Glue pouring device for IGBT (Insulated Gate Bipolar Translator), control method and production line

Abstract

The invention relates to IGBT (Insulated Gate Bipolar Translator) glue filling, in particular to a glue filling device for an IGBT, a control method and a production line, the glue filling device comprises a feeding vacuum box, a conveying mechanism, a plurality of glue filling boxes arranged in the vacuum box, a glue filling box moving mechanism, a discharging vacuum box and a control module; a plurality of glue pouring boxes are used for pouring glue to the IGBT, and after glue pouring is completed, deblocking and vacuum defoaming are carried out in a discharging vacuum box. Thus, in the one-time feeding, glue filling and discharging process, glue filling treatment can be conducted on the multiple glue filling boxes, and the glue filling efficiency is improved. In addition, a plurality of glue filling boxes are arranged in the feeding vacuum box, so that the generation space is also saved.

Description

Technical Field

[0001] This application relates to IGBT potting, and particularly to a potting device, a control method and a production line for IGBT. Background Art

[0002] As an important power electronic device, IGBT (Insulated Gate Bipolar Transistor) has been widely used in many fields. In the production process of IGBT, the potting process is a key link to ensure its performance and reliability.

[0003] The currently used vacuum potting machine on the market adopts a three-chamber layout. Refer to Figure 1 , which is a common potting machine for IGBT in the prior art, including three boxes, which are, from right to left: a feeding vacuum box, a potting box and a discharging vacuum box. Since the product needs to work in a vacuum environment, the feeding vacuum box and the discharging vacuum box need to be frequently reduced from normal atmospheric pressure to a vacuum state, and the state conversion time is long. The existing potting machines generally adopt a matching method of one feeding vacuum box, one discharging vacuum box and one potting box. In this way, every time the feeding vacuum box and the discharging vacuum box complete a feeding and discharging process, only one IGBT in the potting box can be transferred, and the efficiency is low. Moreover, most potting machines adopt a single-nozzle potting method, and only one product can be potted at a time, which cannot meet the efficiency requirements of large-scale production. When facing the increasing market demand for IGBT products, the problem of insufficient production capacity becomes more prominent.

[0004] Therefore, there is currently a lack of an efficient potting device and control method for IGBT. Summary of the Invention

[0005] In order to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are only for reference and explanation, and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, many details are provided to fully understand the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner to simplify the drawings.

[0006] The following description and the drawings fully illustrate specific embodiments of the present invention, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. Examples merely represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present invention includes the entire scope of the claims and all available equivalents of the claims. Herein, the embodiments may be individually or collectively referred to by the term "invention" merely for convenience, and if in fact more than one invention is disclosed, it is not intended to automatically limit the scope of the application to any single invention or inventive concept. Herein, relational terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method or device comprising the element. The embodiments herein are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts among the embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, since they correspond to the method parts disclosed in the embodiments, the description is relatively simple, and the relevant parts may be referred to the description of the method parts.

[0007] Embodiments of the present disclosure provide a potting device, a control method, and a production line for IGBTs, aiming to solve the problem of low potting efficiency in the prior art that only one potting box of IGBTs can be transferred during the feeding and discharging processes of a vacuum potting machine.

[0008] An embodiment of the present disclosure provides a potting device for IGBTs, including: a feeding vacuum chamber, a conveying mechanism, a plurality of potting chambers arranged in the feeding vacuum chamber, a potting chamber moving mechanism, a discharging vacuum chamber, and a control module; the feeding vacuum chamber includes: a feeding vacuum chamber body, a feeding air pressure sensor, and a feeding vacuum module; the conveying mechanism is used to convey IGBTs, and a plurality of sealing rings are arranged on the conveying mechanism; the potting chamber includes: a vacuum tube, a potting assembly, a potting air pressure sensor, and a potting vacuum module; the potting air pressure sensor, the potting assembly, and the potting vacuum module are arranged in the vacuum tube, and the potting air pressure sensor and the potting vacuum module are arranged at the potting assembly; the mouth of the vacuum tube is matched with the sealing ring; the potting chamber moving mechanism is fixedly connected to the potting chamber and is used to move the potting chamber; the discharging vacuum chamber includes: a discharging vacuum chamber body, a discharging air pressure sensor, and a discharging vacuum module; the feeding air pressure sensor, the feeding vacuum module, the potting air pressure sensor, the potting vacuum module, the potting assembly, and the control module are connected; the control module is used to obtain the feeding air pressure data of the feeding air pressure sensor, the potting air pressure data of the potting air pressure sensor, and the discharging air pressure data of the discharging air pressure sensor to control the feeding vacuum module, the potting vacuum module, the potting assembly, and the potting chamber moving mechanism.

[0009] Preferably, an orifice air pressure sensor and an orifice vacuum module, wherein the orifice air pressure sensor and the orifice vacuum module are arranged at the mouth of the vacuum tube, and the orifice air pressure sensor and the orifice vacuum module are respectively connected to the control module; the control module is further used to obtain the orifice air pressure data of the orifice air pressure sensor to control the orifice vacuum module.

[0010] Preferably, it further includes: an integrated vacuum circulation system, including: providing a vacuum degree for the feeding vacuum module, the potting vacuum module, and the discharging vacuum module.

[0011] Preferably, the feeding vacuum module, the potting vacuum module, and the discharging vacuum module are all intelligent vacuum valves.

[0012] Preferably, the number of potting air pressure sensors is multiple, and they are evenly arranged on the inner wall of the vacuum tube.

[0013] Preferably, the feeding vacuum module, the potting vacuum module, and the discharging vacuum module are vacuum pumps.

[0014] Second aspect, a control method for IGBT potting provided by an embodiment of the present disclosure is applied to the above-mentioned potting device for IGBT. The method includes: moving the IGBT into the feeding vacuum chamber; performing vacuum pumping on the feeding vacuum chamber and the discharging vacuum chamber; moving multiple potting chambers, connecting the potting chambers to the sealing rings of the conveying mechanism to seal the potting chambers; performing vacuum pumping on the potting chambers; potting the IGBT; after the potting is completed, moving multiple potting chambers to the discharging vacuum chamber; adjusting the discharging air pressure data and the potting air pressure data to be the same; moving multiple potting chambers, and separating the potting chambers from the sealing rings of the conveying mechanism.

[0015] Preferably, when applied to a potting machine having a nozzle air pressure sensor and a nozzle vacuum module, performing vacuum pumping on the potting chamber includes: performing vacuum pumping with the potting vacuum module and the nozzle vacuum module, and controlling the potting air pressure data and the nozzle air pressure data to be the same; the method further includes: adjusting the discharging air pressure data, the potting air pressure data, and the nozzle air pressure data to be the same.

[0016] Preferably, during the potting process, segmented potting is adopted.

[0017] Third aspect, a production line for IGBT potting provided by an embodiment of the present disclosure includes the above-mentioned potting device for IGBT.

[0018] The embodiments of the present disclosure provide a potting device, a control method, and a production line for IGBT. By providing multiple sealable potting chambers in the feeding vacuum chamber, using multiple potting chambers to pot the IGBT, and performing unsealing and vacuum defoaming in the discharging vacuum chamber after the potting is completed. In this way, during one feeding, potting, and discharging process, multiple potting chambers can be potted, improving the potting efficiency. In addition, setting multiple potting chambers in the feeding vacuum chamber also saves production space. Description of the Drawings

[0019] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and among them: Figure 1 is a schematic diagram of a common potting machine for IGBT in the prior art provided by an embodiment of the present disclosure; Figure 2 is a schematic diagram of a potting device for IGBT provided by an embodiment of the present disclosure; Figure 3 is a schematic diagram of a feeding vacuum chamber provided by an embodiment of the present disclosure; Figure 4It is a flowchart of a control method for IGBT potting provided by an embodiment of the present disclosure; Reference numerals: 1: Feeding vacuum box; 2: Conveying mechanism; 3: Potting box; 31 Vacuum tube; 32: Potting assembly; 4: Potting box moving mechanism; 5: IGBT. Detailed implementation manners

[0020] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are only for reference and illustration purposes and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, numerous details are provided to give a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be shown in a simplified manner to simplify the drawings.

[0021] The following description and drawings fully illustrate the specific embodiments of the present application, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. The embodiments only represent possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations may vary. Some parts and features of some embodiments may be included in or replaced by parts and features of other embodiments. The scope of the embodiments of the present application includes the entire scope of the claims and all available equivalents of the claims. In this document, the embodiments may be referred to individually or collectively by the term "application" for convenience only, and if in fact more than one application is disclosed, it is not intended to automatically limit the scope of the application to any single application or application concept. In this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method or device including a series of elements not only includes those elements but also other elements not explicitly listed, or also includes elements inherent to such process, method or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method or device including the said element. The embodiments in this document are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other. For the methods, products, etc. disclosed in the embodiments, since they correspond to the method part disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0022] In addition, the terms "arranged", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0023] The embodiments of the present disclosure provide a potting device, a control method, and a production line for IGBTs, aiming to solve the problem of low potting efficiency in the prior art that only one potting box for IGBT5 can be transferred during the feeding and discharging processes in a vacuum potting machine. Refer to Figure 2 The potting device for IGBTs includes: a feeding vacuum box 1, a conveying mechanism 2, a plurality of potting boxes 3 arranged in the feeding vacuum box, a potting box moving mechanism 4, a discharging vacuum box, and a control module.

[0024] The feeding vacuum box 1 includes: a feeding vacuum box 1 body, a feeding air pressure sensor, and a feeding vacuum module; the conveying mechanism 2 is used to convey IGBT5, and a plurality of sealing rings are arranged on the conveying mechanism 2; the potting box 3: a vacuum tube 31, a potting component 32, a potting air pressure sensor, and a potting vacuum module; the potting air pressure sensor, the potting component 32, and the potting vacuum module are arranged in the vacuum tube 31, and the potting air pressure sensor and the potting vacuum module are arranged at the potting component 32; the mouth of the vacuum tube matches the sealing ring; the potting box moving mechanism 4 is fixedly connected to the potting box 3 and is used to move the potting box 3; the discharging vacuum box includes: a discharging vacuum box body, a discharging air pressure sensor, and a discharging vacuum module; the feeding air pressure sensor, the feeding vacuum module, the potting air pressure sensor, the potting vacuum module, the potting component 32, and the control module are connected; the control module is used to obtain the feeding air pressure data of the feeding air pressure sensor, the potting air pressure data of the potting air pressure sensor, and the discharging air pressure data of the discharging air pressure sensor to control the feeding vacuum module, the potting vacuum module, the potting component 32, and the potting box moving mechanism 4.

[0025] Refer to Figure 3 As shown, a schematic diagram of a feeding vacuum box is disclosed in the embodiments of the present disclosure. The feeding vacuum box 1 includes a feeding vacuum box 1 body, a feeding air pressure sensor, and a feeding vacuum module. The feeding air pressure sensor is used to monitor the air pressure inside the feeding vacuum box 1 body in real time, and the feeding vacuum module is used to perform a vacuum pumping operation on the feeding vacuum box 1 body to provide a suitable vacuum environment and reduce the air content on the surface and inside of the IGBT.

[0026] The conveying mechanism 2 is used to convey the IGBT 5, and multiple sealing rings are arranged on the conveying mechanism 2. The sealing rings are matched with the vacuum tube nozzles of the potting box 3, playing a sealing role during the potting process to prevent external air from entering the potting area and ensuring the stability of the potting environment. In practical applications, the conveying mechanism 2 can be a conveyor belt.

[0027] Potting box 3: It includes a vacuum tube 31, a potting assembly 32, a potting air pressure sensor, and a potting vacuum module. The potting air pressure sensor, the potting assembly 32, and the potting vacuum module are arranged in the vacuum tube 31, and the potting air pressure sensor and the potting vacuum module are arranged at the potting assembly 32. The potting air pressure sensor is used to monitor the air pressure in the potting area during the potting process, and the potting vacuum module is used to perform a vacuum pumping operation on the potting area to further remove air and ensure the potting quality. The vacuum tube nozzle is matched with the sealing ring on the conveying mechanism 2 to achieve a sealed connection. Multiple potting boxes 3 are arranged inside the feeding vacuum box 1, which can save space.

[0028] Potting box moving mechanism 4: It is fixedly connected to the potting box 3 and is used to move the potting box 3. Through the potting box moving mechanism 4, the potting box 3 can be accurately moved to the appropriate position on the conveying mechanism 2, docked with the sealing ring, and the potting operation can be completed. After the potting is completed, the potting box 3 can be moved away, facilitating the conveying mechanism 2 to transport the IGBT 5 to the next process. In practical applications, the potting box moving mechanism 4 can be a manipulator or a telescopic rod.

[0029] Discharging vacuum box: It includes a discharging vacuum box body, a discharging air pressure sensor, and a discharging vacuum module. The discharging air pressure sensor is used to monitor the air pressure inside the discharging vacuum box body, and the discharging vacuum module is used to perform a vacuum pumping operation or adjust the air pressure on the discharging vacuum box body so that the IGBT 5 can adapt to the appropriate air pressure environment during discharging, avoiding the impact on the potting quality due to excessive air pressure changes.

[0030] Control module: The feeding air pressure sensor, the feeding vacuum module, the potting air pressure sensor, the potting vacuum module, the potting assembly 32 are connected to the control module. The control module is used to obtain the feeding air pressure data of the feeding air pressure sensor, the potting air pressure data of the potting air pressure sensor, and the discharging air pressure data of the discharging air pressure sensor to control the feeding vacuum module, the potting vacuum module, the potting assembly 32, and the potting box moving mechanism 4. Specifically, the control module controls the operation of the feeding vacuum module according to the feeding air pressure data to make the feeding vacuum box 1 reach the appropriate vacuum degree; controls the operation of the potting vacuum module and the potting assembly 32 according to the potting air pressure data to ensure that the potting process is carried out in a stable air pressure environment; controls the operation of the discharging vacuum module according to the discharging air pressure data to make the air pressure of the discharging vacuum box meet the requirements. At the same time, the control module can also control the action of the potting box moving mechanism 4 according to the needs of the entire production process to achieve the accurate movement and positioning of the potting box 3.

[0031] Correspondingly, combine Figure 4 As shown, an embodiment of the present disclosure provides a control method for IGBT potting, including: S100, move the IGBT 5 into the feeding vacuum chamber 1.

[0032] S200, evacuate the feeding vacuum chamber 1 and the discharging vacuum chamber.

[0033] It should be understood that S100 to S200 are the feeding stage. Place the IGBT 5 to be potted on the conveying mechanism 2, and the conveying mechanism 2 transports the product into the feeding vacuum chamber 1. The control module obtains the feeding air pressure data of the feeding air pressure sensor, and according to the preset vacuum degree requirement, controls the feeding vacuum module to evacuate the feeding vacuum chamber 1 so that the air pressure in the chamber reaches an appropriate vacuum degree.

[0034] It should be noted that the feeding vacuum chamber 1 and the discharging vacuum chamber are evacuated separately. The present application does not limit the time point for evacuating the discharging vacuum chamber, which can be determined according to actual situations. The time point for evacuating the discharging vacuum chamber can be set before S700.

[0035] S300, move a plurality of potting chambers 3, and connect the potting chamber 3 to the sealing ring of the conveying mechanism 2 to seal the potting chamber 3.

[0036] S400, evacuate the potting chamber 3.

[0037] S500, pot the IGBT 5.

[0038] It should be understood that S300 to S500 are the potting stage. When the feeding vacuum chamber 1 reaches the set vacuum degree, the potting chamber moving mechanism 4 moves the potting chamber 3 to a suitable position on the conveying mechanism 2, so that the vacuum tube nozzle of the potting chamber 3 is tightly docked with the sealing ring on the conveying mechanism 2 to achieve sealing. The control module obtains the potting air pressure data of the potting air pressure sensor, and according to the need, controls the potting vacuum module to further evacuate the potting area so that the air pressure in the potting area reaches a more accurate vacuum degree. After reaching a suitable air pressure environment, the control module starts the potting assembly 32 to perform the potting operation on the IGBT 5. During the potting process, the control module continuously monitors the potting air pressure data to ensure that the potting process is carried out in a stable air pressure environment.

[0039] S600, after potting is completed, move a plurality of potting chambers 3 to the discharging vacuum chamber.

[0040] S700, adjust the discharging air pressure data and the potting air pressure data to be the same.

[0041] S800. Move multiple potting boxes 3 and separate the potting box 3 from the sealing ring of the conveying mechanism 2.

[0042] It should be understood that S600 to S800 are the discharging stage. After potting is completed, the potting box moving mechanism 4 moves the potting box 3 away. The conveying mechanism 2 transports the IGBT 5 into the discharging vacuum box. The control module obtains the discharging air pressure data of the discharging air pressure sensor and controls the discharging vacuum module to adjust the air pressure of the discharging vacuum box according to the preset air pressure requirements, so that the air pressure in the box gradually returns to an appropriate level. When the air pressure of the discharging vacuum box reaches the requirement, the IGBT 5 is taken out of the discharging vacuum box to complete the entire potting process.

[0043] It should be noted that when potting the IGBT 5, the air pressure in the potting area and the discharging vacuum box area is different, which will cause a sudden change in the environmental pressure where the IGBT 5 and its potting material are located. Just like suddenly changing from a low air pressure environment to a high air pressure environment, the gas solubility in the potting material changes, and the originally dispersed tiny bubbles may gather and become larger; from a high air pressure to a low air pressure, the gas dissolved in the potting material will precipitate to form bubbles. Adjusting the discharging air pressure and the potting air pressure to be the same can ensure that the air pressure environment around the IGBT 5 is stable from the potting stage to the discharging stage, and avoid generating bubbles in the potting material due to a large change in air pressure. If directly entering the discharging link with a large air pressure difference after potting, a lot of bubbles will be formed in the potting material, and these bubbles will affect the electrical performance and heat dissipation performance of the IGBT 5. Adjusting the air pressure data to be the same can reduce this situation. For example, when potting, the air pressure in the potting area is stable at 50 Pa. If directly entering the discharging in the atmospheric pressure environment, a large number of bubbles will be generated in the material; adjusting the discharging air pressure to 50 Pa can avoid sudden changes in air pressure, prevent bubble generation, and improve the potting quality and IGBT performance.

[0044] From potting to discharging, maintaining the air pressure stability in the IGBT area can ensure that the curing process of the potting material is not disturbed by air pressure fluctuations. The stable air pressure can make the potting material evenly distributed around the IGBT chip, fill the tiny gaps, form a dense protection structure, and enhance the electrical insulation and mechanical stability. If the air pressure is unstable, the flow and curing of the potting material are abnormal, resulting in uneven thickness and voids, affecting the performance and reliability of the IGBT 5.

[0045] In a preferred embodiment, an air pressure sensor and a vacuum module are provided at the pipe orifice. The air pressure sensor and the vacuum module are arranged at the pipe orifice of the vacuum pipe, and the air pressure sensor and the vacuum module are respectively connected to the control module; the control module is further configured to obtain the air pressure data of the air pressure sensor at the pipe orifice to control the vacuum module at the pipe orifice.

[0046] In the corresponding control method for IGBT potting, which is applied to a potting machine equipped with a nozzle air pressure sensor and a nozzle vacuum module, evacuating the potting tank 3 includes: Using the potting vacuum module and the nozzle vacuum module for evacuation, and controlling the potting air pressure data and the nozzle air pressure data to be the same; The method further includes: S710, adjusting the discharge air pressure data, the potting air pressure data, and the nozzle air pressure data to be the same.

[0047] It should be understood that inconsistent air pressure is likely to cause gas flow. If there is a difference between the nozzle air pressure and the internal air pressure, external air may enter the interior of the vacuum tube 31 through the nozzle gap, or the gas inside the tube may leak to the outside. The air entering the tube will mix into the potting material and form bubbles. These bubbles will remain inside the IGBT after the potting material cures, affecting its electrical performance and heat dissipation performance, and reducing the reliability and service life of the product. When the nozzle and the internal air pressure are kept consistent, the gas flow is effectively suppressed, reducing the possibility of air intrusion, thereby reducing the risk of bubble generation and ensuring the stability of potting.

[0048] In a preferred embodiment, the potting device for IGBT further includes: an integrated vacuum circulation system, including: providing vacuum degrees for the feeding vacuum module, the potting vacuum module, and the discharge vacuum module. The feeding vacuum module, the potting vacuum module, and the discharge vacuum module are all intelligent vacuum valves.

[0049] In this way, through the integrated design, the setting of multiple independent vacuum systems is avoided, reducing the equipment cost and floor area. At the same time, this system can realize the recycling of vacuum resources, improve the energy utilization efficiency, and reduce the operation cost.

[0050] In a preferred embodiment, during the potting process, segmented potting is adopted.

[0051] Segmented potting can set an appropriate pause time between each potting segment, allowing the glue to have enough time to flow and penetrate, enabling the air therein to have the opportunity to naturally escape. At the same time, during the pause period, some auxiliary means, such as slight vibration or stirring, can be used to further promote the air discharge, reduce the residue of bubbles in the glue, and improve the potting quality.

[0052] A production line for IGBT potting provided by an embodiment of the present disclosure includes the above-mentioned potting device for IGBT.

[0053] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. The embodiments only represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terms used in this application are only for describing the embodiments and do not limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to also include the plural forms. Similarly, as used in this application, the term "and / or" refers to any and all possible combinations of one or more of the associated listed items. Additionally, when used in this application, the term "comprise" and its variants "comprises" and / or "comprising" etc. mean the presence of the stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups of these. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, or device comprising the element. Herein, each embodiment may focus on the differences from other embodiments, and the same or similar parts among the embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, the relevant parts may refer to the description of the method part.

[0054] Those skilled in the art can realize that the various examples and algorithm steps described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner may depend on the specific application and design constraints of the technical solution. The skilled person can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the embodiments of the present disclosure. The skilled person can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described devices and apparatuses can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein.

[0055] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion thereof that contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions noted in the blocks may occur in a different order than noted in the accompanying drawings. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. In the description corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based device that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. An encapsulation device for IGBTs, characterized in that: Including: A feeding vacuum box, a conveying mechanism, a plurality of potting boxes arranged in the feeding vacuum box, a potting box moving mechanism, a discharging vacuum box, and a control module; The feeding vacuum box includes a feeding vacuum box body, a feeding air pressure sensor, and a feeding vacuum module; The conveying mechanism is used to convey IGBTs, and a plurality of sealing rings are arranged on the conveying mechanism; The potting box includes a vacuum tube, a potting assembly, a potting air pressure sensor, and a potting vacuum module; the potting air pressure sensor, the potting assembly, and the potting vacuum module are arranged in the vacuum tube, and the potting air pressure sensor and the potting vacuum module are arranged at the potting assembly; the mouth of the vacuum tube is matched with the sealing ring; The potting box moving mechanism is fixedly connected to the potting box and is used to move the potting box; The discharging vacuum box includes a discharging vacuum box body, a discharging air pressure sensor, and a discharging vacuum module; The feeding air pressure sensor, the feeding vacuum module, the potting air pressure sensor, the potting vacuum module, the potting assembly, and the control module are connected; The control module is used to obtain the feeding air pressure data of the feeding air pressure sensor, the potting air pressure data of the potting air pressure sensor, and the discharging air pressure data of the discharging air pressure sensor to control the feeding vacuum module, the potting vacuum module, the potting assembly, and the potting box moving mechanism.

2. The potting device for IGBT according to claim 1, characterized in that: A tube mouth air pressure sensor and a tube mouth vacuum module, wherein the tube mouth air pressure sensor and the tube mouth vacuum module are arranged at the mouth of the vacuum tube, and the tube mouth air pressure sensor and the tube mouth vacuum module are respectively connected to the control module; The control module is further used to obtain the tube mouth air pressure data of the tube mouth air pressure sensor to control the tube mouth vacuum module.

3. The potting device for IGBT according to claim 1, characterized in that: It further includes: An integrated vacuum circulation system, including: providing vacuum degrees for the feeding vacuum module, the potting vacuum module, and the discharging vacuum module.

4. The potting device for IGBT according to claim 3, wherein: The feeding vacuum module, the potting vacuum module, and the discharging vacuum module are all intelligent vacuum valves.

5. The potting device for IGBT according to claim 1, characterized in that: The number of potting air pressure sensors is multiple, and they are evenly arranged on the inner wall of the vacuum tube.

6. The potting device for IGBT according to claim 1, wherein: The feeding vacuum module, the potting vacuum module, and the discharging vacuum module are vacuum pumps.

7. A control method for IGBT potting, characterized in that: Applied to the potting device for IGBT as described in any one of claims 1 to 6, the method includes: Moving the IGBT into the feeding vacuum box; Performing vacuum pumping on the feeding vacuum box and the discharging vacuum box; Moving a plurality of potting boxes, connecting the potting boxes to the sealing rings of the conveying mechanism to seal the potting boxes; Performing vacuum pumping on the potting boxes; Potting the IGBT; After the potting is completed, moving a plurality of potting boxes to the discharging vacuum box; Adjusting the discharging air pressure data and the potting air pressure data to be the same; Moving a plurality of potting boxes to separate the potting boxes from the sealing rings of the conveying mechanism.

8. The control method for IGBT potting according to claim 7, characterized in that: Applied to a potting machine with a tube mouth air pressure sensor and a tube mouth vacuum module, performing vacuum pumping on the potting box, including: Performing vacuum pumping with the potting vacuum module and the tube mouth vacuum module, and controlling the potting air pressure data and the tube mouth air pressure data to be the same; The method further includes: Adjusting the discharging air pressure data, the potting air pressure data, and the tube mouth air pressure data to be the same.

9. The control method for IGBT potting according to claim 7, wherein: During the potting process, segmented potting is adopted.

10. A production line for IGBT potting, characterized in that: Including the potting device for IGBT as described in any one of claims 1 to 6.

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