 can be achieved, for example, by having the material of the adjustment element 115 itself have the ability to absorb infrared rays, or by having an infrared cutoff film coated on the surface of the adjustment element 115, thereby combining the filter element and the adjustment element 115 into one.

[0176] In the technical solution of the present application, the method of the aforementioned steps S310 to S330 can be used to manufacture and form the first wafer-level lens L31, the second wafer-level lens L32 and the third wafer-level lens L33, and the first wafer-level lens L31, the second wafer-level lens L32 and the third wafer-level lens L33 are overlapped along the optical axis direction and fixed by the adhesive layer 13 to form the optical lens 10.

[0177] The camera module 1 is manufactured using the method of the above-mentioned steps S410 to S440, wherein steps S410 to S440 further include: setting an adjustment element 115 between the third wafer-level lens L33 and the photosensitive component 30, and adjusting the relative position between the optical lens 10 and the photosensitive component 30 by the adjustment element 115.

[0178] Furthermore, in the present application, the thickness of the lens substrate 113 of at least one wafer-level lens 11 in the optical lens 10 is different, so as to adapt to the optical design requirements of each wafer-level lens 11 respectively, thereby reducing the height of the optical lens 10. It is worth mentioning that the thickness of the lens substrate 113 described in the present application refers to the size of the lens substrate 113 along the optical axis.

[0179] As shown in FIG14 , in one example, the thickness of the lens substrate 113 of at least one wafer-level lens 11 gradually increases from the object side to the image side of the optical axis. In other words, the thickness of the lens substrate 113 of at least one wafer-level lens 11 increases along the direction of light incidence. Since the thickness of the wafer-level lens 11 of the optical lens 10 adopted in the present application gradually increases from the object side to the image side of the optical axis, the thickness of the lens substrate 113 of at least one wafer-level lens 11 gradually increases from the object side to the image side of the optical axis, which increases the volume share of the lens substrate 113 in the wafer-level lens 11 and reduces the volume share of the lens unit 114. This reduces the shrinkage of the lens unit 114, thereby reducing the difference in expansion and contraction between the lens unit 114 and the lens substrate 113 due to the different materials. It is understandable that during the manufacturing process of the optical lens 10 and the camera module 1, it is necessary to switch between high temperature and room temperature. Excessive expansion and contraction differences will lead to reduced imaging quality of the optical lens 10 and the camera module 1 obtained.

[0180] It is worth mentioning that in one example of the present application, the refractive index of the lens substrate 113 is greater than the refractive index of the lens unit 114. In this way, the volume proportion of the lens substrate 113 in the wafer-level lens 11 is increased, and the thickness of the wafer-level lens 11 can also be reduced, thereby reducing the overall height of the optical lens 10 and the camera module 1. In a specific example, the lens substrate 113 is made of glass material and the lens unit 114 is made of resin material, wherein the refractive index of the lens substrate 113 is 1.5178, and the refractive index of the lens unit 114 is 1.50547.

[0181] Continuing with FIG14 , in one example, the first lens unit 114a is formed on the image side of the first lens substrate 113a by nanoimprint lithography. The first lens substrate 113a is made of glass, and the first lens unit 114a is made of resin. The second lens unit 114b is formed on the object side of the second lens substrate 113b by nanoimprint lithography. The second lens substrate 113b is made of glass, and the second lens unit 114b is made of resin. The third lens unit 114c is formed on the image side of the third lens substrate 113c by nanoimprint lithography. The third lens substrate 113c is made of glass, and the third lens unit 114c is made of resin. In this example, the thickness of the first lens substrate 113a is less than that of the second lens substrate 113b, and the thickness of the second lens substrate 113b is less than that of the third lens substrate 113c. As a result, the thicknesses of the first lens substrate 113a, the second lens substrate 113b, and the third lens substrate 113c gradually increase from the object side to the image side of the optical axis. For example, the thickness of the first lens substrate 113 a is approximately 0.05 mm, the thickness of the second lens substrate 113 b is approximately 0.18 mm, and the thickness of the third lens substrate 113 c is approximately 0.34 mm.

[0182] It is worth mentioning that in an example of the present application, the optical lens 10 provided in the present application has an aperture value (Fno) of 2.5, a total optical length (TTL) of 1.9 mm, a field of view angle of 104°, and an object distance range of 30 mm.

[0183] FIG15 shows a cross-sectional view of the camera module 10′ of the present application. As shown in FIG15 , the camera module 10′ includes an optical lens 11′ and a photosensitive component 12′. The optical lens 11′ is disposed on the light sensing path of the photosensitive component 12′, thereby transmitting the light focused by the optical lens 11′ to the photosensitive component 12′.

[0184] The photosensitive component 12' includes a photosensitive chip 121' and a chip substrate 122' mounted on the front of the photosensitive chip 121', wherein the side of the photosensitive chip 121' facing the optical lens 11' is the front of the photosensitive chip 121', and the side of the photosensitive chip 121' away from the optical lens 11' is the back of the photosensitive chip 121'. The photosensitive chip 121' includes a photosensitive area 1211' and a non-photosensitive area 1212'. The non-photosensitive area 1212' is arranged around the photosensitive area 1211'. The photosensitive area 1211' is used to obtain light incident on the photosensitive chip 121', and the non-photosensitive area 1212' is used to support the photosensitive area 1211' and provide a circuit for the photosensitive area 1211' to transmit electrical signals. The chip substrate 122' is disposed over the photosensitive area 1211' and the non-photosensitive area 1212' of the photosensitive chip 121' to protect the photosensitive area 1211' and the non-photosensitive area 1212' of the photosensitive chip 121'. It is worth mentioning that the chip substrate 122' can be made of one or more light-transmitting materials. For example, the chip substrate 122' can be made of a glass material or a resin material, or the chip substrate 122' can be made of a glass material and a resin material.

[0185] The photosensitive component 12' also includes an electrical connection portion 124', which is electrically connected to the photosensitive chip 121' to export the image information obtained by the photosensitive chip 121'. The photosensitive chip 121' is electrically connected to other electronic devices through the electrical connection portion 124'. In one example of the present application, the electrical connection portion 124' is provided on the back of the photosensitive chip 121', so that the camera module 10' can be directly electrically connected to other electronic devices through the electrical connection portion 124' on the back of the photosensitive chip 121'. The electrical connection portion 124' can be implemented as a plurality of solder pads or solder balls arranged in an array, and the solder pads or solder balls can be made of a metal suitable for conducting electricity, such as copper, silver, or gold.

[0186] Continuing with reference to Figure 15, the photosensitive component 12' also includes a support structure 123' arranged between the chip substrate 122' and the photosensitive chip 121', and the chip substrate 122' is mounted on the front of the photosensitive chip 121' through the support structure 123'. Specifically, the support structure 123' is fixed between the non-photosensitive area 1212' of the photosensitive chip 121' and the chip substrate 122', and the chip substrate 122' is fixed to the non-photosensitive area 1212' of the photosensitive chip 121' through the support structure 123'. The support structure 123' can create an air gap between the chip substrate 122' and the photosensitive chip 121', so that the chip substrate 122' will not directly contact the photosensitive area 1211' of the photosensitive chip 121'. By adjusting the height of the support structure 123', the distance between the chip substrate 122' and the photosensitive chip 121' can be adjusted. The support structure 123' can be an adhesive medium such as glue. For example, glue is placed between the chip substrate 122' and the photosensitive chip 121' and solidified to form a support structure 123' fixed between the non-photosensitive area 1212' of the photosensitive chip 121' and the chip substrate 122'.

[0187] In the present application, the camera module 10' adopts a CSP-packaged photosensitive component to obtain one-dimensional or two-dimensional optical information and convert it into an electrical signal. CSP (Chip Scale Package) means chip-scale packaging. The photosensitive component packaged with CSP is smaller in size, which helps to achieve the miniaturization of the camera module, so that the camera module can be applied to electronic devices with smaller internal space, such as mobile phones, AR / VR, and endoscopes. However, since the CSP-packaged photosensitive component uses a chip substrate to package the photosensitive chip, the chip substrate occupies the height dimension, the height dimension of the photosensitive component becomes larger, and the height of the camera module becomes difficult to reduce. For this reason, the present application further improves the chip substrate so that the height of the camera module can be reduced.

[0188] Figures 16A to 16C show cross-sectional schematic diagrams of three embodiments of the photosensitive component 12' of the present application. As shown in Figure 1 and Figures 16A to 16C, at least one of the light-entering surface and the light-emitting surface of the chip substrate 122' has a curved surface shape, so that the light emitted from the optical lens 11' is deflected by the chip substrate 122'. In one example of the present application, the curved surface shape can be a rotationally symmetrical spherical surface or an aspherical surface; in another example of the present application, the curved surface shape can also be a free-form surface, so as to compensate for aberrations or distortion problems. It is worth mentioning that in the present application, the deflection of light by the chip substrate 122' means that the direction of light incident on the chip substrate 122' after refraction and exiting the chip substrate 122' is not parallel to the direction of light incident on the chip substrate 122'. In other words, in some embodiments of the present application, the chip substrate 122' also participates in the light modulation process of the camera module 10', thereby replacing or supplementing the optical modulation function of the optical lens 11'. Specifically, the chip substrate 122' includes a base 1221' and at least one surface-shaped portion 1222' formed on the light incident surface and / or light emitting surface of the base 1221'. The surface of the surface-shaped portion 1222' away from the base 1221' forms the curved surface of the chip substrate 122', and light is deflected after passing through the surface-shaped portion 1222'. In one example of the present application, the surface-shaped portion 1222' is fixed to the light incident surface or the light emitting surface of the base 1221' by, for example, etching, integral molding, etc. In the present application, the light incident surface refers to the side where light is incident, and the light emitting surface refers to the side where light is emitted.

[0189] For ease of description, in this application, the side of the camera module 10' or optical lens 11' facing the subject is referred to as the object side, and the side opposite to the object side is referred to as the image side. In other words, the object side refers to the side where imaging light enters the camera module 10' or optical lens 11', and the image side refers to the side where imaging light exits the camera module 10' or optical lens 11', that is, the side of the camera module 10' or optical lens 11' facing the image plane. From the perspective of the camera module 10' shown in Figure 15, the upper side of the camera module 10' is the image side, and the lower side of the camera module 10' is the object side.

[0190] Figure 16A shows a cross-sectional schematic diagram of an embodiment of the photosensitive component 12' of the present application. As shown in Figure 16A, the chip substrate 122' is fixed to the non-photosensitive area 1212' of the photosensitive chip 121' through the support structure 123'. The light-emitting surface of the chip substrate 122' has an inwardly concave curved surface. The curved surface is concave and does not affect the installation between the chip substrate 122' and the photosensitive chip 121'. The chip substrate 122' includes a base 1221' and a surface portion 1222' formed by etching on the light-emitting surface of the base 1221'. Specifically, in this embodiment, the base 1221' can be made of a glass material, and a curved surface is etched on the base 1221' by an etching solution such as hydrofluoric acid to form the surface portion 1222'. The surface portion 1222' is formed by etching on the light-emitting surface of the base 1221'.

[0191] Figure 16B shows a cross-sectional schematic diagram of another embodiment of the photosensitive component 12' of the present application. As shown in Figure 16B, the chip substrate 122' is fixed to the non-photosensitive area 1212' of the photosensitive chip 121' through the support structure 123', and the light incident surface of the chip substrate 122' has a curved surface protruding outward, and the curved surface is a convex surface. The curved surface is formed on the light incident side of the chip substrate 122' away from the photosensitive chip 121', and does not affect the installation between the chip substrate 122' and the photosensitive chip 121'. The chip substrate 122' includes a base 1221' and a surface-shaped portion 1222', and the surface-shaped portion 1222' is integrally formed on the light incident surface of the base 1221'. Specifically, in this embodiment, the base 1221' can be made of glass or resin. The surface portion 1222' is integrally formed on the base 1221' by embossing or injection molding to form a curved surface. The surface portion 1222' can be made of resin.

[0192] Figure 16C shows a cross-sectional schematic diagram of another embodiment of the photosensitive component 12' of the present application. As shown in Figure 16C, the chip substrate 122' is fixed to the non-photosensitive area 1212' of the photosensitive chip 121' through the support structure 123'. The light incident surface of the chip substrate 122' has an outwardly convex curved surface, and the light exit surface of the chip substrate 122' has an inwardly concave curved surface, which does not affect the installation between the chip substrate 122' and the photosensitive chip 121'. The chip substrate 122' includes a base 1221' and a two-sided portion 1222', and the two-sided portion 1222' is respectively arranged on the light incident surface and the light exit surface of the base 1221'. Specifically, in this embodiment, the base 1221' can be made of glass material or resin material, and the one-sided portion 1222' is integrally formed on the light incident surface and the light exit surface of the base 1221' by embossing or injection molding.

[0193] In conjunction with Figures 16A to 16C, in the present application, at least one of the light incident surface and the light emitting surface of the chip substrate 122' has a curved surface, so that the chip substrate 122' has at least some of the functions of a lens. The curved surface of the chip substrate 122' can be convex or concave. In a preferred example, the light emitting surface of the chip substrate 122' is recessed inward to form a concave curved surface. The concave curved surface does not increase the thickness of the chip substrate 122', does not affect the installation between the chip substrate 122' and the photosensitive chip 121', and does not increase the height of the support structure 123' due to the setting of the curved surface. In this way, the overall height of the camera module 10' can be reduced as much as possible.

[0194] In one example, the photosensitive component 12' described in the present application can be made by fixing a single chip substrate 122', a photosensitive chip 121' and a support structure 123'; in another example, the photosensitive component 12' described in the present application can also be manufactured by a panelization process such as a wafer-level process. It is worth mentioning that when the photosensitive component 12' shown in Figures 16A to 16C is manufactured by a wafer-level process, a plurality of array-arranged curved surface shapes can be first formed on the upper surface or lower surface of the substrate 1221' wafer, and then the support structure 123' and the photosensitive chip 121' wafer are fixed on top of the substrate 1221' wafer in sequence, and the support structure 123' and the photosensitive chip 121' respectively correspond to the curved surface shapes on the substrate 1221' wafer, and finally, they are divided to obtain multiple photosensitive components 12'. Due to the above process, in the present application, the side of the chip substrate 122' is flush with the side of the photosensitive chip 121'.

[0195] Next, the optical lens 11' shown in FIG15 is described. In the present application, the optical lens 11' can be obtained by assembling multiple optical lenses in a lens barrel. The optical lenses are usually formed by mold injection molding. However, the height and radial dimensions of the optical lens 11' obtained in this manner are relatively large, making it difficult to achieve a miniaturized camera module 10'. Therefore, in the present application, the optical lens 11' can also be manufactured using a wafer-level process, thereby ultimately obtaining a wafer-level module (WLC module).

[0196] Figure 17 shows a schematic structural diagram of an embodiment of the optical lens 11' of the present application, and Figure 18 shows the manufacturing process of the optical lens 11' shown in Figure 17. As shown in Figure 17, the optical lens 11' includes at least one stacked wafer-level lens 111', and adjacent wafer-level lenses 111' are fixed by an adhesive layer 112'. The wafer-level lens 111' includes an imaging part 1113' and a structural part 1114' that are interconnected. The structural part 1114' surrounds the imaging part 1113' and supports the imaging part 1113', and adjacent wafer-level lenses 111' are fixed by an adhesive layer 112' arranged between the structural parts 1114'. The adhesive layer 112' can be a glue suitable for bonding, such as UV glue, thermosetting glue or UV thermosetting glue.

[0197] In a specific example, at least one wafer-level lens 111' of the optical lens 11' includes three wafer-level lenses 111', namely a first wafer-level lens L1', a second wafer-level lens L2' and a third wafer-level lens L3'. An adhesive layer 112' is provided between the structural portion 1114' of the first wafer-level lens L1' and the structural portion 1114' of the second wafer-level lens L2' to fix the first wafer-level lens L1' and the second wafer-level lens L2'. An adhesive layer 112' is provided between the structural portion 1114' of the second wafer-level lens L2' and the structural portion 1114' of the third wafer-level lens L3' to fix the second wafer-level lens L2' and the third wafer-level lens L3'. It is worth mentioning that in the present application, the number of wafer-level lenses 111' included in the optical lens 11' can also be four, five or more, depending on the requirements of the optical design.

[0198] In this embodiment, the optical lens 11' is made by a wafer-level process. Specifically, as shown in Figure 18, a plurality of lens panels 211' are stacked and an adhesive layer 112' is set between the plurality of lens panels 211' to fix them to form a lens panel 21', and the lens panel 21' is divided to form a plurality of optical lenses 11', wherein the lens panel 211' is also divided into a plurality of optical lenses 11'. In this embodiment, the cross-section of the divided optical lens 11' and the wafer-level lens 111' along the direction perpendicular to its optical axis can be square. Of course, other division methods can also be used to form a rhombus or a regular hexagonal shape. It is worth mentioning that in the present application, the lens panel 21' can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching cutting and other methods to obtain the optical lens 11'. The optical lens 11' made by the wafer-level process can also be called a wafer-level lens (wafer level optics).

[0199] Continuing with reference to Figure 18, the lens panel 211' includes a plurality of connected wafer-level lenses 111'. The lens panel 21' formed by the stacked plurality of lens panels 211' includes a plurality of connected optical lenses 11'. The optical axes of the wafer-level lenses 111' between adjacent lens panels 211' are aligned. The lens panel 211' is made by an embossing process. Specifically, by setting a lens material between an upper mold and a lower mold, then shortening the distance between the upper mold and the lower mold, curing the lens material, and embossing a lens panel 211'. In one example of the present application, the lens material is an epoxy resin material, which can be cured by ultraviolet light (UV) or thermally cured. When the lens material is cured by ultraviolet light, at least one of the upper mold and the lower mold is a light-transmitting mold, so that ultraviolet light can pass through the upper mold or the lower mold to irradiate the lens material. It is worth mentioning that in this embodiment, the entire wafer-level lens 111' is embossed and formed by the lens material. Due to the use of a single lens material, the wafer-level lens 111' has uniform stress at high temperatures and its surface design is flexible.

[0200] Figure 19 shows a camera module 10' including the optical lens 11' shown in Figure 17. As shown in Figure 19, the optical lens 11' is fixed to the photosensitive component 12'. In a specific example, the bottom surface of the structural portion 1114' of the last wafer-level lens 111' (the third wafer-level lens L3') closest to the photosensitive component 12' in the optical lens 11' protrudes from the bottom surface of the imaging portion 1113', so that the optical lens 11' is directly fixed to the photosensitive component 12' by relying on the structural portion 1114' of the optical lens 11'.

[0201] The camera module 10' also includes a packaging body 13', which is arranged on the side of the optical lens 11' and the photosensitive component 12'. The sides of the optical lens 11' and the photosensitive component 12' are all covered by the packaging body 13' to protect the optical lens 11' and the photosensitive component 12'. The packaging body 13' is made of opaque material and can also prevent stray light from entering the optical lens 11'.

[0202] Continuing to refer to Figure 19, the camera module 10' also includes a light-transmitting cover plate 14', which is fixed to the top surface of the optical lens 11'. The light-transmitting cover plate 14' is suitable for passing light and protecting the optical lens 11'. Among them, the top surface of the structural portion 1114' of the first wafer-level lens L1' closest to the object in the optical lens 11' protrudes from the top surface of the imaging portion 1113', and the imaging portion 1113' of the first wafer-level lens L1' is lower than the structural portion 1114' of the first wafer-level lens L1', so that the light-transmitting cover plate 14' is fixed to the structural portion 1114' of the first wafer-level lens L1' of the optical lens 11'. Specifically, an adhesive layer 112' is provided between the light-transmitting cover plate 14' and the structural portion 1114' of the first wafer-level lens L1' of the optical lens 11', and the light-transmitting cover plate 14' is fixed to the top surface of the optical lens 11' through the adhesive layer 112'. It is worth mentioning that the light-transmitting cover plate 14 ′ can be made of glass material.

[0203] Furthermore, the camera module 10' also includes a light shielding portion 15', which is fixed to the transparent cover plate 14'. The light shielding portion 15' has a light hole, so that the light shielding portion 15' can form an aperture to reduce stray light from entering the optical lens 11'. Specifically, the light shielding portion 15' can be formed on the bottom surface of the transparent cover plate 14' by coating or silk screen printing. The light shielding portion 15' is formed between the transparent cover plate 14' and the optical lens 11'. It should be understood that the bottom surface of the transparent cover plate 14' refers to its side close to the optical lens 11'.

[0204] Furthermore, FIG20 shows a method for manufacturing the camera module 10' shown in FIG19. The optical lens 11' and the photosensitive component 12' are first fixed in an inverted array on a light-transmitting cover panel 23'. The optical lens 11' and the photosensitive component 12' are fixed to each other to form a module semi-finished product, with gaps between adjacent module semi-finished products. Then, encapsulation material 22' is filled between adjacent module semi-finished products to cover the sides of the module semi-finished products. Subsequently, the encapsulation material 22' is cured to form a module panel 20'. Finally, the module panel 20' is divided to obtain a plurality of camera modules 10'. It should be understood that the optical lens 11' and the photosensitive component 12' can be first fixed to each other to form a module semi-finished product and then fixed to the transparent cover panel 23', or the optical lens 11' can be first fixed to the transparent cover panel 23' and then the photosensitive component 12' can be fixed to the transparent cover panel 23', and the optical lens 11' and the photosensitive component 12' can be first fixed to each other to form a module semi-finished product. It is worth mentioning that the method of forming a module semi-finished product can not only be the above-mentioned method of first fixing a single optical lens 11' and a photosensitive component 12' to each other, but also the method of first fixing the lens panel 21' and the photosensitive component 12' panel and then dividing them to form a plurality of classified module semi-finished products.

[0205] Among them, the encapsulation material 22' forms an encapsulation body 13' after solidification. In one example of the present application, the encapsulation material 22' can be a molding material, which is injected between adjacent module semi-finished products by injection molding, and the molding material forms a molded encapsulation body 13' after solidification; in another example of the present application, the encapsulation material 22' can also be glue, which is set between adjacent module semi-finished products by, for example, glue dripping, and then solidified by ultraviolet irradiation or heating to form a glue encapsulation body 13'. Through the manufacturing method shown in Figure 20, the encapsulation body 13' of the camera module 10' obtained only covers the sides of the optical lens 11' and the photosensitive component 12', but does not cover the sides of the transparent cover plate 14'. Although the sides of the transparent cover plate 14' can be further covered by side spraying to protect the transparent cover plate 14' and reduce the incidence of stray light, this method increases the process and increases the manufacturing cost.

[0206] Figure 21 shows an improved method for manufacturing a camera module 10'. As shown in Figure 21, after the packaging material 22' is filled between adjacent module semi-finished products and solidified to form a module panel 20', the transparent cover panel 23' is split from the image side of the module panel 20' to form a plurality of separated transparent cover panels 14', and then the packaging material 22' is filled between adjacent transparent cover panels 14' and solidified. Finally, the module panel 20' is split to obtain a plurality of camera modules 10'. Among them, the last splitting of the module panel 20' can be performed from the object side of the module panel 20' to improve the yield of the splitting. The camera module 10' obtained by this manufacturing method has a packaging body 13' arranged on the side of the optical lens 11', the photosensitive component 12' and the transparent cover 14', and the sides of the optical lens 11', the photosensitive component 12' and the transparent cover 14' are all covered by the packaging body 13' to protect the optical lens 11', the photosensitive component 12' and the transparent cover 14', as shown in the camera module 10' shown in Figure 15.

[0207] Of course, the side surface of the transparent cover plate 14 ′ may be further covered by the encapsulation body 13 ′ by disposing the encapsulation body 13 ′ on the side surface of the transparent cover plate 14 ′.

[0208] In one example of the present application, a package 13' is provided on the side of the camera module 10' by spraying glue. In this example, the package 13' is formed by solidifying glue, and the glue may be a black glue after solidification. Specifically, air is mixed with the glue through an atomizing valve, and then the glue is sprayed on one side of the camera module 10'. After solidifying the glue sprayed on this side, the posture of the camera module 10' is adjusted, and the glue is sprayed on the other side of the camera module 10'. The glue is solidified, and the above steps are repeated until the surrounding sides of the camera module 10' are covered with glue. In this way, a package body 13' is set on the side of the camera module 10'. The package body 13' can cover the sides of the transparent cover plate 14', the optical lens 11' and the photosensitive component 12', so that the package body 13' can play a buffering role when the transparent cover plate 14', the optical lens 11' and the photosensitive component 12' are hit. The black package body 13' can also prevent light from entering the optical lens 11' from the side to form stray light and affect imaging. In which, during the glue spraying process, an end face protective layer can be respectively attached to the object side surface of the camera module 10' (that is, the object side surface of the optical lens 11') and the image side surface of the camera module 10' (that is, the image side surface of the photosensitive component 12') to prevent glue from being sprayed onto the object side surface and the image side surface of the camera module 10'. If the object side surface of the camera module 10' is covered by glue, the light incident on the optical lens 11' will be affected. If the image side surface of the camera module 10' is covered by glue, the electrical connection between the electrical connection part 124' of the camera module 10' and the external electronic device will be affected.

[0209] Furthermore, FIG22 shows a schematic diagram of the assembly method of the optical lens 11' and the photosensitive component 12' by back-focus height determination of the present application. As shown in FIG22, the back-focus data of the optical lens 11' and the posture data of the photosensitive component 12' are first obtained respectively, and then the relative position relationship between the optical lens 11' and the photosensitive component 12' is determined based on the back-focus data and the posture data. Then, according to the relative position relationship, the optical lens 11' is set above the photosensitive component 12' and an adjustment member 16' is set between the optical lens 11' and the photosensitive component 12'. Finally, the optical lens 11' and the photosensitive component 12' are fixed by the adjustment member 16'. The camera module 10' also includes an adjustment member 16' arranged between the optical lens 11' and the photosensitive component 12', and the adjustment member 16' is used to fix the relative position of the optical lens 11' and the photosensitive component 12'. The thickness of the adjustment member 16' is determined by the relative position of the optical lens 11' and the photosensitive component 12'.

[0210] In one example of the present application, a light source 31' can be set above the optical lens 11', and the optical lens 11' receives and converges the light projected by the light source 31' and then emits it to a receiving platform 32'. The distance between the receiving platform 32' and the optical lens 11' is adjusted so that the optical lens 11' converges the received light on the receiving platform 32', thereby obtaining the back focus data of the optical lens 11'. The back focus data of the optical lens 11' includes the back focus distance of the optical lens 11'. Through the back focus distance, the ideal spacing between the optical lens 11' and the photosensitive component 12' can be obtained, and an adjustment member 16' of appropriate thickness can be selected to fix the ideal distance between the optical lens 11' and the photosensitive component 12'. In other words, in the present application, the distance between the optical lens 11' and the photosensitive component 12' can be determined by the back focus distance of the optical lens 11'.

[0211] In one example of the present application, the height information of multiple points on the top surface of the photosensitive component 12' can be obtained respectively by the laser altimeter device 33', thereby obtaining the posture data of the photosensitive component 12'. The posture data of the photosensitive component 12' includes the height position information of the photosensitive component 12'. By obtaining the height position information of the photosensitive component 12', the position where the optical lens 11' should be set can be determined, so that the optical lens 11' is set above the photosensitive component 12' and the image plane of the optical lens 11' can overlap with the photosensitive area 1211' of the photosensitive chip 121' of the photosensitive component 12'. Specifically, the posture data of the photosensitive component 12' can be obtained by laser altimeter.

[0212] In one example of the present application, the back focus data of the optical lens 11' includes not only the back focus distance of the optical lens 11' but also the image plane data of the optical lens 11'. The image plane data includes the tilt posture of the image plane of the optical lens 11'. Therefore, in the present application, the tilt angle of the optical lens 11' relative to the photosensitive component 12' can be further adjusted so that the image plane of the optical lens 11' overlaps with the photosensitive area 1211' of the photosensitive chip 121'. Furthermore, the posture data of the photosensitive component 12' can also further include the tilt data of the photosensitive component 12', so as to more accurately adjust the tilt angle between the optical lens 11' and the photosensitive component 12' so that the image plane of the optical lens 11' overlaps with the photosensitive area 1211' of the photosensitive chip 121'. For example, the tilt angle of the optical lens 11' and the tilt angle of the photosensitive component 12' can be adjusted separately to improve the adjustment efficiency.

[0213] In one example of the present application, the adjustment member 16' can be adjusted according to the ideal distance between the optical lens 11' and the photosensitive component 12', and the thickness of the adjustment member 16' is equal to the ideal distance between the optical lens 11' and the photosensitive component 12'. For example, when the thickness between the optical lens 11' and the photosensitive component 12' is 20μm, the thickness of the adjustment member 16 is set to 20μm. It is worth mentioning that the adjustment member 16' has an annular structure. When there is an inclination angle between the optical lens 11' and the photosensitive component 12', the thickness of the annular adjustment member 16' is uneven in the circumferential direction to match the gap between the optical lens 11' and the photosensitive component 12'. Specifically, the adjustment member 16' can be arranged between the chip substrate 122' of the photosensitive component 12' and the optical lens 11' to fix the optical lens 11' to the photosensitive component 12'.

[0214] In a specific example, the adjustment member 16' can be implemented as UV glue that can be cured by ultraviolet radiation (it is worth mentioning that in this application, UV glue not only includes glue that can be cured only by ultraviolet radiation, but also includes glue that can be cured by ultraviolet radiation and other methods at the same time, such as UV thermosetting glue). Furthermore, the adjustment member 16' can also be a particle glue. Specifically, the adjustment member 16' includes glue and particles wrapped in the glue. The diameter of the particles can be determined according to the ideal distance between the optical lens 11' and the photosensitive component 12'. The diameter of the particles is less than or equal to the ideal distance between the optical lens 11' and the photosensitive component 12'. For example, when the thickness between the optical lens 11' and the photosensitive component 12' is 22 μm, a particle glue with a particle diameter of 20 μm can be selected as the adjustment part 16' to be set between the optical lens 11' and the photosensitive component 12'. In this way, after the particle glue is cured, the particles in the particle glue can support the relative position between the optical lens 11' and the photosensitive component 12' to reduce the problem of changes in the distance between the optical lens 11' and the photosensitive component 12' caused by the shrinkage of the glue during curing.

[0215] In the present application, the camera module 10' further includes a filter element, which is disposed on the photosensitive path of the photosensitive chip 121'. The filter element has an infrared cutoff function, which is used to filter the incident light entering the photosensitive chip 121', and filter out stray light such as infrared light that is not necessary for imaging in the incident light. In an example of the present application, the filter element can be an additional component disposed in the camera module 10', which can be disposed between the optical lens 11' and the photosensitive component 12', or it can be disposed in the optical lens 11' or above the optical lens 11'. The filter element can be disposed on the photosensitive path of the photosensitive chip 121', and the present application is not limited to this.

[0216] In another example of the present application, the filter element can also be combined with other components of the camera module 10' into one component. For example, in a specific example, the base 1221' of the chip substrate 122' in the photosensitive component 12' has an infrared cutoff function, that is, the chip substrate 122' can be used as a filter element, so that the chip substrate 122' can filter the imaging light entering the photosensitive chip 121'. This setting method eliminates the need to set up a separate filter element. On the one hand, it can reduce the cost of the camera module, and on the other hand, it can reduce the overall height of the camera module. Specifically, the infrared cutoff function of the chip substrate 122' can be achieved by making the material of the base 1221' itself have the function of absorbing infrared rays or coating the surface of the base 1221' with an infrared cutoff film. In another specific example of the present application, the transparent cover plate 14' can be made to have an infrared cutoff function, that is, the transparent cover plate 14' can be used as a filter element, so that the transparent cover plate 14' can filter the imaging light entering the photosensitive chip 121'. In another specific example of the present application, the optical lens 11 ′ has an infrared cutoff function. Specifically, one of the wafer-level lenses 111 ′ of the optical lens 11 ′ can have an infrared cutoff function.

[0217] Figure 23 shows a schematic structural diagram of another embodiment of the optical lens 11' of the present application, and Figure 24 shows a schematic structural diagram of a camera module 10' including the optical lens 11' shown in Figure 23. As shown in Figure 23, the optical lens 11' and the optical lens 11' shown in Figure 17 adopt different manufacturing processes. Specifically, in this embodiment, the optical lens 11' includes at least one wafer-level lens 111'. The number of wafer-level lenses 111' in the optical lens 11' is determined according to the requirements of the optical design, and the number can be one, two, three, four or more. Among them, the wafer-level lens 111' includes a lens substrate 1111' and at least one lens unit 1112'. The at least one lens unit 1112' is arranged on one side or both sides of the lens substrate 1111'. The at least one lens unit 1112' can converge or diverge light. The at least one lens unit 1112' can be fixed to one side or both sides of the lens substrate 1111' by, for example, bonding, insert injection molding, stamping molding, etc. In a specific example, the lens substrate 1111 ′ is made of glass material, and the lens unit 1112 ′ is made of resin material.

[0218] In one embodiment of the present application, a wafer-level lens 111' includes a lens substrate 1111' and a lens unit 1112' disposed on the object side or image side of the light-transmitting substrate. In other words, one side of the wafer-level lens 111' is a flat surface, while the other side of the wafer-level lens 111' is a curved surface. In another embodiment of the present application, a wafer-level lens 111' includes a lens substrate 1111' and two lens units 1112' disposed on the object side and image side of the lens substrate 1111'. In other words, both sides of the wafer-level lens 111' are curved surfaces. In the present application, the curved surface can be a spherical surface, an aspherical surface, or a free-form surface.

[0219] Furthermore, the wafer-level lens 111' may further include a spacer 113' disposed on at least one side of the lens substrate 1111'. The spacer 113' can adjust the spacing between the wafer-level lens 111' and other wafer-level lenses 111' or the photosensitive component 12' and support the lens substrate 1111'. The spacer 113' can be fixed to one or both sides of the lens substrate 1111' by, for example, bonding, insert molding, or stamping molding. The spacer 113' is disposed around the lens unit 1112'.

[0220] The wafer-level lens 111' includes an imaging portion 1113' and a structural portion 1114' connected to each other. The structural portion 1114' surrounds and supports the imaging portion 1113'. Adjacent wafer-level lenses 111' are fixed by an adhesive layer 112' disposed between the structural portions 1114'.

[0221] In the present application, the optical lens 11' shown in Figure 23 is also formed by splitting the lens panel 21'. Among them, at least one lens panel 211' is stacked and fixed to form a lens panel 21', and the lens panel 21' includes a plurality of connected optical lenses 11'. By splitting the lens panel 21', the optical lens 11' can be manufactured in large quantities at low cost, and the obtained optical head also has a relatively small size. In a specific example, the multiple lens units 1112' on the lens panel 211' are integrally formed on one side or both sides of the lens substrate 1111' by embossing.

[0222] In a specific example of the present application, as shown in Figures 23 and 24, at least one wafer-level lens 111' of the optical lens 11' includes three wafer-level lenses 111': a first wafer-level lens L1', a second wafer-level lens L2', and a third wafer-level lens L3'. The first wafer-level lens L1', the second wafer-level lens L2', and the third wafer-level lens L3' are stacked along the optical axis and fixed by an adhesive layer 112' provided between adjacent wafer-level lenses 111'. The first wafer-level lens L1' comprises a lens substrate 1111', a lens unit 1112' fixed to the image side of the lens substrate 1111', and a spacer 113' fixed to the image side of the lens substrate 1111'. The object side of the first wafer-level lens L1' is a plane. The second wafer-level lens L2' comprises a lens substrate 1111', a lens unit 1112' fixed to the object side of the lens substrate 1111', and a spacer 113' fixed to the object side of the lens substrate 1111'. The second wafer-level lens L2' The image side surface of the third wafer-level lens L3' is a plane; the third wafer-level lens L3' includes a lens substrate 1111', a lens unit 1112' fixed to the image side of the lens substrate 1111' and a spacer 113' fixed to the image side of the lens substrate 1111', the object side surface of the third wafer-level lens L3' is a plane, and the bottom surface of the spacer 113' of the third wafer-level lens L3' is lower than the bottom surface of the lens unit 1112' of the third wafer-level lens L3' to protect the lens unit 1112' of the third wafer-level lens L3'. The first wafer-level lens L1' and the second wafer-level lens L2' are fixed by an adhesive layer 112' arranged between the spacer 113' of the first wafer-level lens L1' and the spacer 113' of the second wafer-level lens L2', and the second wafer-level lens L2' and the third wafer-level lens L3' are fixed by an adhesive layer 112' arranged between the lens substrate 1111' of the first wafer-level lens L1' and the lens substrate 1111' of the second wafer-level lens L2'.

[0223] Continuing with FIG24 , the camera module 10′ shown in FIG24 includes an optical lens 11′, a photosensitive component 12′, and a package 13′ as shown in FIG23 . The optical lens 11′ is fixed to the photosensitive component 12′, and the package 13′ is disposed on the sides of the optical lens 11′ and the photosensitive component 12′. The sides of the optical lens 11′ and the photosensitive component 12′ are completely covered by the package 13′ to protect the optical lens 11′ and the photosensitive component 12′. The package 13′ is made of an opaque material to prevent stray light from entering the optical lens 11′.

[0224] Unlike the camera module 10' shown in Figure 19, since the top surface of the optical lens 11' in this embodiment is flat, there is no need to additionally set a transparent cover 14' on the top surface of the optical lens 11' due to flipping during the manufacturing process. Therefore, in this embodiment, the package body 13' does not need to cover the side of the transparent cover 14'.

[0225] Furthermore, the camera module 10' also includes a light shielding portion 15', which is fixed to the object side of the lens substrate 1111' of the first wafer-level lens L1'. Thus, the light shielding portion 15' can form an aperture to reduce stray light from entering the optical lens 11'. Specifically, the light shielding portion 15' can be formed on the lens substrate 1111' by coating or silk screen printing.

[0226] Furthermore, the camera module 10' also includes an adjustment member 16' disposed between the optical lens 11' and the photosensitive component 12'. The adjustment member 16' adjusts and fixes the relative position between the optical lens 11' and the photosensitive component 12'. In a specific example of this embodiment, the adjustment member 16' includes an adjustment substrate 161' and adjustment adhesives 162' disposed on the object side and image side of the adjustment substrate 161'. The adjustment member 16' is bonded and fixed to the optical lens 11' and the photosensitive component 12' via the adjustment adhesives 162' located on the object side and image side of the adjustment substrate 161'. In some cases, the optical lens 11' has a large back focus, and using more glue as the adjustment part 16' will reduce the bonding function of the adjustment part 16', making the bonding between the optical lens 11' and the photosensitive component 12' weak. Therefore, the adjustment part 16' includes an adjustment substrate 161'. The adjustment substrate 161' occupies a larger height space to improve the bonding effect of the adjustment part 16' and maintain the structural strength of the camera module 10'.

[0227] In some embodiments, the adjusting member 16' is first fixed to the optical lens 11' and then fixed to the photosensitive component 12'; in other embodiments, the adjusting member 16' may also be first fixed to the photosensitive component 12' and then fixed to the optical lens 11'.

[0228] In a specific example of this embodiment, the adjustment substrate 161 ′ of the adjustment member 16 ′ may also have an infrared cutoff function. In other words, the adjustment substrate 161 ′ may be implemented as a filter element.

[0229] It is worth mentioning that the camera module 10' shown in Figure 24 can also be assembled using the assembly method shown in Figure 22. That is, first, the back focus data of the optical lens 11' and the posture data of the photosensitive component 12' are respectively obtained. Then, the relative positional relationship between the optical lens 11' and the photosensitive component 12' is determined based on the back focus data and the posture data. Then, based on the relative positional relationship, the optical lens 11' is positioned above the photosensitive component 12' and an adjustment member 16' is provided between the optical lens 11' and the photosensitive component 12'. Finally, the optical lens 11' and the photosensitive component 12' are fixed by the adjustment member 16'.

[0230] Furthermore, in the present application, the thickness of the lens substrate 1111' of at least one wafer-level lens 111' in the optical lens 11' is different, so as to adapt to the optical design requirements of each wafer-level lens 111' respectively, thereby reducing the height of the optical lens 11'. It is worth mentioning that the thickness of the lens substrate 1111' described in the present application refers to the size of the lens substrate 1111' along the optical axis.

[0231] As shown in FIG25 , in one example, the thickness of the lens substrate 1111′ of at least one wafer-level lens 111′ gradually increases from the object side to the image side of the optical axis. In other words, the thickness of the lens substrate 1111′ of at least one wafer-level lens 111′ increases along the direction of light incidence. Since the thickness of the wafer-level lens 111′ of the optical lens 11′ used in the present application gradually increases from the object side to the image side of the optical axis, the thickness of the lens substrate 1111′ of at least one wafer-level lens 111′ gradually increases from the object side to the image side of the optical axis, which increases the volume share of the lens substrate 1111′ in the wafer-level lens 111′ and reduces the volume share of the lens unit 1112′, thereby reducing the shrinkage of the lens unit 1112′, thereby reducing the difference in expansion and contraction between the lens unit 1112′ and the lens substrate 1111′ due to different materials. It is understandable that during the manufacturing process of the optical lens 11 ′ and the camera module 10 ′, they have to switch between high temperature and room temperature. Excessive expansion and contraction differences will lead to reduced imaging quality of the final optical lens 11 ′ and the camera module 10 ′.

[0232] It is worth mentioning that in one example of the present application, the refractive index of the lens substrate 1111' is greater than the refractive index of the lens unit 1112'. In this way, the volume proportion of the lens substrate 1111' in the wafer-level lens 111' is increased, and the thickness of the wafer-level lens 111' can also be reduced, thereby reducing the overall height of the optical lens 11' and the camera module 10'. In a specific example, the lens substrate 1111' is made of glass material, and the lens unit 1112' is made of resin material, wherein the refractive index of the lens substrate 1111' is 1.5178, and the refractive index of the lens unit 1112' is 1.50547.

[0233] Continuing to refer to FIG25 , the optical lens 11 ′ includes a first wafer-level lens L1 ′, a second wafer-level lens L2 ′, and a third wafer-level lens L3 ′, which are sequentially distributed from the object side to the image side along the optical axis. The first wafer-level lens L1 ′ includes a first lens substrate L1a ′ and a first lens unit L1b ′ disposed on one side of the first lens substrate L1a ′. In one example, the first lens unit L1b ′ is formed on the image side of the first lens substrate L1a ′ by nanoimprinting. The first lens substrate L1a ′ is made of glass, and the first lens unit L1a ′ is made of resin. The second wafer-level lens L2 ′ includes a second lens substrate L2a ′ and a second lens unit L2b ′ disposed on one side of the second lens substrate L2a ′. In one example, the second lens unit L1b ′ is formed on the image side of the first lens substrate L1a ′ by nanoimprinting. The first lens substrate L1a ′ is made of glass, and the first lens unit L1a ′ is made of resin. The lens unit L2b' is formed on the object side of the second lens substrate L2a' by nanoimprinting. The second lens substrate L2a' is made of glass, and the second lens unit L2b' is made of resin. The third wafer-level lens L3' includes a third lens substrate L3a' and a third lens unit L3b' arranged on one side of the third lens substrate L3a'. In one example, the third lens unit L3b' is formed on the image side of the third lens substrate L3a' by nanoimprinting. The third lens substrate L3a' is made of glass, and the third lens unit L3b' is made of resin. In this example, the thickness of the first lens substrate L1a' is smaller than the thickness of the second lens substrate L2a', and the thickness of the second lens substrate L2a' is smaller than the thickness of the third lens substrate L3a'. Thus, the thicknesses of the first lens substrate L1a', the second lens substrate L2a', and the third lens substrate L3a', which are sequentially distributed from the object side to the image side of the optical axis, gradually increase. For example, the thickness of the first lens substrate L1a' is approximately 0.05 mm, the thickness of the second lens substrate L2a' is approximately 0.18 mm, and the thickness of the third lens substrate L3a' is approximately 0.34 mm.

[0234] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: Photosensitive components; An optical lens is arranged on the light-sensitive path of the photosensitive component, and the optical lens includes at least one lens substrate and at least one lens unit, wherein the at least one lens substrate is arranged at the top of the light-incident side of the optical lens, and the at least one lens unit is integrally formed on the light-emitting side of the at least one lens substrate.

2. The camera module according to claim 1, wherein: The optical lens includes at least one wafer-level lens, and the at least one wafer-level lens includes an imaging part and a structural part. The structural part surrounds the outer peripheral side of the imaging part, at least a part of the lens substrate is arranged on the structural part, and at least a part of the lens unit is arranged on the imaging part.

3. The camera module according to claim 2, wherein: The lens substrate is made of glass, the lens unit is made of resin, and the lens unit is arranged on the light incident side or the light exit side of the lens substrate and is integrally formed on the lens substrate using an embossing process.

4. The camera module according to claim 3, wherein: The at least one wafer-level lens includes a first wafer-level lens, a second wafer-level lens and a third wafer-level lens sequentially arranged along the optical axis direction, and the first wafer-level lens is arranged at the top end of the light incident side of the optical lens.

5. The camera module according to claim 4, wherein: The first wafer-level lens includes a first lens substrate and a first lens unit. The first lens unit is integrally formed on a light-emitting side surface of the first lens substrate. The first lens substrate is disposed on the top of the optical lens.

6. The camera module according to claim 5, wherein: The optical lens further includes a support member, which is disposed between the lens substrate of the first wafer-level lens and the second wafer-level lens.

7. The camera module according to claim 6, wherein: The second wafer-level lens and the third wafer-level lens are made of resin, and are integrally formed by a stamping process.

8. The camera module according to claim 6, wherein: The second wafer-level lens includes a second lens substrate and a second lens unit, and the second lens unit is integrally formed on the light incident side and / or light exit side of the second lens substrate. The third wafer-level lens includes a third lens substrate and a third lens unit, and the third lens unit is integrally formed on the light incident side and / or light exit side of the third lens substrate. The second wafer-level lens and the third wafer-level lens are fixedly connected to the third lens substrate through the second lens substrate.

9. The camera module according to any one of claims 7 or 8, wherein: The thickness of the first lens substrate is smaller than that of the second lens substrate, the thickness of the second lens substrate is smaller than that of the third lens substrate, and the thicknesses of the first lens substrate, the second lens substrate, and the third lens substrate sequentially arranged along the optical axis gradually increase.

10. The camera module according to claim 9, wherein: The camera module also includes a packaging body, which covers the photosensitive component and the peripheral side of the lens substrate of the optical lens.

11. A camera module, characterized in that: include: Optical lens; A photosensitive component, comprising a photosensitive chip and a chip substrate mounted on the front of the photosensitive chip, wherein the optical lens is arranged on the light-sensitive path of the photosensitive component, and at least one of the light-entry surface and the light-exit surface of the chip substrate has a curved surface.

12. The camera module according to claim 11, wherein: The photosensitive component also includes a supporting structure arranged between the chip substrate and the photosensitive chip, and the chip substrate is mounted on the front side of the photosensitive chip through the supporting structure.

13. The camera module according to claim 12, wherein: The photosensitive component also includes an electrical connection portion, which is arranged on the back side of the photosensitive chip and is electrically connected to the photosensitive chip.

14. The camera module according to claim 11, wherein: The chip substrate includes a base and at least one surface portion formed on a light incident surface and / or a light emitting surface of the base, and a surface of the surface portion away from the base forms a curved surface of the chip substrate.

15. The camera module according to claim 14, wherein: The surface-shaped portion is formed on the light-emitting surface of the substrate by etching.

16. The camera module according to claim 14, wherein: The surface portion is integrally formed on the base.

17. The camera module according to any one of claims 11 to 16, wherein: The optical lens comprises at least one stacked wafer-level lens, and adjacent wafer-level lenses are fixed by an adhesive layer.

18. The camera module according to claim 17, wherein: The camera module also includes an adjustment member arranged between the optical lens and the photosensitive component, wherein the adjustment member is used to fix the relative position of the optical lens and the photosensitive component, and the thickness of the adjustment member is determined by the relative position of the optical lens and the photosensitive component.

19. The camera module according to claim 17, wherein: The camera module also includes a light-transmitting cover plate, which is fixed to the top surface of the optical lens.

20. The camera module according to claim 19, wherein: The camera module also includes a packaging body, which is arranged on the side of the optical lens, the photosensitive component and the transparent cover plate, and the side of the optical lens, the photosensitive component and the transparent cover plate are all covered by the packaging body.

21. The camera module according to claim 17, wherein: The wafer-level lens includes a lens substrate and at least one lens unit arranged on the lens substrate. The thickness of the lens substrate of at least one wafer-level lens of the optical lens gradually increases from the object side to the image side of the optical axis.

Images